CN115433904A - High-heat-dissipation shell material and application thereof on switch - Google Patents
High-heat-dissipation shell material and application thereof on switch Download PDFInfo
- Publication number
- CN115433904A CN115433904A CN202211124981.1A CN202211124981A CN115433904A CN 115433904 A CN115433904 A CN 115433904A CN 202211124981 A CN202211124981 A CN 202211124981A CN 115433904 A CN115433904 A CN 115433904A
- Authority
- CN
- China
- Prior art keywords
- parts
- protective film
- silicone resin
- compound
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011257 shell material Substances 0.000 title abstract description 20
- 229920002050 silicone resin Polymers 0.000 claims abstract description 43
- 229910001335 Galvanized steel Inorganic materials 0.000 claims abstract description 25
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 25
- 239000008397 galvanized steel Substances 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 15
- 150000003609 titanium compounds Chemical class 0.000 claims abstract description 11
- 150000003755 zirconium compounds Chemical class 0.000 claims abstract description 7
- 150000002222 fluorine compounds Chemical class 0.000 claims abstract description 5
- 239000005078 molybdenum compound Substances 0.000 claims abstract description 5
- 150000002752 molybdenum compounds Chemical class 0.000 claims abstract description 5
- 150000002816 nickel compounds Chemical class 0.000 claims abstract description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 3
- 238000007740 vapor deposition Methods 0.000 claims abstract description 3
- 230000001681 protective effect Effects 0.000 claims description 66
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 27
- 239000004115 Sodium Silicate Substances 0.000 claims description 20
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 230000017525 heat dissipation Effects 0.000 claims description 16
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 10
- 230000009477 glass transition Effects 0.000 claims description 10
- 229910052726 zirconium Inorganic materials 0.000 claims description 10
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 238000009835 boiling Methods 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 9
- 239000011733 molybdenum Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- -1 lanthanide metals Chemical class 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052747 lanthanoid Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052716 thallium Inorganic materials 0.000 claims description 3
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 20
- 238000005260 corrosion Methods 0.000 abstract description 20
- 238000002845 discoloration Methods 0.000 abstract description 13
- 239000002994 raw material Substances 0.000 abstract description 10
- 238000002360 preparation method Methods 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 9
- 230000002829 reductive effect Effects 0.000 description 9
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 9
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 8
- 238000002161 passivation Methods 0.000 description 6
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 6
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 5
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 description 5
- 235000018660 ammonium molybdate Nutrition 0.000 description 5
- 239000011609 ammonium molybdate Substances 0.000 description 5
- 229940010552 ammonium molybdate Drugs 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 235000019353 potassium silicate Nutrition 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000004227 thermal cracking Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 150000002602 lanthanoids Chemical class 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 241001163841 Albugo ipomoeae-panduratae Species 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229920013822 aminosilicone Polymers 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical group CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000015393 sodium molybdate Nutrition 0.000 description 1
- 239000011684 sodium molybdate Substances 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 150000003682 vanadium compounds Chemical class 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical compound F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
- XJUNLJFOHNHSAR-UHFFFAOYSA-J zirconium(4+);dicarbonate Chemical compound [Zr+4].[O-]C([O-])=O.[O-]C([O-])=O XJUNLJFOHNHSAR-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/20—Electroplating: Baths therefor from solutions of iron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
Abstract
The application relates to a high heat dissipating casing material and its application on the switch, casing material includes casing and the protection film on the surface, the casing is aluminum alloy and/or galvanized steel sheet, the protection film is made through coating, vapor deposition or electroplating by the combined liquid, the raw materials of combined liquid include: and (2) component A: 80-120 parts of titanium compound, 25-55 parts of zirconium compound, 0.01-5 parts of nickel compound, 0.01-3 parts of molybdenum compound and 10-200 parts of fluorine compound; and B component: silicone resin and silane coupling agent. The shell material has excellent heat discoloration resistance, high temperature resistance, corrosion resistance and temperature discoloration resistance, can be used for the preparation of a switch, and reduces the requirements of the prepared switch on transportation and use environments.
