CN115424957B - Megasonic cleaning machine for wafer processing - Google Patents

Megasonic cleaning machine for wafer processing Download PDF

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Publication number
CN115424957B
CN115424957B CN202211094781.6A CN202211094781A CN115424957B CN 115424957 B CN115424957 B CN 115424957B CN 202211094781 A CN202211094781 A CN 202211094781A CN 115424957 B CN115424957 B CN 115424957B
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CN
China
Prior art keywords
chuck
wafer
semicircular chuck
semicircular
fixed
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CN202211094781.6A
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Chinese (zh)
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CN115424957A (en
Inventor
贺贤汉
赖章田
陈有生
张城
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Shanghai Shenhe Investment Co ltd
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Shanghai Shenhe Investment Co ltd
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Publication of CN115424957A publication Critical patent/CN115424957A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention relates to the technical field of semiconductor cleaning, in particular to a megasonic cleaning machine for wafer processing, which comprises a containing shell, a wafer clamp and an angle adjusting component, wherein the wafer clamp comprises a fixed semicircular chuck and a movable semicircular chuck, a plurality of driving rotating wheels are arranged in the fixed semicircular chuck, a plurality of elastic rotating wheels are arranged in the movable semicircular chuck, the angle adjusting component comprises two horizontal clamping arms, each horizontal clamping arm is provided with a sliding block, each sliding block is provided with a megasonic cleaning head, the megasonic cleaning heads are guided to move by adopting two mutually hinged horizontal clamping arms with controllable included angles, a moving block is driven by a motor II to drive two connecting rods to drive the two horizontal clamping arms to be gradually unfolded, so that the megasonic cleaning heads move towards the center of a wafer, the farther the distance between the megasonic cleaning heads and the side surfaces of the wafer is, and the center of the wafer is ensured not to be damaged due to the concentrated energy emitted by the megasonic cleaning heads.

Description

Megasonic cleaning machine for wafer processing
Technical Field
The invention relates to the technical field of semiconductor cleaning, in particular to a megasonic cleaning machine for wafer processing.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polysilicon is dissolved and then is doped into a silicon crystal wafer, then the silicon crystal wafer is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal rod is ground, polished and sliced to form the silicon wafer, namely the wafer is cleaned, the wafer is cleaned in the process of continuously being processed, shaped and polished, and the wafer is cleaned as an important process step in the wafer manufacturing process due to the process of cleaning pollutants generated by contact with various organic matters, particles and metals, and the prior China patent with the publication number of CN109346427B discloses a cleaning device and semiconductor wafer cleaning equipment, and the patent also has the following defects:
the support arm is fixed structure, can't controllable adjust the distance between megasonic cleaning head and the wafer side, and the megasonic cleaning head can only carry out horizontal displacement along the specific angle of support arm, so can't confirm when processing the support arm whether the angle that the support arm had can satisfy when the megasonic cleaning head moves to the support arm outer end, the central part of wafer side can not concentrate and receive megasonic cleaning head's energy and damage to need the support arm of purpose-made accurate angle, after the energy that the experiment megasonic cleaning head given out acts on the wafer side repeatedly, whether the central part of wafer side can be damaged, finally can waste a large amount of time and cost.
Therefore, it is necessary to provide a megasonic cleaner for wafer processing to solve the above-mentioned problems.
Disclosure of Invention
Accordingly, it is necessary to provide a megasonic cleaner for wafer processing in order to solve the problems of the prior art.
In order to solve the problems in the prior art, the invention adopts the following technical scheme: a megasonic cleaner for wafer processing comprising:
the accommodating shell is horizontally arranged, and the top of the accommodating shell is of an opening structure;
the wafer clamp comprises a fixed semicircular chuck and a movable semicircular chuck, wherein the fixed semicircular chuck and the movable semicircular chuck can rotate to be combined with a wafer, the fixed semicircular chuck is fixedly arranged in a containing shell, the movable semicircular chuck is positioned right above the fixed semicircular chuck, one end of the movable semicircular chuck is hinged with one end of the fixed semicircular chuck, the other end of the movable semicircular chuck is fixed with the other end of the fixed semicircular chuck through a locking buckle, a plurality of driving rotating wheels which are uniformly distributed along the circumferential direction of the fixed semicircular chuck are rotationally arranged in the fixed semicircular chuck, and a plurality of elastic rotating wheels which are uniformly distributed along the circumferential direction of the movable semicircular chuck are rotationally arranged in the movable semicircular chuck;
the angle adjusting assembly comprises two horizontal clamping arms which are respectively distributed on two sides of the wafer clamp in a clamping mode, one ends of the two horizontal clamping arms, far away from the wafer clamp, are hinged, a sliding block capable of horizontally displacing along the length direction of the sliding block is arranged on each horizontal clamping arm, megasonic cleaning heads opposite to one side of the wafer clamp are arranged on each sliding block, and the other ends of the two horizontal clamping arms can move in opposite directions, so that the corresponding megasonic cleaning heads are gradually close to one side of the wafer clamp.
