CN115376982A - Positioning device, die bonder and positioning correction method - Google Patents

Positioning device, die bonder and positioning correction method Download PDF

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Publication number
CN115376982A
CN115376982A CN202111470691.8A CN202111470691A CN115376982A CN 115376982 A CN115376982 A CN 115376982A CN 202111470691 A CN202111470691 A CN 202111470691A CN 115376982 A CN115376982 A CN 115376982A
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China
Prior art keywords
chip
identification mark
information
suction nozzle
positioning
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CN202111470691.8A
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Chinese (zh)
Inventor
雷伟庄
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Weijian Intelligent Packaging Technology Shenzhen Co ltd
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Weijian Intelligent Packaging Technology Shenzhen Co ltd
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Priority to CN202111470691.8A priority Critical patent/CN115376982A/en
Publication of CN115376982A publication Critical patent/CN115376982A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

The invention relates to the technical field of die bonder, in particular to a positioning device, a die bonder and a positioning and correcting method. A positioning device is used for positioning a chip and comprises a die bonding table, a camera device and a material suction device used for adsorbing and moving the chip, wherein the camera device is arranged close to the die bonding table, a marking device is arranged on the material suction device, and an identification mark is arranged on the marking device; the camera device obtains the information of the identification mark in real time in the mounting process of the chip, and the material suction device moves according to the information of the identification mark to drive and adjust the chip. The camera device of the positioning device can acquire the information of the identification mark in real time and obtain the position information of the chip through calculation, so that the problem that the chip cannot be positioned above the die bonding table is solved, the position of the chip can be adjusted in real time through the material suction device until the chip is mounted on the substrate, the chip does not need to move in the horizontal direction, and the mounting accuracy is greatly improved.