Description
Technical Field
The application relates to the field of metal surface treatment, namely C23C22/50, in particular to a high-heat-dissipation shell material and application thereof to a switch.
Background
With the rapid development of the household car market, the basic popularization of household appliances and personal computers, the large export of electronic products and the development of the anti-theft door market, the demand of the galvanized sheet is rapidly increased, but the galvanized sheet is easy to be oxidized and blackened in the use environment of the galvanized sheet and has a plurality of temperature conditions exceeding the melting point of zinc, for example, in a heat exchanger in an air conditioner outdoor unit, in order to prevent the melting of aluminum when a copper pipe and an aluminum evaporator are welded, the galvanized sheet is placed between the copper pipe and the evaporator to isolate flame and aluminum, how to improve the heat resistance of the galvanized sheet becomes one of the problems to be considered, and how to improve the corrosion resistance, the blackening resistance and the like of the galvanized sheet are also the problems to be solved at present.
Chromate passivation is commonly used in the traditional zinc coating protective film, but with the attention of people on the environment, the reduction of the use of heavy metal salt containing 6-valent chromium becomes the current development trend; in the prior art, a plurality of metal layers and an organic film layer are used for inhibiting blackening resistance and surface white rust generation of a galvanized steel sheet and improving corrosion resistance of the galvanized steel sheet, but the organic film layer is easy to thermally decompose to generate yellowing or browning in a high-temperature environment and is easy to blacken in a damp-heat environment, so that the appearance is influenced, and the protective performance of the film layer on the galvanized layer is also reduced.
Patent CN2013101088180 discloses a low-temperature fingerprint-resistant surface treatment agent for galvanized steel sheets and an environment-friendly surface treatment galvanized steel sheet, wherein a composition of specific water-based resin, phosphide, an organic silicon compound, titanium, a vanadium compound and polyethylene oxide particles is coated on the surface of the galvanized steel sheet to improve the performances of alkali resistance, solvent resistance, corrosion resistance and the like of a coating film, but the coating film is still insufficient in adhesive force and easy to peel off, and the use and discharge of the phosphide cause certain pollution to the environment; patent CN2017105355920 discloses a surface passivation treatment process for a galvanized steel sheet, which improves the anticorrosion effect of the galvanized steel sheet through the formation of two passivation films, but the passivation film formed by the process is 30% thicker than that formed by the traditional process, and brings inconvenience to the use, installation, transportation and the like of the galvanized steel sheet.
Disclosure of Invention
In order to solve the technical problems, the application provides a high-heat-dissipation shell material and an application thereof on a switch; according to the heat-resistant heat-dissipation shell material, the heat resistance discoloration property, the heat resistance cracking property, the corrosion resistance, the temperature change resistance and the mechanical strength of the prepared protective film and the modified shell are improved by limiting the substances and the relative content thereof in the protective film component, and the exchanger prepared from the shell material with high heat dissipation property has the advantages of good preservation property, small limitation on the use temperature environment and long service life.
Specifically, the application provides a high-heat-dissipation shell material which comprises a shell and a protective film on the surface of the shell, wherein the shell is made of aluminum alloy and/or galvanized steel sheet, and the protective film contains at least one of titanium, nickel, zirconium, thallium, aluminum, fluorine, molybdenum, iron, tin, cobalt, chromium or lanthanide series metal.
Further, the protective film contains at least one of titanium, nickel, zirconium, thallium, fluorine, molybdenum, or a lanthanoid metal.
Further, the protective film contains at least one of titanium, nickel, zirconium, fluorine, and molybdenum.
