CN111117539B - High-adhesion low-contact-resistance conductive adhesive and heterojunction laminated solar module prepared from same - Google Patents
High-adhesion low-contact-resistance conductive adhesive and heterojunction laminated solar module prepared from same Download PDFInfo
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- CN111117539B CN111117539B CN201911291131.9A CN201911291131A CN111117539B CN 111117539 B CN111117539 B CN 111117539B CN 201911291131 A CN201911291131 A CN 201911291131A CN 111117539 B CN111117539 B CN 111117539B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 104
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 104
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 15
- 239000000178 monomer Substances 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 11
- -1 1, 3-diisopropyl imidazole tetrafluoroborate Chemical group 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 21
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 10
- 239000004593 Epoxy Substances 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 15
- 238000010030 laminating Methods 0.000 description 11
- 230000032683 aging Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a high-adhesion low-contact-resistance conductive adhesive and a heterojunction shingled solar module prepared from the conductive adhesive, wherein the conductive adhesive comprises the following components in parts by weight: epoxy resin monomer, silver powder, thixotropic agent and latent curing agent. The weight percentage of the epoxy resin monomer in the high-adhesion and low-contact-resistance conductive adhesive is 20-60%, the weight percentage of the silver powder in the high-adhesion and low-contact-resistance conductive adhesive is 40-80%, the weight percentage of the curing initiator in the high-adhesion and low-contact-resistance conductive adhesive is 0.1-3%, and the weight percentage of the thixotropic agent in the high-adhesion and low-contact-resistance conductive adhesive is 0.01-4%. The beneficial effects are as follows: the epoxy conductive adhesive with high adhesive force is prepared innovatively by using the latent type curing agent of the tetrafluoroboric acid, and meanwhile, the thixotropic agent with a special structure is selected to improve the contact characteristic between the conductive adhesive and the surface of the heterojunction solar cell, so that the contact resistance between the conductive adhesive and the heterojunction solar cell is greatly reduced.
Description
Technical Field
The invention relates to the field of polymer-based conductive materials, in particular to a high-adhesion low-contact-resistance conductive adhesive and a heterojunction shingled solar module prepared from the conductive adhesive.
Background
Heterojunction solar cells are a new and efficient solar power technology, and they are constantly refreshing world records of mass-produced solar cell conversion efficiency. The battery has low manufacturing temperature, symmetrical upper and lower surface structures, no mechanical stress, smooth realization of thinning and great potential in the future solar energy industry. However, the surface of the heterojunction solar cell is plated with an amorphous silicon layer, and the amorphous silicon layer cannot resist high temperature, so that the heterojunction solar cell is difficult to finish by applying a conventional welding process when a module is prepared. The traditional high-temperature welding process is abandoned in the technology of the laminated solar module which is gradually raised in recent years, and flexible conductive adhesive is used for realizing interconnection and electric conduction among the battery pieces, so that the laminated solar module can well solve the packaging problem of the heterojunction solar battery. However, the common conductive adhesive used for manufacturing the tiled solar module in the market at present is an acrylic conductive adhesive, and the adhesive force between the acrylic conductive adhesive and the main grid line on the surface of the heterojunction solar cell is low, so that the requirement of the common 25-year service life of the solar industry cannot be met. In addition, the wettability of the acrylic system conductive adhesive and the main grid line on the surface of the heterojunction solar cell is poor, and the acrylic system conductive adhesive cannot be bent and spread on the main grid line on the surface of the heterojunction solar cell, so that larger contact resistance can be caused, and the output power of the heterojunction laminated solar module is reduced.
