CN115334777A - Method for manufacturing ceramic mixed-pressure positive-concave etching plate - Google Patents
Method for manufacturing ceramic mixed-pressure positive-concave etching plate Download PDFInfo
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- CN115334777A CN115334777A CN202211113219.3A CN202211113219A CN115334777A CN 115334777 A CN115334777 A CN 115334777A CN 202211113219 A CN202211113219 A CN 202211113219A CN 115334777 A CN115334777 A CN 115334777A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A method for manufacturing a ceramic hybrid-compression positive-concave etching board comprises the following steps of providing a ceramic copper-clad board and a high-speed epoxy resin copper-clad foil board, sequentially drilling the ceramic copper-clad board, chemically depositing copper, pulse plating, an inner layer circuit, pattern plating and etching, sequentially performing inner layer circuit and inner layer etching treatment on the high-speed epoxy resin copper-clad foil board, pressing the ceramic copper-clad board and the high-speed epoxy resin copper-clad foil board together to form a hybrid board, drilling a hole on the hybrid board after optical detection is completed, sequentially putting the hybrid board after drilling into a plasma cleaner and performing glass fiber etching treatment, sequentially performing chemical deposition copper, pulse plating, an outer layer circuit, pattern plating and etching treatment on the hybrid board after glass fiber etching, and coating a protective film on the surface of the outer layer board after optical detection. The method for manufacturing the ceramic mixed-compression positive pitting plate realizes the pressing between the ceramic copper clad plate and the high-speed epoxy resin copper clad plate, has high reliability, can carry out high-density assembly and has long service life.
Description
Technical Field
The invention belongs to the technical field of PCB (printed circuit board) manufacturing, and particularly relates to a method for manufacturing a ceramic mixed-pressure positive-concave etching plate.
Background
The positive pitting is to press and drill the multilayer core board, etch the epoxy resin and glass fiber yarn on the hole wall to a certain depth after drilling, so that the inner layer circuit copper layer is completely exposed, and then metallize the hole wall, so that the inner layer circuit copper layer and the hole wall copper plating layer form three-dimensional connection to meet the requirement of high-reliability electrical connection of the printed circuit boards. With the rapid advance of aerospace and military technologies, designers have higher and higher requirements on product performance and reliability. At present, aerospace and military products are often used in severe environments such as extreme heat, extreme cold, high pressure and the like, electronic components must meet the requirement of reliability, and a positive pitting process forms a mainstream research and development project.
For example, a manufacturing method of a front-concave etched PCB, which is disclosed in chinese patent No. CN201811502710.9, is to drill an auxiliary hole on a production board and metalize the auxiliary hole to serve as a conductive layer during electroplating, then drill a connection hole, and radially thicken an inner layer circuit copper layer in the connection hole by electroplating to expose and protrude out of the hole wall, so that a three-dimensional connection is formed between the hole wall copper layer plated at a later stage and the protruding inner layer circuit copper layer. At present, in order to improve the reliability and the service life of a PCB, the PCB is formed by laminating a ceramic copper-clad plate and a high-speed epoxy resin copper-clad plate, but the manufacturing method of the positive pitting corrosion PCB cannot be suitable for connection between the ceramic copper-clad plate and the high-speed epoxy resin copper-clad plate.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a ceramic mixed-pressure positive-pitting plate, so as to meet industrial requirements.
