CN115413136A

CN115413136A - Large-size single-sided circuit board preparation method based on photoetching technology

Info

Publication number: CN115413136A
Application number: CN202110585762.2A
Authority: CN
Inventors: 楼斌; 李荣桥; 楼红卫; 匡真安; 张茗; 匡雄; 李紫阳; 戴国勇
Original assignee: Zhejiang Luoqi Taike Technology Co ltd
Current assignee: Zhejiang Luoqi Taike Technology Co ltd
Priority date: 2021-05-27
Filing date: 2021-05-27
Publication date: 2022-11-29

Abstract

The invention is suitable for the technical field of circuit board processing, and provides a method for preparing a large-size single-sided circuit board based on a photoetching process, which comprises the following steps of: the substrate is polished, washed and dried in air, surface stains are removed, and a mechanical arm is used for transferring the substrate plate to be processed to a conveying belt; line coating and photoetching: uniformly coating a layer of circuit ink on the surface of the copper-clad plate by using a coating machine, and photoetching by using a photoetching machine; line development: placing the substrate in a developing machine for developing treatment, and removing the ink which is not photoetched; by arranging the telescopic conveying device, the telescopic conveying device realizes full-automatic steering, so that the arrangement and planning of a production line and the movement of a transmission device are facilitated, and the utilization rate of equipment is improved; through being provided with double-deck transmission device, double-deck transmission device cooperation manipulator improves production efficiency, conveniently manages feeding and ejection of compact simultaneously.

Description

Large-size single-sided circuit board preparation method based on photoetching process

Technical Field

The invention belongs to the technical field of circuit board processing, and particularly relates to a large-size single-sided circuit board preparation method based on a photoetching process.

Background

A Circuit Board, also called a Printed Circuit Board or a Printed Circuit Board, abbreviated as PCB (Printed Circuit Board), is a carrier for electrical connection between electronic components, and is one of important components in the electronic industry. The single-sided circuit board has the advantage of low cost and is widely applied to many technical fields. With the continuous progress of the application technology of electronic products, the demand for high-precision and large-size single-sided circuit boards is continuously increased.

In the prior art, the automation degree of the single-sided circuit board preparation process is not high, and at present, no full-automatic single-sided circuit board production line exists, so that the production efficiency is low, the production cost is relatively high, and the precision and the size of the circuit board are both bottleneck; in the existing single-panel process, only small-size circuit boards can be usually prepared, and the main reason is that the existing circuit layer preparation adopts an exposure process, a large-size film is easy to deform, and the line width of a circuit pattern is reduced due to the refraction of light in the exposure process, so that the circuit has risks of insufficient line width, open circuit and the like, and the large-size precise circuit board cannot be prepared. Therefore, the existing process firstly needs to cut the standard substrate into small plates with corresponding sizes, which not only increases the complexity of the process, but also causes the waste of the plates to a certain extent. If a large-size circuit board can be adopted, the board space can be utilized to the maximum extent through pattern splicing, and the production cost is further reduced.

Therefore, there is a need in the art for an automated technology for manufacturing large-sized circuit boards, so as to solve the technical problems in the prior art.

Disclosure of Invention

Aiming at the problems in the prior art, the large-size single-sided circuit board production process based on the photoetching process provided by the invention adopts the photoetching process to realize circuit transfer printing, so that the limitation of the size of a film is not required, and the preparation of a high-precision large-size circuit layer can be very conveniently realized; meanwhile, in order to meet the production requirements of large-size circuit boards, a plurality of links of the existing production line are improved, and finally, the full-automatic large-size high-precision circuit board production line is realized.