Further, the protective film is made of a combined liquid by coating, vapor deposition or electroplating, and the combined liquid comprises the following raw materials:
and (2) component A: 80-120 parts of titanium compound, 25-55 parts of zirconium compound, 0.01-5 parts of nickel compound, 0.01-3 parts of molybdenum compound and 10-200 parts of fluorine compound;
and B component: silicone resin and silane coupling agent;
further, the titanium compound may be at least one selected from the group consisting of titanium dioxide gel, aqueous solution of titanic acid, and phthalate ester.
Further, the zirconium compound may be selected from at least one of zirconium acetylacetonate, zirconium carbonate, tetrabutyl zirconate, zirconium fluoride, and zirconium silicate.
Further, the nickel compound may be selected from at least one of nickel chloride, nickel nitrate, nickel acetate, and nickel sulfate.
Further, the fluorine compound may be selected from sodium fluoride, hydrofluoric acid, ammonium hydrofluoride.
Further, the molybdenum compound may be selected from at least one of ammonium molybdate, sodium molybdate, potassium molybdate, and molybdic acid.
Further, the raw materials of the combined liquid comprise:
and (2) component A: 80-120 parts of titanium compound, 25-45 parts of zirconium compound, 0.01-4 parts of nickel compound, 0.01-2 parts of molybdenum compound and 10-200 parts of fluorine compound;
and the component B comprises: silicone resin and silane coupling agent;
the corrosion resistance and the heat discoloration resistance of the protective film are improved by adding titanium, nickel, zirconium and molybdenum components, titanium can generate a titanium dioxide passivation film at high temperature to improve the compactness of the film layer, when the titanium is adhered to an overhigh film layer and is too thick, stress cracking is easy to generate, the impact resistance is poor, nickel improves the blackening resistance of the galvanized steel sheet, but the chemical property of nickel is active, and when the nickel content is increased, the corrosion resistance of the protective film is also reduced; zirconium in the layer due to Zr 4+ The migration of the protective film can generate a layer of passive film, so that the compactness and the heat discoloration resistance of the protective film are improved, but when the addition amount is too much, the compactness and the corrosion resistance of the protective film are reduced; after molybdenum is added, the oxidation product of molybdenum can supply oxygen component to zinc in the steel plate to reduce blackening phenomenon of the steel plate, but MoO generated after molybdenum is added in the steel plate 3 For Zr 4+ The migration of Mo plays a role in blocking, and Mo also has an active effect on the surface layer, so that the corrosion of the protective film is aggravated; the corrosion resistance and the heat discoloration resistance of the protective film are better balanced by regulating and controlling the relative addition amount of each component.
However, it has been found that although the addition of the zirconium compound improves the corrosion resistance and blackening resistance of the protective film, the protective film may develop fine cracks at high temperatures.
Further, the A component also comprises sodium silicate, the modulus of which (i.e. SiO) 2 And Na 2 Molar ratio of O) is 2.2-3.7 and is added in an amount of 20-50 wt.% of the mass fraction of zirconium.
In a preferred embodiment, when the sodium silicate has a modulus of 3.3 and is added in an amount of 40wt.% based on the mass of zirconium, the prepared protective film has excellent resistance to thermal cracking; the reason is presumed to be: the oxygen atoms in the sodium silicate crystal can be broken and combined with sodium at high temperature, thereby reducing SiO with larger mechanical strength in the recombination process 4 Generation of a network structure, thereby in vivoThe film has certain fluidity, the softening point of the composite component of the protective film is reduced, the protective film has proper fluidity at high temperature, the generation of film cracks at high temperature is prevented, when the modulus of sodium silicate is too high or the addition amount of sodium silicate is too small, the insufficient heat-resistant fluidity of the sodium component is improved a little, and when the modulus of sodium silicate is too high or the addition amount of sodium silicate is too large, the high-temperature curing effect of the protective film is too poor, and the blackening resistance is also reduced.
