CN115407898A - Display panel, display device and preparation method of display panel - Google Patents

Abstract

The application provides a display panel, a display device and a preparation method of the display panel. The first conductive part is arranged on one side of the substrate and comprises a first sub-part and a second sub-part which are arranged in a stacked mode, the first sub-part is located on one side, facing away from the substrate, of the second sub-part, the first sub-part comprises a body portion located on one side, far away from the substrate, of the second sub-part and a protruding portion protruding beyond the second sub-part in a first direction, and the first direction is parallel to the plane of the substrate. The second conductive part is positioned on one side of the protruding part far away from the body part in the first direction and is electrically connected to the first conductive part, and the second conductive part is positioned on one side of the first sub-part far away from the substrate and at least partially overlaps with the orthographic projection of the first sub-part on the substrate. The lapping block is at least partially positioned on one side of the first conductive part close to the second conductive part along the first direction and is attached to the second conductive part. According to the embodiment of the application, the risk of breakage of the second conductive part can be reduced, and the first conductive part and the second conductive part are reliably connected.

Description

Display panel, display device and preparation method of display panel

Technical Field

The application relates to the technical field of display equipment, in particular to a display panel, a display device and a preparation method of the display panel.

Background

In the conventional display device technology, the display panel is mainly divided into two mainstream technologies, namely a liquid crystal display panel and an organic self-luminous display panel. Along with the gradual improvement of the requirements of people on the display panel, the size of the frame of the display panel is gradually reduced, but the frame is limited by the size of the frame of the display panel in the manufacturing process, so that the poor preparation of the metal layer is easy to occur, and the yield of products is influenced.

Disclosure of Invention

The embodiment of the application provides a display panel, a display device and a preparation method of the display panel, which can improve and reduce the risk of breakage of a conductive structure.

In a first aspect, an embodiment of the present application provides a display panel, which includes a substrate, a first conductive portion, a second conductive portion, and a bump. The first conductive part is arranged on one side of the substrate and comprises a first sub-part and a second sub-part which are arranged in a stacked mode, the first sub-part is located on one side, away from the substrate, of the second sub-part, the first sub-part comprises a body portion located on one side, away from the substrate, of the second sub-part and a protruding portion protruding beyond the second sub-part in the first direction, and the first direction is parallel to the plane of the substrate. The second conductive part is positioned on one side of the protruding part far away from the body part in the first direction and is electrically connected to the first conductive part, and the second conductive part is positioned on one side of the first sub-part far away from the substrate and at least partially overlaps with the orthographic projection of the first sub-part on the substrate. The lapping block is at least partially positioned on one side of the first conductive part close to the second conductive part along the first direction and is attached to the second conductive part.

In some embodiments, the landing block includes a first portion and a second portion connected to each other, the orthographic projection of the first portion on the substrate is located outside the orthographic projection of the first conductive portion on the substrate, the second portion is located on a side of the first conductive portion facing away from the substrate, and the orthographic projection of the second portion on the substrate is located in the orthographic projection of the first conductive portion on the substrate

In some embodiments, the protrusion and the second sub-portion together form a recessed space, and the landing block further includes a third portion located within the recessed space, the third portion being connected to the first portion.

In some embodiments, the first sub-portion and the second sub-portion are of different materials.

In some embodiments, the second portion includes a first through hole penetrating in a thickness direction of the substrate, and the second conductive portion is at least partially located in the first through hole and connected to the first conductive portion.

In some embodiments, the first portion includes a second through hole penetrating in the thickness direction, and the first through hole communicates with the second through hole in the first direction.

In some embodiments, the number of the first through holes is multiple, and the multiple first through holes are arranged at intervals along a second direction, and the second direction is parallel to the plane of the substrate and intersects with the first direction.

In some embodiments, the thickness of the first portion tends to increase gradually in a direction toward the first conductive portion.

In some embodiments, the thickness of the first portion increases in a gradient or linearly in a direction proximate to the first conductive portion.

In some embodiments, the second conductive portion includes a third sub-portion located on a side of the first conductive portion facing away from the substrate, and an orthogonal projection of the third sub-portion on the substrate is at least partially outside an orthogonal projection of the bump on the substrate to connect with the first conductive portion.

In some embodiments, the landing pads comprise a conductive material.

In some embodiments, the bump is a transparent structure.

