CN115424969A - Real-time deviation rectifying method and system based on die bonder - Google Patents
Real-time deviation rectifying method and system based on die bonder Download PDFInfo
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- CN115424969A CN115424969A CN202111605917.0A CN202111605917A CN115424969A CN 115424969 A CN115424969 A CN 115424969A CN 202111605917 A CN202111605917 A CN 202111605917A CN 115424969 A CN115424969 A CN 115424969A
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
The invention relates to the technical field of die bonder, in particular to a real-time deviation rectifying method based on the die bonder, which comprises the following steps: acquiring real-time position information of a preset base point; comparing whether the real-time position information of the preset base point is the same as the initial position information or not; if not, calculating the offset; and calculating real-time position information of the part on the machine platform according to the offset and the initial position information of the part on the machine platform so as to realize deviation correction. According to the invention, the problem of mechanism deviation is solved by re-calibrating the position data of each part after deviation, and the chip mounting precision of the die bonder is greatly improved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of die bonder, in particular to a real-time deviation rectifying method and system based on the die bonder.
[ background of the invention ]
With the rapid progress of modern electronic technology, the preparation and production of electronic equipment are developed towards high precision, and the die bonder is an important device of a high-precision patch in the field of electronic technology.
The factors influencing the mounting accuracy of the die bonder are many, and one of the important factors is that the die bonder deviates from the position of a mechanism on the originally calibrated device due to expansion with heat and contraction with cold during the working process, so that the precision of the chip is reduced.
[ summary of the invention ]
The invention provides a real-time deviation rectifying method and system based on a die bonder, aiming at solving the problem that the die bonder reduces the precision of a chip during working.
In order to solve the technical problems, the invention provides the following technical scheme: a real-time deviation rectifying method based on a die bonder comprises the following steps:
acquiring real-time position information of a preset base point;
comparing whether the real-time position information of the preset base point is the same as the initial position information; if not, calculating the offset;
and calculating to obtain the real-time position information of the part on the machine according to the offset and the initial position information of the part on the machine.
Preferably, the position of the preset base point relative to the machine table is kept unchanged.
Preferably, the specific step of acquiring the real-time position information of the preset base point includes:
calibrating a coordinate system;
calibrating the initial position coordinates of a preset base point in the coordinate system and acquiring the initial position coordinates of the part on the machine platform in the coordinate system;
and acquiring real-time position coordinates of a preset base point according to the coordinate system.
Preferably, the calibrating of the initial position coordinates of the preset base point and the obtaining of the initial position coordinates of the component on the machine are performed before the die bonder mounts the chip, and the obtaining of the real-time position coordinates of the preset base point is performed in the process of mounting the chip by the die bonder.
Preferably, the specific steps of calculating the offset are as follows:
and obtaining the offset through a coordinate calculation method according to the initial position coordinate and the real-time position coordinate of the preset base point in the coordinate system.
Preferably, if the real-time position coordinates are the same as the initial position coordinates after the comparison, it is not necessary to calculate the offset and then correct the position information of the entire machine.
Preferably, after the step of calculating the real-time location information of the component on the machine, the method further includes:
and the die bonder operates according to the calculated real-time position information of the components on the machine table to carry out chip mounting.
Preferably, after calculating the real-time location information of the component on the machine, the method further includes the following steps:
and marking the acquired real-time position information of the preset base point and the real-time position information of the part on the machine station, which is calculated according to the offset, as new initial position information.
Preferably, the step of acquiring the real-time position information of the preset base point is to continuously acquire the real-time position information of the preset base point or to acquire the real-time position information of the preset base point again at predetermined intervals.
In order to solve the above technical problems, the present invention provides another technical solution as follows: a real-time deviation correcting system based on die bonder comprises the following modules:
a camera module: acquiring real-time position information of a preset base point;
a comparison module: comparing whether the real-time position information of the preset base point is the same as the initial position information;
a processing module: and calculating the offset, and calculating to obtain the real-time position information of the part on the machine according to the offset and the initial position information of the part on the machine.