Further, semicircular accommodating grooves are formed in the inner side of the fixed semicircular chuck along the circumferential direction of the fixed semicircular chuck, the number of the driving rotating wheels is three, two driving rotating wheels are in symmetrical states, the other driving rotating wheel is located below the driving rotating wheels in symmetrical states, each driving rotating wheel is arranged in the semicircular accommodating groove, three driving rotating shafts which horizontally penetrate through the fixed semicircular chuck and fix the fixed semicircular chuck in the accommodating shell are arranged on the inner wall of the accommodating shell in a rotating mode, a first wear-resisting sleeve is arranged between each driving rotating shaft and the fixed semicircular chuck, two annular bosses which are respectively distributed on two sides of the fixed semicircular chuck and used for preventing the fixed semicircular chuck from moving left and right are formed in each driving rotating shaft, each driving rotating wheel is coaxially and fixedly arranged on the corresponding driving rotating shaft, one end of each driving rotating shaft horizontally penetrates out of the accommodating shell, and a first driving mechanism which is used for synchronously driving the three driving rotating shafts to rotate in the same direction is arranged on the outer wall of the accommodating shell.
Further, the first driving mechanism includes:
the driving gear is arranged on the outer wall of the accommodating shell and is coaxially connected with the penetrating end of the driving rotating shaft positioned at the lowest part;
the first motor is horizontally and fixedly arranged on the outer wall of the accommodating shell, and an output shaft of the first motor is coaxially connected with the driving gear;
the two transmission gears are symmetrically arranged above the side of the driving gear, each transmission gear is connected with the corresponding outer wall of the accommodating shell in a shaft way, and each transmission gear is meshed with the driving gear;
the two driven gears are symmetrically arranged above the sides of the two transmission gears respectively, each driven gear is coaxially connected with the penetrating end of the corresponding driving rotating shaft, and each driven gear is meshed with the corresponding transmission gear.
Further, the movable semicircular chuck includes:
the two independent semicircular chucks are in a symmetrical state and are distributed at intervals along the axial direction of the fixed semicircular chuck, one end of the same side of each independent semicircular chuck is hinged with one end of the fixed semicircular chuck, the number of locking buckles is two pairs, the two pairs of locking buckles are respectively arranged on two sides of the free ends of the two independent semicircular chucks in a symmetrical state, and each pair of locking buckles is used for fixing the free ends of the corresponding independent semicircular chucks on the end parts of the other ends of the fixed semicircular chucks;
the two semicircular accommodating shells in a symmetrical state are respectively and fixedly arranged on opposite sides of the two independent semicircular chucks, the strip-shaped through grooves 19 which are the same in number and correspond to each other one by one are uniformly formed in each semicircular accommodating shell 18, and the length direction of each strip-shaped through groove is consistent with the radial direction of the corresponding semicircular accommodating shell;
wherein, two symmetrical bar-shaped through grooves in each semicircle holding shell are transversely inserted with a wear-resistant sleeve No. two, two springs which are in a symmetrical state and elastically support the wear-resistant sleeve No. two in the corresponding bar-shaped through grooves are fixedly arranged on each wear-resistant sleeve No. two, the length direction of each spring is consistent with the length direction of the corresponding bar-shaped through groove, a plurality of horizontal rotating shafts which are in one-to-one correspondence with the bar-shaped through grooves are arranged between the two semicircle holding shells, two ends of each horizontal rotating shaft are respectively inserted into the corresponding two wear-resistant sleeves No. two, the quantity of a plurality of elastic rotating wheels is consistent with the quantity of the horizontal rotating shafts, each elastic rotating wheel is coaxially and fixedly arranged at the middle end of the corresponding horizontal rotating shaft, and two limiting rings which are respectively abutted against the two semicircle holding shells are coaxially formed on each horizontal rotating shaft.
Further, one end of each horizontal clamping arm close to the center of the wafer clamp is the head, the other end is the tail, the outer wall on one side of the accommodating shell is fixedly provided with a hollow fixing seat which is positioned between the two horizontal clamping arms and is close to the tail of the two horizontal clamping arms, one side of the hollow fixing seat is fixedly provided with a transverse fixing strip, the length direction of the fixing strip is consistent with the axial direction of the fixed semicircular chuck, the position of each horizontal clamping arm close to the tail of the corresponding fixing strip is hinged with one end of the corresponding fixing strip, a threaded rotating shaft which is horizontal and is consistent with the radial direction of the fixed semicircular chuck in length direction is rotationally arranged in the hollow fixing seat, one end of the threaded rotating shaft horizontally extends towards the tail of one horizontal clamping arm and penetrates out of the hollow fixing seat, the extending end of the threaded rotating shaft is provided with a moving block which is in threaded fit with the threaded rotating shaft, each end of the moving block is hinged with a connecting rod, the other end of each connecting rod is hinged with the tail of the corresponding horizontal clamping arm, and a second driving mechanism for driving the threaded rotating shaft is arranged below the hollow fixing seat.
Further, the second driving mechanism includes:
the second motor is fixedly arranged on the outer wall of the accommodating shell in a vertical state and is positioned right below the hollow fixing seat, and an output shaft of the second motor vertically penetrates into the hollow fixing seat upwards;
the driving umbrella teeth are coaxially fixed on the output shaft of the second motor;
driven bevel gear is located hollow fixing base and is fixed in the screw thread pivot coaxially.
