CN115404032A - Epoxy positioning adhesive for main-grid-free solar module and preparation method thereof - Google Patents
Epoxy positioning adhesive for main-grid-free solar module and preparation method thereof Download PDFInfo
- Publication number
- CN115404032A CN115404032A CN202211272922.9A CN202211272922A CN115404032A CN 115404032 A CN115404032 A CN 115404032A CN 202211272922 A CN202211272922 A CN 202211272922A CN 115404032 A CN115404032 A CN 115404032A
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- China
- Prior art keywords
- epoxy
- positioning adhesive
- resin
- solar module
- positioning
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention relates to an epoxy positioning adhesive for a solar module without a main grid and a preparation method thereof, and is characterized in that the epoxy positioning adhesive comprises the following components: epoxy resin monomer, morpholine diazobenzene boron tetrafluoride latent initiator, toughening resin and thixotropic agent. The beneficial effects are as follows: the morpholine diazobenzene boron tetrafluoride is innovatively used as a latent curing agent to prepare the epoxy positioning adhesive, so that the epoxy positioning adhesive is rapidly cured (cured within 8 seconds at 150 ℃), and the problems of low curing speed, easy aging and the like of the epoxy positioning adhesive are solved. Meanwhile, the brittleness of the epoxy positioning adhesive is effectively reduced by the aid of toughened epoxy resin, subfissure in the manufacturing process of the component is greatly reduced, and the yield of the component is improved.
Description
Technical Field
The invention relates to the field of high-molecular base materials, in particular to an epoxy positioning adhesive for a main-grid-free solar module and a preparation method thereof.
Background
With the proposal of the "dual carbon" target, the solar power generation technology gradually becomes the main force of renewable energy, and the reduction of the manufacturing cost is the target which is always pursued by the photovoltaic industry. Silver paste has been a major part of the cost in the solar cell manufacturing process, and various techniques for reducing the usage amount of silver paste have been gradually adopted by cell factories. The solar cell without the main grid can save the main grid line of the traditional solar cell, so that the using amount of silver paste can be greatly reduced, and the solar cell is considered to be a feasible low-cost process route in the future. However, the solar cell without the main grid can not be welded and interconnected by adopting the traditional welding process, and a new technical process is needed to package the solar cell without the main grid at the component manufacturing end. A novel packaging mode of a solar module without a main grid is characterized in that a tinned copper wire and a solar cell without the main grid are mutually bonded and interconnected into a string by using positioning glue, and then the tinned copper wire is tightly pressed on the solar cell without the main grid through a packaging glue film in a laminating process, so that the tinned copper wire and the solar cell without the main grid are in physical contact to form a conductive path. The positioning adhesive used in the technical process is required to be capable of realizing rapid curing, and has good adhesion, light transmission and aging resistance after curing, and certain flexibility so as to avoid hidden cracking of the battery piece in the using process.
As the technology of the gridless solar module is a new technological route which is emerging in recent two years, no positioning glue is available in the market which is specifically directed to this application. Therefore, the development of the positioning adhesive which can be quickly cured and has good adhesion, light transmission and aging resistance has wide application prospect in the manufacture of the solar module without the main grid.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an epoxy positioning adhesive for a solar module without a main grid and a preparation method thereof. The epoxy positioning adhesive for the solar module without the main grid comprises an epoxy resin monomer, a morpholine diazobenzene boron tetrafluoride latent initiator, a toughening resin and a thixotropic agent. Wherein the weight percentage of the epoxy resin monomer in the epoxy positioning adhesive is 40-90%, the weight percentage of the toughening resin in the epoxy positioning adhesive is 5-30%, the weight percentage of the morpholine diazobenzene boron tetrafluoride in the epoxy positioning adhesive is 0.1-5%, and the weight percentage of the thixotropic agent in the epoxy positioning adhesive is 1-10%.
Wherein the epoxy resin monomer comprises one or a mixture of any two of bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin and cyclopentadiene epoxy resin, and the weight percentage of the epoxy resin monomer in the epoxy positioning adhesive is 40-90%.
Wherein the toughening resin is one or a mixture of two of liquid polysulfide rubber, polyvinyl acetal or polyether polyol, and the weight percentage of the toughening resin in the epoxy positioning adhesive is 5-30%.
Wherein the thixotropic agent comprises one or more of hydrogenated castor oil, ethyl cellulose, fumed silica or bentonite. The weight percentage of the thixotropic agent in the epoxy positioning adhesive is 1-10%.
