CN115390201A - Low-deformation high-reliability light emitting component - Google Patents
Low-deformation high-reliability light emitting component Download PDFInfo
- Publication number
- CN115390201A CN115390201A CN202211159056.2A CN202211159056A CN115390201A CN 115390201 A CN115390201 A CN 115390201A CN 202211159056 A CN202211159056 A CN 202211159056A CN 115390201 A CN115390201 A CN 115390201A
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- base plate
- light emitting
- shell
- deformation
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- 239000000758 substrate Substances 0.000 claims abstract description 122
- 238000000034 method Methods 0.000 claims abstract description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 claims description 4
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 4
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a low-deformation high-reliability light emitting assembly, wherein components of the light emitting assembly are all packaged in a shell, the internal components are all arranged on a substrate, and the substrate is connected with the shell of the light emitting assembly; the method is characterized in that: the base plate tiling is on the bottom surface of shell cavity, and components and parts all set up on the front of base plate, set up the recess on the base plate back, and the deformation zone of recess cover shell, base plate border and shell contact and fixed around the recess on the base plate back. The invention has the advantages that the arrangement of the groove on the substrate ensures that the substrate does not contact the center of the shell with the largest deformation and only contacts the edge of the shell, thereby reducing the influence of the shell deformation on the light path.
Description
Technical Field
The invention relates to a low-deformation high-reliability light emitting component.
Background
With the development of optical communication technology, the reliability requirement on the optical emission component is higher and higher. It is therefore desirable that the light emitting module has as little variation in optical power as possible at high and low temperatures and under the influence of external forces. This requires that the various components on the optical path remain stable with as little distortion as possible.
However, due to space constraints, the size of the housing of the light emitting assembly is difficult to grow, and the wall thickness is difficult to thicken. How to reduce the deformation of components on the optical path without modifying the housing of the light emitting module becomes an urgent problem to be solved.
Disclosure of Invention
Since the outer dimensions of the light emitting assembly are difficult to change due to the MSA protocol, the wall thickness of the housing, which involves heat dissipation, and the internal space requirements are difficult to thicken, conventional methods of reinforcing the various components to reduce distortion are difficult to implement. The invention adopts the hollow substrate, and the substrate does not contact the center of the shell with the largest deformation, thereby reducing the influence of the shell deformation on the light path.
The specific technical scheme is as follows:
a low-deformation high-reliability light emitting assembly comprises light emitting assemblies, wherein components of the light emitting assemblies are all packaged in a shell, the internal components are all arranged on a substrate, and the substrate is connected with the shell of the light emitting assemblies; the method is characterized in that: the base plate tiling is on the bottom surface of shell cavity, and components and parts all set up on the front of base plate, and the recess is seted up at the back of base plate, and the deformation zone of shell is covered to the recess, and the base plate border around the recess on the base plate back contacts and is fixed with the shell.
According to the technical scheme, the sealed light emitting component shell is influenced by high and low temperatures and a welding process, and the internal air expands or contracts to form internal and external pressure difference, so that the shell deforms. From the deformation diagram of the sealed light emitting assembly housing, it can be seen that the central deformation of the housing is the most severe and the peripheral deformation is small. It is thus contemplated that the parts on the optical path will not contact the center, but only the edges, thereby avoiding the effect of deformation of the housing. Therefore, the invention provides the hollow substrate, and the substrate only contacts the edge of the shell, thereby greatly reducing the influence of shell deformation and greatly improving the reliability.
According to the technical scheme of the invention, the depth of the groove is 10% -30% of the thickness of the substrate, so that the substrate is effectively prevented from contacting the shell, and the deformation of the shell does not influence the substrate. Too shallow a depth of the recess may affect the stiffness of the recess itself when it comes into contact with the deformed housing.
