CN115351933A - Semiconductor wafer silicon chip burst device - Google Patents
Semiconductor wafer silicon chip burst device Download PDFInfo
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- CN115351933A CN115351933A CN202211081961.0A CN202211081961A CN115351933A CN 115351933 A CN115351933 A CN 115351933A CN 202211081961 A CN202211081961 A CN 202211081961A CN 115351933 A CN115351933 A CN 115351933A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 75
- 239000010703 silicon Substances 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000004140 cleaning Methods 0.000 claims abstract description 55
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 238000000926 separation method Methods 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 238000005192 partition Methods 0.000 claims description 16
- 238000001125 extrusion Methods 0.000 claims description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 103
- 238000003756 stirring Methods 0.000 abstract description 21
- 230000003139 buffering effect Effects 0.000 description 12
- 241001233242 Lontra Species 0.000 description 10
- 239000012530 fluid Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 4
- 230000010405 clearance mechanism Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
- B01D29/03—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements self-supporting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a semiconductor wafer silicon wafer slicing device, and relates to the technical field of semiconductor wafer silicon wafers; the invention solves the problem that two independent devices are needed for slicing and cleaning, and the use is inconvenient, and the invention comprises a device box and a sealing door arranged on the front surface of the device box, wherein one side of the inner surface of the device box is fixedly connected with a placing plate, and one side of the inner surface of the device box and positioned above the placing plate are fixedly connected with a chute plate; according to the wafer cleaning device, the linkage plate and the limiting baffle are arranged, so that the wafer is clamped, the stability of the wafer is ensured, the linkage plate is moved to push the wafer to move through the arrangement of the first threaded sleeve, the wafer is stirred through the arrangement of the stirring mechanism to be separated, the separated wafer is cleaned through the arrangement of the cleaning mechanism, and the wafer separation and cleaning are automatically arranged without manual operation, so that the device is simple and convenient, and a certain amount of labor force is saved.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer silicon chips, in particular to a semiconductor wafer silicon chip slicing device.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed, and the wafer silicon wafer is in a wafer shape and Fang Pianzhuang.
Most of the existing semiconductor wafer silicon wafer slicing are cut by adopting the wire saw to properly cut the ultra-thin diamond, but certain semiconductor wafer silicon wafer powder and scraps are generated during cutting and remained on the semiconductor wafer silicon wafer, most of the existing semiconductor wafer silicon wafer slicing are separated manually, then the impurities on the surface of the wafer silicon wafer are cleaned, and part of the existing semiconductor wafer silicon wafer slicing can automatically slice the wafer silicon wafer, but two independent devices are needed for slicing and cleaning, so that the use is inconvenient, and the efficiency is low.
In view of the above problems, the inventors propose a semiconductor wafer silicon wafer slicing apparatus to solve the above problems.
Disclosure of Invention
In order to solve the problem that two separate devices are needed for slicing and cleaning, the use is inconvenient; the invention aims to provide a semiconductor wafer silicon wafer slicing device.
In order to solve the technical problems, the invention adopts the following technical scheme: the device comprises a device box and a sealing door arranged on the front surface of the device box, wherein a placing plate is fixedly connected to one side of the inner surface of the device box, a chute plate is fixedly connected to one side of the inner surface of the device box and positioned above the placing plate, a first thread sleeve is slidably connected to the inner surface of the chute plate through a sliding block, a first threaded rod is connected to the inner surface of the first thread sleeve in a threaded manner, a motor is fixedly connected to one side of the device box, the motor is a servo motor and is electrically connected with an external power supply and is controlled through a control switch, one end of an output shaft of the motor penetrates through the device box and is fixedly connected with one end of the first threaded rod, a linkage plate is fixedly connected to the bottom of the first thread sleeve, an adjusting groove is formed in the top of the chute plate, and an adjusting sliding block is slidably connected to the inner surface of the adjusting groove, the bottom fixedly connected with limit baffle of regulation sliding block, the one end of first threaded rod is provided with striking mechanism, the top of chute board is provided with adjustment mechanism, one side of device case is provided with link gear, the bottom of device case is provided with clearance mechanism, through the setting of link gear and limit baffle, carries out the centre gripping with the wafer silicon chip, guarantees the stability of wafer silicon chip, through the setting of first thread bush, makes the link gear remove and promotes the wafer silicon chip and remove, through striking mechanism's setting, stirs the wafer silicon chip to with the separation of wafer silicon chip, through clearance mechanism's setting, clear up the wafer silicon chip after the separation, the piece is with the automatic setting of clearance, does not need the manual work to operate, and is simple and convenient, thereby saves a certain amount of labour, and efficiency is higher.