Further, all rotate on the lateral wall in every horizontal arm lock outside and be equipped with one and be level and length direction and the long axis threaded rod that the length direction of corresponding horizontal arm lock is unanimous, a bar spout corresponding with long axis threaded rod has all been seted up on every horizontal arm lock, every slider all is located on the long axis threaded rod, and every slider all cooperates with long axis threaded rod screw thread, one side that every slider orientation wafer anchor clamps all forms has a stopper that is located corresponding bar spout, every megasonic cleaning head all is fixed to be located stopper towards one side of wafer anchor clamps, the afterbody of two horizontal arm locks is equipped with one and holds the double-end motor that the shell links firmly, two output shafts of double-end motor are level respectively towards two long axes threaded rods, every output shaft of double-end motor all links to each other with the one end transmission of corresponding long axis threaded rod through a universal joint.
Further, a circle of first annular clamping grooves are formed in the peripheral wall of each driving rotating wheel, and a circle of second annular clamping grooves are formed in the peripheral wall of each elastic rotating wheel.
Compared with the prior art, the invention has the following beneficial effects: the device adopts two mutually hinged horizontal clamping arms with controllable included angles to guide the megasonic cleaning head to displace, when the megasonic cleaning head gradually displaces from the outer edge of the wafer to be level with the center of the wafer, the two connecting rods are driven by the second motor to drive the moving block to drive the two horizontal clamping arms to gradually spread, so that the megasonic cleaning head moves towards the center of the wafer, the distance between the megasonic cleaning head and the side surface of the wafer is further, the center of the wafer is not concentrated and damaged by the energy emitted by the megasonic cleaning head, and meanwhile, the included angles between the two horizontal clamping arms are controllable, so that repeated experiments are not required to be carried out by a special angle-accurate supporting arm before the device is put into use.
Drawings
FIG. 1 is a schematic perspective view of an embodiment;
FIG. 2 is an enlarged schematic view of a portion of A1 shown in FIG. 1;
FIG. 3 is an enlarged schematic view of a portion of A2 indicated in FIG. 1;
FIG. 4 is an enlarged schematic view of a portion of A3 indicated in FIG. 1;
FIG. 5 is a top view of an embodiment;
FIG. 6 is an enlarged partial schematic view of A4 of FIG. 5;
FIG. 7 is a cross-sectional view taken along line A-A of FIG. 5;
FIG. 8 is an enlarged partial schematic view of A5 indicated in FIG. 7;
FIG. 9 is a cross-sectional view taken along line B-B of FIG. 5;
FIG. 10 is a cross-sectional view taken along line C-C of FIG. 5;
fig. 11 is a schematic perspective view of a second drive mechanism;
FIG. 12 is an exploded view of a wafer chuck of an embodiment;
FIG. 13 is a left side view of the stationary semi-circular chuck of the embodiment;
FIG. 14 is a cross-sectional view taken along line D-D of FIG. 13;
FIG. 15 is an exploded perspective view of the movable semi-circular chuck of the embodiment;
fig. 16 is a partially enlarged schematic view of A6 indicated in fig. 15.
The reference numerals in the figures are: 1. a housing case; 2. fixing a semicircular chuck; 3. locking the buckle; 4. driving a rotating wheel; 5. an elastic rotating wheel; 6. a horizontal clamping arm; 7. a slide block; 8. megasonic cleaning of the head; 9. a semicircular accommodating groove; 10. driving the rotating shaft; 11. a wear-resistant sleeve I; 12. an annular boss; 13. a drive gear; 14. a motor I; 15. a transmission gear; 16. a driven gear; 17. an independent semicircular chuck; 18. a semicircular accommodating case; 19. a strip-shaped through groove; 20. a second wear-resistant sleeve; 21. a spring; 22. a horizontal rotating shaft; 23. a limit circular ring; 24. a hollow fixing seat; 25. a fixing strip; 26. a threaded spindle; 27. a moving block; 28. a connecting rod; 29. a motor II; 30. a driving bevel gear; 31. driven umbrella teeth; 32. a long-axis threaded rod; 33. a strip-shaped chute; 34. a limiting block; 35. a double-ended motor; 36. a universal joint; 37. a first annular clamping groove; 38. and a second annular clamping groove.
Description of the embodiments
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
Referring to fig. 1 to 16, a megasonic cleaner for wafer processing includes:
the accommodating shell 1 is horizontally arranged, and the top of the accommodating shell is of an opening structure;
the wafer clamp comprises a fixed semicircular chuck 2 and a movable semicircular chuck, wherein the fixed semicircular chuck 2 and the movable semicircular chuck can rotate to be combined with a wafer, the fixed semicircular chuck 2 is fixedly arranged in a containing shell 1, the movable semicircular chuck is positioned right above the fixed semicircular chuck 2, one end of the movable semicircular chuck is hinged with one end of the fixed semicircular chuck 2, the other end of the movable semicircular chuck is fixed with the other end of the fixed semicircular chuck 2 through a locking buckle 3, a plurality of driving rotating wheels 4 which are uniformly distributed along the circumferential direction of the fixed semicircular chuck 2 are rotationally arranged in the fixed semicircular chuck 2, and a plurality of elastic rotating wheels 5 which are uniformly distributed along the circumferential direction of the movable semicircular chuck are rotationally arranged in the movable semicircular chuck;
the angle adjusting component comprises two horizontal clamping arms 6 which are respectively distributed on two sides of the wafer clamp in a clamping mode, one ends of the two horizontal clamping arms 6, far away from the wafer clamp, are hinged, each horizontal clamping arm 6 is provided with a sliding block 7 which can horizontally displace along the length direction of the corresponding horizontal clamping arm, each sliding block 7 is provided with a megasonic cleaning head 8 which is opposite to one side of the wafer clamp, and the other ends of the two horizontal clamping arms 6 can move in opposite directions, so that the corresponding megasonic cleaning heads 8 are gradually close to one side of the wafer clamp.