Compared with the prior art, the real-time deviation rectifying method and system based on the die bonder have the following beneficial effects:
1. the invention presets the base point, obtains the real-time position information of the preset base point, compares with the initial position information of the base point, the mechanism on the equipment can shift due to the expansion with heat and contraction with cold in the operation process of the die bonder, namely, the accuracy of the chip bonding can be reduced due to the chip bonding according to the originally calibrated data, the real-time position of the base point obtained after the shift is necessarily different from the initial position, it can be understood that the base point is fixed relative to the die bonder machine table, so the position information of the base point is fixed relative to the position information of the components on the die bonder machine table, namely, the position shift of the components on the whole machine table can be known by calculating the shift of the base point, and the new position information of the components on the whole machine table after the shift can be directly obtained by calculating, namely, the problem of the shift of the mechanism of the die bonder can be solved by re-calibrating the position information data of each component after the shift, and the chip bonding accuracy of the die bonder can be greatly improved.
2. According to the invention, a coordinate system is calibrated, the position information of each component is easier to calibrate and obtain in a coordinate mode, the initial position coordinates of the preset base point are calibrated, the initial position coordinates of the components on the whole machine are obtained, and before the chip mounter carries out mounting, the real-time position information of the preset base point is obtained and corrected in the chip mounting process of the chip mounter so as to ensure the accuracy of chip mounting.
3. The real-time position coordinates of the base point are obtained and then are compared with the preset position coordinates, if the real-time position coordinates are different, the base point can be understood to be shifted, all the basic position information is represented in a coordinate mode, the offset can be calculated more easily through a coordinate calculation mode, and the position coordinates of all parts of the whole machine table can be corrected more conveniently in a follow-up mode; if the coordinates of the two are the same after comparison, the coordinates are determined not to be shifted, and the subsequent steps are not needed.
4. According to the invention, the real-time position coordinate of the whole machine after the deviation is obtained through the initial position coordinate and the deviation calculation of the whole machine, which is equivalent to recalibrating the real-time position coordinate of the whole machine, and the chip mounter operates according to the corrected real-time position coordinate, so that the chip mounting accuracy of the chip mounter can be ensured.
5. The step of obtaining the real-time information of the preset base point is to continuously obtain the real-time position coordinates of the base point, and the camera device moves along with the material suction device, so that the continuous obtaining can be understood that the coordinates of the whole machine table need to be corrected before each chip is mounted, and the accuracy of continuous chip mounting is improved.
6. The step of obtaining the real-time information of the preset base point can be obtained every preset time, and understandably, the mounted chip can not meet the requirement by finding out a working time threshold value, namely error deviation accumulated by how long the die bonder needs to work continuously, namely the mounted chip meets the requirement in how long the die bonder works continuously, and can be corrected once again every so long time, so that the steps are saved, the mounting efficiency of the die bonder is improved, and the mounted chip meets the requirement.
7. The embodiment of the invention also provides a real-time deviation rectifying system based on the die bonder, which has the same beneficial effects as the real-time deviation rectifying method based on the die bonder, and the details are not repeated herein.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.
Fig. 1 is a flowchart illustrating steps of a real-time error correction method based on a die bonder according to a first embodiment of the present invention.
Fig. 2 is a flowchart illustrating a step S1 of a real-time error correction method based on a die bonder according to a first embodiment of the invention.
Fig. 3 is a flowchart illustrating step S21 of a real-time deviation rectifying method based on a die bonder according to a first embodiment of the present invention.
Fig. 4 is a flowchart illustrating steps S4 and S5 of a real-time error correction method based on a die bonder according to a first embodiment of the invention.
Fig. 5 is a block diagram of a real-time deviation correcting system based on a die bonder according to a second embodiment of the invention.
