CN115376940A - Manufacturing method of clamp welding type packaging device, clamp welding type packaging device and electronic equipment - Google Patents

Manufacturing method of clamp welding type packaging device, clamp welding type packaging device and electronic equipment Download PDF

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Publication number
CN115376940A
CN115376940A CN202210808042.2A CN202210808042A CN115376940A CN 115376940 A CN115376940 A CN 115376940A CN 202210808042 A CN202210808042 A CN 202210808042A CN 115376940 A CN115376940 A CN 115376940A
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China
Prior art keywords
frame
conductive
metal
chip
layer
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CN202210808042.2A
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Chinese (zh)
Inventor
钟仕杰
雷云
李俞虹
高宸山
宋关强
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Sky Chip Interconnection Technology Co Ltd
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Sky Chip Interconnection Technology Co Ltd
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Priority to CN202210808042.2A priority Critical patent/CN115376940A/en
Publication of CN115376940A publication Critical patent/CN115376940A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4828—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

The invention discloses a manufacturing method of a clamp welding type packaging device, the clamp welding type packaging device and electronic equipment, wherein the manufacturing method comprises the following steps: preparing a first frame and a second frame; the first frame is provided with a plurality of first conductive parts arranged at intervals, each first conductive part comprises a copper strip part and two metal bulges, the second frame is provided with a plurality of second conductive parts arranged at intervals, and each second conductive part comprises two metal base platforms; preparing a plurality of chips including pads, one chip being disposed on one metal base in each of the second conductive members of the second frame; welding the first frame and a second frame provided with a chip; plastically packaging the first frame, the chip and the second frame to form a plastic packaging layer; and separating from the interval area between two adjacent first conductive parts to form a plurality of packaged devices. Through the mode, the production efficiency of the clamp welding type packaging device can be improved.

Description

Manufacturing method of clamp welding type packaging device, clamp welding type packaging device and electronic equipment
Technical Field
The present invention relates to the field of package device technologies, and in particular, to a method for manufacturing a clip-on package device, and an electronic device.
Background
Most of traditional chip packages adopt a wire bond mode to realize interconnection between a chip and a frame, but the wire diameter of the wire bond limits that the package form cannot bear large current and large voltage, and the package form cannot be applied to high-power devices.
In order to solve the problem of high-power application, a Clip bond process is available, the process can well solve the bearing problem of large current and large voltage, and the heat dissipation performance is better. However, the process has the disadvantages of great difficulty, high cost and low productivity, so that the process is applied less frequently.
Disclosure of Invention
The invention mainly solves the technical problem of providing a manufacturing method of a clamp welding type packaging device, the clamp welding type packaging device and electronic equipment, which can reduce the production cost of the clamp welding type packaging device and improve the production efficiency of the clamp welding type packaging device.
In order to solve the above technical problem, one technical solution adopted by the present invention is to provide a method for manufacturing a clip-on package device, the method including the steps of: preparing a first frame and a second frame; the first frame is provided with a plurality of first conductive parts arranged at intervals, each first conductive part comprises a copper strip part and two metal bulges, the second frame is provided with a plurality of second conductive parts arranged at intervals, and each second conductive part comprises two metal base platforms; preparing a plurality of chips including pads, one chip being disposed on one metal base in each of the second conductive members of the second frame; welding the first frame and a second frame provided with a chip; plastically packaging the first frame, the chip and the second frame to form a plastic packaging layer; and separating from the interval area between two adjacent first conductive parts to form a plurality of packaged devices.
Wherein the step of preparing the first frame and the second frame comprises: preparing a first conductive layer and a second conductive layer; etching or/and punching the first conducting layer and the second conducting layer to form a first frame and a second frame, wherein the first frame is provided with a plurality of first conducting parts arranged at intervals, the first conducting parts comprise copper strip parts and two metal bumps, the second frame is provided with a plurality of second conducting parts arranged at intervals, and the second conducting parts comprise two metal base platforms.
The projection of the metal protrusion on the second frame along the arrangement direction of the first frame and the second frame is partially overlapped with the metal base.