As both the technology of the laminated tile solar module and the technology of the heterojunction solar module are emerging technologies, the market does not have a special conductive adhesive for the heterojunction laminated tile solar module. The invention patent with the patent application number of grant publication No. CN109439268A and the publication date of 2019, 3 and 08 provides a multifunctional polybutadiene polyurethane acrylate and a multifunctional VTBN which are used as base resins, and acrylic acid with peroxide as an initiator is used for a conductive adhesive of a laminated tile assembly, but the adhesive force of the conductive adhesive is only 4 MPa. Therefore, the preparation of the conductive adhesive with high adhesive force and low contact resistance to meet the application of the heterojunction shingled solar module has important practical significance.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a conductive adhesive with high adhesive force and low contact resistance and a heterojunction shingled solar module prepared from the conductive adhesive. The high-adhesion and low-contact-resistance conductive adhesive is an epoxy conductive adhesive based on 1, 3-diisopropyl imidazole tetrafluoroborate as a latent curing agent. Most of the traditional epoxy resin curing agents are thermal decomposition type, thermal dissolution type and cationic curing agents, and the two curing agents of the thermal decomposition type and the thermal dissolution type need large addition amount, so that the system viscosity is increased, and the conductive adhesive can not be constructed. The cationic curing agent is usually boron trifluoride, and the initiator is easy to hydrolyze, has poor water resistance, contains free acid, is corrosive to metal and has high curing temperature, so that the cationic curing agent is not favorable for being used in the process of a laminated assembly. The invention innovatively uses 1, 3-diisopropyl imidazole tetrafluoroborate as a latent curing agent, has small addition amount, does not influence the viscosity of a system, can realize quick curing, and has a series of advantages of ultrahigh bonding force and the like. In addition, siloxane is preferably used as a thixotropic agent, so that the wettability of the surfaces of the epoxy conductive adhesive and the heterojunction solar cell main grid line is greatly improved, the contact resistance between the conductive adhesive and the heterojunction solar cell is greatly reduced, and the output power of the heterojunction laminated tile assembly is improved.
The invention provides a high-adhesion low-contact-resistance conductive adhesive and a heterojunction shingled solar module prepared from the conductive adhesive, which comprises the following technical scheme:
a high-adhesion low-contact-resistance conductive adhesive and a heterojunction shingled solar module prepared from the same comprise an epoxy resin monomer, silver powder, a thixotropic agent and a latent initiator. The method is characterized in that: the weight percentage of the epoxy resin monomer in the high-adhesion and low-contact-resistance conductive adhesive is 20-60%, the weight percentage of the silver powder in the high-adhesion and low-contact-resistance conductive adhesive is 40-80%, the weight percentage of the latent initiator in the high-adhesion and low-contact-resistance conductive adhesive is 0.1-3%, and the weight percentage of the thixotropic agent in the high-adhesion and low-contact-resistance conductive adhesive is 0.01-4%. The conductive adhesive has good adhesion and extremely low contact resistance with the surface of a heterojunction solar cell, and can be used for preparing a heterojunction shingled solar module.
Wherein the latent initiator is used as 1, 3-diisopropyl imidazole tetrafluoroborate, and the weight percentage of the 1, 3-diisopropyl imidazole tetrafluoroborate in the high-adhesion and low-contact-resistance conductive adhesive is 0.1-3%.
Wherein the epoxy resin monomer comprises one or a mixture of any two of bisphenol A epoxy resin, bisphenol F epoxy resin, aliphatic epoxy resin and cyclopentadiene epoxy resin, and the weight percentage of the epoxy resin monomer in the high-adhesion low-contact-resistance conductive adhesive is 20-60%.
The silver powder is spherical silver powder or flake silver powder, the average grain diameter of the spherical silver powder is 0.1-10 um, the apparent density is 0.5-5 g/cubic centimeter, the average grain diameter of the flake silver powder is 0.5-25 um, the apparent density is 0.3-4 g/cubic centimeter, and the weight percentage of the silver powder in the high-adhesion low-contact-resistance conductive adhesive is 40-80%.
Wherein the thixotropic agent comprises one or more of alkyl polyester dimethyl siloxane, polyether modified polysiloxane and alkyl dimethyl siloxane. The weight percentage of the thixotropic agent in the high-adhesion and low-contact-resistance conductive adhesive is 0.01-4%.
The heterojunction shingled solar module uses the conductive adhesive with high adhesive force and low contact resistance as an interconnection conductive material between the battery pieces.
The implementation of the invention comprises the following technical effects:
according to the high-adhesion and low-contact-resistance conductive adhesive provided by the invention, 1, 3-diisopropyl imidazole tetrafluoroborate is innovatively used as a latent initiator to realize extremely high adhesion force, and siloxane is preferably used as a thixotropic agent to improve the wettability of the conductive adhesive and the main grid line on the surface of the heterojunction solar cell, so that the contact resistance between the conductive adhesive and the main grid line on the surface of the heterojunction solar cell is greatly reduced. The conductive adhesive provided by the invention can meet the requirements of a heterojunction shingled solar module on high adhesion and low contact resistance of the conductive adhesive, and the heterojunction shingled solar module prepared by the conductive adhesive provided by the invention has the advantages of high efficiency, high reliability and the like.
