CN115431189B - Polishing sponge pad - Google Patents
Polishing sponge pad Download PDFInfo
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- CN115431189B CN115431189B CN202111204109.3A CN202111204109A CN115431189B CN 115431189 B CN115431189 B CN 115431189B CN 202111204109 A CN202111204109 A CN 202111204109A CN 115431189 B CN115431189 B CN 115431189B
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- Prior art keywords
- polishing
- sponge
- sponge pad
- main body
- clay
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- 238000005498 polishing Methods 0.000 title claims abstract description 154
- 239000000203 mixture Substances 0.000 claims abstract description 28
- 239000002245 particle Substances 0.000 claims description 15
- 229920000098 polyolefin Polymers 0.000 claims description 6
- 229920005862 polyol Polymers 0.000 claims description 3
- 150000003077 polyols Chemical class 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 229920002457 flexible plastic Polymers 0.000 claims 1
- 239000003595 mist Substances 0.000 abstract description 5
- 239000003973 paint Substances 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004927 clay Substances 0.000 description 3
- 238000009957 hemming Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002367 Polyisobutene Polymers 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010097 foam moulding Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
- B24D15/04—Hand tools or other devices for non-rotary grinding, polishing, or stropping resilient; with resiliently-mounted operative surface
Abstract
The invention provides a polishing sponge pad capable of polishing a polished surface with high precision. The polishing sponge pad (10) has: a sponge main body (11) provided with a polishing surface (11 a) and an upper surface positioned on the opposite side of the polishing surface (11 a); a clay-like polishing composition (12) impregnated into the polishing surface (11 a); and a hand-held part (13) which is provided on the opposite side of the polishing surface (11 a) and is harder than the sponge main body (11). A plurality of cuts (11 c) facing the inside of the sponge body (11) are formed on the polishing surface (11 a) of the sponge body (11) so as to extend from any one end (11 d) of the polishing surface (11 a) to the end (11 e) opposite to the end, and when the vehicle body is cleaned, tiny protrusions and paint mist attached to the surface of the vehicle body can be removed.
Description
Technical Field
The present invention relates to a polishing sponge pad for removing an adherent substance adhering to a painted surface or the like.
Background
Various pollutants such as paint mist and iron powder adhere to the surfaces of a vehicle body such as an automobile and a mechanical device installed outdoors. Among such contaminants, fine protrusions such as iron powder bite into the painted surface, and eventually corrode the metallic material under the painted surface. As an example of a means for removing such fine protrusions without damaging the painted surface, patent document 1 describes a polishing towel in which a soft plastic grinding stone, which is a clay-like composition, is impregnated into terry cloth.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2020-189035
Disclosure of Invention
In the polishing towel impregnated with the plastic soft grindstone, the surface of the toweling cloth is relatively hard, so that a high polishing force can be obtained, but it is difficult to polish the painted surface with high precision. Furthermore, it is also difficult to change the polishing force in an increasing or decreasing manner. For example, in cleaning a high-grade automobile or the like, there is a demand and a desire to clean a painted surface of a vehicle body without causing a fine damage of a wire, and therefore, development of a polishing means capable of polishing the painted surface with high precision is required.
The invention aims to provide a polishing sponge pad capable of polishing a polished surface with high precision.
The polishing sponge pad of the present invention has: a sponge main body having a 1 st surface and a 2 nd surface located on the opposite side of the 1 st surface; and a clay-like polishing composition impregnated in the 1 st surface, wherein a slit extending from any one end of the 1 st surface to an end opposite to the end is formed so as to extend toward the inside of the sponge body.
According to the present invention, the polished surface can be polished with high precision. Moreover, the polishing force of the polishing sponge pad can be adjusted to be increased or decreased.
Drawings
Fig. 1 is a perspective view showing a structure of a hand-held surface side of a polishing sponge pad according to an embodiment of the present invention.
Fig. 2 is a perspective view showing a structure of the polishing surface side of the polishing sponge pad shown in fig. 1.
Fig. 3 is a rear view showing the configuration of the polishing surface shown in fig. 2.
Fig. 4 is a front view showing the construction of the polishing sponge pad shown in fig. 1.
Fig. 5 is a partial perspective view showing a method of using the polishing sponge pad shown in fig. 1.