Further, the boiling point of the silane coupling agent is 220-300 ℃ (760 mmHg); according to the application, the organic silicon resin and the silane compound are added to serve as a protective film framework to stabilize hard substances in the protective film framework and improve the corrosion resistance of the protective film, but polysiloxane bonds after condensation reaction are easily thermally decomposed at high temperature to cause structural damage of the main framework, so that the corrosion resistance is reduced; when the boiling point of the silane coupling agent is too low, the resistance to thermal discoloration and resistance to moist heat of the main skeleton are lowered, and when the boiling point is increased, the compatibility with the silicone resin and the system is improved, but when the boiling point is too high, the internal force of the protective film is too strong, and the protective film is brittle and does not resist impact.
Further, the silane coupling agent is selected from at least one of phenyl triethoxysilane, vinyl tri (methoxyethoxy) silane, gamma-aminopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, and N-beta- (aminoethyl) -gamma-aminopropylmethyldimethoxysilane.
Further, the silane coupling agent is selected from at least one of phenyl triethoxysilane, gamma-aminopropyl triethoxysilane, and N-beta- (aminoethyl) -gamma-aminopropyl methyldimethoxysilane.
Preferably, the silane coupling agent is phenyl triethoxysilane.
Further, the total mass of the component A in the raw materials, the mass ratio of the silicon resin to the silane coupling agent is (55-75): (25-45): (0.1-0.5).
Preferably, the total mass of the component A in the raw materials, the mass ratio of the silicone resin to the silane coupling agent is 65:35:0.3, the protective film prepared under the mass ratio has excellent corrosion resistance and service life; the dosage of the silane coupling agent in the system is further controlled to regulate and control the stabilizing effect of the main skeleton on hard substances and the flexibility of the system, when the dosage of the silane coupling agent and the organic silicon resin is too much, although the film layer is compact and the corrosion resistance is improved, the stress relaxation capacity is reduced because the crosslinking structure is too compact, the thermal degradation is easily generated at the crosslinking part, the generation of cracks under the high-temperature environment is caused, and the service life is reduced; the compound containing titanium, nickel, fluorine, molybdenum and zirconium in the system belongs to a hard substance in the system, and van der waals force generated with the main skeleton can be stably existed in the hard substance, but when the hard substance is excessively added, the compactness of the protective film is easily damaged in the system.
Further, the silicone resin may be selected from at least one of methylphenyl silicone resin, amino silicone resin, fluorosilicone resin, epoxy modified silicone resin, high temperature type silicone resin, methyl MQ silicone resin, vinyl MQ silicone resin, and the like.
Further, the silicone resin is selected from at least one of fluorosilicone resin, epoxy modified silicone resin, methyl MQ silicone resin, vinyl MQ silicone resin, and the like.
Further, the silicone resin is selected from at least one of epoxy modified silicone resin, methyl MQ silicone resin and vinyl MQ silicone resin.
The present application unexpectedly finds: when the weight average molecular weight of the silicon resin is defined to be 7000-10000 and the glass transition temperature is 60-100 ℃, the temperature change resistance of the protective film can be improved; the applicant speculates that the reason is that: the molecular chain of the organic silicon resin is of a helical structure which is easy to wind, under high and low temperature environments, the helical expansion can regulate and control the intermolecular distance so as to relieve the influence of temperature on the performance of the organic silicon resin, when the weight average molecular weight of the organic silicon resin is too low, the organic silicon resin has insufficient stability on hard substances in a system, and when the weight average molecular weight and the glass transition temperature of the organic silicon resin are too high, due to the space barrier effect of internal hard substances, the molecular helical expansion cannot well cope with the reduction of the average distance of the molecules under the low temperature environment, the formed protective film has insufficient toughness at low temperature, is easy to crack under the high and low temperature environments, and when the glass transition temperature is too low, the curing performance of the protective film under the high temperature condition is reduced.
In a preferred embodiment, the silicone resin has a weight average molecular weight of 8500 and a glass transition temperature of 86 ℃.
Further, the protective film is formed by coating and drying the combined liquid, and the drying temperature is 80-160 ℃.
