CN115379656A - Flexible circuit and preparation method thereof - Google Patents
Flexible circuit and preparation method thereof Download PDFInfo
- Publication number
- CN115379656A CN115379656A CN202210986951.5A CN202210986951A CN115379656A CN 115379656 A CN115379656 A CN 115379656A CN 202210986951 A CN202210986951 A CN 202210986951A CN 115379656 A CN115379656 A CN 115379656A
- Authority
- CN
- China
- Prior art keywords
- substrate
- liquid metal
- layer
- carbon powder
- powder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a preparation method of a flexible circuit, which comprises the following steps: forming a carbon powder layer with a pre-designed circuit pattern on a substrate by using a thermal transfer method; coating liquid metal on one surface of the substrate on which the carbon powder layer is formed so as to form a liquid metal circuit layer in an area which is not covered with the carbon powder on the substrate; placing an electronic device at a preset position of the liquid metal circuit layer, and fixing the electronic device on the carbon powder layer; and packaging the liquid metal circuit layer and the electronic device by adopting the packaging layer. The invention also discloses a flexible circuit prepared by the preparation method.
Description
Technical Field
At least one embodiment of the present invention relates to a flexible circuit, and more particularly, to a flexible circuit based on thermal transfer printing and a method of manufacturing the same.
Background
The conventional printed circuit is an electronic circuit in which conductor patterns are etched or exposed to light on an insulating substrate by printing means to interconnect electronic components, and is the basis of various electronic devices and is widely used in various industries. Early printed circuit substrates were mostly rigid substrates, and various processes for manufacturing flexible electronic circuits have been proposed to enhance the applicability of the circuits. Common methods for manufacturing flexible electronic circuits include screen printing, micro-channel perfusion, 3D printing, photolithography, and transfer printing. Although the processing methods realize the preparation of the flexible circuit, and part of the technologies are widely applied to industries such as industrial production, consumer electronics, medical education and the like, the processing methods are complex, multiple devices and reagents are required to be used, the processing period is long, the types of substrates are fixed, the processing can be carried out only on a plane, and the requirements of rapid preparation and conformal processing are difficult to meet.
Liquid metals are a class of lower melting point metals or alloys, such as the common metallic mercury. Metallic mercury has strong toxicity, and thus is difficult to apply to the field of daily life. Other types of liquid metals, such as room temperature liquid metal alloy materials based on low melting point metal gallium (melting point 29.8 ℃, boiling point 2204 ℃), have the characteristics of small resistance, fluidity and the like, and have unique advantages in the preparation of flexible circuits or the manufacture of tension and pressure sensors and other applications.
Disclosure of Invention
In view of this, the present invention provides a method for manufacturing a flexible circuit, which can realize rapid printing of a patterned liquid metal circuit layer on a substrate surface based on the adhesion difference of liquid metal on different substrates, thereby realizing rapid and low-cost manufacturing of a flexible circuit.
The invention provides a preparation method of a flexible circuit, which comprises the following steps: forming a carbon powder layer with a pre-designed circuit pattern on a substrate by using a thermal transfer method; coating liquid metal on one surface of the substrate on which the carbon powder layer is formed so as to form a liquid metal circuit layer in an area which is not covered with carbon powder on the substrate; placing the electronic device at a preset position of the liquid metal circuit layer, and fixing the electronic device on the carbon powder layer; and packaging the liquid metal circuit layer and the electronic device by adopting a packaging layer.
The invention also provides a flexible circuit prepared by the preparation method, which comprises the following steps: a substrate; a carbon powder layer formed on the substrate, the carbon powder layer having a pre-designed circuit pattern; the liquid metal circuit layer is formed on the area, which is not covered by the carbon powder layer, on the substrate; the electronic device is formed at a preset position of the liquid metal circuit layer; and the packaging layer is formed on the liquid metal circuit layer and the electronic device and is suitable for packaging the liquid metal circuit layer and the electronic device.
