CN115390316A - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN115390316A CN115390316A CN202211193152.9A CN202211193152A CN115390316A CN 115390316 A CN115390316 A CN 115390316A CN 202211193152 A CN202211193152 A CN 202211193152A CN 115390316 A CN115390316 A CN 115390316A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133611—Direct backlight including means for improving the brightness uniformity
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The application provides a backlight module, backlight module includes the backplate and is located the light-emitting component of backplate, and light-emitting component is used for sending basic light. The backlight module further comprises an optical film component and a quantum dot film layer which are arranged on the light emitting side of the light emitting component, and the optical film component, the quantum dot film layer and the light emitting component are arranged in a stacked mode. The orthographic projection of the light-emitting component on the back plate is at least positioned in the orthographic projection of the quantum dot film layer on the back plate, so that basic light emitted by the light-emitting component can penetrate through the quantum dot film layer to be converted into white light, and the blue light of the backlight module is avoided. The orthographic projection of the light-emitting component on the back plate is at least positioned in the orthographic projection of the optical membrane component on the back plate, so that the white light converted from the basic light can penetrate through the optical membrane component, the optical membrane component enables the white light to be more uniform, and bright edges of the backlight module are avoided. The application also provides a display device with the backlight module.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a backlight module and a display device having the same.
Background
With the continuous development of display technologies, people pay more and more attention to the appearance of displays, and the appearance of displays mainly develops towards the direction of lightness, thinness and narrow frames. In recent years, a sub-millimeter Light-Emitting Diode (Mini LED) display is developed, which mainly comprises a Mini LED backlight module and a liquid crystal display panel. Because the Mini LED backlight module combines the quantum dot technology and the backlight massive partition technology, the Mini LED display has better picture quality, and the Mini LED display also has the advantages of lower cost, higher reliability, longer service life and the like.
At present, the most widely used Mini LED backlight module is a direct type backlight module, which mainly converts blue light into white backlight with high color gamut through a quantum dot film, but the existing Mini LED backlight module has the condition of blue light leakage or bright edge.
Therefore, the problem that how to solve the problem of blue light leakage or bright edge of the Mini LED backlight module needs to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of the above deficiencies of the prior art, the present application provides a backlight module and a display device having the same, which aims to solve the problem of blue light leakage or bright edge leakage of the Mini LED backlight module in the prior art.
In order to solve the above technical problem, an embodiment of the present application provides a backlight module, where the backlight module includes a back plate and a light emitting assembly located in the back plate, and the light emitting assembly is configured to emit basic light. Backlight unit is still including set up in the optics diaphragm subassembly and the quantum dot rete of light-emitting component's light-emitting side, optics diaphragm subassembly the quantum dot rete and the range upon range of setting of light-emitting component, light-emitting component is in orthographic projection on the backplate is located at least optics diaphragm subassembly is in orthographic projection on the backplate and being located at least the quantum dot rete is in orthographic projection on the backplate. The quantum dot film layer is used for converting the basic light emitted by the light-emitting component into white light, and the optical film component is used for enabling the white light to be uniform.
To sum up, the backlight module that this application embodiment provided includes the backplate and is located the light emitting component of backplate, and light emitting component is used for sending basic light. The backlight module further comprises an optical film assembly and a quantum dot film layer, wherein the optical film assembly and the quantum dot film layer are arranged on the light emitting side of the light emitting assembly, and the optical film assembly, the quantum dot film layer and the light emitting assembly are arranged in a stacked mode. The orthographic projection of the light-emitting component on the back plate is at least positioned in the orthographic projection of the quantum dot film layer on the back plate, so that basic light emitted by the light-emitting component can penetrate through the quantum dot film layer to be converted into white light, and the blue light of the backlight module is avoided. The orthographic projection of the light-emitting component on the back plate is at least positioned in the orthographic projection of the optical membrane component on the back plate, so that the white light converted from the basic light can penetrate through the optical membrane component, the optical membrane component enables the white light to be more uniform, and bright edges of the backlight module are avoided.
In an exemplary embodiment, the back plate includes a back plate body, a first side plate assembly, and a second side plate assembly. The first side plate assembly is arranged around the periphery of the back plate main body in a surrounding mode, the second side plate assembly is arranged on one side, back to the back plate main body, of the first side plate assembly, and the inner side face of the second side plate assembly is located in the outer side of the orthographic projection of the inner side face of the first side plate assembly on the back plate main body, so that the first side plate assembly is back to the surface of the back plate main body to form a carrying face. The backlight module further comprises a diffusion layer, wherein the diffusion layer is erected on the carrying surface and is located between the light-emitting component and the quantum dot film layer.
In an exemplary embodiment, the back plate includes a back plate body, a first side plate assembly, and a second side plate assembly. The first side plate component is arranged around the periphery of the back plate main body in a surrounding mode, and the second side plate component is arranged on the back plate main body and located on the inner side of the first side plate component. The second side plate component comprises a first inner side face and a second inner side face, the first inner side face is connected with the surface of the back plate main body, where the light-emitting component is arranged, and the second inner side face is connected to one side, back to the back plate main body, of the first inner side face. The second inner side face inclines towards the outer side face of the second side plate assembly in the direction away from the first inner side face, and the inclination angle of the second inner side face is matched with the light emitting angle of the light emitting assembly.
