CN115385563A - Mobile phone rear cover machining process - Google Patents
Mobile phone rear cover machining process Download PDFInfo
- Publication number
- CN115385563A CN115385563A CN202210962914.0A CN202210962914A CN115385563A CN 115385563 A CN115385563 A CN 115385563A CN 202210962914 A CN202210962914 A CN 202210962914A CN 115385563 A CN115385563 A CN 115385563A
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- CN
- China
- Prior art keywords
- mobile phone
- rear cover
- glass
- polishing
- processing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
- C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
Abstract
The invention discloses a processing technology of a rear cover of a mobile phone, which comprises the following steps: cutting a mobile phone rear cover with a target shape on the surface of glass by laser, then carrying out chemical polishing, splitting and cleaning to obtain the mobile phone rear cover, wherein after the laser cutting, the mobile phone rear cover with the target shape is still connected with the glass; the polishing solution comprises the following raw materials: sulfuric acid, hydrofluoric acid, nitric acid and water. According to the invention, laser cutting is adopted and an appropriate polishing process is combined, so that a complex CNC (computer numerical control) processing process is avoided, the processing efficiency and the product yield are improved, and the investment cost and the processing field are saved; and various problems caused by laser cutting can be improved, and the surface smoothness of the glass is improved.
Description
Technical Field
The invention relates to the technical field of glass mobile phone rear covers, in particular to a mobile phone rear cover processing technology.
Background
At present, the preparation process of the rear cover of the glass mobile phone generally comprises the following steps: cutting glass by a cutting machine, breaking off a piece, performing CNC (computer numerical control) processing, and finally cleaning the rear cover of the glass mobile phone with the target size. But the time of present CNC processing is very long for the productivity of lid is lower behind the glass cell-phone, and in the CNC course of working, the lid takes place the breakage easily behind the glass cell-phone, reduces the yields of product.
Disclosure of Invention
Based on the technical problems in the background art, the invention provides a mobile phone rear cover processing technology, which uses laser cutting and combines a proper polishing technology, avoids the complex process of CNC processing, improves the processing efficiency and the product yield, and saves the input cost and the processing field; and various problems caused by laser cutting can be improved, and the surface smoothness of the glass is improved.
The invention provides a processing technology of a rear cover of a mobile phone, which comprises the following steps: cutting a mobile phone rear cover with a target shape on the surface of glass by laser, then carrying out chemical polishing, splitting and cleaning to obtain the mobile phone rear cover, wherein after the laser cutting, the mobile phone rear cover with the target shape is still connected with the glass; the polishing solution comprises the following raw materials: sulfuric acid, hydrofluoric acid, nitric acid and water.
The laser cutting is that a horizontal laser beam emitted by a laser emitter is changed into a vertically downward laser beam through a 45-degree total reflector, then the laser beam is focused through a lens, a tiny light spot is formed at a focus, when the light spot irradiates on a material, the material is quickly heated to a gasification temperature, a hole shape and the like are formed through evaporation, the melted waste residue is blown away by matching with auxiliary gas (such as carbon dioxide gas, oxygen gas, nitrogen gas and the like) along with the movement of the light beam to the material, and the hole continuously forms a slit with a narrow width, so that the material cutting is completed. After the glass is cut by laser, the rear cover of the mobile phone and the original glass still have partial positions to keep a connection state at high temperature.
Preferably, the polishing solution comprises the following raw materials in percentage by weight: 5-9% of concentrated sulfuric acid, 2-6% of hydrofluoric acid aqueous solution, 3-8% of concentrated nitric acid and 75-88% of water, wherein the sum of the weight percentages of the raw materials is 100%.
Preferably, the mass fraction of the concentrated sulfuric acid is 96-98wt%, the mass fraction of the concentrated nitric acid is 66-68wt%, and the mass fraction of the hydrofluoric acid aqueous solution is 39-41wt%.
Preferably, the temperature of the polishing process is 34-38 ℃.
Preferably, the polishing process time is 1-4min.
Preferably, the polished amount of the filaments is 0.015 to 0.1mm.
Preferably, the chemical polishing comprises the following specific steps: soaking the glass cut by the laser for 5-15s by water for the first time, then transferring the glass to a chemical polishing solution for polishing treatment, and then soaking the glass for 5-15s by water for the second time.
Preferably, the power of laser cutting is more than or equal to 30W, the cutting speed is 100-500mm/s, and the frequency is 45-55Hz.
The above-mentioned amount of stringiness refers to the reduced thickness of the glass after polishing.
The water may be purified water, distilled water, etc.