According to the preparation method of the flexible circuit provided by the embodiment of the invention, based on the adhesion difference of the liquid metal on different substrates, the substrate has adhesion to the liquid metal, the carbon powder layer does not have adhesion to the liquid metal, and the liquid metal selectively stays in the area which is not covered by the carbon powder layer on the substrate, so that the patterned liquid metal circuit layer can be rapidly printed on the surface of the substrate, and the flexible circuit can be rapidly prepared at low cost.
Drawings
FIGS. 1 (a) -1 (b) are schematic diagrams illustrating the principle of selective adhesion of liquid metal on different substrate surfaces;
FIG. 2 is a flow chart of a method of making a flexible circuit according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a flexible circuit according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a process for making a flexible circuit according to an embodiment of the present invention;
FIGS. 5 (a) -5 (c) are schematic diagrams of the fabrication of flexible circuits on three-dimensional curved surfaces of different shapes according to embodiments of the present invention;
FIG. 6 is a schematic diagram of a water temperature detection circuit applied to a glass according to an embodiment of the present invention; and
fig. 7 is a schematic diagram of an electrocardiograph detection circuit applied to a cloth according to an embodiment of the present invention.
[ description of reference ]
1-a substrate;
101-a non-adherent substrate;
102-an adherent substrate;
2-an adhesive layer;
3-a carbon powder layer with a pre-designed circuit pattern;
4-a liquid metal circuit layer;
401 — liquid metal of high surface tension;
402-low surface tension liquid metal;
5-an electronic device; 6-packaging layer;
7-laser printer; 8-thermal transfer paper;
9-areas not covered with carbon powder; 10-liquid metal coated rollers;
11-glue coated roller; 12-a substrate formed with a layer of carbon powder;
13-areas not covered with liquid metal;
14-a three-dimensional curved surface; 15-liquid metal coated brush;
16-a liquid metal circuit layer on the three-dimensional curved surface;
17-a glass; 18-water temperature detection circuit;
19-human skin; 20-an electrocardiographic detection circuit;
21-a liquid metal circuit layer of the electrocardio detection circuit;
22-an amplifier module; 23-an ADC module;
24-a bluetooth control module; 25-measuring electrode.
Detailed Description
In order that the objects, technical solutions and advantages of the present invention will become more apparent, the present invention will be further described in detail with reference to the accompanying drawings in conjunction with the following specific embodiments. This invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity, and like reference numerals designate like elements throughout.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.
Related researches have found that the liquid metal has different adhesion on different substrates, because the liquid metal forms an oxide film in the atmospheric environment, which allows the liquid metal to adhere to some materials with smooth surfaces and not to rough surfaces. The carbon powder printed on the thermal transfer paper by the laser printer is a non-adhesive rough surface for liquid metal. The laser printer and the thermal transfer paper are easy to purchase and low in price, so that the laser printer and the thermal transfer paper are used for manufacturing the thermal transfer carbon powder pattern to prepare the electronic circuit, compared with the traditional printed circuit, the laser printer and the thermal transfer paper have the advantages of low cost, short period, simple processing technology and the like, materials used in the whole process are safe and non-toxic, the flexible circuit can be processed on an uneven surface, and the flexible circuit can be rapidly prepared.
Fig. 1 (a) -1 (b) are schematic diagrams illustrating the principle of selective adhesion of liquid metal on different substrate surfaces.
The liquid metal has different adhesivity on different substrates, so that the liquid metal can selectively stay in a set circuit area, and referring to fig. 1 (a), on the non-adhesive substrate 101, the liquid metal presents higher surface tension and does not adhere to the substrate, that is, a high surface tension liquid metal 401 is formed on the non-adhesive substrate 101; referring to fig. 1 (b), on adherent substrate 102, the liquid metal exhibits a low surface tension, adhering to the substrate, i.e., forming a low surface tension liquid metal 402 on adherent substrate 102. By taking advantage of the differences in adhesion of liquid metal on different substrates, specific liquid metal circuit patterns can be printed on the substrate surface.
FIG. 2 is a flow chart of a method of making a flexible circuit according to an embodiment of the present invention; fig. 3 is a schematic diagram of a flexible circuit according to an embodiment of the invention.
According to an exemplary embodiment of the present invention, there is provided a method of manufacturing a flexible circuit, as shown in fig. 2 to 3, including: and S01 to S04.