In an exemplary embodiment, the second inner side surface may be inclined at an angle of 40 to 80 degrees.
In an exemplary embodiment, the backlight module further includes a reflective layer disposed on the first inner side surface and the second inner side surface, and the reflective layer is configured to reflect the basic light emitted by the light emitting element and reflect the white light converted from the basic light.
In an exemplary embodiment, the backplate includes a backplate main body and a rim component, and the rim component is arranged around the periphery of the backplate main body. The backlight module further comprises a first rubber frame and a second rubber frame, the first rubber frame is arranged on one side, back to the back plate main body, of the frame component, and the second rubber frame is arranged on the back plate main body and located on the inner side of the frame component. The second rubber frame comprises a first inner surface and a second inner surface, the first inner surface is connected with the surface of the back plate main body, which is provided with the light-emitting assembly, and the second inner surface is connected to one side, back to the back plate main body, of the first inner surface. The second inner surface is inclined towards the direction of the outer side surface of the second rubber frame in the direction away from the first inner surface, and the inclination angle of the second inner surface is matched with the light emitting angle of the light emitting assembly.
In an exemplary embodiment, the second inner surface is inclined at an angle of 40 to 80 degrees.
In an exemplary embodiment, a black paint layer is disposed on a surface of the first adhesive frame to shield the basic light and the white light. The first inner surface and the second inner surface are provided with white paint layers, the first inner surface reflects the basic light emitted by the light-emitting component, and the second inner surface reflects the white light converted from the basic light.
In an exemplary embodiment, the backlight module further includes a fixing layer disposed between the optical film assembly and the quantum dot film layer, and the fixing layer is used for bonding the optical film assembly and the quantum dot film layer.
Based on the same inventive concept, the embodiment of the present application further provides a display device, where the display device includes a display panel and the backlight module, the display panel is disposed on the light emitting side of the backlight module, and the display panel is configured to display an image under the backlight provided by the backlight module.
To sum up, the display device that this application embodiment provided includes display panel and foretell backlight unit, backlight unit includes the backplate and is located the light emitting component of backplate, and light emitting component is used for sending basic light. The backlight module further comprises an optical film component and a quantum dot film layer which are arranged on the light emitting side of the light emitting component, and the optical film component, the quantum dot film layer and the light emitting component are arranged in a stacked mode. The orthographic projection of the light-emitting component on the back plate is at least positioned in the orthographic projection of the quantum dot film layer on the back plate, so that basic light emitted by the light-emitting component can penetrate through the quantum dot film layer to be converted into white light, and the blue light of the backlight module is avoided. The orthographic projection of the light-emitting component on the back plate is at least positioned in the orthographic projection of the optical membrane component on the back plate, so that the white light converted from the basic light can penetrate through the optical membrane component, the optical membrane component enables the white light to be more uniform, and bright edges of the backlight module are avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic view of a first layer structure of a display device disclosed in an embodiment of the present application;
fig. 2 is a schematic diagram of a second layer structure of a display device disclosed in an embodiment of the present application;
fig. 3 is a schematic diagram of a third layer structure of a display device disclosed in the embodiment of the present application.
Description of reference numerals:
1. 2, 3-display device; 10-a backlight module; 20-a display panel; 21-an array substrate; 22-a color substrate; 101-a carrying surface; 110-a back-plate; 111-a back plate body; 113-a first side panel assembly; 115-a second side panel assembly; 115 a-a first medial side; 115 b-a second medial side; 117-bezel components; 120-a light emitting component; 121-a drive substrate; 123-a light emitting element; 125-an encapsulation layer; 140-an optical film assembly; 150-quantum dot film layer; 170-a fixing layer; 180-a diffusion layer; 190-cushion, 210-reflective layer; 230-a first rubber frame; 240-second rubber frame; 240 a-a first inner surface; 240 b-second inner surface.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). Directional phrases referred to in this application, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," and the like, refer to the orientation of the appended drawings and are therefore used in a better and clearer sense of description and understanding of the present application, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered limiting of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. It should be noted that the terms "first", "second", and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "comprises," "comprising," "includes," "including," or "can include" when used in this application, specify the presence of stated features, operations, elements, and the like, and do not limit one or more other features, operations, elements, and the like. Furthermore, the terms "comprises" or "comprising" indicate the presence of the respective features, numbers, steps, operations, elements, components or combinations thereof disclosed in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components or combinations thereof, and are intended to cover non-exclusive inclusions. It is also to be understood that the term "at least one" as used herein means one and more than one, such as one, two or three, etc., and the term "plurality" means at least two, such as two or three, etc., unless specifically limited otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Referring to fig. 1, fig. 1 is a schematic diagram of a first layer structure of a display device according to an embodiment of the disclosure. The display device 1 provided by the embodiment of the application at least comprises a backlight module 10 and a display panel 20, wherein the display panel 20 is arranged on the light emergent side of the backlight module 10, and the display panel 20 is used for displaying images under backlight provided by the backlight module 10.
