CN115346710A - High-thermal-conductivity multi-rubber powder mica tape and preparation method thereof - Google Patents
High-thermal-conductivity multi-rubber powder mica tape and preparation method thereof Download PDFInfo
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- CN115346710A CN115346710A CN202211116474.3A CN202211116474A CN115346710A CN 115346710 A CN115346710 A CN 115346710A CN 202211116474 A CN202211116474 A CN 202211116474A CN 115346710 A CN115346710 A CN 115346710A
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- 239000000843 powder Substances 0.000 title claims abstract description 123
- 239000010445 mica Substances 0.000 title claims abstract description 112
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 112
- 229920001971 elastomer Polymers 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 claims abstract description 65
- 239000011521 glass Substances 0.000 claims abstract description 51
- 238000009413 insulation Methods 0.000 claims abstract description 51
- 239000004744 fabric Substances 0.000 claims abstract description 50
- 239000003292 glue Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000013329 compounding Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 9
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 8
- 229930184652 p-Terphenyl Natural products 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- KVBYPTUGEKVEIJ-UHFFFAOYSA-N benzene-1,3-diol;formaldehyde Chemical compound O=C.OC1=CC=CC(O)=C1 KVBYPTUGEKVEIJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004305 biphenyl Substances 0.000 claims description 4
- 235000010290 biphenyl Nutrition 0.000 claims description 4
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- XJKSTNDFUHDPQJ-UHFFFAOYSA-N 1,4-diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=C(C=2C=CC=CC=2)C=C1 XJKSTNDFUHDPQJ-UHFFFAOYSA-N 0.000 claims description 3
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 claims description 3
- UREVLELSVZQJTM-UHFFFAOYSA-N benzene-1,4-diol;formaldehyde Chemical compound O=C.OC1=CC=C(O)C=C1 UREVLELSVZQJTM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000001828 Gelatine Substances 0.000 claims description 2
- 229920000159 gelatin Polymers 0.000 claims description 2
- 235000019322 gelatine Nutrition 0.000 claims description 2
- 239000004843 novolac epoxy resin Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 239000011230 binding agent Substances 0.000 abstract description 5
- 238000001035 drying Methods 0.000 description 26
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- 238000003756 stirring Methods 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 17
- 238000005096 rolling process Methods 0.000 description 11
- 239000007787 solid Substances 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 238000007731 hot pressing Methods 0.000 description 8
- 238000004088 simulation Methods 0.000 description 8
- 238000010998 test method Methods 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 240000002834 Paulownia tomentosa Species 0.000 description 2
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- YGANSGVIUGARFR-UHFFFAOYSA-N dipotassium dioxosilane oxo(oxoalumanyloxy)alumane oxygen(2-) Chemical compound [O--].[K+].[K+].O=[Si]=O.O=[Al]O[Al]=O YGANSGVIUGARFR-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052627 muscovite Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
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- 238000003860 storage Methods 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
Abstract
The invention discloses a high-heat-conductivity multi-rubber powder mica tape and application thereof, and relates to the field of insulation systems of high-voltage motors and manufacturing of related materials of the insulation systems. The high-heat-conductivity multi-glue powder mica tape is formed by compounding a layer of mica paper, one or two layers of alkali-free glass cloth, a binder and inorganic heat-conducting powder, and the mass of each component material in unit area is as follows: the method is mainly used for preparing main insulation of the high-voltage motor, wherein the powder mica paper is 60-130 g/square meter, the alkali-free glass cloth is 16-45 g/square meter, the adhesive is 50-105 g/square meter, and the inorganic heat-conducting powder is 20-50 g/square meter. The main insulation prepared by the high-heat-conductivity poly-rubber powder mica tape has the heat conductivity coefficient of 0.40-0.55W/(m.K), is improved by 60-100 percent compared with the main insulation of a common powder-free high-voltage motor, and has the breakdown field intensity and the electric service life which are in the same level with the main insulation of the common powder-free high-voltage motor.
Description
Technical Field
The invention relates to the field of insulation systems of high-voltage motors and manufacturing of related materials of the insulation systems, in particular to a high-heat-conductivity multi-glue powder mica tape applied to manufacturing of main insulation of a high-voltage motor.
Background
The air-cooled high-voltage motor does not need auxiliary machines such as water treatment or hydrogen production and the like and control equipment thereof, and has the advantages of simple structure, low manufacturing cost, simple repair and maintenance, high operation reliability, quick start and the like, so that the air-cooled high-voltage motor has a large number of applications in the aspects of power grid peak shaving motors, pumped storage motors, mine motors, high-power driving motors and the like, and is rapidly developed in more than ten years.