Further, the preparation method of the high heat dissipation shell material comprises the following steps:
(1) Pretreatment: cleaning, deoiling, polishing and drying the aluminum alloy and/or galvanized steel plate;
(2) Coating: the combined solution is coated on a galvanized steel sheet and dried in an oven at 80-160 ℃ for 0.5-2h.
Further, the thickness of the protective film is not more than 5 μm, and the amount of titanium compound attached in the protective film is 0.2 to 0.8g/m 2 。
Furthermore, the shell material with high heat dissipation performance prepared by the technical scheme can be used on a switch, and the switch can be used in a low-temperature environment (minus 30-5 ℃).
Has the beneficial effects that:
1. the protective film balances the balance of passivation capability, corrosion resistance, blackening resistance and heat resistance through the addition of various metal components and the regulation and control of quality, has excellent protective effect on a zinc coating, and has excellent film forming property, adhesive force and compactness through the use of silicone resin and silane coupling agents, so that the protective effect of the metal components is further improved.
2. The high-temperature toughness of the protective film is adjusted by using sodium silicate, the modulus of the protective film is further limited to be 2.2-3.7, and the addition amount of the sodium silicate is 20-50 wt% of the mass of zirconium, so that the protective film has excellent thermal cracking resistance, and the shell material can be well used in a high-temperature environment.
3. The total mass of the component A in the raw materials is limited, and the mass ratio of the silicone resin to the silane coupling agent is (55-75): (25-45): (0.1-0.5), the high-temperature flexibility and the corrosion resistance of the protective film are further improved; in addition, the application discovers that when the weight average molecular weight of the silicon resin is defined to be 7000-10000, and the glass transition temperature is 60-100 ℃, the protective film can well cope with the change of high and low temperature environments through the spiral expansion movement of the molecular chain of the silicon resin, so that the shell material has excellent high and low temperature resistance.
4. The shell material has excellent heat discoloration resistance, high temperature resistance, corrosion resistance and temperature discoloration resistance, can be used for the preparation of the exchanger, and reduces the requirements of the prepared exchanger on transportation and use environments.
Detailed Description
Examples
Example 1
A high heat dissipation casing material comprises a casing and a protective film on the surface of the casing, wherein the casing is a galvanized steel sheet (Bao Steel SECC), the thickness of the protective film is 4 μm, and the adhesion amount of titanium compound in the protective film is 0.5g/m 2 (ii) a The protective film is prepared by coating a combined liquid, and the combined liquid comprises the following raw materials:
the component A comprises: by mass, 100 parts of tetrabutyl titanate (CAS: 5593-70-4), 35 parts of zirconium silicate (CAS: 10101-52-7), 1.2 parts of nickel sulfate (CAS: 15244-37-8), 0.8 part of ammonium molybdate (CAS: 12054-85-2), 145 parts of ammonium hydrofluoride (CAS: 1336-21-6) and 14 parts of sodium silicate (CAS: 1344-09-8);
and B component: 160 parts of silicone resin and 1.7 parts of silane coupling agent;
the silicone resin is methyl MQ silicone resin, the weight-average molecular weight is 8500, the glass transition temperature is 86 ℃, and the silicone resin is purchased from chemical engineering Co., ltd, new four seas, hubei; the silane coupling agent is phenyl triethoxysilane (CAS: 172975-69-8), boiling point is 236.5 deg.C (760 mmHg); the sodium silicate has a modulus of 3.3 and is purchased from Yongshu waterglass manufacturing Co.
The preparation method of the high-heat-dissipation shell material comprises the following steps:
(1) Pretreatment: cleaning, deoiling, polishing and drying the galvanized steel plate;
(2) Coating: the combined solution was coated on a galvanized steel sheet and dried in an oven at 140 ℃ for 1h.