In step S01, a carbon powder layer 3 having a pre-designed circuit pattern is formed on a substrate 1 using a thermal transfer method.
According to an embodiment of the present invention, forming the carbon powder layer 3 having a pre-designed circuit pattern on the substrate 1 using the thermal transfer method includes: printing a pre-designed circuit pattern on thermal transfer paper by using a laser printer, and forming a carbon powder layer 3 with the pre-designed circuit pattern on the thermal transfer paper; the carbon powder layer 3 with the pre-designed circuit pattern is attached to the substrate 1, and the carbon powder layer 3 with the pre-designed circuit pattern is transferred to the substrate 1 through hot pressing.
According to an embodiment of the present invention, the substrate 1 may be a plane or a three-dimensionally curved surface.
According to an embodiment of the present invention, the substrate 1 may be a non-adhesive substrate 101 or an adhesive substrate 102. Adherent substrate 102 has adhesion to liquid metal and non-adherent substrate 101 has no adhesion to liquid metal.
According to an embodiment of the present invention, the non-adhesive substrate 101 includes paper, cloth, wood, or carbon powder. The adherent substrate 102 comprises glass or a high molecular polymer material; the high polymer material is a silicone rubber material or an acrylic polymer, and the silicone rubber material comprises at least one of Polydimethylsiloxane (PDMS), copolyester (Ecoflex), thermoplastic polyurethane elastomer rubber (TPU) and polyethylene terephthalate (PET).
According to the embodiment of the invention, the liquid metal cannot be adhered to the non-adhesive substrate 101, in the case that the substrate 1 is the non-adhesive substrate 101, before the carbon powder layer 3 having the pre-designed circuit pattern is attached to the non-adhesive substrate 101, glue capable of forming an adhesive film is coated on the non-adhesive substrate 101 to form the adhesive layer 2, so that the liquid metal can be adhered to the non-adhesive substrate 101 through the adhesive layer 2, and the adhesive layer 2 includes Polydimethylsiloxane (PDMS), propylene glycol methyl ether acetate (PMA), ecoflex.
In step S02, a liquid metal is coated on the surface of the substrate 1 on which the carbon powder layer 3 is formed, and a liquid metal circuit layer 4 is formed on the substrate 1 in a region not covered with carbon powder.
According to an embodiment of the invention, the melting point of the liquid metal is below 30 ℃; the liquid metal includes a gallium-based alloy, a bismuth-based alloy, or a tin-based alloy.
According to an embodiment of the present invention, coating the liquid metal on the side of the substrate 1 on which the carbon powder layer 3 is formed includes: rolling the surface of the substrate 1 on which the carbon powder layer 3 is formed by using a roller coated with liquid metal; alternatively, the surface of the substrate 1 on which the carbon powder layer 3 is formed is brushed with a brush or a writing brush coated with the liquid metal.
In step S03, the electronic device 5 is placed at a predetermined position of the liquid metal circuit layer 4, and the electronic device 5 is fixed on the carbon powder layer 3.
In step S04, the liquid metal circuit layer 4 and the electronic device 5 are encapsulated with the encapsulation layer 6.
According to an embodiment of the invention, the encapsulation layer 6 is a flexible material; for example, the encapsulation layer 6 is a flexible silicone material or a flexible silicone rubber material.
The invention also provides a flexible circuit obtained by the preparation method, which is shown in fig. 3 and comprises the following steps: a substrate 1; a carbon powder layer 3 formed on the substrate 1, the carbon powder layer 3 having a pre-designed circuit pattern; a liquid metal circuit layer 4 formed on a region of the substrate 1 not covered by the carbon powder layer; an electronic device 5 formed at a predetermined position of the liquid metal circuit layer 4; and an encapsulation layer 6 formed on the liquid metal circuit layer 4 and the electronic device 5, adapted to encapsulate the liquid metal circuit layer 4 and the electronic device 5.
According to an embodiment of the present invention, the flexible circuit further includes: and an adhesion layer 2 formed between the substrate 1 and the carbon powder layer 3.