Referring to fig. 5, fig. 7, fig. 12 and fig. 14, semicircular accommodating grooves 9 are formed in the inner side of the fixed semicircular chuck 2 along the circumferential direction of the fixed semicircular chuck 2, the number of driving rotating wheels 4 is three, two driving rotating wheels 4 are in symmetrical states, the other driving rotating wheel 4 is located below the driving rotating wheels 4 in symmetrical states, each driving rotating wheel 4 is arranged in the semicircular accommodating groove 9, three driving rotating shafts 10 which horizontally penetrate through the fixed semicircular chuck 2 and fix the fixed semicircular chuck 2 in the accommodating shell 1 are rotatably arranged on the inner wall of the accommodating shell 1, a wear-resisting sleeve 11 is arranged between each driving rotating shaft 10 and the fixed semicircular chuck 2, two annular bosses 12 which are respectively distributed on two sides of the fixed semicircular chuck 2 and are used for preventing the fixed semicircular chuck 2 from moving left and right are formed on each driving rotating shaft 10, each driving rotating wheel 4 is fixedly arranged on the corresponding driving rotating shaft 10 in a coaxial mode, one end of each driving rotating shaft 10 horizontally penetrates out of the accommodating shell 1, and a driving mechanism for synchronously driving the three driving rotating shafts 10 in the same direction is arranged on the outer wall of the accommodating shell 1.
When a wafer is fixed, the wafer is placed in the fixed semicircular chuck 2, the wafer is supported by the three driving rotating wheels 4 at the moment, then the movable semicircular chuck is rotated to be clamped and fixed with the fixed semicircular chuck 2, the lower end of the wafer is supported by the three driving rotating wheels 4 at the moment, the upper end of the wafer is limited by the plurality of elastic rotating wheels 5, after the first driving mechanism is started, the three driving rotating wheels 4 rotate in the same direction, the wafer rotates in one direction, the megasonic cleaning head 8 is convenient for cleaning all positions on the side face of the wafer, and as the three driving rotating shafts 10 play a role of supporting the fixed semicircular chuck 2 and are provided for three driving rotation, the corresponding driving rotating shafts 10 are prevented from directly and rigidly contacting the fixed semicircular chuck 2 by the first abrasion-resistant sleeve 11, and the annular boss 12 is used for preventing the fixed semicircular chuck 2 from deflecting left and right on the driving rotating shafts 10, so that the fixed semicircular chuck 2 is always in a fixed state when each driving rotating shaft 10 rotates.
Referring to fig. 5 and 10, the first driving mechanism includes:
the driving gear 13 is arranged on the outer wall of the accommodating shell 1 and is coaxially connected with the penetrating end of the driving rotating shaft 10 positioned at the lowest part;
the first motor 14 is horizontally and fixedly arranged on the outer wall of the accommodating shell 1, and an output shaft of the first motor 14 is coaxially connected with the driving gear 13;
the two transmission gears 15 are symmetrically arranged above the side of the driving gear 13, each transmission gear 15 is connected with the corresponding outer wall of the containing shell 1 in a shaft way, and each transmission gear 15 is meshed with the driving gear 13;
the two driven gears 16 are symmetrically arranged above the sides of the two transmission gears 15 respectively, each driven gear 16 is coaxially connected with the penetrating end of the corresponding driving rotating shaft 10, and each driven gear 16 is meshed with the corresponding transmission gear 15.
When the motor 14 is started, the motor 14 defaults to drive the driving gear 13 to rotate clockwise, then the two driving gears 15 are driven by the driving gear 13 to synchronously rotate anticlockwise, so that the two driven gears 16 respectively meshed with the two driving gears 15 can synchronously rotate clockwise with steps, the three driving rotating shafts 10 synchronously and synchronously drive the three driving rotating wheels 4 to rotate in the same direction, and after the driving mechanism is installed, a protective shell for coating the driving gear 13, the two driving gears 15 and the two driven gears 16 can be additionally arranged on the outer wall of the accommodating shell 1.
