CN115332307A - Display panel, preparation method thereof and display device - Google Patents
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- CN115332307A CN115332307A CN202211049864.3A CN202211049864A CN115332307A CN 115332307 A CN115332307 A CN 115332307A CN 202211049864 A CN202211049864 A CN 202211049864A CN 115332307 A CN115332307 A CN 115332307A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
Abstract
The application discloses a display panel, a preparation method thereof and a display device. The inorganic functional layer comprises a plurality of inorganic layers which are stacked in the thickness direction of the display panel, the plurality of inorganic layers penetrate in the thickness direction of the display panel to form a pixel opening, the plurality of inorganic layers at least comprise a first inorganic layer and a second inorganic layer which is positioned on one side, away from the substrate, of the first inorganic layer, and the orthographic projection area of the second inorganic layer on the substrate is larger than that of the first inorganic layer on the substrate. The carrier layer comprises a first part and a second part, the first part is located on the side, facing away from the substrate, of the inorganic functional layer, and the second part is located in the pixel opening and is arranged at intervals. The display panel provided by the application obviously improves the phenomenon of transverse current transmission in the current carrier layer, improves the crosstalk problem between sub-pixels, improves the display quality of the display panel, and is simple in preparation process.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a display panel, a preparation method of the display panel and a display device.
Background
An Organic Light-Emitting Diode (OLED) is also called an Organic electroluminescent display or an Organic Light-Emitting semiconductor. The OLED has the characteristics of low driving voltage, active luminescence, wide visual angle, high efficiency, high response speed and easiness in realizing full-color large-area wall-mounted Display and flexible Display, and gradually replaces Liquid Crystal Display (LCD) Display.
The OLED display panel comprises a whole continuous common layer, and the common layer has the problem of transverse electric leakage, so that crosstalk is generated between adjacent sub-pixels, and the display quality of the display panel is influenced.
Disclosure of Invention
The embodiment of the application provides a display panel, a preparation method thereof and a display device, so as to improve the phenomenon that a sub-pixel emits light abnormally due to transverse current and improve the display quality of the display panel.
An embodiment of a first aspect of an embodiment of the present application provides a display panel, including:
a substrate;
the inorganic functional layer is arranged on the substrate and comprises a plurality of inorganic layers which are stacked along the thickness direction of the display panel, and the plurality of inorganic layers penetrate along the thickness direction of the display panel to form a pixel opening; the multilayer inorganic layer at least comprises a first inorganic layer and a second inorganic layer positioned on the side of the first inorganic layer, which faces away from the substrate, and the orthographic area of the second inorganic layer on the substrate is larger than that of the first inorganic layer;
the carrier layer is positioned on one side, away from the substrate, of the inorganic functional layer and comprises a first part and a second part, wherein the first part is positioned on one side, away from the substrate, of the inorganic functional layer, the second part is positioned in the pixel opening, and the first part and the second part are arranged at intervals.
According to an embodiment of the first aspect of the present application, the display panel includes a plurality of light emitting units, the light emitting units include at least one light emitting device, the light emitting device includes a light emitting layer located at the pixel opening, and the charge carrier layer is located at a side of the light emitting layer facing toward and/or away from the substrate;
preferably, the charge carrier layer includes: a hole injection transport layer located on a side of the light-emitting layer facing the substrate; and/or an electron injection transport layer positioned on the side of the light-emitting layer facing away from the substrate.
According to any one of the embodiments of the first aspect of the present application, the light emitting unit includes a plurality of the light emitting devices, the plurality of the light emitting devices are stacked in a thickness direction of the display panel, a charge generation layer is disposed between adjacent light emitting devices, the charge generation layer includes a third portion located on a side of the inorganic functional layer away from the substrate and a fourth portion located in the pixel opening, and the third portion and the fourth portion are spaced from each other;
preferably, when the light-emitting unit includes two light-emitting devices, the light-emitting unit includes a first electrode, a first light-emitting device, the charge generation layer, a second light-emitting device, and a second electrode, which are stacked in this order in a direction away from the substrate, wherein the first light-emitting device includes a first hole injection transport layer, a first light-emitting layer, and a first electron injection transport layer, which are stacked in a direction away from the substrate, and the second light-emitting device includes a second hole injection transport layer, a second light-emitting layer, and a second electron injection transport layer, which are stacked in a direction away from the substrate.
According to any one of the preceding embodiments of the first aspect of the present application, the first inorganic layer comprises SiO x1 N y1 The second inorganic layer comprises SiO x2 N y2 Wherein x1 is larger than x2, y1 is smaller than y2, and x2 and y1 are both larger than or equal to 0.
According to any one of the embodiments of the first aspect of the present application, an inner wall surface of the inorganic functional layer facing the pixel opening is shaped as a plane, and an included angle between the inner wall surface and the substrate facing the pixel opening is smaller than 90 °; alternatively, the first and second electrodes may be,
the shape of the inner wall surface is a curved surface, and the curved surface protrudes towards the direction departing from the pixel opening; alternatively, the first and second electrodes may be,
the shape of the inner wall surface is a step surface.
