CN115335204A - Sensor with injection molded housing made of liquid silicone rubber - Google Patents
Sensor with injection molded housing made of liquid silicone rubber Download PDFInfo
- Publication number
- CN115335204A CN115335204A CN202180028595.XA CN202180028595A CN115335204A CN 115335204 A CN115335204 A CN 115335204A CN 202180028595 A CN202180028595 A CN 202180028595A CN 115335204 A CN115335204 A CN 115335204A
- Authority
- CN
- China
- Prior art keywords
- sensor
- housing
- sensor element
- lsr
- silicone rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 33
- 239000004944 Liquid Silicone Rubber Substances 0.000 title claims abstract description 31
- 238000002347 injection Methods 0.000 title description 8
- 239000007924 injection Substances 0.000 title description 8
- 239000000463 material Substances 0.000 claims abstract description 49
- 239000007788 liquid Substances 0.000 claims description 12
- 238000001746 injection moulding Methods 0.000 claims description 11
- 239000000945 filler Substances 0.000 description 16
- 239000011257 shell material Substances 0.000 description 14
- 238000004132 cross linking Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 238000009529 body temperature measurement Methods 0.000 description 7
- -1 polysiloxane Polymers 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011224 oxide ceramic Substances 0.000 description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
- G01K1/10—Protective devices, e.g. casings for preventing chemical attack
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Measuring Fluid Pressure (AREA)
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention relates to a sensor (1) comprising a sensor element (2), a connecting element for electrical connection, and a housing (8) applied to the sensor element. Here, the housing (8) comprises a housing material having a cured Liquid Silicone Rubber (LSR) as a main component.
Description
Technical Field
The invention relates to a sensor comprising a sensor element, a connecting element for electrical connection, and a housing for the sensor element.
Background
Prior art sensors use a housing constructed of a metal, ceramic or thermoplastic material in combination with an internal filler constructed of a hardened material such as a thermoplastic, ceramic or epoxy.
Additional internal filler is required to adapt the shape of the housing to the shape of the sensor element and to allow close mechanical and thermal contact between the sensor element and the housing. Ceramic and metal housings are difficult to miniaturize due to their relatively large wall thickness and the additional filler material required.
Furthermore, a stiff can casing generally provides good mechanical protection, but limits the mechanical and thermal contact between the sensor element and the medium to be measured.
DE 69323126 T2 discloses another technique using a shrink tube as the housing of the sensor element. The element has a silicone elastomer coating and is covered by a thin, heat-shrinkable outer tube.
However, such housings have several disadvantages, because the size and shape of the shrink tube is difficult to control and the adhesion between the shrink tube and the connected electrical leads is low.
Another prior art document discloses the use of flexible sensors, wherein the sensor elements are applied, for example, on a polyimide foil. On the other hand, such sensors are difficult to protect against mechanical shocks.
Disclosure of Invention
In view of the drawbacks of the prior art, it is an object of the present invention to disclose an improved housing for a sensor element, which can be applied easily.
This object is achieved by a sensor as claimed in claim 1.
The sensor comprises a sensor element, a connecting element for electrical connection and a housing applied to the sensor element. Here, the case includes a case material having a cured Liquid Silicone Rubber (LSR) as a main component.
In one embodiment, the sensor element has a cylindrical shape. The sensor element may have a diameter of ≦ 2.4 mm.
The sensor may be a sensor for temperature measurement. The sensor element may have any geometry. The connecting element is mechanically and electrically connected to the sensor element.
The housing closely covers the entire sensor element. It is made of an elastic shell material. In addition to the main component Liquid Silicone Rubber (LSR), the housing material may also comprise several filling materials or additives.
LSR has advantageous properties as a housing material. Due to its high flowability and low viscosity, the housing material can be easily formed during its application on the outside of the sensor element. This enables miniaturization and free design change of the housing. Furthermore, the wall thickness can be minimized. The small wall thickness shortens the response time of the sensor.
Due to the low injection pressure and the lack of shrinkage behavior during this process, the application of LSR on the sensor element is more favourable than the application of thermoplastic materials used in prior art sensors. Therefore, LSRs can even be applied to vulnerable mechanical structures.
The low compression set of the LSR housing, which is typically 5-25%, and the high elongation before breaking, which is higher than 100%, allow a soft and smooth application. Thus, the outer surface of the LSR housing is easy to adapt to the surface to be measured and good thermal contact can be achieved.