Description

Positioning device, die bonder and positioning correction method
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of die bonder, in particular to a positioning device, a die bonder and a positioning and correcting method.
[ background of the invention ]
With the rapid progress of modern electronic technology, the preparation and production of electronic equipment are developed towards high precision, and the die bonder is an important device of a high-precision patch in the field of electronic technology.
Factors influencing the production efficiency of the die bonder are many, wherein a chip is mounted as the most important step in the die bonder, and meanwhile, a step of making mistakes easily is also provided, a product is likely to be unqualified due to slight deviation, so that the real-time position and state of the chip are required to be shot in real time in the chip mounting process of the die bonder so as to be adjusted conveniently and timely, the current chip positioning is to arrange a camera on the side surface of a die bonder table, the chip is required to be moved to the position above the camera and then is adjusted by using the camera, and the adjusted chip is directly moved to the position above a substrate for mounting without being adjusted. However, when the chip is horizontally moved above the substrate for mounting after being adjusted in this manner, some deviation may occur during the movement, resulting in insufficient mounting accuracy.
[ summary of the invention ]
The invention provides a positioning device, a die bonder and a positioning correction method, which aim to solve the problem that the mounting precision of the existing die bonder is insufficient.
In order to solve the technical problems, the invention provides the following technical scheme: a positioning device is used for positioning a chip and comprises a die bonding table, a camera device and a material suction device for sucking and moving the chip, wherein the camera device is arranged close to the die bonding table, a marking device is arranged on the material suction device, and an identification mark is arranged on the marking device; the camera device obtains the information of the identification mark in real time in the mounting process of the chip, and the material suction device moves according to the information of the identification mark to drive and adjust the chip.
Preferably, the material suction device comprises a body and a suction nozzle detachably connected to the body, and the marking device is arranged on one of the body or the suction nozzle in a surrounding mode.
Preferably, when the suction nozzle sucks the chip to move to one side of the die bonding table where the substrate is placed, the camera device acquires the information of the identification mark.
Preferably, the camera device directly obtains the identification mark information or the camera device obtains the identification mark information through the die bonding stage.
In order to solve the above technical problems, the present invention provides another technical solution as follows: a die bonder comprises the positioning device.
In order to solve the above technical problems, the present invention provides another technical solution as follows: a method of positional correction, comprising the steps of:
presetting an identification mark;
acquiring information of the identification mark through a camera device;
and adjusting the position of the chip through the material sucking device based on the identification mark information acquired in real time.
Preferably, the step of presetting the identification mark specifically includes:
arranging a marking device on a material suction device, and arranging a plurality of identification marks on the marking device, wherein each identification mark has a preset angle characteristic;
the offset value of each identification mark from the center point of the nozzle is recorded.
Preferably, the specific steps of acquiring the information of the identification mark by the image pickup device are as follows:
the chip is sucked by the sucking device and moved to the upper part of the die bonding table;
acquiring real-time position and angle information of the identification mark through a camera device;
calculating the real-time position of the center of the suction nozzle through the real-time position of the identification mark and the deviation value of the identification mark and the center of the suction nozzle;
and calculating the path to be moved and the rotating angle of the center of the suction nozzle according to the real-time position of the center of the suction nozzle, the position of the preset sticking point on the substrate and the angle information of the identification mark.
Preferably, the specific steps of adjusting the position of the chip by the suction device are as follows:
rotating and/or translating the chip by the suction device;
the chip is pasted and mounted on the preset pasting point of the substrate by the material sucking device.
Preferably, in the process of rotating and/or translating the chip by the suction device, the specific step of obtaining the identification mark information by the camera device is further repeated until the calculated chip position corresponds to the preset mounting point position of the substrate, and then the chip is mounted on the preset mounting point of the substrate by the suction device.
Compared with the prior art, the positioning device, the die bonder and the positioning and correcting method provided by the invention have the following beneficial effects:
1. a positioning device is used for positioning a chip; the chip mounting device comprises a die bonding table, a camera device and a material suction device, wherein a substrate to be mounted is placed above the die bonding table, and the material suction device is used for adsorbing and moving a chip and mounting the chip on the substrate; the marking device is arranged on the material suction device, the identification mark is arranged on the marking device, the identification mark can be understood to be fixed and not move relative to the material suction device, and after the material suction device sucks the chip, the chip is also fixed and not move relative to the material suction device, namely the position relationship between the chip and the identification mark can be determined, at the moment, the information of the identification mark can be identified through the camera device, the position information of the chip can be calculated by utilizing the information of the identification mark, and the problem that the chip cannot be positioned above the die bonding table is solved at the moment. Then, the real-time position information of the chip and the position information of the preset mounting point on the substrate can be used for calculating the angle and/or the position of the chip to be adjusted, and the position of the chip is driven to be adjusted by the translation and/or the rotation of the suction device, so that the mounting accuracy is ensured.
