CN115348716A - Optical fiber circuit board assembly and photoelectric hybrid circuit board - Google Patents

Abstract

The application relates to the technical field of circuit boards, specifically discloses an optical fiber circuit board subassembly and photoelectricity hybrid lines way board, and optical fiber circuit board subassembly includes at least: the base plate comprises a main body part provided with a first windowing and a second windowing, a first extending part formed by extending the main body part to the center of the first windowing from the position, located on the inner side of the first windowing, of the main body part, a second extending part formed by extending the outer side of the main body part outwards, and third extending parts formed by extending the outer side of the main body part outwards, wherein the tail ends of the third extending parts are distributed in a semi-surrounding or surrounding manner, and fiber outlets are formed in the inner side of the second windowing, the tail end of the first extending part, the tail end of the second extending part and the tail ends of the third extending parts; and the optical fiber units are partially arranged on the substrate, one ends of the optical fiber units extend out from one of the fiber outlets, and the other ends of the optical fiber units extend out from any other fiber outlet. By the mode, the assembling of optical interconnection and electrical interconnection can be simplified, and the efficiency is greatly improved.

Description

Optical fiber circuit board assembly and photoelectric hybrid circuit board

Technical Field

The application relates to the technical field of circuit boards, in particular to an optical fiber circuit board assembly and a photoelectric hybrid circuit board.

Background

Electrical interconnection refers to the use of metal lines (usually copper) to connect signals between circuit boards and chips. Optical interconnection refers to the use of light-conducting media (optical fibers, optical waveguides, etc.) to realize signal connection between circuit boards and chips.

Optical interconnects can be combined with electrical interconnects, but the number of optical fibers in the existing optical interconnects is usually large, which easily causes the problems of disorder and difficult assembly.

Disclosure of Invention

The embodiment of the application provides an optical fiber circuit board assembly and a photoelectric hybrid circuit board, and aims to solve the technical problem that optical interconnection and electric interconnection in the prior art are difficult to assemble.

In order to solve the technical problem, the application adopts a technical scheme that: there is provided a fiber optic circuit board assembly comprising at least: the base plate comprises a main body part provided with a first windowing, a second windowing, a first extending part formed by extending the main body part to the center of the first windowing from the position, located at the inner side of the first windowing, of the main body part, a second extending part formed by extending the outer side of the main body part outwards, and third extending parts formed by extending the outer side of the main body part outwards, wherein the tail ends of the third extending parts are distributed in a semi-surrounding or surrounding manner, and fiber outlets are formed in the inner side of the second windowing, the tail end of the first extending part, the tail end of the second extending part and the tail ends of the third extending parts; and the optical fiber units are partially arranged on the substrate, one ends of the optical fiber units extend out from one of the fiber outlets, and the other ends of the optical fiber units extend out from any other fiber outlet.

In order to solve the technical problem, the application adopts a technical scheme that: provided is a photoelectric hybrid circuit board including: a printed circuit board; the optical fiber circuit board assembly is laminated with the printed circuit board; the first electronic element is arranged on the printed circuit board and corresponds to the first window; the first optical device is arranged on the printed circuit board, the optical fiber unit is coupled with the first optical device through an optical fiber interface, the first optical device is coupled with the first electronic component through the printed circuit board, and the first optical device is arranged on the periphery of the first electronic component.

The beneficial effect of this application is: different from the prior art, the base plate of this application is including seting up first windowing, the main part of second windowing, be located the first extension that the department extended the formation to first windowing center in first windowing by the main part, extend the second extension that forms by the outside of main part outwards, and extend the third extension that forms by the outside of main part outwards, the optical fiber unit part sets up in the base plate, and each one end of a plurality of optical fiber unit extends from one of them fibre outlet, each other end of a plurality of optical fiber unit extends from other arbitrary fibre outlets, realize the fixed of optical fiber unit and the protection of optical fiber unit, and then the condition of disorder can not appear, the setting order of optical fiber unit, the position is fixed, no longer need relocate the connection optical device one by one, and then the equipment of optical interconnection and electric interconnection is simplified by a wide margin, efficiency improves by a wide margin.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:

FIG. 1 is a schematic structural diagram of one embodiment of a fiber optic circuit board assembly according to the present application;

FIG. 2 is a schematic structural diagram of another embodiment of a fiber optic circuit board assembly according to the present application;

FIG. 3 is a schematic structural diagram of a first embodiment of the opto-electric hybrid circuit board according to the present application;

FIG. 4 is a schematic structural diagram of another embodiment of a fiber optic circuit board assembly according to the present application;

fig. 5 is a schematic structural diagram of a second embodiment of the opto-electric hybrid circuit board according to the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

Referring to fig. 1, in the present embodiment, the optical fiber circuit board assembly 10 may include a circuit board that transmits only optical signals, or may include a circuit board that transmits mixed signals including optical signals.