Detailed Description
The present invention will be described in detail with reference to the following examples, which are intended to facilitate the understanding of the present invention and should not be construed as limiting in any way.
The embodiment provides a conductive adhesive with high adhesive force and low contact resistance, which comprises a resin monomer, silver powder, a thixotropic agent and a latent initiator for curing the resin monomer. The specific processing process flow is as follows: accurately weighing an epoxy resin monomer and a thixotropic agent, stirring and mixing for 60 minutes in a double-planet way at 0-30 ℃, adding silver powder, continuously stirring for 60 minutes, then adding 1, 3-diisopropyl imidazole tetrafluoroborate according to the amount, stirring for 10 minutes, and performing vacuum defoaming and filling to obtain the conductive adhesive for the heterojunction shingle solar module. The specific processing technology of the heterojunction shingle assembly comprises the following steps: 5-8 mg of glue is applied to the main grid position of each small heterojunction solar cell by a spraying or silk-screen printing process, then another cell is placed on the main grid and is heated on a heating table at 150 ℃ for 30 seconds to ensure that the conductive adhesive is fully cured, and the like, the required number of laminated solar cell strings are manufactured, and a certain number of cell strings are connected in parallel end to end/in series to form a cell string group. And laminating the cell string group according to the conventional process of the module, wherein the laminating sequence is glass/EVA/solar cell string group/EVA/back plate, and finally laminating to obtain the heterojunction shingle module.
Compared with the prior art, the conductive adhesive with ultrahigh bonding force can be prepared by innovatively adopting 1, 3-diisopropyl imidazole tetrafluoroborate as a latent curing agent. In addition, siloxane is preferably used as a thixotropic agent, so that the contact resistance between the conductive adhesive and the heterojunction solar cell is greatly reduced, and the output power of the heterojunction shingle assembly is effectively improved.
The following describes a method for preparing the conductive adhesive with low density, high adhesion and low contact resistance by using a plurality of examples.
Example 1
The preparation method of the conductive adhesive with low density, high adhesive force and low contact resistance of the embodiment is that 350 g of bisphenol A type epoxy resin and 20 g of alkyl polyester dimethyl siloxane are accurately weighed and fully mixed, 620 g of flake silver powder is continuously added under the condition of double-planet stirring at the temperature of 0-30 ℃, the average particle size is 10um, and the apparent density is 2.5 g/cubic centimeter. Stirring for 60 minutes to ensure that the silver powder is uniformly dispersed in the epoxy resin, adding 20 g of 1, 3-diisopropyl imidazole tetrafluoroborate, stirring for 10 minutes, and carrying out vacuum defoaming to obtain the epoxy conductive adhesive for the shingled solar module, wherein the specific characteristics are as follows:
viscosity: 209,800mPa.s
Bonding strength: 13MPa (bonding base material is aluminum)
Density: 2.1 g/cc
Curing speed: 25 seconds (150 ℃ C.)
Volume resistivity: 4.4X 10-4Ω.cm
Contact resistance: 3X 10-7Ω.cm-2(and silver-containing low-temperature paste)
Volume resistivity after high temperature and high humidity (85 ℃, 85% RH, 1000 hours) aging: 5.8X 10-4Ω.cm
The conductive adhesive is used for preparing a heterojunction laminated tile assembly, and the specific process comprises the following steps: 5-8 mg of glue is applied to the main grid position of each small heterojunction solar cell by a spraying or silk-screen printing process, then the other cell is placed on the main grid and is heated on a heating table at 150 ℃ for 30 seconds to ensure that the conductive adhesive is fully cured, and the like, 34 laminated solar cell strings are manufactured, and each 34 cells of 5 strings are connected in parallel end to end, and then connected in series with the 34 cells of the other 5 strings in parallel end to end. And laminating the whole cell string according to the conventional assembly process, wherein the laminating sequence is glass/EVA/solar cell string/EVA/back plate. And finally, carrying out lamination to obtain the heterojunction shingle assembly.
Heterojunction stack tile assembly power:
| Isc（A） | Voc（V） | Pmax（W） | FF |
| 9.87 | 44.25 | 335.91 | 77.1 |
the bonding force of the conductive adhesive for the laminated solar module prepared in the embodiment is far higher than that of the conventional conductive adhesive, the contact resistance is far lower than that of the conventional conductive adhesive, the performance is very stable after high-temperature high-humidity aging, and the prepared heterojunction laminated solar module is high in power.