Fig. 6 is a schematic view showing a hemming phenomenon in the polishing sponge pad shown in fig. 1.
Fig. 7 (a) and 7 (b) are partial enlarged views schematically showing a state in which minute projections are removed.
Fig. 8 is a perspective view showing the structure of a polishing sponge pad according to a modification of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The construction of the polishing sponge pad 10 of the present embodiment is explained. As shown in fig. 1 to 4, the polishing sponge pad 10 of the present embodiment includes: a sponge main body 11, the sponge main body 11 having a polishing surface (1 st surface) 11a as a lower surface and an upper surface (2 nd surface) 11b located on the opposite side of the polishing surface 11 a; and a clay-like polishing composition 12 impregnated in the polishing surface 11a. The polishing surface 11a is a surface for polishing a surface to be polished such as a painted surface, and the upper surface 11b shown in fig. 4 is a surface on the hand side.
Further, on the polishing surface 11a of the sponge main body 11, slits 11c facing the inside of the sponge main body 11 are formed so as to extend from any end 11d of the polishing surface 11a to an end 11e opposite to the end. In addition, the slit 11c is formed toward the inside of the sponge main body 11 along the thickness direction T of the sponge main body 11, but does not reach the upper surface 11b, but ends in the inside of the sponge main body 11. The slit 11c is formed such that the edge portions at the end portions 11d and 11e of the polished surface 11a are not connected to each other, and the slit 11c is visible on the side surface of the sponge body 11. Further, it is preferable that a plurality of slits 11c are formed in the polishing surface 11a so as to be in the same direction as each other, and in the polishing sponge pad 10 of the present embodiment, three slits 11c are formed in the polishing surface 11a so as to be in the same direction as each other.
In the polishing sponge pad 10, the sponge main body 11 is substantially rectangular parallelepiped. Thus, the polishing surface 11a and the upper surface 11b are rectangular, and three slits 11c are formed in the polishing surface 11a so as to extend along the longitudinal direction L of the rectangular polishing surface 11a.
The sponge main body 11 is formed by foam molding a synthetic resin such as polyurethane. Further, since the clay-like polishing composition 12 is impregnated into the polishing surface 11a, the sponge main body 11 is an open-cell body that can allow liquid and gas to permeate therethrough. The impregnation depth of the clay-like polishing composition 12 in the polishing surface 11a of the sponge main body 11 is not limited, but is preferably, for example, 2mm to 3mm. When the immersion depth of the clay-like polishing composition 12 is less than 2mm to 3mm, the amount of the clay-like polishing composition 12 adhering to the surface to be polished during polishing becomes small, and the polishing force during hemming of the individual pieces 11f (see fig. 6) of the sponge main body 11 including the polished surface 11a is insufficient during polishing.
On the other hand, when the immersion depth of the clay-like polishing composition 12 is more than 2mm to 3mm, the amount of the clay-like polishing composition 12 immersed in the continuous bubble body of the sponge main body 11 becomes excessive, and the continuous bubble body becomes hard, and damages the surface to be polished during polishing. Therefore, the dipping depth of the clay-like polishing composition 12 is preferably 2mm to 3mm. The method of impregnating the sponge main body 11 with the clay-like polishing composition 12 is as follows: the clay-like polishing composition 12 is dissolved in a solvent, immersed in the polishing surface 11a of the sponge main body 11, and then only the solvent is volatilized by a heat treatment or the like.
The depth (notched amount) of the notch 11c in the polishing surface 11a is preferably sufficiently larger than the immersion depth of the clay-like polishing composition 12 by 2mm to 3mm.
Further, in the polishing sponge pad 10, a plate-shaped holding portion 13 harder than the sponge body 11 is fixed to the upper surface (2 nd surface) 11b of the sponge body 11. The hand-held portion 13 is also made by foam molding synthetic resin such as polyurethane, for example. The hardness of the sponge can be changed by the foaming degree, and the hardness of the holding portion 13 is sufficiently higher than that of the sponge main body 11, so that the rigidity of the polishing sponge pad 10 can be improved, and the holding by an operator at the time of polishing can be facilitated.
