CN115368000A - Preparation method of glass shell, glass shell and electronic device - Google Patents

Preparation method of glass shell, glass shell and electronic device Download PDF

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Publication number
CN115368000A
CN115368000A CN202211062230.1A CN202211062230A CN115368000A CN 115368000 A CN115368000 A CN 115368000A CN 202211062230 A CN202211062230 A CN 202211062230A CN 115368000 A CN115368000 A CN 115368000A
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China
Prior art keywords
glass
glass shell
blank
adhesive
degreasing
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CN202211062230.1A
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Chinese (zh)
Inventor
程强
李忠军
崔基国
毛桂江
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Goertek Inc
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Goertek Inc
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Priority to CN202211062230.1A priority Critical patent/CN115368000A/en
Publication of CN115368000A publication Critical patent/CN115368000A/en
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00Other methods of shaping glass
    • C03B19/06Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Signal Processing (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

The embodiment of the application provides a glass shell, a preparation method of the glass shell and electronic equipment. The preparation method of the glass shell comprises the following steps: dissolving a water-insoluble first adhesive and a water-soluble second adhesive in a water-soluble solvent according to a volume ratio of 1; dispersing glass powder in the solution to prepare a solid compound, wherein the volume ratio of the solid compound to the glass powder is 1; extruding and molding the solid compound and granulating to form a feed; forming a glass shell blank body by the feeding material through an injection molding method; sequentially carrying out solvent degreasing and thermal degreasing on the glass shell blank to form a degreased glass shell blank; sintering the degreased glass shell blank to form a glass shell sintered part; and processing the surface of the glass shell sintered piece to form the glass shell.

Description

Preparation method of glass shell, glass shell and electronic device
Technical Field
The embodiment of the application relates to the technical field of glass shell preparation, in particular to a glass shell preparation method, a glass shell and electronic equipment.
Background
With the continuous improvement of the technology and the continuous improvement of the aesthetic level of people, the terminal appearance is continuously innovated, and the innovation is carried out not only from the processing details of the appearance, but also from the appearance material. And the mode of using glass and center cooperation on the cell-phone casing can provide excellent feel such as smooth warm and moist, can also satisfy diversified colour demand simultaneously. In addition, the rear shell of the electronic equipment made of glass can meet the requirement of 5G communication.
At present, the production and processing of the glass shell still face the problems of high energy consumption, great environmental pollution, great processing difficulty, fussy process procedure, low yield and the like, so how to reduce the processing difficulty of the glass shell and the complexity of the process procedure is an urgent technical problem to be solved.
Disclosure of Invention
The application aims to provide a preparation method of a glass shell, the glass shell and a new technical scheme of electronic equipment.
In a first aspect, the present application provides a method of making a glass envelope. The preparation method of the glass shell comprises the following steps:
dissolving a water-insoluble first adhesive and a water-soluble second adhesive in a water-soluble solvent according to a volume ratio of 1;
dispersing glass powder in the solution to prepare a solid compound, wherein the volume ratio of the solid compound to the glass powder is 1;
extruding and molding the solid compound and granulating to form a feed;
forming a glass shell blank from the feed by an injection molding method;
sequentially carrying out solvent degreasing and thermal degreasing on the glass shell blank to form a degreased glass shell blank;
sintering the degreased glass shell blank to form a glass shell sintered part;
and processing the surface of the glass shell sintered piece to form the glass shell.
Optionally, the particle size of the glass powder is 200-500 meshes.
Alternatively, a method of preparing a solid composite by dispersing glass frit in a solution comprises:
and dispersing the glass powder in the solution in a stirring manner, and after the glass powder is uniformly dispersed, evaporating the solvent to obtain a solid compound.
Alternatively, a method of extrusion molding and pelletizing a solid composite to form a feedstock includes:
putting the solid compound into a double-screw extruder for plasticizing and extruding, wherein the extrusion temperature is 130-200 ℃; the extruded solid composite was pelletized in a pelletizer to form the feed.
Optionally, the feed has a particle size range of: 1mm-10mm.