In some embodiments, the maximum thickness H1 of the bump is greater than the maximum thickness H2 of the first conductive portion.

In some embodiments, H1 ≧ 2H2.

In some embodiments, 3H2 ≧ H1.

In some embodiments, the display panel has a display region and a non-display region located at an outer peripheral side of the display region, and the display panel further includes a driving chip located in the non-display region;

the first conductive part comprises a touch wire, the second conductive part comprises a touch electrode, at least part of the second conductive part is positioned in the display area, the first conductive part is positioned in the non-display area, and the second conductive part is electrically connected with the driving chip through the first conductive part. In a second aspect, embodiments of the present application provide a display device, which includes the display panel in any one of the foregoing embodiments.

In a third aspect, an embodiment of the present application provides a method for manufacturing a display panel, including:

forming a second sub-portion on one side of the substrate;

forming a first sub-portion on a side of the second sub-portion away from the substrate, the first sub-portion including a body portion located on a side of the second sub-portion away from the substrate and a protrusion portion extending beyond the second sub-portion in a first direction, the first direction being parallel to a plane of the substrate;

forming a lapping block on one side of the substrate, wherein the lapping block is at least partially positioned on one side of the protruding part far away from the body part along the first direction;

and a second conductive part is formed on one side of the substrate, and part of the second conductive part is attached to the lapping block, extends to the side, away from the substrate, of the first sub-part and is electrically connected with the first sub-part.

The embodiment of the application provides a display panel, a display device and a preparation method of the display panel, wherein the lapping block is at least partially positioned on one side, close to the second conductive part, of the first conductive part along the first direction, so that a concave space formed by the protruding part can be shielded by the lapping block, and when the second conductive part climbs a slope, the second conductive part can be supported by the lapping block, the risk of fracture of the second conductive part can be reduced, and the connection reliability of the first conductive part and the second conductive part is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

FIG. 2 is an enlarged schematic view of region Q of FIG. 1;

FIG. 3 isbase:Sub>A schematic cross-sectional view A-A of FIG. 2;

fig. 4 is an enlarged schematic structural diagram of a further display panel in a region Q according to an embodiment of the present disclosure;

FIG. 5 is a schematic cross-sectional view of B-B in FIG. 4;

fig. 6 is a schematic cross-sectional view of another display panel provided in the embodiment of the present application;

fig. 7 is a schematic structural diagram of a landing block in another display panel provided in an embodiment of the present application;

FIG. 8 is a schematic cross-sectional view taken at C-C of FIG. 7;

fig. 9 is a schematic structural diagram of a landing block in a display panel according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a landing block in a display panel according to an embodiment of the present disclosure;

fig. 11 is a schematic cross-sectional view of another display panel provided in an embodiment of the present application;

fig. 12 is a schematic structural diagram of a display device according to an embodiment of the present application;

fig. 13 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

fig. 14a to 14d are schematic process structure diagrams of a method for manufacturing a display panel according to an embodiment of the present application.

Description of the labeling:

1. a substrate;

2. a first conductive portion; 21. a first sub-section; 22. a second sub-section;

3. a second conductive portion; 31. a third sub-section; 32. a fourth sub-section; 33. a fifth sub-section;

4. a lap joint block; 41. a first portion; 411. a second through hole; 42. a second portion; 421. a first through hole; 43. a third portion;

5. a planarization layer;

AA. A display area; NA, non-display area;

a1, a concave space;

B. a body portion; t, a protrusion;

x, a first direction; y, a second direction; z, thickness direction.

Detailed Description

Features of various aspects and exemplary embodiments of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of, and not restrictive on, the present application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of another like element in a process, method, article, or apparatus that comprises the element.

Display panels are generally arranged with conductive layers for signal transmission, and due to impedance limitations, the conductive layers are often formed together using different conductive materials. In the preparation process of the conducting layer, because the etching rate of the etching liquid to different conducting materials is different, the etching amount of the conducting material in the middle or at the bottom is easily caused to be too large, so that the conducting layer has a concave structure at the edge position, and when the conducting layer is in lap joint with other structures, the problem of climbing and breaking of the edge side of the conducting layer is easily caused to other structures, and the connecting effect between the conducting layer and the other structures is influenced.