The attached drawings indicate the following:
1. a real-time deviation correcting system;
10. a camera module; 20. a comparison module; 30. and (5) a processing module.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, a real-time deviation rectifying method based on a die bonder according to a first embodiment of the present invention includes the following steps:
s1, acquiring real-time position information of a preset base point;
s2, comparing whether the real-time position information of the preset base point is the same as the initial position information or not, and if not, calculating the offset;
and S3, calculating to obtain real-time position information of the part on the machine according to the offset and the initial position information of the part on the machine to realize deviation correction.
The base point in the step S1 is preset in advance on a machine table of the die bonder, and may be at any position; it will be understood that the base point is not necessarily a point, but may be other points such as a pattern, a mark with a certain shape, etc.; the base point can be arranged in plurality at the same time.
It can be understood that, the real-time position information of the preset base point is obtained, that is, the current position information of the preset base point is expressed to be the current position information of the obtained base point, and then compared with the initial position information of the base point, the mechanism on the equipment is deviated due to the thermal expansion and cold contraction of the die bonder in the operation process, and the pasting according to the originally calibrated data causes the accuracy of the pasting to be reduced, and the real-time position of the base point obtained after the deviation is inevitably different from the initial position.
Further, the position of the preset base point relative to the machine table is kept unchanged.
It can be understood that the base point is fixed relative to the machine table of the die bonder, so that the position information of the base point is fixed relative to the position information of the part on the machine table of the die bonder, at the moment, the position deviation of the part on the whole machine table can be known by calculating the deviation of the base point, and the new position information of the part on the whole machine table after the deviation can be directly obtained by calculating, namely, the position data of each part is calibrated again, so that the problem that the mechanism deviates is solved, and the die bonding accuracy of the die bonder is greatly improved.
The comparison process in step S2 may be manual comparison by a user, or may be intelligent comparison by using an intelligent device using a program.
It is understood that the "component" in step S3 should include one or more of a chip, a substrate, and a downward-looking camera. Of course, other components which are located on the machine and need to acquire the position information are included according to a specific scene, and the corresponding components fall into the protection scope of the present invention.
In a specific embodiment, a standard column is arranged on a machine table of a die bonder, a base point is marked on the standard column and can be identified by a camera device, initial position information of the base point is marked before the die bonder is used for mounting a chip, real-time position information of the base point is identified after the die bonder runs for a period of time, an offset can be calculated according to the two pieces of position information, real-time position information of the chip and the substrate can be calculated according to the offset, and then chip mounting can be carried out according to the real-time position information to ensure mounting accuracy.
In another embodiment, the base point is arranged at an upward-looking camera in the die bonder, initial position information of the base point is firstly calibrated, real-time position information of the base point is then obtained, an offset is calculated according to the two pieces of position information, and real-time position information of the upward-looking camera is obtained through calculation according to the offset and the initial position information of the upward-looking camera.
It is understood that the above two embodiments can be performed simultaneously to improve the mounting accuracy.
Specifically, referring to fig. 2, the step S1 includes the following steps:
s11, calibrating a coordinate system;
s12, calibrating the initial position coordinates of a preset base point in the coordinate system and acquiring the initial position coordinates of the part on the machine table in the coordinate system;
and S13, acquiring the real-time position coordinates of the preset base point according to the coordinate system.
Step S11 may select and calibrate a corresponding coordinate system according to specific situations, which may be a two-dimensional coordinate system, a three-dimensional coordinate system, or the like; and the information of each position can be more conveniently acquired in a manner of calibrating a coordinate system.
Exemplary such as: if the base point is only one point, an x, y two-dimensional rectangular coordinate system may be calibrated in step S11, and the initial position coordinates of the preset base point and all the obtained initial position coordinates on the entire machine are calibrated to be one two-dimensional coordinate (x, y); if the base point is a pattern, an x, y, theta coordinate system can be established, the initial position coordinates of the calibration base point and the whole machine platform are (x, y, theta), it can be understood that an angle theta is added on the basis of an x, y two-dimensional rectangular coordinate system, the angle can be calculated through the coordinates of two points on the pattern, and each part on the machine platform can have a certain shape, and the angle can also be calculated through the method, and the offset on the angle can also be judged through the theta.