Next, the clay-like polishing composition 12 impregnated in the sponge main body 11 will be described. The "clay" in the clay-like polishing composition 12 is "a substance having plasticity and tackiness" composed of fine weathered particles, or may be said to be "a deposit composed of fine particles". The clay-like polishing composition 12 of the present embodiment includes a plastic soft base material 12a and polishing particles 12b shown in fig. 7, which will be described later. As the plastic soft base material 12a, a clay-like substance composed of a resin or the like can be used, and for example, a resin such as a polyolefin or a polyolefin polyol can be used. Polyolefin polyols are polymers or copolymers of diene monomers having hydroxyl groups at the molecular terminals or in the molecular chains, and their hydrides. Examples of the polyolefin include polybutene and polyisobutylene. Polybutene, polyisobutene and the like having hydroxyl groups at molecular terminals or in molecular chains can also be used.
Further, as the polishing particles 12b, a substance having relatively high hardness is preferable, and for example, calcium carbonate, quartz, silicon carbide (diamond grit), a compound, ceramics, green silicon carbide, or the like can be used. Calcium carbonate is particularly preferably used. The average particle diameter of the polishing particles 12b is preferably, for example, 2 μm to 50 μm. The reason is that when the particle diameter is smaller than 2um, the polishing force is insufficient, and when the particle diameter is larger than 50um, scratch or residual fine damage may occur on the surface (painted surface) 14a of the vehicle body 14 shown in fig. 5. The polishing particles 12b are preferably added in an amount of 50 to 100 parts by weight, more preferably 70 to 80 parts by weight, based on 100 parts by weight of the clay-like polishing composition.
Other additives (fillers, pigments, fragrances, etc.) may be included as the clay-like polishing composition 12. Examples of the filler include inorganic powders such as talc, clay, kaolin, silica, aluminum hydroxide, alumina, bentonite, diatomaceous earth, titanium oxide, glass, and silica, and organic powders such as polyurethane, polypropylene, nylon, urea resin, phenol resin, and urethane resin, and mixtures of these materials.
Next, a method of using the polishing sponge 10 of the present embodiment will be described. The method of using the polishing sponge 10 is not limited, and, for example, the polishing sponge can be used for cleaning (polishing) the surface (painted surface) 14a of the vehicle body 14 of an automobile as shown in fig. 5. The vehicle body 14 has minute projections (height of 1mm or less and width of 1mm or less) 15a shown in fig. 7, which cannot be removed by a detergent or the like, remaining even after washing. The fine protrusions 15a are contaminated materials such as iron powder. For example, the minute protrusions 15a are removed by gently wiping the surface 14a of the vehicle body 14 with the polishing sponge pad 10 while spraying water to the surface (painted surface) 14a of the vehicle body 14. In addition, water droplets 16 remain on the surface 14a of the vehicle body 14 on which the water is sprayed.
In the polishing sponge pad 10, by forming the slit 11a in the polishing surface 11a of the sponge main body 11, at the time of cleaning (polishing), the polishing particles 12b move while curling (twisting) P occurs in the single piece portion 11f of the sponge main body 11 as shown in fig. 6, and the polishing force increases. However, in the polishing sponge pad 10 of the present embodiment, since the clay-like polishing composition 12 is impregnated into the soft sponge main body 11, polishing can be smoothly performed, and the minute protrusions 15a can be removed without damaging the surface (painted surface) 14a. The polishing force can be changed by increasing or decreasing the depth of the slits 11c formed in the sponge body 11 or the number of slits 11c.
Here, a curling (twisting) phenomenon of the single piece portion 11f of the sponge main body 11 in the polishing sponge pad 10 will be described. As shown in fig. 6, when the polishing sponge pad 10 is moved in the movement direction Q, the individual pieces 11f of the sponge that are unit-sliced by the presence of the slit 11c (see fig. 2) are curled (twisted) P, respectively. The individual piece portions 11f are inclined by the curled edges (twists) P, and the edge portions 11g stand up. Then, as the polishing sponge 10 is moved in the moving direction Q, the single piece 11f in which the edge portion 11g stands up while becoming inclined sequentially occurs. This can increase the polishing force of the polishing sponge pad 10 as compared with the case of polishing with the entire surface. Further, since the sponge is far softer than a towel or the like, the polishing can be performed smoothly without damaging the surface 14a of the vehicle body 14.