In order to solve the above problem, referring to fig. 1 to fig. 3, an embodiment of the present invention provides a display panel, which includes a substrate 1, a first conductive part 2, a second conductive part 3, and a bump 4. The first conductive part 2 is disposed on one side of the substrate 1, the first conductive part 2 includes a first sub-part 21 and a second sub-part 22 stacked, the first sub-part 21 is disposed on one side of the second sub-part 22 facing away from the substrate 1, and the first sub-part 21 includes a body B disposed on one side of the second sub-part 22 facing away from the substrate 1 and a protrusion T extending beyond the second sub-part 22 in a first direction X parallel to a plane of the substrate 1.

The second conductive part 3 is located on the side of the protrusion T away from the body part B in the first direction X and is electrically connected to the first conductive part 2, and the second conductive part 3 is located on the side of the first sub-part 21 away from the substrate 1 and at least partially overlaps with the orthographic projection of the first sub-part 21 on the substrate 1.

The bonding pad 4 is at least partially located on a side of the first conductive part 2 close to the second conductive part 3 along the first direction X, and is attached to the second conductive part 3.

The substrate 1 may be rigid, such as a glass substrate, or flexible, such as a PolyimiDe (PI) substrate. The first conductive part 2 and the second conductive part 3 are located on the same side of the substrate 1, and are electrically connected to each other, i.e. the driving signal on the first conductive part 2 can be transmitted to the second conductive part 3, and the driving signal on the second conductive part 3 can also be transmitted to the first conductive part 2. Among them, a plurality of functional film layers may be included between the first conductive part 2 and the substrate 1, and the functional film layers include, but are not limited to, the planarization layer 5, the light emitting device layer, and the like.

The specific positions and functions of the first conductive part 2 and the second conductive part 3 are not limited in the embodiments of the present application. Illustratively, the display panel includes a display area AA and a non-display area NA surrounding the outer periphery of the display area AA, the first conductive part 2 is located in the non-display area NA and electrically connected to the driving chip, the second conductive part 3 is located in the display area AA and electrically connected to the pixel circuit, and the first conductive part 2 and the second conductive part 3 are used for transmitting a driving signal emitted by the driving chip to the pixel circuit to control the display panel to emit light or turn off.

The first conductive part 2 includes a first sub-part 21 and a second sub-part 22 stacked, and the first sub-part 21 and the second sub-part 22 are made of different materials. In the production of the first conductive part 2, the second sub-part 22 is first patterned by means of an etching technique and the first sub-part 21 is then patterned by means of an etching technique on the side of the second sub-part 22 facing away from the substrate 1. Ideally, the second sub-portion 22 formed by patterning overlaps with the orthographic projection profile of the first sub-portion 21 on the substrate 1. However, in the actual manufacturing process, due to the different etching rates of the etching solution for different materials, the etched first sub-portion 21 at least partially exceeds the second sub-portion 22 in the first direction X, i.e., the protrusion T exceeding the second sub-portion 22 appears in the first sub-portion 21. Wherein the orthographic projection of the body portion B on the substrate 1 at least partially overlaps the orthographic projection of the second sub-portion 22 on the substrate 1, and the orthographic projection of the protrusion T on the substrate 1 is outside the orthographic projection of the second sub-portion 22 on the substrate 1.

The second conductive part 3 at least includes a fourth sub-part 32, a third sub-part 31 and a fifth sub-part 33, and the fourth sub-part 32 is disposed in the same layer as the first conductive part 2 and is located on one side of the first conductive part 2 in the first direction X. The third sub-portion 31 is located on a side of the first conductive portion 2 facing away from the substrate 1, and the third sub-portion 31 is electrically connected to the first conductive portion 2 to achieve electrical connection between the first conductive portion 2 and the second conductive portion 3. The fifth sub-portion 33 and the fourth sub-portion 32 are located on the same side of the first conductive portion 2 in the first direction X, and two ends of the fifth sub-portion 33 are connected to the fourth sub-portion 32 and the third sub-portion 31, respectively.

The protrusion T and the second sub-portion 22 together form a concave space A1, and in fig. 3, the concave space A1 is indicated by a dashed square. Due to the existence of the recessed space A1, when the second conductive part 3 is overlapped with the first conductive part 2, the fifth sub-part 33 at the position of the recessed space A1 cannot be supported, so that the risk of fracture is likely to occur, and the reliability of the electrical connection between the first conductive part 2 and the second conductive part 3 is affected.