A method for manufacturing a ceramic mixed-pressure positive pitting plate comprises the following steps:
step S100: providing a ceramic copper-clad plate and at least one high-speed epoxy resin copper-clad plate, wherein the ceramic copper-clad plate comprises a ceramic layer and two first copper layers respectively arranged on two sides of the ceramic layer, and the high-speed epoxy resin copper-clad plate comprises an epoxy resin layer and two second copper layers respectively arranged on two sides of the epoxy resin layer;
step S110: sequentially carrying out drilling, chemical copper deposition, pulse electroplating, inner layer circuit, pattern electroplating and etching treatment on the ceramic copper-clad plate, and carrying out optical detection on the etched ceramic copper-clad plate;
step S120: sequentially carrying out inner layer circuit and inner layer etching treatment on the high-speed epoxy resin copper-clad laminate, and carrying out optical detection on the etched high-speed epoxy resin copper-clad laminate;
step S130: pressing the ceramic copper-clad plate and the high-speed epoxy resin copper-clad plate together to form a mixed pressing plate, and carrying out optical detection on the mixed pressing plate;
step S140: drilling holes on the mixed pressing plate after the optical detection is finished, and sequentially putting the mixed pressing plate after the optical detection is finished into a plasma cleaner and performing glass fiber etching treatment;
step S150: carrying out chemical copper deposition, pulse electroplating, outer layer circuit, pattern electroplating and etching treatment on the mixed pressing plate subjected to glass fiber etching in sequence, and carrying out optical detection on the mixed pressing plate;
step S160: and solder resist, coating a protective film on the surface of the outer plate after optical detection.
Further, the method for manufacturing the ceramic mixed-pressure positive-concavity etching plate further comprises step S170: and detecting the mixed pressing plate with the solder resist completed.
Further, the expansion and contraction of the ceramic copper clad laminate and the high-speed epoxy resin copper clad laminate are respectively measured after the step S110 and the step S140 are completed.
Further, in step S130, the ceramic copper clad laminate and the high-speed epoxy resin copper clad laminate are bonded through a PP layer.
Further, in step S150, the etching of the glass fiber is performed by using a mixed solution of ammonium bifluoride and sulfuric acid.
Further, in step S140, the plasma cleaning machine ionizes the mixed gas of oxygen, nitrogen and carbon tetrafluoride with high voltage to form plasma gas, and then bombards the hole wall of the mixing plate with the plasma gas to clean and modify the plate hole wall and ash the photoresist.
Compared with the prior art, the method for manufacturing the ceramic mixed-pressing positive-concave etching plate provided by the invention has the advantages that the mixed-pressing plate formed by the ceramic copper-clad plate and the high-speed epoxy resin copper-clad plate is sequentially subjected to the ion cleaning machine and the glass fiber etching treatment, so that the quality of the mixed-pressing plate is improved. The method for manufacturing the ceramic mixed-pressure positive-concave etching plate comprises the steps of sequentially drilling a ceramic copper-clad plate, chemically depositing copper, performing pulse electroplating, performing inner-layer circuit, performing pattern electroplating and etching, and performing optical detection on the etched ceramic copper-clad plate. And sequentially carrying out inner layer circuit and etching treatment on the high-speed epoxy resin copper-clad laminate, and carrying out optical detection on the etched high-speed epoxy resin copper-clad laminate. And pressing the ceramic copper-clad plate and the high-speed epoxy resin copper-clad plate together to form a mixed pressing plate, and carrying out optical detection on the mixed pressing plate. And drilling holes on the mixed pressing plate after the optical detection is finished, sequentially placing the mixed pressing plate after the optical detection is finished into a plasma cleaner and performing glass fiber etching treatment, sequentially performing chemical copper deposition, pulse electroplating, outer layer circuit, pattern electroplating and etching treatment on the mixed pressing plate after the glass fiber etching is finished, and performing optical detection on the mixed pressing plate. The plasma cleaning machine and the treatment are used for eroding the hole wall resin of the mixed pressing plate by a certain depth to enable the inner layer copper to be protruded, after the resin is removed, the resin passes through the glass fiber of the hole wall and needs to be eroded by the glass fiber etching treatment, so that the roughness of the hole wall meets the requirement, and in the process of chemical copper deposition, three-dimensional links are formed between all copper layers in the hole in the mixed pressing plate, so that the reliability performance is enhanced. The method for manufacturing the ceramic mixed-compression positive pitting plate realizes the pressing between the ceramic copper clad plate and the high-speed epoxy resin copper clad plate, has high reliability, can carry out high-density assembly and has long service life.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a ceramic mixed-pressure positive-concave etching plate according to the present invention.