Wherein the step of preparing a plurality of chips including pads, one chip being disposed on one metal base in each of the second conductive parts of the second frame, comprises: and manufacturing a first welding layer on one side of one metal base platform in each second conductive component, and connecting the chip and one metal base platform by using the first welding layer.
Before the first frame and the second frame provided with the chip are welded, the method comprises the following steps: a second solder layer and a third solder layer are formed on the sides of the two metal bumps in each first conductive component remote from the copper strip portion.
Wherein, the step of welding the first frame with the chip and the second frame comprises: connecting the bonding pad of each chip with one metal bump in each first conductive member in the first frame by using a second bonding layer; the other metal bump in each of the first conductive members in the first frame and the other metal base in each of the second conductive members in the second frame are connected by a third solder layer.
Wherein one metal base in the chip and the second conductive part is connected by the first soldering layer; connecting the chip and one metal bump in the first conductive part through a second welding layer; connecting the other metal bump in the first conductive component and the other metal base in the second conductive component through a third welding layer; the first welding layer, the second welding layer and the third welding layer are formed by arranging conductive glue or/and solder on one side of the metal base station or/and the metal bump in a steel mesh printing or/and silk screen printing or/and dispensing mode.
In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a clip-on package device, which is manufactured by the above clip-on package method, and includes: a first conductive component comprising a copper strap portion and two metal bumps; a second conductive component comprising two metal pedestals; the chip comprises a bonding pad, and is arranged on one side of one of the metal bases; and the plastic packaging layer at least covers the first conductive part, the second conductive part and the chip.
Wherein, press from both sides formula of welding encapsulation device still includes: the first welding layer is arranged on one side of one of the metal base platforms and is used for connecting the chip with the one of the metal base platforms; the second welding layer is arranged on one side, away from the copper strip part, of one of the metal bumps and is used for connecting the bonding pad of the chip with one of the metal bumps; and the third welding layer is arranged on one side of the other metal bulge far away from the copper strip part and is connected with the other metal bulge and the other metal base.
In order to solve the above technical problem, another technical solution of the present invention is to provide an electronic device, where the electronic device includes any one of the above clip-on package devices.
The invention has the beneficial effects that: different from the situation of the prior art, the manufacturing method of the clamp welding type packaging device utilizes the first frame provided with the first conductive parts arranged at a plurality of intervals, the second frame provided with the second conductive parts arranged at a plurality of intervals and the chips provided with the bonding pads to simultaneously manufacture a plurality of clamp welding type packaging devices, namely, the whole manufacturing scheme of the copper strip is adopted, so that the welding efficiency of the chips and the frames can be effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an embodiment of a clip-on package device according to the present application;
FIG. 2 is a schematic flow chart illustrating a method for manufacturing a clip-on package device according to a first embodiment of the present invention;
FIG. 3 is a schematic flow chart illustrating a method for manufacturing a clip-on package device according to a second embodiment of the present invention;
FIG. 4 is a schematic flow chart illustrating a method for manufacturing a clip-on package device according to a third embodiment of the present invention;
FIG. 5 is a schematic flow chart illustrating a fourth embodiment of a method for manufacturing a clip-on package device according to the present invention;
FIG. 6 is a schematic flow chart illustrating a fifth embodiment of a method for fabricating a clip-on package device according to the present invention;
fig. 7a to 7i are schematic structural diagrams of an embodiment corresponding to steps S601 to S607 in fig. 6.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, in which fig. 1 is a schematic structural diagram of an embodiment of a clip-on package device according to the present application, the clip-on package device 10 at least includes: a first conductive component 100, first conductive component 100 comprising a copper strip portion 101 and two metal bumps 102; a second conductive member 103, the second conductive member 103 including two metal bases 104; a chip 105 including a pad, the chip 105 being disposed on one side of one of the metal pedestals 104; and the plastic packaging layer 106, wherein the plastic packaging layer 106 at least covers the first conductive component 100, the chip 105 and the second conductive component 103.