Due to the high heat resistance of LSR, the sensor is suitable for applications in harsh operating conditions and is designed for temperature measurement in an extended measurement range of-40 ℃ to 250 ℃.
Oxide ceramics may be used as the filler material. The oxide ceramic may contain an oxide of silicon or aluminum, such as silica, montmorillonite or Al 2 O 3 . In addition, the filler material may include nitrides, such as AlN and BN. In addition to this, carbides such as SiC may also be used. By means of the filling material, the properties of the housing can be improved or changed. Examples of properties that can be changed by the filler material are the tensile strength, hardness, dielectric strength, thermal conductivity and thermal expansion of the housing material.
Since LSR is the main component, the proportion of filler material in the shell material is less than 50 wt.%. The particle diameter of the filler material is preferably between 10 nm and 20 μm.
In one embodiment, the sensor element comprises a temperature sensitive member.
The temperature sensitive member may include a thermistor material for detecting temperature.
Since the electrical conductivity of the thermistor material depends on the temperature, this material can be used for a temperature sensor. The thermistor material may have a Negative Temperature Coefficient (NTC). In another embodiment, the thermistor material can have a Positive Temperature Coefficient (PTC).
In one embodiment, the sensor element comprises a lead wire connected to the temperature sensitive member. The leads enable the sensor elements to form an electrical connection.
In one embodiment, a pair of leads are connected to the temperature sensitive member.
In one embodiment, the connecting element comprises an electrical lead.
In one embodiment, the wire is a single wire. In another embodiment, the wire is a multi-stranded wire. In a preferred embodiment, two electrical leads are connected to the sensor element.
In one embodiment, the electrical leads are insulated with an insulating material (i.e., silicone). The wire may be a single wire or a plurality of stranded wires.
In a preferred embodiment, two electrical leads are connected to the leads of the sensor element. The connection between the electrical leads and the leads of the sensor element can be realized by crimping the electrical leads or by soldering.
The sensor element may comprise two portions having different cross-sections. One cross-section is larger than the other. In one embodiment, the electrical leads are fixed to the side of that part having the larger cross section.
The housing may be tightly applied to a portion of the connecting element. The covered portion may be positioned adjacent to the sensor element. In another embodiment, a portion of the connecting element not adjacent to the sensor element is covered.
It is necessary to protect the sensor, including the sensor element and the connection element, from the chemical influence of the medium to be measured with a tight, impermeable housing. An example of a need for an impermeable housing is a sensor for measuring the temperature of a chemical such as Automatic Transmission Fluid (ATF) or antifreeze chemical.
At the other end of the wire, an electrical plug may be provided to connect the sensor element to the circuit.
In another embodiment, the connecting element comprises a lead frame.
The housing may be applied to at least a portion of the lead frame. The covered portion may be adjacent to the sensor element.
In one embodiment, the housing material has a thermal conductivity of 0.2-0.3W/(mK) at 100 ℃.
Depending on the application, the thermal conductivity can be adjusted by adding filler materials. The high thermal conductivity of the housing can be achieved by a filler material having a high thermal conductivity, such as Al 2 O 3 And h-BN. This ensures a short response time of the sensor.
In one embodiment, the housing material has 2xl0 -4 -4xl0 -4 K -1 The coefficient of thermal expansion of (a).
The low coefficient of thermal expansion ensures smooth operation of the sensor over a wide temperature range. The coefficient of thermal expansion can be adapted to the requirements of the application by means of a filler material.
In one embodiment, the shell material has a Shore A hardness of 10-90.
The hardness can be adapted to the requirements of the application by means of the filler material. Thus, the housing provides good protection against environmental mechanical shocks.
In one embodiment, the housing material has a dielectric strength of 20 kV/mm or more.
The housing thus provides protection against environmental electrical shocks and covers the sensor element as an electrically insulating housing.
In one embodiment, the housing protecting the sensor element has a wall thickness greater than or equal to 0.2 mm. In a preferred embodiment, the housing has a wall thickness of between 0.3 mm and 0.2 mm. In a more preferred embodiment, the housing has a wall thickness of between 0.21 mm and 0.20 mm.
Due to its advantageous properties, such as high flow and low viscosity, the LSR can be tightly applied onto the outer surface of the sensor element to form a housing with a low wall thickness tightly surrounding the sensor element. The close application and low wall thickness of the housing shortens the response time of the sensor.