However, because the heat generated by the stator coil or the bar when the air-cooled motor operates must firstly pass through the main insulation (ground insulation) and then can be transferred to the outside of the coil or the bar and the iron core, and then is taken away by the air-cooled system, the smaller the thermal resistance of the main insulation, the higher the cooling efficiency of the motor is, the lower the temperature rise of the coil or the bar is, the lower the loss of the motor is and the higher the reliability is; or the size of the motor can be reduced under the same capacity, and the manufacturing cost is reduced. Therefore, the reduction of the thermal resistance of the main insulation has important economic and technical significance in the manufacturing field of high-voltage motors.
There are generally two ways to reduce the main insulation resistance in engineering: firstly, the thickness of the main insulation is reduced; and secondly, the heat conductivity coefficient of the related insulating material is improved. Since the thickness of the main insulation must depend on many factors, such as the operating voltage of the machine, the insulation level of the insulation material, the design of the insulation structure and the level of manufacture of the coil or bar, which are generally determined by the electrical life of the coil or bar, the actual operating conditions and the reliability requirements, the thickness of the main insulation cannot be reduced until the insulation level is largely broken. According to the current technical conditions, a more reliable approach is to reduce the thermal resistance of the main insulation by increasing the thermal conductivity of the relevant insulating material.
In order to improve the thermal conductivity of the primary insulation material, a great deal of improvement research work has been conducted on the materials used for manufacturing the primary insulation material at home and abroad for over thirty years. The improvement method adopted so far is basically to increase the thermal conductivity of the main insulation by adding inorganic thermal conductive powder into the mica tape used for preparing the main insulation. The powder-filled high-thermal-conductivity mica tape has a technical difficulty which is difficult to overcome at the present stage: because the heat conductivity coefficient of the existing high-heat-conductivity poly-mica powder tapes strongly depends on the amount of the added inorganic heat-conducting powder, a large amount of inorganic powder (more than 60 g/square meter) must be added to obtain higher heat conductivity coefficient. However, the prior art cannot completely eliminate the defects at the interface between the organic binder and the inorganic heat conductive powder, and the more powder is added, the more interface defects become. The defects can cause the aggregation of space charge and the distortion and local concentration of an electric field, thereby increasing the local discharge capacity of the main insulation, reducing the electric service life, the breakdown field strength and the reliability of the main insulation, and leading the high-heat-conduction rich-glue mica powder tape to be not practically applied so far.
Disclosure of Invention
The cooling mode and the heat dissipation technology of the high-voltage motor are very important links in the design and manufacturing technology of the high-voltage motor, and directly influence various economic and technical indexes, manufacturing cost and operation reliability of the high-voltage motor. The invention solves the technical problem that the electric service life of the main insulation and the breakdown field strength are greatly reduced due to the fact that excessive heat-conducting powder needs to be added to the high-heat-conducting rich-glue mica tape in the prior art. The invention provides a high-heat-conductivity multi-powder mica tape, which can realize the same increase of heat conductivity coefficient by using lower addition amount of heat-conducting powder (not more than 35 g/square meter). The novel formula is introduced into the adhesive of the high-thermal-conductivity poly-mica powder tape, so that the heat conduction of the adhesive is enhanced, the addition amount of inorganic heat-conducting powder can be greatly reduced on the premise of improving the same heat conductivity coefficient by combining the heat-conducting powder, the defects on the interface between the organic adhesive and the inorganic heat-conducting powder are reduced, the adverse effect on the dielectric property of the main insulation due to excessive addition of the heat-conducting powder is reduced, the electric life and the breakdown field strength of the main insulation can be maintained while the heat conductivity coefficient is improved, and the application requirements of the main insulation of a high-voltage motor on the high-thermal-conductivity poly-mica powder tape are met.
The invention adopts the following technical scheme:
a high-heat-conductivity multi-glue powder mica tape is compounded by mica paper, alkali-free glass cloth, adhesive and inorganic heat-conducting powder, wherein the mass of each component material in unit area is as follows: 60-130 g of mica paper per square meter, 16-45 g of alkali-free glass cloth per square meter, 50-105 g of adhesive per square meter and 20-50 g of inorganic heat-conducting powder per square meter; the adhesive is prepared from the raw materials of liquid epoxy resin and a curing agent. Preferably, the mica paper powder is 60 to 90 grams per square meter, the alkali-free glass cloth is 25 to 45 grams per square meter, the adhesive is 60 to 90 grams per square meter, and the inorganic heat-conducting powder is 20 to 40 grams per square meter.