FIG. 4 is a schematic diagram of a process for making a flexible circuit according to an embodiment of the present invention.
According to an embodiment of the present invention, it is first judged whether the substrate is an adherent substrate or a non-adherent substrate. Referring to fig. 4, for a non-adhesive substrate 101 to which liquid metal cannot be adhered, a roller 11 or other tool coated with adhesive glue such as PDMS, PMA, etc. is used to coat the non-adhesive substrate 101 with glue having adhesiveness, and an adhesive layer 2 is formed after drying.
The carbon powder layer 3 with the pre-designed circuit pattern is printed on the thermal transfer paper 8 by the laser printer 7, so that the thermal transfer paper with the carbon powder layer 3 is obtained, and the area 9 which is not covered with carbon powder exists on the thermal transfer paper with the carbon powder layer 3.
Attaching the thermal transfer paper with the carbon powder layer 3 and the adhesive layer 2 on the non-adhesive substrate 101 together, and transferring the carbon powder layer 3 with the pre-designed circuit pattern on the thermal transfer paper onto the adhesive layer 2 in a hot pressing mode to form a substrate 12 with the carbon powder layer with the pre-designed circuit pattern; rolling the substrate 12 by using a roller 10 coated with liquid metal, wherein the area covered with the carbon powder layer on the substrate 12 has no adhesiveness to the liquid metal, and the area 9 uncovered with the carbon powder on the substrate 12 has adhesiveness to the liquid metal, so as to form a liquid metal circuit layer 4 on the substrate 12; placing the electronic device 5 at a preset position of the liquid metal circuit layer 4, and fixing the electronic device 5 on the carbon powder layer 3 by using glue; finally, the circuit is encapsulated with glue, such as PU glue, ecoflex, PDMS, etc., to form an encapsulation layer 6. The glue for packaging the circuit includes, but is not limited to, PU glue, ecoflex, PDMS.
According to the embodiment of the present invention, as for the adherent substrate 102, the thermal transfer paper on which the carbon powder layer 3 is formed and the adherent substrate 102 are directly bonded together, forming the substrate 12 having the carbon powder layer of the pre-designed circuit pattern.
Fig. 5 (a) -5 (c) are schematic diagrams illustrating the fabrication of flexible circuits on three-dimensional curved surfaces of different shapes according to embodiments of the present invention.
Referring to fig. 5 (a) to 5 (c), flexible electrodes are prepared on three-dimensional curved surfaces of different shapes. The carbon powder layer 3 with the pre-designed circuit pattern is printed on the thermal transfer paper 8 by the laser printer 7, and then the carbon powder layer 3 on the thermal transfer paper is transferred to the three-dimensional curved surface 14. Brushing the three-dimensional curved surface 14 with a brush 15 stained with liquid metal to form a liquid metal circuit layer 16 on the three-dimensional curved surface, placing an electronic device at a corresponding position of the liquid metal circuit layer 16 on the three-dimensional curved surface, fixing with glue, and finally packaging the circuit with PDMS, ecofelx, PUA and the like to finish conformal processing on the surface of the three-dimensional object.
FIG. 6 is a schematic diagram of a water temperature detection circuit applied to a glass according to an embodiment of the present invention.
Referring to fig. 6, a carbon powder layer with a pre-designed water temperature detection circuit pattern is printed on a thermal transfer paper 8 by using a laser printer 7, since liquid metal can be adhered to the glass surface, the carbon powder layer can be directly transferred to the outer surface of a glass cup 17 to form the carbon powder layer on the glass cup 17, and then a brush 15 stained with the liquid metal is used for brushing the area of the surface of the glass cup 17 which is not covered with carbon powder, so that the liquid metal is adhered to the area of the carbon powder layer exposing the glass, and a liquid metal circuit layer composed of the liquid metal is formed. A temperature detection sensor is arranged at a set position of the liquid metal circuit layer and is fixed by glue to form a complete water temperature detection circuit 18; finally, the whole circuit is packaged by using PUA glue.
Fig. 7 is a schematic diagram of an electrocardiograph detection circuit applied to a cloth according to an embodiment of the present invention.