In one embodiment, the connecting element is covered by a housing.
In this embodiment, the housing is applied to both the sensor element and the connection element. There is no gap in the housing between the sensor element and the connecting element. At least such a tight, impermeable seal is required if the sensor is used to measure the temperature of a chemically aggressive medium. The shell should be at least impermeable to liquids and chemically aggressive vapors and gases.
In one embodiment, the housing is applied by injection molding.
When applied by injection molding, the housing may be applied to the sensor element in one step. During injection, the inner surface of the housing material smoothly adapts to the shape of the sensor element. The outer shape of the housing is formed by a mold.
In one embodiment, the housing is applied by liquid injection molding.
In a liquid injection molding process for LSR, two viscous liquid educt components a and B are provided, which contain polymers of different chain lengths.
Component B may include a first isolated polymer and a crosslinking agent. Here, the crosslinking agent stimulates a crosslinking reaction between the supplied educts. By crosslinking, the polymer is isolated to form a three-dimensional network.
Component a may comprise a second isolated polymer and a catalyst. The catalyst may comprise a noble metal. For example, the catalyst is a platinum catalyst.
The first and second educt polymers may comprise the same type of molecule or different types of molecules. The release polymer comprises a polysiloxane.
In one embodiment, components a and B may comprise the same type of polysiloxane with organic substituents. The organic substituents may include one or more of methyl, vinyl, phenyl, or similar organic substituents.
Here, a crosslinking agent is required to stimulate a crosslinking reaction between the supplied educt polymers in order to convert the raw rubber into a cured silicone rubber. By crosslinking, the polymers form a three-dimensional network.
The catalyst accelerates the crosslinking reaction. Noble metal catalysts, particularly platinum catalysts, exhibit high performance in accelerating the crosslinking reaction.
Prior to injection, the two components are mixed into a reaction mixture and cooled to delay the crosslinking reaction.
To cure the mixed components, the crosslinking reaction is triggered by heating during or after injection. Alternatively, the crosslinking reaction is initiated by exposure to UV radiation. Which alternative is chosen depends on the nature of the educt materials used. After solidification, the shell material is infusible.
The liquid injection molding process is preferred because of the use of liquid educts. For injecting the liquid educt, a relatively low injection pressure is required. Thus, more susceptible sensor elements having more susceptible structures on their outer surfaces can be covered in this way without the risk of damaging the sensor during injection molding.
In a preferred embodiment, an educt component having a low viscosity is selected. The lower the viscosity, the lower the pressure required for injection.
The viscosity of the reaction mixture is between 50000 and 500000 mPas, depending on the type of LSR used. The reaction mixture may have thixotropic properties. Thus, during the injection molding process, the viscosity may decrease.
Drawings
Other exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, the present invention is not limited to these examples. In the drawings, similar elements, elements of the same type and elements with the same function may be provided with the same reference numerals.
FIG. 1 shows a first embodiment of a sensor having a cuboid housing and a connecting element;
fig. 2 shows a cross-sectional view of a first embodiment, in which the leads of the sensor element are soldered to the wires of the connection element;
fig. 3 shows the first embodiment in another perspective view;
FIG. 4 shows a second embodiment of a sensor having a two-part cylindrical housing and a connecting element;
fig. 5 shows a sectional view of a second exemplary embodiment, in which the leads of the sensor element are crimped with the wires of the connecting element.
Detailed Description
The sensor 1 in fig. 1 to 3 comprises a sensor element 2, the sensor element 2 comprising a temperature sensitive member 21 and a pair of leads 22. The pair of leads 22 for electrical connection is disposed between the temperature sensitive member 21 and the connection element.
The entire sensor element 2 is covered by a single-part, tight and impermeable housing 8, completely enclosing the sensor element 2. In the present embodiment, the housing 8 has a rectangular parallelepiped shape. The shape and configuration of the housing 8 may vary depending on the application of the sensor.
The temperature sensitive member 21 is arranged at a first end of the sensor element 2 within the housing 8, the first end being denoted as the sensor head 3.
The temperature sensitive member 21 is composed of a thermistor material. In a first embodiment, the thermistor material has a negative thermal coefficient. In another embodiment, the thermistor material can have a positive thermal coefficient.