2. The material suction device comprises a body and a suction nozzle, wherein the suction nozzle is used for sucking a chip, the center position of the suction nozzle can represent the position of the chip, the body moves to drive the suction nozzle to move so as to drive the chip to move, and a marking device is annularly arranged on the body or the suction nozzle of the material suction device and can also move along with the movement of the material suction device; after the suction nozzle is connected to the body, the position relation between the suction nozzle and the body is fixed, so that the position of the identification mark on the marking device relative to the center of the suction nozzle is also fixed, the position of the center of the suction nozzle can be calculated by acquiring the information of the identification mark, and the position of the chip can be further determined.
3. The substrate is placed above the die bonding table, so that the die can be conveniently mounted, when the die moves above the die bonding table, the marking device arranged on the material suction device is also driven to move above the die bonding table, and the camera device can acquire the information of the identification mark and calculate the real-time information of the die so as to conveniently correct the die before the die is mounted on the substrate.
4. The camera device can be arranged on the side surface of the die bonding table, and the side camera device directly obtains the information of the identification mark, or a transparent area can be arranged on the die bonding table, and the camera device obtains the information of the identification mark through the transparent area.
5. The embodiment of the invention also provides a die bonder which has the same beneficial effects as the positioning device, and the details are not repeated herein.
6. The embodiment of the invention also provides a positioning correction method, which has the same beneficial effects as the positioning device, and is not described herein again.
7. According to the positioning correction method, the plurality of identification marks are arranged on the marking device, so that the identification marks can be shot in the visual field shot by the lens of the camera device when the chip moves above the die bonding table, because the rotation condition can occur in the process of moving the chip by the material suction device, each identification mark has a specific angle characteristic, the rotation angle can be calculated through the shot identification marks so as to perform correction, or some mounted chips have angle requirements, and the current angle of the chip and the angle required to be adjusted can be calculated by utilizing the identification marks; the actual position of the center of the suction nozzle can be calculated by recording the fixed offset value between each identification mark and the center of the suction nozzle and then calculating the position of the identification mark identified by the camera device.
8. The positioning correction method is characterized in that the position pasting point of the substrate is predetermined, the path required to move and the rotating angle can be calculated through the position pasting point information and the real-time position information of the center of the suction nozzle, and the correction method is very quick and accurate compared with other methods.
9. The positioning correction method provided by the invention finally needs to move and rotate the chip through the suction device, the rotation is to rotate around the central point of the suction nozzle, the position of the chip cannot be moved due to the rotation, only the angle of the chip and the position of the identification mark can be changed, so that the moving and rotating sequence can be exchanged, finally, the chip mounting is directly completed through the suction device, the chip mounting is directly performed after the correction, and the final mounting accuracy is influenced due to the absence of other steps in the middle.
10. The positioning correction method provided by the invention can repeatedly acquire the information of the identification mark in the process of rotating and/or translating the chip by the suction device, because the deviation possibly exists in the process of rotating and/or translating the chip, the deviation in adjustment can be solved by repeated calculation, and the chip mounting accuracy is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic view of a positioning assembly according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of a marking device of a positioning assembly according to a first embodiment of the present invention.
Fig. 3 is a schematic view of a die bonder according to a second embodiment of the invention.
Fig. 4 is a flowchart of a positioning correction method according to a third embodiment of the present invention.
Fig. 5 is a flowchart illustrating a step S1 of a positioning correction method according to a third embodiment of the present invention.
Fig. 6 is a flowchart illustrating a step S2 of a positioning correction method according to a third embodiment of the present invention.
Fig. 7 is a flowchart illustrating a step S3 of a positioning correction method according to a third embodiment of the present invention.
The attached drawings indicate the following:
1. a positioning device; 2. a die bonder; 3. positioning and correcting methods;
11. a die bonding table; 12. a camera device; 13. a material suction device; 14. a marking device; 15. a chip; 16. a substrate.
131. A body; 132. a suction nozzle; 141. identifying the mark;
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2, a first embodiment of the present invention provides a positioning apparatus, which is a positioning apparatus 1, for positioning a chip 15, and includes a die bonding stage 11, an image pickup device 12, and a material suction device 13 for sucking and moving the chip 15, wherein the image pickup device 12 is disposed near the die bonding stage 11, the material suction device 13 is disposed with a marking device 14, and the marking device 14 is disposed with an identification mark 141; the camera device 12 obtains the information of the identification mark 141 in real time during the mounting process of the chip 15, and the suction device 13 adjusts the chip 15 according to the information of the identification mark 141.