In this embodiment, the chip 105 is connected to one metal base 104 of the second conductive component 103, and then the chip 105 is connected to one metal bump 102 of the first conductive component 100, and the other metal base 104 of the second conductive component 103 is connected to one metal bump 102 of the first conductive component 100, so as to achieve interconnection and conduction between the first conductive component 100 and the chip 105 as well as between the first conductive component 103.
The molding layer 106 at least covers the first conductive component 100, the chip 105 and the second conductive component 103. The function of the molding layer 106 is to protect and fix the first conductive component 100 and the chip 105 as well as the second conductive component 103.
Through the embodiment, the first conductive part, the chip and the second conductive part in the clip-on packaging device can be interconnected and conducted.
In another embodiment, in order to connect the chip 105 and the first conductive member 100, the chip 105 and the second conductive member 103, and the first conductive member 100 and the second conductive member 103, a first solder layer 107 is provided on one side of one metal base 104 in the second conductive member 103; providing a second solder layer 108 on the side of first conductive component 100 where one metal bump 102 is distal from copper strap portion 101; a third solder layer 109 is provided on the first conductive component 100 on the side of the further metal bump 102 remote from the copper strip portion 101.
In the above embodiment, the first bonding layer, the second bonding layer, and the third bonding layer are used to connect and connect the first conductive member to the chip and the second conductive member.
The application also provides a manufacturing method of the clamping welding type packaging device, and the manufacturing method can be used for manufacturing the clamping welding type packaging device. Referring to fig. 2, fig. 2 is a schematic flow chart illustrating a method for manufacturing a clip-on package device according to a first embodiment of the present invention. The manufacturing method of the clamping welding type packaging device in the embodiment comprises the following steps:
s201: a first frame provided with a plurality of first conductive members arranged at intervals and including a copper strip portion and two metal bumps, and a second frame provided with a plurality of second conductive members arranged at intervals and including two metal bases are prepared.
It is understood that in the actual manufacturing process of the clip-on package device, a plurality of clip-on package devices can be manufactured at one time, that is, the first frame is formed by connecting a plurality of first conductive components arranged at intervals, and the second frame is formed by connecting a plurality of second conductive components arranged at intervals, wherein the number of the first conductive components and the number of the second conductive components are the same, and a separable cutting boundary is arranged between the adjacent first conductive components and the adjacent second conductive components.
S202: a plurality of chips including pads are prepared, one chip being disposed on one metal base in each of the second conductive members of the second frame.
It will be appreciated that the clip-on package device needs to have chips to perform its function, where the number of chips is the same as the number of first conductive members and one side of each chip is provided with a pad. The chips are core portions of the clip-on packaged devices, which contain integrated circuits therein, and therefore, each chip can be disposed on one side of one of the metal pedestals of each of the second conductive members of the second frame.
S203: and welding the first frame and the second frame provided with the chip.
After each chip is arranged on one side of the corresponding metal base, the first frame needs to be attached to the second frame provided with the chip, so that the first frame is connected and conducted with the chip and the second frame.
S204: and plastically packaging the first frame, the chip and the second frame to form a plastic packaging layer.
In order to fix and protect the combined structure formed by the first frame, the chip and the second frame and avoid the damage and short circuit of the chip, the first frame, the chip and the second frame need to be subjected to plastic packaging to form a plastic packaging layer. The plastic packaging layer at least coats the first frame, the chip and the second frame.
It is understood that the molding material of the molding layer in this embodiment may be resin or plastic. For example, a plastic package layer may be formed on a side of the second frame away from the chip by silk-screen printing of resin or laminating of thermoplastic plastics such as polypropylene, which may not only lower the cost, but also ensure reliable fixing of the chip or protection of the device structure.
S205: and separating from the interval area between two adjacent first conductive parts to form a plurality of packaged devices.
After the first frame, the chip and the second frame are subjected to plastic packaging to form a plastic packaging layer, the first frame, the chip and the second frame are separated from an interval area between two adjacent first conductive parts, namely, the adjacent device structures are separated from a cutting boundary between two adjacent first conductive parts, and then each separated device structure forms a clamping welding type packaging device.