For this purpose, the embodiment of the present application adds the joint block 4, and the joint block 4 is located at least partially on the side of the first conductive part 2 close to the second conductive part 3 along the first direction X. Specifically, the land block 4 is located at least partially between the first conductive part 2 and the fourth sub-part 32. The lapping block 4 can block the concave space A1, further, since the second conductive part 3 is attached to the lapping block 4, the fifth sub-part 33 in the second part 42 can extend to the side of the first conductive part 2 away from the substrate 1 along the lapping block 4, and is connected with the third sub-part 31, and the existence of the lapping block 4 can reduce the risk of the second conductive part 3 breaking. The specific material of the block 4 is not limited in the embodiments of the present application.

In summary, in the embodiment of the present application, the overlapping block 4 is at least partially located on one side of the first conductive part 2 close to the second conductive part 3 along the first direction X, so that the recessed space A1 formed by the protruding portion T can be blocked by the overlapping block 4, and when the second conductive part 3 climbs, the second conductive part 3 can be supported by the overlapping block 4, and thus the risk of breaking the second conductive part 3 can be reduced, and the connection reliability between the first conductive part 2 and the second conductive part 3 can be improved.

The first conductive part 2 includes, but is not limited to, the first sub-part 21 and the second sub-part 22, that is, the first conductive part 2 may be formed by stacking three or more conductive structures. Besides, the first sub-portion 21 and the second sub-portion 22 may have different sizes in the first direction X due to different materials, so that the first sub-portion 21 at least partially extends beyond the second sub-portion 22 in the first direction X. Therefore, the material of the first sub-portion 21 and the second sub-portion 22 is not limited in the embodiments of the present application, and the first sub-portion 21 may be the same as or different from the second sub-portion 22, as long as the first sub-portion 21 at least partially extends beyond the second sub-portion 22 in the first direction X.

In some embodiments, referring to fig. 4 and 5, the landing pad 4 includes a first portion 41 and a second portion 42 connected to each other, an orthogonal projection of the first portion 41 on the substrate 1 is located outside an orthogonal projection of the first conductive part 2 on the substrate 1, the second portion 42 is located on a side of the first conductive part 2 facing away from the substrate 1, and an orthogonal projection of the second portion 42 on the substrate 1 is located within an orthogonal projection of the first conductive part 2 on the substrate 1.

The first portion 41 covers one side of the edge of the first conductive part 2 in the first direction X, and can function to block the recess space A1. The presence of the first portion 41 enables the second conductive part 3 to be supported by the first portion 41 during climbing, thereby reducing the risk of the second conductive part 3 breaking.

The second portion 42 covers one side of the edge of the first conductive part 2 in the thickness direction Z of the substrate 1, the first portion 41 and the second portion 42 can completely cover the edge of the first conductive part 2 in the first direction X, the fifth sub-part 33 of the second conductive part 3 is attached to the first portion 41, and at least part of the third sub-part 31 of the second conductive part 3 is attached to the second portion 42, and can be electrically connected to the first conductive part 2. The third sub-portion 31 may directly contact with the first conductive portion 2 to electrically connect with the first conductive portion 2, or the third sub-portion 31 may also electrically connect with the first conductive portion 2 through the second portion 42, which is not limited in the embodiment of the present application.

In some embodiments, referring to fig. 6, the landing block 4 further includes a third portion 43 located in the recessed space A1, and the third portion 43 is connected to the first portion 41.

The third portion 43 of the landing block 4 is filled in the recessed space A1. For example, the landing block 4 may include some material with a relatively high fluidity so that at least a portion of the material can enter and fill the recessed space A1, thereby forming the third portion 43 of the landing block 4.

The presence of the third portion 43 can help the bump 4 to better cover the recessed space A1, thereby further reducing the risk of the second conductive part 3 breaking and improving the reliability of the connection between the first conductive part 2 and the second conductive part 3.

In some embodiments, the materials of the first sub-portion 21 and the second sub-portion 22 are different. Due to the different materials, the etching rates of the etching solution to the first sub-portion 21 and the second sub-portion 22 are different during the preparation of the display panel, so that the etched first sub-portion 21 at least partially exceeds the second sub-portion 22 in the first direction X, that is, a protrusion T exceeding the second sub-portion 22 occurs in the first sub-portion 21.