In the invention, the liquid epoxy resin is one or more of novolac epoxy resin, resorcinol diglycidyl ether, bisphenol A type liquid epoxy resin and bisphenol F type liquid epoxy resin.
In the invention, the mica paper is the existing product and is made of natural muscovite; in the high heat conduction multi-powder mica tape, powder mica paper is a layer.
In the high-thermal-conductivity multi-glue powder mica tape, the alkali-free glass cloth is one layer or two layers; when the alkali-free glass cloth is two layers, the mica paper is positioned between the two layers of alkali-free glass cloth; the mass per unit area means the mass per unit area of all the alkali-free glass cloths.
In the invention, the curing agent is one or more of 4,4' -dihydroxy biphenyl, 4' -diaminobiphenyl, 4' -dicarboxylic acid biphenyl, 4' -dicarboxylic acid p-terphenyl, 4' -dihydroxy p-terphenyl, resorcinol formaldehyde resin and hydroquinone formaldehyde resin.
In the invention, the inorganic heat-conducting powder is BN or Al 2 O 3 One or two of them; the median particle size of the inorganic heat-conducting powder is 0.1-30 mu m.
The invention takes liquid epoxy resin and curing agent as raw materials, and the raw materials react in solvent to obtain the adhesive which plays a role in adhering powder mica paper and alkali-free glass cloth. The solvent is a conventional organic solvent used for dissolving the curing agent and serving as a dispersant of the reaction system. Preferably, the reaction condition is that the reflux reaction is carried out for 3 to 5 hours at the temperature of between 105 and 110 ℃.
The high-thermal-conductivity multi-rubber powder mica tape is mainly used for preparing main insulation of a high-voltage motor. The production process of the high-thermal-conductivity rich-glue mica tape is consistent with that of the common high-thermal-conductivity rich-glue mica tape, such as: preparing an adhesive, mixing the adhesive with heat-conducting powder, gluing glass cloth, compounding the glued glass cloth with mica paper, drying, rolling and slitting the mica tape and the like.
Compared with the prior art, the invention has the following advantages:
(1) The invention adopts the liquid epoxy resin and the curing agent as raw materials, enhances the transmission of phonons in the adhesive and improves the heat-conducting property of the adhesive. Compared with epoxy curing systems such as tung oil anhydride, tung maleic anhydride and the like adopted in the prior art, the thermal conductivity of the adhesive is improved by 50 percent or more compared with the thermal conductivity of the adhesive used in the prior art, which is 0.17-0.19W/(m.K).
(2) Because the heat conductivity coefficient of the adhesive adopted by the invention is obviously improved compared with the prior art, the adhesive is a continuous phase in the main insulation of the high-voltage motor, and the effect of a small amount of heat-conducting powder is combined, the technical effects of high heat conductivity and low filler consumption can be realized, and the interface defect between the adhesive and the inorganic heat-conducting powder is reduced; because the usage amount of the heat-conducting powder with high price is reduced, and the manufacturing cost of the high-heat-conducting multi-rubber powder mica tape is also reduced.
(3) The heat conductivity coefficient of the main insulation of the high-voltage motor prepared by the high-heat-conductivity poly-rubber powder mica tape can reach 0.40-0.55W/(m.K), and is improved by 50-100 percent compared with the heat conductivity coefficient of the main insulation of the common powder-free high-voltage motor in the prior art of 0.25-0.28W/(m.K), and the breakdown field intensity and the electric service life of the high-voltage motor are in the same level with the main insulation of the common powder-free high-voltage motor in the prior art.
