CN115366363A - A Rapid Cooling System for Flip Chip Packaging Injection Mold - Google Patents

Abstract

The invention provides a quick cooling system of a flip chip packaging injection mold, which comprises an upper mold and a lower mold, wherein the upper mold and the lower mold are respectively internally provided with a cooling system, the cooling system comprises four water channels, water nozzles are respectively arranged at two ends of each water channel and are respectively a water outlet nozzle and a water inlet nozzle, the water inlet nozzles are connected with water inlet pipes, the water outlet nozzles are connected with water outlet pipes, the water channels comprise two water pipes which are mutually and vertically connected, the four water channels are respectively positioned at four corners of the upper mold or the lower mold, and the right corners of the water pipes of the four water channels are close to the center of the upper mold or the lower mold.

Description

A Rapid Cooling System for Flip Chip Packaging Injection Mold

technical field

The invention mainly relates to the design field of injection mold cooling systems, in particular to a rapid cooling system for flip-chip packaging injection molds.

Background technique

The purpose of the injection mold cooling system is to cool the product evenly and eject it into the mold in a short period of time. The quality of the waterway arrangement in the cooling system directly affects the molding and molding cycle of the plastic part. The molding of plastic parts is mainly manifested in the smoothness of the product surface, thermal bending, etc.; in the molding cycle, shortening the cooling time is to improve the molding efficiency.

Especially in the injection molding process of flip chips, usually a plurality of linear cooling water channels are arranged on the outer edge of the plastic part. This structure has poor cooling effect, and cooling dead angles often appear, reducing the yield.

Contents of the invention

Aiming at the above-mentioned defects of the prior art, the present invention provides a rapid cooling system for flip-chip packaging injection molds, an upper mold and a lower mold, the upper mold and the lower mold are respectively equipped with cooling systems, and the cooling system includes four The two ends of the water channel 3 and the water channel 3 are respectively provided with water nozzles 4, which are the water outlet nozzle and the water inlet nozzle, wherein the water inlet nozzle is connected to the water inlet pipe, and the water outlet nozzle is connected to the water outlet pipe. The water channel 3 includes two water pipes connected vertically to each other. , the four water channels 3 are respectively located at the four corners of the upper mold or the lower mold, and the right angles of the water pipes of the four water channels 3 are close to the center of the upper mold or the lower mold.

Preferably, the upper mold includes an upper mold core 1 and an upper mold core mounting plate.

Preferably, the lower mold includes a lower mold core and a lower mold core mounting plate.

Preferably, the water channel 3 is arranged at the bottom of the upper mold core or the lower mold core in the upper mold core mounting plate or the lower mold core mounting plate.

Preferably, the water channel 3 is a metal pipe.

Beneficial effects of the present invention:

This structure has uniform cooling, good cooling effect, simple structure, and simple distribution in the upper mold or the lower mold.

Description of drawings

Fig. 1 is a structural diagram of the present invention.

Fig. 2 is a waterway distribution diagram of the present invention.

Detailed ways

In order to enable those skilled in the art to better understand the technical solutions of the present invention, and to make the above-mentioned features, objectives and advantages of the present invention clearer and easier to understand, the present invention will be further described below in conjunction with embodiments. The examples are only for illustrating the present invention and are not intended to limit the scope of the present invention.

As can be seen from Figure 1-2, the present invention includes:

A rapid cooling system for a flip-chip packaging injection mold, an upper mold and a lower mold, the upper mold and the lower mold are respectively equipped with a cooling system, and the cooling system includes four water channels 3, and the two ends of the water channels 3 are respectively equipped with The water nozzles 4 are water outlet nozzles and water inlet nozzles, wherein the water inlet nozzles are connected to the water inlet pipes, and the water outlet nozzles are connected to the water outlet pipes. The water channels 3 are composed of two water pipes connected vertically to each other. At the four corners of the mold, the right angles of the water pipes of the four water channels 3 are close to the center of the upper mold or the lower mold.

Preferably in this implementation, the upper mold includes an upper mold core 1 and an upper mold core mounting plate.

Preferably in this implementation, the lower mold includes a lower mold core and a lower mold core mounting plate.

Preferably in this implementation, the water channel 3 is arranged at the bottom of the upper mold core or the lower mold core in the upper mold core mounting plate or the lower mold core mounting plate.

Preferably in this implementation, the water channel 3 is a metal pipe.

The above-mentioned embodiments only illustrate the principle and effect of the present patent application, but are not intended to limit the present patent application. Any person familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of this patent application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in this patent application should still be covered by the claims of this patent application.

Claims (5)

1. A fast cooling system for flip-chip packaging injection molds, characterized in that, a patrix and a lower die, the inside of the patrix and the lower die are respectively provided with a cooling system, and the cooling system includes four water channels (3), The two ends of the waterway (3) are provided with water nozzles (4) which are water outlet nozzles and water inlet nozzles respectively, wherein the water inlet nozzles are connected to the water inlet pipes, and the water outlet nozzles are connected to the water outlet pipes. The waterway (3) includes two water pipes perpendicular to each other. The four water channels (3) are respectively located at the four corners of the upper mold or the lower mold, and the right angles of the water pipes of the four water channels (3) are close to the center of the upper mold or the lower mold. 2. A flip-chip packaging injection mold rapid cooling system according to claim 1, characterized in that: the upper mold includes an upper mold core (1) and an upper mold core mounting plate. 3. A rapid cooling system for flip-chip packaging injection molds according to claim 2, wherein the lower mold includes a lower mold core and a lower mold core mounting plate. 4. A rapid cooling system for flip-chip packaging injection molds according to claim 3, characterized in that: the water channel (3) is arranged on the bottom of the upper mold core or the lower mold core on the upper mold core mounting plate or the lower mold core inside the mounting plate. 5. A rapid cooling system for flip-chip packaging injection molds according to claim 4, characterized in that: the water channel (3) is a metal pipe.

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