Preferably, the toggle mechanism comprises a rotating disc, one end of the first threaded rod is fixedly connected with the center of one side of the rotating disc, the periphery of the other side of the rotating disc is rotatably connected with a linkage strip through a bearing, the disc is used for installing the linkage strip, the disc rotates to drive one end of the linkage strip to rotate, one end of the linkage strip rotates to extrude the other end of the linkage strip to drive a linkage block to move along a toggle sliding chute plate, so that the linkage block reciprocates along the toggle sliding chute plate, one end of the linkage strip is rotatably connected with the linkage block through a bearing, the height of the linkage block and the height of the center of the rotating disc are positioned on the same horizontal plane, so that the normal operation of the device is ensured, the toggle sliding chute plate is fixedly connected with the inner surface of the device box, the inner surface of the stirring sliding chute plate is connected with the top of the linkage block in a sliding mode through a sliding block, the bottom of the linkage block is fixedly connected with a linkage frame, one end of the linkage frame is fixedly connected with a stirring strip, the stirring sliding chute plate is used for limiting the linkage block, the wafer silicon wafers are divided into pieces through the reciprocating motion of the stirring strip, the front surface and the back surface of the placing plate are fixedly connected with stirring baffles, one side of the linkage plate is penetrated and connected with a buffering spring rod in a sliding mode, the outer surface of the buffering spring rod is sleeved with an error buffering spring, one end of the buffering spring rod is fixedly connected with an extrusion push plate, the arrangement of the stirring baffles enables the stirring strip to only stir one wafer silicon wafer at a time, the error buffering spring is arranged on the buffering spring rod, when the stirring strip does not complete the dividing operation, the first threaded sleeve drives the linkage plate to continuously move, the linkage plate pulls the error buffering spring to extend, and therefore the normal operation of the device is guaranteed, the first thread sleeve is prevented from slipping, one end of the error buffer spring is fixedly connected with one side of the linkage plate, and the other end of the error buffer spring is fixedly connected with the outer surface of the buffer spring rod.
Preferably, adjustment mechanism includes the second threaded rod, the one end of second threaded rod is rotated with the top of spout board and is connected, the surface threaded connection of second threaded rod has the second thread bush, the surface of second thread bush and the top fixed connection who adjusts the sliding block, the through-hole has been seted up to limit baffle's one side, and when the wafer silicon chip of different thickness need be processed, it moves to rotate the second threaded rod and drive the second thread bush, and the second thread bush drives and adjusts the sliding block and make limit baffle remove to adjust limit baffle and stir the space between the baffle.