The technical scheme adopted by the invention for solving the technical problems is as follows: a large-size single-sided circuit board production process based on a photoetching process comprises the following steps:

(1) Pre-treating a substrate: directly transferring a substrate plate to be processed to a conveying belt by using a mechanical arm, polishing, washing and air-drying a standard substrate, and removing stains on the surface of the substrate;

(2) Line coating and photoetching: uniformly coating a layer of circuit ink on the surface of the copper-clad plate by using a coating machine, and photoetching by using a photoetching machine;

(3) Line development: placing the substrate in a developing machine for developing treatment, and removing the ink which is not photoetched;

(4) Etching copper: carrying out chemical reaction on the copper surface without the ink protection by using strong acid or strong alkali to remove the copper surface without the ink protection, and only keeping a pattern with the ink protection;

(5) Removing the film: removing the circuit ink for protecting the copper wires on the substrate, and exposing all the copper wires;

(6) Solder resist coating and prebaking: coating solder resist ink on the whole surface of the copper wire surface on the substrate by using a coating machine, and baking;

(7) Solder mask photoetching: photoetching the substrate through a photoetching machine;

(8) Solder resist development: placing the baked substrate in a developing machine for developing treatment, removing the ink which is not photoetched, and leaving a photoetched pattern;

(9) High-temperature curing: conveying the substrate to a high-temperature curing furnace, and curing the solder resist ink completely after high-temperature curing to increase the adhesive force between the substrate and the solder resist ink;

(10) Cutting: the large-sized PCB board is cut into corresponding small boards or finished products using a laser cutter.

Preferably, the conveying device between the adjacent processes adopts a telescopic conveying device.

Preferably, the step 2 and the step 7 adopt double-layer transmission.

Preferably, a temporary storage device is arranged between the adjacent working procedures.

Preferably, in the steps 1 to 10, the substrate is subjected to a centering treatment before entering the next process.

Preferably, after step 2, step 7 and step 9 are completed, the cooling treatment is performed respectively.

Preferably, in the step 5, after the film is removed, the substrate is polished, washed and air-dried to remove stains on the surface of the substrate.

Preferably, the substrate is cleaned and then subjected to a dust-binding treatment.

Preferably, in the step 4, the substrate is turned over by 180 degrees before the substrate is corroded by copper, the corrosive liquid is sprayed from the lower part of the substrate, the corrosion effect is improved, and the substrate is turned over by 180 degrees after the copper corrosion is finished, so that the copper-clad surface is upward, and the requirement of scrubbing and removing the film is met.

Preferably, the photolithography in step 2 and step 7 is performed by using a photolithography machine.

The invention has the beneficial effects that: the technical scheme of the application provides a full-automatic production line of a large-size single-sided circuit board, so that the performance and the production efficiency of the single-sided circuit board can be further improved, and the production cost of the single-sided circuit board is further reduced; the line transfer printing is realized by adopting the photoetching process in the process, so that the limitation of the size of a film is not required, and the preparation of a high-precision large-size line layer can be very conveniently realized; meanwhile, in order to meet the production requirement of a large-size circuit board, a plurality of links of the existing production line are improved, wherein the telescopic conveying device is arranged to realize full-automatic steering, so that the arrangement and planning of the production line and the movement of the transmission device are facilitated, and the utilization rate of equipment is improved; the double-layer transmission device is arranged and matched with the manipulator, so that the production efficiency is improved, and meanwhile, the feeding and discharging are convenient to manage; a certain amount of substrates can be temporarily stored through the temporary storage device; when the next process equipment has problems, the controller can send signals to the temporary storage device, and the temporary storage device starts to store the substrate after receiving the signals, so that the circuit board can be conveniently processed; before the substrate is corroded with copper, the substrate is turned over by 180 degrees through a plate turnover machine, and corrosive liquid is sprayed from the lower part of the substrate, so that the corrosion effect is improved.

Drawings

FIG. 1 is a schematic view of a telescopic drive of the present invention;

FIG. 2 is a schematic view of the fixing frame shown in FIG. 1;

FIG. 3 is a schematic view of the moving assembly of FIG. 2;

FIG. 4 is a schematic structural diagram of a double-layer transmission device according to the present invention;

FIG. 5 is a top view of FIG. 4;

FIG. 6 is a schematic structural diagram of a temporary storage apparatus according to the present invention;

FIG. 7 is a process flow diagram of the present invention;

FIG. 8 is a schematic view of an etching apparatus.

Detailed Description

The present invention is described in further detail with reference to the following examples, but the scope of the present invention is not limited thereto.