In this embodiment, the plurality of first conductive parts and the second conductive parts are simultaneously fabricated and generated through the prepared first frame including the plurality of first conductive parts arranged at intervals and the prepared second frame including the plurality of second conductive parts arranged at intervals, so that the production efficiency of the fabrication method of the clip-on package device in this embodiment is improved, then the plurality of chips including the bonding pads are prepared, and each chip is arranged on one metal base in each second conductive part of the second frame, that is, the chip is firstly connected with the second frame to fix the position of the chip, thereby ensuring that the chip is not displaced in the connection process with the first frame; and then welding the first frame and the second frame provided with the chip to form a packaging structure which is formed by interconnecting and conducting the first frame, the chip and the second frame, and simultaneously improving the welding efficiency of the production process of the packaging device. The manufacturing method for integrally generating the plurality of clamping welding type packaging devices and then separating the clamping welding type packaging devices not only can effectively reduce the production cost, but also can improve the production efficiency of the manufacturing method in the actual production process.
Referring to fig. 3, fig. 3 is a schematic flow chart illustrating a manufacturing method of a clip-on package device according to a second embodiment of the present invention. The manufacturing method of the clip-on package device in the embodiment includes the following steps:
s301: a first conductive layer and a second conductive layer are prepared.
Specifically, in the present embodiment, the first conductive layer and the second conductive layer are copper foils processed to have a desired size, and in other embodiments, the first conductive layer and the second conductive layer may also be other conductive materials with excellent conductivity, which is not limited herein.
S302: and etching or/and punching the first conducting layer and the second conducting layer to form a first frame and a second frame, wherein the first frame is provided with a plurality of first conducting parts arranged at intervals, the first conducting parts comprise copper strip parts and two metal bulges, the second frame is provided with a plurality of second conducting parts arranged at intervals, and the second conducting parts comprise two metal base platforms.
Specifically, the first conductive layer may be chemically etched or die-cut to form a first frame, that is, the finally obtained first frame is provided with a plurality of first conductive components arranged at intervals, and each first conductive component includes a copper strip portion and two metal bumps; the second conductive layer may be chemically etched or die-cut to form a second frame, that is, the finally obtained second frame is provided with a plurality of second conductive members arranged at intervals, and each second conductive member includes two metal bases.
S303: a plurality of chips including pads are prepared, and one chip is disposed on one metal base in each of the second conductive members of the second frame.
S304: and welding the first frame and the second frame provided with the chip.
S305: and carrying out plastic packaging on the first frame, the chip and the second frame to form a plastic packaging layer.
S306: and separating from the interval area between two adjacent first conductive components to form a plurality of packaged devices.
Steps S303 to S306 provided in this embodiment are substantially similar to steps S202 to S205 in the first embodiment of the method for manufacturing a clip-on package device provided in this application, and are not described herein again.
The foregoing step S201 in the first embodiment specifically includes steps S301 and S302 in this embodiment, and this embodiment is different from the first embodiment of the method for manufacturing a clip-on package device in that the first conductive layer and the second conductive layer are etched or/and punched to form the first frame and the second frame, where the first frame and the second frame formed by etching can reduce the production cost increased by manufacturing a frame mold.
In another embodiment, in order to make the metal bump fit with the chip and the metal base in the position without deviation during the soldering process between the first frame and the second frame provided with the chip, the projection of the metal bump on the second frame along the arrangement direction of the first frame and the second frame may be partially overlapped with the metal base during the formation process of the first frame and the second frame.
Through setting up metal protruding and metal base station positional relation, can guarantee to carry out the welding process of first frame with the second frame that is provided with the chip, the second frame can be correctly connected and switch on with chip and second frame.
Referring to fig. 4, fig. 4 is a schematic flow chart illustrating a method for manufacturing a clip-on package device according to a third embodiment of the present invention. The manufacturing method of the clip-on package device in the embodiment includes the following steps:
s401: a first conductive layer and a second conductive layer are prepared.