Referring to fig. 7, a carbon powder layer with a pre-designed electrocardio detection circuit pattern is printed on a thermal transfer paper 8 by using a laser printer 7; because the substrate is cloth which is not adhered with liquid metal, the surface of the cloth needs to be treated firstly; the method comprises the steps of coating a layer of silk-screen glue on the surface of a cloth substrate by using a roller 11 coated with glue, after the glue is dried and solidified to form an adhesion layer 2, closely attaching the cloth substrate to thermal transfer paper with a carbon powder layer, and transferring the carbon powder layer to the cloth substrate with the adhesion layer 2 on the surface in a hot pressing mode. The cloth substrate which is well processed is coated by the roller 10 coated with the liquid metal in a rolling way, a liquid metal circuit layer 21 of the electrocardio detection circuit is formed on the cloth substrate, the amplifier module 22, the ADC module 23 and the Bluetooth control module 24 are respectively placed at corresponding positions of the circuit, and the measuring electrode 25 is connected. Glue is used for fixing to prevent separation, and a complete electrocardio detection circuit 20 is formed; finally the whole circuit is encapsulated using Ecoflex.
According to the preparation method of the flexible circuit provided by the embodiment of the invention, based on the adhesion difference of the liquid metal on different substrates, the substrate has adhesion to the liquid metal, the carbon powder layer does not have adhesion to the liquid metal, and the liquid metal selectively stays in the area which is not covered by the carbon powder layer on the substrate, so that the patterned liquid metal circuit layer can be rapidly printed on the surface of the substrate, and the flexible circuit can be rapidly prepared at low cost.
According to the preparation method of the flexible circuit provided by the embodiment of the invention, the substrate can be a plane or a three-dimensional curved surface, and conformal processing on the surface of a three-dimensional object can be realized by quickly printing the graphical liquid metal circuit layer on the three-dimensional curved surface, so that the flexible circuit can be customized individually.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method of making a flexible circuit, comprising:
forming a carbon powder layer (3) with a pre-designed circuit pattern on a substrate (1) by using a thermal transfer method;
coating liquid metal on one surface of the substrate (1) on which the carbon powder layer (3) is formed so as to form a liquid metal circuit layer (4) in an area which is not covered with carbon powder on the substrate;
placing an electronic device (5) at a preset position of the liquid metal circuit layer (4), and fixing the electronic device (5) on the carbon powder layer (3); and
and packaging the liquid metal circuit layer (4) and the electronic device (5) by adopting a packaging layer (6).
2. The method of claim 1, wherein forming a carbon powder layer having a pre-designed circuit pattern on a substrate using a thermal transfer method comprises:
printing a pre-designed circuit pattern on thermal transfer paper by using a laser printer, and forming a carbon powder layer with the pre-designed circuit pattern on the thermal transfer paper;
and attaching the carbon powder layer with the pre-designed circuit pattern to the substrate, and transferring the carbon powder layer with the pre-designed circuit pattern to the substrate through hot pressing.
3. The method of claim 2, wherein the substrate is a flat surface or a three-dimensional curved surface;
the substrate comprises an adherent substrate having adhesion to the liquid metal or a non-adherent substrate having no adhesion to the liquid metal.
4. A method of manufacturing according to claim 3, wherein the adherent substrate comprises glass or a high molecular weight polymeric material;
preferably, the high molecular polymer material is a silicone rubber material or an acrylic polymer, and the silicone rubber material includes at least one of polydimethylsiloxane, copolyester, thermoplastic polyurethane elastomer rubber and polyethylene terephthalate.
5. The production method according to claim 3, wherein the non-adhesive substrate comprises paper, cloth, or wood;
in the case that the substrate is a non-adhesive substrate, coating an adhesive layer (2) on the non-adhesive substrate before attaching the carbon powder layer having the pre-designed circuit pattern to the substrate,
the adhesive layer (2) comprises polydimethylsiloxane, propylene glycol methyl ether acetate and copolyester.
6. The method of claim 1, wherein the liquid metal has a melting point of less than 30 ℃;
the liquid metal includes a gallium-based alloy, a bismuth-based alloy, or a tin-based alloy.