Referring to fig. 7, a flow chart of a method for manufacturing a large-size single-sided circuit board based on a photolithography process according to the present invention is shown, which includes the following steps:

(1) Substrate pretreatment: directly transferring a substrate plate to be processed onto a conveying belt by using a mechanical arm, polishing, washing and air-drying a standard substrate, and removing stains on the surface of the substrate plate; the prior art processes typically cut standard substrates into small plates of corresponding size before processing, and the present application processes standard substrates (typically 1.2m x 1.2m) directly. Because the process is directly prepared on the basis of the standard substrate, the step of cutting the plate can be omitted, the preparation process is simplified to a certain extent, and meanwhile, the large-size circuit board is beneficial to splicing the circuit layer and can fully utilize the size of the substrate.

(2) Line coating and photoetching: uniformly coating a layer of circuit printing ink with the thickness of 0.01mm on the surface of the copper-clad plate by using a coating machine, and photoetching by using a photoetching machine; according to the method, the circuit layer is prepared by adopting the photoetching process, so that the circuit precision can be further improved, meanwhile, the circuit splicing plate can be very conveniently realized, the preparation of a film is omitted, the size of the circuit layer is not limited by the bottleneck of the film, and the preparation of a large-size circuit board can be very conveniently realized.

In a preferred embodiment, the line lithography adopts a plurality of lithography machines to carry out the lithography simultaneously, and the line lithography speed is increased so as to meet the requirements of the whole automatic production line.

(5) Removing the film: removing the circuit printing ink for protecting the copper wires on the substrate, and exposing all the copper wires;

(7) Solder mask photoetching: photoetching the substrate through a photoetching machine; in the application, the preparation of the solder mask layer also adopts a photoetching process, so that the automation degree of a production line and the precision of the solder mask layer can be further improved;

In this embodiment, a large-sized substrate is used, a plurality of small circuit boards are processed at a time, and after the processing is completed, the substrate is cut, and a plurality of circuit boards are processed at a time. This application can further make full use of base plate space through the circuit makeup, has further reduced the manufacturing cost of circuit board, has also promoted production efficiency simultaneously.

The existing single-sided circuit board technology is based on the preparation of a small-size circuit board, in order to meet the production requirement of a large-size circuit board and realize a full-automatic large-size high-precision circuit board production line, the method makes corresponding improvements on various links of the existing production line, and concretely refers to the following description.

The existing etching machine is based on a small-size circuit board, and the performance of the circuit board is reduced due to uneven etching in the preparation of the large-size circuit board. To this end, the present application provides a corresponding improvement over existing etching processes. Firstly, the invention adopts a plurality of etching machines to work in a cascade mode, the circuit board passes through the plurality of etching machines in the etching process, thereby ensuring the full etching of the large-size circuit board, and meanwhile, the plurality of etching machines provide etching solution through the same container, thereby ensuring the consistency of the concentration of the solution in different etching machines and the consistency of the feeding amount, and further greatly improving the performance of the circuit board.

As shown in fig. 8, 4 etching machines are connected together to etch a PCB, one side of each of the four etching machines is connected with a container 1201, etching solution is contained in the container, a stirring device 1202 is connected in the container, and the etching solution is stirred by the stirring device, so that the etching solution is prevented from precipitating and affecting the quality of the PCB; the container is connected with a pump 1203, the pump is connected with four connecting pipes 1204, and the four connecting pipes are respectively connected to the etching machines 1205, so that the concentration of the etching solution in each etching machine 1205 is kept consistent, and the quality of the PCB is improved.

According to the method, the photoetching process is adopted for preparing the circuit layer, and the photoetching efficiency of a single photoetching machine cannot meet the requirements of the process of a full-automatic production line, so that in the actual photoetching process, a plurality of photoetching machines are adopted to cooperate with mechanical arms to carry out photoetching in a coordinated manner, and in order to ensure that the photoetching process is carried out orderly, the production line is improved.

Further, double-layer transmission is adopted in the processes of step 2 and step 7.