In some embodiments, referring to fig. 7 and fig. 8, the second portion 42 includes a first through hole 421 penetrating along the thickness direction Z of the substrate 1, and the second conductive portion 3 is at least partially located in the first through hole 421 and connected to the first conductive portion 2. In fig. 7, the first via 421 is illustrated in the form of a block.

As can be seen from the foregoing, the second conductive part 3 needs to be electrically connected to the first conductive part 2 through the third sub-part 31, and the third sub-part 31 is at least partially located on the side of the second part 42 away from the substrate 1, in order to achieve the electrical connection between the first conductive part 2 and the second conductive part 3, in the embodiment of the present application, the first through hole 421 is provided on the second part 42, and the first through hole 421 penetrates through the second part 42 along the thickness direction Z. When the second conductive part 3 is prepared, at least the material in the second conductive part 3 is filled into the first via 421, so as to achieve the electrical connection between the first conductive part 2 and the second conductive part 3.

It should be noted that, in the embodiment of the present application, the overlapping block 4 may be a conductive material, and may also be an insulating material, and when the overlapping block 4 is an insulating material, the first conductive part 2 and the second conductive part 3 are connected to each other through the first through hole 421; when the joint block 4 is made of a conductive material, the first conductive part 2 and the second conductive part 3 may be connected to each other through the first through hole 421, or an electrical signal may be transmitted through the joint block 4.

In some embodiments, referring to fig. 9, the first portion 41 includes a second through hole 411 penetrating along the thickness direction, and the first through hole 421 communicates with the second through hole 411 in the first direction X.

The second through hole 411 penetrates the first portion 41 in the thickness direction, and at least part of the material in the second conductive part 3 may also be filled into the first portion 41 and electrically connected to the second conductive part 3. Here, the first via 421 on the second portion 42 and the second via 411 on the first portion 41 are interconnected in the first direction X, so that the first via 421 and the second via 411 can be formed simultaneously in the same process. Further, optionally, the second through hole 411 penetrates the first portion 41 in the first direction X, and this design makes at least a part of the structure of the block 4 have a zigzag structure.

In some embodiments, the number of the first through holes 421 is multiple, and the multiple first through holes 421 are arranged at intervals along the second direction Y, which is parallel to the plane of the substrate 1 and intersects with the first direction X. Exemplarily, the first direction X is perpendicular to the second direction Y.

The number of the first through holes 421 is plural, and the plural first through holes 421 can improve the connection effect between the first conductive part 2 and the second conductive part 3, and improve the reliability of signal transmission between the first conductive part 2 and the second conductive part 3. The cross-sectional shape of the first through holes 421 includes, but is not limited to, a circle, a square, a polygon, and the like, and the size of each first through hole 421 and the distance between adjacent first through holes 421 are not limited in the embodiments of the present application. Alternatively, the plurality of first through holes 421 are equidistantly arranged in the second direction Y.

In some alternative embodiments, referring to fig. 10, the number of the second through holes 411 is also multiple, and the plurality of first through holes 421 and the plurality of second through holes 411 are correspondingly disposed and communicated with each other. Further, optionally, the second through hole 411 penetrates the first portion 41 along the first direction X, and the first through hole 421 penetrates the second portion 42 along the first direction X. Under this design, the overlapping block 4 is a plurality of strip structures arranged separately, and the plurality of strip structures are arranged side by side along the second direction Y. This design may increase the contact area between the first conductive portion and the second conductive portion. Thereby reducing the resistance of the lap joint.

In some embodiments, as shown in fig. 3, the thickness of the first portion 41 tends to increase gradually in a direction approaching the first conductive portion 2.

The "tendency of the thickness of the first portion 41 to gradually increase in the direction approaching the first conductive part 2" mentioned in the embodiment of the present application means that the size of the first portion 41 in the thickness direction Z tends to gradually increase in the direction parallel to the first direction X and directed toward the first conductive part 2.

The fifth sub-portion 33 in the second conductive portion 3 needs to extend along the surface of the first portion 41 and in a direction away from the substrate 1 to be in contact connection with the third sub-portion 31. On this basis, the size of the first portion 41 is limited in the embodiment of the present application, so that the thickness of the first portion 41 tends to change gradually, and compared with a scheme in which the thickness changes suddenly, the embodiment of the present application can further reduce the risk of the fifth sub-portion 33 breaking, and improve the connection reliability between the first conductive portion 2 and the second conductive portion 3. Optionally, the thickness of the first portion 41 increases in a gradient or linearly in a direction approaching the first conductive portion 2.