The leads 22 are constructed of a conductive material, such as nickel, copper, silver, similar conductive metals, or one of their alloys. The lead wire 22 is fixed to the temperature sensitive member 21 at a side opposite to the sensor head 3. The leads 22 point away from the sensor head 3.
The sensor element of the first embodiment has a cylindrical shape and a diameter of ≦ 2.4 mm.
The sensor 1 of the first embodiment is used for temperature measurement. Possible applications are for example temperature measurement of chemical fluids or solid surfaces. The sensor 1 is designed for temperature measurement in an extended measurement range of-40 ℃ to 250 ℃.
Thus, the sensor head 3 on the first end of the sensor housing 8 is in contact with the surface to be measured.
The heat of the medium 4 is quickly conducted to the temperature sensitive member through the thin housing 8 at the sensor head 3.
At the second end 5 of the sensor housing 8, two insulated wires 6 are fixed to the leads of the sensor element 2 as electrical connection elements. The wire 6 is fixed to the lead by solder 62. The portion of the wire 6 in contact with the lead 22 is not insulated. The insulation of the remaining wires is made of silicone material.
In the present embodiment, the second end 5 is the side of the housing 8 that is at the greatest distance from the sensor head 3.
Only a portion of the insulated conductor 6 is shown in the figure. The other parts of the insulated conductor 6 are not shown in this figure. A plug may be fixed at the end of the insulated conductor 6, not shown in this figure, to connect the insulated conductor 6 with an electric circuit.
In the embodiment shown, the portion 7 of the insulated conductor 6 adjacent to the sensor element 2, the solder connection 62 and the sensor element 2 is covered by the housing 8.
The housing 8 comprises as a main component Liquid Silicone Rubber (LSR). The housing is applied to the sensor by injection molding. The molded housing 8 consists of only one layer, the inner surface of which smoothly and tightly conforms to the shape of the sensor element 2. Thus, the housing 8 is tightly fitted with the sensor element 2. The outer surface of the shell is formed by a mold.
The shell material may include additional components. LSR is the main component, the proportion of LSR in the material of the shell being at least 50 wt%. In addition, the shell material includes an additive and a filler material. Possible filler materials are oxide ceramics, which contain oxides of silicon and/or aluminum. In addition, nitrides such as AlN and BN or carbides such as SiC may be used as the filler material.
Such filler materials can affect several properties of the shell material, such as its tensile strength, hardness, dielectric strength, thermal elongation, and thermal conductivity.
Furthermore, colorants may be added to color the transparent LSR material.
However, the housing material consists of one single homogeneous layer, in which the added reagent is homogeneously dispersed in the LSR phase.
The housing material of the first embodiment is applied to the sensor 1 by liquid injection moulding. Due to the low viscosity of the liquid educt, a low housing wall thickness of 0.2 mm or more at the sensor head 3 can be achieved. The low shell wall thickness shortens the response time of the sensor.
Furthermore, the housing material has strong hydrophobic properties and thus provides good water and moisture protection for the electrical components.
The possible elongation before the selected shell material breaks is more than 100%. Elongation is defined as the possible elastic deformation of a component relative to its original length. Due to its compactness and elasticity, the housing provides strong mechanical protection, especially with regard to shock absorption.
Furthermore, LSR shows a high chemical resistance. It is therefore suitable for protecting the sensor during temperature measurement in aggressive chemical media.
The viscosity of the uncured LSR depends on the respective application and ranges between 50000 and 500000 mPas. During the molding process, the viscosity decreases due to the shear thinning behavior of the LSR material.
An uncured LSR is a mixture of liquid components including component a and component B. Component a includes a polysiloxane having organic substituents and a platinum catalyst. Component B also includes a polysiloxane having organic substituents and a crosslinker.
Components a and B may comprise the same type of polysiloxane having the same organic group, or different types of polysiloxane having different organic groups. The organic substituent may be a methyl group, a vinyl group, a phenyl group or the like.
The crosslinking reaction of the polysiloxane is triggered by exposure to UV radiation or heating. The crosslinking reaction converts the liquid mixture into a solid shell material.
The cured LSR had the following properties: the thermal conductivity of LSR without additives is typically between 0.2 and 0.5W/(mk) at 100 ℃. System of thermal expansionThe number is about 2xl0 -4 -4xl0 -4 K. The compression set is usually 5 to 25%. The Shore A hardness is usually 10 to 90. The dielectric strength according to DIN IEC 243-2 is 20 kV/mm or more.
