CN115420155A

CN115420155A - Integrated electronic digital detonator module adopting SIP packaging

Info

Publication number: CN115420155A
Application number: CN202210994173.4A
Authority: CN
Inventors: 曾成凡
Original assignee: Shenzhen Yinchen Technology Co ltd
Current assignee: Shenzhen Yinchen Technology Co ltd
Priority date: 2022-08-18
Filing date: 2022-08-18
Publication date: 2022-12-02

Abstract

The invention discloses an integrated electronic digital detonator module packaged by SIP, comprising: detonator frame support, detonator frame support's one end is provided with AB leg line pad, it has bridge rectifier chip, detonator control chip, detonator ignition capacitance and bridging wire ignition control NMOS pipe to establish ties in proper order through the 3D lead wire in detonator frame support, the integrated electronic digital detonator module that adopts SIP encapsulation still include with bridging wire ignition control NMOS pipe through 3D pin attach bridge silk resistance, with bridging wire resistance passes through 3D pin attach's detonator wafer, the bridging wire resistance sets up the safety cover outward. Compared with the prior art, the bridge wire resistor can be prevented from being damaged in the transportation and storage processes or the blasting working site, the yield is improved, the use safety is improved, and the production cost is reduced.

Description

Integrated electronic digital detonator module adopting SIP packaging

Technical Field

The invention relates to the technical field of electronic digital detonators, in particular to an integrated electronic digital detonator module packaged by SIP.

Background

As shown in fig. 1 and 2, in the digital electronic detonator industry, the existing digital electronic detonator comprises a digital electronic detonator chip 1, a bridge rectifier chip 2, an AB polar wire clamp 3, a TVS diode 4, a chip working capacitor 5, a detonator ignition capacitor 6, a bridge wire ignition control NMOS tube 7 and a bridge wire resistor 8.

The working principle of the digital electronic detonator is as follows: the digital electronic detonators are connected with the exploder through the AB lines, and the multiple-generation digital electronic detonators are connected to the AB bus lines in a certain mode to form a multiple-generation detonator network. After networking is successful, the detonator firstly carries out single-shot function detection, whole network scanning, delay parameter setting and the like; and then entering a detonation flow, and carrying out operations such as charging of a detonator ignition capacitor 6, detonator detonation password authentication and the like. After the detonation process is started, the single-shot digital electronic detonator and an AB bus of the detonator are disconnected to independently work, after the delay is finished, the digital electronic detonator chip 1 controls the NMOS tube 7 through bridge wire ignition to enable a circuit from the detonator ignition capacitor 6 to the bridge wire resistor 8 to be conducted, the bridge wire resistor 8 sends out electric arc to detonate a powder head, and the powder head detonates the explosive wrapped outside the detonator shell to perform blasting.

In the prior art, the electronic detonator chip 1 is required to be packaged and pasted on a PCBA board, so that the cost is high; in the production process of the existing detonator, sensitive explosive is required to be coated on the bridge wire resistor 8 attached to the PCBA board for production, and due to the fact that the bridge wire is too thin and the outside is not protected, the bad conditions that the bridge wire is easy to break or mistakenly explode in the transportation, storage and blasting fields are generated subsequently.

Disclosure of Invention

The invention mainly aims to provide an integrated electronic digital detonator module packaged by SIP, aiming at preventing a bridge wire resistor from being damaged in the transportation and storage processes or the blasting working site, improving the yield and reducing the production cost.

In order to achieve the above object, the present invention provides an integrated electronic digital detonator module packaged by SIP, comprising: detonator frame support, detonator frame support's one end is provided with AB leg line pad, it has bridge rectifier chip, detonator control chip, detonator ignition capacitance and bridging wire ignition control NMOS pipe to establish ties in proper order through the 3D lead wire in detonator frame support, the integrated electronic digital detonator module that adopts SIP encapsulation still include with bridging wire ignition control NMOS pipe through 3D pin attach bridge silk resistance, with bridging wire resistance passes through 3D pin attach's detonator wafer, the bridging wire resistance sets up the safety cover outward.

The further technical scheme of the invention is that the low-temperature silica gel is injected outside the detonator frame bracket.

The further technical scheme of the invention is that the bridgewire resistor is a concave bridgewire resistor.

The further technical scheme of the invention is that the bridgewire resistor is an upward convex bridgewire resistor.

The integrated electronic digital detonator module packaged by the SIP has the beneficial effects that: according to the technical scheme, one end of the detonator frame support is provided with the AB leg wire bonding pad, a bridge rectifier chip, a detonator control chip, a detonator ignition capacitor and a bridge wire ignition control NMOS tube are sequentially connected in series in the detonator frame support through a 3D lead wire, the integrated electronic digital detonator module packaged by the SIP further comprises a bridge wire resistor connected with the bridge wire ignition control NMOS tube through the 3D lead wire and a detonator wafer connected with the bridge wire resistor through the 3D lead wire, and a protective cover is arranged outside the bridge wire resistor, so that the bridge wire resistor can be prevented from being damaged in the transportation and storage processes or the blasting working site, the yield is improved, the use safety is improved, and the production cost is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic view of the overall structure of a digital electronic detonator at a first angle in the prior art;

FIG. 2 is a schematic diagram of the overall structure of a digital electronic detonator at a second angle in the prior art;

FIG. 3 is a schematic diagram of the overall structure of a first angle of the preferred embodiment of the integrated electronic digital detonator module packaged by SIP according to the present invention;