Alternatively, the method of forming the feedstock into a glass shell blank by an injection molding process comprises:
and filling the feed into a mold cavity for injection molding to obtain a glass shell blank, wherein the injection molding temperature is 100-170 ℃, the injection molding pressure is 600-1400 bar, the pressure maintaining time is 0.5-5 s, and the cooling time is 30-35 s.
Optionally, the temperature range of the mold cavity is: 40-85 ℃.
Optionally, the method of solvent degreasing the glass-shell blank comprises:
and (3) putting the glass shell blank into deionized water, and soaking for 3-15 h to remove the second adhesive, wherein the temperature of the deionized water is 40-65 ℃.
Optionally, the method of thermally degreasing the glass-shell blank comprises:
transferring the glass shell blank subjected to solvent degreasing to a degreasing furnace for thermal degreasing, wherein the glass shell blank is heated from room temperature to 200-300 ℃ at the heating rate of 0.5-3.5 ℃/min, is kept warm for 1-2 h at 200-300 ℃, is heated to 400-450 ℃ at the heating rate of 0.5-3.5 ℃/min, is kept warm for 1.5-2.5 h at 400-450 ℃, is heated to 480-550 ℃ at the heating rate of 2-4 ℃/min, is kept warm for 0.8-1.5 h at 480-550 ℃, is heated to 600-650 ℃ at the heating rate of 1-2.5 ℃/min, is kept warm for 1-2 h at 600-650 ℃, and is cooled to room temperature along with the degreasing furnace.
Optionally, the method for sintering the degreased glass shell blank to form the glass shell sintered piece comprises the following steps:
transferring the degreased glass shell blank to a vacuum sintering furnace, wherein the vacuum degree in the vacuum sintering furnace is 1 multiplied by 10 - 3 pa, heating the glass shell blank to 1100-1400 ℃ at a heating rate of 1-3 ℃/min, preserving the heat for 1.5-2.5 h at the temperature, then cooling to 850 ℃ at a cooling rate of 0.5-1.5 ℃/min, and finally cooling to room temperature along with a vacuum sintering furnace to form the glass shell sintered part.
Optionally, the method of treating the surface of the sintered glass shell to form the glass shell comprises:
and grinding and polishing the surface of the glass shell sintered piece, and evaporating a film on the surface of the ground and polished glass shell sintered piece to form a glass shell.
Optionally, the first adhesive comprises one of polyaldehyde resin, polyvinyl butyral and polymethacrylate, and the second adhesive comprises one of polyethylene glycol, polyacrylic acid, polyvinylpyrrolidone, ammonium polymethacrylate and ammonium polyacrylate.
Optionally, the water soluble solvent comprises one of tetrahydrofuran, deionized water, and dimethyl ether.
In a second aspect, a glass envelope is provided. Wherein the glass shell is produced by the method for producing a glass shell according to the first aspect.
In a third aspect, an electronic device is provided. The electronic device comprises a glass envelope as described in the second aspect.
According to the embodiment of the application, the preparation method of the glass shell is improved under the condition that the quality of the glass shell is ensured, the mass preparation of the glass shell with high precision and a complex shape is realized by introducing an injection molding process into the production of the glass shell, and the problems of high processing difficulty, complex process procedure, high energy consumption and high pollution of the conventional glass shell are effectively solved.
Other features of the present description and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the specification and together with the description, serve to explain the principles of the specification.
Fig. 1 is a schematic flow chart of a method for manufacturing a glass envelope provided in an embodiment of the present application.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses.
Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the prior art, in current 3C electronic products, such as smart wearable devices, smart phones, and other products, a shell undergoes a transition from a plastic material to a metal material, but the shell made of the metal material has an obvious signal shielding effect on signal transmission, and is not favorable for wireless charging and 5G signal transmission.
In addition, at present, some housings of 3C electronic products are made of glass, but the production and processing of the glass rear housing still face the problems of high energy consumption, large environmental pollution, large processing difficulty, complex process and low yield. The current process of the glass rear shell is generally as follows: firstly, the glass substrate needs to be formed in a high-temperature melting state, so that the energy consumption and pollution are large, and the requirement on equipment is high; secondly, a plurality of working procedures such as cutting, perforating, fine carving, grinding, hot bending and the like are needed from the substrate to the rear shell, the process flow is long, and the yield is low.