The fiber circuit board assembly 10 includes at least: a substrate 11, an optical fiber interface 14, and an optical fiber unit 12.

The substrate 11 includes: the first and second sliding windows are at least provided with a main body part 111 of the first sliding window 101 and the second sliding window 102, a first extending part 112 formed by the main body part 111 located at the inner side of the first sliding window 101 and extending towards the center of the first sliding window 101, a second extending part 113 formed by the outer side of the main body part 111 extending outwards, and a third extending part 114 formed by the outer side of the main body part 111 extending outwards.

The ends of the third extending portions 114 are disposed in a semi-surrounding or surrounding manner, and fiber outlets are disposed at the inner side of the second window 102, the end of the first extending portion 112, the end of the second extending portion 113, and the end of the third extending portion 114.

Further, the ends of the third extending portions 114 may be arranged in a single ring array or in a double ring array, so as to increase the arrangement density of the optical devices and increase the integration level of the optoelectronic hybrid circuit board 100.

Further, the ends of the plurality of third extending portions 114 are arranged in a single ring array or in a double ring array, and further, the third optical devices 203 are arranged in a single ring array or in a double ring array, so as to increase the arrangement density of the third optical devices 203 and increase the integration level of the hybrid circuit board 100.

In an embodiment, at least one third extending portion 114 is bent to be adjacent to the remaining third extending portions 114, so as to form a plurality of third extending portions 114 with ends thereof in a semi-surrounding or surrounding distribution state.

The plurality of optical fiber units 12 are partially disposed on the substrate 11, one end of each of the plurality of optical fiber units 12 extends from one of the fiber outlets, and the other end of each of the plurality of optical fiber units 12 extends from any of the other fiber outlets.

Specifically, in this embodiment, a pattern transfer process may be used to open the first opening 101 and the second opening 102 in the central area or the edge area of the main body 111, that is, the main body 111 in the central area or the edge area is removed, so that in the subsequent processing, an electronic component and an optical device may be correspondingly disposed in the first opening 101 and/or the second opening 102.

The first window 101 may be a quadrilateral window, and the plurality of first extending portions 112 are disposed at intervals on two inner sides, three inner sides, or four inner sides of the first window 101 and extend toward the center of the first window 101. When the first extending portions 112 are disposed at intervals on the four inner sides of the first window 101, the first extending portions 112 surround the inner side of the first window 101.

The first window 101 may be a circular or oval window, and the plurality of first extending portions 112 are spaced apart from each other and disposed inside one-half, three-quarters, or the entire circumference of the inside of the circumference of the first window 101. When the plurality of first extending portions 112 are disposed at intervals on the inner side of the entire circumference of the first window 101, the plurality of first extending portions 112 are disposed around the inner side of the first window 101.

Part of the structure of the optical fiber unit 12 may be provided in the main body 111 and the first extension 112, or may be attached to the inside of the main body 111 and the first extension 112. The optical fiber units 12 are arranged in the main body 111 and the first extension portion 112 in a certain manner, wherein the arrangement manner of the optical fiber units 12 in the main body 111 and the first extension portion 112 may be the same or different. Each optical fiber unit 12 includes at least one optical fiber, which may be one or more optical fibers, one or more groups of optical fibers, or the like. The number of the optical fibers in each group of optical fibers may be set according to actual requirements, for example, according to the model of the connector to be connected, and may be, for example, 1, 4, 8, 12, 24, and the like. The number of groups of optical fibers can also be set according to requirements, and is not limited here.