Referring to fig. 3, 7, 8, 12, 15 and 16, the movable semi-circular chuck includes:
the two independent semicircular chucks 17 are in a symmetrical state and are distributed at intervals along the axial direction of the fixed semicircular chuck 2, one end of the same side of the two independent semicircular chucks 17 is hinged with one end of the fixed semicircular chuck 2, the number of the locking buckles 3 is two, the two pairs of locking buckles 3 are respectively arranged on two sides of the free ends of the two independent semicircular chucks 17 in a symmetrical state, and each pair of locking buckles 3 is used for fixing the free ends of the corresponding independent semicircular chucks 17 on the end part of the other end of the fixed semicircular chuck 2;
the two semicircular accommodating shells 18 in a symmetrical state are respectively and fixedly arranged on opposite sides of the two independent semicircular chucks 17, the strip-shaped through grooves 19 which are the same in number and correspond to each other one by one are uniformly formed in each semicircular accommodating shell 18, and the length direction of each strip-shaped through groove 19 is consistent with the radial direction of the corresponding semicircular accommodating shell 18;
wherein, two symmetrical strip-shaped through grooves 19 in each semicircle containing shell 18 are transversely inserted with a second wear-resistant sleeve 20, two springs 21 which are symmetrical and elastically support the second wear-resistant sleeve 20 in the corresponding strip-shaped through grooves 19 are fixedly arranged on each second wear-resistant sleeve 20, the length direction of each spring 21 is consistent with the length direction of the corresponding strip-shaped through groove 19, a plurality of horizontal rotating shafts 22 which are in one-to-one correspondence with the strip-shaped through grooves 19 are arranged between the two semicircle containing shells 18, two ends of each horizontal rotating shaft 22 are respectively inserted into the corresponding two second wear-resistant sleeves 20, the number of a plurality of elastic rotating wheels 5 is consistent with the number of the horizontal rotating shafts 22, each elastic rotating wheel 5 is coaxially and fixedly arranged at the middle end of the corresponding horizontal rotating shaft 22, and two limiting rings 23 which are respectively contradicted with the two semicircle containing shells 18 are coaxially formed on each horizontal rotating shaft 22.
Through two springs 21 that are symmetrical state for every horizontal pivot 22 all can carry out elastic displacement along the radial of semicircle containment shell 18 in corresponding two bar through groove 19, thereby every elastic runner 5 all can carry out elastic displacement along the radial of two semicircle containment shells 18, and then after two independent semicircle chucks 17 block on fixed semicircle chuck 2, every elastic runner 5 supports the wafer tightly through elasticity, and when three drive runner 4 drive wafer rotated, the wafer can give every elastic runner 5 a rotation force and radial conflict force in the rotation, the rotation force drives every elastic runner 5 and rotates through corresponding horizontal pivot 22 this moment, radial conflict force then weakens through the elasticity of corresponding spring 21, spacing ring 23 on every horizontal pivot 22 is used for preventing that horizontal pivot 22 from taking place left and right sides skew between two semicircle containment shells 18.
Referring to fig. 1 and 9, one end of each horizontal clamping arm 6 near the center of the wafer chuck is a head, the other end is a tail, a hollow fixing seat 24 which is positioned between the two horizontal clamping arms 6 and near the tails of the two horizontal clamping arms 6 is fixedly arranged on the outer wall of one side of the accommodating shell 1, a transverse fixing strip 25 is fixedly arranged on one side of the hollow fixing seat 24, the length direction of the fixing strip 25 is consistent with the axial direction of the fixed semicircular chuck 2, the part of each horizontal clamping arm 6 near the tail is hinged with one end of the corresponding fixing strip 25, a threaded rotating shaft 26 which is horizontal and the length direction of which is consistent with the radial direction of the fixed semicircular chuck 2 is arranged in the hollow fixing seat 24 in a rotating manner, one end of the threaded rotating shaft 26 horizontally extends towards the tail of one horizontal clamping arm 6 and penetrates out of the hollow fixing seat 24, a moving block 27 which is in threaded fit with the threaded rotating shaft 26 is arranged on the extending end of the threaded rotating shaft 26, each end of the moving block 27 is hinged with a connecting rod 28, the other end of each connecting rod 28 is hinged with the tail of the corresponding horizontal clamping arm 6, and a second-number driving mechanism for driving the threaded rotating shaft 26 is arranged below the hollow fixing seat 24.
When the megasonic cleaning head 8 horizontally slides on the horizontal clamping arm 6 through the sliding block 7, energy emitted by the megasonic cleaning head 8 acts on the wafer to clean the side surface of the wafer, and as the energy emitted by the megasonic cleaning head 8 is unchanged, when the megasonic cleaning head 8 gradually moves from the outer edge of the wafer to the center of the wafer, the outer edge of the wafer has enough area to spread the energy emitted by the megasonic cleaning head 8 after rotating, but the receiving area at the center of the wafer is small, all the energy emitted by the megasonic cleaning head 8 can be concentrated, so that the center of the wafer is damaged by the energy, and a pit surface appears, so if the distance between the megasonic cleaning head 8 and the side surface of the wafer needs to be controllably adjusted, the distance between the megasonic cleaning head 8 and the side surface of the wafer is further when the megasonic cleaning head 8 is ensured to be closer to the center of the wafer;
when the second driving mechanism is started, the threaded rotating shaft 26 rotates, the moving block 27 moves horizontally on the threaded rotating shaft 26, when the moving block 27 moves horizontally towards the wafer clamp, the moving block 27 pulls the tail parts of the two horizontal clamping arms 6 to approach each other through the connecting rods 28 at the two ends, so that the heads of the two horizontal clamping arms 6 are reversely far away, the corresponding megasonic cleaning heads 8 are driven to gradually separate from the wafer clamp by the sliding blocks 7 arranged on the horizontal clamping arms 6, otherwise, when the threaded rotating shaft 26 reversely rotates to enable the moving block 27 to separate from the wafer clamp for horizontal movement, the moving block 27 pulls the tail parts of the two horizontal clamping arms 6 to reversely separate from each other through the connecting rods 28 at the two ends, and then the corresponding megasonic cleaning heads 8 are driven to gradually approach the wafer clamp by the sliding blocks 7 finally arranged on the horizontal clamping arms 6, so that after the wafer clamp fixes the wafer, the distance between the megasonic cleaning heads 8 and the wafer side faces can be controlled and adjusted by driving the threaded rotating shaft 26.