S402: etching or/and punching the first conducting layer and the second conducting layer to form a first frame and a second frame, wherein the first frame is provided with a plurality of first conducting parts arranged at intervals, the first conducting parts comprise copper strip parts and two metal bulges, the second frame is provided with a plurality of second conducting parts arranged at intervals, and the second conducting parts comprise two metal base platforms.
In this implementation scenario, step S401 and step S402 provided in this embodiment are substantially similar to step S301 and step S302 in the second embodiment of the method for manufacturing a clip-on package device provided in this application, and are not described herein again.
S403: fabricating a first solder layer on one side of one of the metal pedestals in each of the second conductive features, and connecting each of the chips with one of the metal pedestals in each of the second conductive features using the first solder layer.
It is understood that the placement of the chip on one metal submount in each second conductive part of the second frame is achieved by the first solder layer.
S404: and welding the first frame and the second frame provided with the chip.
S405: and plastically packaging the first frame, the chip and the second frame to form a plastic packaging layer.
S406: and separating from the interval area between two adjacent first conductive parts to form a plurality of packaged devices.
In this implementation scenario, steps S404 to S406 in this embodiment are substantially similar to steps S304 to S306 in the second embodiment of the method for manufacturing a clip-on package device provided in this application, and are not described herein again.
Step S303 in the foregoing second embodiment specifically includes step S403 in this embodiment, and this embodiment is different from the second embodiment of the manufacturing method of the clip-on package device in that a first soldering layer is manufactured on one side of one of the metal pedestals in each of the second conductive components, and the first soldering layer is used to achieve connection conduction between the chip and the metal pedestals.
Referring to fig. 5, fig. 5 is a schematic flow chart illustrating a fourth embodiment of a method for manufacturing a clip-on package device according to the present application. The manufacturing method of the clip-on package device in the embodiment includes the following steps:
s501: a first conductive layer and a second conductive layer are prepared.
S502: and etching or/and punching the first conducting layer and the second conducting layer to form a first frame and a second frame, wherein the first frame is provided with a plurality of first conducting parts arranged at intervals, the first conducting parts comprise copper strip parts and two metal bulges, the second frame is provided with a plurality of second conducting parts arranged at intervals, and the second conducting parts comprise two metal base platforms.
S503: fabricating a first solder layer on one side of one of the metal pedestals in each of the second conductive features, and connecting each of the chips with one of the metal pedestals in each of the second conductive features using the first solder layer.
In this implementation scenario, steps S501 to S503 provided in this embodiment are substantially similar to steps S401 to S403 in the third embodiment of the method for manufacturing a clip-on package device provided in this application, and are not described herein again.
S504: a second solder layer and a third solder layer are formed on the sides of the two metal bumps in each first conductive component remote from the copper strip portion.
It will be appreciated that soldering the first frame to the second frame provided with the chip requires the use of a second solder layer and a third solder layer, i.e. the second solder layer and the third solder layer are made on one side of the two metal bumps in each first conductive part in the first frame, respectively.
S505: and welding the first frame and the second frame provided with the chip.
S506: and carrying out plastic packaging on the first frame, the chip and the second frame to form a plastic packaging layer.
S507: and separating from the interval area between two adjacent first conductive parts to form a plurality of packaged devices.
In this implementation scenario, step S505 and step S507 provided in this embodiment are substantially similar to step S404 and step S406 in the third embodiment of the method for manufacturing a clip-on package device provided in this application, and are not repeated here.
Step S504 in this embodiment may be between step S403 and step S404, or before step S403, and this embodiment is different from the third embodiment of the method for manufacturing a clip-on package device described above in that this embodiment manufactures a second solder layer and a third solder layer on the sides of the two metal bumps of each first conductive member away from the copper strip portion, and the purpose of manufacturing the second solder layer and the third solder layer is to connect the first frame and the second frame provided with the chip.
Referring to fig. 6, fig. 6 is a schematic flow chart illustrating a fifth embodiment of a method for manufacturing a clip-on package device according to the present application. The manufacturing method of the clip-on package device in the embodiment includes the following steps:
s601: a first conductive layer and a second conductive layer are prepared.