In some embodiments, referring to fig. 11, the orthographic projection of the third sub-portion 31 on the substrate 1 is at least partially outside the orthographic projection of the bump 4 on the substrate 1 to connect with the first conductive portion 2. In other words, the third sub-section 31 at least partially exceeds the second portion 42 in the first direction X, and a portion of the third sub-section 31 exceeding the second portion 42 can be in direct contact with the first conductive part 2, thereby achieving electrical connection between the first conductive part 2 and the second conductive part 3.

In the embodiment of the present application, the orthographic projection of the landing pad 4 on the substrate 1 is completely located in the orthographic projection of the second conductive part 3 on the substrate 1, and during the preparation process, the size of the landing pad 4 in the first direction X can be reduced appropriately, so that the second conductive part 3 can exceed the landing pad 4 in the first direction X, thereby realizing the contact connection between the first conductive part 2 and the second conductive part 3. This design can further reduce the influence of the bumps 4 on the impedance, thereby improving the signal transmission effect between the first conductive part 2 and the second conductive part 3.

In some embodiments, the landing pads 4 comprise a conductive material.

Since the solder bump 4 itself has a conductive effect, the first conductive part 2 and the second conductive part 3 can perform a signal transmission function by the solder bump 4 without the need to contact the first conductive part 2 and the second conductive part 3. On this basis, the embodiment of the present application may set the orthographic projection of the third sub-portion 31 on the substrate 1 within the orthographic projection of the second portion 42 on the substrate 1, that is, the whole third sub-portion 31 is attached to the bonding block 4.

In some embodiments, the landing block 4 is a transparent structure.

For the display panel, the overlapping position of the first conductive part 2 and the second conductive part 3 may be located in the display area AA, and in order to reduce the influence of the overlapping block 4 on the display effect in the display panel, the overlapping block 4 is set to be a transparent structure in the embodiment of the present application, so as to increase the transmittance of the display panel at the position of the overlapping block 4.

Note that, in the present embodiment, at least one of the first conductive part 2 and the second conductive part 3 may be a transparent conductive structure. Illustratively, the first conductive part 2 is located in the non-display area NA, the first conductive part 2 is a conductive metal structure, the second conductive part 3 is located in the display area AA, and the second conductive part 3 is a transparent conductive structure.

In some embodiments, the maximum thickness H1 of the landing block 4 is greater than the maximum thickness H2 of the first conductive portion 2.

In the prior art, the second conductive part 3 is prone to fracture at the position of the recessed space A1, mainly because the second conductive part 3 is relatively thin, and therefore the strength of the second conductive part 3 itself is insufficient, and the second conductive part 3 is prone to fracture risk without support. Similarly, if the thickness of the bump 4 itself is too small, the bump 4 is likely to be broken at the position of the recessed space A1, and the effect of supporting the second conductive part 3 is not obtained.

On this basis, in the embodiment of the present application, the maximum thickness H1 of the block 4 is set to be greater than the maximum thickness H2 of the first conductive part 2, so that the risk of the block 4 breaking is reduced, and the supporting effect of the block 4 on the second conductive part 3 is improved. Alternatively, H1 ≧ 2H2.

In some embodiments, 3H2 ≧ H1. Since the thickness of the bonding block 4 affects the thickness of the display panel, if the thickness of the bonding block 4 is too large, the overall thickness of the display panel tends to be too large, which is disadvantageous in terms of the user's hand. Therefore, in the embodiment of the present application, H1 is set to be equal to or less than 3H2, so that the entire thickness of the display panel is reduced and the use hand feeling of the display panel is improved on the basis that the second conductive part 3 can be supported.

In some embodiments, the display panel further includes a driving chip located in the non-display area NA, the first conductive part 2 includes a touch trace, the second conductive part 3 includes a touch electrode, the second conductive part 3 is at least partially located in the display area AA, the first conductive part 2 is located in the non-display area NA, and the second conductive part 3 is electrically connected to the driving chip through the first conductive part 2.

The touch wiring and the touch electrode are both located in the touch metal layer and are used for achieving the touch effect of the display panel. The touch electrode in the second conductive part 3 can sense touch information of a user. The touch trace in the first conductive part 2 is used for electrically connecting the second conductive part 3 and the driver chip, and is used for transmitting touch information obtained by the touch electrode to the driver chip, and obtaining specific touch coordinates through processing of the driver chip, so that the display panel performs corresponding feedback.