Based on the technical problems, the embodiment of the application provides a preparation method of a glass shell. The method comprises the following steps: referring to fig. 1, the method of making a glass envelope includes steps 101-107.
Step 101: dissolving a water-insoluble first adhesive and a water-soluble second adhesive in a water-soluble solvent according to a volume ratio of 1;
step 102: dispersing glass powder in the solution to prepare a solid compound, wherein the volume ratio of the solid compound to the glass powder is 1;
step 103: extruding and molding the solid compound and granulating to form a feed;
step 104: forming a glass shell blank from the feed by an injection molding method;
step 105: sequentially carrying out solvent degreasing and thermal degreasing on the glass shell blank to form a degreased glass shell blank;
step 106: sintering the degreased glass shell blank to form a glass shell sintered part;
step 107: and processing the surface of the glass shell sintered piece to form the glass shell.
In step 101, a first adhesive and a second adhesive are dissolved in an aqueous solvent to prepare a solution, so that glass powder is dispersed in the solution subsequently to prepare a feed material.
In the step, the first adhesive is a first adhesive which is insoluble in water, the second adhesive is a second adhesive which is soluble in water, the first adhesive and the second adhesive are both polymers, namely, the first adhesive and the second adhesive exist in a solution in a polymer form, and the first adhesive and the second adhesive need to be removed in the subsequent degreasing process. The first adhesive is insoluble in water and can wrap the glass powder. The second adhesive is soluble in water, and the second adhesive soluble in water can also generate an adhesive effect on the glass powder.
In this step, the first adhesive is defined to be insoluble in water, and the second adhesive is defined to be soluble in water, so that subsequent solvent degreasing and thermal degreasing are performed. For example, after the water-soluble second adhesive is removed by solvent degreasing, the water-insoluble first adhesive needs to be removed by thermal degreasing.
In the examples, therefore, the first binder is limited to water-insoluble polymers and the second binder is limited to water-soluble polymers, taking into account the subsequent degreasing means. In addition, in combination with the subsequent degreasing step, the first adhesive can be a framework support piece so as to keep the original shape of the glass shell blank; after the second adhesive is removed, a loose porous structure is easily formed in the glass shell blank, and the subsequent thermal degreasing process is facilitated.
In this step, the first adhesive and the second adhesive are limited to be dissolved in the water-soluble solvent in a volume ratio of 1. Specifically, limiting the volume ratio of the first adhesive to the second adhesive within this range can better ensure that the first adhesive can fully exert a skeleton-supporting effect after the second adhesive is completely removed by solvent degreasing.
In an alternative embodiment, wherein the mass fraction of the first adhesive is 5wt.% to 15wt.%, the mass fraction of the first adhesive is limited to this range, so that the first adhesive has a better wrapping effect, and the first adhesive can serve as a skeleton to play a better supporting role.
In step 102, the glass frit is dispersed in a solution, for example, with stirring, and a solid composite is formed after treatment.
In this step, the volume ratio of the solid composite to the glass frit is limited to 1.5 to 1, that is, 50vol.% to 65vol.% of the glass frit is dispersed in the solution by adding the glass frit under stirring. The volume ratio of the glass powder is described in relation to the whole system, i.e. in relation to the solid compound.
In particular, in the preparation of the feedstock, parameters relating to the powder load are concerned. The powder loading influences many parameters of the subsequent feeding in the injection molding process, for example, the powder loading influences the flowability and the compactness of the feeding. Wherein the factor directly affecting the powder loading parameter is the volume fraction of glass frit in the feed. Wherein the volume ratio of the glass frit is too small or too large, the powder loading, i.e., the occupancy of the glass frit in the solid composite, is affected. The glass powder is the main component of the sintered glass shell, so that the volume ratio of the glass powder is limited in order to ensure the compactness and the loading capacity of the glass powder, and the final internal structure and the final density of the glass shell and the stress structure of the glass shell are ensured to be more in line with the requirements of users.