As shown in fig. 4 and 5, fig. 4 is a schematic structural diagram of a double-layer transmission device, in step 2 and step 3, in order to improve the production efficiency of an enterprise, a plurality of photoetching machines work simultaneously, in order to feed and discharge materials orderly when a robot arm interacts with the plurality of photoetching machines, the robot arm takes a circuit board from a lower layer, and after the photoetching machines finish machining, the robot arm puts an upper layer to enter a next procedure, so that the feeding and the discharge materials can be conveniently managed, and the production efficiency of the enterprise is greatly improved.

In this embodiment, a first conveying device 92 is connected to the top end of the first fixing frame 91, a second conveying device 93 is connected to the top end of the first conveying device 92, one end or two of the first conveying device 92 are connected to a plurality of material placing frames 94, the number of the material placing frames 94 can be determined according to the number of the material placing frames moving downwards to a production line of a process, a steering device 95 is arranged on the first conveying device 92 corresponding to the material placing frames 4, a PCB on the first conveying device 92 can be transferred to the material placing frames 94 through the steering device 95, so that the PCB is automatically steered to the material placing frames 94, the first conveying device 92 is used for feeding, the second conveying device 93 is used for discharging, the floor area of the conveying device is reduced, and limited space is fully utilized; the material conveying frame and the material placing frame are used for realizing quick and automatic material conveying, the material conveying efficiency is greatly improved, and the production efficiency is greatly improved.

In the present embodiment, the control method of the double-layer transmission apparatus is as follows: (1) The PCB is conveyed by the first conveying device, the first sensor records the number of the PCBs on the first conveying device and sends a signal of the PCB to be processed on the first conveying device to the controller;

(2) Any one second sensor judges whether the PCB to be processed is on the corresponding object, and transmits the signal to the steering device and the photoetching machine, and when the second sensor transmits the signal of needing the PCB, the steering device shunts the PCB on the first transmission device to the object placing frame;

(3) The storage rack conveys the PCB and sends a signal to the photoetching machine, the photoetching machine judges whether the PCB is needed, and when the photoetching machine needs the PCB, the photoetching machine sends a signal to the manipulator;

(4) The manipulator receives the signal and moves the PCB on the shelf to the corresponding photoetching machine;

(5) After the photoetching machine finishes processing the PCB, the photoetching machine sends a signal to the first sensor on the second conveying device, when no PCB is transmitted on the second conveying device, the manipulator moves the PCB onto the second conveying device, and the PCB is conveyed to the next procedure through the second conveying device.

In the embodiment, when the substrate in the previous process enters the first layer of double-layer conveying, the first layer of double-layer conveying is started, the roller rotates, and the substrate enters the material taking area through corner conveying and sends a material taking signal to the mechanical arm; the photoetching machine is started to process and enter a material waiting signal, the photoetching machine sends a material waiting signal to the mechanical arm, the mechanical arm confirms that the material taking area has materials to be grabbed, the mechanical arm takes materials from the material taking area, then the substrate is placed on the processing table board of the photoetching machine, the photoetching machine starts vacuum to suck the plates, then the mechanical arm leaves to finish the material placing action, the photoetching machine is started to process, after the photoetching machine finishes processing, the material taking signal is sent to the mechanical arm, the mechanical arm takes away the processed substrate on the table board of the photoetching machine, the mechanical arm sends a signal to the double-layer transmission to confirm whether the plates can be placed in the second-layer discharging and plate placing area of the double-layer transmission, and the mechanical arm is confirmed to place the plates in the second-layer discharging and plate placing area under the condition that the second-layer discharging and plate placing area does not have the plates; and after the material is discharged by the mechanical arm, a plate discharge completion signal is transmitted to the double-layer conveying roller, and the double-layer conveying discharging roller rotates to convey the plate material to the next station.

In this embodiment, the PCB is on the first conveying device, when the PCB on the first conveying frame moves to one side of the corresponding material placing frame, when the first sensor and the second sensor detect the PCB and the signal of the controller simultaneously, the driving device on the corresponding conveying frame stops working, the steering device starts working, and then the PCB is conveyed to the material placing frame, when the third sensor on the material placing frame detects the PCB, the driving device on the corresponding material placing frame starts working, and the PCB is conveyed to the corresponding position, the manipulator transfers the PCB to the corresponding production line, and after the PCB is processed, the manipulator moves the PCB to the second conveying device 3, and then the next production process is conveyed.