In a further preferred aspect of the present invention, the substrate is rectangular, and the wall thickness of the edge of the substrate is less than 15% of the total width of the substrate. Deformation experiments verify that the sealed light emitting assembly shell is influenced by high and low temperatures, and the internal air expands or contracts to form internal and external pressure difference, so that the shell deforms. From the deformation diagram of the sealed light emitting component shell, the central deformation of the shell is the most serious, and the peripheral deformation is very small; therefore, the wall thickness of the edge of the substrate is less than 15% of the total width of the substrate, and the wall thickness is very close to the edge of the shell, so that the influence of shell deformation on internal components is effectively avoided.
In a further preferred embodiment of the present invention, the substrate edge on the back side of the substrate is U-shaped or rectangular.
Preferably, the lens, the laser assembly and the isolator are arranged on the front surface of the first substrate, the wavelength division multiplexer and the shifter are arranged on the front surface of the second substrate, the first substrate and the second substrate are different in thickness, the first substrate and the second substrate are flatly laid on the bottom surface of the inner cavity of the shell in a straight shape, a gap is arranged between the first substrate and the second substrate, and the back surfaces of the first substrate and the second substrate are provided with U-shaped grooves. The sectional type substrates of the first substrate and the second substrate are arranged, and mainly because the heat productivity of components in the shell is different, the heat dissipation requirements on the substrates are different, and the thickness requirements of the substrates are different; secondly, because the external dimension of the light emitting component is hardly changed under the influence of the MSA protocol, the requirement of the internal space makes the selection of the thickness of the substrate very important, and the lower the thickness of the substrate is, the larger the space for installing components therein is, so that the space for installing components therein can be enlarged as much as possible by adopting a sectional substrate structure.
In a further preferred embodiment of the present invention, the substrate is made of kovar alloy, tungsten-copper alloy, or molybdenum-copper alloy. The manufacturing material of the substrate is selected to have the advantages of small deformation, good heat conduction and convenient machining; furthermore, kovar, tungsten copper and molybdenum copper have the characteristics of low expansion coefficient, stability, corrosion resistance and the like, are easy to machine, and are more suitable to be used as the material of the substrate compared with the traditional ceramic.
Further preferably, the edge of the substrate is provided with a chamfer or a fillet. Since the inside of the housing is usually chamfered or rounded, the edge of the substrate is chamfered or rounded to bring the substrate as close to the edge of the housing as possible.
The light emitting assembly referred to in the technical solution of the present invention is known in the art and known to those skilled in the art.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the groove is arranged on the substrate, the substrate does not contact the center of the shell with the largest deformation, and the substrate only contacts the edge of the shell, so that the influence of the shell deformation on a light path is reduced.
Drawings
Fig. 1 is a sectional view (groove of substrate) of a light emitting assembly.
Fig. 2 is a schematic view of a deformation of the light emitting assembly.
Fig. 3 is a schematic view of the internal structure of the light emitting module.
Fig. 4 is a perspective view of the first substrate.
Fig. 5 is a front view of the first substrate.
Fig. 6 is a perspective view of the second substrate.
Fig. 7 is a front view of the second substrate.
FIG. 8 is a bottom view of the substrate of example 3 (showing the back side grooves of the integrated structure of the tec and mux substrates).
Fig. 9 is a sectional view of a light emitting assembly of embodiment 3.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to fig. 1 to 9 and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
Example 1
The components of the light emitting assembly are all packaged in the shell, the internal components are all arranged on the substrate, and the substrate is connected with the shell of the light emitting assembly; the base plate tiling is on the bottom surface of shell cavity, and components and parts all set up on the front of base plate, set up recess 5 on the base plate back, and recess 5 covers the deformation zone of shell, and base plate border 6 and shell contact and fixed around the recess on the base plate back.
As shown in fig. 2, the sealed light emitting module housing is subjected to low temperatures and the internal air contracts to create a pressure differential between the inside and outside, causing the housing to deform. Careful inspection of the distortion map revealed that the center of the shell was most distorted and the periphery was very little distorted. It is thus contemplated that if the component on the optical path does not touch the center, but only the edge, it is possible to avoid being affected by the deformation of the housing.