Referring to fig. 9, the No. two driving mechanism includes:
the second motor 29 is fixedly arranged on the outer wall of the accommodating shell 1 in a vertical state and is positioned right below the hollow fixing seat 24, and an output shaft of the second motor 29 vertically penetrates into the hollow fixing seat 24 upwards;
the driving umbrella teeth 30 are coaxially fixed on the output shaft of the second motor 29;
the driven bevel gear 31 is positioned in the hollow fixed seat 24 and is coaxially fixed on the threaded rotating shaft 26.
After the second motor 29 is started, the driven bevel gear 31 is driven to rotate through the driving bevel gear 30, so that the threaded rotating shaft 26 coaxially and fixedly connected with the driven bevel gear 31 can rotate, the moving block 27 can horizontally displace on the extending end of the threaded rotating shaft 26, and the displacement direction of the moving block 27 can be realized through the forward and reverse rotation of the second motor 29.
Referring to fig. 1 and 4, a long shaft threaded rod 32 which is horizontal and the length direction is consistent with the length direction of the corresponding horizontal clamping arm 6 is rotatably arranged on the side wall on the outer side of each horizontal clamping arm 6, a bar-shaped sliding groove 33 corresponding to the long shaft threaded rod 32 is formed in each horizontal clamping arm 6, each sliding block 7 is arranged on the long shaft threaded rod 32, each sliding block 7 is in threaded fit with the long shaft threaded rod 32, a limiting block 34 positioned in the corresponding bar-shaped sliding groove 33 is formed on one side, facing the wafer clamp, of each sliding block 7, each megasonic cleaning head 8 is fixedly arranged on one side, facing the wafer clamp, of the limiting block 34, a double-head motor 35 fixedly connected with the accommodating shell 1 is arranged at the tail of each horizontal clamping arm 6, two output shafts of the double-head motor 35 are horizontally connected with one end of the corresponding long shaft threaded rod 32 through a universal joint 36 respectively.
When the double-headed motor 35 is started, the two output shafts on the double-headed motor 35 rotate in the same direction, so that the two long-axis threaded rods 32 connected with the two output shafts of the double-headed motor 35 through the universal joint 36 rotate in the same direction or in opposite directions with steps, then the two sliders 7 respectively arranged on the two long-axis threaded rods 32 synchronously displace in the same direction, and the displacement is likely to be gradually close to the wafer clamp or gradually far away from the wafer clamp, then the two megasonic cleaning heads 8 connected with the sliders 7 through the limiting blocks 34 synchronously displace in the same direction, wherein the limiting blocks 34 are used for being matched with the strip-shaped sliding grooves 33, so that the corresponding sliders 7 can displace along the axial direction of the long-axis threaded rods 32.
Referring to fig. 6, a circle of first annular clamping grooves 37 are formed in the peripheral wall of each driving rotating wheel 4, and a circle of second annular clamping grooves 38 are formed in the peripheral wall of each elastic rotating wheel 5.
Because the wafer is thinner, the outer edge of the wafer is clamped on the corresponding driving rotating wheel 4 and the elastic rotating wheel 5 through the first annular clamping groove 37 and the second annular clamping groove 38, so that the wafer cannot move left and right when the driving rotating wheel 4 drives the wafer to rotate.
Working principle:
firstly, a wafer is vertically placed in a fixed semicircular chuck 2, the outer edge of the wafer is clamped in a first annular clamping groove 37 on a driving rotary wheel 4, then two independent semicircular chucks 17 are rotated, the two independent semicircular chucks 17 are clamped and fixed with the fixed semicircular chuck 2, a second annular clamping groove 38 on an elastic rotary wheel 5 distributed between the two independent semicircular chucks 17 is clamped at the outer edge of the wafer, each elastic rotary wheel 5 supports the wafer downwards through the elasticity of two springs 21, then a first motor 14 is started, the three driving rotary wheels 4 synchronously and equidirectionally drive the wafer to rotate, a double-head motor 35, a second motor 29 and two megasonic cleaning heads 8 are started, the double-head motor 29 and the double-head motor 35 all need to adopt reciprocating motors, in the process, the double-head motor 35 drives a long shaft 32 to rotate, and the slide block 7 drives the megasonic cleaning head 8 to horizontally displace, the megasonic cleaning head 8 gradually moves from the outer edge of the wafer to be level with the center of the wafer, and because the wafer is in rotation at this time, the whole side surface of the wafer is cleaned by the megasonic cleaning head 8, and in the process of moving the megasonic cleaning head 8, the second motor 29 drives the moving block 27 to displace, so that the moving block 27 pulls the two connecting rods 28 to pull the two horizontal clamping arms 6 to be closed or opened, when the megasonic cleaning head 8 gradually moves from the outer edge of the wafer to be level with the center of the wafer, the megasonic cleaning head 8 gradually changes from a state close to the wafer to a state far away from the wafer, when the megasonic cleaning head 8 moves to be level with the center of the wafer, the distance between the megasonic cleaning head 8 and the side surface of the wafer is furthest, thereby preventing the center of the wafer from being damaged due to the whole energy of the megasonic cleaning head 8 being intensively received, eventually leading to dishing in the center of the wafer.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (6)

1. A megasonic cleaning machine for wafer processing, comprising:
the accommodating shell (1) is horizontally arranged, and the top of the accommodating shell is of an opening structure;