In step 103, the solid compound may be fed into a twin screw extruder for plasticization and extrusion using an automatic feeding device, and the extruded solid compound is cooled in flowing air and then pelletized in a pelletizer to finally obtain a pellet feed. For example, the solid compound can be plasticized by the internal structure of the twin-screw extruder, after the plasticizing of the solid compound is completed, the plasticized solid compound is extruded, and the extruded solid compound is pelletized by the pelletizer to form the feed material.
In step 104, a glass shell blank is formed by injection molding, for example, injection molding of a glass shell is performed in a day-essence 110T injection molding machine, and the mold cavity is filled with the feed material to obtain a glass shell blank.
Compared with the forming mode of the glass shell in the prior art, the glass shell blank is formed by the injection molding mode, and the problems of high processing difficulty, complex process, high energy consumption and high pollution of the glass shell of the modern 3C product are effectively solved.
In step 105, the glass-shell blank is degreased by a two-step degreasing process. The two degreasing modes comprise solvent degreasing and thermal degreasing, wherein solvent degreasing is carried out on the glass shell blank, and then thermal degreasing is carried out on the glass shell blank.
Specifically, in the solvent degreasing process, the water-soluble second binder is degreased and removed, so as to form a porous grid structure (because the water-soluble second binder is degreased and removed), for example, loose pore channels are formed on the glass shell blank, and the loose pore channels correspond to the porous grid structure; after the second adhesive is removed, the remaining structure is a skeleton structure for supporting the glass shell blank, and the skeleton structure is removed by means of thermal degreasing, namely the first adhesive which is insoluble in water is removed by means of thermal degreasing.
In the prior art, a degreased blank is formed by adopting a one-step thermal degreasing mode, and due to the uneven heat conduction process, the polymer is not degreased completely, the adhesive in the blank is not easy to degrease and remove, and the defects of bubbling, cracks and the like are easily formed on the surface of the blank.
In this embodiment, the polymers (the second adhesive and the first adhesive) of the glass-shell blank are removed by two-step degreasing, so as to improve the quality of the degreased glass-shell blank. Specifically, after solvent degreasing, a porous pore structure is formed on the glass shell blank, in the thermal degreasing process, heat enters the glass shell blank along the porous pore structure, so that the temperature inside and outside the glass shell blank is uniform when the first adhesive is subjected to thermal degreasing, the first adhesive positioned outside the glass shell blank and the first adhesive positioned inside the glass shell blank can be removed, and the quality of the degreased glass shell blank is more uniform.
In step 106, the degreased glass shell blank is sintered to form a sintered glass shell blank, so that the compactness of the glass shell blank and the structural strength of the glass shell blank are improved.
In step 107, the surface of the sintered glass envelope is further surface-treated to produce a glass envelope satisfying the requirements for use.
Therefore, according to the preparation method of the glass shell provided by the embodiment of the application, the preparation method of the glass shell is improved under the condition of ensuring the quality of the glass shell, the mass preparation of the glass shell with high precision and complex shape is realized by introducing the injection molding process into the production of the glass shell, and the problems of high processing difficulty, complex process procedure, high energy consumption and high pollution of the glass shell of the modern 3C product are effectively solved.
In one embodiment, the glass powder has a particle size of 200 mesh to 500 mesh.
In this embodiment, the particle size of the glass frit is defined such that the glass frit can be uniformly dispersed in the solution, and the particle size of the glass frit is further defined such that the texture of the formed solid composite is more uniform, which facilitates subsequent plasticization and extrusion.
In one embodiment, a method of preparing a solid composite by dispersing glass frit in a solution comprises:
and dispersing the glass powder in the solution by adopting a stirring mode, and after the glass powder is uniformly dispersed, obtaining a solid compound by adopting a solvent evaporation method.
In this example, the manner in which the solid composite is obtained is defined so as to form a granular feed.
Specifically, the glass powder is uniformly dispersed in the solution by stirring, and when the glass powder is uniformly dispersed in the solution, the solid compound is obtained by evaporating the solvent.
For example, the glass frit may be uniformly dispersed in the solution, and the solution mixed with the glass frit may be placed in a steam box to evaporate the solvent. Or other means of increasing the temperature (e.g., providing a temperature of 80 c to 100 c) may be used for the purpose of evaporating the solvent.