Has the advantages that:
according to the invention, laser cutting is selected and combined with a proper polishing process, so that a complex CNC (computer numerical control) processing process is avoided, the processing time can be shortened, the processing efficiency is improved, the investment cost and the processing field are saved, and the product yield can be improved; the operation is simple, and automatic flow line production can be realized; the equipment investment cost can be saved by 50-80%, and the site space can be saved by 50%;
in addition, after laser cutting, the edge of the glass is right-angled, so that hands are easily scratched, the edge of the glass is easily sanded and cracked, scratches and the like are easily formed on the surface of the glass, and the light transmittance, the smoothness and the appearance of the glass are influenced; according to the invention, by combining a proper polishing process and a polishing solution with a proper formula after laser cutting, the problems of edge grinding, edge breakage, surface scratch change and the like can be solved, and the edge of the glass forms a chamfer angle, so that the hand is prevented from being scratched by the glass; the invention selects proper polishing liquid and polishing process, which can improve the surface finish of the glass.
Drawings
FIG. 1 is a photograph of the glass after laser cutting according to the present invention.
FIG. 2 is a photograph of the edge chamfer of the glass after chemical polishing according to the present invention.
Detailed Description
Hereinafter, the technical solution of the present invention will be described in detail by specific examples, but these examples should be explicitly proposed for illustration, but should not be construed as limiting the scope of the present invention.
Example 1
A processing technology for a rear cover of a mobile phone comprises the following steps: cutting a mobile phone rear cover with a target shape on the surface of glass by laser, wherein the laser cutting power is 30W, the cutting speed is 500mm/s, and the frequency is 45Hz; after laser cutting, the rear cover of the mobile phone with the target shape is still connected with the glass;
soaking the glass subjected to laser cutting with water for 5s, then transferring the glass into chemical polishing solution to polish for 1min at 38 ℃, then soaking the glass with water for 5s for the second time, then splitting the glass, and cleaning to obtain a rear cover of the mobile phone; wherein, the polishing solution comprises the following raw materials in percentage by weight: 5% of concentrated sulfuric acid aqueous solution, 2% of hydrofluoric acid aqueous solution with the mass fraction of 40wt%, 5% of concentrated nitric acid aqueous solution and 88% of water.
Example 2
A processing technology for a rear cover of a mobile phone comprises the following steps: cutting a mobile phone rear cover with a target shape on the surface of glass by laser, wherein the laser cutting power is 40W, the cutting speed is 100mm/s, and the frequency is 55Hz; after laser cutting, the rear cover of the mobile phone with the target shape is still connected with the glass;
soaking the glass subjected to laser cutting by using water for 15s, then transferring the glass into chemical polishing solution to polish for 4min at 34 ℃, then soaking the glass for 15s by using water for the second time, then splitting the glass, and cleaning to obtain a rear cover of the mobile phone; wherein, the polishing solution comprises the following raw materials in percentage by weight: 9% of concentrated sulfuric acid aqueous solution, 6% of hydrofluoric acid aqueous solution with the mass fraction of 40wt%, 8% of concentrated nitric acid aqueous solution and 77% of water.
Example 3
A processing technology for a rear cover of a mobile phone comprises the following steps: cutting a mobile phone rear cover with a target shape on the surface of glass by laser, wherein the laser cutting power is 35W, the cutting speed is 200mm/s, and the frequency is 50Hz; after laser cutting, the rear cover of the mobile phone with the target shape is still connected with the glass;
soaking the glass subjected to laser cutting with water for 10s for the first time, then transferring the glass into chemical polishing solution to polish for 3min at 36 ℃, then soaking the glass with water for the second time for 10s, then splitting the glass, and cleaning to obtain a rear cover of the mobile phone; wherein, the polishing solution comprises the following raw materials in percentage by weight: 7% of concentrated sulfuric acid aqueous solution, 4% of hydrofluoric acid aqueous solution with the mass fraction of 40wt%, 6% of concentrated nitric acid aqueous solution and 83% of water.
FIG. 1 is a photograph of the glass after laser cutting according to the present invention.
FIG. 2 is a photograph of the edge chamfer of the glass after chemical polishing according to the present invention.
Comparative example 1
The traditional mobile phone rear cover processing technology comprises the following steps: cutting the glass by a cutting machine, breaking off the glass, performing CNC (computer numerical control) processing, and finally cleaning to obtain the rear cover of the mobile phone.
Comparative example 2
The polishing solution was a 12wt% hydrofluoric acid aqueous solution, and the same as example 3 was repeated.
The processes of examples 1 to 3 and comparative examples 1 to 2 were respectively employed to continuously process 100 pieces of mobile phone back covers having the same size, to count the time and cost used, and to test the mobile phone back covers of each group, with the results shown in table 1.