Fig. 2 is a schematic cross-sectional structure diagram of a hybrid board in the method for manufacturing a ceramic hybrid positive-cavitation plate according to the present invention.
Detailed Description
Specific examples of the present invention will be described in further detail below. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Fig. 1 to fig. 2 are schematic flow charts of the method for manufacturing a ceramic mixed-pressure positive-concave etching plate according to the present invention.
The method for manufacturing the ceramic mixed pressure positive-pitting plate comprises the following steps:
step S100: providing a ceramic copper clad laminate 10 and at least one high-speed epoxy resin copper clad laminate 20, wherein the ceramic copper clad laminate 10 comprises a ceramic layer 11 and two first copper layers 12 respectively arranged on two sides of the ceramic layer 11, and the high-speed epoxy resin copper clad laminate 20 comprises an epoxy resin layer 21 and two second copper layers 22 respectively arranged on two sides of the epoxy resin layer 21;
step S110: sequentially carrying out drilling, chemical copper deposition, pulse electroplating, inner layer circuit, pattern electroplating and etching treatment on the ceramic copper-clad plate 10, and carrying out optical detection on the etched ceramic copper-clad plate 10, wherein the drilling is to process a hole on the ceramic copper-clad plate 10 by using a drill bit;
step S120: sequentially carrying out inner layer circuit and etching treatment on the high-speed epoxy resin copper-clad laminate 20, and carrying out optical detection on the etched high-speed epoxy resin copper-clad laminate 20, wherein the etching is to corrode the copper surface of the outer laminate and reserve the copper surface covered by the outer layer circuit protection layer to form an inner layer circuit;
step S130: pressing the ceramic copper-clad plate 10 and the high-speed epoxy resin copper-clad plate 20 together to form a mixed pressing plate, and carrying out optical detection on the mixed pressing plate;
step S140: drilling holes in the mixed pressing plate, and sequentially putting the mixed pressing plate subjected to hole turning into a plasma cleaning machine and performing glass fiber etching treatment;
step S150: carrying out chemical copper deposition, pulse electroplating, outer-layer circuit, pattern electroplating and etching treatment on the mixed pressing plate after glass fiber etching is finished in sequence, and carrying out optical detection on the mixed pressing plate, wherein the chemical copper deposition is to deposit a layer of copper among copper layers in holes of the mixed pressing plate, the pulse electroplating is carried out, an outer-layer circuit protective layer is manufactured on the outer layer of the mixed pressing plate, the pattern electroplating is carried out, and the etching is to corrode the copper surface of the outer-layer plate and reserve the copper surface covered by the outer-layer circuit protective layer to form an outer-layer circuit;
step S160: solder resist, coating a protective film on the surface of the optically detected mixed plate;
step S170: and detecting the mixed pressing plate with the solder resist completed.
As shown in fig. 2, which is a cross-sectional structure of the hybrid board in the method for manufacturing the ceramic hybrid-pressed forward etching board according to the present invention, the ceramic copper clad laminate 10 includes a ceramic layer 11, and two first copper layers 12 respectively disposed on two sides of the ceramic layer 11, and the high-speed epoxy resin copper clad laminate 20 includes an epoxy resin layer 21, and two second copper layers 22 respectively disposed on two sides of the epoxy resin layer 21. The ceramic copper clad laminate 10 is composed of a ceramic substrate, a bonding layer and a conductive layer, the high-speed epoxy resin copper clad laminate is a plate made by weaving and gluing glass fibers with epoxy resin, and the side wall of the plate is coated with copper foil, the ceramic copper clad laminate 10 and the high-speed epoxy resin copper clad laminate 20 are a kind of prior art, and are not described herein again.
