CN115366363A

CN115366363A - Quick cooling system of flip chip packaging injection mold

Info

Publication number: CN115366363A
Application number: CN202110554534.9A
Authority: CN
Inventors: 张�浩
Original assignee: Hitech Semiconductor Wuxi Co Ltd
Current assignee: Hitech Semiconductor Wuxi Co Ltd
Priority date: 2021-05-21
Filing date: 2021-05-21
Publication date: 2022-11-22

Abstract

The invention provides a quick cooling system of a flip chip packaging injection mold, which comprises an upper mold and a lower mold, wherein the upper mold and the lower mold are respectively internally provided with a cooling system, the cooling system comprises four water channels, water nozzles are respectively arranged at two ends of each water channel and are respectively a water outlet nozzle and a water inlet nozzle, the water inlet nozzles are connected with water inlet pipes, the water outlet nozzles are connected with water outlet pipes, the water channels comprise two water pipes which are mutually and vertically connected, the four water channels are respectively positioned at four corners of the upper mold or the lower mold, and the right corners of the water pipes of the four water channels are close to the center of the upper mold or the lower mold.

Description

Quick cooling system of flip chip packaging injection mold

Technical Field

The invention mainly relates to the field of design of cooling systems of injection molds, in particular to a rapid cooling system of a flip chip packaging injection mold.

Background

The cooling system of the injection mold aims to uniformly cool a product and eject the product for molding in a short time, and the quality of the water path arrangement in the cooling system directly influences the molding and forming period of a plastic part. The molding of the plastic part mainly shows the smoothness, the hot bending and the like of the surface of the product; in the molding cycle, shortening the cooling time improves the molding efficiency.

During the injection molding process of the flip chip, a plurality of linear cooling water channels are usually arranged at the outer edge of the plastic part, the cooling effect of the structure is poor, cooling dead angles often occur, and the yield is reduced.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a rapid cooling system of a flip chip packaging injection mold, which comprises an upper mold and a lower mold, wherein the upper mold and the lower mold are respectively internally provided with a cooling system, the cooling system comprises four water channels 3, two ends of each water channel 3 are respectively provided with a water nozzle 4 which is a water outlet nozzle and a water inlet nozzle, the water inlet nozzles are connected with water inlet pipes, the water outlet nozzles are connected with water outlet pipes, each water channel 3 comprises two water pipes which are vertically connected, the four water channels 3 are respectively positioned at four corners of the upper mold or the lower mold, and the straight corners of the water pipes of the four water channels 3 are close to the center of the upper mold or the lower mold.

Preferably, the upper die comprises an upper die core 1 and an upper die core mounting plate.

Preferably, the lower die comprises a lower die core and a lower die core mounting plate.

Preferably, the water channel 3 is arranged at the bottom of the upper mold core or the lower mold core in the upper mold core mounting plate or the lower mold core mounting plate.

Preferably, the water channel 3 is a metal pipe.

The invention has the beneficial effects that:

the structure has the advantages of uniform cooling, good cooling effect, simple structure and simple distribution in the upper die or the lower die.

Drawings

FIG. 1 is a block diagram of the present invention.

FIG. 2 is a water course profile of the present invention.

Detailed Description

In order to make the technical solutions of the present invention better understood and make the above features, objects, and advantages of the present invention more comprehensible, the present invention is further described with reference to the following examples. The examples are intended to illustrate the invention and are not intended to limit the scope of the invention.

As shown in fig. 1-2, the present invention includes:

the utility model provides a quick cooling system of flip chip encapsulation injection mold, goes up mould and lower mould, go up mould and the inside cooling system that is equipped with respectively of lower mould, cooling system includes four water courses 3, and the both ends of water course 3 are equipped with water injection well choke 4 respectively and are faucet and water inlet tap, and wherein the inlet tube is connected to the water inlet tap, and the outlet pipe is connected to the faucet, water course 3 includes that two water pipe mutually perpendicular connect to form, and four water courses 3 are located the four corners department of mould or lower mould respectively, and the water pipe right angle department of four water courses 3 is close to the center department of mould or lower mould.

In this embodiment, preferably, the upper mold includes an upper mold core 1 and an upper mold core mounting plate.

In this embodiment, the lower mold preferably includes a lower mold core and a lower mold core mounting plate.

In this embodiment, the water channel 3 is preferably disposed at the bottom of the upper mold core or the lower mold core in the upper mold core mounting plate or the lower mold core mounting plate.

In the present embodiment, the water channel 3 is preferably a metal pipe.

The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of this patent application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of this patent application.

Claims

1. The utility model provides a quick cooling system of flip chip encapsulation injection mold, its characterized in that goes up mould and lower mould, go up mould and the inside cooling system that is equipped with respectively of lower mould, cooling system includes four water courses (3), and the both ends of water course (3) are equipped with water injection well choke (4) respectively and are faucet and water inlet tap, and wherein the inlet tube is connected to the water inlet tap, and the outlet pipe is connected to the faucet, water course (3) include that two water pipe mutually perpendicular connect to form, and four water courses (3) are located the four corners department of mould or lower mould respectively, and the water pipe right angle department of four water courses (3) is close to the center department of mould or lower mould.

2. The system of claim 1, wherein the system comprises: the upper die comprises an upper die core (1) and an upper die core mounting plate.

3. The system of claim 2, wherein the cooling system comprises: the lower die comprises a lower die core and a lower die core mounting plate.

4. The system of claim 3, wherein the cooling system comprises: the water channel (3) is arranged at the bottom of the upper mold core or the lower mold core in the upper mold core mounting plate or the lower mold core mounting plate.

5. The system of claim 4, wherein the cooling system comprises: the water channel (3) is a metal pipeline.