In one embodiment, a method of extrusion molding and pelletizing a solid composite to form a feedstock includes:
putting the solid compound into a double-screw extruder for plasticizing and extruding, wherein the extrusion temperature is 130-200 ℃; the extruded solid composite was pelletized in a pelletizer to form the feed.
In this example, the extrusion temperature is defined, wherein too low an extrusion temperature results in a rough surface and increased cross-section of the extruded solid composite; too high an extrusion temperature can scorch and foam the surface of the extruded solid composite, etc. Therefore, in order to ensure the quality of the extruded solid composite, the temperature at extrusion is limited to 130 ℃ to 200 ℃.
In one embodiment, the feed material has a particle size in the range of 1mm to 10mm.
In this embodiment, the feed material formed by granulation generally has a particle size range of mm, for example, the particle size of the feed material is limited in this range, which makes the particle size range of the feed material more uniform and is more beneficial to the subsequent injection molding process.
In one embodiment, a method of forming a feedstock into a glass-shell blank by an injection molding process comprises:
and filling the feed into a mold cavity for injection molding to obtain a glass shell blank, wherein the injection molding temperature is 100-170 ℃, the injection molding pressure is 600-1400 bar, the pressure maintaining time is 0.5-5 s, and the cooling time is 30-35 s.
In this example, the injection temperature, injection pressure, dwell time and cooling time were defined,
and (3) after the feed is injected into the mold cavity, maintaining the pressure of the mold cavity, and cooling for a period of time until the mold cavity is opened after the pressure maintaining is finished. Wherein the cooling time is limited within this range, and the shape of the glass shell blank is fixed within the cooling time range.
In one embodiment, the temperature of the mold cavity ranges from 40 ℃ to 85 ℃.
Specifically, a mold cavity is arranged in the injection molding machine, the feed is filled in the mold cavity, and injection molding treatment is carried out to obtain a glass shell blank. In the injection molding machine, a mold cavity needs to be heated, and in addition, a tool for controlling the mold cavity is specially arranged, so that the temperature of the mold cavity is always kept in a set range.
Specifically, the injection molding temperature and the injection molding pressure occur in the whole injection molding process, the feeding material is placed in the material pipe, the temperature in the material pipe corresponds to the injection molding temperature, the temperature of the mold cavity is lower than the injection molding temperature, a temperature difference exists between the temperature of the mold cavity and the injection molding temperature, when the feeding material is injected into the mold cavity, the injection molding process is actually finished, and the temperature of the mold cavity is the temperature of the feeding material in the mold cavity. In the embodiment, the temperature of the mold cavity is limited to 40-85 ℃, the quality of the glass shell blank after injection molding is improved, and when the mold temperature is lower than 40 ℃, the filling property of the product is reduced, so that insufficient injection is easily caused, and the demolding is not easy to occur; when the mold temperature is higher than 85 ℃, the product is easy to stick to the mold, and has the defects of flash, local bright spots of plastic parts and the like. .
In one embodiment, a method of solvent degreasing a glass-shell blank comprises:
and (3) putting the glass shell blank into deionized water, and soaking for 3-15 h to remove the second adhesive, wherein the temperature of the deionized water is 40-65 ℃.
In this example, the glass gob shell is solvent degreased in deionized water at a temperature of 40 ℃ to 65 ℃ and soaked for 3 hours to 15 hours to remove the water-soluble second adhesive. Wherein the temperature and soaking time of the deionized water are limited so that the second adhesive is completely removed by solvent degreasing to form a pore channel in the glass envelope blank.
In one embodiment, a method of thermally degreasing a glass envelope blank comprises:
transferring the glass shell blank subjected to solvent degreasing to a degreasing furnace for thermal degreasing, wherein the glass shell blank is heated from room temperature to 200-300 ℃ at the heating rate of 0.5-3.5 ℃/min, is kept warm for 1-2 h at 200-300 ℃, is heated to 400-450 ℃ at the heating rate of 0.5-3.5 ℃/min, is kept warm for 1.5-2.5 h at 400-450 ℃, is heated to 480-550 ℃ at the heating rate of 2-4 ℃/min, is kept warm for 0.8-1.5 h at 480-550 ℃, is heated to 600-650 ℃ at the heating rate of 1-2.5 ℃/min, is kept warm for 1-2 h at 600-650 ℃, and is cooled to room temperature along with the degreasing furnace.
In this example, the glass envelope blank is thermally degreased in a stepwise temperature increase to ensure complete removal of the first binder.
Specifically, the temperature increase rate in each temperature increase stage is too fast, and there may be cases where degreasing is insufficient, or where a glass-shell blank is deformed or cracked. The too slow heating rate of each heating stage can affect the preparation efficiency of the glass shell and the loss of energy consumption, and reduce the productivity; therefore, in order to consider the efficiency of the glass shell preparation, and whether the first binder can be completely removed, the rate of temperature rise at each stage is defined.
In addition, in order to completely remove the first adhesive, in the process of stepwise temperature rise, the temperature difference of each step is neither too large nor too small, wherein too small temperature difference affects the efficiency of thermal degreasing and the integrity of removing the first adhesive, and too large temperature difference also affects the integrity of removing the first adhesive.
In a specific embodiment, the glass shell blank subjected to solvent degreasing is transferred to a degreasing furnace for thermal degreasing, the part is heated from room temperature to 260 ℃ at the heating rate of 1 ℃/min, the temperature is kept at 260 ℃ for 1h, then the part is heated to 400 ℃ at the heating rate of 1 ℃/min, the temperature is kept at 400 ℃ for 1.5h, then the part is heated to 480 ℃ at the heating rate of 2.5 ℃/min, the temperature is kept at 480 ℃ for 0.8h, then the part is heated to 600 ℃ at the heating rate of 1.5 ℃/min, the temperature is kept at 600 ℃ for 1h, and finally the temperature is reduced to room temperature along with the degreasing furnace.
In one embodiment, the method for sintering the degreased glass shell blank to form the glass shell sintered part comprises the following steps:
transferring the degreased glass shell blank to a vacuum sintering furnace, wherein the vacuum degree in the vacuum sintering furnace is 1 multiplied by 10 - 3 pa, heating the glass shell blank to 1100-1400 ℃ at the heating rate of 1-3 ℃/min, preserving the heat for 1.5h at the temperature, then cooling to 850 ℃ at the cooling rate of 0.5-1.5 ℃/min, and finally cooling to room temperature along with a vacuum sintering furnace to form the glass shell sintered part.
In this example, the temperature in the furnace was first reduced to 850 ℃ and then cooled in the furnace. Because the temperature difference between the temperature in the furnace and the outdoor temperature is very large under the condition of high temperature in the furnace, the temperature in the furnace can be cooled very quickly under the condition of not limiting the cooling rate, and because the thermal stress and the internal stress of the glass shell which is just sintered are relatively large under the condition of very quick temperature reduction in the furnace, the glass shell is easy to crack and the like in the process of quick temperature reduction. Therefore, the cooling rate is limited in the embodiment, and under the high-temperature condition, the cooling rate is limited in the range, so that the quality of the glass shell is better;
in addition, in the embodiment, in the temperature reduction process, the temperature is reduced by 850 ℃ and then the glass shell is cooled along with the furnace, so that the product quality of the glass shell is more favorable. For example, if the temperature is reduced to 600 ℃ to 800 ℃ in the temperature reduction process, the temperature is cooled along with the furnace, wherein the furnace temperature is reduced slowly; if the temperature is reduced to about 200 ℃ in the cooling process, cooling along with the furnace, wherein the furnace temperature is reduced more slowly; the glass shell product quality and the cooling rate are considered, the temperature is reduced to 850 ℃ by the glass shell cooling device, the cooling rate is not limited, the cooling is naturally slower, and the product quality is not greatly influenced.
In one embodiment, a method of treating a surface of a sintered glass shell to form a glass shell comprises:
and grinding and polishing the surface of the glass shell sintered piece, and evaporating a film on the surface of the ground and polished glass shell sintered piece to form a glass shell.
In this embodiment, the surface treatment is performed on the sintered glass shell, specifically, the sintered glass shell has good dimensional accuracy and surface quality, but in order to meet the product standard, the glass shell needs to be polished and the film layer needs to be deposited, so as to finally obtain the glass shell with high quality meeting the requirement. For example, the film layer may be an AF anti-fingerprint film.
In one embodiment, the first adhesive comprises one of a polyaldehyde resin, polyvinyl butyral (PVB), and polymethacrylate.
In this embodiment, the type of the first adhesive is defined, wherein the first adhesive includes, but is not limited to, polyacetal, polyvinyl butyral (PVB), and polymethacrylate, wherein the first adhesive is capable of being insoluble in water.
In an alternative embodiment, the second adhesive includes one of polyethylene glycol, polyacrylic acid, polyvinylpyrrolidone, ammonium polymethacrylate, and ammonium polyacrylate.
In this embodiment, the type of the second adhesive is limited, wherein the second adhesive includes, but is not limited to, polyethylene glycol, polyacrylic acid, polyvinylpyrrolidone, ammonium polymethacrylate, ammonium polyacrylate, wherein the second adhesive is only soluble in water.
In one embodiment, the water soluble solvent comprises one of tetrahydrofuran, deionized water, dimethyl ether.
In this example, a water soluble solvent is defined, wherein the water soluble solvent includes but is not limited to tetrahydrofuran, deionized water, dimethyl ether.
In a second aspect, a glass envelope is provided. The glass shell is produced by the method for producing a glass shell according to the first aspect.
In the embodiment, the glass shell is prepared by adopting the glass shell preparation method, so that the problems of high processing difficulty, complex process, high energy consumption and high pollution of the glass shell of the modern 3C product are effectively solved.
In a third aspect, an electronic device is provided. The electronic device comprises a glass envelope as described in the second aspect.
In this embodiment, an electronic device is provided, wherein the electronic device includes the glass housing described above, and wherein the electronic device may be a smart wearable device or a smart phone, a tablet computer, or the like.
In the above embodiments, the differences between the embodiments are described with emphasis, and different optimization features between the embodiments may be combined to form a better embodiment as long as the differences are not contradictory, and in consideration of the brevity of the text, no further description is given here.
Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (15)

1. A method of making a glass envelope, the method comprising:
dissolving a water-insoluble first adhesive and a water-soluble second adhesive in a water-soluble solvent according to a volume ratio of 1;
dispersing glass powder in the solution to prepare a solid compound, wherein the volume ratio of the solid compound to the glass powder is 1;
extruding and molding the solid compound and granulating to form a feed;
forming a glass shell blank from the feed by an injection molding method;
sequentially carrying out solvent degreasing and thermal degreasing on the glass shell blank to form a degreased glass shell blank;
sintering the degreased glass shell blank to form a glass shell sintered part;
and processing the surface of the glass shell sintered piece to form the glass shell.
2. The method for manufacturing a glass envelope according to claim 1, wherein the particle size of the glass frit is 200 mesh to 500 mesh.
3. The method of manufacturing a glass envelope as in claim 1, wherein the method of preparing a solid composite by dispersing the glass frit in the solution comprises:
and dispersing the glass powder in the solution by adopting a stirring mode, and after the glass powder is uniformly dispersed, obtaining a solid compound by adopting a solvent evaporation method.
4. A method of making a glass envelope as in claim 1 wherein the method of extruding and pelletizing the solid composite to form the feedstock comprises:
putting the solid compound into a double-screw extruder for plasticizing and extruding, wherein the extrusion temperature is 130-200 ℃; the extruded solid composite was pelletized in a pelletizer to form the feed.
5. A method for making glass envelopes as set forth in claims 1 or 4 wherein the feedstock is in the grain size range of: 1mm-10mm.
6. A method of making glass envelopes as set forth in claim 1 wherein the step of injection molding the feed material into the glass envelope blanks comprises:
and filling the feed into a mold cavity for injection molding to obtain a glass shell blank, wherein the injection molding temperature is 100-170 ℃, the injection molding pressure is 600-1400 bar, the pressure maintaining time is 0.5-5 s, and the cooling time is 30-35 s.