Further, the polishing particles 12b move while curling (twisting) P occurs. As shown in fig. 7 (a) and 7 (b), the polishing particles 12b also move due to the movement of the clay-like polishing composition 12 in the movement direction Q, and the polishing force increases. As a result, as shown in fig. 7 b, the minute projections 15a can be removed from the surface (painted surface) 14a of the vehicle body 14. At this time, in the polishing sponge pad 10 of the present embodiment, since the clay-like polishing composition 12 is impregnated into the polishing surface 11a of the soft sponge body 11 as described above, polishing can be smoothly performed, and the minute protrusions 15a can be removed without damaging the surface 14a of the vehicle body 14. In addition, the paint mist 15b can be removed.
As described above, according to the polishing sponge pad 10 of the present embodiment, since the notch 11c is formed in the polishing surface 11a of the sponge main body 11, the single piece 11f of the sponge main body 11 is curled (twisted) P at the time of polishing, and therefore polishing can be performed smoothly, and the minute protrusions 15a can be removed without damaging the surface (painted surface) 14a. In other words, the surface (painted surface) 14a can be polished with high precision. This allows cleaning without causing a fine damage to the surface 14a of the vehicle body 14, and satisfies the demands and expectations of the users of high-grade automobiles.
In addition, the minute protrusions 15a cannot be easily removed in a normal car washing process. The fine protrusions 15a are formed of the above-mentioned iron powder, and are also formed by various reasons such as PM2.5 and yellow sand. In particular, in recent brake shoes, steel wool is hardened, and the vehicle body 14 is easily contaminated with iron powder. In this way, since the minute projections 15 are formed for various reasons, it is difficult to perform chemical removal such as dissolution in accordance with the composition of the minute projections 15a.
In contrast, in the polishing sponge pad 10 of the present embodiment, the minute protrusions 15a can be removed by the effect of the curling (twisting) phenomenon of the polishing surface 11a of the sponge main body 11, and the surface 14a of the vehicle body 14 can be polished with high accuracy without damaging the surface 14a of the vehicle body 14, regardless of the physical properties of the substance forming the minute protrusions. In addition, paint mist 15b adhering to surface 14a can be removed. That is, the surface 14a of the vehicle body 14 can be cleaned (polished) with high accuracy.
Further, since the polishing force can be changed by increasing or decreasing the depth of the slits 11c and the number of slits 11c formed in the sponge main body 11, the polishing force of the polishing sponge pad 10 can be adjusted to be increased or decreased.
Further, since the sponge main body 11 is substantially rectangular parallelepiped, the polishing sponge pad 10 is also substantially rectangular parallelepiped and has a relatively slender shape, and therefore, the operator can firmly grasp the polishing sponge pad 10, and the wiping operation of the polishing sponge pad 10 at the time of cleaning can be easily performed.
Further, since the holding portion 13 harder than the sponge main body 11 is fixed to the sponge main body 11, the rigidity of the polishing sponge pad 10 can be improved, and the holding by an operator can be facilitated at the time of polishing. As a result, even if continuous wiping operation is performed, the polishing force is not weakened, and high-precision polishing can be continued.
Next, a polishing sponge pad 10 according to a modification of the present embodiment will be described. The polishing sponge pad 10 of the modification shown in fig. 8 has the following structure: the polishing surface (1 st surface) 11a is rectangular, and the slit 11c is formed in plural numbers along the long side direction L and the short side direction M of the rectangle.
Thus, since many individual pieces 11f are formed by the polished surface 11a (see fig. 6), the polishing force can be increased, and the surface (painted surface) 14a of the vehicle body 14 can be polished with higher accuracy.
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above embodiment, the case where the plurality of slits 11c are formed in the polished surface 11a of the sponge main body 11 has been described, but at least one slit 11c may be formed in the polished surface 11a.
The shape of the sponge body 11 is not limited to a rectangular parallelepiped, and may be, for example, a disk shape in which the polishing surface 11a is circular.
Further, although the above embodiment has been described with respect to the cleaning (polishing) of the surface (painted surface) 14a of the vehicle body 14, the polishing sponge pad 10 of the above embodiment can also be applied to the cleaning (polishing) of a portion (for example, a windshield, a tire wheel, or the like) of an automobile other than the vehicle body 14. Further, the polishing composition can be applied to cleaning (polishing) of various articles such as vehicles other than automobiles (for example, railway vehicles), machines installed outdoors, and window glass of buildings.