In step S110, the electroless copper plating is to deposit a layer of copper between copper layers in the hole of the ceramic copper-clad plate 10, the pulse plating is to plate a copper layer with a preset thickness threshold on the hole wall of the ceramic copper-clad plate 10, the inner layer circuit is to fabricate an inner layer circuit protection layer on the first copper layer 12 of the ceramic copper-clad plate 10, the pattern plating is to increase the copper thickness of the covered area of the inner layer circuit protection layer, and the inner layer etching is to corrode the first copper layer 12 of the ceramic copper-clad plate 10 and to reserve the copper surface covered by the inner layer circuit protection layer to form the inner layer circuit.
In step S120, the inner layer circuit is formed by fabricating an inner layer circuit protection layer on the second copper layer 22 of the high-speed epoxy resin copper clad laminate 20, etching the inner layer to etch the second copper layer 22 of the high-speed epoxy resin copper clad laminate 20, and leaving the copper surface covered by the inner layer circuit protection layer.
In step S130, the ceramic copper clad laminate 10 and the high-speed epoxy resin copper clad laminate 20 are laminated together, and the lamination is formed by bonding the ceramic copper clad laminate 10 and the high-speed epoxy resin copper clad laminate 20 at a preset lamination temperature threshold and a preset pressure threshold. And the ceramic copper clad laminate 10 and the high-speed epoxy resin copper clad laminate 20 are bonded through a PP layer 30, wherein the PP layer 30 is made of polypropylene, and the PP layer 30 is a prior art.
In step S140, the mixed pressing plate is sequentially processed by a plasma cleaning machine and glass fiber etching, the plasma cleaning machine bombards the hole wall of the mixed pressing plate with plasma gas, the plasma cleaning machine ionizes the mixed gas composed of oxygen, nitrogen and carbon tetrafluoride with high voltage to form plasma gas, and then the plasma gas bombards the hole wall of the mixed pressing plate to clean, modify and ashing the plate hole wall with photoresist. In this embodiment, the cleaning time of the ion cleaning machine is 5min to 13min, so as to ensure the glue removing effect of the hole walls of the ceramic copper clad laminate 10 and the high-speed epoxy resin copper clad laminate 20 in the hybrid board.
The mixed pressing plate is accommodated in a plasma cleaner for removing glue, the mixed pressing plate bites and erodes the hole wall resin for a certain depth in the glue removing time, so that the inner layer copper is protruded, the glass fiber on the hole wall needs to be bitten and eroded through the ammonium bifluoride and sulfuric acid proportioning liquid medicine after the resin is removed, so that the roughness of the hole wall meets the requirement, and in the step S150, three-dimensional links are formed among all copper layers in the hole in the mixed pressing plate in the chemical copper deposition process, so that the reliability performance is enhanced. The glass fiber etching is carried out by using a mixed solution of ammonium bifluoride and sulfuric acid, the glass fiber etching temperature is 25 +/-2 ℃, and the glass fiber etching time is 150 +/-10 s, so that the glass fiber etching effect is stable, and the requirement on the roughness of the hole wall is met.
After the steps S110 and S140 are completed, the ternary device is used to detect the expansion and contraction of the ceramic copper-clad plate 10 and the high-speed epoxy resin copper-clad plate 20, that is, to test whether the ceramic copper-clad plate 10 and the high-speed epoxy resin copper-clad plate 20 deform during the processing, so as to ensure the molding quality of the ceramic copper-clad plate 10 and the high-speed epoxy resin copper-clad plate 20. The ternary device is an instrument for measuring by taking points in three dimensions, and is also called a three-dimensional measuring machine in the market.
In step S150, the hybrid board sequentially performs electroless copper plating, pulse plating, outer layer circuit plating, pattern plating, and etching. The chemical copper deposition is to deposit a layer of copper among copper layers in holes of the mixed pressing plate, the pulse plating is to plate a copper layer with a preset thickness threshold on the hole wall of the mixed pressing plate, the outer circuit is to manufacture an outer circuit protection layer on a first copper layer 12 which can be contacted with air in the ceramic copper-clad plate 10 in the mixed pressing plate or on a second copper layer 22 which can be contacted with air in a high-speed epoxy resin copper-clad foil plate 20, the pattern plating is to increase the copper thickness of a coverage area of the outer circuit protection layer, and the etching is to form the outer circuit by reserving the copper surface covered by the outer circuit protection layer for the mixed pressing plate. In steps S110 and S150, the electroless copper plating thickness is 0.5um, so that the structure of the formed ceramic copper-clad plate 10 and the hole wall of the mixed pressing plate is stable.