As can be understood, a substrate 16 to be mounted is placed above the die bonding table 11, and the suction device 13 is used for sucking and moving the chip 15 and mounting the chip 15 onto the substrate 16; the mark device 14 is arranged on the suction device 13, the identification mark 141 is arranged on the mark device 14, and it can be understood that the identification mark 141 is fixed and does not move relative to the suction device 13, and after the suction device 13 sucks the chip 15, the chip 15 is also fixed and does not move relative to the suction device 13, that is, the position relationship between the chip 15 and the identification mark 141 can be determined, at this time, the information of the identification mark 141 can be identified by the camera device 12, and the position information of the chip 15 can be calculated by using the information of the identification mark 141, at this time, the problem that the chip 15 cannot be positioned above the die bonding table 11 is solved. Then, the real-time position information of the chip 15 and the position information of the preset mounting point on the substrate 16 can be used for calculating the angle and/or position of the chip 15 to be adjusted and driving the adjustment of the position of the chip 15 through the translation and/or rotation of the suction device 13 so as to ensure the mounting accuracy, meanwhile, the camera device 12 can always obtain the information of the identification mark 141 in real time and calculate the position information of the chip 15 in real time during adjustment so as to ensure that the current adjusted position is correct, and if the current adjusted position is incorrect, the adjustment is carried out according to the recalculated position until the chip 15 is mounted on the substrate 16, so that the adjustment can be carried out before the chip 15 is mounted on the substrate 16, and the mounting accuracy is greatly improved. .
Further, the suction device 13 includes a body 131 and a suction nozzle 132 detachably connected to the body 131, and the marking device 14 is disposed around one of the body 131 or the suction nozzle 132. In one embodiment, the marker 14 is circumferentially disposed on the body 131.
It can be understood that the suction nozzle 132 is used for sucking the chip 15, the central position of the suction nozzle 132 represents the position of the chip 15, the body 131 moves to drive the suction nozzle 132 to move and then drive the chip 15 to move, the marking device 14 is annularly disposed on the body 131 of the suction device 13 or the suction nozzle 132, and the marking device 14 will also move along with the movement of the suction device; after the suction nozzle 132 is connected to the body 131, the suction nozzle is fixed and does not move, so the position of the identification mark 141 on the marking device 14 relative to the center of the suction nozzle 132 is also fixed, and the position of the center of the suction nozzle 132 can be calculated by acquiring the information of the identification mark 141, so as to determine the position of the chip 15.
Further, when the suction nozzle 132 sucks the chip 15 and moves to one side of the die bonding stage 11, the imaging device 12 acquires information of the identification mark 141.
It can be understood that the substrate 16 is placed above the die bonding stage 11 for mounting the chip 15, when the chip 15 moves above the die bonding stage 11, the marking device 14 disposed on the suction device 13 is also driven to move above the die bonding stage 11, and the camera device 12 recognizes the information of the identification mark 141 to calculate the real-time position information of the chip 15 for facilitating correction before the chip 15 is mounted on the substrate 16.
Alternatively, the marker 14 may be of any shape, but it is desirable to ensure that the marker 14 is disposed around the body 131 or the suction nozzle 132 to facilitate the placement of the plurality of identification marks 141 at a plurality of angles around the center of the suction nozzle 132. Specifically, in the first embodiment of the present invention, the marking device 14 is circular and has a center coaxial with the center of the suction nozzle.
Further, the imaging device 12 directly acquires the identification mark 141 information or the imaging device 12 acquires the identification mark 141 information through the die bonding stage 11.
Alternatively, the image pickup device 12 may be directly disposed on the side surface of the die bonding stage 11, so that the image pickup device 12 can directly photograph the identification mark 141 to obtain the information of the identification mark 141; alternatively, the die bonding stage 11 may be transparent, and the imaging device 12 may acquire the information of the identification mark 141 through the die bonding stage 11, or a transparent region may be provided in a region other than the region where the substrate 16 is placed on the die bonding stage 11, and the imaging device 12 may acquire the information of the identification mark 141 through the transparent region. Specifically, in the first embodiment of the present invention, the imaging device 12 is disposed on the side surface of the die bonding stage 11, and the imaging device 12 directly acquires the information of the identification mark 141.
Referring to fig. 3, a die bonder 2 according to a second embodiment of the present invention includes the positioning device 1 described above and the die bonder 2.
Referring to fig. 4, a third embodiment of the present invention provides a positioning correction method 3, including the following steps:
s1, presetting an identification mark;
s2, acquiring information of the identification mark through a camera device;
and S3, adjusting the position of the chip through a material suction device based on the identification mark information acquired in real time.
Specifically, referring to fig. 5, in the step S1, the following steps are further included:
s11, arranging a marking device on the material suction device, and arranging a plurality of identification marks on the marking device, wherein each identification mark has a preset angle characteristic;
and S12, recording the deviation value of each identification mark and the central point of the suction nozzle.
As can be appreciated, in step S11, since the field of view of the image capturing device is limited, a plurality of identification marks are provided on the marking device to ensure that the image capturing device can identify at least one identification mark when the suction device sucks the chip to move above the eutectic platform.