Further, since the outer dimensions of the light emitting assembly are difficult to change due to the MSA protocol, the wall thickness of the housing involved in heat dissipation and the internal space requirements are difficult to thicken, and conventional methods of reinforcing the various components to reduce distortion are difficult to work with.
Therefore, the embodiment provides the hollow substrate, the groove 5 is formed in the back face of the substrate, and the groove 5 covers the deformation area of the shell, so that the substrate only contacts with the edge of the shell, the influence of shell deformation is greatly reduced, and the reliability is greatly improved.
As shown in fig. 1, it can be seen that the hollow substrates are all supported at the edges of the light emitting module housing, and the center is hollow without contact, greatly reducing the effect of housing deformation.
Further, it is generally contemplated by those skilled in the art, given the general knowledge of reinforcing the housing to reduce the effect of housing deformation on the internal components, that this approach is limited by the MSA protocol and is difficult to implement. Another method is to place a small substrate at the center of the housing, so that the distortion is symmetrical, the optical path only moves horizontally and has no rotation angle, and the change of the optical power can be reduced. However, the center of the shell is not coincident with the center of the part, and the eccentric placement is not beneficial to the stability of the structure. And the small substrate area undersize supporting structure is weak, and is easy to fall off in the vibration impact.
According to the technical scheme of the embodiment, the depth of the groove is 10% -30% of the thickness of the substrate, so that the substrate is effectively prevented from contacting the shell, and the deformation of the shell does not affect the substrate.
According to the technical scheme, the substrate is rectangular, the edge of the substrate on the back of the substrate is rectangular, the wall thickness L1 of the edge of the substrate is smaller than 15% of the total width L of the substrate, and the influence of shell deformation on internal components is effectively avoided.
The thickness L1 of the substrate edge mentioned in this embodiment represents a portion where the periphery of the back surface of the substrate contacts the bottom surface inside the housing; the total width L of the substrate, which represents the dimension of the substrate mounted on the light emitting device, is based on the width direction of the light emitting device. As shown in fig. 5 and 7.
According to the technical scheme of the embodiment, the substrate is made of kovar alloy, tungsten-copper alloy or molybdenum-copper alloy.
According to the technical scheme of the embodiment, the edge of the substrate is provided with the chamfer or the fillet, so that the substrate can be close to the edge of the shell as much as possible.
Example 2
In this embodiment, on the basis of embodiment 1, the components inside the light emitting module are disposed on two substrates, namely a first substrate 7 and a second substrate 8. The sectional type substrates of the first substrate and the second substrate are arranged, and mainly have different heat dissipation requirements on the substrates and different thickness requirements on the substrates due to different heat productivity of components inside the shell; secondly, because the external dimension of the light emitting component is hardly changed under the influence of the MSA protocol, the requirement of the internal space makes the selection of the thickness of the substrate very important, and the lower the thickness of the substrate is, the larger the space for installing components therein is, so that the space for installing components therein can be enlarged as much as possible by adopting a sectional substrate structure.
As shown in fig. 3, the components inside the optical transmission module of the present embodiment include a lens, a laser module 1, an isolator 2, a wavelength division multiplexer 3, and a shifter 4. Lens, laser instrument subassembly 1 and isolator 2 set up on the front of first base plate 7, wavelength division multiplexer 3 and displacer 4 set up on the front of second base plate 8, and first base plate 7 is different with the thickness of second base plate 8, and first base plate 7 is "one" style of calligraphy tiling on the bottom surface of shell cavity with second base plate 8, sets up the interval between first base plate and the second base plate, and U font recess 9 is all seted up to the back of first base plate and second base plate, as shown in fig. 1.