S602: etching or/and punching the first conducting layer and the second conducting layer to form a first frame and a second frame, wherein the first frame is provided with a plurality of first conducting parts arranged at intervals, the first conducting parts comprise copper strip parts and two metal bulges, the second frame is provided with a plurality of second conducting parts arranged at intervals, and the second conducting parts comprise two metal base platforms.
S603: and manufacturing a first welding layer on one side of one metal base platform in each second conductive component, and connecting each chip with one metal base platform in each second conductive component by using the first welding layer.
S604: a second solder layer and a third solder layer are formed on the sides of the two metal bumps in each first conductive component remote from the copper strip portion.
In this implementation scenario, steps S601 to S604 provided in this embodiment are substantially similar to steps S501 to S504 in the third embodiment of the method for manufacturing a clip-on package device provided in this application, and are not described herein again.
S605: connecting the bonding pad of each chip and one metal bump in each first conductive part in the first frame by using a second welding layer; and connecting the other metal bump in each first conductive component in the first frame with the other metal base in each second conductive component in the second frame by using a third welding layer.
Specifically, the chip and the metal bump in the first conductive component are connected by the second bonding layer formed in step S604, and the metal bump in the first conductive component and the metal base in the second conductive component are connected by the third bonding layer formed in step S604, so that the first frame and the second frame provided with the chip are tightly attached.
S606: and plastically packaging the first frame, the chip and the second frame to form a plastic packaging layer.
S607: and separating from the interval area between two adjacent first conductive components to form a plurality of packaged devices.
In this implementation scenario, step S606 and step S607 provided in this embodiment are substantially similar to step S506 and step S507 in the third embodiment of the method for manufacturing a clip-on package device provided in this application, and are not described again here.
The step S505 in the third embodiment specifically includes the step S605 in this embodiment, and the difference between this embodiment and the third embodiment of the method for manufacturing a clip-on package device is that the first frame, the chip and the second frame are connected by the second bonding layer and the third bonding layer, so that the first frame and the second frame provided with the chip are tightly attached.
In another embodiment, in order to manufacture the first welding layer, the second welding layer and the third welding layer, the first welding layer, the second welding layer and the third welding layer are formed by arranging the conductive glue or/and the solder on one side of the metal base platform or/and the metal bump in a steel mesh printing or/and silk screen or/and dispensing manner.
In the embodiment, the first welding layer, the second welding layer and the third welding layer are made of the conductive glue or/and the solder in a steel mesh printing or/and silk screen printing or/and dispensing mode, so that the welding efficiency can be improved.
Referring to fig. 6 and fig. 7a to 7i, fig. 6 is a schematic flow chart of a fourth embodiment of a method for manufacturing a clip-on package device according to the present application, and fig. 7a to 7i are schematic structural diagrams of an embodiment corresponding to steps S601 to S607 in fig. 6. The manufacturing method of the clamping welding type packaging device in the embodiment comprises the following steps:
s601: a first conductive layer and a second conductive layer are prepared.
Specifically, as shown in fig. 7a, in one embodiment, the first conductive layer 1010 and the second conductive layer 1011 may be copper foils processed to have a desired size, and in other embodiments, the first conductive layer may also be other conductive materials with excellent conductivity, which is not limited herein.
S602: etching or/and punching the first conducting layer and the second conducting layer to form a first frame and a second frame, wherein the first frame is provided with a plurality of first conducting parts arranged at intervals, the first conducting parts comprise copper strip parts and two metal bulges, the second frame is provided with a plurality of second conducting parts arranged at intervals, and the second conducting parts comprise two metal base platforms.
Referring to fig. 7b, 7c and 7d, in one embodiment, specifically, as shown in fig. 7b, photosensitive films 1012 are attached to both sides of the first conductive layer 1010; as shown in fig. 7c, the first conductive layer 1010 with the photosensitive film 1012 thereon is processed by double-sided exposure, development and chemical etching to form a first frame, wherein the copper strip portion 101 is etched and formed simultaneously on both sides, and the metal bump 102 is etched and formed on one side; as shown in fig. 7d, the photosensitive film 1012 remaining after the etching process is also removed. The resulting first frame is provided with a plurality of first conductive parts 100 arranged at intervals, the first conductive parts 100 comprising a copper strip portion 101 and two metal bumps 102. The first frame is formed by chemical etching, so that the development cost of the mold can be reduced, and the production cost is reduced.