TABLE 1 test results
As can be seen from the table 1, the time for processing the rear covers of 100 mobile phones is far shorter than that of the comparative example 1, and the yield is improved by 3% compared with that of the comparative example 1; the wire feeding amount and the chamfer width of the rear cover of the mobile phone are both larger than those of the comparative example 2.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A processing technology for a rear cover of a mobile phone is characterized by comprising the following steps: cutting a mobile phone rear cover with a target shape on the surface of glass by laser, then carrying out chemical polishing, splitting and cleaning to obtain the mobile phone rear cover, wherein after the laser cutting, the mobile phone rear cover with the target shape is still connected with the glass; the polishing solution comprises the following raw materials: sulfuric acid, hydrofluoric acid, nitric acid and water.
2. The processing technology of the mobile phone rear cover according to claim 1, wherein the polishing solution comprises the following raw materials in percentage by weight: 5-9% of concentrated sulfuric acid, 2-6% of hydrofluoric acid aqueous solution, 3-8% of concentrated nitric acid and 75-88% of water, wherein the sum of the weight percentages of the raw materials is 100%.
3. The processing technology of the rear cover of the mobile phone according to claim 2, wherein the mass fraction of the concentrated sulfuric acid is 96-98wt%, the mass fraction of the concentrated nitric acid is 66-68wt%, and the mass fraction of the hydrofluoric acid aqueous solution is 39-41wt%.
4. The process for processing the rear cover of the mobile phone according to any one of claims 1 to 3, wherein the temperature of the polishing treatment is 34 to 38 ℃.
5. The process for processing the rear cover of the mobile phone according to any one of claims 1 to 4, wherein the polishing time is 1 to 4min.
6. The process for manufacturing the rear cover of the mobile phone according to any one of claims 1 to 5, wherein the polished filament amount is 0.015 to 0.1mm.
7. The process for machining the rear cover of the mobile phone according to any one of claims 1 to 6, wherein the chemical polishing comprises the following specific steps: and soaking the glass subjected to laser cutting for 5-15s by using water, then transferring the glass into chemical polishing solution for polishing treatment, and then soaking for 5-15s by using water for the second time.
8. The process for processing the rear cover of the mobile phone according to any one of claims 1 to 7, wherein the power of laser cutting is more than or equal to 30W, the cutting speed is 100-500mm/s, and the frequency is 45-55Hz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210962914.0A CN115385563A (en) | 2022-08-11 | 2022-08-11 | Mobile phone rear cover machining process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210962914.0A CN115385563A (en) | 2022-08-11 | 2022-08-11 | Mobile phone rear cover machining process |
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| Publication Number | Publication Date |
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| CN115385563A true CN115385563A (en) | 2022-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210962914.0A Pending CN115385563A (en) | 2022-08-11 | 2022-08-11 | Mobile phone rear cover machining process |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104829139A (en) * | 2015-04-22 | 2015-08-12 | 四川旭虹光电科技有限公司 | Polishing solution for improving glass surface strength and polishing method using the same |
| CN104860541A (en) * | 2015-05-12 | 2015-08-26 | 中国船舶重工集团公司第七一七研究所 | Polishing solution and polishing method |
| CN107835794A (en) * | 2015-07-10 | 2018-03-23 | 康宁股份有限公司 | The method of continuous manufacturing hole and product related to this in flexible substrate plate |
| CN110526564A (en) * | 2019-09-16 | 2019-12-03 | 蓝思科技（长沙）有限公司 | A kind of glass splinter method |
| CN112404736A (en) * | 2020-11-12 | 2021-02-26 | 科立视材料科技有限公司 | Method for polishing glass by laser and polishing method for glass hole and glass sheet |
-
2022
- 2022-08-11 CN CN202210962914.0A patent/CN115385563A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104829139A (en) * | 2015-04-22 | 2015-08-12 | 四川旭虹光电科技有限公司 | Polishing solution for improving glass surface strength and polishing method using the same |
| CN104860541A (en) * | 2015-05-12 | 2015-08-26 | 中国船舶重工集团公司第七一七研究所 | Polishing solution and polishing method |
| CN107835794A (en) * | 2015-07-10 | 2018-03-23 | 康宁股份有限公司 | The method of continuous manufacturing hole and product related to this in flexible substrate plate |
| CN110526564A (en) * | 2019-09-16 | 2019-12-03 | 蓝思科技（长沙）有限公司 | A kind of glass splinter method |
| CN112404736A (en) * | 2020-11-12 | 2021-02-26 | 科立视材料科技有限公司 | Method for polishing glass by laser and polishing method for glass hole and glass sheet |
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