The implementation of the invention comprises the following technical effects:
according to the epoxy positioning adhesive for the solar module without the main grid, morpholine diazobenzene boron tetrafluoride is innovatively used as a latent curing initiator, so that the positioning adhesive can be rapidly cured (completely cured within 8 seconds at 150 ℃), and the requirement for rapid curing of the positioning adhesive in the production process of the solar module without the main grid is met. Meanwhile, the toughening resin is introduced into the epoxy positioning adhesive, so that the brittleness of the positioning adhesive is reduced while the bonding force of the epoxy positioning adhesive is ensured, and the hidden crack in the manufacturing process of the non-main-grid assembly is reduced. The applicant selects and optimizes the types and the addition amounts of the latent curing agent and the toughening resin through a large number of experiments, so that the epoxy positioning adhesive has the characteristics of quick curing, high adhesive force, high toughness and the like, solves a series of problems of conventional positioning adhesives, and has high practical value in the manufacture of non-main-grid components.
Detailed Description
The present invention will be described in detail with reference to the following examples, which are intended to facilitate the understanding of the present invention and should not be construed as limiting in any way.
The epoxy positioning adhesive for the solar module without the main grid provided by the embodiment comprises an epoxy resin monomer, a morpholine diazobenzene boron tetrafluoride latent initiator, a toughening resin and a thixotropic agent. The specific processing technological process comprises the following steps: precisely weighing epoxy resin monomer, toughening resin and morpholine diazobenzene boron tetrafluoride, stirring and mixing for 30 minutes at 0-30 ℃ in a double-planet manner, adding a thixotropic agent, continuously stirring for 30 minutes, and carrying out vacuum defoaming and filling to obtain the epoxy positioning adhesive for the solar module without the main grid
The following description describes the preparation of the epoxy positioning adhesive for the maingrid-free solar module in several embodiments.
Example 1
The preparation method of the epoxy positioning adhesive for the solar module without the main grid comprises the steps of accurately weighing 500 g of bisphenol A type epoxy resin, 300 g of polyether polyol and 10 g of morpholine diazobenzene boron tetrafluoride, stirring and mixing for 30 minutes at 0-30 ℃ in a double planetary way, adding 40 g of fumed silica, continuing stirring for 30 minutes, and performing vacuum deaeration to obtain the epoxy positioning adhesive for the solar module without the main grid, wherein the specific characteristics are as follows:
viscosity: 75 Pa.s
Bonding strength: 6MPa (bonding base material is aluminum)
Density: 1.06 g/cc
Curing speed: 8 second (150 ℃ C.)
The curing speed and the bonding force of the epoxy positioning adhesive for the solar module without the main grid are much higher than those of the conventional positioning adhesive, and the epoxy positioning adhesive has very stable performance after high-temperature, high-humidity and aging.
Example 2
The preparation method of the epoxy positioning adhesive for the solar module without the main grid comprises the steps of accurately weighing 1000 g of alicyclic epoxy resin, 200 g of polyvinyl acetal and 30 g of morpholine diazobenzene boron tetrafluoride, stirring and mixing for 30 minutes in a double planetary way at 0-30 ℃, adding 70 g of hydrogenated castor oil, continuing stirring for 30 minutes, and performing vacuum defoaming to obtain the epoxy positioning adhesive for the solar module without the main grid, wherein the specific characteristics are as follows:
viscosity: 43 Pa.s
Bonding strength: 7.6MPa (bonding base material is aluminum)
Density: 1.03 g/cc
Curing speed: 7 second (150 ℃ C.)
The curing speed and the bonding force of the epoxy positioning adhesive for the solar module without the main grid are much higher than those of the conventional positioning adhesive, and the epoxy positioning adhesive has very stable performance after high-temperature, high-humidity and aging.
Example 3
The preparation method of the epoxy positioning adhesive for the solar module without the main grid comprises the steps of accurately weighing 1000 g of bisphenol F epoxy resin, 350 g of polyether polyol and 20 g of morpholine diazobenzene boron tetrafluoride, stirring and mixing for 30 minutes in a double planetary way at 0-30 ℃, adding 60 g of ethyl cellulose, continuously stirring for 30 minutes, and carrying out vacuum defoaming to obtain the epoxy positioning adhesive for the solar module without the main grid, wherein the specific characteristics are as follows:
viscosity: 88 Pa.s
Bonding strength: 7.9MPa (bonding base material is aluminum)
Density: 1.09 g/cc
Curing speed: 8 second (150 ℃ C.)
The curing speed and the bonding force of the epoxy positioning adhesive for the solar module without the main grid, which is prepared in the embodiment, are far higher than those of the conventional positioning adhesive, and the epoxy positioning adhesive has very stable performance after high-temperature, high-humidity and aging.
