CN115433538B - 一种灌封胶及其制备方法与应用 - Google Patents
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- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
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Abstract
本发明公开了一种灌封胶,包括A组分和B组分,其中A组分包含以下质量百分比的原料:T型聚硅氧烷10~30份,聚二甲基硅氧烷2~15份,阻燃填料38~69份,导热填料2~21份,深层固化剂0.02~2份;B组分包含以下质量百分比的原料:聚二甲基硅氧烷1~30份,交联剂40~80份,增粘剂1~10份,催化剂0.1~10份。本发明的灌封胶散热效果、阻燃效果、防水效果优异,并且粘度低、抗拉伸强度和伸长率高,可避免接线盒胶体开裂、胶体与接线盒剥离等现象,提升接线盒的使用寿命。
Description
技术领域
本发明涉及一种灌封胶及其制备方法与应用。
背景技术
现有的灌封胶的各方面性能较为平庸,普遍导热系数在0.5W/m·k以下,抗拉强度在1.2MPa左右,伸长率只有80%,较差的性能会导致使用了灌封胶的接线盒在工作时产生的热量不能及时散发到外界中,且长时间的热胀冷缩过程会出现胶体开裂、胶体与接线盒剥离,这大大影响了产品的使用寿命,间接提升了产品的成本。因此,通过改善灌封胶的性能从而提升接线盒的使用寿命是本领域技术人员需要解决的技术问题。
发明内容
本发明的目的在于克服上述现有技术的不足之处而提供一种综合性能良好的灌封胶。
本发明另一目的在于提供上述灌封胶的制备方法。
本发明再一目的在于提供上述灌封胶的应用。
为了解决上述技术问题,本发明采取的技术方案为:一种灌封胶,包括A组分和B组分,
A组分包括以下质量份数计的原料:T型聚硅氧烷10~30份,聚二甲基硅氧烷2~15份,阻燃填料38~69份,导热填料2~21份,深层固化剂0.02~2份;
B组分包括以下质量份数计的原料:聚二甲基硅氧烷1~30份,交联剂40~80份,增粘剂1~10份,催化剂0.1~10份。
作为优选方案,所述A、B组分按质量比(4~20):1混合。
作为优选方案,所述T型聚硅氧烷的分子量为5000~500000;
作为优选方案,所述T型聚硅氧烷的结构式为R1SiO3/2{[(R2)2SiO1/2]aSi(R2)m(R3)n}3,
其中,R1独立地为-CH3、-CH2CH3或-C6H5中任意一种,R2独立地为-CH3、-CH2CH3或-C6H5中任意一种或两种,
R3独立地为-OCH3、-OCH2CH3或-OCH2CH2CH3中任意一种,
a、n为大于0的整数,m+n=3。
作为优选方案,所述聚二甲基硅氧烷分子量为500~100000;
作为优选方案,所述聚二甲基硅氧烷的结构式为(R4)3SiO[R4R5SiO1/2]p[(R4)2SiO1/2]qSi(R4)3,
其中,R4和R5独立地为-CH3、-CH2CH3或-C6H5中任意一种或几种,
p和q为大于等于0的整数。
本发明采用特定结构和合适分子量的T型聚硅氧烷和聚二甲基硅氧烷,能够有效提高灌封胶的抗拉伸强度和伸长率;T型聚硅氧烷的分子量<5000或聚二甲基硅氧烷的分子量<500会导致灌封胶的抗拉伸强度和伸长率下降;T型聚硅氧烷的分子量>500000或聚二甲基硅氧烷的分子量>100000会导致灌封胶的混合粘度过大,流平性和流动性不佳,不利于灌封。
作为优选方案,所述阻燃填料的粒径为0.2~100μm。
作为优选方案,所述导热填料的粒径为0.2~100μm。
本发明采用粒径为0.2~100μm的阻燃填料和导热填料,能够提高灌封胶的抗拉伸强度和伸长率,阻燃填料或导热填料的粒径<0.2μm导致灌封胶的混合粘度过大,流平性和流动性不佳,不利于灌封;阻燃填料或导热填料的粒径>100μm导致灌封胶的抗拉伸强度和伸长率下降。
作为优选方案,所述阻燃填料为氧化镁、氢氧化镁、碱式碳酸镁和氢氧化铝中的一种或几种。
作为优选方案,所述导热填料为二氧化硅、碳纳米管、氧化铝、氮化硼、氮化铝和碳化硅中的一种或几种。
本发明将特定种类的阻燃填料与导热填料复配使用,既能提升产品的阻燃性能,又能很好的保证导热效果。
作为优选方案,所述深层固化剂为聚醚多元醇、十二烷基苯磺酸钠和甘油中的一种或几种。
作为优选方案,所述交联剂为甲基三甲氧基硅烷、甲基三乙氧硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、正硅酸乙酯Si28和正硅酸乙酯Si40中的一种或几种。