In the embodiment of the present application, the display panel 20 may include at least an array substrate 21 and a color substrate 22, which are stacked, wherein the array substrate 21 is disposed on the backlight module 10, and the color substrate 22 is disposed on a side of the array substrate 21 opposite to the backlight module 10. The array substrate 21 is used for controlling electrical signals, and the color substrate 22 is used for displaying colors.
It is understood that the display device 1 can be used in electronic devices including, but not limited to, tablet computers, notebook computers, desktop computers, and the like. According to the embodiment of the present invention, the specific type of the display device 1 is not particularly limited, and those skilled in the art can design the display device according to the specific use requirement of the display device 1, and the details are not repeated herein.
In an exemplary embodiment, the display device 1 may further include other necessary components and components such as a driving board, a power board, a high voltage board, a key control board, etc., and those skilled in the art may perform corresponding supplementation according to the specific type and actual functions of the display device 1, which will not be described herein again.
In the embodiment of the present application, the backlight module 10 may include at least a back plate 110 and at least one light emitting assembly 120 located in the back plate 110, where the light emitting assembly 120 is configured to emit a basic light.
In the embodiment of the present application, the backlight module 10 further includes an optical film component 140 and a quantum dot film layer 150 disposed on the light emitting side of the light emitting component 120, the optical film component 140, the quantum dot film layer 150 and the light emitting component 120 are stacked, that is, the optical film component 140 is disposed on the surface of the quantum dot film layer 150 facing away from the light emitting component 120. The peripheral side surface of the optical film assembly 140 is flush with the peripheral side surface of the quantum dot film layer 150, and the orthographic projection of the light emitting assembly 120 on the back plate 110 is at least located in the orthographic projection of the optical film assembly 140 on the back plate 110 and at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110. That is, the orthographic projection of the light emitting element 120 on the back plate 110 is located within the orthographic projection of the quantum dot film layer 150 on the back plate 110, or the orthographic projection of the light emitting element 120 on the back plate 110 is coincident with the orthographic projection of the quantum dot film layer 150 on the back plate 110. The quantum dot film layer 150 is used to convert the basic light emitted from the light emitting component 120 into white light, and the optical film component 140 is used to make the white light more uniform.
It is understood that the orthographic projection of the light emitting assembly 120 on the back plate 110 is at least within the orthographic projection of the quantum dot film layer 150 on the back plate 110. That is, the quantum dot film layer 150 may just completely cover or excessively cover the light emitting element 120, so that the basic light emitted from the light emitting element 120 may pass through the quantum dot film layer 150. Wherein, the excessive covering means that the periphery of the quantum dot film layer 150 protrudes out of the light emitting component 120. It can also be understood that the peripheral side surface of the optical film assembly 140 is flush with the peripheral side surface of the quantum dot film layer 150, so that the size of the orthographic projection of the optical film assembly 140 on the back plate 110 can be prevented from being larger or smaller than the size of the orthographic projection of the quantum dot film layer 150 on the back plate 110, and the bezel of the backlight module 10 is prevented from being too wide, so as to realize a narrow bezel.
In an exemplary embodiment, the optical film assembly 140 is disposed on a side of the quantum dot film layer 150 opposite to the light emitting assembly 120, and is spaced apart from the display panel 20. In other embodiments of the present disclosure, the quantum dot film layer 150 is disposed on a side of the optical film assembly 140 opposite to the light emitting assembly 120, which is not particularly limited in this disclosure.
In an exemplary embodiment, the number of the light emitting elements 120 may be determined according to the size of the backlight module 10 and the size of the light emitting elements 120, which is not particularly limited in the present application. The optical film assembly 140 may include at least one prism sheet for brightness enhancement and at least one diffusion sheet for making the white light more uniform, which are stacked.
In the embodiment of the present application, the thickness of the quantum dot film layer 150 may be 200um to 800um, for example, 200um, 300um, 500um, 600um, 750um, 800um, or other values, which is not particularly limited in the present application.
In summary, the backlight module 10 provided in the embodiment of the present application may at least include a back plate 110 and at least one light emitting assembly 120 located in the back plate 110, where the light emitting assembly 120 is configured to emit basic light. The backlight module 10 further includes an optical film assembly 140 and a quantum dot film layer 150 disposed on the light-emitting side of the light-emitting assembly 120, the optical film assembly 140, the quantum dot film layer 150 and the light-emitting assembly 120 are stacked, the peripheral side surface of the optical film assembly 140 is flush with the peripheral side surface of the quantum dot film layer 150, and the orthographic projection of the light-emitting assembly 120 on the back plate 110 is at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110. The quantum dot film layer 150 is used to convert the basic light into white light, and the optical film assembly 140 is used to make the white light more uniform. Therefore, the orthographic projection of the light emitting element 120 on the back plate 110 is at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110, so that the basic light emitted by the light emitting element 120 can penetrate through the quantum dot film layer 150, and the occurrence of blue light in the backlight module 10 is avoided. The orthographic projection of the light emitting component 120 on the back plate 110 is at least positioned in the orthographic projection of the optical film component 140 on the back plate 110, so that the white light converted from the basic light can penetrate through the optical film component 140, the optical film component 140 enables the white light to be more uniform, and bright edges of the backlight module 10 are avoided.