Detailed Description
According to the invention, liquid epoxy resin and a curing agent are used as raw materials, the adhesive is obtained by reaction in a solvent and is matched with a small amount of heat-conducting powder to serve as an adhesive material of a mica tape, the technical effect of high heat conduction and low filler consumption is unexpectedly realized, the technical effect of high filler in the prior art can be achieved by only adopting less than half of the filler consumption, the breakdown field intensity and the electric service life are not reduced while the heat-conducting property is obviously improved, the technical defect that the breakdown field intensity and the electric service life are greatly reduced due to the high filler consumption in the prior art is solved, and the technical bias that the heat-conducting property can be improved only by adopting high filler in the prior art is corrected.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the following examples and comparative examples. The embodiments described herein are merely illustrative and not restrictive of the present invention. The raw materials of the invention are all commercial products, meet the use requirements of mica tapes, and the specifications of mica paper, alkali-free glass cloth and heat-conducting filler used in the embodiment and proportion are consistent. The preparation operation of the high-heat-conductivity rich-glue mica tape is conventional, and the production process of the high-heat-conductivity rich-glue mica tape is consistent with that of the conventional high-heat-conductivity rich-glue mica tape. The specific process steps and process parameters for manufacturing the simulation line bar sample by adopting the hot pressing process are the prior art, such as: the working procedure details of simulating the size requirement of the aluminum row or the copper bar, the wrapping layer number, the wrapping tension, the pre-baking condition, the vacuum devolatilization, the die-entering pressurization, the temperature rise solidification, the cooling and die unloading and the like are well known by the same workers, and the embodiment is not repeated.
The heat conductivity coefficient of the main insulation of the analog bar is detected according to the regulation of GB/T29313-2012 test method for the heat conductivity of the electric insulation material, the breakdown field strength is detected according to the regulation of JB/T12685-2016 technical conditions for the stator coil of the high-voltage motor, section 5.5, and the electric life is detected according to the regulation of JB/T12685-2016 technical conditions for the stator coil of the high-voltage motor, section 5.8.2.
Example 1
The high-thermal-conductivity multi-powder mica tape prepared in the embodiment contains a layer of mica paper, a layer of glass cloth, a binder and BN thermal-conductivity powder, wherein the mass of each component material in unit area is as follows: 105g of mica paper, 20g of alkali-free glass cloth, 80g of adhesive, 30g of BN heat-conducting powder and 0.16 +/-0.02 mm of mica tape.
The preparation procedure of this example is as follows:
(1) Adhesive formulation
100kg of bisphenol A liquid epoxy resin with the epoxy value of 0.52mol/100g, 40kg of 4,4' -dihydroxybiphenyl and 20kg of acetone are put into a reaction kettle, stirred, heated to 100 ℃ for reflux reaction for 4 hours, 30kg of toluene and 10kg of acetone are sequentially added after the heating is stopped, the stirring is continued, the temperature is naturally reduced, and the materials are discharged, filtered and barreled, thus obtaining the adhesive with the solid content of 70 percent.
(2) Compounding heat conducting powder with adhesive
And (2) putting 100kg of the adhesive with the solid content of 70% prepared in the step (1) into a stirring and dispersing tank, starting stirring, putting 26.25kg of BN heat-conducting powder with the median particle size of 20 microns, and stirring for 2 hours to obtain the adhesive containing the heat-conducting powder.
(3) Glass cloth gluing
Transferring the adhesive containing the heat-conducting powder prepared in the step (2) into a glue groove of a mica tape gluing machine, which is provided with a stirring device, gluing alkali-free glass cloth with the given amount of 20 g/square meter, and controlling the gluing amount to meet the requirement by adjusting the solid content of the adhesive, the speed of the mica tape machine and the rotating speed of a gluing roller, wherein the method for controlling and adjusting the gluing amount is well known by the same workers and is not repeated herein.
(4) Compounding, drying, rolling and cutting
Compounding the glass cloth glued in the step (3) with mica paper with the quantitative weight of 105 g/square meter, and then drying in a drying tunnel: the temperature of the front section of the drying tunnel is controlled to be 70-80 ℃, the temperature of the middle section is controlled to be 110-120 ℃, the temperature of the tail section is controlled to be 80-90 ℃, the speed of the drying tunnel is controlled to be 1.5-2 m/min, and the high-heat-conductivity multi-glue powder mica tape is prepared after rolling and slitting.
A high-thermal-conductivity poly-mica powder tape is taken, a simulation wire rod sample with the unilateral insulation thickness of 3.5mm is manufactured by adopting a hot-pressing process, and the main insulation has the thermal conductivity coefficient of 0.45W/(m.K), the breakdown field strength of 34kV/mm and the electric service life of 1320 hours under the field strength of 10kV/mm according to the test method specified by relevant national or industrial standards.