Further, calibrating the initial position coordinates of the preset base point and acquiring the initial position coordinates of the component on the whole machine before the die bonder mounts the chip, and acquiring the real-time position coordinates of the preset base point in the process of mounting the chip by the die bonder.
Further, referring to fig. 3, the specific step of "calculating the offset" in step S2 includes:
and S21, obtaining the offset through a coordinate calculation method according to the initial position coordinate and the real-time position coordinate of the preset base point in the coordinate system.
It will be appreciated that the offset amount will vary depending on the data contained in the coordinate system established in step S11, as exemplified by: if the step S11 is calibrated to be an x, y two-dimensional rectangular coordinate system, the initial position coordinates of the calibration base points are (x) 0 ，y 0 ) The real-time position coordinate of the base point is (x) 1 ，y 1 ) Offset amount obtained by calculationIs (x) 2 ，y 2 ) The calculation process is as follows
x 2 ＝x 1 -x 0
y 2 ＝y 1 -y 0
Wherein x and y have positive and negative signs, and represent different directions in a coordinate system, the offset (x) at that time 2 ，y 2 ) Indicating that the base point is displaced by x along the x-axis 2 While also being displaced by y in the y-axis direction 2 The distance of (d); if the base point is a pattern, and an angle can also be determined according to the coordinates of two points on the base point, the offset calculated later should also include the angle.
Further, if the preset position coordinate and the real-time position coordinate are the same in step S21, it is not necessary to calculate the offset and then correct the position information of the entire machine. It will be appreciated that if the two position coordinates are the same then it is assumed that no offset has occurred.
Further, referring to fig. 4, after step S3, the method further includes:
and S4, the die bonder operates according to the calculated real-time position information of the components on the machine to carry out chip mounting.
S5: and marking the acquired real-time position information of the preset base point and the real-time position information of the part on the machine station, which is calculated according to the offset, as new initial position information.
It can be understood that, in the die bonder, generally, the image capturing device is used for acquiring each position information, and the image capturing device moves along with the suction nozzle, and since the suction nozzle needs to move back and forth to suck the mounted chip, a deviation may occur over time, and then the image capturing device recognizes the position information of the base point again, and similarly, it can be understood that a deviation may occur if the image capturing device recognizes other position information on the machine station again, and since the base point is fixed relative to each position on the machine station, the deviation is consistent with the deviation of the base point, so that the step of recognizing each position information again can be directly saved, and new real-time position information can be calculated directly through the deviation and the initial position information of each position. And then, chip mounting is carried out according to the new position information, so that the problem that the chip mounting precision is reduced when the die bonder works is solved.
It can be understood that, in step S5, the real-time position information obtained after the deviation correction is re-calibrated to be new real-time position information, because the deviation correction may be performed more than once in the die bonder, when the real-time position information of the base point is obtained again subsequently, the real-time position information is compared with the re-calibrated real-time position information, and the real-time position information is calculated by using the initial position information re-calibrated with each component, that is, the data is updated in real time, so as to improve the efficiency and accuracy of the real-time deviation correction.
In still other real-time examples, the step S5 may not be included, that is, each time the real-time position information of the base point is obtained, the real-time position information is compared with the initial position information of the base point which is calibrated at the beginning, and the offset is calculated, and the coordinates of each component on the correction machine are also compared with the initial position information of each component on the machine which is calibrated at the beginning through the offset.
In an embodiment, the step of obtaining the real-time position information of the preset base point is to continuously obtain the real-time position information of the preset base point.
As can be appreciated, since the camera device moves along with the suction device, the continuous acquisition can be understood as that the coordinate of the whole machine station needs to be corrected before each chip is mounted, so as to improve the mounting accuracy.
In another embodiment, the step of obtaining the real-time position information of the preset base point is to obtain the real-time position information of the base point again every predetermined time interval.