Example 4
The preparation method of the epoxy positioning adhesive for the solar module without the main grid comprises the steps of accurately weighing 700 g of bisphenol a type epoxy resin, 200 g of liquid polysulfide rubber and 15 g of morpholine diazobenzene boron tetrafluoride, stirring and mixing for 30 minutes at 0-30 ℃ in a double planetary way, adding 40 g of bentonite, continuing stirring for 30 minutes, and performing vacuum deaeration to obtain the epoxy positioning adhesive for the solar module without the main grid, wherein the specific characteristics are as follows:
viscosity: 105 Pa.s
Bonding strength: 4.5MPa (bonding base material is aluminum)
Density: 1.15 g/cc
Curing speed: 8 second (150 ℃ C.)
The curing speed and the bonding force of the epoxy positioning adhesive for the solar module without the main grid, which is prepared in the embodiment, are far higher than those of the conventional positioning adhesive, and the epoxy positioning adhesive has very stable performance after high-temperature, high-humidity and aging.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (4)
1. The utility model provides an epoxy positioning glue for no main grid solar energy component, includes epoxy monomer, morpholine diazobenzene boron tetrafluoride latent type initiator, toughened resin and thixotropic agent, its characterized in that: the weight percentage of the epoxy resin monomer in the epoxy positioning adhesive is 40-90%, the weight percentage of the toughening resin in the epoxy positioning adhesive is 5-30%, the weight percentage of the morpholine diazobenzene boron tetrafluoride in the epoxy positioning adhesive is 0.1-5%, and the weight percentage of the thixotropic agent in the epoxy positioning adhesive is 1-10%.
2. The epoxy positioning adhesive for the maingrid-less solar module as claimed in claim 1, wherein: the epoxy resin monomer comprises one or a mixture of any two of bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin and cyclopentadiene epoxy resin, and the weight percentage of the epoxy resin monomer in the epoxy positioning adhesive is 40-90%.
3. The epoxy positioning adhesive for the solar module without the main grid as claimed in claim 1, wherein: the toughening resin is one or a mixture of two of liquid polysulfide rubber, polyvinyl acetal or polyether polyol, and the weight percentage of the toughening resin in the epoxy positioning adhesive is 5-30%.
4. The epoxy positioning adhesive for the maingrid-less solar module as claimed in claim 1, wherein: the thixotropic agent comprises one or more of hydrogenated castor oil, ethyl cellulose, fumed silica or bentonite, and the weight percentage of the thixotropic agent in the epoxy positioning adhesive is 1-10%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211272922.9A CN115404032A (en) | 2022-10-19 | 2022-10-19 | Epoxy positioning adhesive for main-grid-free solar module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211272922.9A CN115404032A (en) | 2022-10-19 | 2022-10-19 | Epoxy positioning adhesive for main-grid-free solar module and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115404032A true CN115404032A (en) | 2022-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211272922.9A Pending CN115404032A (en) | 2022-10-19 | 2022-10-19 | Epoxy positioning adhesive for main-grid-free solar module and preparation method thereof |
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| Country | Link |
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| CN (1) | CN115404032A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006241252A (en) * | 2005-03-01 | 2006-09-14 | Sekisui Chem Co Ltd | Epoxy resin cured product, sheet made thereof and manufacturing method of the epoxy resin cured product |
| CN110894411A (en) * | 2019-12-16 | 2020-03-20 | 苏州瑞力博新材科技有限公司 | Epoxy conductive adhesive for laminated solar module and preparation method thereof |
| CN111145934A (en) * | 2019-12-16 | 2020-05-12 | 苏州瑞力博新材科技有限公司 | Silver paste capable of being stored at room temperature and used for Heterojunction (HIT) solar cell and preparation method |
| KR20210091972A (en) * | 2020-01-15 | 2021-07-23 | 주식회사 에프피 | Fast curing type silver paste for solar cell |
| CN113667436A (en) * | 2021-08-03 | 2021-11-19 | 海程新材料科技有限公司 | Single-component high-toughness impact-resistant epoxy resin structural adhesive and preparation method thereof |
-
2022
- 2022-10-19 CN CN202211272922.9A patent/CN115404032A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006241252A (en) * | 2005-03-01 | 2006-09-14 | Sekisui Chem Co Ltd | Epoxy resin cured product, sheet made thereof and manufacturing method of the epoxy resin cured product |
| CN110894411A (en) * | 2019-12-16 | 2020-03-20 | 苏州瑞力博新材科技有限公司 | Epoxy conductive adhesive for laminated solar module and preparation method thereof |
| CN111145934A (en) * | 2019-12-16 | 2020-05-12 | 苏州瑞力博新材科技有限公司 | Silver paste capable of being stored at room temperature and used for Heterojunction (HIT) solar cell and preparation method |
| KR20210091972A (en) * | 2020-01-15 | 2021-07-23 | 주식회사 에프피 | Fast curing type silver paste for solar cell |
| CN113667436A (en) * | 2021-08-03 | 2021-11-19 | 海程新材料科技有限公司 | Single-component high-toughness impact-resistant epoxy resin structural adhesive and preparation method thereof |
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