Example 2
The high-thermal-conductivity multi-glue powder mica tape prepared in the embodiment contains a layer of mica paper, a layer of glass cloth, a binder and BN thermal-conductivity powder, wherein the mass of each component material in unit area is as follows: 85g of mica paper per square meter and 40g of two layers of alkali-free glass cloth per square meter, and 30g of adhesive and 30g of BN heat-conducting powder per square meter, wherein the intrinsic heat conduction is improved, the total mass per unit area is 235g per square meter, and the thickness of the mica tape is 0.16 +/-0.02 mm.
The preparation procedure of this example is as follows:
(1) Glass cloth sizing
Pouring the adhesive containing the heat-conducting powder prepared in the step (2) in the example 1 into glue tanks of which the upper layer and the lower layer are both provided with stirring devices, respectively gluing alkali-free glass cloth with the quantity of both being 20 g/square meter to the upper layer and the lower layer, and controlling the gluing quantity to meet the requirements by adjusting the solid content of the adhesive, the speed of the mica tape machine and the rotating speed of a gluing roller.
(2) Compounding, drying, rolling and cutting
Compounding the glass cloth glued in the step (1) with mica paper with the quantitative weight of 85 g/square meter, and then drying in a drying tunnel: the temperature of the front section of the drying tunnel is controlled to be 70-80 ℃, the temperature of the middle section is controlled to be 110-120 ℃, the temperature of the tail section is controlled to be 80-90 ℃, the speed of the drying tunnel is controlled to be 1.5-2 m/min, and the high-heat-conductivity multi-glue powder mica tape is prepared after rolling and slitting.
A high-thermal-conductivity multi-rubber powder mica tape is taken, a simulation wire rod sample with the unilateral insulation thickness of 3.5mm is manufactured by adopting a hot pressing process, and the main insulation has the thermal conductivity coefficient of 0.43W/(m.K), the breakdown field strength of 32kV/mm and the electric life of 1290 hours under the field strength of 10kV/mm according to the test method specified by relevant national or industrial standards.
Example 3
The high-thermal-conductivity multi-glue powder mica tape prepared by the embodiment contains a layer of mica paper, a layer of glass cloth, a bonding agent for improving intrinsic heat conduction, BN heat-conducting powder and Al 2 O 3 The heat conducting powder comprises the following components in unit area by mass: 105g of mica paper, 20g of alkali-free glass cloth, 85g of adhesive, 31g of BN heat-conducting powder, al 2 O 3 4g of heat-conducting powder per square meter, the total mass per unit area of the heat-conducting powder per square meter is 245g per square meter, and the thickness of the mica tape is 0.17 +/-0.02 mm.
The preparation procedure of this example is as follows:
(1) Adhesive formulation
Putting 100kg of resorcinol diglycidyl ether, 30kg of 4,4' -diformic acid biphenyl and 20kg of dimethyl sulfoxide into a reaction kettle, starting stirring, raising the temperature to 105 ℃ for reaction for 4 hours, adding 10kg of resorcinol formaldehyde resin, stirring for 1 hour, stopping heating, adding 20kg of toluene and 20kg of acetone, continuously stirring, naturally cooling, discharging, filtering and barreling to obtain the adhesive with the solid content of 70%.
(2) Compounding heat conducting powder with adhesive
100kg of the binder having a solids content of 70% obtained in step (1) were addedPutting into a stirring dispersion tank, stirring, adding 25.5kg of BN heat-conducting powder with median particle size of 20 μm and 3.3kg of Al with median particle size of 5 μm 2 O 3 And stirring the heat-conducting powder for 2 hours to obtain the adhesive containing the heat-conducting powder.
(3) Glass cloth gluing
Transferring the adhesive containing the heat-conducting powder prepared in the step (2) into a glue groove of a mica tape gluing machine, which is provided with a stirring device, gluing alkali-free glass cloth with the given quantity of 20 g/square meter, and controlling the gluing quantity to meet the requirement by adjusting the solid content of the adhesive, the speed of the mica tape machine and the rotating speed of a gluing roller.
(4) Compounding, drying, rolling and cutting
Compounding the glass cloth glued in the step (3) with mica paper with the quantitative weight of 105 g/square meter, and then drying in a drying tunnel: the temperature of the front section of the drying tunnel is controlled to be 60-70 ℃, the temperature of the middle section is controlled to be 120-130 ℃, the temperature of the tail section is controlled to be 90-100 ℃, the speed of the drying tunnel is controlled to be 1.0-1.5 m/min, and the high heat conduction rich glue powder mica tape is prepared after rolling and slitting.