It is understood that each identification mark may be a different shape, pattern, or the same pattern or shape may use different colors for distinguishing each identification mark, each identification mark has a specific angular characteristic, such as an arrow indicating 0 degree, an ellipse indicating 1 degree, a rectangle indicating 2 degrees, etc., it is understood that the function of the identification mark is equivalent to that of a protractor.
In step S12, the position of each identification mark from the center of the nozzle is relatively constant, but the distance from each identification mark to the center of the nozzle may be the same or different, and a specific feature point is determined on each identification mark, and the offset value of the feature point from the center of the nozzle is recorded, i.e. the offset value represents the distance from the identification mark to the center of the nozzle.
Specifically, referring to fig. 6, in the step S2, the following steps are further included:
s21, sucking the chip by a sucking device and moving the chip to the upper part of a die bonding table;
s22, acquiring real-time position and angle information of the identification mark through a camera device;
s23, calculating the real-time position of the center of the suction nozzle through the real-time position of the identification mark and the deviation value of the identification mark and the center of the suction nozzle;
and S24, calculating the path required to move and the rotation angle of the center of the suction nozzle according to the real-time position of the center of the suction nozzle, the position of the preset sticking point on the substrate and the angle information of the identification mark.
It can be understood that the chip is sucked by the suction nozzle of the suction device, and the chip position can be determined by determining the central position of the suction nozzle.
The real-time position of the identification mark in S22 may be understood as a three-dimensional coordinate axis or a two-dimensional coordinate axis set in advance, where the real-time position represents a point coordinate thereon, and the angle information is an angle characteristic preset by the identification mark.
The preset position of the mounting point on the substrate in S24 is known, and the position of the mounting point, which is the position of the mounted chip previously set on the substrate, can be determined according to the position information.
It is understood that steps S21 to S24 describe a specific process for calculating the center of the nozzle, and the following description is made by way of specific examples, which are exemplified as follows: firstly, two-dimensional coordinate axes of an X axis and a Y axis are established in advance, and chip mounting points (X0 and Y0) on a substrate are preset in advance. When the chip is sucked by the sucking device and moved to the upper part of the die bonding table, if an identification mark representing 0 degree is detected in the visual field of the camera device but does not represent that the suction nozzle does not rotate, if the X axis is preset to be the positive direction, because the identification mark is not a point but a mark with a certain shape, two points with a certain distance are determined on each identification mark, wherein the connecting line of the two points passes through the center of the suction nozzle, the camera device can calculate the included angle theta between the straight line connecting the two points and the X axis after recognizing the coordinate information of the two points, if the theta is 0, the suction nozzle does not rotate, if the theta is not 0, the center of the suction nozzle can be represented to rotate by the theta degree, wherein the theta has positive and negative to represent the rotating direction; if the identification mark representing 10 degrees is identified, the rotation angle of the suction nozzle is 10 degrees plus theta degrees. And meanwhile, the camera device also identifies the coordinates (X1, Y1) of the characteristic point on the identification mark and the calibration deviation value d of the center of the suction nozzle, and then the position (X2, Y2) of the center of the suction nozzle is calculated by the formula:
X2＝X1－d×cosθ；
Y2＝Y1－d×sinθ；
and then the position of the center of the suction nozzle needing to be moved can be calculated through the coordinates (X2, Y2) of the center of the suction nozzle and the attachment points (X0, Y0). It can be understood that the chip is adsorbed on the suction nozzle, the chip is rotated by rotating the suction nozzle, and the chip is moved by moving the suction nozzle.
Specifically, referring to fig. 7, in the step S3, the following steps are further included:
s31, rotating and/or translating the chip through a material suction device;
and S31, mounting the chip on a preset mounting point of the substrate by using a suction device.
It is to be understood that, in step S31, it is determined whether the suction nozzle, on which the chip is attached, needs to be rotated and/or translated, based on the information obtained in the specific step of the foregoing S2, and the suction nozzle is adjusted, that is, the chip is adjusted. Exemplary are as follows: the camera device detects an identification mark representing 0 degree, the identification mark has an angle theta, the suction nozzle is rotated by rotating the suction device by theta degrees, only the position is deviated at the moment, and the suction nozzle is moved by the suction device at the moment. It will be appreciated that when the suction device rotates the suction nozzle, the position of the centre of the suction nozzle is not changed, i.e. the order of translation and rotation can be interchanged.
Further, in the process of rotating and/or translating the chip by the suction device, the specific steps of obtaining the identification mark information by the camera device are repeated until the calculated chip position corresponds to the preset mounting point position of the substrate, and then the chip is mounted on the preset mounting point of the substrate by the suction device.