In the embodiment of the present application, the backlight module 10 further includes a fixing layer 170, the fixing layer 170 is disposed between the optical film assembly 140 and the quantum dot film layer 150, and the fixing layer 170 is used for bonding the optical film assembly 140 and the quantum dot film layer 150.
It is understood that the fixing layer 170 bonds the optical film assembly 140 and the quantum dot film layer 150 together, so as to facilitate cutting to a desired size, and it can be ensured that the optical film assembly 140 is flush with the peripheral side surface of the quantum dot film layer 150.
In an exemplary embodiment, the fixing layer 170 may be an Optical Clear Adhesive (OCA), an Isotropic Diffusion Film (IDF), or other material having a good transmittance and a good adhesion, which is not particularly limited in the present application.
It is understood that, when the light emitting assembly 120 emits light, the quantum dot film layer 150 and the optical film assembly 140 are subjected to heat radiation, which causes the optical film assembly 140 to expand due to heat, and causes ligands of the quantum dot film layer 150 to fall off from the surface of quantum dots or ligand fracture occurs, such that the quantum dot film layer 150 is damaged. Therefore, the fixing layer 170 may also be a graphene layer coated with glue on the surface, and the graphene layer has better transparency and heat dissipation performance, so as to prevent the loss of the white light, and has good heat dissipation performance, so as to prevent the optical film assembly 140 from expanding due to heat or the quantum dot film layer 150 from being damaged due to heat. The fixing layer 170 may also be made of a transparent heat dissipation material, and has better light transmittance and heat dissipation, so as to dissipate heat from the quantum dot film layer 150 and the optical film assembly 140.
In an exemplary embodiment, the peripheral side of the fixing layer 170 is flush with the peripheral side of the optical film assembly 140 and the quantum dot film layer 150. The thickness of the fixing layer 170 may be 50um to 150um, for example, 50um, 70um, 100um, 120um, 150um, or other values, which is not specifically limited in the present application.
In the present embodiment, the back plate 110 includes a back plate body 111, a first side plate assembly 113, and a second side plate assembly 115. The first side plate assembly 113 is disposed around the periphery of the back plate main body 111 and extends toward the display panel 20, and the second side plate assembly 115 is disposed on a side of the first side plate assembly 113 opposite to the back plate main body 111.
In an exemplary embodiment, the first side plate assembly 113 and the second side plate assembly 115 may be hollow cylindrical structures as a whole, the peripheral side surface of the back plate main body 111 is flush with the outer side surface of the first side plate assembly 113 and the outer side surface of the second side plate assembly 115, and an orthographic projection of the second side plate assembly 115 on the back plate main body 111 is located within an orthographic projection of the first side plate assembly 113 on the back plate main body 111. That is, the orthographic projection of the inner side surface of the second side plate assembly 115 on the back plate main body 111 is located outside the orthographic projection of the inner side surface of the first side plate assembly 113 on the back plate main body 111, that is, the first side plate assembly 113 and the second side plate assembly 115 form a stepped structure, so that the carrying surface 101 is formed on the surface of the first side plate assembly 113 facing away from the back plate main body 111.
In an exemplary embodiment, a surface of the light emitting component 120 facing away from the back plate main body 111 is flush with the mounting surface 101.
In the embodiment of the present application, the backlight module 10 further includes a diffusion layer 180, the diffusion layer 180 is set on the mounting surface 101 and located between the light emitting component 120 and the quantum dot film layer 150, that is, the peripheral edge of the diffusion layer 180 is placed on the mounting surface 101, and the diffusion layer 180 is used to make the basic light emitted by the light emitting component 120 more uniform.
In an exemplary embodiment, the peripheral side surface of the diffusion layer 180 is flush with the peripheral side surface of the quantum dot film layer 150.
In an exemplary embodiment, a predetermined distance is maintained between the peripheral side surfaces of the optical film assembly 140, the fixed layer 170, the quantum dot film layer 150, and the diffusion layer 180 and the inner side surface of the second side plate assembly 115, so that the optical film assembly 140, the fixed layer 170, the quantum dot film layer 150, and the diffusion layer 180 have a matched buffer space with respect to the second side plate assembly 115, and warpage after thermal expansion is avoided.
In the embodiment of the present application, the predetermined interval may be 0.2mm to 0.5mm, for example, 0.2mm, 0.3mm, 0.4mm, 0.5mm, or other values, which is not particularly limited in the present application.
In the embodiment of the present application, the backlight module 10 further includes a buffer pad 190, the buffer pad 190 is disposed on a side of the second side plate assembly 115 opposite to the first side plate assembly 113, and the display panel 20 is disposed on a side of the buffer pad 190 opposite to the second side plate assembly 115. That is, the display panel 20 is disposed on the buffer pad 190, and the buffer pad 190 is used to protect the display panel 20 from being damaged by impact.
In an exemplary embodiment, the buffer pad 190 may be a hollow ring structure, an outer side of the buffer pad 190 is flush with an outer side of the second side plate assembly 115, and an inner side of the buffer pad 190 is flush with a circumferential side of the optical film assembly 140.