A high-thermal-conductivity poly-mica powder tape is taken, a simulation wire rod sample with the unilateral insulation thickness of 3.5mm is manufactured by adopting a hot-pressing process, and the main insulation has the thermal conductivity coefficient of 0.51W/(m.K), the breakdown field strength of 33kV/mm and the electric life of 1300 hours under the field strength of 10kV/mm according to the test method specified by relevant national or industrial standards.
Example 4
The high thermal conductivity multi-glue mica powder tape prepared in the embodiment contains a layer of mica paper, a layer of glass cloth, a bonding agent, BN thermal conductive powder and Al 2 O 3 The heat conducting powder comprises the following components in percentage by mass in unit area: 85g of mica paper per square meter and 40g of two layers of alkali-free glass cloth per square meter, and the adhesive for improving intrinsic heat conduction comprises 85g of adhesive per square meter, 31g of BN heat-conducting powder per square meter and Al 2 O 3 4g of heat-conducting powder per square meter, the total mass per unit area of the heat-conducting powder per square meter is 245g per square meter, and the thickness of the mica tape is 0.17 +/-0.02 mm.
The preparation procedure of this example is as follows:
(1) Glass cloth gluing
Pouring the adhesive containing the heat-conducting powder prepared in the step (2) in the embodiment 3 into glue grooves of a mica tape machine, wherein the glue grooves are respectively provided with a stirring device, gluing alkali-free glass cloth with the quantity of both being 20 g/square meter on the upper layer and the lower layer, and controlling the gluing amount to meet the requirements by adjusting the speed of the mica tape machine and the rotating speed of a gluing roller.
(2) Compounding, drying, rolling and cutting
Compounding the glass cloth glued in the step (1) with mica paper with the quantitative weight of 85 g/square meter, and then drying in a drying tunnel: the temperature of the front section of the drying tunnel is controlled to be 60-70 ℃, the temperature of the middle section is controlled to be 120-130 ℃, the temperature of the tail section is controlled to be 90-100 ℃, the speed of the drying tunnel is controlled to be 1.0-1.5 m/min, and the high-heat-conductivity multi-glue powder mica tape is prepared after rolling and slitting.
A high-thermal-conductivity poly-mica powder tape is taken, a simulation wire rod sample with the unilateral insulation thickness of 3.5mm is manufactured by adopting a hot-pressing process, and the main insulation has the thermal conductivity coefficient of 0.48W/(m.K), the breakdown field strength of 31kV/mm and the electric service life of 1260 hours under the field strength of 10kV/mm according to the test method specified by related national or industrial standards.
Comparative example 1
The comparative example is a commercially available multi-rubber powder mica tape without heat-conducting powder filling, and the model of a national standard unified product is 5440-1 (see GB/T5019.8-2009 epoxy glass cloth powder mica tape). The comparative example contains a layer of mica paper, two layers of glass cloth and an epoxy-tungma resin adhesive, wherein the mass of each component material in unit area is as follows: 85g of mica paper per square meter, 40g of two layers of alkali-free glass cloth per square meter and 75g of epoxy-tung tree resin adhesive per square meter, wherein the total mass per unit area is 200g per square meter, and the thickness of the mica tape is 0.14 +/-0.02 mm.
The multi-rubber powder mica tape of the comparative example is taken, a simulation wire rod sample with the unilateral insulation thickness of 3.5mm is manufactured by adopting a hot pressing process, and the main insulation has the thermal conductivity coefficient of 0.27W/(m.K), the breakdown field strength of 34kV/mm and the electric service life of 1350h under the field strength of 10kV/mm according to the test method specified by relevant national or industrial standards.
Comparative example 2
The comparative example is a high heat conduction multi-rubber powder mica tape filled with heat conduction powder. The comparative example contains a layer of mica paper, two layers of glass cloth, an epoxy-tungma resin adhesive and BN heat-conducting powder, wherein the mass of each component material in unit area is as follows: the mica paper powder is 65 g/square meter, the two layers of alkali-free glass cloth are 40 g/square meter, the epoxy-tung tree resin adhesive is 85 g/square meter, the BN heat-conducting powder is 60 g/square meter, the total mass of unit area is 250 g/square meter, and the thickness of the mica tape is 0.18 +/-0.02 mm.