FIG. 4 is a schematic diagram of the overall structure of a second angle of the preferred embodiment of the integrated electronic digital detonator module packaged by SIP according to the present invention;

FIG. 5 is a schematic diagram of a recessed bridge resistor configuration;

FIG. 6 is a schematic diagram of a structure of an upwardly convex bridge wire resistor;

FIG. 7 is a schematic diagram of the structure of the novel ignition resistor;

FIG. 8 is a schematic diagram of the circuit structure of the AB pin wire pad;

FIG. 9 is a schematic diagram of a bridge rectifier chip;

FIG. 10 is a schematic diagram of the detonation control IC.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 3 to 10, the invention provides an integrated electronic digital detonator module packaged by SIP, the preferred embodiment of the integrated electronic digital detonator module packaged by SIP of the invention comprises a detonator frame support 1, an AB leg wire bonding pad 2 is arranged at one end of the detonator frame support 1, a bridge rectifier chip 4, a detonator control chip 5, a detonator ignition capacitor 6 and a bridge wire ignition control NMOS tube 7 are sequentially connected in series in the detonator frame support 1 through a 3D lead 3, the integrated electronic digital detonator module packaged by SIP further comprises a bridge wire resistor 8 connected with the bridge wire ignition control NMOS tube 7 through the 3D lead 3, a detonator wafer 9 connected with the bridge wire resistor 8 through the 3D lead 3, and a protective cover 10 is arranged outside the bridge wire resistor 8. The AB pin wire bonding pad 2 is connected with the bridge rectifier chip 4 through a 3D lead 3.

In this embodiment, the protective cover 10 is arranged outside the bridgewire resistor 8, so that the bridgewire resistor is not easy to damage in the transportation and storage processes or on the working site, the yield is improved, and the use safety is improved.

In this embodiment, the detonator wafer 9 is directly packaged in a 3D lead wire 3 manner by the SIP technique without additional packaging, which is beneficial to reducing the production cost.

In this embodiment, the low-temperature silica gel 11 is injected outside the detonator frame support 1.

The electronic detonator wafer 9 in the embodiment is communicated with other devices through the SIP technology and the 3D lead 3, compared with the prior art, the detonator wafer 9 is not packaged, the PCB substrate is not needed, the production cost is saved, the 3D lead 3 is equivalent to the internal wiring of the PCB, the detonator frame support 1 is equivalent to the device packaging, all the devices are injection molded through the low-temperature silica gel 11 to be fixed and formed outside, and the whole framework is framed.

In this embodiment, the bridge wire resistor 8 is connected to the bridge wire ignition control NMOS tube 7 and the detonator wafer 9 through the 3D lead 3, and when the detonator wafer 9 receives a detonation signal through the 3D lead 3, the bridge wire resistor 8 with a protective cap on the outside is heated to ignite sensitive explosive to detonate peripheral explosive to perform blasting.

In this embodiment, the bridge wire resistor 8 may be a concave bridge wire resistor, an convex bridge wire resistor, or a novel ignition resistor, which is not limited in the present invention.

The working principle of the integrated electronic digital detonator module packaged by SIP according to the present invention is explained in detail with reference to fig. 8 to 10, wherein fig. 8 is a schematic circuit structure diagram of the AB pin wire bonding pad, fig. 9 is a schematic structure diagram of the bridge rectifier chip, and fig. 10 is a schematic diagram of the initiation control IC.

The working principle of the integrated electronic digital detonator module packaged by the SIP is as follows:

the detonator connects the signal of the AB pole to the J5 riveting head of the detonator through a bus and a leg wire, and the AB pole can supply power and can communicate. The AB pole signal is supplied to a digital detonator control chip U1 through a bridge pair rectifier chip U2, and when the voltage of the AB pole is 16V, the AB pole signal is in a normal communication mode, and when the voltage is 32V, the AB pole signal is in a charging detonation mode.

In a normal communication mode, the detonator performs operations such as scanning, code retention, state monitoring and the like with a digital detonator control chip U1 through an AB pole; in the detonation mode, the detonator supplies power to the digital detonator control chip U1 through the AB pole, the digital detonator control chip U1 supplies power to the ignition capacitors C1 and C2, the explosive head wrapped outside the bridge wire resistor is ignited, and then the explosive package is detonated.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the specification and drawings, or any other related technical fields, which are directly or indirectly applied to the present invention, are included in the scope of the present invention.

Claims

1. An integrated electronic digital detonator module adopting SIP packaging is characterized by comprising: detonator frame support, detonator frame support's one end is provided with AB foot line pad, it has bridge rectifier chip, detonator control chip, detonator ignition capacitance and bridging fibril ignition control NMOS pipe to establish ties in proper order through the 3D lead wire in detonator frame support, the integrated electronic digital detonator module that adopts SIP encapsulation still include with bridging fibril ignition control NMOS pipe through 3D pin connection's bridging fibril resistance, with bridging fibril resistance passes through 3D pin connection's detonator wafer, the bridging fibril resistance sets up the safety cover outward.

2. The SIP packaged integrated electronic digital detonator module according to claim 1, wherein the low temperature silica gel is injected outside the detonator frame support.

3. The SIP packaged integrated electronic digital detonator module of claim 1 wherein the bridgewire resistor is a recessed bridgewire resistor.

4. The SIP packaged integrated electronic digital detonator module according to claim 1, wherein the bridgewire resistor is an upper convex bridgewire resistor.