As shown in fig. 4, 5, 6 and 7, the U-shaped groove 9 is formed on the back surface of the first substrate 7, the U-shaped groove 9 is formed on the back surface of the second substrate 8, and the U-shaped groove 9 covers the deformation region of the housing, so that the substrate only contacts the edge of the housing, thereby greatly reducing the influence of the deformation of the housing and greatly improving the reliability.
Referring to fig. 1, in the technical solution of the present embodiment, referring to the cross-sectional view, it can be seen that the hollow substrates (the back of the substrate is provided with the grooves to form the substrate with a hollow back) are all supported at the edge of the light emitting module housing, and the center is hollow and has no contact. The influence of the deformation of the housing is greatly reduced.
The technical scheme of this embodiment, the base plate is changed for the gouging copper base plate, and following beneficial effect is gouging copper base plate test data, as table 1 below, table 1 is the optical power of the light emission subassembly that uses two kinds of base plates under different temperatures.
TABLE 1
| Changing items | Normal temperature 25 deg.C | Low temperature of-40 deg.C |
| Common potteryCeramic substrate | 9.01dBm | 0.51dBm |
| Grooving copper substrate | 8.45dBm | 7.68dBm |
The change of the common ceramic substrate reaches more than 8-10dB, and the optical power is often less than 0dBm; and the low-deformation grooving copper substrate usually changes by less than 1dB, and meets the requirement of high reliability.
Example 3
As shown in fig. 8, in this embodiment, in addition to embodiment 1, the substrate is formed by integrating a tec substrate 10, i.e., a thermoelectric cooler substrate, and a mux substrate 11, i.e., a wavelength division multiplexer substrate. the tec substrate and the mux substrate are of an integral structure. The tec substrate 10 and the mux substrate 11 of the present embodiment have an integrated structure, and are more stable.
In this embodiment, the grooves are cut at the back surfaces of the tec substrate 10 and the mux substrate 11, that is, the grooves 5 are formed, and the grooves 5 cover the deformation region of the housing, so that the substrate only contacts with the edge of the housing, thereby greatly reducing the influence of deformation of the housing and greatly improving the reliability.
As shown in fig. 8 and 9, a lens, a laser module 1 and an isolator 2 are mounted on the tec substrate 10, and a mux wavelength division multiplexer and a shifter 4 are mounted on the mux substrate 11.
The above embodiments are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modifications made on the basis of the technical scheme according to the technical idea of the present invention fall within the protection scope of the present invention.
Claims (7)
1. A low-deformation high-reliability light emitting assembly comprises a light emitting assembly, wherein components of the light emitting assembly are all packaged in a shell, the internal components are all arranged on a substrate, and the substrate is connected with the shell of the light emitting assembly; the method is characterized in that: the base plate tiling is on the bottom surface of shell cavity, and components and parts all set up on the front of base plate, offer the recess on the base plate back, and the deformation region of shell is covered to the recess, and the base plate border around the recess on the base plate back contacts and is fixed with the shell.
2. The low-deformation high-reliability light emitting module according to claim 1, wherein: the substrate is rectangular, and the wall thickness of the substrate edge is less than 15% of the total width of the substrate.
3. The low-deformation high-reliability light emitting module according to claim 1, wherein: the depth of the groove is 10-30% of the thickness of the substrate.
4. The low-deformation high-reliability light emitting module according to claim 1, wherein: the edge of the substrate on the back of the substrate is U-shaped or rectangular.
5. The low distortion high reliability light emitting assembly of claim 1, wherein: lens, laser instrument subassembly and isolator set up on the front of first base plate, and wavelength division multiplexer and displacer set up on the front of second base plate, and first base plate is different with the thickness of second base plate, and first base plate and second base plate are "one" style of calligraphy tiling on the bottom surface in shell cavity, set up the interval between first base plate and the second base plate, and U font recess is all seted up to the back of first base plate and second base plate.
6. The low-deformation high-reliability light emitting module according to claim 1, wherein: the substrate is made of kovar alloy, tungsten-copper alloy or molybdenum-copper alloy.