作为优选方案,所述增粘剂为3-氨基丙基三乙氧基硅烷KH-550、γ-(2,3-环氧丙氧)丙基三甲氧基硅烷KH-560、γ-巯丙基三甲氧基硅烷KH570和N-(β-氨乙基)-γ-氨丙基三甲氧基硅烷KH-792中的一种或几种。
作为优选方案,所述催化剂为酞酸酯、酞酸酯螯合物、有机锡和有机锡螯合物中的一种或几种。
本发明还提供了上述灌封胶的制备方法,包括以下步骤:
步骤1、将A组分的原料混合,脱泡后获得A组分,将B组分的原料混合获得B组分;
步骤2、将A组分和B组分混合,脱泡后获得灌封胶。
作为优选方案,步骤1中所述A组分的原料混合时间为1~4h。
作为优选方案,步骤1中所述脱泡时间为10~60min。
作为优选方案,步骤1中所述B组分的原料在隔绝空气或氮气保护条件下混合。
作为优选方案,步骤1中所述B组分混合时间为5~60min。
作为优选方案,步骤2中所述脱泡时间为3~10min。
本发明还提供了上述灌封胶在接线盒灌封中的应用。
相比于现有技术,本发明实施例具有如下有益效果:
本发明通过将特定结构、特定分子量的T型聚硅氧烷和聚二甲基硅氧烷为基体,加入特定种类、粒径的阻燃填料和导电填料,实现良好的抗拉伸强度和伸长率高、导热性能和阻燃性能,并且得到的产品还具有粘度低、拉伸剪切强度高的优点。以上优点说明本发明的灌封胶具有优异的综合性能,适用于光伏接线盒的灌封,灌封的接线盒散热效果、阻燃效果、防水效果优异,且粘度低、抗拉伸强度和伸长率高,避免了接线盒胶体开裂、胶体与接线盒剥离等现象,从而提升接线盒的使用寿命。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1~2
实施例1、实施例2分别提供一种灌封胶,包括A组分和B组分,A、B组分具体配比如表1所示,制备方法包括以下步骤:
步骤1、将A组分各原料混合搅拌2h,脱泡30min,获得A组分,B组分各原料在氮气保护下搅拌30min,获得B组分。
步骤2、将A组分和B组分按质量比10:1混合,脱泡5min获得灌封胶。
实施例组分说明如下:
T型聚硅氧烷:CH3SiO3/2{[(CH3)2SiO1/2]88SiCH3(CH3O)2}3,广州集泰化工;
聚二甲基硅氧烷:(CH3)3SiO[(CH3)2SiO1/2]40Si(CH3)3,市售;
碱式碳酸镁:Mg2(OH)2CO3,粒径5μm,市售;
氢氧化铝:粒径5μm,市售;
氮化硼:2μm,市售;
氧化铝:粒径2μm,市售;
聚醚多元醇:脂肪醇聚氧乙烯醚,市售;
正硅酸乙酯Si40:市售;
3-氨基丙基三乙氧基硅烷KH-550:市售;
二月桂酸二丁基锡:市售。
表1实施例1~2的灌封胶的组成/按质量份数计
对比例1~4
对比例1~4分别提供了一种灌封胶,这些灌封胶包括A组分和B组分,A、B组分具体配比如表2所示,A组分和B组分按质量10:1混合,制备方法与实施例1相同。
对比例1采用的107胶的结构式为HO(CH3)2SiO[(CH3)2SiO1/2]264Si(CH3)2OH。
表2对比例2~4的灌封胶的组成/按质量份数计
对比例5~9
对比例5~9分别提供了一种灌封胶,这些灌封胶与实施例1的配方和制备方法基本相似,不同之处有:
对比例5的T型聚硅氧烷的分子量为200;
对比例6的聚二甲基硅氧烷的分子量为200000;
对比例7的聚二甲基硅氧烷结构式为(R4)3SiO[R4R5SiO1/2]p[(R4)2SiO1/2]qSi(R4)3,R4为-CH2CH2CH3,R5为-CH2CH2CH3;
对比例8的导热填料粒径为150μm;
对比例9的阻燃填料粒径为150μm。
效果例
将上述实施例及对比例所得的灌封胶进行性能测定,测定结果如表3所示,具体操作方法如下:
混合粘度按照GB/T 2794-2013标准测定;
导热系数按照ASTM D5470标准测定;
阻燃等级按照UL94等级指标测定;
拉伸剪切强度按照GB/T 7124标准测定;
抗拉伸强度和伸长率按照GB/T 528标准测定。
表3各实施例及对比例所得灌封胶的性能测定结果
上述实施例表明,本发明制备的灌封胶拉伸强度和伸长率高;导热系数高,可以提升接线盒的散热效果;阻燃等级达到最高阻燃等级UL94-V0;拉伸剪切强度高,说明粘接性能稳定,粘接性能好,防水效果好。本发明的灌封胶的综合性能优异,采用本灌封胶灌封的接线盒散热效果、阻燃效果、防水效果优异,并且粘度低、抗拉伸强度和伸长率高,可避免接线盒胶体开裂、胶体与接线盒剥离等现象,从而提升接线盒的使用寿命。
通过上述实施例与对比例结果表明:
与实施例1相比,对比例1结果表明采用107胶得到的灌封胶拉伸强度和伸长率不佳;