As shown in fig. 7d, the second frame is formed by punching the second conductive layer 1011 using a die, that is, the finally obtained second frame is provided with a plurality of second conductive members 103 arranged at intervals, and the second conductive members 103 include two metal bases 104.
S603: and manufacturing a first welding layer on one side of one metal base platform in each second conductive component, and connecting each chip with one metal base platform in each second conductive component by using the first welding layer.
Specifically, as shown in fig. 7e, in one embodiment, the first soldering layer 107 is formed by disposing conductive glue or/and solder on one side of the metal base 104 by means of steel screen printing or/and silk screen printing or/and dispensing.
The chip 105 is connected to one of the metal pedestals 104 by the first solder layer 107 formed as described above to fix the chip 105 to the second conductive member 103.
S604: a second solder layer and a third solder layer are formed on the sides of the two metal bumps in each first conductive component remote from the copper strip portion.
Specifically, as shown in fig. 7f, in one embodiment, the second soldering layer 108 and the third soldering layer 109 are formed by disposing conductive glue or/and solder on one side of the metal bump 102 by means of screen printing or/and silk-screening or/and dispensing.
S605: connecting the bonding pad of each chip and one metal bump in each first conductive part in the first frame by using a second welding layer; the other metal bump in each of the first conductive members in the first frame and the other metal base in each of the second conductive members in the second frame are connected by a third solder layer.
Specifically, in one embodiment, with reference to fig. 7f and 7g, the chip 105 is connected to the metal bump 102 in the first conductive component 100 by the formed second solder layer 108, and the metal bump 102 in the first conductive component 100 is connected to the metal base 104 in the second conductive component 103 by the formed third solder layer 109, so that the first frame is closely attached to the second frame provided with the chip 105.
S606: and plastically packaging the first frame, the chip and the second frame to form a plastic packaging layer.
Specifically, as shown in fig. 7h, in one embodiment, in order to fix and protect the combined structure formed by the first frame and the chip 105 and the second frame, and to avoid the damage and short circuit of the chip 105, the first frame and the chip 105 and the second frame need to be plastically molded to form the plastic package layer 106. The molding compound layer 106 at least covers the first frame, the chip 105 and the second frame.
S607: and separating from the interval area between two adjacent first conductive components to form a plurality of packaged devices.
Specifically, as shown in fig. 7i, in an embodiment, after the first frame, the chip 105 and the second frame are subjected to plastic molding to form the molding layer 106, the adjacent device structures are separated from the spacing region between the two adjacent first conductive components 100, that is, the adjacent device structures are separated from the cutting boundary between the two adjacent first conductive components 100, so that each separated device structure forms a clip-on package device.
Through the embodiment, the first frame comprising the plurality of first conductive parts is formed by utilizing a chemical etching mode, so that the first conductive parts can be processed more quickly, and the production efficiency can be effectively improved due to the adoption of the manufacturing method for integrally producing the clip-welding type packaging device.
The clip-on package device can be prepared by the method for manufacturing the clip-on package device provided by any embodiment of the application.
The present application further provides an electronic device having any of the above clip-on package devices. The electronic device may also include components such as a display screen that cooperates with the integrated circuit and a wireless transceiver that cooperates with the integrated circuit. The electronic device may be a smartphone, computer, tablet, wearable device, mobile power source, or the like.
It is noted that, in the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications that can be made by using equivalent structures or equivalent principles in the contents of the specification and the drawings or directly or indirectly applied to other related technical fields are also included in the scope of the present application.