Embodiments of the second aspect of the present application further provide a method for manufacturing a display panel, including:
forming a patterned first electrode on a substrate;
forming an inorganic functional layer on one side, away from the substrate, of the first electrode, wherein the inorganic functional layer comprises a plurality of inorganic layers which are stacked in the thickness direction of the display panel, and the inorganic layers at least comprise a first inorganic layer and a second inorganic layer which is positioned on one side, away from the substrate, of the first inorganic layer;
forming a pixel opening in the inorganic functional layer at a position opposite to the first electrode, the pixel opening penetrating the inorganic functional layer in a thickness direction of the display panel so that an orthographic projection area of the second inorganic layer on the substrate is larger than an orthographic projection of the first inorganic layer on the substrate;
and forming a carrier layer on one side of the inorganic functional layer, which is far away from the substrate, wherein the carrier layer comprises a first part and a second part, the first part is positioned on one side of the inorganic functional layer, which is far away from the substrate, and the second part is positioned in the pixel opening, and the first part and the second part are arranged at intervals.
According to an embodiment of the second aspect of the present application, the forming an inorganic functional layer on a side of the first electrode facing away from the substrate, the inorganic functional layer including a plurality of inorganic layers stacked in a thickness direction of the display panel, the step of including at least a first inorganic layer and a second inorganic layer on a side of the first inorganic layer facing away from the substrate includes:
and forming the inorganic functional layer by adopting a chemical vapor deposition process, and forming a plurality of layers of the inorganic functional layers which are arranged in a laminated manner by controlling the composition of reaction gas and the power of an electric field in different time.
According to any of the preceding embodiments of the second aspect of the present application, the reaction speed of the multiple inorganic layers with the same etching medium decreases gradually in a direction away from the substrate.
According to any one of the embodiments of the second aspect of the present application, the step of forming a pixel opening in the inorganic functional layer at a position opposite to the first electrode, the pixel opening penetrating the inorganic functional layer in a thickness direction of the display panel so that an area of an orthographic projection of the second inorganic layer on the substrate is larger than an area of an orthographic projection of the first inorganic layer on the substrate includes:
forming an etching barrier layer on one side of the inorganic functional layer, which is far away from the substrate, wherein the etching barrier layer comprises a first opening opposite to the pixel opening;
and etching the area, opposite to the first opening, in the inorganic functional layer through an etching medium, wherein the etching medium comprises etching liquid and/or etching gas.
Embodiments of the third aspect of the present application further provide a display device, including any one of the display panels provided in the first aspect of the present application.
In the display panel provided by the application, an inorganic functional layer is arranged on a substrate, a pixel opening is arranged on the inorganic functional layer, the inorganic functional layer comprises a plurality of inorganic layers, the inorganic layers at least comprise a first inorganic layer and a second inorganic layer, the second inorganic layer is positioned on one side, which is far away from the substrate, of the first inorganic layer, the orthographic projection area of the second inorganic layer on the substrate is larger than that of the first inorganic layer on the substrate, so that the pixel opening is in a cross section along the thickness direction of the display panel, and the size of a part, which is positioned in the second inorganic layer, in the pixel opening is smaller than that of a part, which is positioned in the first inorganic layer, along the direction parallel to the light-emitting surface of the display panel. The display panel further comprises a current carrier layer located on one side, away from the substrate, of the inorganic functional layer, the pixel opening divides the current carrier layer into a first portion located on one side, away from the substrate, of the inorganic functional layer and a second portion located in the pixel opening, and the first portion and the second portion are arranged at intervals, so that the phenomenon that current in the current carrier layer is transmitted transversely is improved, the problem of crosstalk between sub-pixels is solved, and the display quality of the display panel is improved. Meanwhile, in the display panel provided by the application, the inorganic functional layer comprises a plurality of inorganic layers, the preparation process of the inorganic layers can be synchronously carried out, and the etching process of the inorganic layers can also be synchronously carried out, so that the preparation process can be reduced and the effect of well isolating the carrier layer can be simultaneously achieved when the inorganic functional layer and the pixel opening are formed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another display panel provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of another display panel provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
fig. 5 is a schematic structural diagram of a partial film layer of another display panel provided in an embodiment of the present application;
FIG. 6 is a schematic diagram illustrating a structure of a portion of a film layer of another display panel according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram illustrating a structure of a portion of a film layer of another display panel according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a partial film layer of another display panel provided in an embodiment of the present application;
fig. 9 is a schematic structural diagram of a partial film layer of another display panel provided in an embodiment of the present application;
fig. 10 is a schematic structural diagram of a partial film layer of another display panel provided in an embodiment of the present application;
fig. 11 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 12 to 17 are schematic diagrams illustrating film variations of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 18 is a schematic structural diagram of a display device according to an embodiment of the present application.