Preferably, the linkage mechanism comprises a cam, one side of the device box is rotatably connected with a linkage rotating shaft, one end of the linkage rotating shaft is fixedly connected with the rotating shaft of the cam, the outer surface of the output shaft of the motor is in transmission connection with the outer surface of the linkage rotating shaft through a conveying belt, the cleaning screen plate is reciprocated up and down through the arrangement of the linkage mechanism, so that the wafer silicon wafer on the cleaning screen plate is moved up and down in the cleaning water to be cleaned, the cleaning effect of the device on the wafer silicon wafer is improved, water on the left side of the separation plate is pumped into the right side of the separation plate to be filtered through the arrangement of a water pump, the water quality for cleaning the wafer silicon wafer is ensured, the cleaning effect is improved, the cleaning mechanism comprises the cleaning screen plate, the top of the cleaning screen plate is penetrated through and slidably connected with a guide rod, one end of the guide rod is fixedly connected with the bottom of the inner surface of the device box, and a reset spring is sleeved on the outer surface of the guide rod, a reciprocating chute is formed in one side of the device box, a reciprocating slide block is connected to the inner surface of the reciprocating chute in a sliding manner, one side of the reciprocating slide block is fixedly connected with one side of a cleaning screen plate, a sealing plate is fixedly connected to the other side of the reciprocating slide block, a linkage extrusion plate is fixedly connected to the top of the sealing plate, the top of the linkage extrusion plate is tightly contacted with the outer surface of a cam, the cleaning screen plate is used for receiving dropped wafer silicon wafers, the cam rotates to extrude the linkage extrusion plate to enable the cleaning screen plate to descend, a partition plate is fixedly connected to the bottom of the inner surface of the device box, a filter screen plate is fixedly connected between one side of the partition plate and the inner surface of the device box, a water pump is fixedly connected to the inner surface of the device box and is positioned below the filter screen plate, the water inlet end of the water pump is communicated with one side of the partition plate, and the partition plate is used for separating a filter area from the cleaning area, the filter screen plate is used for filtering impurities in the cleaning liquid, the water pump provides power for circulation of the cleaning liquid, one side of the partition plate is provided, the inner surface of the partition plate is in sliding connection with the outer surface of the cleaning screen plate through the sliding block, and the stability of the cleaning screen plate in up-and-down reciprocating motion is improved.
Compared with the prior art, the invention has the beneficial effects that:
1. the wafer silicon chip is clamped through the arrangement of the linkage plate and the limiting baffle plate, the stability of the wafer silicon chip is guaranteed, the linkage plate is enabled to move to push the wafer silicon chip to move through the arrangement of the first threaded sleeve, the wafer silicon chip is stirred through the arrangement of the stirring mechanism, so that the wafer silicon chip is separated, the separated wafer silicon chip is cleaned through the arrangement of the cleaning mechanism, the wafer silicon chip is automatically arranged in a slicing mode and cleaned without manual operation, the operation is simple and convenient, a certain amount of labor force is saved, and the slicing and cleaning integrated design is convenient to use, so that the slicing and cleaning efficiency is improved;
2. through link gear's setting, make clearance otter board reciprocating motion from top to bottom to make the wafer silicon chip on the clearance otter board reciprocate in the clear water and clear up, increase the cleaning performance of device to wafer silicon chip, through the setting of water pump, filter the right side of the left water suction baffle of baffle, thereby guarantee the quality of water of clearance wafer silicon chip, increase the cleaning performance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a schematic view of the internal structure of the apparatus case of the present invention.
FIG. 3 is a schematic view of the structure of the chute plate of the present invention.
Fig. 4 is a schematic structural view of the toggle mechanism of the present invention.
Fig. 5 is a schematic structural view of the adjusting mechanism of the present invention.
Fig. 6 is a schematic structural view of the cam of the present invention.
FIG. 7 is a schematic view of a buffer spring rod according to the present invention.
FIG. 8 is a schematic structural view of a toggle baffle of the present invention.
Fig. 9 is a schematic structural view of the water pump of the present invention.
FIG. 10 is a schematic view of a reinforced chute of the present invention.
Fig. 11 is a schematic structural view of the reciprocating chute of the present invention.