the wafer clamp comprises a fixed semicircular chuck (2) and a movable semicircular chuck, wherein the fixed semicircular chuck (2) and the movable semicircular chuck can rotate to be closed, the fixed semicircular chuck (2) is fixedly arranged in a containing shell (1), the movable semicircular chuck is positioned right above the fixed semicircular chuck (2), one end of the movable semicircular chuck is hinged with one end of the fixed semicircular chuck (2), the other end of the movable semicircular chuck is fixed with the other end of the fixed semicircular chuck (2) through a locking buckle (3), a plurality of driving rotating wheels (4) which are uniformly distributed along the circumferential direction of the fixed semicircular chuck (2) are arranged in the fixed semicircular chuck (2), and a plurality of elastic rotating wheels (5) which are uniformly distributed along the circumferential direction of the movable semicircular chuck are arranged in the movable semicircular chuck;
the angle adjusting assembly comprises two horizontal clamping arms (6) which are respectively distributed on two sides of the wafer clamp in a clamping shape, one ends of the two horizontal clamping arms (6) far away from the wafer clamp are hinged, each horizontal clamping arm (6) is provided with a sliding block (7) which can horizontally displace along the length direction of the corresponding horizontal clamping arm, each sliding block (7) is provided with a megasonic cleaning head (8) which is opposite to one side of the wafer clamp, and the other ends of the two horizontal clamping arms (6) can move in opposite directions, so that the corresponding megasonic cleaning heads (8) are gradually close to one side of the wafer clamp;
one end of each horizontal clamping arm (6) close to the center of the wafer clamp is a head, the other end of each horizontal clamping arm is a tail, a threaded rotating shaft (26) which is horizontal and has the length direction which is radially consistent with that of the fixed semicircular chuck (2) is fixedly arranged on the outer wall of one side of the containing shell (1), a hollow fixing seat (24) which is positioned between the two horizontal clamping arms (6) and is close to the tail of the two horizontal clamping arms (6) is fixedly arranged on one side of the hollow fixing seat (24), a transverse fixing strip (25) is fixedly arranged on one side of the hollow fixing seat (24), the length direction of the fixing strip (25) is consistent with the axial direction of the fixed semicircular chuck (2), the part of each horizontal clamping arm (6) close to the tail is hinged with one end of the corresponding fixing strip (25), a threaded rotating shaft (26) which is horizontal and has the length direction which is radially consistent with that of the fixed semicircular chuck (2) is arranged in the rotating mode, one end of the threaded rotating shaft (26) extends horizontally towards the tail of one horizontal clamping arm (6) and passes out of the hollow fixing seat (24), a moving block (27) which is in threaded fit with the threaded rotating shaft (26) is arranged on the extending end, each end of the moving block (27) is hinged with one end of the corresponding tail (28) of the connecting rod (26), and the other end is hinged with the corresponding end of the rotating shaft (24);
the side wall on the outer side of each horizontal clamping arm (6) is provided with a long shaft threaded rod (32) which is horizontal and the length direction of which is consistent with the length direction of the corresponding horizontal clamping arm (6) in a rotating mode, each horizontal clamping arm (6) is provided with a bar-shaped sliding groove (33) which is corresponding to the long shaft threaded rod (32), each sliding block (7) is arranged on the long shaft threaded rod (32), each sliding block (7) is in threaded fit with the long shaft threaded rod (32), one side of each sliding block (7) facing the wafer clamp is provided with a limiting block (34) which is located in the corresponding bar-shaped sliding groove (33), each megasonic cleaning head (8) is fixedly arranged on one side of the limiting block (34) facing the wafer clamp, the tail parts of the two horizontal clamping arms (6) are provided with a double-end motor (35) which is fixedly connected with the containing shell (1), two output shafts of the double-end motor (35) are respectively horizontally facing the two long shaft threaded rods (32), and each output shaft of the double-end motor (35) is connected with one end of the corresponding long shaft threaded rod (32) through a universal joint (36).
2. The megasonic cleaning machine for wafer processing according to claim 1, wherein the inner side of the fixed semicircular chuck (2) is provided with semicircular accommodating grooves (9) along the circumferential direction thereof, the number of the driving rotating wheels (4) is three, two driving rotating wheels (4) are in symmetrical states, the other driving rotating wheel (4) is located below the two driving rotating wheels (4) in symmetrical states, each driving rotating wheel (4) is arranged in the semicircular accommodating groove (9), three driving rotating shafts (10) which horizontally penetrate through the fixed semicircular chuck (2) and fix the fixed semicircular chuck (2) in the accommodating shell (1) are rotationally arranged on the inner wall of the accommodating shell (1), a first wear-resisting sleeve (11) is arranged between each driving rotating shaft (10) and the fixed semicircular chuck (2), two annular bosses (12) which are respectively distributed on two sides of the fixed semicircular chuck (2) and are used for preventing the left and right sides of the fixed semicircular chuck (2) from moving are respectively formed, each driving rotating wheel (4) is coaxially and fixedly arranged on the corresponding driving rotating shafts (10), and one end (10) of each driving rotating shaft (10) is fixedly arranged on the inner wall of the accommodating shell (1), and one end (1) of each driving rotating shaft (10) is provided with a synchronous rotating shaft (10).