The comparative example was prepared as follows:
(1) Adhesive formulation
35kg of bisphenol A liquid epoxy resin with the epoxy value of 0.44mol/100g is put into a reaction kettle, stirring is carried out, 15kg of bisphenol A solid epoxy resin with the epoxy value of 0.12mol/100g is put into the reaction kettle when the temperature is raised to 120 ℃, 50kg of Tung horse resin is put into the reaction kettle after stirring for 1h, and stirring is carried out for 1h at the temperature of 100 ℃. After the heating is stopped, 50kg of toluene and 50kg of acetone are added in turn, and the mixture is continuously stirred and naturally cooled. Cooling to below 40 ℃, adding 0.04kg of curing accelerator, stirring for 1h, discharging, filtering and barreling to obtain the epoxy-tungma resin adhesive with the solid content of 50 percent.
(2) Compounding heat conducting powder with adhesive
And (2) putting 100kg of the epoxy-tungma resin adhesive with the solid content of 50 percent prepared in the step (1) into a stirring and dispersing tank, starting stirring, putting 35.3kg of BN heat-conducting powder with the median particle size of 20 mu m, and stirring for 2h to obtain the epoxy-tungma resin adhesive containing the heat-conducting powder.
(3) Glass cloth gluing
Transferring the epoxy-tung-tree-horse resin adhesive containing the heat-conducting powder prepared in the step (2) into glue tanks of which the upper layer and the lower layer are both provided with stirring devices, respectively gluing alkali-free glass cloth of which the upper layer and the lower layer are both provided with a quantitative power of 20 g/square meter, and controlling the gluing amount to meet the requirements by adjusting the solid content of the adhesive, the speed of the mica tape machine and the rotating speed of a gluing roller.
(4) Compounding, drying, rolling and cutting
Compounding the two layers of glass cloth glued in the step (3) with mica paper with the quantitative rate of 65 g/square meter, and then drying in a drying tunnel: the temperature of the front section of the drying tunnel is controlled to be 60-70 ℃, the temperature of the middle section is controlled to be 110-120 ℃, the temperature of the end section is controlled to be 80-90 ℃, the speed of the drying tunnel is controlled to be 1.5-2 m/min, and the high heat conduction rich gelatine powder mica tape without improving intrinsic heat conduction of the comparative example is prepared after rolling and slitting.
The high-thermal-conductivity poly-rubber powder mica tape prepared by the comparative example is taken, a hot-pressing process is adopted to prepare a simulation wire rod sample with the unilateral insulation thickness of 3.5mm, and the main insulation has the thermal conductivity coefficient of 0.45W/(m.K), the breakdown field strength of 23kV/mm and the electric life of 700 hours under the field strength of 10kV/mm according to the test method specified by relevant national or industrial standards. The deterioration of breakdown field strength and electrical lifetime leads to the inability to apply high powder filled products, which is also the reason why the prior art fails to provide mica tapes with both high thermal conductivity and excellent electrical properties.
Comparative example 3
The comparative example is a high-heat-conductivity multi-glue powder mica tape filled with heat-conducting powder, and comprises a layer of mica paper, two layers of glass cloth, a bonding agent and BN heat-conducting powder, and the preparation method is the same as that of the comparative example 2; wherein the mass of each component material in unit area is as follows: 85g of mica paper per square meter and 40g of two layers of alkali-free glass cloth per square meter, 80g of adhesive per square meter and 30g of BN heat-conducting powder per square meter, wherein the total mass per unit area is 235g per square meter, and the thickness of the mica tape is 0.16 +/-0.02 mm; the adhesive was the epoxy-tungma resin adhesive of comparative example 2.
The high-thermal-conductivity poly-rubber powder mica tape prepared by the comparative example is taken, a hot-pressing process is adopted to prepare a simulation wire rod sample with the unilateral insulation thickness of 3.5mm, the thermal conductivity coefficient of the main insulation is measured to be 0.32W/(m.K) according to a test method specified by relevant national or industrial standards, and the improvement of the thermal conductivity is small.
The results of the performance tests on the primary insulation obtained in each of the above examples and comparative examples are summarized in table 1.
It should be understood by those skilled in the art that the above-described embodiments are merely preferred embodiments of the present invention, and not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A high-heat-conductivity multi-glue powder mica tape is characterized by being formed by compounding mica paper, alkali-free glass cloth, an adhesive and inorganic heat-conducting powder, wherein the mass of each component material in unit area is as follows: 60-130 g of mica paper per square meter, 16-45 g of alkali-free glass cloth per square meter, 50-105 g of adhesive per square meter and 20-50 g of inorganic heat-conducting powder per square meter; the raw materials for preparing the adhesive comprise liquid epoxy resin and a curing agent; the curing agent is one or more of 4,4' -dihydroxy biphenyl, 4' -diaminobiphenyl, 4' -dicarboxylic acid biphenyl, 4' -dicarboxylic acid p-terphenyl, 4' -dihydroxy p-terphenyl, resorcinol formaldehyde resin and hydroquinone formaldehyde resin.