In an exemplary embodiment, the light emitting assembly 120 includes a driving substrate 121, a plurality of light emitting elements 123 and an encapsulation layer 125, the driving substrate 121 is disposed on the back-plate body 111 and located inside the first side-plate assembly 113, the plurality of light emitting elements 123 are disposed on a side of the driving substrate 121 opposite to the back-plate body 111 and electrically connected to the driving substrate 121, and the encapsulation layer 125 covers the plurality of light emitting elements 123 on the back-plate body 111. The driving substrate 121 is configured to drive the plurality of light emitting elements 123 to emit the basic light, and the encapsulation layer 125 is configured to isolate impurities such as water vapor, dust, and oxygen from entering the light emitting elements 123, so that the light emitting elements 123 are protected, and the service life of the light emitting elements 123 is prolonged.
In an exemplary embodiment, the light emitting element 123 may be a Mini LED chip or a Micro LED chip, and the base light emitted from the light emitting element 123 may be blue light.
In an exemplary embodiment, a red quantum dot for converting the basic light into red light and a green quantum dot for converting the basic light into green light are disposed in the quantum dot film layer 150, and the red light, the green light and the blue light are mixed to form white light.
In summary, the backlight module 10 provided in the embodiment of the present application may at least include a back plate 110 and at least one light emitting assembly 120 located in the back plate 110, where the light emitting assembly 120 is configured to emit basic light. The backlight module 10 further includes an optical film assembly 140 and a quantum dot film layer 150 disposed on the light-emitting side of the light-emitting assembly 120, the optical film assembly 140, the quantum dot film layer 150 and the light-emitting assembly 120 are stacked, the peripheral side surface of the optical film assembly 140 is flush with the peripheral side surface of the quantum dot film layer 150, and the orthographic projection of the light-emitting assembly 120 on the back plate 110 is at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110. The quantum dot film layer 150 is used to convert the basic light into white light, and the optical film assembly 140 is used to make the white light more uniform. Therefore, the orthographic projection of the light emitting element 120 on the back plate 110 is at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110, so that the basic light emitted by the light emitting element 120 can penetrate through the quantum dot film layer 150, and the occurrence of blue light in the backlight module 10 is avoided. The orthographic projection of the light emitting component 120 on the back plate 110 is at least positioned in the orthographic projection of the optical film component 140 on the back plate 110, so that the white light converted from the basic light can penetrate through the optical film component 140, the optical film component 140 enables the white light to be more uniform, and bright edges of the backlight module 10 are avoided.
Referring to fig. 2, fig. 2 is a schematic diagram of a second layer structure of a display device according to an embodiment of the present disclosure. The display device 2 of the second layer structure differs from the display device 1 of the first layer structure in that: the first side panel assembly 113 is located differently from the second side panel assembly 115. The descriptions of the display device 2 with the second layer structure are the same as the description of the display device 1 with the first layer structure, please refer to the description of the display device 1 with the first layer structure, and the description thereof is omitted here.
Specifically, in the embodiment of the present application, the back plate 110 includes a back plate main body 111, a first side plate assembly 113 and a second side plate assembly 115, the first side plate assembly 113 is disposed around a periphery of the back plate main body 111 and extends toward the display panel 20, and the second side plate assembly 115 is disposed on the back plate main body 111 and is located inside the first side plate assembly 113. That is, the first side plate assembly 113 and the second side plate assembly 115 are both disposed on the same side of the back plate main body 111, and the second side plate assembly 115 is attached to the inner side of the first side plate assembly 113.
In an exemplary embodiment, the outer side surface of the first side plate assembly 113 is flush with the peripheral side surface of the back plate main body 111, and the display panel 20 is located inside the first side plate assembly 113. The outer side of the second side plate assembly 115 is flush with the inner side of the first side plate assembly 113, and the outer side of the second side plate assembly 115 is flush with the peripheral side of the display panel 20.
In an exemplary embodiment, the back plate main body 111, the first side plate assembly 113, and the second side plate assembly 115 may be fixed by welding.
In the embodiment of the present application, the second side plate assembly 115 includes a first inner side surface 115a and a second inner side surface 115b, the first inner side surface 115a is connected to the surface of the back plate main body 111 where the light emitting assembly 120 is disposed, and the second inner side surface 115b is connected to a side of the first inner side surface 115a opposite to the back plate main body 111.
In an exemplary embodiment, the second inner side surface 115b is gradually inclined toward the outer side surface of the second side plate assembly 115 in a direction away from the first inner side surface 115a, that is, the aperture of the side of the second inner side surface 115b facing the first inner side surface 115a is smaller than the aperture of the side of the second inner side surface 115b facing away from the first inner side surface 115 a. The inclination angle α of the second inner side surface 115b is matched with the light emitting angle of the light emitting element 120, so that the basic light emitted by the light emitting element 120 can pass through the diffusion layer 180 to the quantum dot film layer 150 and the white light converted from the quantum dot film layer 150 can pass through the optical film assembly 140 to the display panel 20, thereby avoiding light loss, and simultaneously guiding the white light to the peripheral side of the backlight module 10, so that the light at the light emitting side of the backlight module 10 is more uniform. The inclination angle α of the second inner side surface 115b refers to an included angle between a plane of the second inner side surface 115b and a normal of the light emitting assembly 120.
In an exemplary embodiment, the angle of inclination α of the second inner side surface 115b may be 40 degrees to 80 degrees, for example, 40 degrees, 55 degrees, 65 degrees, 70 degrees, 80 degrees, or other values, which are specifically limited by the present application.
In an exemplary embodiment, the height of the first inner side surface 115a is consistent with the height of the peripheral side surface of the light emitting assembly 120, that is, the connection between the second inner side surface 115b and the first inner side surface 115a is flush with the surface of the light emitting assembly 120 facing away from the rear panel body 111. The heights of the optical film assembly 140, the fixing layer 170, the quantum dot film layer 150, and the diffusion layer 180 are identical to the height of the second inner side surface 115 b.
In an exemplary embodiment, the backlight module 10 further includes a buffer pad 190, the buffer pad 190 is disposed between the display panel 20 and the second side plate assembly 115 and located inside the first side plate assembly 113, and the display panel 20 is also located inside the first side plate assembly 113.
In the embodiment of the present application, the backlight module 10 further includes a reflective layer 210, and the reflective layer 210 is disposed on the first inner side surface 115a and the second inner side surface 115 b. The reflective layer 210 is used for reflecting the basic light emitted by the light emitting assembly 120 and reflecting the white light converted from the basic light, so as to increase the light emitting efficiency of the backlight module 10.
In an exemplary embodiment mode, the reflective layer 210 may be a white paint layer.
In an exemplary embodiment, the peripheral side of the light emitting assembly 120 is spaced apart from the reflective layer 210. The peripheral side surface of the optical film assembly 140, the peripheral side surface of the fixed layer 170, the peripheral side surface of the quantum dot film layer 150 and a part of the peripheral side surface of the diffusion layer 180 are kept at proper intervals with the reflection layer 210, so that the optical film assembly 140, the fixed layer 170, the quantum dot film layer 150 and the diffusion layer 180 have matched buffer spaces relative to the reflection layer 210, and warping after thermal expansion is avoided.
In summary, the backlight module 10 provided in the embodiment of the present application may at least include a back plate 110 and at least one light emitting assembly 120 located in the back plate 110, where the light emitting assembly 120 is configured to emit basic light. The backlight module 10 further includes an optical film assembly 140 and a quantum dot film layer 150 disposed on the light-emitting side of the light-emitting assembly 120, the optical film assembly 140, the quantum dot film layer 150 and the light-emitting assembly 120 are stacked, the peripheral side surface of the optical film assembly 140 is flush with the peripheral side surface of the quantum dot film layer 150, and the orthographic projection of the light-emitting assembly 120 on the back plate 110 is at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110. The quantum dot film layer 150 is used to convert the basic light into white light, and the optical film assembly 140 is used to make the white light more uniform. Therefore, the orthographic projection of the light emitting element 120 on the back plate 110 is at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110, so that the basic light emitted by the light emitting element 120 can penetrate through the quantum dot film layer 150, and the occurrence of blue light in the backlight module 10 is avoided. The orthographic projection of the light emitting assembly 120 on the back plate 110 is at least located in the orthographic projection of the optical film assembly 140 on the back plate 110, so that the white light converted from the basic light can penetrate through the optical film assembly 140, the optical film assembly 140 makes the white light more uniform, and the occurrence of bright edges on the backlight module 10 is avoided. The back plate 110 comprises a back plate main body 111, a first side plate assembly 113 and a second side plate assembly 115, the second inner side surface 115b is far away from the direction of the first inner side surface 115a and faces the direction of the outer side surface of the second side plate assembly 115, the inclination angle alpha of the second inner side surface 115b is matched with the light emitting angle of the light emitting assembly 120, so that the basic light emitted by the light emitting assembly 120 can sequentially pass through the diffusion layer 180, the quantum dot film layer 150 and the optical film assembly 140 to the display panel 20, the light loss is avoided, and meanwhile, the white light can be guided to the peripheral side of the backlight module 10, and the light on the light emitting side of the backlight module 10 is more uniform.
Referring to fig. 3, fig. 3 is a schematic diagram of a third layer structure of a display device according to an embodiment of the present disclosure. The display device 3 of the third layer structure differs from the display device 1 of the first layer structure in that: the back plate 110 does not include the first side plate assembly 113 and the second side plate assembly 115. The descriptions of the display device 3 with the third layer structure are the same as the description of the display device 1 with the first layer structure, please refer to the description of the display device 1 with the first layer structure, and are not repeated herein.
Specifically, in the embodiment of the present invention, the back plate 110 includes a back plate main body 111 and a bezel assembly 117, and the bezel assembly 117 is disposed around the periphery of the back plate main body 111 and extends toward the display panel 20.
In an exemplary embodiment, the outer side surface of the bezel assembly 117 is flush with the peripheral side surface of the backplate main body 111.