7. A method of making a glass envelope as in claim 6 wherein the temperature range of the mold cavity is: 40-85 ℃.
8. The method of manufacturing a glass envelope as in claim 1, wherein the method of solvent degreasing the glass envelope blank comprises:
and placing the glass shell blank into deionized water, and soaking for 3-15 h to remove the second adhesive, wherein the temperature of the deionized water is 40-65 ℃.
9. The method of making a glass envelope as in claim 1, wherein the method of thermally degreasing the glass envelope blank comprises:
transferring the glass shell blank subjected to solvent degreasing to a degreasing furnace for thermal degreasing, wherein the glass shell blank is heated from room temperature to 200-300 ℃ at the heating rate of 0.5-3.5 ℃/min, is kept warm for 1-2 h at 200-300 ℃, is heated to 400-450 ℃ at the heating rate of 0.5-3.5 ℃/min, is kept warm for 1.5-2.5 h at 400-450 ℃, is heated to 480-550 ℃ at the heating rate of 2-4 ℃/min, is kept warm for 0.8-1.5 h at 480-550 ℃, is heated to 600-650 ℃ at the heating rate of 1-2.5 ℃/min, is kept warm for 1-2 h at 600-650 ℃, and is cooled to room temperature along with the degreasing furnace.
10. The method for manufacturing a glass envelope as claimed in claim 1, wherein the method for forming the glass envelope sintered member by sintering the degreased glass envelope blank comprises:
transferring the degreased glass shell blank to a vacuum sintering furnace, wherein the vacuum degree in the vacuum sintering furnace is 1 multiplied by 10 -3 pa, heating the glass shell blank to 1100-1400 ℃ at a heating rate of 1-3 ℃/min, preserving the heat for 1.5-2.5 h at the temperature, then cooling to 850 ℃ at a cooling rate of 0.5-1.5 ℃/min, and finally cooling to room temperature along with a vacuum sintering furnace to form the glass shell sintered part.
11. The method of manufacturing a glass envelope as claimed in claim 1, wherein the method of processing the surface of the sintered glass envelope piece to form the glass envelope comprises:
and grinding and polishing the surface of the glass shell sintered part, and evaporating a film on the surface of the ground and polished glass shell sintered part to form a glass shell.
12. The method of claim 1, wherein the first adhesive comprises one of polyaldehyde resin, polyvinyl butyral and polymethacrylate, and the second adhesive comprises one of polyethylene glycol, polyacrylic acid, polyvinyl pyrrolidone, ammonium polymethacrylate and ammonium polyacrylate.
13. The method of making a glass envelope as in claim 1, wherein the water soluble solvent comprises one of tetrahydrofuran, deionized water, and dimethyl ether.
14. A glass envelope produced by the method for producing a glass envelope according to any one of claims 1 to 13.
15. An electronic device, characterized in that the electronic device comprises a glass envelope as claimed in claim 14.
CN202211062230.1A 2022-08-31 2022-08-31 Preparation method of glass shell, glass shell and electronic device Pending CN115368000A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007132704A (en) * 2005-11-08 2007-05-31 Tosoh Quartz Corp Microchip base plate made of glass, its manufacturing method and microchip
CN109354647A (en) * 2018-09-06 2019-02-19 中国科学院宁波材料技术与工程研究所 A kind of preparation method of glass 3D printing silk material and glassware
CN109836055A (en) * 2017-11-29 2019-06-04 辽宁法库陶瓷工程技术研究中心 A kind of method of vacuum glass sealing device
CN113429118A (en) * 2021-06-17 2021-09-24 贵州航天电器股份有限公司 Glass blank powder injection molding process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007132704A (en) * 2005-11-08 2007-05-31 Tosoh Quartz Corp Microchip base plate made of glass, its manufacturing method and microchip
CN109836055A (en) * 2017-11-29 2019-06-04 辽宁法库陶瓷工程技术研究中心 A kind of method of vacuum glass sealing device
CN109354647A (en) * 2018-09-06 2019-02-19 中国科学院宁波材料技术与工程研究所 A kind of preparation method of glass 3D printing silk material and glassware
CN113429118A (en) * 2021-06-17 2021-09-24 贵州航天电器股份有限公司 Glass blank powder injection molding process

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