In the drawings:
1-a display panel; 101-a substrate; 102-a driver circuit layer; 103-a planarization layer; 10-substrate 11-inorganic functional layer; 12-an inorganic layer; 121 — a first inorganic layer; 122 — a second inorganic layer; 13-pixel openings; 14-a charge carrier layer; 141-a first part; 142-a second portion; 15-a first electrode; 16-a hole injection transport layer; 161-a first hole injection transport layer; 162-a second hole injection transport layer; 17-a light emitting layer; 171-a first light emitting layer; 172-a second light emitting layer; 22-a charge generation layer; 18-electron injection transport layer; 181 — a first electron injection transport layer; 182-a second electron injection transport layer; 19-a second electrode; 20-a support layer; 21-etching the barrier layer; 2-display device.
Detailed Description
Features of various aspects of the present application and exemplary embodiments will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of another like element in a process, method, article, or apparatus that comprises the element.
With the development of display technology, the requirements on the display quality of the display panel are higher and higher. The inventors have studied and found that the OLED display panel includes a first electrode, a second electrode, and a light emitting layer disposed between the first electrode and the second electrode, and the light emitting layer includes a common layer having a continuous whole surface, and since the common layer is continuously disposed on the whole surface, when a part of sub-pixels emit light, current may be transmitted to adjacent sub-pixels through the common layer, thereby easily causing abnormal light emission of the adjacent sub-pixels, i.e., causing crosstalk between the adjacent sub-pixels. That is, the lateral current in the common layer may cause abnormal turn-on of the sub-pixels, thereby causing impure chromaticity or uneven display, and seriously affecting the display effect. Based on the research on the above problems, the inventors provide a display panel, a method for manufacturing the same, and a display device, so as to improve the phenomenon that the sub-pixels emit light abnormally due to the lateral current and improve the display quality of the display panel.
For better understanding of the present application, a display panel, a method for manufacturing the display panel, and a display device according to an embodiment of the present application will be described in detail below with reference to fig. 1 to 18.
Referring to fig. 1, an embodiment of the present disclosure provides a display panel 1 including a substrate 10, an inorganic functional layer 11, and a charge carrier layer 14. The inorganic functional layer 11 is disposed on the substrate 10, the inorganic functional layer 11 includes a plurality of inorganic layers 12 stacked in a thickness direction of the display panel 1 and a pixel opening 13 penetrating in the thickness direction of the display panel 1, the plurality of inorganic layers 12 at least includes a first inorganic layer 121 and a second inorganic layer 122 located on a side of the first inorganic layer 121 away from the substrate 10, and an orthographic projection area of the second inorganic layer 122 on the substrate 10 is larger than an orthographic projection area of the first inorganic layer 121 on the substrate 10. The charge carrier layer 14 is located on a side of the inorganic functional layer facing away from the substrate 10, the charge carrier layer 14 includes a first portion 141 located on a side of the inorganic functional layer 11 facing away from the substrate 10 and a second portion 142 located in the pixel opening 13, and the first portion 141 and the second portion 142 are spaced apart from each other.
In the display panel 1 provided by the present application, an inorganic functional layer 11 is disposed on a substrate 10, a pixel opening 13 is disposed on the inorganic functional layer 11, the inorganic functional layer 11 includes a plurality of inorganic layers 12, the plurality of inorganic layers 12 at least include a first inorganic layer 121 and a second inorganic layer 122, the second inorganic layer 122 is disposed on a side of the first inorganic layer 121 away from the substrate 10, and an orthographic projection area of the second inorganic layer 122 on the substrate 10 is larger than an orthographic projection area of the first inorganic layer 121 on the substrate 10, so that in a cross section of the pixel opening 13 along a thickness direction of the display panel 1, a size of a portion of the pixel opening 13 located in the second inorganic layer 122 along a direction parallel to a light exit surface of the display panel 1 is smaller than a size of a portion located in the first inorganic layer 121. The display panel 1 further includes a charge carrier layer 14 located on a side of the inorganic functional layer 11 away from the substrate 10, the pixel opening 13 partitions the charge carrier layer 14 into a first portion 141 located on a side of the inorganic functional layer 11 away from the substrate 10 and a second portion 142 located in the pixel opening 13, and the first portion 141 and the second portion 142 are arranged at intervals, so that a phenomenon of transverse current transmission in the charge carrier layer 14 is improved, a crosstalk problem between sub-pixels is improved, and display quality of the display panel 1 is improved. Meanwhile, in the display panel 1 provided by the present application, the inorganic functional layer 11 includes the multiple inorganic layers 12, the preparation process of the multiple inorganic layers 12 can be performed synchronously, and the etching process of the multiple inorganic layers 12 can be performed synchronously, so that when the inorganic functional layer 11 and the pixel opening 13 are formed, the preparation process can be reduced, and the effect of well blocking the carrier layer 14 is achieved.