In step S160, a protective film is coated on the hybrid board to prevent damage during surface transportation of the hybrid board.
In step S170, the hybrid board subjected to the solder resist process is detected to ensure the quality of the hybrid board. The step S110 and the step S140 are completed, and then the mixed pressing plate subjected to the resistance welding treatment is detected in the step S170, so that the product quality of the mixed pressing plate in the processing process is ensured.
Compared with the prior art, the method for manufacturing the ceramic mixed-pressing positive pitting plate provided by the invention has the advantages that the mixed-pressing plate formed by the ceramic copper-clad plate 10 and the high-speed epoxy resin copper-clad plate 20 is subjected to the ion cleaning machine and the glass fiber etching treatment in sequence, so that the quality of the mixed-pressing plate is improved. The method for manufacturing the ceramic mixed-pressure positive-concave etching plate comprises the steps of sequentially carrying out drilling, chemical copper deposition, pulse electroplating, inner layer circuit, pattern electroplating and etching treatment on the ceramic copper-clad plate 10, and carrying out optical detection on the etched ceramic copper-clad plate 10. And sequentially carrying out inner layer circuit and etching treatment on the high-speed epoxy resin copper-clad plate 20, and carrying out optical detection on the etched high-speed epoxy resin copper-clad plate 20. And (3) pressing the ceramic copper-clad plate 10 and the high-speed epoxy resin copper-clad plate 20 together to form a mixed pressing plate, and carrying out optical detection on the mixed pressing plate. And drilling holes on the mixed pressing plate after the optical detection is finished, sequentially placing the mixed pressing plate after the optical detection is finished into a plasma cleaner and performing glass fiber etching treatment, sequentially performing chemical copper deposition, pulse electroplating, outer layer circuit, pattern electroplating and etching treatment on the mixed pressing plate after the glass fiber etching is finished, and performing optical detection on the mixed pressing plate. The plasma cleaning machine and the treatment are used for eroding the hole wall resin of the mixed pressing plate by a certain depth to enable the inner layer copper to be protruded, after the resin is removed, the resin passes through the glass fiber of the hole wall and needs to be eroded by the glass fiber etching treatment, so that the roughness of the hole wall meets the requirement, and in the process of chemical copper deposition, three-dimensional links are formed between all copper layers in the hole in the mixed pressing plate, so that the reliability performance is enhanced. The method for manufacturing the ceramic mixed-compression forward-concave etching plate realizes the pressing between the ceramic copper-clad plate and the high-speed epoxy resin copper-clad plate, has high reliability, can carry out high-density assembly and has long service life.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, and any modifications, equivalents or improvements that are within the spirit of the present invention are intended to be covered by the following claims.
Claims (9)
1. A method for manufacturing a ceramic mixed-pressure positive pitting plate is characterized by comprising the following steps: the method for manufacturing the ceramic mixed-compression positive pitting plate comprises the following steps:
step S100: providing a ceramic copper-clad plate and at least one high-speed epoxy resin copper-clad plate, wherein the ceramic copper-clad plate comprises a ceramic layer and two first copper layers which are respectively arranged on two sides of the ceramic layer, and the high-speed epoxy resin copper-clad plate comprises an epoxy resin layer and two second copper layers which are respectively arranged on two sides of the epoxy resin layer;
step S110: sequentially carrying out drilling, chemical copper deposition, pulse electroplating, inner layer circuit, pattern electroplating and etching treatment on the ceramic copper-clad plate, and carrying out optical detection on the etched ceramic copper-clad plate;
step S120: sequentially carrying out inner layer circuit and inner layer etching treatment on the high-speed epoxy resin copper-clad plate, and carrying out optical detection on the etched high-speed epoxy resin copper-clad plate;
step S130: pressing the ceramic copper-clad plate and the high-speed epoxy resin copper-clad plate together to form a mixed pressing plate, and carrying out optical detection on the mixed pressing plate;
step S140: drilling holes on the mixed pressing plate after the optical detection is finished, and sequentially putting the mixed pressing plate after the optical detection is finished into a plasma cleaner and performing glass fiber etching treatment;
step S150: carrying out chemical copper deposition, pulse electroplating, outer layer circuit, pattern electroplating and etching treatment on the mixed pressing plate subjected to glass fiber etching in sequence, and carrying out optical detection on the mixed pressing plate;
step S160: and solder-resisting, namely coating a protective film on the surface of the outer laminate which is subjected to optical detection.