Claims (10)

1. A method of making a clip on package device, the method comprising:
preparing a first frame and a second frame; the first frame is provided with a plurality of first conductive parts arranged at intervals, each first conductive part comprises a copper strip part and two metal bulges, the second frame is provided with a plurality of second conductive parts arranged at intervals, and each second conductive part comprises two metal bases;
preparing a plurality of chips including pads, one chip being disposed on one of the metal pedestals in each of the second conductive parts of the second frame;
welding the first frame and a second frame provided with the chip;
plastically packaging the first frame, the chip and the second frame to form a plastic packaging layer;
and separating from the interval area between two adjacent first conductive parts to form a plurality of packaged devices.
2. The method of manufacturing of claim 1, wherein the step of preparing the first frame and the second frame comprises:
preparing a first conductive layer and a second conductive layer;
etching or/and punching the first conducting layer and the second conducting layer to form the first frame and the second frame, wherein the first frame is provided with a plurality of first conducting parts arranged at intervals, the first conducting parts comprise the copper strip parts and two metal bumps, the second frame is provided with a plurality of second conducting parts arranged at intervals, and the second conducting parts comprise two metal bases.
3. The manufacturing method according to claim 1, wherein a projection of the metal projection on the second frame along the arrangement direction of the first frame and the second frame coincides with the metal base.
4. The method of manufacturing according to claim 1, wherein the step of preparing a plurality of chips including pads, one chip being provided on one of the metal submounts in each of the second conductive parts of the second frame, includes:
and manufacturing a first welding layer on one side of one of the metal bases in each second conductive component, and connecting the chip and one of the metal bases by using the first welding layer.
5. The method of manufacturing according to claim 1, wherein before the bonding the first frame and the second frame provided with the chip, the method includes:
and manufacturing a second welding layer and a third welding layer on one side, away from the copper strip part, of the two metal bulges in each first conductive component.
6. The method of manufacturing according to claim 5, wherein the step of soldering the first frame and the second frame provided with the chip includes:
connecting a bonding pad of each of the chips with one of the metal bumps in each of the first conductive parts in the first frame using the second bonding layer; connecting the other metal bump in each of the first conductive parts in the first frame with the other metal base in each of the second conductive parts in the second frame using the third solder layer.
7. The method of manufacturing according to claim 1,
connecting the chip to one of the metal submounts in the second conductive component by a first solder layer;
connecting the chip to one of the metal bumps in the first conductive component by a second solder layer;
connecting the other metal bump in the first conductive component and the other metal base in the second conductive component by a third solder layer;
the first welding layer, the second welding layer and the third welding layer are formed by arranging conductive glue or/and solder on one side of the metal base platform or/and the metal bump in a steel mesh printing or/and silk screen printing or/and dispensing mode.
8. A clip-on package device, characterized in that the clip-on package device is manufactured by the method for manufacturing a clip-on package device according to any one of claims 1 to 7; the clip-on package device includes:
a first conductive component comprising a copper strap portion and two metal bumps;
a second conductive component comprising two metal submounts;
the chip comprises a bonding pad, and is arranged on one side of one of the metal bases;
and the plastic packaging layer at least covers the first conductive part, the second conductive part and the chip.
9. The clip-on package device of claim 8, further comprising:
the first welding layer is arranged on one side of one of the metal base platforms and is used for connecting the chip with one of the metal base platforms;
the second welding layer is arranged on one side, away from the copper strip part, of one of the metal bumps and is used for connecting a bonding pad of the chip with one of the metal bumps;
and the third welding layer is arranged on one side, far away from the copper strip part, of the other metal bulge and is used for connecting the other metal bulge with the other metal base.
10. An electronic device characterized in that it comprises the clip-on package device of claim 8 or 9.
CN202210808042.2A 2022-07-07 2022-07-07 Manufacturing method of clamp welding type packaging device, clamp welding type packaging device and electronic equipment Pending CN115376940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210808042.2A CN115376940A (en) 2022-07-07 2022-07-07 Manufacturing method of clamp welding type packaging device, clamp welding type packaging device and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210808042.2A CN115376940A (en) 2022-07-07 2022-07-07 Manufacturing method of clamp welding type packaging device, clamp welding type packaging device and electronic equipment

Publications (1)

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CN115376940A true CN115376940A (en) 2022-11-22

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