In the above embodiment (fig. 7), the cross section of the polishing particles 12b is shown in a triangular shape, but the shape of the polishing particles 12b is not limited, and, for example, spherical, columnar, or other shapes may be used.
Description of the reference numerals
10. Polishing sponge pad
11. Sponge main body
11a polishing surface (surface 1)
11b upper surface (2 nd side)
11c incision
11d, 11e end
11f single piece
11g edge portion
11h, 11i end
12. Clay polishing composition
12a plastic soft base material
12b polishing particles
13. Hand-held part
14. Vehicle body
14a surface (painted surface)
15a micro-protrusion
15b paint mist
16. Water drop
L long side direction
M short side direction
P hemming
Q direction of movement
T thickness direction
Claims (7)
1. A polishing sponge pad, wherein,
the polishing sponge pad has:
a sponge main body having a 1 st surface and a 2 nd surface located on the opposite side of the 1 st surface; and
a clay-like polishing composition impregnated in the 1 st surface,
a slit extending from any one end of the 1 st surface to an end opposite to the end, toward the inside of the sponge main body;
wherein the slit is formed in a grid shape on the 1 st surface, the sponge body has a plurality of pieces formed by the slit, and edge portions of the plurality of pieces are in a standing state at the time of polishing.
2. The polishing sponge pad according to claim 1, wherein,
the slits are formed in a plurality of lines along the same direction with each other.
3. The polishing sponge pad according to claim 2, wherein,
the 1 st surface is rectangular,
the slit is formed in plural pieces along the longitudinal direction of the 1 st surface of the rectangle.
4. The polishing sponge pad according to claim 1, wherein,
the 1 st surface is rectangular,
the slit is formed in plural numbers along the long side direction and the short side direction of the 1 st surface of the rectangle.
5. The polishing sponge pad according to claim 3, wherein,
the clay-like polishing composition includes a ductile soft substrate and polishing particles.
6. The polishing sponge pad according to claim 5, wherein,
the flexible plastic substrate comprises a polyolefin or a polyolefin polyol.
7. The polishing sponge pad according to claim 6, wherein,
a hand-held part harder than the sponge main body is fixed on the 2 nd surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021092652A JP7217048B2 (en) | 2021-06-02 | 2021-06-02 | polishing sponge pad |
| JP2021-092652 | 2021-06-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115431189A CN115431189A (en) | 2022-12-06 |
| CN115431189B true CN115431189B (en) | 2024-03-26 |
Family
ID=84271856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111204109.3A Active CN115431189B (en) | 2021-06-02 | 2021-10-15 | Polishing sponge pad |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7217048B2 (en) |
| CN (1) | CN115431189B (en) |
| TW (1) | TWI802967B (en) |
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| US20080311363A1 (en) * | 2007-06-12 | 2008-12-18 | 3M Innovative Properties Company | Metal fiber coated substrate and method of making |
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| CN109247883A (en) * | 2018-07-25 | 2019-01-22 | 中山市科炫表面技术有限公司 | A kind of compound silk floss of multifunctional cleaning and preparation method thereof |
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| CN209915891U (en) * | 2019-04-30 | 2020-01-10 | 河北洁仕宝日用塑料制品有限公司 | Cleaning sponge head of cleaning tool |
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2021
- 2021-06-02 JP JP2021092652A patent/JP7217048B2/en active Active
- 2021-08-20 TW TW110130944A patent/TWI802967B/en active
- 2021-10-15 CN CN202111204109.3A patent/CN115431189B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5472858U (en) * | 1977-11-02 | 1979-05-24 | ||
| JPS5475060U (en) * | 1977-11-07 | 1979-05-28 | ||
| JP2001258809A (en) * | 1997-08-29 | 2001-09-25 | Inoac Corp | Wiper tool |
| CN203956756U (en) * | 2014-06-13 | 2014-11-26 | 唐永勇 | A kind of polishing sponge disc |
| CN207807477U (en) * | 2018-02-02 | 2018-09-04 | 常州市太宇橡塑有限公司 | A kind of sponge polishing disk |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7217048B2 (en) | 2023-02-02 |
| JP2022185170A (en) | 2022-12-14 |
| CN115431189A (en) | 2022-12-06 |
| TW202247812A (en) | 2022-12-16 |
| TWI802967B (en) | 2023-05-21 |
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