2. The method for manufacturing a ceramic mixed-pressure positive-cavitation plate according to claim 1, wherein: the method for manufacturing the ceramic mixed-pressure positive pitting plate further comprises the step S170: and detecting the mixed pressing plate with the solder resist completed.
3. The method for manufacturing a ceramic mixed-pressure positive-cavitation plate according to claim 1, wherein: and after the step S110 and the step S140 are finished, respectively detecting the expansion and shrinkage of the ceramic copper clad laminate and the high-speed epoxy resin copper clad laminate by using ternary equipment.
4. The method for manufacturing a ceramic mixed-pressure positive-cavitation plate according to claim 1, wherein: in step S130, the ceramic copper clad laminate and the high-speed epoxy resin copper clad laminate are bonded by a PP layer.
5. The method for manufacturing a ceramic mixed-pressure positive-cavitation plate according to claim 1, wherein: in step S150, the etching of the glass fiber is performed by using a mixed solution of ammonium bifluoride and sulfuric acid, the etching temperature of the glass fiber is 25 ± 2 ℃, and the etching time is 150 ± 10S.
6. The method of making a ceramic hybrid positive cavitation plate of claim 1 wherein: the mass concentration of the ammonium bifluoride is 25g/L, and the concentration of the sulfuric acid solution is 10%.
7. The method for manufacturing a ceramic mixed-pressure positive-cavitation plate according to claim 1, wherein: in step S140, the plasma cleaning machine ionizes a mixed gas composed of oxygen, nitrogen, and carbon tetrafluoride at a high voltage to form a plasma gas, and then bombards the hole wall of the mixing plate with the plasma gas to clean and modify the plate hole wall, and ashing the photoresist.
8. The method of making a ceramic hybrid positive cavitation plate of claim 1 wherein: the ion cleaner cleaning time is 5min to 13min in step S140.
9. The method of making a ceramic hybrid positive cavitation plate of claim 1 wherein: in steps S110 and S150, the electroless copper plating thickness is 0.5um.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210549747.7A CN114845482A (en) | 2022-05-20 | 2022-05-20 | Method for manufacturing ceramic mixed-pressure positive-concave etching plate |
| CN2022105497477 | 2022-05-20 |
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| Publication Number | Publication Date |
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| CN115334777A true CN115334777A (en) | 2022-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210549747.7A Withdrawn CN114845482A (en) | 2022-05-20 | 2022-05-20 | Method for manufacturing ceramic mixed-pressure positive-concave etching plate |
| CN202211113219.3A Pending CN115334777A (en) | 2022-05-20 | 2022-09-14 | Method for manufacturing ceramic mixed-pressure positive-concave etching plate |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210549747.7A Withdrawn CN114845482A (en) | 2022-05-20 | 2022-05-20 | Method for manufacturing ceramic mixed-pressure positive-concave etching plate |
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| CN (2) | CN114845482A (en) |
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2022
- 2022-05-20 CN CN202210549747.7A patent/CN114845482A/en not_active Withdrawn
- 2022-09-14 CN CN202211113219.3A patent/CN115334777A/en active Pending
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