In the display panel 1 provided by the present application, as shown in fig. 2, the display panel 1 includes a plurality of light emitting units a, each of the light emitting units a includes a first electrode 15, a second electrode 19, and at least one light emitting device B located between the first electrode 15 and the second electrode 19, each of the light emitting devices B includes a hole injection transport layer 16, an electron injection transport layer 18, and a light emitting layer 17, the hole injection transport layer 16, the electron injection transport layer 18, and the light emitting layer 17 are stacked between the first electrode 15 and the second electrode 19, and the light emitting layer 17 is located between the hole injection transport layer 16 and the electron injection transport layer 18, where the first electrode 15 may be an anode and the second electrode 19 may be a cathode, and the present application is not particularly limited. When the first electrode 15 is an anode, the first electrodes 15 are formed on the substrate 10 and are patterned in a plurality, the pixel openings 13 in the inorganic functional layer 11 are arranged in one-to-one correspondence with the first electrodes 15, each pixel opening 13 exposes a central position of one first electrode 15, and an edge of each first electrode 15 is covered by the inorganic functional layer 11. The second electrode 19 is a cathode and is a continuous film layer disposed over the entire surface.
The display panel 1 includes a plurality of sub-pixels each including one of the above-described light emitting units a, specifically, the light emitting unit a includes a light emitting layer 17, and the light emitting layer 17 is located at the pixel opening 13. The inorganic functional layer 11 now functions as a pixel definition, each pixel opening 13 defines one sub-pixel (light emitting unit a), and the inorganic functional layer 11 also functions to block the carrier layer 14, thereby improving the problem of crosstalk between adjacent sub-pixels caused by lateral leakage.
In a possible embodiment, the charge carrier layer 14 is located on the side of the light-emitting layer 17 facing towards and/or away from the substrate 10. As shown in fig. 2, charge carrier layer 14 includes: a hole injection transport layer 16, the hole injection transport layer 16 being located on the side of the light-emitting layer 17 facing the substrate 10; and/or, as shown in fig. 3, further comprises an electron injection transport layer 18, wherein the electron injection transport layer 18 is positioned on the side of the light-emitting layer 17 facing away from the substrate 10.
Each light-emitting unit A provides a necessary condition for light emission for the light-emitting layer 17 through the hole injection transport layer 16 and the electron injection transport layer 18, and the hole injection transport layer 16 is separated through the pixel opening 13 of the inorganic functional layer 11, so that the probability of transverse transmission of current in the first electrode 15 through the hole injection transport layer 16 can be reduced, the crosstalk phenomenon between adjacent light-emitting units is improved, and the display effect of the display panel 1 is better; and/or, the electron injection transport layer 18 is blocked by the pixel opening 13 of the inorganic functional layer 11, so that the probability of lateral transmission of the current in the second electrode 19 through the electron injection transport layer 18 can be reduced, the crosstalk phenomenon between adjacent light emitting units can be improved, and the display effect of the display panel 1 is better.
In one possible embodiment, the hole injection transport layer 16 includes at least one of a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), and an Electron Blocking Layer (EBL). The electron injection transport layer 18 includes at least one of an Electron Injection Layer (EIL), an Electron Transport Layer (ETL), and a Hole Blocking Layer (HBL).
In the display panel 1, at least part of the film layers in the hole injection transport layer 16 are separated by the separation structure, so that the partial communication areas of the at least part of the film layers in the hole injection transport layer 16 corresponding to different light-emitting units are reduced, and/or at least part of the film layers in the electron injection transport layer 18 are separated by the separation structure, so that the partial communication areas of the at least part of the film layers in the electron injection transport layer 18 corresponding to different light-emitting units are reduced, thereby improving the crosstalk phenomenon between adjacent light-emitting units, and making the display effect of the display panel 1 better.
In one possible embodiment, as shown in fig. 3, each light emitting unit a includes only one light emitting device B.
In another possible embodiment, as shown in fig. 4, each light-emitting unit a includes a plurality of light-emitting devices B stacked in the thickness direction of the display panel, with a charge generation layer 22 disposed between adjacent light-emitting devices B, each light-emitting device B including a hole injection transport layer 16, an electron injection transport layer 18, and a light-emitting layer 17, and in each light-emitting device, the hole injection transport layer 16 is located on the side of the light-emitting layer 17 facing the substrate, and the electron injection transport layer 18 is located on the side of the light-emitting layer 17 facing away from the substrate. The light emitting devices B adjacent in the thickness direction of the display panel are electrically connected by the charge generation layer 22. The charge generation layer 22 includes a third portion located on a side of the inorganic functional layer 11 facing away from the substrate 10 and a fourth portion located in the pixel opening 13, and the third portion and the fourth portion are spaced apart from each other.
In the above embodiment, the OLED device is a stacked OLED device, in this case, one light emitting unit a includes a plurality of light emitting devices B stacked in the thickness direction of the display panel, and adjacent light emitting devices B are electrically connected through the charge generation layer 22, so that the luminance of the light emitting unit a can be improved. The material of the charge generation layer 22 may be an organic material, specifically, a polymer resin material, and is not particularly limited in this application. When the light emitting units include the charge generation layer 22, the charge generation layer 22 may also be separated into a third portion and a fourth portion by the pixel opening 13 of the inorganic functional layer 11, the third portion is located on a side of the inorganic functional layer 11 away from the substrate 10, and the fourth portion is located in the pixel opening 13, so as to improve the circulation of the lateral current in the charge generation layer 172 of different light emitting units, and further reduce the crosstalk between adjacent light emitting units.