The position of the center of the suction nozzle is changed in the moving process, the position of the identification mark is also changed, the position and the angle which need to be moved are calculated again according to the information of the identification mark which is repeatedly obtained, and then adjustment is carried out until the center of the suction nozzle which is calculated through the information of the identification mark obtained by the camera device can correspond to the preset attaching point information of the substrate, at the moment, the attaching of the chip is completed through the material suction device, and the accuracy of the attached chip is greatly improved through the method.
In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may also be determined from a and/or other information.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also appreciate that the embodiments described in this specification are exemplary and alternative embodiments, and that the acts and modules illustrated are not required in order to practice the invention.
In various embodiments of the present invention, it should be understood that the sequence numbers of the above-mentioned processes do not imply an inevitable order of execution, and the execution order of the processes should be determined by their functions and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.
The flowchart and block diagrams in the figures of the present application illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will be understood that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Compared with the prior art, the positioning device, the die bonder and the positioning and correcting method provided by the invention have the following beneficial effects:
1. a positioning device is used for positioning a chip; the chip mounting device comprises a die bonding table, a camera device and a material suction device, wherein a substrate to be mounted is placed above the die bonding table, and the material suction device is used for sucking and moving a chip and mounting the chip on the substrate; the marking device is arranged on the material suction device, the identification mark is arranged on the marking device, the identification mark can be understood to be fixed and not move relative to the material suction device, and after the material suction device sucks the chip, the chip is also fixed and not move relative to the material suction device, namely the position relationship between the chip and the identification mark can be determined, at the moment, the information of the identification mark can be identified through the camera device, the position information of the chip can be calculated by utilizing the information of the identification mark, and the problem that the chip cannot be positioned above the die bonding table is solved at the moment. Then, the real-time position information of the chip and the position information of the preset mounting point on the substrate can be used for calculating the angle and/or the position of the chip to be adjusted and driving the position of the chip to be adjusted through translation and/or rotation of the suction device so as to ensure the mounting accuracy, meanwhile, the camera device can always obtain the information of the identification mark in real time and calculate the position information of the chip in real time during adjustment so as to ensure that the current adjusted position is correct, if the position is incorrect, the adjustment is carried out according to the recalculated position until the chip is mounted on the substrate, so that the chip can be adjusted before being mounted on the substrate, and meanwhile, the mounting is directly carried out after the adjustment without moving in the horizontal direction, and the mounting accuracy is greatly improved.
2. The material suction device comprises a body and a suction nozzle, wherein the suction nozzle is used for sucking a chip, the center position of the suction nozzle can represent the position of the chip, the body moves to drive the suction nozzle to move so as to drive the chip to move, a marking device is annularly arranged on the body or the suction nozzle of the material suction device, and the marking device can also move along with the movement of the material suction device; after the suction nozzle is connected to the body, the position relation between the suction nozzle and the body is fixed, so that the position of the identification mark on the marking device relative to the center of the suction nozzle is also fixed, the position of the center of the suction nozzle can be calculated by acquiring the information of the identification mark, and the position of the chip can be further determined.
3. The substrate is placed above the die bonding table, so that the die can be conveniently mounted, when the die moves above the die bonding table, the marking device arranged on the material suction device is also driven to move above the die bonding table, and the camera device can acquire the information of the identification mark and calculate the real-time information of the die so as to conveniently correct the die before the die is mounted on the substrate.
4. The camera device can be arranged on the side surface of the die bonding table, and the side camera device directly obtains the information of the identification mark, or a transparent area can be arranged on the die bonding table, and the camera device obtains the information of the identification mark through the transparent area.
5. The embodiment of the invention also provides a die bonder which has the same beneficial effects as the positioning device, and the details are not repeated herein.
6. The embodiment of the invention also provides a positioning correction method, which has the same beneficial effects as the positioning device, and is not described herein again.
7. According to the positioning correction method, the plurality of identification marks are arranged on the marking device, so that the identification marks can be shot in the visual field shot by the lens of the camera device when the chip moves above the die bonding table, because the rotation condition can occur in the process of moving the chip by the material suction device, each identification mark has a specific angle characteristic, the rotation angle can be calculated through the shot identification marks so as to perform correction, or some mounted chips have angle requirements, and the current angle and the angle required to be adjusted can be calculated by the identification marks; the actual position of the center of the suction nozzle can be calculated by recording the fixed offset value between each identification mark and the center of the suction nozzle and then calculating the position of the identification mark identified by the camera device.