In the figure: 1. a device case; 2. a sealing door; 3. placing a plate; 4. a chute plate; 5. a first threaded sleeve; 6. a first threaded rod; 7. an electric motor; 8. a linkage plate; 9. an adjustment groove; 10. adjusting the sliding block; 11. a limit baffle; 12. a toggle mechanism; 13. an adjustment mechanism; 14. a linkage mechanism; 15. a cleaning mechanism; 17. rotating the disc; 18. a linkage bar; 19. a linkage block; 20. shifting the chute plate; 21. a linkage frame; 22. the bar is stirred; 23. shifting the baffle; 24. a buffer spring lever; 25. extruding the push plate; 26. a second threaded rod; 27. a second threaded sleeve; 28. a through hole; 29. a linkage rotating shaft; 30. a cam; 31. a conveyor belt; 32. cleaning the screen plate; 33. a guide bar; 34. a return spring; 35. a reciprocating chute; 36. a reciprocating slide block; 37. a sealing plate; 38. a linkage extrusion plate; 39. a partition plate; 40. a filter screen plate; 41. a water pump; 42. strengthen the spout.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in FIGS. 1 to 11, the invention provides a semiconductor wafer slicing device, which comprises a device box 1 and a sealing door 2 arranged on the front surface of the device box 1, wherein one side of the inner surface of the device box 1 is fixedly connected with a placing plate 3, one side of the inner surface of the device box 1 and positioned above the placing plate 3 are fixedly connected with a chute plate 4, the inner surface of the chute plate 4 is connected with a first thread sleeve 5 in a sliding way through a slide block, the inner surface of the first thread sleeve 5 is connected with a first threaded rod 6 in a threaded way, one side of the device box 1 is fixedly connected with a motor 7, the motor 7 is a servo motor and is electrically connected with an external power supply and is controlled by a control switch, one end of an output shaft of the motor 7 penetrates through the device box 1 and is fixedly connected with one end of the first threaded rod 6, the bottom of the first thread sleeve 5 is fixedly connected with a linkage plate 8, the top of the chute plate 4 is provided with an adjusting groove 9, the inner surface of the adjusting groove 9 is connected with an adjusting sliding block 10 in a sliding manner, the bottom of the adjusting sliding block 10 is fixedly connected with a limit baffle 11, one end of a first threaded rod 6 is provided with a stirring mechanism 12, the top of the sliding groove plate 4 is provided with an adjusting mechanism 13, one side of the device box 1 is provided with a linkage mechanism 14, the bottom of the device box 1 is provided with a cleaning mechanism 15, the wafer silicon wafer is clamped through the arrangement of the linkage plate 8 and the limit baffle 11 to ensure the stability of the wafer silicon wafer, the linkage plate 8 is moved to push the wafer silicon wafer to move through the arrangement of the first threaded sleeve 5, the wafer silicon wafer is stirred through the arrangement of the stirring mechanism 12, so that the wafer silicon wafer is separated, the separated wafer silicon wafer is cleaned through the arrangement of the cleaning mechanism 15, the wafer separation and the cleaning are automatically arranged, manual operation is not needed, the device is simple and convenient, thereby saving a certain amount of labor and having higher efficiency.
The toggle mechanism 12 comprises a rotating disc 17, one end of the first threaded rod 6 is fixedly connected with the center of one side of the rotating disc 17, and the periphery of the other side of the rotating disc 17 is rotatably connected with a linkage strip 18 through a bearing.
By adopting the technical scheme, the rotating disc 17 is used for installing the linkage strip 18, the rotating disc 17 rotates to drive one end of the linkage strip 18 to rotate, one end of the linkage strip 18 rotates to extrude the other end of the linkage strip 18 to drive the linkage block 19 to move along the shifting chute plate 20, and therefore the linkage block 19 reciprocates along the shifting chute plate 20.
One end of the linkage bar 18 is rotatably connected with a linkage block 19 through a bearing, and the height of the linkage block 19 and the height of the center of the rotating disc 17 are in the same horizontal plane.
By adopting the technical scheme, the height of the linkage block 19 and the height of the center of the rotating disc 17 are in the same horizontal plane, so that the normal operation of the device is ensured.
The inner surface of the device box 1 is fixedly connected with a shifting chute plate 20, the inner surface of the shifting chute plate 20 is connected with the top of a linkage block 19 in a sliding mode through a sliding block, the bottom of the linkage block 19 is fixedly connected with a linkage frame 21, and one end of the linkage frame 21 is fixedly connected with a shifting strip 22.
By adopting the technical scheme, the sliding groove plate 20 is shifted to limit the linkage block 19, and the shifting strip 22 reciprocates to separate the wafer silicon chips.
Place the equal fixedly connected with in front and the back of board 3 and stir baffle 23, one side of linkage plate 8 runs through and sliding connection has buffering spring rod 24, and the surface cover of buffering spring rod 24 is equipped with error buffer spring, and the one end fixedly connected with extrusion push pedal 25 of buffering spring rod 24.
Through adopting above-mentioned technical scheme, stir the setting of baffle 23, make stir strip 22 and can only stir a slice wafer once, buffering spring rod 24 goes up error buffer spring's setting, when making stir strip 22 not accomplish the burst operation, first thread bush 5 drives linkage plate 8 and continues to move, linkage plate 8 pulling error buffer spring makes error buffer spring extension, thereby guarantee the normal operating of device, prevent the smooth silk of first thread bush 5, error buffer spring's one end and one side fixed connection of linkage plate 8, error buffer spring's the other end and buffering spring rod 24's surface fixed connection.
By adopting the technical scheme, when wafer silicon chips with different thicknesses are required to be processed, the second threaded rod 26 is rotated to drive the second threaded sleeve 27 to move, the second threaded sleeve 27 drives the adjusting sliding block 10 to move the limiting baffle 11, and therefore the gap between the limiting baffle 11 and the shifting baffle 23 is adjusted.
The linkage mechanism 14 comprises a cam 30, one side of the device box 1 is rotatably connected with a linkage rotating shaft 29, one end of the linkage rotating shaft 29 is fixedly connected with the rotating shaft of the cam 30, and the outer surface of the output shaft of the motor 7 is in transmission connection with the outer surface of the linkage rotating shaft 29 through a conveyor belt 31.
Through adopting above-mentioned technical scheme, through the setting of link gear 14, make clearance otter board 32 up-and-down reciprocating to make the wafer silicon chip on the clearance otter board 32 reciprocate in the clear water and clear up, increase the cleaning performance of device to the wafer silicon chip, through the setting of water pump 41, filter the right side of the left water suction baffle 39 of baffle 39, thereby guarantee the quality of water of clearance wafer silicon chip, increase the cleaning performance.
By adopting the technical scheme, the cleaning screen plate 32 is used for receiving the dropped wafer silicon wafers, and the cam 30 rotates to extrude the linkage extrusion plate 38 to enable the cleaning screen plate 32 to descend.
The bottom of the inner surface of the device box 1 is fixedly connected with a partition plate 39, a filter screen plate 40 is fixedly connected between one side of the partition plate 39 and the inner surface of the device box 1, a water pump 41 is fixedly connected to the inner surface of the device box 1 and below the filter screen plate 40, and the water inlet end of the water pump 41 is communicated with one side of the partition plate 39.
Through adopting above-mentioned technical scheme, baffle 39 is used for distinguishing filtering area and clearance district, and filter screen plate 40 is arranged in crossing the impurity in the filter cleaning fluid, and water pump 41 provides power for the clearance liquid circulation.
One side of the partition plate 39 is provided with a reinforcing sliding chute 42, and the inner surface of the reinforcing sliding chute 42 is connected with the outer surface of the cleaning net plate 32 in a sliding manner through a sliding block.
By adopting the technical scheme, the stability of the cleaning screen plate 32 in the up-and-down reciprocating motion is improved.
The working principle is as follows: cleaning liquid is added to the left side of the partition plate 39, a wafer silicon wafer is placed on the placing plate 3, the starting motor 7 drives the first threaded rod 6 to rotate, due to the limit of the sliding chute plate 4, the first threaded rod 6 rotates to drive the first threaded sleeve 5 to move the linkage plate 8, the linkage plate 8 drives the error buffer spring on the buffer spring rod 24 to move the buffer spring rod 24, the buffer spring rod 24 drives the extrusion push plate 25 to move, the extrusion push plate 25 extrudes the wafer silicon wafer on the placing plate 3 to be in close contact with the limit baffle plate 11, simultaneously, the first threaded rod 6 drives the rotating disc 17 to rotate, the rotating disc 17 rotates to drive the linkage strip 18 to rotate, due to the limit of the sliding chute plate 20 to the linkage block 19, the linkage strip 18 rotates to drive the linkage block 19 to reciprocate along the sliding chute plate 20, the linkage block 19 drives the linkage frame 21 to reciprocate the toggle strip 22, and due to the limit of the toggle baffle plate 23, the toggle bar 22 reciprocates to extrude the wafer silicon slice, so that the wafer silicon slice is moved out through a gap between the toggle baffle plate 23 and the limit baffle plate 11, when the toggle bar 22 moves to the front side, the wafer silicon slice drops to the front side, when the toggle bar 22 moves to the back side, the wafer silicon slice drops to the back side, the wafer silicon slice is far away from the placing plate 3 and drops to the cleaning screen plate 32, meanwhile, the motor 7 drives the linkage rotating shaft 29 to rotate through the conveyor belt 31, the linkage rotating shaft 29 rotates to drive the cam 30 to rotate, the cam 30 rotates to extrude the linkage extrusion plate 38 to lower the sealing plate 37, the sealing plate 37 drives the reciprocating slide block 36 to descend along the reciprocating chute 35, the reciprocating slide block 36 drives the cleaning screen plate 32 to descend, the cleaning screen plate 32 descends to extrude the reset spring 34 to contract, the cam 30 continues to rotate, the reset spring 34 extends to drive the cleaning screen plate 32 to ascend, and further enable the cleaning screen plate 32 to reciprocate, the wafer silicon chip up-and-down motion on clearance otter board 32 is driven to clearance otter board 32, thereby wash the wafer silicon chip, start water pump 41 takes out the left cleaning fluid of baffle 39 to the right side of baffle 39, when the cleaning fluid liquid level on baffle 39 right side is higher than baffle 39, the left side that the filtration inflow baffle 39 of cleaning fluid through filter otter board 40, thereby carry out filtration cycle to the cleaning fluid and use, when the wafer silicon chip of different thickness needs to be processed, it drives second threaded sleeve 27 and removes to rotate second threaded rod 26, second threaded sleeve 27 drives and adjusts sliding block 10 and make limit baffle 11 remove, thereby adjust the space between limit baffle 11 and the stirring baffle 23, make the device can process the wafer silicon chip of different thickness.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. The utility model provides a semiconductor wafer silicon chip burst device, includes device case (1) and sets up sealing door (2) at device case (1) front, its characterized in that: the device is characterized in that a placing plate (3) is fixedly connected to one side of the inner surface of a device box (1), a sliding groove plate (4) is fixedly connected to one side of the inner surface of the device box (1) and located above the placing plate (3), a first threaded sleeve (5) is connected to the inner surface of the sliding groove plate (4) through a sliding block in a sliding mode, a first threaded rod (6) is connected to the inner surface of the first threaded sleeve (5) in a threaded mode, a motor (7) is fixedly connected to one side of the device box (1), one end of an output shaft of the motor (7) penetrates through the device box (1) and is fixedly connected with one end of the first threaded rod (6), a linkage plate (8) is fixedly connected to the bottom of the first threaded sleeve (5), an adjusting groove (9) is formed in the top of the sliding groove plate (4), an adjusting sliding block (10) is connected to the inner surface of the adjusting groove (9) in a sliding mode, a limiting baffle (11) is fixedly connected to the bottom of the adjusting block (10), a shifting mechanism (12) is arranged at one end of the first threaded rod (6), an adjusting mechanism (13) is arranged at the top of the sliding groove plate (4), and a clearing linkage mechanism (14) is arranged on one side of the device box (1), and a clearing mechanism (15) is arranged on one side of the device box (1).
2. The device for separating the semiconductor wafer from the silicon wafer according to claim 1, wherein the toggle mechanism (12) comprises a rotating disk (17), one end of the first threaded rod (6) is fixedly connected with the center of one side of the rotating disk (17), and the periphery of the other side of the rotating disk (17) is rotatably connected with a linkage strip (18) through a bearing.
3. The semiconductor wafer silicon wafer slicing device as claimed in claim 2, wherein one end of the linkage bar (18) is rotatably connected with a linkage block (19) through a bearing, and the height of the linkage block (19) is in the same horizontal plane with the height of the center of the rotating disc (17).
4. The semiconductor wafer silicon wafer separation device according to claim 3, wherein a toggle sliding groove plate (20) is fixedly connected to the inner surface of the device box (1), the inner surface of the toggle sliding groove plate (20) is slidably connected with the top of the linkage block (19) through a sliding block, a linkage frame (21) is fixedly connected to the bottom of the linkage block (19), and a toggle bar (22) is fixedly connected to one end of the linkage frame (21).