In one possible embodiment, as shown in fig. 4, the light emitting unit a includes two light emitting devices B. When the light emitting unit a includes two light emitting devices B, the two light emitting devices B may include a first light emitting device B1 and a second light emitting device B2, and at this time, the light emitting unit a includes a first electrode 15, a first light emitting device B1, a charge generation layer 22, a second light emitting device B2, and a second electrode 19 which are stacked in a direction away from the substrate 10, wherein the first light emitting device B1 includes a first hole injection transport layer 161, a first light emitting layer 171, and a first electron injection transport layer 181 which are stacked in a direction away from the substrate 10, and the second light emitting device B2 includes a second hole injection transport layer 162, a second light emitting layer 172, and a second electron injection transport layer 182 which are stacked in a direction away from the substrate 10.
In one possible embodiment, the thickness of the inorganic functional layer 11 may be
Specifically, the thickness of the inorganic functional layer 11 may be
Etc., and the present application is not particularly limited. Such that the pixel opening 13 of the inorganic functional layer 11 blocks the hole injection transport layer 16 and/or the electron injection transport layer 18, and in the case of a stacked OLED, at least one carrier layer (including the hole injection transport layer 16 and/or the electron injection transport layer 1) in the light emitting device8) And the separation is optional, the charge generation layer 22 can be separated synchronously, the problem of crosstalk between sub-pixels is further improved, and the continuity of the second electrode 19 is ensured. It is understood that the thickness of the inorganic functional layer 11 can be set according to the thickness of the film layer to be cut off, the thickness is not particularly limited, and the upper limit of the thickness of the inorganic functional layer 11 cannot exceed the total thickness of each light emitting unit and the second electrode 19, i.e. the continuity of the second electrode 19 needs to be ensured.
In one possible embodiment, the first inorganic layer 121 comprises SiO x1 N y1 The second inorganic layer 122 includes SiO x2 N y2 Wherein x1 is larger than x2, y1 is smaller than y2, and x2 and y1 are both larger than or equal to 0.
In the above embodiment, the first inorganic layer 121 and the second inorganic layer 122 included in the inorganic functional layer 11 are both nitrogen, oxygen, and a silicon compound, and the second inorganic layer 122 has a lower oxygen content, an increased nitrogen content, and a minimum zero oxygen content than the first inorganic layer 121; the first inorganic layer 121 has a reduced nitrogen content and an increased oxygen content as compared with the second inorganic layer 122, and the nitrogen content is zero at the lowest; the reaction speed of the second inorganic layer 122 with the same etching medium is made smaller than that of the first inorganic layer 121, so that the distance between the portions of the pixel openings 13 located in the first inorganic layer 121 and parallel to the light emitting surface of the display panel 1 is made larger than the distance between the portions of the pixel openings 13 located in the second inorganic layer 122 and parallel to the light emitting surface of the display panel 1, and the charge carrier layer 14 can be separated by the pixel openings 13 to improve the lateral transfer of the lateral leakage current.
In one possible embodiment, as shown in fig. 5, the shape of the inner wall surface of the inorganic functional layer 11 facing the pixel opening 13 is a plane, and the included angle between the inner wall surface and the substrate 10 facing the pixel opening 13 is less than 90 °. That is, the cross section of the pixel opening 13 in the thickness direction of the display panel 1 is trapezoidal.
In another possible embodiment, as shown in fig. 6 and 7, the shape of the inner wall surface of the inorganic functional layer 11 facing the pixel opening 13 is a curved surface, and the curved surface is convex in a direction away from the pixel opening 13.
In the above two embodiments, the inorganic functional layer 11 may include a plurality of inorganic layers 12, and the plurality of inorganic layers 12 may be all nitrogen, oxygen, or silicon compounds, and the nitrogen content of the plurality of inorganic layers 12 gradually increases and the oxygen content gradually decreases in a direction away from the substrate 10. In the above two embodiments, the changes of the nitrogen content and the oxygen content of the multi-layer inorganic layer 12 are different along the direction away from the substrate 10, so that the shapes of the formed pixel openings 13 are different, but the multi-layer inorganic layer 12 includes the first inorganic layer 121 and the second inorganic layer 122, the second inorganic layer 122 is located on the side of the first inorganic layer 121 away from the substrate 10, and the distance between the portions of the pixel openings 13 located in the second inorganic layer 122 is smaller than the distance between the portions located in the first inorganic layer 121, so that the pixel openings can be used for blocking the carrier layer 14.
In another possible embodiment, as shown in fig. 8 and 9, the shape of the inner wall surface of the inorganic functional layer 11 facing the pixel opening 13 is a stepped surface. Specifically, the number of steps may be one or more, and the present application is not particularly limited.