Example 2
The preparation method of the conductive adhesive with low density, high adhesion and low contact resistance of the embodiment is that 160 g of bisphenol F type epoxy resin and 4 g of polyether modified polysiloxane are accurately weighed and fully mixed, and 330 g of spherical silver powder with the average particle size of 7um and the apparent density of 3.3 g/cubic centimeter is continuously added under the condition of double-planetary stirring at the temperature of 0-30 ℃. Stirring for 60 minutes to ensure that the silver powder is uniformly dispersed in the epoxy resin, adding 8 g of 1, 3-diisopropyl imidazole tetrafluoroborate, stirring for 10 minutes, and carrying out vacuum defoaming to obtain the epoxy conductive adhesive for the shingled solar module, wherein the specific characteristics are as follows:
viscosity: 168,800mPa.s
Bonding strength: 16MPa (bonding base material is aluminum)
Density: 2.9 g/cc
Curing speed: 30 seconds (150 ℃ C.)
Volume resistivity: 6.6X 10-4Ω.cm
Contact resistance: 5X 10-7Ω.cm-2(and silver-containing low-temperature paste)
Volume resistivity after high temperature and high humidity (85 ℃, 85% RH, 1000 hours) aging: 8.9X 10-4Ω.cm
The conductive adhesive is used for preparing a heterojunction laminated tile assembly, and the specific process comprises the following steps: 5-8 mg of glue is applied to the main grid position of each small heterojunction solar cell by a spraying or silk-screen printing process, then the other cell is placed on the main grid and is heated on a heating table at 150 ℃ for 30 seconds to ensure that the conductive adhesive is fully cured, and the like, 34 laminated solar cell strings are manufactured, and each 34 cells of 5 strings are connected in parallel end to end, and then connected in series with the 34 cells of the other 5 strings in parallel end to end. And laminating the whole cell string according to the conventional assembly process, wherein the laminating sequence is glass/EVA/solar cell string/EVA/back plate. And finally, carrying out lamination to obtain the heterojunction shingle assembly.
Heterojunction stack tile assembly power:
the bonding force of the conductive adhesive for the laminated solar module prepared in the embodiment is far higher than that of the conventional conductive adhesive, the contact resistance is far lower than that of the conventional conductive adhesive, the performance is very stable after high-temperature high-humidity aging, and the prepared heterojunction laminated solar module is high in power.
Example 3
The preparation method of the conductive adhesive with low density, high adhesive force and low contact resistance of the embodiment is that 700 g of epoxy type epoxy resin and 30 g of alkyl dimethyl siloxane are accurately weighed and fully mixed, 1200 g of flake silver powder is continuously added under the condition of double-planetary stirring at the temperature of 0-30 ℃, the average particle size is 3um, and the apparent density is 1.5 g/cubic centimeter. Stirring for 60 minutes to ensure that the silver powder is uniformly dispersed in the epoxy resin, adding 50 g of 1, 3-diisopropyl imidazole tetrafluoroborate, stirring for 10 minutes, and carrying out vacuum defoaming to obtain the epoxy conductive adhesive for the shingled solar module, wherein the specific characteristics are as follows:
viscosity: 176,500mPa.s
Bonding strength: 12MPa (bonding base material is aluminum)
Density: 1.4 g/cc
Curing speed: 20 seconds (150 ℃ C.)
Volume resistivity: 3.2X 10-4Ω.cm
Contact resistance: 4X 10-7Ω.cm-2(and silver-containing low-temperature paste)
Volume resistivity after high temperature and high humidity (85 ℃, 85% RH, 1000 hours) aging: 3.8X 10-4Ω.cm
The conductive adhesive is used for preparing a heterojunction laminated tile assembly, and the specific process comprises the following steps: 5-8 mg of glue is applied to the main grid position of each small heterojunction solar cell by a spraying or silk-screen printing process, then the other cell is placed on the main grid and is heated on a heating table at 150 ℃ for 30 seconds to ensure that the conductive adhesive is fully cured, and the like, 34 laminated solar cell strings are manufactured, and each 34 cells of 5 strings are connected in parallel end to end, and then connected in series with the 34 cells of the other 5 strings in parallel end to end. And laminating the whole cell string according to the conventional assembly process, wherein the laminating sequence is glass/EVA/solar cell string/EVA/back plate. And finally, carrying out lamination to obtain the heterojunction shingle assembly.
Heterojunction stack tile assembly power:
the bonding force of the conductive adhesive for the laminated solar module prepared in the embodiment is far higher than that of the conventional conductive adhesive, the contact resistance is far lower than that of the conventional conductive adhesive, the performance is very stable after high-temperature high-humidity aging, and the prepared heterojunction laminated solar module is high in power.
Example 4
The preparation method of the conductive adhesive with low density, high adhesive force and low contact resistance of the embodiment is that 330 g of cyclopentadiene epoxy resin and 5 g of alkyl polyester dimethyl siloxane are accurately weighed and fully mixed, 700 g of spherical silver powder with the average particle size of 1um and the apparent density of 2.8 g/cubic centimeter is continuously added under the condition of double-planet stirring at the temperature of 0-30 ℃. Stirring for 60 minutes to ensure that the silver powder is uniformly dispersed in the epoxy resin, adding 8 g of 1, 3-diisopropyl imidazole tetrafluoroborate, stirring for 10 minutes, and carrying out vacuum defoaming to obtain the epoxy conductive adhesive for the shingled solar module, wherein the specific characteristics are as follows:
viscosity: 156,800mPa.s
Bonding strength: 11MPa (bonding base material is aluminum)
Density: 2.6 g/cc
Curing speed: 22 seconds (150 ℃ C.)
Volume resistivity: 3.8X 10-4Ω.cm
Contact resistance: 7X 10-7Ω.cm-2(and silver-containing low-temperature paste)
Volume resistivity after high temperature and high humidity (85 ℃, 85% RH, 1000 hours) aging: 5.9X 10-4Ω.cm
The conductive adhesive is used for preparing a heterojunction laminated tile assembly, and the specific process comprises the following steps: 5-8 mg of glue is applied to the main grid position of each small heterojunction solar cell by a spraying or silk-screen printing process, then the other cell is placed on the main grid and is heated on a heating table at 150 ℃ for 30 seconds to ensure that the conductive adhesive is fully cured, and the like, 34 laminated solar cell strings are manufactured, and each 34 cells of 5 strings are connected in parallel end to end, and then connected in series with the 34 cells of the other 5 strings in parallel end to end. And laminating the whole cell string according to the conventional assembly process, wherein the laminating sequence is glass/EVA/solar cell string/EVA/back plate. And finally, carrying out lamination to obtain the heterojunction shingle assembly.
Heterojunction stack tile assembly power:
| Isc（A） | Voc（V） | Pmax（W） | FF |
| 9.76 | 44.66 | 336.93 | 77.3 |
the bonding force of the conductive adhesive for the laminated solar module prepared in the embodiment is far higher than that of the conventional conductive adhesive, the contact resistance is far lower than that of the conventional conductive adhesive, the performance is very stable after high-temperature high-humidity aging, and the prepared heterojunction laminated solar module is high in power.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (4)
1. A conductive adhesive with high adhesive force and low contact resistance comprises an epoxy resin monomer, silver powder, a thixotropic agent and a latent initiator; the method is characterized in that: the latent initiator is 1, 3-diisopropyl imidazole tetrafluoroborate, and the weight percentage of the latent initiator in the high-adhesion and low-contact-resistance conductive adhesive is 0.1-3%; the thixotropic agent comprises one or two of polyether modified polysiloxane and alkyl dimethyl siloxane, and the weight percentage of the thixotropic agent in the high-adhesion low-contact-resistance conductive adhesive is 0.01-4%; the weight percentage of the epoxy resin monomer in the high-adhesion and low-contact-resistance conductive adhesive is 20-60%; the weight percentage of the silver powder in the high-adhesion low-contact-resistance conductive adhesive is 40-80%.
2. The conductive adhesive with high adhesion and low contact resistance as claimed in claim 1, wherein: the epoxy resin monomer comprises one or a mixture of any two of bisphenol A epoxy resin, bisphenol F epoxy resin, aliphatic epoxy resin and cyclopentadiene epoxy resin.
3. The conductive adhesive with high adhesion and low contact resistance as claimed in claim 1, wherein: the silver powder is spherical silver powder or flake silver powder, the average grain diameter of the spherical silver powder is 0.1-10 um, the apparent density is 0.5-5 g/cubic centimeter, the average grain diameter of the flake silver powder is 0.5-25 um, and the apparent density is 0.3-4 g/cubic centimeter.
4. The conductive adhesive with high adhesion and low contact resistance as claimed in claim 1, wherein: the conductive adhesive has good adhesion and extremely low contact resistance with the surface of the heterojunction solar cell, and is used for preparing a heterojunction shingled solar module.
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