The optical fiber in the optical fiber unit 12 may be a high temperature optical fiber or a general optical fiber. The high temperature optical fiber is different from the general optical fiber in that: the material of high temperature optical fiber surface coating is high temperature resistant material, makes high temperature optical fiber can satisfy the application under the adverse circumstances of high temperature, and ordinary optical fiber is also equipped with the coating in the surface, but ordinary optical fiber surface's coating can lose the effect of protection optic fibre under high temperature, and then optic fibre is impaired easily. Wherein the designer may select the optical fiber unit 12 to be a high temperature optical fiber or a general optical fiber according to the application environment of the optical fiber circuit board assembly 10. For example: when the optical fiber circuit board assembly 10 is required to be capable of operating at high temperatures of 100 ℃ or higher and to be capable of being repeatedly bent, the optical fiber unit 12 may be selected as a high-temperature optical fiber. It should be noted that, by setting the optical fiber unit 12 as a high-temperature optical fiber, in addition to widening the working temperature of the optical fiber circuit board assembly 10, the optical fiber circuit board assembly 10 can be processed in a laminating manner during the processing process, so as to widen the processing manner of the optical fiber circuit board assembly 10.

One end of the optical fiber unit 12 may extend from the fiber outlet inside the second window 102, and the other end extends from any one of the ends of the first extending portion 112, the second extending portion 113, and the third extending portion 114.

Alternatively, one end of the optical fiber unit 12 may extend from the fiber outlet of the end of the first extending portion 112, and the other end may extend from any one of the fiber outlets inside the second opening window 102, the end of the second extending portion 113, and the end of the third extending portion 114.

Alternatively, one end of the optical fiber unit 12 may extend from the fiber outlet of the end of the second extending portion 113, and the other end may extend from any one of the fiber outlets of the inner side of the second opening window 102, the end of the first extending portion 112, and the end of the third extending portion 114.

Alternatively, one end of the optical fiber unit 12 may extend from the fiber outlet of the end of the third extending portion 114, and the other end may extend from any one of the fiber outlets of the inner side of the second opening window 102, the end of the first extending portion 112, and the end of the second extending portion 113.

Be different from prior art's condition, the base plate of this application is including seting up first windowing, the main part of second windowing, be located the first extension that first windowing center extension formed of inboard department of first windowing by the main part, the second extension that forms is extended to the outside by the main part, and the third extension that forms is extended to the outside by the main part, optical fiber unit part sets up in the base plate, and each one end of a plurality of optical fiber unit extends from one of them fibre outlet, each other end of a plurality of optical fiber unit extends from any other fibre outlet, realize optical fiber unit's fixed and optical fiber unit's protection, and then the condition of disorder can not appear, optical fiber unit's setting order, the rigidity, no longer need relocate the connection optical device one by one, and then the equipment of optical interconnection and electric interconnection is simplified by a wide margin, efficiency improves by a wide margin.

In one embodiment, the fiber optic circuit board assembly further comprises: the optical fiber interface 14 is connected to one end of the optical fiber unit 12 extending from the optical fiber interface 14, and the optical fiber unit is coupled to the optical device or other optical fiber unit 12 through the optical fiber interface.

In particular, the fiber optic interface 14 may include a single-way optical connector and/or a multi-way optical connector. The single-path optical connector is provided with a positioning structure for positioning one path of optical fiber unit 12 in an inner cavity, and can be used for receiving the optical fiber unit 12 extending from the optical fiber port and positioning the optical fiber unit 12 through the positioning structure. And a positioning structure for positioning the multi-path optical fiber unit 12 is arranged in the inner cavity of the multi-path optical connector, and the multi-path optical connector can be used for receiving the multi-path optical fiber unit 12 extending from the optical fiber port and positioning the multi-path optical fiber unit 12 through the positioning structure.

In the actual manufacturing process, no matter the single-path optical connector or the multi-path optical connector, the corresponding optical fiber unit 12 needs to be inserted into the inner cavity of the optical connector, then the optical fiber can be fixed by glue, the redundant optical fiber is cut off, and then grinding and polishing are performed, so as to manufacture the optical fiber interface 14 meeting the requirements.

Wherein, a part of the optical fiber unit 12 is arranged in the substrate in a certain way, and the rest part of the optical fiber unit 12 extends from the fiber outlet.

As shown in fig. 4, in one embodiment, the substrate 11 includes: the first film layer 1111 and the second film layer 1112 arranged at intervals and the bonding layer 1113 are stacked. The first film 1111 and the second film 1112 are stacked and spaced, and the optical fiber unit is accommodated between the first film 1111 and the second film 1112, wherein a first opening is formed between the first film 1111 and the second film 1112 at the end of the first extending portion, and the optical fiber interface is at least partially located in the first opening. The bonding layer 1113 is filled in a remaining space between the first film 1111 and the second film 1112 except for the optical fiber unit to fix the optical fiber unit with respect to the first film 1111.