Specifically, as shown in fig. 8, the inorganic functional layer 11 may include two inorganic layers 12, i.e., a first inorganic layer 121 and a second inorganic layer 122, which are stacked, and a step is formed at the boundary of the first inorganic layer 121 and the second inorganic layer 122. Alternatively, as shown in fig. 9, the inorganic functional layer 11 may include four inorganic layers 12 stacked, specifically, a first inorganic layer 121, a second inorganic layer 122, a first inorganic layer 121, and a second inorganic layer 122 arranged in a direction away from the substrate 10, which is not particularly limited in the present application.
In the display panel 1 provided by the application, as shown in fig. 10, a supporting layer 20 for supporting a mask plate is further formed on one side of the inorganic functional layer 11 departing from the substrate 10, the supporting layer 20 supports the mask plate, and damage to the lower film layer due to contact between the mask plate and the lower film layer in the evaporation process can be prevented.
The present application also provides a method for manufacturing a display panel 1, as shown in fig. 11, including:
s100, a patterned first electrode 15 is formed on the substrate 10, as shown in fig. 12.
The base plate 10 includes a substrate 101, a driving circuit layer 102 on the substrate, a planarization layer 103 on a side of the driving circuit layer away from the substrate, and the like, and the first electrode 15 is formed on the planarization layer 103 and electrically connected to a driving circuit in the driving circuit layer 102.
S200, forming an inorganic functional layer 11 on a side of the first electrode 15 away from the substrate 10, where the inorganic functional layer 11 includes a plurality of inorganic layers 12 stacked in a thickness direction of the display panel 1, and the plurality of inorganic layers 12 at least includes a first inorganic layer 121 and a second inorganic layer 122 located on a side of the first inorganic layer 121 away from the substrate 10, as shown in fig. 13.
S300, forming a pixel opening 13 in the inorganic functional layer 11 at a position opposite to the first electrode 15, wherein the pixel opening 13 penetrates through the inorganic functional layer 11 along the thickness direction of the display panel 1, so that the orthographic projection area of the second inorganic layer 122 on the substrate 10 is larger than that of the first inorganic layer 121 on the substrate 10, as shown in fig. 14, 15 and 16.
S400, forming a charge carrier layer 14 on a side of the inorganic functional layer 11 away from the substrate 10, where the charge carrier layer 14 includes a first portion 141 located on the side of the inorganic functional layer 11 away from the substrate 10 and a second portion 142 located in the pixel opening 13, and the first portion 141 and the second portion 142 are disposed at an interval from each other, as shown in fig. 17.
In the preparation method of the display panel 1 provided by the application, the inorganic functional layer 11 is formed on one side of the first electrode 15, which is far away from the substrate 10, the inorganic functional layer 11 comprises the multiple inorganic layers 12 which are arranged in a stacked manner, and the multiple inorganic layers 12 can be prepared by one-step process in the forming process, so that the preparation process is simplified and the preparation time is saved; the pixel opening 13 is formed on the inorganic functional layer 11, so that the orthographic projection area of the second inorganic layer 122 on the substrate 10, which is located on the side of the first inorganic layer 121 facing away from the substrate 10, is larger than the orthographic projection area of the first inorganic layer 121 on the substrate 10, and thus the carrier layer 14 is separated into a first part 141 located on the side of the inorganic functional layer 11 facing away from the substrate 10 and a second part 142 located in the pixel opening 13, thereby improving the problem of crosstalk between sub-pixels. Meanwhile, the pixel opening 13 in the inorganic functional layer 11 exposes the first electrode 15, that is, the inorganic functional layer 11 also plays a role in limiting pixels while blocking the current carrier layer 14, and the multiplexing of the inorganic functional layer 11 simplifies the structure of the display panel 1, simplifies the preparation process of the display panel 1, and saves the manufacturing cost.
In one possible embodiment, step S200 includes:
the inorganic functional layer 11 is formed by a chemical vapor deposition process, and a plurality of inorganic layers 12 are formed in a laminated manner by controlling the composition of reaction gas and the power of an electric field in different time periods.
In the above embodiment, the composition of the reaction gas and the power of the electric field are changed to form the plurality of inorganic layers 12 having different degrees of difficulty in etching, and the manufacturing process is simple. In particular, N can be varied 2 O and SiH 4 The inorganic layer 12 is grown so that the multilayer inorganic layer 12 having different ratios of Si, O and N components is formed, specifically, the multilayer inorganic layer 12 has SiO components x N y Wherein x can be 0 to 2,y can be 0 to 1.33.
In a possible embodiment, the reaction speed of the multiple inorganic layers 12 with the same etching medium is gradually reduced along the direction away from the substrate 10, so that the pixel opening 13 can be formed by one etching medium, thereby further simplifying the manufacturing process.