7. The manufacturing method according to claim 1, wherein the pre-designed circuit pattern includes a water temperature detection circuit pattern and an electrocardiograph detection circuit pattern.
8. The method according to claim 1, wherein applying a liquid metal to the side of the substrate on which the carbon powder layer is formed comprises:
rolling and coating one surface of the substrate on which the carbon powder layer is formed by using a roller coated with the liquid metal;
or brushing one surface of the substrate on which the carbon powder layer is formed by using a brush or a writing brush coated with the liquid metal.
9. The method of claim 1, wherein the encapsulation layer is a flexible material;
preferably, the encapsulation layer is a flexible silicone material or a flexible silicone rubber material.
10. A flexible circuit obtained by the production method according to any one of claims 1 to 9, comprising:
a substrate;
a carbon powder layer formed on the substrate, the carbon powder layer having a pre-designed circuit pattern;
a liquid metal circuit layer formed on a region of the substrate not covered by the carbon powder layer;
the electronic device is formed at a preset position of the liquid metal circuit layer; and
and the packaging layer is formed on the liquid metal circuit layer and the electronic device and is suitable for packaging the liquid metal circuit layer and the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210986951.5A CN115379656A (en) | 2022-08-17 | 2022-08-17 | Flexible circuit and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210986951.5A CN115379656A (en) | 2022-08-17 | 2022-08-17 | Flexible circuit and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115379656A true CN115379656A (en) | 2022-11-22 |
Family
ID=84065198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210986951.5A Pending CN115379656A (en) | 2022-08-17 | 2022-08-17 | Flexible circuit and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115379656A (en) |
-
2022
- 2022-08-17 CN CN202210986951.5A patent/CN115379656A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106908176B (en) | Multi-phase dielectric layer capacitive pressure sensor with micro-structure and manufacturing method thereof | |
| Zhao et al. | A fast and cost-effective transfer printing of liquid metal inks for three-dimensional wiring in flexible electronics | |
| Maddipatla et al. | A polyimide based force sensor fabricated using additive screen-printing process for flexible electronics | |
| CN110207867B (en) | Graphene pressure sensor and structure and preparation method thereof | |
| CN105810598A (en) | Preparation method for stretchable flexible electronic device and stretchable flexible electronic device product | |
| Palaniappan et al. | Flexible M-tooth hybrid micro-structure-based capacitive pressure sensor with high sensitivity and wide sensing range | |
| CN107073518B (en) | Scalable, printable, patterned sheet of high mobility graphene on flexible substrates | |
| Okamoto et al. | Sandwich fixation of electronic elements using free-standing elastomeric nanosheets for low-temperature device processes | |
| Sondhi et al. | Airbrushing and surface modification for fabricating flexible electronics on polydimethylsiloxane | |
| JP4118708B2 (en) | Flexible sensor, input device using the same, and method for manufacturing flexible sensor | |
| Ntagios et al. | 3D printed robotic hand with embedded touch sensors | |
| CN115379656A (en) | Flexible circuit and preparation method thereof | |
| Reis Carneiro et al. | Gallium‐Based Liquid–Solid Biphasic Conductors for Soft Electronics | |
| EP1289777B1 (en) | Image transfer onto non-planar surfaces | |
| JP2008059085A (en) | Information management tag | |
| KR102264385B1 (en) | Coating method using particle alignment | |
| US11945099B2 (en) | System and method for fabricating soft sensors that conform to arbitrary smooth geometries | |
| CN112757800A (en) | Photo-induced polymer water transfer paper manufacturing method, water transfer paper and application method | |
| JP2016115178A (en) | Flexible laminate, manufacturing method thereof, and capacitive three-dimensional sensor | |
| WO2021059092A1 (en) | Methods and devices using microchannels for interconnections | |
| WO2008026640A1 (en) | Rfid tag structure | |
| JP2021134226A (en) | Double-sided adhesive sheet | |
| CN108021970B (en) | Transparent invisible RFID label material and preparation method thereof | |
| JP2020111679A (en) | Double-sided adhesive sheet | |
| CN110791220A (en) | Transparent polyimide composite film for flexible display and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |