CN115379646A

CN115379646A - Manufacturing method of circuit board, circuit board and lens module

Info

Publication number: CN115379646A
Application number: CN202110557770.6A
Authority: CN
Inventors: 刘立坤; 李艳禄; 袁刚
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2021-05-21
Filing date: 2021-05-21
Publication date: 2022-11-22
Also published as: TWI833126B; TW202247717A

Abstract

A manufacturing method of a circuit board comprises the following steps: providing a circuit substrate, wherein the circuit substrate comprises a dielectric layer and a circuit layer positioned on the surface of the dielectric layer, and the circuit substrate is divided into a first area, a second area and a third area which are sequentially connected from inside to outside; covering shielding layers on two opposite surfaces of the circuit substrate positioned in the first area and the third area; removing the dielectric layer in the second region; and removing the shielding layer to form a circuit board, wherein the circuit layer located in the second area is hollowed out of the dielectric layer, and the circuit layer located in the second area is connected with the first area and the third area. The application also provides a circuit board and a lens module comprising the circuit board.

Description

Manufacturing method of circuit board, circuit board and lens module

Technical Field

The present disclosure relates to the field of circuit boards, and more particularly, to a method for manufacturing a circuit board, and a lens module.

Background

With the development of multimedia technology, electronic devices such as digital cameras and video cameras are increasingly popular with consumers, so that the frequency of using the lens module by users is greatly increased, and the requirement on the shooting performance of the lens module is higher and higher.

The lens module comprises a sensor and a circuit board, wherein the sensor is used for sensing light, the sensor is connected with the circuit board, and imaging signals are transmitted to the circuit board for imaging through the light sensing effect of the sensor. In the actual shooting process, due to the influence of external factors, the electronic device keeps a complete static state, and the shaking of the sensor is caused, so that the lens module cannot be quickly focused, and the imaging is blurred.

Disclosure of Invention

In view of the above, it is desirable to provide a method for manufacturing a circuit board that avoids causing sensor jitter, so as to solve the above problems.

It is also necessary to provide a circuit board and a lens module including the circuit board and a sensor.

A manufacturing method of a circuit board comprises the following steps:

providing a circuit substrate, wherein the circuit substrate comprises a dielectric layer and a circuit layer positioned on the surface of the dielectric layer, and the circuit substrate is divided into a first area, a second area and a third area which are sequentially connected from inside to outside; covering shielding layers on two opposite surfaces of the circuit substrate positioned in the first area and the third area; removing the dielectric layer in the second region; and removing the shielding layer to form a circuit board, wherein the circuit layer located in the second area is hollowed out of the dielectric layer, and the circuit layer located in the second area is connected with the first area and the third area.

In some embodiments, the method of making further comprises the steps of: and carrying out surface treatment on the circuit layer to form a protective layer on the surface of the circuit layer.

In some embodiments, the circuit substrate further includes a fourth region, the first region is surrounded by the fourth region, and the dielectric layer and the circuit layer are not disposed in the fourth region.

In some embodiments, the step of forming the wiring substrate includes: providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises the dielectric layer and a copper layer positioned on the surface of the dielectric layer, and is divided into the first area, the second area and the third area which are sequentially connected from inside to outside; and carrying out circuit manufacturing on the copper layer to form the circuit layer.

In some embodiments, a portion of the dielectric layer and a portion of the circuit layer in the first region are removed to form the circuit substrate having the fourth region.

In some embodiments, after the step of removing the shielding layer, the method of manufacturing a circuit board further comprises the steps of: and forming solder mask layers on two opposite surfaces of the dielectric layer, wherein the solder mask layers also cover the circuit layer.

In some embodiments, the dielectric layer is provided with the wiring layer on both of opposite surfaces thereof.

A circuit board comprises a dielectric layer and a circuit layer located on the surface of the dielectric layer, the circuit board is divided into a first area, a second area and a third area which are sequentially connected from inside to outside, the dielectric layer and the circuit layer are arranged in the first area and the third area, and the dielectric layer is arranged in the second area and is not arranged in the second area.

In some embodiments, the circuit board further includes a fourth region, the first region is surrounded by the fourth region, and the fourth region is not provided with the circuit layer and the dielectric layer.

The lens module comprises a circuit board and a sensor, wherein the sensor is connected with the circuit layer in the first area.

In the circuit board formed by the circuit board manufacturing method provided by the application, the circuit layer positioned in the third area is used for being connected with an external circuit to form a static platform; the circuit layer located in the first area is used for being connected with the sensor, the sensor located in the first area is connected with the static platform through the circuit layer located in the second area, the sensor can dynamically move in a plane through the circuit layer which is not provided with the medium layer, a dynamic platform is formed, balance of the sensor is maintained, and therefore the anti-shaking function of the lens module is achieved.

Drawings

Fig. 1 is a top view of a single-sided copper-clad plate including a first region, a second region, a third region and a fourth region provided in an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of the single-sided copper-clad plate shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of a wiring substrate obtained by forming a wiring layer by wiring the copper layer shown in fig. 2.

Fig. 4 is a schematic cross-sectional view of the circuit substrate in the first area and the third area shown in fig. 3 after covering shielding layers on opposite surfaces of the circuit substrate.

Fig. 5 is a schematic cross-sectional view of fig. 4 after removing the dielectric layer in the second region.

Fig. 6 is a schematic cross-sectional view of fig. 5 after removing the shielding layer.

Fig. 7 is a top view of the circuit board obtained after the masking layer is removed.

Fig. 8 isbase:Sub>A schematic cross-sectional view alongbase:Sub>A-base:Sub>A' direction after surface treatment of the circuit board shown in fig. 7.

Fig. 9 is a schematic cross-sectional view along the direction B-B' after surface treatment of the circuit board shown in fig. 7.

Fig. 10 is a schematic cross-sectional view of the circuit board shown in fig. 7 after surface treatment and along the direction C-C'.

Fig. 11 is a schematic cross-sectional view along the direction D-D' after surface treatment of the circuit board shown in fig. 7.

Fig. 12 isbase:Sub>A schematic cross-sectional view of the circuit board shown in fig. 8 after solder mask treatment and along the directionbase:Sub>A-base:Sub>A'.

Fig. 13 is a top view of a lens module according to an embodiment of the disclosure.

Description of the main elements

Circuit board	100
		Circuit substrate	10
Dielectric layer	12
		Line layer	14
Single-sided copper-clad plate	20
		Copper layer	22
Shielding layer	30
		Protective layer	40
Welding-proof layer	50
		Lens module	200
Sensor with a sensor element	210
		First region	I
Second region	II
		Third zone	III
Fourth zone	IV

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.

Referring to fig. 1 to 12, an embodiment of the present invention provides a method for manufacturing a circuit board 100, including the following steps:

step S1: referring to fig. 1 to 3, a circuit substrate 10 is provided, where the circuit substrate 10 includes a dielectric layer 12 and a circuit layer 14 located on a surface of the dielectric layer 12, and the circuit substrate 10 is divided into a first region I, a second region II and a third region III, which are sequentially connected from inside to outside.

The second region II is surrounded by the first region I, the third region III is surrounded by the second region II, and the first region I, the second region II, and the third region III all have the dielectric layer 12 and the line layer 14. The circuit layer 14 may be located on one surface of the dielectric layer 12, or located on two opposite surfaces of the dielectric layer 12, and in this embodiment, the circuit layer 14 is located on one surface of the dielectric layer 12 as an example.

Further, in some embodiments, the circuit substrate 10 further includes a fourth region IV, and the fourth region IV is located at the center of the first region I, that is, the first region I surrounds the fourth region IV. The fourth region IV is hollow, that is, the line layer 14 and the dielectric layer 12 are not disposed in the fourth region IV.