In one possible embodiment, step S300 includes:
forming an etch stop layer 21 on a side of the inorganic functional layer 11 facing away from the substrate 10, the etch stop layer 21 including a first opening opposite to the pixel opening 13, as shown in fig. 14;
the region of the inorganic functional layer 11 opposite to the first opening is etched by an etching medium comprising an etching liquid and/or an etching gas, as shown in fig. 15.
Step S300 further includes removing the etch stop layer 21, as shown in fig. 16.
Specifically, the inorganic layer 12 in the inorganic functional layer 11 may be SiO x N y Wherein x and y are greater than or equal to 0, the etching solution can be HF acid-containing etching solution, and the inorganic layers 12 stacked in the inorganic functional layer 11 are all SiO x N y And at least part of the inorganic layers 12 have different composition ratios of Si, O and N, so that different speeds of etching of the multiple inorganic layers 12 can be realized by one etching medium to form the pixel openings 13 for blocking the carrier layers 14.
Specifically, the oxygen content in the multilayer inorganic layer 12 in the inorganic functional layer 11 may decrease linearly in a direction away from the substrate 10, and the nitrogen content may increase linearly in a direction away from the substrate 10, so that the shape of the inner wall surface of the etched inorganic functional layer 11 facing the pixel opening 13 is a plane, and an included angle between the inner wall surface and the substrate 10 facing the pixel opening 13 is smaller than 90 °. That is, the cross section of the pixel opening 13 along the thickness direction of the display panel 1 is trapezoidal, please refer to fig. 5 again.
Or, referring to fig. 6 again, the oxygen content in the multiple inorganic layers 12 in the inorganic functional layer 11 may decrease more and more slowly in the direction away from the substrate 10, and the nitrogen content may increase more and more slowly in the direction away from the substrate 10, so that the shape of the inner wall surface of the etched inorganic functional layer 11 facing the pixel opening 13 is a curved surface, and one end of the curved surface away from the substrate 10 protrudes in the direction away from the pixel opening 13.
Alternatively, referring to fig. 7 again, the oxygen content in the multi-layer inorganic layer 12 in the inorganic functional layer 11 may be raised and then lowered in the direction away from the substrate 10, and the nitrogen content may be lowered and then raised in the direction away from the substrate 10, so that the shape of the inner wall surface of the etched inorganic functional layer 11 facing the pixel opening 13 is a curved surface, the curved surface is expanded and then recovered in the direction away from the substrate 10, and the whole is protruded in the direction away from the pixel opening 13.
Alternatively, referring to fig. 8 and 9 again, the number of the inorganic layers 12 may be controlled, and a step structure may be formed between adjacent inorganic layers 12 to block the carrier layer 14, for example, the inorganic layers 12 may be two or four layers, and specifically, may be a silicon oxide layer and a silicon nitride layer stacked along a direction away from the substrate 10, or a silicon oxide layer, a silicon nitride layer, and the like stacked, which is not limited in this application.
The present application also provides a display device 2, as shown in fig. 18, including any one of the display panels 1 provided in the above embodiments of the present application.
In the display device 2, the problem of sub-pixel crosstalk of the display panel 1 is improved, so that the display effect of the display device 2 is remarkably improved, and meanwhile, the inorganic functional layer 11 in the display panel 1 also plays a role in pixel limitation while blocking the current carrier layer 14, so that the structural design change of a film layer in the display panel 1 is small, the preparation process is simple, and the preparation cost is saved.
The display device 2 may be a mobile terminal such as a mobile phone or a tablet, or a fixed terminal such as a television or a display, or may be a wearable device such as a watch, and the present application is not particularly limited.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and its various modifications as are suited to the particular use contemplated. The application is limited only by the claims and their full scope and equivalents.
Claims (10)
1. A display panel, comprising:
a substrate;
the inorganic functional layer is arranged on the substrate and comprises a plurality of inorganic layers which are stacked along the thickness direction of the display panel, and the plurality of inorganic layers penetrate along the thickness direction of the display panel to form pixel openings; the multilayer inorganic layer at least comprises a first inorganic layer and a second inorganic layer positioned on the side of the first inorganic layer, which faces away from the substrate, and the orthographic area of the second inorganic layer on the substrate is larger than that of the first inorganic layer;
and the current carrier layer is positioned on one side of the inorganic functional layer, which is far away from the substrate, and comprises a first part positioned on one side of the inorganic functional layer, which is far away from the substrate, and a second part positioned in the pixel opening, wherein the first part and the second part are arranged at intervals.
2. The display panel according to claim 1, wherein the display panel comprises a plurality of light emitting units, the light emitting units comprise at least one light emitting device, the light emitting device comprises a light emitting layer located at the pixel opening, and the charge carrier layer is located at a side of the light emitting layer facing toward and/or away from the substrate;
preferably, the charge carrier layer includes: a hole injection transport layer located on a side of the light emitting layer facing toward or away from the substrate; and/or an electron injection transport layer located on a side of the light emitting layer facing away from or towards the substrate.