In the embodiment of the present application, the backlight module 10 further includes a first glue frame 230 and a second glue frame 240, the first glue frame 230 is disposed on one side of the frame assembly 117 opposite to the back plate main body 111, and the second glue frame 240 is disposed on one side of the back plate main body 111 and located on an inner side of the frame assembly 117. That is, the frame assembly 117 and the second rubber frame 240 are both disposed on the same side of the backplate main body 111, and the second rubber frame 240 is attached to the inner side of the frame assembly 117.
In an exemplary embodiment, the backlight module 10 further includes a buffer pad 190, the buffer pad 190 is located on a side of the first plastic frame 230 opposite to the frame assembly 117, and the display panel 20 is located on a side of the buffer pad 190 opposite to the first plastic frame 230.
In an exemplary embodiment, each of the first rubber frame 230 and the second rubber frame 240 may be a hollow ring structure, an outer side surface of the first rubber frame 230 is flush with an outer side surface of the bezel assembly 117, an outer side surface of the buffer pad 190, and a circumferential side surface of the display panel 20, and an inner side surface of the first rubber frame 230 is flush with an inner side surface of the bezel assembly 117 and an inner side surface of the buffer pad 190.
In an exemplary embodiment, the second adhesive frame 240 includes a first inner surface 240a and a second inner surface 240b, the first inner surface 240a is connected to the surface of the back plate main body 111 where the light emitting assembly 120 is disposed, and the second inner surface 240b is connected to a side of the first inner surface 240a facing away from the back plate main body 111.
In an exemplary embodiment, the second inner surface 240b is gradually inclined toward the outer side surface of the second rubber frame 240 in a direction away from the first inner surface 240a, that is, the aperture of the second inner surface 240b facing the first inner surface 240a is smaller than the aperture of the second inner surface 240b facing away from the first inner surface 240 a. The inclination angle β of the second inner surface 240b is matched with the light emitting angle of the light emitting element 120, so that the basic light emitted by the light emitting element 120 can pass through the diffusion layer 180 to the quantum dot film layer 150 and the white light converted from the quantum dot film layer 150 can pass through the optical film assembly 140 to the display panel 20, thereby avoiding light loss, and guiding the white light to the peripheral side of the backlight module 10, so that the light at the light emitting side of the backlight module 10 is more uniform. The inclination angle β of the second inner surface 240b refers to an angle between a plane of the second inner surface 240b and a normal of the light emitting element 120.
In an exemplary embodiment, the inclination angle β of the second inner surface 240b may be 40 degrees to 80 degrees, for example, 40 degrees, 55 degrees, 65 degrees, 70 degrees, 80 degrees, or other values, which are specifically limited in the present application.
In an exemplary embodiment, a black paint layer is disposed on a surface of the first plastic frame 230 to block the basic light and the white light, so that light leakage around the backlight module 10 can be prevented and the first plastic frame 230 can be an appearance surface. The first inner surface 240a and the second inner surface 240b are provided with a white paint layer, so that the first inner surface 240a can reflect the basic light emitted by the light emitting assembly 120, and the second inner surface 240b can reflect the white light converted from the basic light, so as to increase the light emitting efficiency of the backlight module 10.
In an exemplary embodiment, the height of the first inner surface 240a is consistent with the height of the peripheral side surface of the light emitting assembly 120, that is, the junction of the second inner surface 240b and the first inner surface 240a is flush with the surface of the light emitting assembly 120 facing away from the back plate body 111. The heights of the optical film assembly 140, the fixing layer 170, the quantum dot film layer 150, and the diffusion layer 180 are identical to the height of the second inner surface 240 b. The height of the frame assembly 117 is consistent with that of the first rubber frame 230 and the height of the outer side of the second rubber frame 240.
In an exemplary embodiment, the peripheral side surface of the light emitting assembly 120 is spaced apart from the first inner surface 240 a. The peripheral side surface of the optical film assembly 140, the peripheral side surface of the fixed layer 170, the peripheral side surface of the quantum dot film layer 150, and a part of the peripheral side surface of the diffusion layer 180 are kept at proper intervals from the second inner surface 240b, so that the optical film assembly 140, the fixed layer 170, the quantum dot film layer 150, and the diffusion layer 180 have matched buffer spaces relative to the second inner surface 240b, and warping after thermal expansion is avoided.