2. The high-thermal-conductivity poly-mica powder tape as recited in claim 1, wherein the liquid epoxy resin is one or more of novolac epoxy resin, resorcinol diglycidyl ether, bisphenol a type liquid epoxy resin, and bisphenol F type liquid epoxy resin.
3. The high thermal conductivity rich rubber powder mica tape according to claim 1, wherein in the high thermal conductivity rich rubber powder mica tape, the alkali-free glass cloth is one layer or two layers; when the alkali-free glass cloth is two layers, the mica paper is positioned between the two layers of alkali-free glass cloth.
4. The high thermal conductivity multi-powder mica tape as recited in claim 1, wherein the inorganic thermal conductivity powder is BN, al 2 O 3 One or two of them; the median particle size of the inorganic heat-conducting powder is 0.1-30 mu m.
5. The high thermal conductivity poly-mica powder tape as recited in claim 1, wherein the adhesive is obtained by reacting liquid epoxy resin and curing agent in a solvent.
6. The method for preparing high thermal conductivity poly-powder mica tape according to claim 1, wherein the liquid epoxy resin and the curing agent are used as raw materials, which react in a solvent to obtain an adhesive, and then the thermal conductive powder is added to obtain the adhesive containing the thermal conductive powder; and then coating the adhesive containing the heat-conducting powder on the alkali-free glass cloth, and compounding the alkali-free glass cloth with the mica paper to obtain the high-heat-conductivity multi-glue powder mica tape.
7. The preparation method of the high thermal conductivity rich rubber powder mica tape according to claim 6, wherein the high thermal conductivity rich rubber powder mica tape comprises the following components by mass per unit area: 60-90 g of mica paper per square meter, 25-45 g of alkali-free glass cloth per square meter, 60-90 g of adhesive per square meter and 20-40 g of inorganic heat-conducting powder per square meter.
8. The use of the high thermal conductivity rich mica tapes as recited in claim 1 in the preparation of thermal conductive and insulating materials.
9. The use of the high thermal conductivity rich gelatine powder mica tape as defined in claim 1 in the preparation of main insulation of high voltage motor.
10. The application of the adhesive in preparing the high-heat-conductivity multi-glue powder mica tape as recited in claim 1, wherein the adhesive is prepared from the raw materials of liquid epoxy resin and a curing agent; the curing agent is one or more of 4,4 '-dihydroxy biphenyl, 4' -diamino biphenyl, 4 '-dicarboxylic acid p-terphenyl, 4' -dihydroxy p-terphenyl, resorcinol formaldehyde resin and hydroquinone formaldehyde resin.
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| US20040094325A1 (en) * | 2001-04-27 | 2004-05-20 | Katsuhiko Yoshida | Coil for electric rotating machine, and mica tape and mica sheet used for the coil insulation |
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| CN103400665A (en) * | 2013-08-05 | 2013-11-20 | 桂林理工大学 | Nano-enhanced rich resin mica tape with high thermal conductivity and applications thereof |
| WO2021128895A1 (en) * | 2019-12-26 | 2021-07-01 | 苏州巨峰电气绝缘系统股份有限公司 | High-thermal-conductivity insulating layer material, metal substrate, and preparation method |
| CN114664501A (en) * | 2022-03-29 | 2022-06-24 | 中国人民解放军海军工程大学 | Mica tape with high heat conductivity coefficient and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040094325A1 (en) * | 2001-04-27 | 2004-05-20 | Katsuhiko Yoshida | Coil for electric rotating machine, and mica tape and mica sheet used for the coil insulation |
| CN102693791A (en) * | 2012-05-29 | 2012-09-26 | 苏州巨峰电气绝缘系统股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
| CN103400665A (en) * | 2013-08-05 | 2013-11-20 | 桂林理工大学 | Nano-enhanced rich resin mica tape with high thermal conductivity and applications thereof |
| WO2021128895A1 (en) * | 2019-12-26 | 2021-07-01 | 苏州巨峰电气绝缘系统股份有限公司 | High-thermal-conductivity insulating layer material, metal substrate, and preparation method |
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