Example 2
A casing material with high heat dissipation performance comprises a casing made of galvanized steel plate and a protective film on the surface of the casing(Bao Steel SECC), the thickness of the protective film was 3 μm, and the amount of titanium compound adhered in the protective film was 0.8g/m 2 (ii) a The protective film is prepared by coating a combination liquid, and the combination liquid comprises the following raw materials:
the component A comprises: according to the mass parts, 120 parts of tetrabutyl titanate (CAS: 5593-70-4), 45 parts of zirconium silicate (CAS: 10101-52-7), 4 parts of nickel sulfate (CAS: 15244-37-8), 2 parts of ammonium molybdate (CAS: 12054-85-2), 200 parts of ammonium hydrofluoride (CAS: 1336-21-6) and 22.5 parts of sodium silicate (CAS: 1344-09-8);
and B component: 236 parts of silicon resin and 2.6 parts of silane coupling agent;
the silicone resin is methyl MQ silicone resin, the weight-average molecular weight is 10000, the glass transition temperature is 98 ℃, and the silicone resin is purchased from chemical industry Co., ltd, new four seas, hubei; the silane coupling agent is phenyl triethoxysilane (CAS: 172975-69-8), boiling point is 236.5 deg.C (760 mmHg); the sodium silicate has a modulus of 2.4 and is purchased from Yongshui waterglass manufacturing Co.
The preparation method of the high-heat-dissipation shell material comprises the following steps:
(1) Pretreatment: cleaning, deoiling, polishing and drying the galvanized steel sheet;
(2) Coating: the combined solution was coated on a galvanized steel sheet and dried in an oven at 80 ℃ for 2h.
Example 3
A high heat dissipation casing material comprises a casing and a protective film on the surface of the casing, wherein the casing is a galvanized steel sheet (Bao Steel SECC), the thickness of the protective film is 4 μm, and the adhesion amount of titanium compound in the protective film is 0.2g/m 2 (ii) a The protective film is prepared by coating a combined liquid, and the combined liquid comprises the following raw materials:
and (2) component A: according to the mass parts, 80 parts of tetrabutyl titanate (CAS: 5593-70-4), 25 parts of zirconium silicate (CAS: 10101-52-7), 0.05 part of nickel sulfate (CAS: 15244-37-8), 0.03 part of ammonium molybdate (CAS: 12054-85-2), 20 parts of ammonium hydrofluoride (CAS: 1336-21-6) and 5 parts of sodium silicate (CAS: 1344-09-8);
and B component: 60 parts of silicone resin and 0.25 part of silane coupling agent;
the silicone resin is methyl MQ silicone resin, the weight average molecular weight is 7000, the glass transition temperature is 62 ℃, and the silicone resin is purchased from chemical engineering Co., ltd of New four seas in Hubei; the silane coupling agent is phenyl triethoxysilane (CAS: 172975-69-8), boiling point is 236.5 deg.C (760 mmHg); the sodium silicate has a modulus of 3.4 and is purchased from Yongshu waterglass manufacturing Co.
The preparation method of the high-heat-dissipation shell material comprises the following steps:
(1) Pretreatment: cleaning, deoiling, polishing and drying the galvanized steel sheet;
(2) Coating: the combined solution was coated on a galvanized steel sheet and dried in an oven at 160 ℃ for 0.5h.
Comparative example 1
Consistent with example 1, the differences are: the sodium silicate in the component A has a modulus of 3.7 and is purchased from Yongshun sodium silicate manufacturing company Limited.
Comparative example 2
Consistent with example 1, the difference is: the silane coupling agent is vinyl trimethoxy silane (CAS: 24898-62-2), and the boiling point is 123 ℃.
Comparative example 3
Consistent with example 1, the differences are: the raw materials of the combined liquid comprise:
the component A comprises: by mass, 100 parts of tetrabutyl titanate (CAS: 5593-70-4), 35 parts of zirconium silicate (CAS: 10101-52-7), 1.2 parts of nickel sulfate (CAS: 15244-37-8), 0.8 part of ammonium molybdate (CAS: 12054-85-2), 145 parts of ammonium hydrofluoride (CAS: 1336-21-6) and 14 parts of sodium silicate (CAS: 1344-09-8);
and B component: 323 parts of silicon resin and 0.5 part of silane coupling agent;
comparative example 4
Consistent with example 1, the difference is: the silicone resin is methyl MQ silicone resin, the weight average molecular weight is 15000, the glass transition temperature is 132 ℃, and the silicone resin is purchased from chemical engineering Co., ltd, new four seas, hubei.