The second conductive part 3 is located in the display area AA, the second conductive part 3 may be made of Indium Tin Oxide (ITO) material, the first conductive part 2 is located in the non-display area NA, and may be made of a multi-layer metal structure, for example, the first conductive part 2 includes three layers of metal structures, which are metal molybdenum, metal aluminum, and metal molybdenum, respectively, stacked together. The first sub-portion 21 and the second sub-portion 22 are made of different materials, the first sub-portion 21 includes molybdenum metal, and the second sub-portion 22 includes aluminum metal.

According to the embodiment of the application, the lapping blocks 4 are additionally arranged in the touch metal layer, so that the risk of fracture of the second conductive part 3 is reduced, the connection reliability between the first conductive part 2 and the second conductive part 3 is enhanced, and the display panel is ensured to have a stable touch induction effect.

In a second aspect, please refer to fig. 12, an embodiment of the present application provides a display device including the display panel in any one of the foregoing embodiments.

The display device provided in the embodiment of the present application has the beneficial effects of the display panel in any of the foregoing embodiments, and for specific content, please refer to the foregoing description of the beneficial effects of the display panel, which is not repeated herein.

In a third aspect, referring to fig. 13 and 14, an embodiment of the present application provides a method for manufacturing a display panel, including:

s100: forming a second sub-portion on one side of the substrate;

referring to fig. 14a, in step S100, the second sub-portion 22 may be patterned by an etching technique and formed on one side of the substrate 1, and optionally, the display panel includes a display region and a non-display region located on the periphery of the display region, and the second sub-portion 22 is located in the non-display region.

S110: and forming a first sub-part on the side of the second sub-part, which is far away from the substrate, wherein the first sub-part comprises a body part positioned on the side of the second sub-part, which is far away from the substrate, and a protruding part which exceeds the second sub-part in a first direction, and the first direction is parallel to the plane of the substrate.

Referring to fig. 14b, in step S110, the first sub-portion 21 may be patterned by an etching technique, and due to a difference between materials of the first sub-portion 21 and the second sub-portion 22 or other factors, in a process of preparing the first sub-portion 21, etching rates of the etching solution to the first sub-portion 21 and the second sub-portion 22 are different, so that the etched first sub-portion 21 at least partially exceeds the second sub-portion 22 in the first direction X, thereby forming a protrusion T, and the protrusion T and the second sub-portion 22 form a concave space A1 together.

It should be noted that, the etching process may be performed on the first sub-portion 21 and the second sub-portion 22 simultaneously, that is, the second sub-portion 22 in the full-surface structure and the first sub-portion 21 in the full-surface structure are sequentially formed on one side of the substrate 1, and then the first sub-portion 21 and the second sub-portion 22 are etched simultaneously, so that the first sub-portion 21 after the etching process is completed at least partially exceeds the second sub-portion 22 in the first direction X due to the different etching rates of the etching solution on the first sub-portion 21 and the second sub-portion 22.

S120: and a lapping block is formed on one side of the substrate, and is at least partially positioned on one side of the protruding part far away from the body part along the first direction.

Referring to fig. 14c, in step S120, the joint block 4 is located at one side of the first sub-portion 21 and the second sub-portion 22 along the first direction X, and the existence of the joint block 4 can block the recess space A1. Alternatively, the overlap block 4 comprises a first portion 41 and a second portion 42 connected to each other, the orthographic projection of the first portion 41 on the substrate 1 is located outside the orthographic projection of the first sub-portion 21 on the substrate 1, the orthographic projection of the second portion 42 on the side of the first sub-portion 21 facing away from the substrate 1 is located, and the orthographic projection of the second portion 42 on the substrate 1 is located inside the orthographic projection of the first sub-portion 21 on the substrate 1.

S130: and a second conductive part is formed on one side of the substrate, and part of the second conductive part is attached to the lapping block, extends to the side, away from the substrate, of the first sub-part and is electrically connected with the first sub-part.

Referring to fig. 14d, in step S130, the recessed space A1 formed by the second sub-portion 22 and the portion of the first sub-portion 21 beyond the second sub-portion 22 can be shielded by the bonding block 4, so that a part of the structure of the second conductive portion 3 can be supported by the bonding block 4 during the manufacturing process of the second conductive portion 3, thereby reducing the risk of breaking the second conductive portion 3.