In one embodiment, the first layer 1111 is a flexible material; the second film layer 1112 and the bonding layer 1113 are made of thermosetting materials or thermoplastic materials; the bonding layer 1113 comprises n layers of bonding layers 1114 which are arranged in a stacked mode, and a plurality of optical fiber units are distributed in a stacked mode in m layers of optical fiber unit layers, wherein n is more than or equal to 1, and m is more than or equal to 1; the optical fiber unit layers are arranged between two adjacent bonding layers 1114 or in one bonding layer 1114.

In an embodiment, the first film 1111 and the second film 1112 are made of a flexible material, wherein the bonding layer 1113 includes n adhesive layers 1114 arranged in a stacked manner, and the plurality of optical fiber units are distributed in a stacked manner by m optical fiber unit layers, wherein n is greater than or equal to 1, and m is greater than or equal to 1. The optical fiber unit layers are arranged between two adjacent bonding layers 1114 or in one bonding layer 1114, and the bonding layer 1114 is made of thermosetting materials or thermoplastic materials.

In particular, the flexible material may be specifically a flexible composite material, and may be, for example: polyimide, polyethylene terephthalate, polydimethylsiloxane, and the like. The first film layer 1111 is made of a flexible material, so that the substrate 11 can be made flexible to withstand repeated bending to meet the actual position requirement. The thickness of the first film layer 1111 may be not more than 100 μm, for example, 20 μm to 100 μm, specifically, 20 μm, 25 μm, 45 μm, 65 μm, 85 μm, 100 μm, and the like, and is not particularly limited herein.

A bonding layer 1113 is disposed between the first film 1111 and the second film 1112 that are disposed adjacent to each other, so as to be connected to each other by the bonding layer 1113, and the corresponding optical fiber unit 12 is fixed between the two adjacent first film 1111 and second film 1112 by the bonding layer 1113, and the bonding layer 1113 is filled in a remaining space between the two adjacent first film 1111 and second film 1112 except for the optical fiber unit 12.

Note that when the thickness of the bonding layer 1113 is too small, it is difficult to fix the optical fiber, and when the thickness is too large, it is difficult to maintain the flexibility of the substrate 11. Here, the thickness here refers to a thickness of the bonding layer 1113 in a direction perpendicular to the plate surfaces of the first and second film layers 1111 and 1112. In this embodiment, the thickness of the thinnest region of the bonding layer 1113 between two adjacent first film layers 1111 and 1112 is greater than one tenth of the diameter of the optical fiber unit 12 and less than 10 times the diameter of the optical fiber unit 12, or greater than one half of the diameter of the optical fiber unit 12 and less than 2 times the diameter of the optical fiber unit 12, for example, the thickness of the thinnest region of the bonding layer 1113 between two adjacent first film layers 1111 and 1112 is one fifth, one half, 1 time, 2 times, 5 times, etc. of the diameter of the optical fiber, which is not limited herein.

Specifically, the thickness of the bonding layer 1113 is not less than 50 μm, and may be 50 μm, 60 μm, 70 μm, or the like, and the peel strength between the adjacent first film layer 1111 and second film layer 1112 after the bonding layer 1113 is used is not less than 15N/cm ³ 。

Specifically, in one application scenario, the adhesive layer 1114 is solid and flexible in a first temperature range and/or a first pressure range, and has fluidity in a second temperature range and/or a second pressure range, wherein any temperature value in the first temperature range is not greater than any temperature value in the second temperature range. Specifically, the adhesive layer 1114 is solid and flexible at or near normal temperature and pressure, and has a certain fluidity when heated to a certain temperature and/or applied with a certain pressure. Specifically, the adhesive layer 1114 can be a thermoplastic material or a thermoset material.

The adhesive layer 1114 can be made of different materials according to the actual usage environment of the optical fiber circuit board assembly 10. Specifically, when it is required to adapt to a high temperature environment, as described above, the optical fiber of the optical fiber unit 12 is a high temperature optical fiber, and the material of the adhesive layer 1114 may be at least one of an epoxy system, an acrylic system, and a silicone system. When the operation is performed only in the normal room temperature environment, as described above, the optical fiber of the optical fiber unit 12 is the normal optical fiber, and the material of the adhesive layer 1114 may be at least one of an acrylic system and a silicone system.