Furthermore, in order to meet the requirements of a full-automatic large-size circuit board production line, a telescopic conveying device is adopted as a conveying device between adjacent working procedures.

As shown in fig. 1, 2 and 3, fig. 1 is a telescopic transmission conveying device, and adjacent processes are connected through the telescopic conveying device, so that a space can be reserved for the subsequent production line modification, and the subsequent production line modification can be conveniently removed, so that a new process can be added in the space; when equipment of the next production procedure breaks down, the transmission line can be quickly disconnected, and manual operation is convenient to carry out.

In this embodiment, the telescopic conveyor rotates with independent electric rollers, which together form a conveyor belt; meanwhile, the telescopic conveying device achieves full-automatic steering, so that arrangement and planning of a production line and movement of the transmission device are facilitated, and the utilization rate of equipment is improved.

In the embodiment, movable frames 4 are connected between fixed frames 1 at adjacent positions, a first connecting rod 3 is connected to any fixed frame 1, a second connecting rod 5 is connected to the movable frame 4, a supporting component 6 is connected between the first connecting rod 4 and the second connecting rod 5, the fixed frame 1 and the movable frame 4 can be conveniently moved through the supporting component 6, and further the transmission device can be conveniently stretched and retracted, a moving component 2 is connected to the bottom end of any fixed frame 1, the transmission device can be conveniently adjusted through the moving component 2 by controlling the transmission device through a controller, the adjustment precision of the transmission device is greatly improved, errors in manual operation are reduced, transmission components 7 are respectively connected to the top ends of the fixed frame 1 and the movable frame 4, and the PCB can be conveniently moved through the transmission components 7; the bottom of the fixed frame 4 is connected with the moving assembly 2, so that the fixed frame 1 can move and can stretch, and the conveying device can realize steering conveying, so that the arrangement and planning of a production line and the movement of a transmission device are facilitated, and the utilization rate of equipment is improved; the telescopic conveying device can be conveniently removed, so that a new process is added in space; meanwhile, when the rear-stage equipment fails, the transmission line can be quickly disconnected, and manual operation is convenient to perform.

In this embodiment, a first driving motor 21 is connected to the inner side of the lower portion of the fixing frame 1, an output end of the first driving motor 21 is connected to a rotating rod 22, a housing 23 is connected to the bottom end of the rotating rod 22, a roller 24 is rotatably connected to the housing 23, the first driving motor 21 drives the roller 24 to rotate, so that the transmission device is convenient to adjust, a second driving motor 25 is connected to the inner side wall of the housing 23, an output end of the second driving motor 25 is connected to a gear 26, a support rod on one side of the roller 24 is provided with a slot tooth 27, the slot tooth 27 is meshed with the gear 26, the roller can be driven to rotate by the second driving motor 25, and the fixing frame 1 is convenient to move; a supporting block 28 is connected to the outer side wall of the rotating rod 22, and the supporting block 28 is connected with the fixing frame 1 in a sliding manner, so that a supporting effect is provided when the rotating rod 22 rotates; be connected with angle sensor 29 on the upper portion lateral wall of dwang 22, detect dwang 22 pivoted angle through angle sensor 29, and then can accurate adjustment roller 24's turned angle.

In this embodiment, any transmission assembly 7 includes a roller 71, one end of the roller 71 is rotatably connected to the fixed frame 1 or the movable frame 4, the other end of the roller 71 is connected to a third driving motor 72, the third driving motor 72 is fixed to the fixed frame 1 or the movable frame 4, and the third driving motor 72 is connected to the controller.

Furthermore, in order to meet the requirements of a full-automatic large-size circuit board production line, a temporary storage device is arranged between adjacent working procedures.