It can be understood that the working time threshold can be found, that is, the chips mounted by the die bonder in the continuous working time are in accordance with the requirements, the chips can be corrected again at intervals of so long time, and each chip does not need to be corrected, so that steps are saved, the mounting efficiency of the die bonder is improved, and the mounted chips are in accordance with the requirements.
Referring to fig. 5, a real-time deviation correcting system 1 based on a die bonder according to a second embodiment of the present invention includes the following modules:
a camera module: acquiring real-time position information of a preset base point;
a comparison module: comparing whether the real-time position information of the preset base point is the same as the initial position information;
a processing module: and calculating the offset, and calculating to obtain the real-time position information of the part on the machine according to the offset and the initial position information of the part on the machine.
It can be understood that, when the modules of the real-time deviation rectifying system 1 are operated, a real-time deviation rectifying method described in the first embodiment needs to be used, and therefore, it is within the scope of the present invention to integrate or configure different hardware for generating functions similar to the effects achieved by the present invention.
In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a from which B can be determined. It should also be understood, however, that determining B from a does not mean determining B from a alone, but may also be determined from a and/or other information.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also appreciate that the embodiments described in this specification are exemplary embodiments in nature, and that the acts and modules involved are not necessarily essential to the invention.
In various embodiments of the present invention, it should be understood that the sequence numbers of the above-mentioned processes do not imply a necessary order of execution, and the order of execution of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
The flowchart and block diagrams in the figures of the present application illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will be understood that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Compared with the prior art, the real-time deviation rectifying method and system based on the die bonder have the following beneficial effects:
1. the invention presets the base point, obtains the real-time position information of the preset base point, compares with the initial position information of the base point, the mechanism on the equipment will shift because of the expansion and contraction of heat and the like in the operation process of the die bonder, namely, the accuracy of the chip bonding will be reduced because of the chip bonding according to the originally calibrated data, the real-time position of the base point obtained after the shift is inevitably different from the initial position, it can be understood that the base point is fixed relative to the die bonder machine table, so the position information of the base point is fixed relative to the position information of the components on the die bonder machine table, that is, the position shift of the components on the whole machine table can be known by calculating the shift of the base point, and the new position information of all the components on the whole machine table after the shift can be directly obtained by calculating, that the position data is re-calibrated according to each component after the shift, thereby solving the problem of the shift of the mechanism, and greatly improving the chip bonding accuracy of the die bonder.
2. According to the invention, a coordinate system is calibrated, the position information of each component is easier to calibrate and obtain in a coordinate mode, the initial position coordinates of the preset base point are calibrated, the initial position coordinates of the components on the whole machine are obtained, and before the chip mounter carries out mounting, the real-time position information of the preset base point is obtained and corrected in the chip mounting process of the chip mounter so as to ensure the accuracy of chip mounting.
3. The real-time position coordinates of the base point are obtained and then are compared with the preset position coordinates, if the real-time position coordinates are different, the base point can be understood to be shifted, all the basic position information is represented in a coordinate mode, the offset can be calculated more easily through a coordinate calculation mode, and the position coordinates of all parts of the whole machine table can be corrected more conveniently in a follow-up mode; if the coordinates of the two are the same after comparison, the coordinates are determined to be not shifted, and the subsequent steps are not needed.
4. According to the invention, the real-time position coordinate of the whole machine after the deviation is obtained through the initial position coordinate and the deviation calculation of the whole machine, which is equivalent to recalibrating the real-time position coordinate of the whole machine, and the chip mounter operates according to the corrected real-time position coordinate, so that the chip mounting accuracy of the chip mounter can be ensured.
5. The step of obtaining the real-time information of the preset base point is to continuously obtain the real-time position coordinates of the base point, and the camera device moves along with the material suction device, so that the continuous obtaining can be understood that the coordinates of the whole machine table need to be corrected before each chip is mounted, and the accuracy of continuous chip mounting is improved.