Fig. 3 shows a first embodiment of the sensor 1 from a different angle. The elements already described above are not described again.
In the first embodiment, the insulated wires 6 are each constituted by a single wire. In another embodiment, the wire 6 is a stranded wire.
In another embodiment, the sensor element may be contacted by more than two insulated wires.
In yet another embodiment, the sensor comprises two or more sensor elements covered by the same or several housings.
Fig. 4 and 5 show a second embodiment of the sensor 1. Basically, the second embodiment is similar to the first embodiment of the sensor 1.
In contrast to the first exemplary embodiment, the sensor housing 8 is here shaped as a two-part cylinder. The portion 9 of the cylinder at the second end side 5 has a larger diameter than the portion 10 at the first end side 3.
Thus, the portion 9 at the second end side 5 can accommodate the crimp connection 62 between the wire 6 and the lead 22. A portion of the wire 6 in contact with the lead is not insulated. The lead is arranged at the second end side 5 of the temperature sensitive member 21 and is directed away from the head 3 of the sensor.
The sensor element 2, the crimp connection 62, and a portion 7 of the wire 6 are covered by the housing 8.
The fluid medium 4 to be measured is in contact with at least the thinner portion 10 of the sensor housing 8 including the sensor head 3. The thin wall thickness at the thinner portion 10 of the housing 8 allows for a short response time for temperature measurement. In another embodiment the entire housing 8 and the insulated conductor wire 6 are in contact with the medium 4 to be measured.
In the fourth embodiment, not shown in the drawings, the connecting element for electrical connection is a lead frame instead of a wire.
List of reference marks
1. Sensor with a sensor element
2. Sensor element
21. Temperature sensitive component
22. Lead wire
3. First end of sensor element 2
4. Medium to be measured
5. Second end of sensor element 2
6. Conducting wire
62. Connection part of lead wire and wire
7. Covered portion of insulated electrical conductor 6
8. Shell body
9. A majority of the sensor housing 8
10. A small part of the sensor housing 8
Claims (12)
1. Sensor (1), the sensor (1) comprising a sensor element (2), a connection element for electrical connection and a housing (8) applied to the sensor element, wherein the housing (8) comprises a housing material having a cured Liquid Silicone Rubber (LSR) as a main component.
2. The sensor (1) according to claim 1, wherein the sensor element (2) comprises a temperature sensitive member.
3. A sensor (1) as claimed in claim 2, wherein the temperature sensitive member comprises a thermistor material.
4. The sensor (1) according to one of claims 1 or 3, wherein the connecting element comprises an electrical lead (6).
5. The sensor (1) according to one of claims 1 or 3, wherein the connecting element comprises a lead frame.
6. The sensor (1) according to one of claims 1 to 5, wherein the housing material has a thermal conductivity of 0.2-0.3W/(mK) at 100 ℃.
7. The sensor (1) according to one of claims 1 to 6, wherein the housing material has 2xl0 -4 -4xl0 -4 K coefficient of thermal expansion.
8. The sensor (1) according to one of claims 1 to 7, wherein the housing material has a Shore A hardness of 10-90.
9. The sensor (1) of one of claims 1 to 8, wherein the housing material has a dielectric strength of 20 kV/mm or more.
10. Sensor (1) according to one of claims 1 to 9, wherein the housing (8) is applied to a portion of the connecting element.