In some embodiments, the step of forming the wiring substrate 10 may include:

step S101: referring to fig. 1 and 2, a single-sided copper-clad plate 20 is provided, where the single-sided copper-clad plate 20 includes the dielectric layer 12 and a copper layer 22 located on the surface of the dielectric layer 12, and the single-sided copper-clad plate 20 is divided into a first region I, a second region II, and a third region III, which are connected in sequence, from inside to outside.

Step S102: referring to fig. 3, the copper layer 22 is patterned to form the circuit layer 14. Wherein, FIG. 3 isbase:Sub>A schematic sectional view along the A-A' direction.

In some embodiments, the step of forming the wiring substrate 10 further includes the step S103: referring to fig. 3, referring to fig. 7 and 9, a portion of the dielectric layer 12 and a portion of the circuit layer 14 in the first region I are removed to form the circuit substrate 10 having the fourth region IV. That is, the fourth region IV is hollow, and is not provided with the dielectric layer 12 and the circuit layer 14.

Step S2: referring to fig. 4, shielding layers 30 are covered on two opposite surfaces of the circuit substrate 10 located in the first region I and the third region III.

The shielding layer 30 is used to prevent the dielectric layer 12 located in the first region I and the third region III and covered by the shielding layer 30 from being removed, and the dielectric layer 12 not covered can be removed. The shielding layer 30 covers the dielectric layer 12 of the first region I and the third region III, and also covers the circuit layer 14 of the first region I and the third region III.

And step S3: referring to fig. 5, the dielectric layer 12 in the second region II is removed.

The dielectric layer 12 located in the second area II is removed, and the circuit layer 14 located in the second area II is retained to form a hollowed-out circuit layer 14. Wherein, the circuit layer 14 located in the second region II is connected to the circuit layer 14 located in the first region I and the third region III.

And step S4: referring to fig. 6 and 7, the shielding layer 30 is removed, and the circuit board 100 in which the circuit layer 14 in the second region II is hollowed out of the dielectric layer 12 is formed, wherein the circuit layer 14 in the second region II is connected to the first region I and the third region III.

After the masking layer 30 is removed, the dielectric layer 12 and the wiring layer 14, which are not removed, are exposed.

It is understood that the circuit board 100 is formed to include the first region I, the second region II and the third region III, the second region II has only the wiring layer 14, no dielectric layer 12 is provided, and the first region I and the third region III are dynamically connected through the wiring layer 14 located in the second region II.

In some embodiments, the circuit board 100 is formed to further include a fourth region IV, the fourth region IV is located in the center of the first region I, and the fourth region IV is not provided with the line layer 14 and the dielectric layer 12.

In some embodiments, the method for manufacturing the circuit board 100 further includes the following steps:

step S5: referring to fig. 8 to 11, a surface treatment is performed on the circuit layer 14 to form a protection layer 40 on the surface of the circuit layer 14, so as to protect the circuit layer 14 and prevent the circuit layer 14 from being oxidized. Fig. 8 to 11 are schematic cross-sectional views along directionsbase:Sub>A-base:Sub>A ', B-B', C-C ', and D-D' of fig. 7, which are formed in the same step, and the detailed forming process is not repeated.

The step of surface treatment is after the circuit layer 14 is formed, i.e. the step of forming the protection layer 40 may be before the shielding layer 30 is covered, or may be after the shielding layer 30 is removed.

step S6: referring to fig. 12, solder masks 50 are formed on two opposite surfaces of the dielectric layer 12, and the solder masks 50 further cover the circuit layer 14.

Referring to fig. 7 to 11, an embodiment of the present application further provides a circuit board 100, where the circuit board 100 includes a dielectric layer 12 and a circuit layer 14 located on a surface of the dielectric layer 12, the circuit board 100 is divided into a first area I, a second area II and a third area III connected in sequence from inside to outside, the dielectric layer 12 and the circuit layer 14 are disposed in the first area I and the third area III, and the circuit layer 14 and the dielectric layer 12 are not disposed in the second area II.