8. The positioning correction method is characterized in that the position pasting point of the substrate is predetermined, the path required to move and the rotating angle can be calculated through the position pasting point information and the real-time position information of the center of the suction nozzle, and the correction method is very quick and accurate compared with other methods.
9. The positioning correction method provided by the invention finally needs to move and rotate the chip through the suction device, the rotation is to rotate around the central point of the suction nozzle, the rotation does not cause the position of the chip to move, only the angle of the chip and the position of the identification mark can be changed, so that the moving and rotating sequence can be exchanged, finally, the chip mounting is directly completed through the suction device, the chip mounting is directly performed after the correction, and other steps do not exist in the middle, so that the final mounting accuracy is influenced.
10. The positioning correction method provided by the invention can repeatedly acquire the information of the identification mark in the process of rotating and/or translating the chip by the suction device, because deviation possibly exists in the process of rotating and/or translating the chip, the deviation occurring in adjustment is solved through repeated calculation, and the chip mounting accuracy is improved.
The embodiment of the invention discloses a positioning device, a die bonder and a positioning correction method. The detailed description is given, and the principle and the embodiment of the present invention are explained by applying specific examples, and the above description of the embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for the persons skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present description should not be construed as a limitation to the present invention, and any modification, equivalent replacement, and improvement made within the principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a positioner for fix a position chip position which characterized in that: the chip picking-up device comprises a die bonding table, a camera device and a material sucking device for sucking and moving a chip, wherein the camera device is arranged close to the die bonding table, a marking device is arranged on the material sucking device, and an identification mark is arranged on the marking device; the camera device obtains the information of the identification mark in real time in the mounting process of the chip, and the material suction device moves according to the information of the identification mark to drive and adjust the chip.
2. The positioning device of claim 1, wherein: the material suction device comprises a body and a suction nozzle detachably connected to the body, and the marking device is arranged on one of the body or the suction nozzle in a surrounding mode.
3. The positioning device of claim 2, wherein: and when the suction nozzle sucks the chip to move to one side of the die bonding table for placing the substrate, the camera device acquires the information of the identification mark.
4. The positioning apparatus of claim 2, wherein: the camera device directly obtains the identification mark information or the camera device obtains the identification mark information through the die bonding table.
5. A die bonder is characterized in that: comprising a positioning device according to any of claims 1-4.
6. A positioning correction method is characterized in that: the method comprises the following steps:
presetting an identification mark;
acquiring information of the identification mark through a camera device;
and adjusting the position of the chip through the material suction device based on the identification mark information acquired in real time.
7. A method of positional correction according to claim 6, wherein: the step of presetting the identification mark specifically comprises the following steps:
arranging a marking device on a material suction device, and arranging a plurality of identification marks on the marking device, wherein each identification mark has a preset angle characteristic;
the offset value of each identification mark from the center point of the nozzle is recorded.
8. A method of positional correction according to claim 7, wherein: the specific steps of acquiring the information of the identification mark through the camera device are as follows:
the chip is sucked by the sucking device and moved to the upper part of the die bonding table;
acquiring real-time position and angle information of the identification mark through a camera device;
calculating the real-time position of the center of the suction nozzle according to the real-time position of the identification mark and the deviation value of the identification mark and the center of the suction nozzle;
and calculating the path required to move and the rotation angle of the center of the suction nozzle according to the real-time position of the center of the suction nozzle, the position of the preset sticking point on the substrate and the angle information of the identification mark.
9. The method of claim 8, wherein: the specific steps of adjusting the position of the chip through the material suction device are as follows:
rotating and/or translating the chip by the suction device;
the chip is pasted and mounted on the preset pasting point of the substrate by the material sucking device.
10. A method of positional correction according to claim 9, wherein: and in the process of rotating and/or translating the chip by the suction device, repeating the specific steps of acquiring the identification mark information by the camera device until the calculated chip position corresponds to the preset mounting point position of the substrate, and mounting the chip on the preset mounting point of the substrate by the suction device.
CN202111470691.8A 2021-12-03 2021-12-03 Positioning device, die bonder and positioning correction method Pending CN115376982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111470691.8A CN115376982A (en) 2021-12-03 2021-12-03 Positioning device, die bonder and positioning correction method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111470691.8A CN115376982A (en) 2021-12-03 2021-12-03 Positioning device, die bonder and positioning correction method

Publications (1)

Publication Number Publication Date
CN115376982A true CN115376982A (en) 2022-11-22

Family

ID=84060454

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111470691.8A Pending CN115376982A (en) 2021-12-03 2021-12-03 Positioning device, die bonder and positioning correction method

Country Status (1)

Country Link
CN (1) CN115376982A (en)

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