3. The megasonic cleaner for wafer processing of claim 2 wherein the drive mechanism comprises:
the driving gear (13) is arranged on the outer wall of the accommodating shell (1) and is coaxially connected with the penetrating end of the driving rotating shaft (10) positioned at the lowest part;
the first motor (14) is horizontally and fixedly arranged on the outer wall of the accommodating shell (1), and an output shaft of the first motor (14) is coaxially connected with the driving gear (13);
the two transmission gears (15) are symmetrically arranged above the side of the driving gear (13), each transmission gear (15) is in shaft connection with the corresponding outer wall of the containing shell (1), and each transmission gear (15) is meshed with the driving gear (13);
the two driven gears (16) are symmetrically arranged above the sides of the two transmission gears (15), each driven gear (16) is coaxially connected with the penetrating end of the corresponding driving rotating shaft (10), and each driven gear (16) is meshed with the corresponding transmission gear (15).
4. The megasonic cleaner for wafer processing of claim 1 wherein the movable semi-circular chuck comprises:
the two independent semicircular chucks (17) are in a symmetrical state and are distributed at intervals along the axial direction of the fixed semicircular chuck (2), one end of the same side of each independent semicircular chuck (17) is hinged with one end of the fixed semicircular chuck (2), the number of the locking buckles (3) is two, the two pairs of locking buckles (3) are respectively arranged on two sides of the free ends of the two independent semicircular chucks (17) in a symmetrical state, and each pair of locking buckles (3) is used for fixing the free end of the corresponding independent semicircular chuck (17) on the end of the other end of the fixed semicircular chuck (2);
the two semicircular accommodating shells (18) are in symmetrical states and are respectively and fixedly arranged on opposite sides of the two independent semicircular chucks (17), the number of the strip-shaped through grooves (19) which are identical and correspond to each other one by one are uniformly formed in each semicircular accommodating shell (18), and the length direction of each strip-shaped through groove (19) is consistent with the radial direction of the corresponding semicircular accommodating shell (18);
wherein, all transversely insert No. two wear-resisting cover (20) in two symmetrical bar-shaped through grooves (19) in every semicircle holds shell (18), all fix on every No. two wear-resisting cover (20) and be equipped with two and be symmetrical state and with No. two wear-resisting cover (20) elastic support in the spring (21) in corresponding bar-shaped through groove (19), the length direction of every spring (21) all is unanimous with the length direction of corresponding bar-shaped through groove (19), be equipped with a plurality of horizontal pivot (22) with bar-shaped through groove (19) one-to-one between two semicircle holds shell (18), the both ends of every horizontal pivot (22) all insert respectively in two No. two wear-resisting covers (20) that correspond, the quantity and the quantity of horizontal pivot (22) of a plurality of elastic rotating wheel (5) are unanimous, the middle-end of locating corresponding horizontal pivot (22) is all coaxial fixed to every elastic rotating wheel (5), all coaxial shaping has two spacing rings (23) that are inconsistent with two semicircle holds shell (18) respectively on every horizontal pivot (22).
5. The megasonic cleaner for wafer processing of claim 1 wherein the drive mechanism No. two comprises:
the second motor (29) is fixedly arranged on the outer wall of the accommodating shell (1) in a vertical state and is positioned right below the hollow fixing seat (24), and an output shaft of the second motor (29) vertically penetrates into the hollow fixing seat (24) upwards;
the driving umbrella teeth (30) are coaxially fixed on the output shaft of the second motor (29);
driven umbrella teeth (31) are positioned in the hollow fixed seat (24) and coaxially fixed on the threaded rotating shaft (26).
6. Megasonic cleaning machine for wafer processing according to claim 1, characterized in that a circle of annular clamping grooves (37) are formed in the peripheral wall of each driving rotating wheel (4), and a circle of annular clamping grooves (38) are formed in the peripheral wall of each elastic rotating wheel (5).
CN202211094781.6A 2022-09-08 2022-09-08 Megasonic cleaning machine for wafer processing Active CN115424957B (en)

Priority Applications (1)

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CN202211094781.6A CN115424957B (en) 2022-09-08 2022-09-08 Megasonic cleaning machine for wafer processing

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Application Number Priority Date Filing Date Title
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CN115424957B true CN115424957B (en) 2023-05-09

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Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6070284A (en) * 1998-02-04 2000-06-06 Silikinetic Technology, Inc. Wafer cleaning method and system
JPH11354480A (en) * 1998-06-11 1999-12-24 Sumitomo Metal Ind Ltd Wafer washing method and wafer washing device
US6055694A (en) * 1998-11-30 2000-05-02 Tsk America, Inc. Wafer scrubbing machine
US7823241B2 (en) * 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
CN102513301A (en) * 2011-12-29 2012-06-27 清华大学 Megasonic cleaning device for wafer
CN204996772U (en) * 2015-06-29 2016-01-27 上海华力微电子有限公司 Million sound wave grooves
CN109227359A (en) * 2018-10-19 2019-01-18 清华大学 The post-processing unit of chemical-mechanical polishing system and method, wafer

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