对比例2-4结果表明采用的阻燃填料、导热填料、深层固化剂种类不合适,得到的灌封胶粘度过大或导热系数低,或阻燃性能、拉伸剪切强度、拉伸强度和伸长率不佳;
对比例5结果表明T型聚硅氧烷分子量过小会导致灌封胶的抗拉伸强度和伸长率不佳;
对比例6结果表明聚二甲基硅氧烷的分子量过大会导致灌封胶的混合粘度过大,造成流平性和流动性不佳,不利于灌胶;
对比例7结果表明采用结构式不符合要求的聚二甲基硅氧烷会导致抗拉伸强度和伸长率不佳;
对比例8、对比例9结果表明导热填料或阻燃填料粒径过大会导致灌封胶的抗拉伸强度和伸长率不佳。
以上所述的具体实施例,对本发明的目的、技术方案和有益效果进行了进一步的详细说明,应当理解,以上所述仅为本发明的具体实施例而已,并不用于限定本发明的保护范围。特别指出,对于本领域技术人员来说,凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (9)
1.一种灌封胶,其特征在于,包含A和B两个组分,A组分包括以下按质量份数计的原料:T型聚硅氧烷10~30份,聚二甲基硅氧烷2~15份,阻燃填料38~69份,导热填料2~21份,深层固化剂0.02~2份;
B组分包括以下按质量份数计的原料:聚二甲基硅氧烷1~30份,交联剂40~80份,增粘剂1~10份,催化剂0.1~10份;
所述T型聚硅氧烷的分子量为5000~500000;
所述T型聚硅氧烷的结构式为R1SiO3/2{[(R2)2SiO1/2]aSi(R2)m(R3)n}3,其中,R1独立地为-CH3、-CH2CH3或-C6H5中任意一种,R2独立地为-CH3、-CH2CH3或-C6H5中任意一种或两种,R3独立地为-OCH3、-OCH2CH3或-OCH2CH2CH3中任意一种,a、n为大于0的整数,m+n=3。
2.如权利要求1所述的灌封胶,其特征在于,所述A、B组分按质量比(4~20):1混合。
3.如权利要求1所述的灌封胶,其特征在于,包含以下各项中至少一项:
所述聚二甲基硅氧烷的分子量为500~100000;
所述聚二甲基硅氧烷的结构式为(R4)3SiO[R4R5SiO1/2]p[(R4)2SiO1/2]qSi(R4)3,其中,R4和R5独立地为-CH3、-CH2CH3或-C6H5中任意1种或几种,p和q为大于等于0的整数。
4.如权利要求1所述的灌封胶,其特征在于,包含以下各项中的至少一项:
所述阻燃填料和导热填料的粒径为0.2~100μm;
所述导热填料的粒径为0.2~100μm;
所述阻燃填料为氧化镁、氢氧化镁、碱式碳酸镁和氢氧化铝中的一种或几种;
所述导热填料为二氧化硅、碳纳米管、氧化铝、氮化硼、氮化铝和碳化硅中的一种或几种。
5.如权利要求1所述的灌封胶,其特征在于,所述深层固化剂为聚醚多元醇、十二烷基苯磺酸钠和甘油中的一种或几种。
6.如权利要求1所述的灌封胶,其特征在于,包含以下各项中的至少一项:
所述交联剂为甲基三甲氧基硅烷、甲基三乙氧硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、正硅酸乙酯Si28和正硅酸乙酯Si40中的一种或几种;
所述增粘剂为3-氨基丙基三乙氧基硅烷KH-550、γ-(2,3-环氧丙氧)丙基三甲氧基硅烷KH-560、γ-巯丙基三甲氧基硅烷KH-570和N-(β-氨乙基)-γ-氨丙基三甲氧基硅烷KH-792中的一种或几种;
所述催化剂为有机锡和有机锡螯合物中的一种或几种。
7.如权利要求1~6任一项所述的灌封胶的制备方法,其特征在于,包括以下步骤:
步骤1、将A组分的原料混合,脱泡后获得A组分,将B组分的原料混合获得B组分;
步骤2、将A组分和B组分混合,脱泡后获得灌封胶。
8.如权利要求7所述的灌封胶的制备方法,其特征在于,包含以下各项中的至少一项:
步骤1中所述A组分的原料混合时间为1~4h;
步骤1中所述脱泡时间为10~60min;
步骤1中所述B组分的原料在隔绝空气或氮气保护条件下混合;
步骤1中所述B组分混合时间为5~60min;
步骤2中所述脱泡时间为3~10min。
9.如权利要求1~6任一项所述的灌封胶在光伏接线盒灌封中的应用。
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EP0572927A1 (en) * | 1992-05-28 | 1993-12-08 | Dow Corning Toray Silicone Company Ltd. | Low modulus room-temperature-curable organosiloxane composition |
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