As shown in fig. 6, fig. 6 is a schematic structural diagram of a temporary storage device, and a temporary storage device is connected between adjacent processes, through which a certain amount of substrates can be temporarily stored; when next process equipment goes wrong, can send the signal for temporary storage device through the controller, the temporary storage device begins storage base plate on receiving the signal, and then makes things convenient for the processing of circuit board.

In the embodiment, in the steps 1 to 10, the substrate is subjected to centering treatment before entering the next process, the centering device corrects the position of the substrate in the middle of the conveying device, so that the condition of the substrate is conveniently and visually checked by manpower, the sheet material is reasonably treated in time, and meanwhile, the processing of the substrate is convenient,

in this embodiment, carry out cooling treatment to basically respectively after step 2, step 6 and step 9 are accomplished, cool off the base plate through the cooling work or material rest during the cooling, can hold a plurality of base plates on the cooling work or material rest, the cooling work or material rest is located sealed space, the space is inside to export air conditioning in the space through the air conditioner, through installing radiator fan on the cooling work or material rest, the radiating efficiency of base plate is quickened, through dispelling the heat to the base plate, make things convenient for the processing of next process, accomplish the heat dissipation of base plate fast, the precision of improvement base plate processing, and then the yields of improvement base plate processing.

In this embodiment, in step 5, after the film removal, the substrate is polished, washed with water, and air-dried to remove stains on the surface of the substrate.

In the present embodiment, after the substrate is cleaned, a dust adhering machine is used to perform a dust adhering treatment on the substrate surface to prevent residual dust and the like on the surface, and a surface cleaning protection treatment is performed for coating the solder resist ink.

In the embodiment, in step 4, before the substrate is etched with copper, the substrate is turned over by 180 degrees by a plate turnover machine, the corrosive liquid is sprayed from the lower part, so that the corrosion effect is improved, and after the copper etching is finished, the substrate is turned over by 180 degrees, so that the copper-clad surface faces upwards, and the requirement of brushing and removing the film on the substrate is met.

In this embodiment, the photolithography is performed in both the step 2 and the step 7 by using a photolithography machine.

The above-mentioned embodiments are merely preferred embodiments of the present invention, which are not intended to limit the present invention in any way, and other variations and modifications are possible without departing from the scope of the present invention as defined in the appended claims.

Claims

1. A large-size single-sided circuit board preparation method based on a photoetching process is characterized in that: the method comprises the following steps:

(1) Substrate pretreatment: directly transferring a substrate plate to be processed to a conveying belt by using a mechanical arm, polishing, washing and air-drying a standard substrate, and removing stains on the surface of the substrate;

(7) Solder resist lithography: photoetching the substrate through a photoetching machine;

(10) Cutting: and cutting the large-size PCB into corresponding small plates or finished products by using a laser cutting machine.

2. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as claimed in claim 1, wherein: the conveying device between the adjacent processes adopts a telescopic conveying device.

3. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as recited in claim 1, wherein: and the procedures of the step 2 and the step 7 adopt double-layer transmission.

4. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as claimed in claim 1, wherein: a temporary storage device is arranged between the adjacent working procedures.

5. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as recited in claim 1, wherein: in the steps 1 to 10, the substrate is subjected to centering treatment before entering the next process.

6. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as claimed in claim 1, wherein: and after the step 2, the step 7 and the step 9 are finished, respectively carrying out cooling treatment on the basic materials.

7. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as recited in claim 1, wherein: and 5, after the membrane is removed, polishing, washing and air-drying the substrate to remove stains on the surface of the substrate.

8. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as claimed in claim 7, wherein: and carrying out dust sticking treatment after the substrate is cleaned.

9. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as recited in claim 1, wherein: and 4, before the substrate is corroded by copper, the substrate is turned over by 180 degrees, the corrosive liquid is sprayed from the lower part of the substrate, the corrosion effect is improved, and after the copper corrosion is finished, the substrate is turned over by 180 degrees, so that the copper-clad surface is upward, and the requirement of scrubbing and removing the film is met.

10. The method for manufacturing a large-size single-sided circuit board based on the photolithography process as recited in claim 1, wherein: and photoetching in the step 2 and the step 7 by adopting a photoetching machine.