The circuit board 100 further includes a fourth region IV, the first region I is surrounded by the fourth region IV, and the line layer 14 and the dielectric layer 12 are not disposed in the fourth region IV. The hollow fourth area IV can reduce the weight of the first area I and improve the motion flexibility of the first area I.

Referring to fig. 12, in some embodiments, the circuit board 100 further includes a solder mask layer 50, and the solder mask layer 50 covers the dielectric layer 12 and the circuit layer 14.

Referring to fig. 13, an embodiment of the present invention further provides a lens module 200, where the lens module 200 includes the circuit board 100 and a sensor 210 connected to the circuit board 100.

The circuit layer 14 located in the third area III is used for connecting with an external circuit to form a static platform; the circuit layer 14 located in the first area I is used for being connected to the sensor 210, the sensor 210 located in the first area I is connected to the static platform through the circuit layer 14 located in the second area II, and the sensor 210 can dynamically move in a plane through the circuit layer 14 without the dielectric layer 12, so as to form a dynamic platform, and maintain the balance of the sensor 210, thereby implementing the anti-shake function of the lens module 200.

Further, when the sensor 210 moves after being connected with the first area I, the hollow fourth area IV is arranged, so that the weight of the first area I is reduced, and the sensor 210 can move more flexibly.

Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.

Claims

1. The manufacturing method of the circuit board is characterized by comprising the following steps of:

providing a circuit substrate, wherein the circuit substrate comprises a dielectric layer and a circuit layer positioned on the surface of the dielectric layer, and the circuit substrate is divided into a first area, a second area and a third area which are sequentially connected from inside to outside;

covering shielding layers on two opposite surfaces of the circuit substrate positioned in the first area and the third area;

removing the dielectric layer in the second area; and

and removing the shielding layer to form the circuit board, wherein the circuit layer located in the second area is hollowed out of the dielectric layer, and the circuit layer located in the second area is connected with the first area and the third area.

2. The method of manufacturing a circuit board according to claim 1, further comprising the steps of:

and carrying out surface treatment on the circuit layer to form a protective layer on the surface of the circuit layer.

3. The method of claim 1, wherein the circuit substrate further comprises a fourth region, the first region surrounds the fourth region, and the dielectric layer and the circuit layer are not disposed in the fourth region.

4. The method of claim 3, wherein the step of forming the circuit substrate comprises:

providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises the dielectric layer and a copper layer positioned on the surface of the dielectric layer, and the single-sided copper-clad plate is divided into the first area, the second area and the third area which are sequentially connected from inside to outside; and

and carrying out circuit manufacturing on the copper layer to form the circuit layer.

5. The method of claim 4, wherein a portion of the dielectric layer and a portion of the circuit layer in the first region are removed to form the circuit substrate having the fourth region.

6. The method of manufacturing a circuit board according to claim 1, wherein after the step of removing the shielding layer, the method of manufacturing a circuit board further comprises the steps of:

and forming solder mask layers on two opposite surfaces of the dielectric layer, wherein the solder mask layers also cover the circuit layer.

7. The method of claim 1, wherein the circuit layer is disposed on both of opposite surfaces of the dielectric layer.

8. The circuit board is characterized by comprising a dielectric layer and a circuit layer positioned on the surface of the dielectric layer, wherein the circuit board is divided into a first area, a second area and a third area which are sequentially connected from inside to outside, the dielectric layer and the circuit layer are arranged in the first area and the third area, and the dielectric layer is arranged in the second area and is not arranged in the second area.

9. The circuit board of claim 8, further comprising a fourth region, wherein the first region surrounds the fourth region, and wherein the line layer and the dielectric layer are not disposed in the fourth region.

10. A lens module comprising the circuit board of any one of claims 8-9, and a sensor connected to the circuit layer in the first region.