CN115401360A - Welding material for photovoltaic laminated tile assembly and preparation method thereof - Google Patents
Welding material for photovoltaic laminated tile assembly and preparation method thereof Download PDFInfo
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- CN115401360A CN115401360A CN202211168153.8A CN202211168153A CN115401360A CN 115401360 A CN115401360 A CN 115401360A CN 202211168153 A CN202211168153 A CN 202211168153A CN 115401360 A CN115401360 A CN 115401360A
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- powder
- rosin
- flux
- conductive
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- 239000000463 material Substances 0.000 title claims abstract description 43
- 238000003466 welding Methods 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000000843 powder Substances 0.000 claims abstract description 77
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 44
- 239000000956 alloy Substances 0.000 claims abstract description 44
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 27
- 239000000203 mixture Substances 0.000 claims abstract description 12
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 31
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 31
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 31
- 238000002844 melting Methods 0.000 claims description 22
- 230000004907 flux Effects 0.000 claims description 21
- 230000008018 melting Effects 0.000 claims description 21
- 239000013008 thixotropic agent Substances 0.000 claims description 15
- 239000003906 humectant Substances 0.000 claims description 13
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 12
- 239000000654 additive Substances 0.000 claims description 12
- 230000000996 additive effect Effects 0.000 claims description 12
- 239000003963 antioxidant agent Substances 0.000 claims description 12
- 230000003078 antioxidant effect Effects 0.000 claims description 12
- 230000007797 corrosion Effects 0.000 claims description 12
- 238000005260 corrosion Methods 0.000 claims description 12
- 239000003112 inhibitor Substances 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 12
- 239000012190 activator Substances 0.000 claims description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 5
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 4
- 239000001361 adipic acid Substances 0.000 claims description 4
- 235000011037 adipic acid Nutrition 0.000 claims description 4
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 4
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 4
- 235000002906 tartaric acid Nutrition 0.000 claims description 4
- 239000011975 tartaric acid Substances 0.000 claims description 4
- 229940116411 terpineol Drugs 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- QKKSKKMOIOGASY-UHFFFAOYSA-N 2,3-dibromobut-1-ene-1,1-diol Chemical compound CC(Br)C(Br)=C(O)O QKKSKKMOIOGASY-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007872 degassing Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- YZASAXHKAQYPEH-UHFFFAOYSA-N indium silver Chemical compound [Ag].[In] YZASAXHKAQYPEH-UHFFFAOYSA-N 0.000 claims description 3
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 3
- 229940099259 vaseline Drugs 0.000 claims description 3
- QAQSNXHKHKONNS-UHFFFAOYSA-N 1-ethyl-2-hydroxy-4-methyl-6-oxopyridine-3-carboxamide Chemical compound CCN1C(O)=C(C(N)=O)C(C)=CC1=O QAQSNXHKHKONNS-UHFFFAOYSA-N 0.000 claims description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 2
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 claims description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- 239000004359 castor oil Substances 0.000 claims description 2
- 235000019438 castor oil Nutrition 0.000 claims description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 2
- 229920000136 polysorbate Polymers 0.000 claims description 2
- 229960004889 salicylic acid Drugs 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 239000004250 tert-Butylhydroquinone Substances 0.000 claims description 2
- 235000019281 tert-butylhydroquinone Nutrition 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims 9
- 230000000712 assembly Effects 0.000 claims 3
- 238000000429 assembly Methods 0.000 claims 3
- 229910000743 fusible alloy Inorganic materials 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 229910052709 silver Inorganic materials 0.000 abstract description 10
- 239000004332 silver Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- -1 silver ions Chemical class 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002503 electroluminescence detection Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000000687 hydroquinonyl group Chemical group C1(O)=C(C=C(O)C=C1)* 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the field of photovoltaic module connecting materials, in particular to a welding material for a photovoltaic laminated module and a preparation method thereof. The welding material consists of conductive powder and fluxing agent; the mass percent of the conductive powder in the welding material is 80-92 wt.%, the conductive powder is low-melting-point alloy powder or a mixture of the low-melting-point alloy powder and silver powder, and the mass percent of the silver powder in the conductive powder is 0-8 wt.%. According to the invention, the low-melting-point alloy powder is adopted to replace or partially replace the welding material of the silver powder, so that the effect of the conductive silver adhesive can be realized, the material cost and the welding temperature are reduced, the problems of brittle sheet hidden cracking and the like caused by thermal stress are reduced when the prepared assembly is welded at a low temperature, and the bonding strength and the welding stability of the assembly are higher.
Description
Technical Field
The invention relates to the field of photovoltaic module connecting materials, in particular to a welding material for a photovoltaic laminated module and a preparation method thereof.
Background
Solar energy is an environment-friendly and inexhaustible energy, is an important development direction for replacing conventional oil and gas energy by human beings, and is an important mode of photoelectric conversion. At present, the crystalline silicon solar cell is relatively mature, and in order to improve the photoelectric conversion efficiency of the crystalline silicon solar cell, researchers expect to improve the module power as much as possible under the same cell module area so as to reduce the transportation cost, the installation cost and the like. Therefore, the laminated assembly is produced by cutting the originally used large battery piece into small battery pieces, then connecting the small battery pieces together through soldering tin or conductive adhesive, and then combining the small battery pieces into an assembly through series connection and parallel connection.
The surface of the laminated assembly is not provided with metal grid lines, the battery pieces are in seamless connection, and 13% of battery pieces are packaged more. The traditional crystal silicon assembly is connected by adopting metal grid lines, and the cell spacing of about 2-3 mm is generally reserved. The laminated assembly cuts the traditional battery plate into 4-5 plates, and the edge area of the front surface and the back surface of the battery is made into a main grid, and at present, the front surface edge of the previous battery plate and the back surface edge of the next battery plate are mainly interconnected by using a special conductive adhesive so as to omit welding of welding strips. The imbrication technology has the advantages of increasing the light receiving area, effectively increasing the light receiving area and improving the photoelectric conversion rate.
Because the stack assembly eliminates the gaps among the battery pieces, the effective battery piece capacity of the assembly is increased, and the stack assembly improves the assembly power greatly compared with the traditional welding assembly with welding strips. However, the temperature of soldering is above 300 ℃, and since soldering is performed on one side of the battery piece, huge thermal stress is instantaneously generated on the front and back sides of the battery piece, the battery piece is seriously bent, and even the battery piece is hidden and cracked, so that the yield is reduced, and the cost is increased. Although the conductive adhesive has the characteristics of low curing temperature, good flexibility and no too large stress generated during bonding, and is an effective method for solving the problems of the laminated assembly, the laminated conductive adhesive in the current market has the advantages that the silver content is over 70 percent by taking silver powder as a conductive filler, the raw material cost is high, the contact resistance is large after the laminated conductive adhesive is used, the stability is poor, the bonding mechanical property is poor, silver ions are easy to migrate, and the like, so that the performance and the competitive advantage of the laminated assembly are seriously influenced. At present, a product capable of replacing conductive silver adhesive for a laminated tile assembly is urgently needed to be provided, and the problems of large contact resistance, poor stability, poor bonding mechanical property, easy migration of silver ions and the like are solved.
Disclosure of Invention
In order to solve the technical problems, the invention provides a welding material for a photovoltaic laminated assembly and a preparation method thereof.
The welding material for the photovoltaic laminated tile assembly provided by the invention comprises conductive powder and fluxing agent; the mass percent of the conductive powder in the welding material is 80-92 wt.%, the conductive powder is low-melting-point alloy powder or a mixture of the low-melting-point alloy powder and silver powder, and the mass percent of the silver powder in the conductive powder is 0-8 wt.%. According to the invention, the conductive powder is uniformly dispersed and mixed in the fluxing agent, the fluxing agent plays a role in advance when the welding material is used at a certain working condition temperature, conditions are created for melting and welding the conductive powder, and the welding material can be well used for replacing conductive silver adhesive for a laminated tile assembly. The invention uses the low-melting-point alloy powder to replace or partially replace the welding material of the silver powder, can realize the effect of the conductive silver adhesive, and reduces the material cost and the welding temperature. The assembly prepared by the welding material can solve the problems of large contact resistance, poor stability, poor bonding mechanical property, easy migration of silver ions and the like, and has higher bonding strength and welding stability.
Preferably, the mass percentage of the conductive powder in the welding material is 80wt.% to 89wt.%, and more preferably 82wt.% to 85wt.%.
Preferably, the conductive powder is a low melting point alloy powder having a melting point of less than 200 ℃, or a mixture of a low melting point alloy powder having a melting point of less than 200 ℃ and silver powder.
More preferably, the melting point of the conductive powder is 80 to 180 ℃.
Further preferably, the low-melting point alloy powder is selected from one or a mixture of several of indium tin-based alloy, indium silver-based alloy and tin-based alloy.
Preferably, when the conductive powder is a mixture of low-melting-point alloy powder and silver powder, the silver powder accounts for 3wt.% to 8wt.% of the conductive powder, and more preferably 3wt.% to 6.5wt.%. According to the invention, the specific amount of silver powder added into the low-melting-point alloy powder can enhance the conductivity of the connecting point and reduce the phenomenon of material ratio change caused by silver ion migration, thereby improving the stability and feasibility of the connecting point.
Preferably, the low-melting-point alloy powder is selected from one or a mixture of several of indium-tin-based alloy, indium-silver-based alloy and tin-based alloy. Compared with the conductive connection of a small amount of silver powder in the modes of conductive silver paste and the like, the conductive powder is used as the metal material for conductive connection of the laminated tile assembly, and the electrical property and the stability effect of the connection point are better.
More preferably, the low melting point alloy powder is In-48Sn alloy powder, in-3Ag alloy powder, in-Ag-Cu alloy powder, in-Sn-Cu powder, or the like.
More preferably, the grain diameter of the low-melting-point alloy powder is less than or equal to 45 mu m; preferably, the particle size of the low-melting-point alloy powder is 10-35 μm.
Further preferably, the fluxing agent comprises a solvent, rosin, an activator, a surfactant, a corrosion inhibitor, an antioxidant, an additive, a humectant and a thixotropic agent. The fluxing agent adopted by the invention has the main functions of assisting the melting of the conductive powder and providing welding conditions for the conductive powder.
More preferably, the ratio of the solvent in the flux is 18wt.% to 35wt.%, the ratio of the rosin in the flux is 15wt.% to 40wt.%, the ratio of the activator in the flux is 15wt.% to 25wt.%, the ratio of the surfactant in the flux is 0.2wt.% to 4wt.%, the ratio of the corrosion inhibitor in the flux is 1wt.% to 3wt.%, the ratio of the antioxidant in the flux is 1wt.% to 3wt.%, the ratio of the additive in the flux is 1wt.% to 5wt.%, the ratio of the humectant in the flux is 0.5wt.% to 2wt.%, and the balance of the thixotropic agent in the flux is the thixotropic agent.
Further preferably, the solvent accounts for 27.5wt.% to 34.5wt.% of the flux; the proportion of the activator in the fluxing agent is 19.5-28 wt%; the proportion of the surfactant in the fluxing agent is 0.5-1.5 wt%; the proportion of the corrosion inhibitor in the fluxing agent is 1.5-2.2 wt%; the proportion of the antioxidant in the fluxing agent is 1.0-1.5 wt%; the proportion of the additive in the fluxing agent is 3.8-4.5 wt.%; the proportion of the humectant in the fluxing agent is 0.7-1.4 wt.%.
Further preferably, the solvent is selected from one or more of isopropanol, ethylene glycol, methyl ether, n-butanol, propylene glycol, butyl acetate and terpineol; the activator is selected from one or more of malonic acid, adipic acid, glutaric acid, stearic acid, tartaric acid, huang Ji salicylic acid and triethanolamine; the rosin is one or more selected from water white rosin, hydrogenated rosin, gum rosin, KE-604 rosin, AX rosin, KR-610 rosin and pentaerythritol rosin; the surfactant is selected from one or more of OP10, tween, dibromobutenediol and cetylpyridinium bromide; the corrosion inhibitor is selected from one or more of benzotriazole and benzimidazole; the antioxidant is selected from one or more of hydroquinone and tert-butyl hydroquinone; the additive is selected from one or more of vaseline and glycerol; the humectant is selected from one or more of AP8, castor oil and span 85; the thixotropic agent is an ST thixotropic agent.
The invention also provides a preparation method of the welding material, which comprises the following steps: mixing, stirring and heating the solvent, the rosin, the activator, the surfactant, the corrosion inhibitor, the antioxidant, the additive, the humectant and the thixotropic agent in proportion, cooling and grinding to obtain the fluxing agent, mixing the conductive powder and the fluxing agent weighed according to a certain proportion, stirring, vacuumizing and degassing to obtain the welding material.
The invention has the beneficial effects that: according to the invention, silver powder is replaced or partially replaced by low-melting-point alloy powder with lower cost, so that the effect of conductive silver adhesive is realized, the material cost and the welding temperature are reduced, the problems of brittle sheet hidden cracking and the like caused by thermal stress are reduced by welding the prepared assembly at low temperature, and the bonding strength and the welding stability of the assembly are higher.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and the following embodiments are used for illustrating the present invention and are not intended to limit the scope of the present invention. The examples do not show the specific techniques or conditions, according to the technical or conditions described in the literature in the field, or according to the product specifications. The reagents or instruments used are conventional products available from regular distributors, not indicated by the manufacturer.
The proportion of the low-melting-point alloy powder provided by the embodiment of the invention is only a brief representation of a certain material system, and the material proportion of the system meeting the melting point requirement range meets the requirements of the embodiment. In the present invention, the ratio refers to a mass ratio unless otherwise specified.
Example 1
The embodiment provides a welding material for replacing conductive silver adhesive for a laminated tile assembly, which is composed of conductive powder and fluxing agent. The mass percent of the conductive powder in the welding material is 83.6wt.%, and the balance is fluxing agent. The conductive powder is uniformly dispersed and mixed in the fluxing agent, and the fluxing agent plays a role in advance when the conductive powder is used under a certain working condition temperature to create conditions for melting and welding the conductive powder.
The conductive powder is In-48Sn alloy powder with the melting point of 120 ℃, and the particle size of the powder is 25-45 mu m.
The fluxing agent consists of 32.5wt.% of solvent, 33wt.% of rosin, 23wt.% of activating agent, 0.5wt.% of surfactant, 2wt.% of corrosion inhibitor, 1wt.% of antioxidant, 4wt.% of additive, 1wt.% of humectant and 3wt.% of thixotropic agent. The used solvents are isopropanol, n-butanol, propylene glycol and terpineol, and the proportion of the isopropanol: n-butanol: propylene glycol: terpineol =5.5:5.5:2:2; the activator is glutaric acid, adipic acid, tartaric acid and triethanolamine, and the proportion is glutaric acid: adipic acid: tartaric acid: triethanolamine =5.5:2.5:1:1; the rosin is water white rosin, KE-604 rosin and gum rosin, and the proportion is water white rosin: crude Chuanke-604 rosin: gum rosin =7, 1.5, and the surfactant used is dibromobutenediol; the corrosion inhibitor is benzotriazole; the antioxidant is hydroquinone; the additive is vaseline; the humectant is AP8 humectant; the thixotropic agent used is the ST thixotropic agent.
The embodiment also provides a preparation process of the welding material: weighing the components of the fluxing agent according to the proportion, mixing, stirring and heating the components In sequence according to the proportion, grinding the components for multiple times after cooling to obtain the fluxing agent, adding the weighed In-48Sn alloy powder into the fluxing agent, uniformly dispersing and mixing the fluxing agent and the In-48Sn alloy powder by using a homogenizer device, and vacuumizing and degassing to obtain the welding material.
Example 2
The present embodiment is different from embodiment 1 in that: the conductive powder is a mixture of melting points 118 ℃ and 960 ℃ of In-48Sn alloy powder with the particle size of 15-35 mu m, wherein the silver powder accounts for 3.4 wt% of the conductive powder.
Example 3
The present embodiment is different from embodiment 1 in that: the conductive powder is formed by 33wt.% of solvent, 31wt.% of rosin, 25wt.% of activator, 1wt.% of surfactant, 1.5wt.% of corrosion inhibitor, 1wt.% of antioxidant, 3.5wt.% of additive, 1.2wt.% of humectant, 2.8wt.% of thixotropic agent and the like when the melting point of the In-3Ag alloy powder with the particle size of 25-40 mu m is 147 ℃.
Example 4
The present embodiment is different from embodiment 3 in that: the conductive powder is a mixture of an In-3Ag alloy powder with the particle size of 25-40 mu m and a silver powder with the melting point of 147 ℃ and 960 ℃, and the silver powder accounts for 6.5 wt% of the conductive powder.
Example 5
The present embodiment is different from embodiment 3 in that: the conductive powder is In-1.7Ag-0.39Cu alloy powder with the grain diameter of 10-30 mu m, and the melting point is 147 ℃.
Comparative example 1
The comparative example is a commercially available silicone system conductive paste.
Comparative example 2
The comparative example is a commercially available acrylic system conductive adhesive.
The components are prepared according to the photovoltaic industry tiling process in the embodiments and the comparative examples, the welded components adopt overcurrent capacity detection, TC200 and DH1000 tests, EL detection and the like, and the test results are shown in Table 1:
TABLE 1 results of performance test of examples and comparative examples
Although the invention has been described in detail hereinabove with respect to a general description and specific embodiments thereof, it will be apparent to those skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (10)
1. A welding material for a photovoltaic laminated tile assembly, characterized in that the welding material consists of conductive powder and fluxing agent; the mass percent of the conductive powder in the welding material is 80-92 wt.%, the conductive powder is low-melting-point alloy powder or a mixture of the low-melting-point alloy powder and silver powder, and the mass percent of the silver powder in the conductive powder is 0-8 wt.%.
2. The fusion material for a photovoltaic shingle assembly according to claim 1, wherein the conductive powder comprises 80wt.% to 89wt.%, preferably 82wt.% to 85wt.%, of the mass of the fusion material.
3. The fusion material for photovoltaic stack assemblies according to claim 1, wherein the conductive powder is a low melting point alloy powder having a melting point below 200 ℃ or a mixture of a low melting point alloy powder having a melting point below 200 ℃ and silver powder.
4. The fusion material for photovoltaic shingle assemblies according to claim 3, wherein when the conductive powder is a mixture of low melting point alloy powder and silver powder, the silver powder accounts for 3wt.% to 8wt.% of the conductive powder.
5. The fusion material for photovoltaic stack modules according to claim 3, wherein the low melting point alloy powder is selected from one or a mixture of several alloys of indium-tin-based alloy, indium-silver-based alloy, tin-based alloy.
6. The fusion material for a photovoltaic shingle assembly of claim 5, wherein the low-melting alloy powder has a particle size of 45 μm or less; preferably, the particle size of the low-melting-point alloy powder is 10-35 μm.
7. The fusion material for a photovoltaic shingle assembly according to any of claims 1 to 6, wherein the flux comprises a solvent, rosin, an activator, a surfactant, a corrosion inhibitor, an antioxidant, an additive, a humectant, and a thixotropic agent.
8. The flux material for a photovoltaic shingle assembly as defined in claim 7 wherein the solvent is present in the flux in a ratio of 18wt.% to 35wt.%, the rosin is present in the flux in a ratio of 15wt.% to 40wt.%, the activator is present in the flux in a ratio of 15wt.% to 25wt.%, the surfactant is present in the flux in a ratio of 0.2wt.% to 4wt.%, the corrosion inhibitor is present in the flux in a ratio of 1wt.% to 3wt.%, the antioxidant is present in the flux in a ratio of 1wt.% to 3wt.%, the additive is present in the flux in a ratio of 1wt.% to 5wt.%, the humectant is present in the flux in a ratio of 0.5wt.% to 2wt.%, and the remainder of the flux is the thixotropic agent.
9. The fusion material for a photovoltaic shingle assembly according to claim 7 or 8, wherein the solvent is selected from one or more of isopropyl alcohol, ethylene glycol, methyl ether, n-butanol, propylene glycol, butyl acetate, terpineol; the activator is selected from one or more of malonic acid, adipic acid, glutaric acid, stearic acid, tartaric acid, huang Ji salicylic acid and triethanolamine; the rosin is one or more selected from water white rosin, hydrogenated rosin, gum rosin, KE-604 rosin, AX rosin, KR610 rosin and pentaerythritol rosin; the surfactant is selected from one or more of OP10, tween, dibromobutenediol and cetylpyridinium bromide; the corrosion inhibitor is selected from one or more of benzotriazole and benzimidazole; the antioxidant is selected from one or more of hydroquinone and tert-butyl hydroquinone; the additive is selected from one or more of vaseline and glycerol; the humectant is selected from one or more of AP8, castor oil and span 85; the thixotropic agent is an ST thixotropic agent.
10. A method of producing a fusion material for photovoltaic shingle assemblies as recited in any of claims 1 to 9, comprising: mixing, stirring and heating the solvent, the rosin, the activator, the surfactant, the corrosion inhibitor, the antioxidant, the additive, the humectant and the thixotropic agent in proportion, cooling and grinding to obtain the fluxing agent, mixing the conductive powder and the fluxing agent weighed according to a certain proportion, stirring, vacuumizing and degassing to obtain the welding material.
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