6. The step of obtaining the real-time information of the preset base point can be obtained every preset time, understandably, the step of obtaining the real-time information of the preset base point can be obtained every preset time, and the step of obtaining the real-time information of the preset base point can be obtained by finding a working time threshold value, namely, error deviation accumulated by the die bonder for continuous working for a long time can cause that the mounted chip can not meet the requirement, namely, the chip mounted by the die bonder in the continuous working time can be corrected every long time, so that the steps are saved, the mounting efficiency of the die bonder is improved, and the mounted chip can meet the requirement.
7. The embodiment of the invention also provides a real-time deviation rectifying system based on the die bonder, which has the same beneficial effects as the real-time deviation rectifying method based on the die bonder, and the details are not repeated herein.
The real-time deviation rectifying method and system based on the die bonder disclosed by the embodiment of the invention are described in detail, a specific example is applied to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for the persons skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present description should not be construed as a limitation to the present invention, and any modification, equivalent replacement, and improvement made within the principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A real-time deviation rectifying method based on a die bonder is characterized by comprising the following steps: the method comprises the following steps:
acquiring real-time position information of a preset base point;
comparing whether the real-time position information of the preset base point is the same as the initial position information; if not, calculating the offset;
and calculating to obtain the real-time position information of the part on the machine according to the offset and the initial position information of the part on the machine.
2. The method of claim 1, wherein: the position of the preset base point relative to the machine table is kept unchanged.
3. The method of claim 1, wherein: the specific steps of acquiring the real-time position information of the preset base point comprise:
calibrating a coordinate system;
calibrating the initial position coordinates of a preset base point in the coordinate system and acquiring the initial position coordinates of the part on the machine platform in the coordinate system;
and acquiring the real-time position coordinates of the preset base point according to the coordinate system.
4. The method of claim 3, wherein: calibrating initial position coordinates of a preset base point and acquiring initial position coordinates of a component on the whole machine before a die bonder carries out chip bonding, and acquiring real-time position coordinates of the preset base point in the process of carrying out chip bonding by the die bonder.
5. The method of claim 3, wherein: the specific steps for calculating the offset are as follows:
and obtaining the offset by a coordinate calculation method according to the initial position coordinate and the real-time position coordinate of the preset base point in the coordinate system.
6. The method of claim 5, wherein: if the real-time position coordinates are the same as the initial position coordinates after comparison, the offset does not need to be calculated, and the position information of the whole machine station does not need to be corrected later.
7. The method of claim 1, wherein: after the step of calculating the real-time position information of the component on the machine station, the method further comprises the following steps:
and the die bonder operates according to the calculated real-time position information of the part on the machine table to carry out chip mounting.
8. The method of claim 1, wherein: after calculating the real-time position information of the part on the machine station, the method further comprises the following steps:
and marking the acquired real-time position information of the preset base point and the real-time position information of the part on the machine station, which is calculated according to the offset, as new initial position information.
9. The method of claim 1, wherein: the step of acquiring the real-time position information of the preset base point is to continuously acquire the real-time position information of the preset base point or to acquire the real-time position information of the preset base point again at preset time intervals.
10. A real-time deviation correcting system based on solid crystal machine which characterized in that: comprises the following steps:
a camera module: acquiring real-time position information of a preset base point;
a comparison module: comparing whether the real-time position information of the preset base point is the same as the initial position information or not;
a processing module: and calculating the offset, and calculating to obtain the real-time position information of the part on the machine according to the offset and the initial position information of the part on the machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111605917.0A CN115424969A (en) | 2021-12-25 | 2021-12-25 | Real-time deviation rectifying method and system based on die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111605917.0A CN115424969A (en) | 2021-12-25 | 2021-12-25 | Real-time deviation rectifying method and system based on die bonder |
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| CN117012683A (en) * | 2023-10-07 | 2023-11-07 | 深圳黑晶光电技术有限公司 | Solar cell offset correction method |
| CN117012683B (en) * | 2023-10-07 | 2023-12-22 | 深圳黑晶光电技术有限公司 | Solar cell offset correction method |
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