5. The semiconductor wafer silicon wafer slicing device according to claim 1, wherein a toggle baffle (23) is fixedly connected to both the front side and the back side of the placing plate (3), a buffer spring rod (24) penetrates through and is slidably connected to one side of the linkage plate (8), an error buffer spring is sleeved on the outer surface of the buffer spring rod (24), and an extrusion push plate (25) is fixedly connected to one end of the buffer spring rod (24).
6. The semiconductor wafer silicon wafer slicing device of claim 1, wherein the adjusting mechanism (13) comprises a second threaded rod (26), one end of the second threaded rod (26) is rotatably connected with the top of the chute plate (4), a second threaded sleeve (27) is connected with the outer surface of the second threaded rod (26) in a threaded manner, the outer surface of the second threaded sleeve (27) is fixedly connected with the top of the adjusting sliding block (10), and a through hole (28) is formed in one side of the limit baffle (11).
7. The semiconductor wafer silicon wafer slicing device as claimed in claim 1, wherein the linkage mechanism (14) comprises a cam (30), one side of the device box (1) is rotatably connected with a linkage rotating shaft (29), one end of the linkage rotating shaft (29) is fixedly connected with the rotating shaft of the cam (30), and the outer surface of the output shaft of the motor (7) is in transmission connection with the outer surface of the linkage rotating shaft (29) through a conveyor belt (31).
8. The semiconductor wafer silicon wafer separation device according to claim 7, wherein the cleaning mechanism (15) comprises a cleaning screen plate (32), a guide rod (33) penetrates through and is slidably connected to the top of the cleaning screen plate (32), one end of the guide rod (33) is fixedly connected to the bottom of the inner surface of the device box (1), a return spring (34) is sleeved on the outer surface of the guide rod (33), a reciprocating sliding groove (35) is formed in one side of the device box (1), a reciprocating sliding block (36) is slidably connected to the inner surface of the reciprocating sliding groove (35), one side of the reciprocating sliding block (36) is fixedly connected to one side of the cleaning screen plate (32), a sealing plate (37) is fixedly connected to the other side of the reciprocating sliding block (36), a linkage extrusion plate (38) is fixedly connected to the top of the sealing plate (37), and the top of the linkage extrusion plate (38) is in close contact with the outer surface of the cam (30).
9. The semiconductor wafer silicon wafer separation device according to claim 8, wherein a partition plate (39) is fixedly connected to the bottom of the inner surface of the device box (1), a filter screen plate (40) is fixedly connected between one side of the partition plate (39) and the inner surface of the device box (1), a water pump (41) is fixedly connected to the inner surface of the device box (1) and below the filter screen plate (40), and a water inlet end of the water pump (41) is communicated with one side of the partition plate (39).
10. The semiconductor wafer silicon wafer separating device as claimed in claim 9, wherein a reinforcing runner (42) is formed at one side of the partition plate (39), and an inner surface of the reinforcing runner (42) is slidably connected with an outer surface of the cleaning screen (32) through a slider.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211081961.0A CN115351933A (en) | 2022-09-06 | 2022-09-06 | Semiconductor wafer silicon chip burst device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211081961.0A CN115351933A (en) | 2022-09-06 | 2022-09-06 | Semiconductor wafer silicon chip burst device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115351933A true CN115351933A (en) | 2022-11-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211081961.0A Pending CN115351933A (en) | 2022-09-06 | 2022-09-06 | Semiconductor wafer silicon chip burst device |
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| Country | Link |
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| CN (1) | CN115351933A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115881596B (en) * | 2023-03-08 | 2023-05-05 | 四川上特科技有限公司 | Wafer bearing frame and wafer slicing device |
-
2022
- 2022-09-06 CN CN202211081961.0A patent/CN115351933A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115881596B (en) * | 2023-03-08 | 2023-05-05 | 四川上特科技有限公司 | Wafer bearing frame and wafer slicing device |
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