7. The low distortion high reliability light emitting assembly of claim 1, wherein: the edge of the substrate is provided with a chamfer or a fillet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211159056.2A CN115390201B (en) | 2022-09-22 | 2022-09-22 | Low deformation high reliability light emitting assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211159056.2A CN115390201B (en) | 2022-09-22 | 2022-09-22 | Low deformation high reliability light emitting assembly |
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| Publication Number | Publication Date |
|---|---|
| CN115390201A true CN115390201A (en) | 2022-11-25 |
| CN115390201B CN115390201B (en) | 2024-02-23 |
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| CN202211159056.2A Active CN115390201B (en) | 2022-09-22 | 2022-09-22 | Low deformation high reliability light emitting assembly |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0893861A2 (en) * | 1997-07-25 | 1999-01-27 | Oki Electric Industry Co., Ltd. | Optical module |
| JP2011124388A (en) * | 2009-12-10 | 2011-06-23 | Opnext Japan Inc | Optical device and method of manufacturing the same |
| JP2013057720A (en) * | 2011-09-07 | 2013-03-28 | Panasonic Corp | Optical module |
| US20150029591A1 (en) * | 2013-07-29 | 2015-01-29 | Seiko Epson Corporation | Interference filter, optical filter device, optical module, electronic apparatus, manufacturing method of interference filter, and mems element |
| CN104662460A (en) * | 2012-09-27 | 2015-05-27 | 株式会社藤仓 | Optical module |
| US20180008132A1 (en) * | 2015-03-20 | 2018-01-11 | Olympus Corporation | Optical transmission module, endoscope, and method for manufacturing optical transmission module |
| US20210088714A1 (en) * | 2017-10-27 | 2021-03-25 | Radiant Opto-Electronics(Suzhou) Co., Ltd. | LED light source module |
| CN113253404A (en) * | 2021-06-23 | 2021-08-13 | 希烽光电科技(南京)有限公司 | Anti-electromagnetic interference optical module structure |
-
2022
- 2022-09-22 CN CN202211159056.2A patent/CN115390201B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0893861A2 (en) * | 1997-07-25 | 1999-01-27 | Oki Electric Industry Co., Ltd. | Optical module |
| JP2011124388A (en) * | 2009-12-10 | 2011-06-23 | Opnext Japan Inc | Optical device and method of manufacturing the same |
| JP2013057720A (en) * | 2011-09-07 | 2013-03-28 | Panasonic Corp | Optical module |
| CN104662460A (en) * | 2012-09-27 | 2015-05-27 | 株式会社藤仓 | Optical module |
| US20150029591A1 (en) * | 2013-07-29 | 2015-01-29 | Seiko Epson Corporation | Interference filter, optical filter device, optical module, electronic apparatus, manufacturing method of interference filter, and mems element |
| US20180008132A1 (en) * | 2015-03-20 | 2018-01-11 | Olympus Corporation | Optical transmission module, endoscope, and method for manufacturing optical transmission module |
| US20210088714A1 (en) * | 2017-10-27 | 2021-03-25 | Radiant Opto-Electronics(Suzhou) Co., Ltd. | LED light source module |
| CN113253404A (en) * | 2021-06-23 | 2021-08-13 | 希烽光电科技(南京)有限公司 | Anti-electromagnetic interference optical module structure |
Non-Patent Citations (2)
| Title |
|---|
| TSUNG-HUNG LIN ET AL.: "New dual-curvature microlens array with a high fill-factor for organic light emitting diode modules", 《OPTICS COMMUNICATIONS》, vol. 304, 30 September 2013 (2013-09-30), pages 123 - 128 * |
| 丁超 等: "基于标定模块的多线结构光测量系统的直接标定", 《光电子·激光》, vol. 30, no. 08, 31 August 2019 (2019-08-31), pages 835 - 841 * |
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| CN115390201B (en) | 2024-02-23 |
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