Although the embodiments disclosed in the present application are as described above, the descriptions are only for the convenience of understanding the present application, and are not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.

As described above, only the specific embodiments of the present application are provided, and it can be clearly understood by those skilled in the art that, for convenience and brevity of description, the corresponding processes in the foregoing method embodiments may be referred to for replacement of the other connection manners described above, and are not described herein again. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application.

Claims (10)

1. A display panel, comprising:

a substrate;

the first conductive part is arranged on one side of the substrate and comprises a first sub-part and a second sub-part which are arranged in a stacked mode, the first sub-part is positioned on one side, away from the substrate, of the second sub-part, the first sub-part comprises a body part positioned on one side, away from the substrate, of the second sub-part and a protruding part which exceeds the second sub-part in a first direction, and the first direction is parallel to the plane of the substrate;

a second conductive portion, a part of which is located on a side of the protruding portion away from the body portion in the first direction and is electrically connected to the first conductive portion, and a part of which is located on a side of the first sub-portion away from the substrate and at least partially overlaps with an orthographic projection of the first sub-portion on the substrate;

and at least part of the lapping block is positioned on one side of the first conductive part close to the second conductive part along the first direction and is attached to the second conductive part.

2. The display panel according to claim 1, wherein the bump comprises a first portion and a second portion connected to each other, an orthographic projection of the first portion on the substrate is outside an orthographic projection of the first conductive portion on the substrate, the second portion is on a side of the first conductive portion facing away from the substrate, and the orthographic projection of the second portion on the substrate is within the orthographic projection of the first conductive portion on the substrate;

preferably, the protrusion and the second sub-portion together form a recessed space, and the bridging block further includes a third portion located in the recessed space, the third portion being connected to the first portion;

preferably, the first sub-portion and the second sub-portion are of different materials.

3. The display panel according to claim 2, wherein the second portion includes a first through hole penetrating in a thickness direction of the substrate, and wherein the second conductive portion is at least partially located in the first through hole and connected to the first conductive portion;

preferably, the first portion includes a second through hole penetrating in the thickness direction, the first through hole communicating with the second through hole in the first direction;

preferably, the number of the first through holes is multiple, the multiple first through holes are arranged at intervals along a second direction, and the second direction is parallel to the plane of the substrate and intersects with the first direction.

4. The display panel according to claim 2, wherein a thickness of the first portion is gradually increased in a direction toward the first conductive portion;

preferably, the thickness of the first portion increases in a gradient or linearly in a direction approaching the first conductive portion.

5. The display panel of claim 2, wherein the second conductive portion comprises a third sub-portion located on a side of the first conductive portion facing away from the substrate, and an orthogonal projection of the third sub-portion on the substrate is at least partially outside an orthogonal projection of the bump on the substrate to connect with the first conductive portion.

6. The display panel of claim 1, wherein the bump blocks comprise a conductive material;

preferably, the bridging block is a transparent structure.

7. The display panel according to claim 1, wherein a maximum thickness H1 of the bump is larger than a maximum thickness H2 of the first conductive portion;

preferably, H1 ≧ 2H2;

preferably, 3H2 ≧ H1.

8. The display panel according to claim 1, wherein the display panel has a display region and a non-display region located on an outer peripheral side of the display region, the display panel further comprising a driving chip located in the non-display region;

the first conductive part comprises a touch wire, the second conductive part comprises a touch electrode, at least part of the second conductive part is located in the display area, the first conductive part is located in the non-display area, and the second conductive part is electrically connected to the driving chip through the first conductive part.

9. A display device characterized by comprising the display panel according to any one of claims 1 to 8.

10. A method for manufacturing a display panel, comprising:

forming a second sub-portion on one side of the substrate;

forming a first sub-portion on a side of the second sub-portion facing away from the substrate, the first sub-portion including a body portion located on a side of the second sub-portion facing away from the substrate and a protrusion portion extending beyond the second sub-portion in a first direction, the first direction being parallel to a plane of the substrate;

forming a lapping block on one side of the substrate, wherein the lapping block is positioned on one side of the protruding part far away from the body part at least partially along the first direction;

and forming a second conductive part on one side of the substrate, wherein part of the second conductive part is attached to the lapping block, extends to one side of the first sub-part, which is away from the substrate, and is electrically connected with the first sub-part.

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