In summary, the backlight module 10 provided in the embodiment of the present application may at least include a back plate 110 and at least one light emitting assembly 120 located in the back plate 110, where the light emitting assembly 120 is configured to emit basic light. The backlight module 10 further includes an optical film assembly 140 and a quantum dot film layer 150 disposed on the light-emitting side of the light-emitting assembly 120, the optical film assembly 140, the quantum dot film layer 150 and the light-emitting assembly 120 are stacked, the peripheral side surface of the optical film assembly 140 is flush with the peripheral side surface of the quantum dot film layer 150, and the orthographic projection of the light-emitting assembly 120 on the back plate 110 is at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110. The quantum dot film layer 150 is used to convert the basic light into white light, and the optical film assembly 140 is used to make the white light more uniform. Therefore, the orthographic projection of the light emitting element 120 on the back plate 110 is at least located in the orthographic projection of the quantum dot film layer 150 on the back plate 110, so that the basic light emitted by the light emitting element 120 can penetrate through the quantum dot film layer 150, and the occurrence of blue light in the backlight module 10 is avoided. The orthographic projection of the light emitting component 120 on the back plate 110 is at least positioned in the orthographic projection of the optical film component 140 on the back plate 110, so that the white light converted from the basic light can penetrate through the optical film component 140, the optical film component 140 enables the white light to be more uniform, and bright edges of the backlight module 10 are avoided. Backlight unit 10 still includes first gluey frame 230 and second gluey frame 240, frame 240 is glued to the second includes first internal surface 240a and second internal surface 240b, second internal surface 240b is keeping away from the direction orientation of first internal surface 240a the lateral surface direction slope of frame 240 is glued to the second, the inclination beta of second internal surface 240b with light-emitting component 120's luminous angle phase-match makes light-emitting component 120 send the basis light can both pass through in proper order diffusion layer 180, quantum dot rete 150 and optics diaphragm subassembly 140 extremely display panel 20 avoids light loss, also can lead white light to backlight unit 10's week side simultaneously, makes backlight unit 10 light of light-emitting side is more even.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims. Those skilled in the art will recognize that all or a portion of the above-described embodiments can be practiced without departing from the scope of the present disclosure, which is encompassed by the claims.
Claims (10)
1. The utility model provides a backlight module, includes the backplate and is located light-emitting component in the backplate, light-emitting component is used for sending basic light, its characterized in that, backlight module still including set up in light-emitting component's the light-emitting side optical film subassembly and quantum dot rete, optical film subassembly quantum dot rete and light-emitting component range upon range of setting, light-emitting component is in orthographic projection on the backplate is located at least optical film subassembly is in orthographic projection on the backplate and at least being located the quantum dot rete is in orthographic projection on the backplate, the quantum dot rete is used for with light-emitting component sends basic light turns into white light, optical film subassembly is used for making white light is even.
2. The backlight module according to claim 1, wherein the back plate comprises a back plate main body, a first side plate assembly and a second side plate assembly, the first side plate assembly is arranged around the periphery of the back plate main body, the second side plate assembly is arranged at a side of the first side plate assembly opposite to the back plate main body, an orthographic projection of an inner side face of the second side plate assembly on the back plate main body is positioned outside an orthographic projection of an inner side face of the first side plate assembly on the back plate main body, so as to form a carrying surface at a surface of the first side plate assembly opposite to the back plate main body;
the backlight module further comprises a diffusion layer, wherein the diffusion layer is erected on the carrying surface and is located between the light-emitting component and the quantum dot film layer.
3. The backlight module as claimed in claim 1, wherein the back plate comprises a back plate main body, a first side plate assembly and a second side plate assembly, the first side plate assembly is disposed around a periphery of the back plate main body, and the second side plate assembly is disposed on the back plate main body and located inside the first side plate assembly;
the second side plate component comprises a first inner side face and a second inner side face, the first inner side face is provided with the surface of the light-emitting component, the second inner side face is connected with one side, back to the back plate body, of the first inner side face, the second inner side face faces the outer side face of the second side plate component in the direction away from the first inner side face, and the inclination angle of the second inner side face is matched with the light-emitting angle of the light-emitting component.
4. The backlight module as claimed in claim 3, wherein the second inner side face has an inclination angle of 40 to 80 degrees.
5. The backlight module as claimed in claim 3, wherein the backlight module further comprises a reflective layer disposed on the first inner side surface and the second inner side surface, the reflective layer being configured to reflect the basic light emitted from the light emitting elements and reflect the white light converted from the basic light.
6. The backlight module according to claim 1, wherein the back plate comprises a back plate main body and a frame assembly, the frame assembly is disposed around the back plate main body, the backlight module further comprises a first glue frame and a second glue frame, the first glue frame is disposed on a side of the frame assembly opposite to the back plate main body, the second glue frame is disposed on the back plate main body and is located inside the frame assembly;
the frame is glued to the second includes first internal surface and second internal surface, first internal surface with the backplate main part is provided with light emitting component's surface is connected, the second internal surface connect in first internal surface is back of to one side of backplate main part, wherein, the second internal surface is keeping away from the direction orientation of first internal surface the slope of the lateral surface direction of frame is glued to the second, just the inclination of second internal surface with light emitting component's luminous angle phase-match.
7. The backlight module as claimed in claim 6, wherein the second inner surface is inclined at an angle of 40 to 80 degrees.
8. The backlight module as claimed in claim 6, wherein a black paint layer is disposed on the surface of the first frame to block the basic light and the white light, and a white paint layer is disposed on the first inner surface and the second inner surface, the first inner surface reflects the basic light emitted from the light emitting element, and the second inner surface reflects the white light converted from the basic light.
9. The backlight module according to any one of claims 1-8, further comprising a fixing layer disposed between the optical film assembly and the quantum dot film layer, the fixing layer for bonding the optical film assembly and the quantum dot film layer.
10. A display device, comprising a display panel and the backlight module as claimed in any one of claims 1 to 9, wherein the display panel is disposed on the light-emitting side of the backlight module, and the display panel is configured to display an image under the backlight provided by the backlight module.
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