3. The display panel according to claim 2, wherein the light emitting unit includes a plurality of the light emitting devices, the plurality of the light emitting devices are stacked in a thickness direction of the display panel, a charge generation layer is disposed between adjacent light emitting devices, the charge generation layer includes a third portion on a side of the inorganic functional layer facing away from the substrate and a fourth portion in the pixel opening, and the third portion and the fourth portion are spaced apart from each other;
preferably, when the light-emitting unit includes two light-emitting devices, the light-emitting unit includes a first electrode, a first light-emitting device, the charge generation layer, a second light-emitting device, and a second electrode, which are stacked in this order in a direction away from the substrate, wherein the first light-emitting device includes a first hole injection transport layer, a first light-emitting layer, and a first electron injection transport layer, which are stacked in a direction away from the substrate, and the second light-emitting device includes a second hole injection transport layer, a second light-emitting layer, and a second electron injection transport layer, which are stacked in a direction away from the substrate.
4. The method of claim 1The display panel, wherein the first inorganic layer comprises SiO x1 N y1 The second inorganic layer comprises SiO x2 N y2 Wherein x1 is larger than x2, y1 is smaller than y2, and x2 and y1 are both larger than or equal to 0.
5. The display panel according to claim 1, wherein an inner wall surface of the inorganic functional layer facing the pixel opening is shaped as a plane, and an included angle of an included angle formed between the inner wall surface and the substrate, the included angle being smaller than 90 ° toward the pixel opening side; alternatively, the first and second electrodes may be,
the shape of the inner wall surface is a curved surface, and the curved surface protrudes towards the direction departing from the pixel opening; alternatively, the first and second electrodes may be,
the shape of the inner wall surface is a step surface.
6. A method for manufacturing a display panel, comprising:
forming a patterned first electrode on a substrate;
forming an inorganic functional layer on one side, away from the substrate, of the first electrode, wherein the inorganic functional layer comprises a plurality of inorganic layers which are stacked in the thickness direction of the display panel, and the inorganic layers at least comprise a first inorganic layer and a second inorganic layer which is positioned on one side, away from the substrate, of the first inorganic layer;
forming a pixel opening in the inorganic functional layer at a position opposite to the first electrode, the pixel opening penetrating the inorganic functional layer in a thickness direction of the display panel so that an orthographic projection area of the second inorganic layer on the substrate is larger than an orthographic projection of the first inorganic layer on the substrate;
and forming a carrier layer on one side of the inorganic functional layer, which is far away from the substrate, wherein the carrier layer comprises a first part and a second part, the first part is positioned on one side of the inorganic functional layer, which is far away from the substrate, and the second part is positioned in the pixel opening, and the first part and the second part are arranged at intervals.
7. The method according to claim 6, wherein the step of forming an inorganic functional layer on a side of the first electrode facing away from the substrate, the inorganic functional layer including a plurality of inorganic layers stacked in a thickness direction of the display panel, the plurality of inorganic layers including at least a first inorganic layer and a second inorganic layer on a side of the first inorganic layer facing away from the substrate includes:
and forming the inorganic functional layer by adopting a chemical vapor deposition process, and forming a plurality of layers of the inorganic functional layers which are arranged in a laminated manner by controlling the composition of reaction gas and the power of an electric field in different time.
8. A method according to claim 6, wherein the reaction rate of the inorganic layers with the same etching medium decreases in a direction away from the substrate.
9. The production method according to claim 8, wherein the step of forming a pixel opening in the inorganic functional layer at a position opposite to the first electrode, the pixel opening penetrating the inorganic functional layer in a thickness direction of the display panel so that an area of an orthographic projection of the second inorganic layer on the substrate is larger than an area of an orthographic projection of the first inorganic layer on the substrate comprises:
forming an etching barrier layer on one side of the inorganic functional layer, which is far away from the substrate, wherein the etching barrier layer comprises a first opening opposite to the pixel opening;
and etching the area, opposite to the first opening, in the inorganic functional layer through an etching medium, wherein the etching medium comprises etching liquid and/or etching gas.
10. A display device comprising the display panel according to any one of claims 1 to 5.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211049864.3A CN115332307A (en) | 2022-08-30 | 2022-08-30 | Display panel, preparation method thereof and display device |
| PCT/CN2022/128349 WO2024045307A1 (en) | 2022-08-30 | 2022-10-28 | Display panel and manufacturing method therefor, display apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211049864.3A CN115332307A (en) | 2022-08-30 | 2022-08-30 | Display panel, preparation method thereof and display device |
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| TWI678829B (en) * | 2017-09-05 | 2019-12-01 | 創王光電股份有限公司 | Light emitting device and manufacturing method thereof |
| CN108717942B (en) * | 2018-05-31 | 2021-11-19 | 京东方科技集团股份有限公司 | OLED substrate, manufacturing method thereof and display device |
| KR20210145907A (en) * | 2020-05-26 | 2021-12-03 | 엘지디스플레이 주식회사 | Display device |
| CN112531003B (en) * | 2020-12-01 | 2023-04-25 | 武汉天马微电子有限公司 | Display panel, preparation method of display panel and display device |
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