11. The sensor (1) according to one of claims 1 to 10, wherein the housing (8) is applied by injection molding.
12. A sensor (1) according to claim 11, wherein the housing (8) is applied by liquid injection moulding.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020110438.3 | 2020-04-16 | ||
DE102020110438.3A DE102020110438A1 (en) | 2020-04-16 | 2020-04-16 | Sensor with housing |
PCT/EP2021/059961 WO2021209619A1 (en) | 2020-04-16 | 2021-04-16 | Sensor having an injection moulded housing made from liquid silicone rubber |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115335204A true CN115335204A (en) | 2022-11-11 |
Family
ID=75625551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180028595.XA Pending CN115335204A (en) | 2020-04-16 | 2021-04-16 | Sensor with injection molded housing made of liquid silicone rubber |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230121789A1 (en) |
EP (1) | EP4135961A1 (en) |
JP (1) | JP2023522668A (en) |
CN (1) | CN115335204A (en) |
DE (1) | DE102020110438A1 (en) |
WO (1) | WO2021209619A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220052463A1 (en) * | 2018-10-15 | 2022-02-17 | Beijing Const Instrument Technology Inc. | Crimp Terminal, Crimp Terminal Module, Terminal Box and Tester |
CN115307766A (en) | 2021-05-08 | 2022-11-08 | 热敏碟公司 | Temperature sensor probe |
DE102023103620A1 (en) | 2023-02-15 | 2024-08-22 | Pepperl+Fuchs Se | Protection device for sensors |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55134325A (en) * | 1979-04-06 | 1980-10-20 | Ishizuka Denshi Kk | Temperature sensor |
JPS59176941U (en) * | 1983-05-13 | 1984-11-27 | ティーディーケイ株式会社 | heat sensitive element |
US5367282A (en) * | 1992-07-21 | 1994-11-22 | Texas Instruments Incorporated | Electric motor protector sensor |
DE20208698U1 (en) * | 2002-06-05 | 2002-09-19 | Clauß, Ulrich, Dr.-Ing., 08297 Zwönitz | Temperature contact sensor |
NL1021766C1 (en) * | 2002-10-29 | 2002-11-25 | Stericom Mfg Co Ltd | Probe, comprises electrically insulating silicone body and electrically conducting silicone electrodes |
US20030235272A1 (en) * | 2002-06-05 | 2003-12-25 | Michael Appleby | Devices, methods, and systems involving castings |
CN110585532A (en) * | 2019-10-12 | 2019-12-20 | 东莞市裕天硅橡胶科技有限公司 | Silicone rubber transfusion heating insulation pipe and manufacturing method thereof |
JP3225297U (en) * | 2019-05-03 | 2020-02-27 | エルケム・シリコーンズ・ユーエスエイ・コーポレーションElkem Silicones Usa Corp. | Device assembly useful for producing molded silicone rubber products by injection molding from liquid silicone rubber compositions |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49140631U (en) * | 1973-04-02 | 1974-12-04 | ||
JPS59191629U (en) * | 1983-06-07 | 1984-12-19 | 石塚電子株式会社 | temperature detector |
JPS6057104U (en) * | 1983-09-27 | 1985-04-20 | ティーディーケイ株式会社 | Positive characteristic thermistor device |
JPS62255837A (en) * | 1986-04-30 | 1987-11-07 | Yamatake Honeywell Co Ltd | Production of temperature sensor for water |
JPH04115034U (en) * | 1991-03-25 | 1992-10-12 | 日本ペイント株式会社 | Support device for contact type measuring instruments |
JP2505866Y2 (en) * | 1993-01-26 | 1996-08-07 | 株式会社クラベ | Temperature detector for photoconductor drum |
JP2965122B2 (en) * | 1994-06-03 | 1999-10-18 | 矢崎総業株式会社 | Mounting structure of polymer PTC element and method of mounting polymer PTC element |
JPH08149672A (en) * | 1994-11-25 | 1996-06-07 | Hitachi Cable Ltd | Terminal joint of insulated wire |
JPH1038705A (en) * | 1996-07-26 | 1998-02-13 | Nissei Denki Kk | Water, temperature sensor |
JP2000340403A (en) * | 1999-05-26 | 2000-12-08 | Murata Mfg Co Ltd | Thermal sensor and manufacture therefor |
KR101008310B1 (en) | 2010-07-30 | 2011-01-13 | 김선기 | Ceramic chip assembly |
US20120157934A1 (en) * | 2010-12-15 | 2012-06-21 | Grace Chuang Liao | Infusion Sleeve with Multiple Material Layers |
JP6278957B2 (en) * | 2012-05-14 | 2018-02-14 | 深▲セン▼市敏▲傑▼▲電▼子科技有限公司 | Temperature sensor for surface temperature measurement |
US10052441B2 (en) * | 2016-08-02 | 2018-08-21 | Becton, Dickinson And Company | System and method for measuring delivered dose |
CN206804182U (en) | 2017-06-16 | 2017-12-26 | 苏州班奈特电子有限公司 | NTC thermistor formula temperature sensor |