Comparative example 5
Consistent with example 1, the differences are: the thickness of the protective film was 0.28. Mu.m, and the amount of titanium compound adhered to the protective film was 0.1g/m 2 。
The performance test method comprises the following steps:
1. resistance to thermal discoloration: the galvanized steel sheets in the examples were heat-treated in an oven at 200 ℃ for 4 hours, and the presence or absence of discoloration of the protective film on the surface was visually observed, 0: substantially no discoloration, 1: small amount of discoloration, 2: yellowing.
2. Corrosion resistance: the test was carried out according to GB/T10125-1997 and the time to start to generate corrosion was calculated.
3. Resistance to thermal cracking: the galvanized steel sheets in the examples were heated to 500 ℃ in an infrared heating furnace (MILA-5000), and after 5 minutes, the surface appearance when naturally cooled to room temperature was visually observed and evaluated as follows: a: visual crack-free, B: very slight cracking, difficult observation, C: slightly cracked.
4. Temperature change resistance: taking the protective solution in the embodiment, preparing and maintaining a sample according to the regulations of GB/T1727 and GB/T9728, storing the sample at 90 ℃ for 240h, then cooling to-40 ℃ for 24h, and observing whether the appearance of the protective film has the bad phenomena of falling, cracking, bubbling, discoloring and the like.
And (4) performance test results:
TABLE 1
Claims (10)
1. A high heat dissipation casing material comprises a casing and a protective film on the surface of the casing, and is characterized in that the casing is an aluminum alloy and/or a galvanized steel sheet, and the protective film contains at least one of titanium, nickel, zirconium, thallium, aluminum, fluorine, molybdenum, iron, tin, cobalt, chromium or lanthanide metals.
2. The casing material with high heat dissipation property as recited in claim 1, wherein the protective film is formed by coating, vapor deposition or electroplating from a composition liquid comprising:
the component A comprises: 80-120 parts of titanium compound, 25-55 parts of zirconium compound, 0.01-5 parts of nickel compound, 0.01-3 parts of molybdenum compound and 10-200 parts of fluorine compound;
and the component B comprises: silicone resin and silane coupling agent.
3. The casing material with high heat dissipation performance as defined in claim 2, wherein the component A of the combined fluid further comprises sodium silicate.
4. The housing material with high heat dissipation performance as claimed in claim 3, wherein the sodium silicate has a modulus of 2.2-3.4, and is added in an amount of 20wt.% to 50wt.% of the zirconium compound.
5. The housing material with high heat dissipation performance as claimed in claim 3, wherein the silane coupling agent has a boiling point of 220-300 ℃ (760 mmHg), wherein the total mass of the component A, the mass ratio of the silicone resin to the silane coupling agent is (55-75): (25-45): (0.1-0.5).
6. The casing material with high heat dissipation property as claimed in claim 5, wherein the weight average molecular weight of the silicone resin is 7000-12000, and the glass transition temperature is 60-120 ℃.
7. The material as claimed in claim 5, wherein the silicone resin is at least one selected from epoxy modified silicone resin, methyl MQ silicone resin, and vinyl MQ silicone resin.
8. The casing material with high heat dissipation performance as set forth in claim 2, wherein the thickness of the protective film is not more than 5 μm, and the amount of titanium compound attached to the protective film is 0.2-0.8g/m 2 。
9. The casing material with high heat dissipation performance as claimed in claim 2, wherein the protective film is formed by coating the composition liquid and then drying, and the drying temperature is 80-160 ℃.
10. Use of a housing material with high heat dissipation properties according to any one of claims 1-9 in an exchange.
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