By adopting the adhesive layer 1114 made of the above materials, when the substrate 11 is heated and/or pressurized, the adhesive layer 1114 can flow and cover the periphery of the optical fiber unit 12, and fills the space between the adjacent first film layer 1111 and the second film layer 1112 except the optical fiber, so as to fix the optical fiber more firmly, reduce the situation that the optical fiber is loosened and displaced due to loose fixation during long-term use, and improve the reliability of the substrate 11 and the optical fiber circuit board assembly 10.

Referring to fig. 2 to 3, in the present embodiment, the optoelectric hybrid board 100 includes: a printed circuit board 30, a fiber circuit board assembly 10, a first electronic component 401, and a first optical device 201.

The fiber optic circuit board assembly 10 is the fiber optic circuit board assembly 10 of the above-described embodiment. The fiber-optic wiring board assembly 10 is stacked on the printed circuit board 30, the first electronic component 401 is disposed on the printed circuit board 30, and the first electronic component 401 is disposed corresponding to the first window 101. The first optical device 201 is disposed on the printed circuit board 30, the optical fiber unit 12 is coupled to the first optical device 201 through the optical fiber interface 14, and the first optical device 201 is coupled to the first electronic component 401 through the printed circuit board 30.

The first electronic element 401 may or may not exceed the first window 101.

Specifically, the supporting member 60 is disposed between the printed circuit board 30 and the optical fiber circuit board assembly 10, specifically, a mounting hole (not shown) may be disposed on the printed circuit board 30 and the optical fiber circuit board assembly 10, in this case, the supporting member 60 may be a screw, a rivet, a pin, or the like, which is inserted into the mounting hole to fixedly connect the printed circuit board 30 and the optical fiber circuit board assembly 10. In this way, the printed circuit board 30 and the optical fiber circuit board assembly 10 can be fixed more firmly and can be detached more conveniently.

As shown in fig. 3, in an embodiment, the optoelectronic hybrid circuit board 100 further includes: a first light device 201. The first optical device 201 is disposed on the printed circuit board 30, and the first optical device 201 is disposed on the periphery of the first electronic component 401.

In one embodiment, the optoelectronic hybrid circuit board 100 further includes: a second optical fiber unit or a second optical device 202 arranged on the printed circuit board 30, the optical fiber unit being coupled to the second optical fiber unit or the second optical device 202 via an optical fiber interface, and the second optical device 202 being coupled to the first electronic component 401 via the printed circuit board 30.

In one embodiment, the optoelectronic hybrid circuit board 100 further includes: the second electronic component 50 and the third optical device 203, the second electronic component 50 and the third optical device 203 are disposed on the printed circuit board 30, the plurality of third optical devices 203 are disposed at intervals, the plurality of third optical devices 203 are distributed outside the second electronic component 50 in a semi-surrounding or surrounding manner, the third optical fiber unit is coupled to the third optical device 203 through a third optical fiber interface, and the third optical device 203 is coupled to the second electronic component 50 through the printed circuit board 30. Further, the third optical devices 203 may be arranged in a single ring array or in a double ring array, so as to increase the arrangement density of the third optical devices 203 and increase the integration level of the hybrid circuit board 100.

In an embodiment, the main body further has a second opening 102, and the second opening 102 is spaced apart from the first opening 101. The optoelectric hybrid board 100 further includes: a third electronic component. The third electronic component is disposed on the printed circuit board 30, and the third electronic component is disposed corresponding to the second window 102 of the optoelectronic hybrid circuit board 100, wherein the second window 102 is used for exposing the third electronic component.

As shown in fig. 5, in an embodiment, the optoelectronic hybrid circuit board 100 further includes: printed circuit board 30, fiber circuit board assembly 10, high-speed substrate 70, first optical device 201, first electronic component 401. The optical fiber circuit board assembly 10 is the optical fiber circuit board assembly 10 in the above embodiment. The printed circuit board 30 can be made of common cheap plates, the interior of the printed circuit board 30 can be free of high-speed signals, the high-speed substrate 70 is arranged on one side of the printed circuit board 30, and the first optical device 201 and the first electronic component 401 are arranged on one side of the high-speed substrate 70 away from the printed circuit board 30, wherein the number of the first optical devices 201 can be multiple. The optical fiber board assembly 10 and the printed circuit board 30 are stacked, and the first electronic component 401 is disposed corresponding to the first window 101. The optical fiber unit 12 is coupled to the first optical device 201 through the optical fiber interface 14, and the first optical device 201 is coupled to the first electronic component 401 through the high-speed substrate 70.

In an embodiment, the first electronic component 401 may be an Application Specific Integrated Circuit (ASIC) chip for a Specific Application, and the first optical device 201 may be a photo Engine (optical Engine).

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (12)

1. An optical fiber circuit board assembly, comprising at least:

the base plate comprises a main body part provided with a first windowing and a second windowing, a first extending part formed by the main body part located at the inner side of the first windowing and extending towards the center of the first windowing, a second extending part formed by the outer side of the main body part extending outwards, and a third extending part formed by the outer side of the main body part extending outwards, wherein the tail ends of the third extending parts are distributed in a semi-surrounding or surrounding manner, and fiber outlets are formed in the inner side of the second windowing, the tail end of the first extending part, the tail end of the second extending part and the tail end of the third extending part;

and the optical fiber units are partially arranged on the substrate, one ends of the optical fiber units extend out from one of the fiber outlet openings, and the other ends of the optical fiber units extend out from any other fiber outlet opening.

2. The fiber optic circuit board assembly of claim 1, further comprising:

the optical fiber unit is connected with the optical fiber interface from one end extending out of the optical fiber interface, and the optical fiber unit is coupled with an optical device or other optical fiber units through the optical fiber interface.

3. The fiber optic circuit board assembly of claim 1, wherein ends of adjacent fiber outlets are spaced from a center of the first window by a distance that is at least greater than or equal to the optical device dimension.

4. The fiber optic circuit board assembly of claim 1,

at least one third extension part is bent to be close to the rest third extension parts so as to form a plurality of ends of the third extension parts in a semi-surrounding or surrounding distribution state.

5. The fiber optic circuit board assembly of claim 1, wherein the base plate comprises:

the optical fiber unit comprises a first film layer and a second film layer which are arranged at intervals in a stacked mode, wherein the optical fiber unit is partially accommodated between the first film layer and the second film layer;

and a bonding layer filled in a remaining space between the first film layer and the second film layer except for the optical fiber unit to fix the optical fiber unit with respect to the first film layer.

6. The fiber optic circuit board assembly of claim 5, wherein the fiber exit port is formed between the first membrane layer and the second membrane layer.

7. The fiber optic circuit board assembly of claim 5,

the first film layer is made of flexible materials;

the second film layer and the bonding layer are made of thermosetting materials or thermoplastic materials;

the bonding layer comprises n layers of bonding layers which are arranged in a stacked mode, the optical fiber units are distributed in a stacked mode in the form of m layers of optical fiber unit layers, wherein n is more than or equal to 1, and m is more than or equal to 1;

the optical fiber unit layers are arranged between two adjacent bonding layers or in one of the bonding layers.

8. The fiber optic circuit board assembly of claim 5,

the first film layer and the second film layer are made of flexible materials;

the bonding layer comprises n bonding layers which are arranged in a stacked mode, the optical fiber units are distributed in a stacked mode in m optical fiber unit layers, n is larger than or equal to 1, and m is larger than or equal to 1;

the optical fiber unit layers are arranged between two adjacent bonding layers or in one of the bonding layers, and the bonding layers are made of thermosetting materials or thermoplastic materials.

9. An optoelectric hybrid board, comprising:

a printed circuit board;

the fiber optic circuit board assembly of any one of claims 1-8, disposed in a stack with the printed circuit board;

the first electronic element is arranged on the printed circuit board and corresponds to the first window;

the optical fiber unit is coupled with the first optical device through the optical fiber interface, the first optical device is coupled with the first electronic component through the printed circuit board, and the first optical device is arranged on the periphery of the first electronic component.

10. The board of claim 8, wherein the board further comprises:

the optical fiber unit is coupled to the second optical fiber unit or the second optical device through the optical fiber interface, and the second optical device is coupled to the first electronic component through the printed circuit board.

11. The board of claim 8, wherein the board further comprises:

the second electronic element and the third optical device are both arranged on the printed circuit board, the plurality of third optical devices are arranged at intervals, the plurality of third optical devices are distributed outside the second electronic element in a semi-surrounding or surrounding manner, the third optical fiber unit is coupled with the third optical device through the third optical fiber interface, and the third optical device is coupled with the second electronic element through the printed circuit board.

12. The optoelectronic hybrid circuit board of claim 8, wherein the main body further comprises a second window, the second window being spaced apart from the first window;

the photoelectric mixed circuit board further comprises:

and the third electronic element is arranged on the printed circuit board and corresponds to a second window of the photoelectric hybrid circuit board, wherein the second window is used for exposing the third electronic element.

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