WO2019159221A1 (en) * | 2018-02-13 | 2019-08-22 | 株式会社芝浦電子 | Temperature sensor, sensor element, and method for manufacturing temperature sensor |
CN112512615A (en) * | 2018-05-09 | 2021-03-16 | 斐雪派克医疗保健有限公司 | Medical component having thermoplastic molded article bonded to substrate |
-
2020
- 2020-04-16 DE DE102020110438.3A patent/DE102020110438A1/en active Pending
-
2021
- 2021-04-16 WO PCT/EP2021/059961 patent/WO2021209619A1/en unknown
- 2021-04-16 US US17/905,613 patent/US20230121789A1/en active Pending
- 2021-04-16 EP EP21720418.9A patent/EP4135961A1/en active Pending
- 2021-04-16 JP JP2022562897A patent/JP2023522668A/en active Pending
- 2021-04-16 CN CN202180028595.XA patent/CN115335204A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55134325A (en) * | 1979-04-06 | 1980-10-20 | Ishizuka Denshi Kk | Temperature sensor |
JPS59176941U (en) * | 1983-05-13 | 1984-11-27 | ティーディーケイ株式会社 | heat sensitive element |
US5367282A (en) * | 1992-07-21 | 1994-11-22 | Texas Instruments Incorporated | Electric motor protector sensor |
DE20208698U1 (en) * | 2002-06-05 | 2002-09-19 | Clauß, Ulrich, Dr.-Ing., 08297 Zwönitz | Temperature contact sensor |
US20030235272A1 (en) * | 2002-06-05 | 2003-12-25 | Michael Appleby | Devices, methods, and systems involving castings |
NL1021766C1 (en) * | 2002-10-29 | 2002-11-25 | Stericom Mfg Co Ltd | Probe, comprises electrically insulating silicone body and electrically conducting silicone electrodes |
JP3225297U (en) * | 2019-05-03 | 2020-02-27 | エルケム・シリコーンズ・ユーエスエイ・コーポレーションElkem Silicones Usa Corp. | Device assembly useful for producing molded silicone rubber products by injection molding from liquid silicone rubber compositions |
CN110585532A (en) * | 2019-10-12 | 2019-12-20 | 东莞市裕天硅橡胶科技有限公司 | Silicone rubber transfusion heating insulation pipe and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
EP4135961A1 (en) | 2023-02-22 |
WO2021209619A1 (en) | 2021-10-21 |
JP2023522668A (en) | 2023-05-31 |
US20230121789A1 (en) | 2023-04-20 |
DE102020110438A1 (en) | 2021-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN115335204A (en) | Sensor with injection molded housing made of liquid silicone rubber | |
US7824101B2 (en) | Sensor arrangement | |
JP3889441B2 (en) | Elastic recoverable silicone fitting cover | |
CN109073480B (en) | Temperature sensor, sensor element, and method for manufacturing temperature sensor | |
KR100530434B1 (en) | Device for detecting the pressure and temperature in the induction pipe of an internal combustion engine and method for the production of said device | |
JP4903898B2 (en) | Sensor adapter circuit housing assembly and method for manufacturing the same | |
JP2005005042A (en) | Cable with waterproofing plug, connector cable with waterproofing plug, manufacturing method of cable with waterproofing plug, and terminal fitting connecting structure | |
JP5484456B2 (en) | Electrode part of medium pressure or high pressure switchgear assembly and method of manufacturing electrode part | |
US6380840B1 (en) | Temperature sensor with measuring resistor | |
JP2008157950A (en) | Exhaust gas sensor and method of manufacturing the same | |
JP6992442B2 (en) | Temperature sensor | |
CN104204745A (en) | Temperature sensor | |
US6034421A (en) | Semiconductor device including molded IC fixed to casing | |
CN109029753B (en) | Temperature sensor and battery pack | |
JP5141791B2 (en) | Temperature sensor | |
US20060103393A1 (en) | Sensor device for determining a fluid property | |
US20110019714A1 (en) | Overmolded temperature sensor and method for fabricating a temperature sensor | |
KR20210113997A (en) | sealed electrical plug | |
CN111615622A (en) | Temperature sensor, temperature sensor element, and method for manufacturing temperature sensor | |
CN111247407A (en) | Temperature sensor and method for manufacturing same | |
CN108885928B (en) | Resistor with a resistor element | |
CN113167659A (en) | Temperature sensor | |
JPS632455B2 (en) | ||
JPH08219904A (en) | Thermistor type surface temperature sensor | |
CN111373126B (en) | Heating device, method for producing a heating device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |