CN115325854B - Heat exchanger and method for manufacturing the same - Google Patents
Heat exchanger and method for manufacturing the same Download PDFInfo
- Publication number
- CN115325854B CN115325854B CN202210768204.4A CN202210768204A CN115325854B CN 115325854 B CN115325854 B CN 115325854B CN 202210768204 A CN202210768204 A CN 202210768204A CN 115325854 B CN115325854 B CN 115325854B
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- substrate
- coating
- groove
- heat exchanger
- adhesive
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 24
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- 238000000576 coating method Methods 0.000 claims abstract description 191
- 239000011248 coating agent Substances 0.000 claims abstract description 186
- 229910000679 solder Inorganic materials 0.000 claims abstract description 94
- 239000000853 adhesive Substances 0.000 claims abstract description 89
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- 238000005520 cutting process Methods 0.000 claims description 6
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 59
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 38
- 239000000463 material Substances 0.000 description 30
- 239000000377 silicon dioxide Substances 0.000 description 28
- 239000002105 nanoparticle Substances 0.000 description 24
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 23
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 21
- 239000002245 particle Substances 0.000 description 20
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
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- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910003849 O-Si Inorganic materials 0.000 description 3
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- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
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- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical class [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
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- 238000001816 cooling Methods 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
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- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 description 1
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- WZXYXXWJPMLRGG-UHFFFAOYSA-N hexadecyl benzenesulfonate Chemical compound CCCCCCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 WZXYXXWJPMLRGG-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
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- 150000007522 mineralic acids Chemical class 0.000 description 1
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- 150000007524 organic acids Chemical class 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
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- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/05316—Assemblies of conduits connected to common headers, e.g. core type radiators
- F28D1/05333—Assemblies of conduits connected to common headers, e.g. core type radiators with multiple rows of conduits or with multi-channel conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/126—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element consisting of zig-zag shaped fins
- F28F1/128—Fins with openings, e.g. louvered fins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
- F28F19/04—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The application provides a heat exchanger, including base member and colored coating, the base member includes first base member and second base member, and at least one of first base member and second base member has the recess, and some recess intussuseptions are filled with adhesive or solder, and the adhesive or the solder of filling in the recess all contact with first base member and second base member, and at least part coating is located the recess. The heat exchanger provided by the application is reliable in connection between the first substrate and the second substrate, and the coating is firmly combined with the substrate. The application also provides a method for manufacturing the heat exchanger, which comprises the following steps: providing a first substrate and a second substrate, wherein at least one of the first substrate and the second substrate is provided with a groove, connecting the first substrate and the second substrate, enabling the adhesive or the solder filled in the groove to be in contact with both the first substrate and the second substrate, covering the first substrate and the second substrate with a color coating, and at least partially positioning the coating in the groove. The manufacturing method can manufacture the heat exchanger with reliable connection between the first substrate and the second substrate and firm combination of the coating and the heat exchanger substrate.
Description
Technical Field
The application relates to the technical field of heat exchange, in particular to a heat exchanger and a manufacturing method thereof.
Background
In the heat exchanger, the connection between the components can be achieved with an adhesive or solder. For example, to achieve a connection between two parts, an adhesive or solder may be provided on the outer surface of one of the two parts, and the two parts may then be assembled. However, since the outer surface of the component is smoother, less adhesive and solder remains on the surface of the component, making it difficult to achieve a reliable connection between the two components.
In addition, in some cases, the heat exchangers need to be distinguished, and as the heat exchanger surfaces in the related art often exhibit the color of the substrate, it is difficult to meet the requirement of easy distinction.
Accordingly, there is a need for improvements in the related art that increase the reliability of the connections between the components in the heat exchanger and that facilitate the differentiation of the heat exchanger.
Disclosure of Invention
In order to solve the technical problem, the application provides a heat exchanger with reliable connection between parts and convenient distinction, and the application also provides a manufacturing method of the heat exchanger.
A first aspect of the present application provides a heat exchanger comprising a substrate and a coating layer covering at least a portion of a surface of the substrate;
the substrate comprises a first substrate and a second substrate, at least one of the first substrate and the second substrate having a groove formed from at least one of the first substrate and the second substrate recessed inwardly from an outer surface;
The groove comprises a first groove and a second groove, wherein an adhesive or solder is filled in the first groove, the adhesive or the solder filled in the first groove is in contact with the first substrate and the second substrate, the coating is covered on the outer surface of at least one of the first substrate and the second substrate, and at least part of the coating is positioned in the second groove;
the coating includes a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
In the present application, at least one of the first substrate and the second substrate has a groove, which includes a first groove and a second groove. The first groove is filled with adhesive or solder, and the adhesive or solder filled in the first groove is in contact with both the first substrate and the second substrate. The first groove can contain more adhesive or solder for connecting the first matrix and the second matrix, so that the connection between the first matrix and the second matrix is more reliable. The coating is at least partially located within the second recess, thereby increasing the bonding force of the coating to the heat exchanger matrix. In addition, the coating comprises a color additive, can color the surface of the heat exchanger, and is convenient for distinguishing the heat exchanger.
A second aspect of the present application provides a method of manufacturing a heat exchanger, the method comprising the steps of:
providing a first substrate and a second substrate, at least one of the first substrate and the second substrate having a groove recessed inwardly from an outer surface of at least one of the first substrate and the second substrate, the groove comprising a first groove and a second groove;
connecting the first substrate and the second substrate, so that an adhesive or solder is filled in the first groove, and the adhesive or the solder filled in the first groove is in contact with both the first substrate and the second substrate;
a coating is applied to at least a portion of an outer surface of at least one of the first substrate and the second substrate such that at least a portion of the coating is positioned within the second recess, the coating including a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
According to the manufacturing method, as the grooves are formed in at least one of the first substrate and the second substrate, the grooves comprise the first grooves and the second grooves. The first recess is capable of receiving more adhesive or solder when connecting the first substrate and the second substrate for connecting the first substrate and the second substrate, so that the connection between the first substrate and the second substrate is more reliable. When the coating is coated, the coating is at least partially positioned in the second groove, so that the binding force between the coating and the heat exchanger matrix can be increased. In addition, the coating provided by the manufacturing method comprises a color additive, and the color additive can color the surface of the heat exchanger, so that the heat exchanger can be distinguished conveniently. Therefore, the manufacturing method provided by the application can manufacture the heat exchanger which is reliable in connection between the first substrate and the second substrate, firmly combined with the heat exchanger substrate and convenient to distinguish.
Drawings
FIG. 1 is a schematic illustration of a heat exchanger provided in one embodiment of the present application;
FIG. 2 is a schematic illustration of a connection between a first substrate and a second substrate according to one embodiment of the present application;
FIG. 3 is a schematic view of another angular connection of a first substrate and a second substrate provided in one embodiment of the present application;
FIG. 4 is a schematic illustration of the connection of a first substrate and a second substrate provided in one embodiment of the present application;
FIG. 5 is an enlarged schematic view of portion a of FIG. 3 in one embodiment of the present application;
FIG. 6 is an enlarged schematic view of portion a of FIG. 3 in another embodiment of the present application;
FIG. 7 is a schematic view of a first substrate provided in one embodiment of the present application;
FIG. 8 is a schematic illustration of a second substrate provided in one embodiment of the present application;
FIG. 9 is a schematic illustration of a surface coating of a first substrate provided in accordance with one embodiment of the present application;
FIG. 10 is a schematic illustration of a surface coating of a second substrate provided in accordance with one embodiment of the present application;
FIG. 11 is a flow chart of a method of manufacturing a heat exchanger provided in one embodiment of the present application;
FIG. 12 is a flow chart of step S1 in a heat exchanger manufacturing method provided in one embodiment of the present application;
FIG. 13 is a flow chart of step S2 in a heat exchanger manufacturing method provided in one embodiment of the present application;
FIG. 14 is a flow chart of step S2 in a heat exchanger manufacturing method according to another embodiment of the present application;
FIG. 15 is a flow chart of step S3 in a heat exchanger manufacturing method provided in one embodiment of the present application;
FIG. 16 is a scanning electron microscope image of a first substrate provided in one embodiment of the present application after sandblasting;
FIG. 17 is a schematic diagram of a thermal management system provided in one embodiment of the present application.
Detailed Description
For a better understanding of the technical solutions of the present application, embodiments of the present application are described in detail below with reference to the accompanying drawings.
It should be understood that the described embodiments are merely some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
In the heat exchanger, the connection between the components can be achieved with an adhesive or solder. For example, to achieve a connection between two parts, an adhesive or solder may be provided on the outer surface of one of the two parts, and the two parts may then be assembled. However, since the outer surface of the component is smoother, less adhesive and solder remains on the surface of the component, making it difficult to achieve a reliable connection between the two components. In addition, since the outer surface of the component is smooth, it is difficult for the coating to firmly bond with the outer surface of the component.
To this end, the present application provides a heat exchanger, for example as shown in fig. 1, 3, 5 and 6, comprising a base body including a first base body 11 and a second base body 12, at least one of the first base body 11 and the second base body 12 having a groove, the groove 3 being recessed inwardly from an outer surface of at least one of the first base body 11 and the second base body 12. The grooves include a first groove 31 and a second groove 32, the first groove 31 is filled with an adhesive or solder, the adhesive or solder filled in the first groove 31 is in contact with both the first substrate 11 and the second substrate 12, the coating 2 is provided on the outer surface of at least one of the first substrate 11 and the second substrate 12, and at least part of the coating 2 is located in the second groove 32.
In the present application, at least one of the first substrate and the second substrate has a groove, which includes a first groove and a second groove. The first groove is filled with adhesive or solder, and the adhesive or solder filled in the first groove is in contact with both the first substrate and the second substrate. The first groove can contain more adhesive or solder for connecting the first matrix and the second matrix, so that the connection between the first matrix and the second matrix is more reliable. The coating is at least partially located within the second recess, thereby increasing the bonding force of the coating to the heat exchanger matrix.
In some embodiments, the substrate includes a third substrate 13 with which the adhesive or solder filled in the first grooves 31 is in contact. That is, the adhesive or solder filled in the first groove 31 is in contact with each of the first substrate 11, the second substrate 12, and the third substrate 13, thereby achieving the connection of the first substrate 11, the second substrate 12, and the third substrate 13.
Illustratively, as shown in FIG. 1, the heat exchanger 100 includes a plurality of heat exchange tubes 101, a plurality of fins 102, and two headers 103. The heat exchange tube 101 is fixedly connected with the collecting pipe 103, the heat exchange tube 101 is in sealing connection with the collecting pipe 103, and the inner cavity of the heat exchange tube 101 is communicated with the inner cavity of the collecting pipe 103. The plurality of heat exchange tubes 101 are arranged along the length direction of the header 103. The thickness direction of the heat exchange tube 101 is parallel to the length direction of the header 103, and the width direction of the heat exchange tube 101 is perpendicular to the length direction of the header 103. The thickness direction of the heat exchange tube 101 may refer to the X direction in fig. 1 and 2, the width direction of the heat exchange tube 101 may refer to the Y direction in fig. 2, and the length direction of the heat exchange tube 101 may refer to the Z direction in fig. 1 and 2. Wherein, X direction, Y direction and Z direction are mutually perpendicular between two by two. The fin 102 is located between two adjacent heat exchange tubes 101, and the fin 102 is fixedly connected with the two heat exchange tubes 101 adjacent thereto. The fins 102 are corrugated along the length of the heat exchange tube 101. The arrangement of the fins 102 can enlarge the heat exchange area of two adjacent heat exchange tubes 101, and improves the heat exchange efficiency of the heat exchanger 100. In some embodiments, a partial region of the fins 102 may be provided with a window structure to form louvered fins to further enhance heat transfer.
In some embodiments, a plurality of independent channels (micro-channels) are arranged in parallel inside one heat exchange tube 101, as shown in fig. 3, and the heat exchanger thus formed is a micro-channel heat exchanger. In some embodiments, the heat exchange tubes 101, fins 102, and collector tubes 103 in a microchannel heat exchanger are all made of a material comprising aluminum/aluminum alloy.
In order to achieve the connection between the heat exchange tube 101, the fins 102 and the manifold 103, solder may be provided on the outer surfaces of the fins 102 and the manifold 103. After the heat exchange tube 101, the fins 102 and the collector tube 103 are arranged, the whole assembly is heated to a temperature higher than the melting point of the solder, the solder is melted, and then cooled and solidified, so that the fixed connection among the heat exchange tube 101, the fins 102 and the collector tube 103 is realized by the solder. Because the surfaces of the heat exchange tube 101, the fins 102 and the collecting pipe 103 are smooth, only a small amount of solder 4 can be reserved between the heat exchange tube 101 and the fins 102 and between the heat exchange tube 101 and the collecting pipe 103 for welding, for example, as shown in fig. 4, so that the connection reliability between the heat exchange tube 101, the fins 102 and the collecting pipe 103 is poor.
Furthermore, during use of the heat exchanger, it may be necessary to distinguish between different heat exchangers, for example when more than two heat exchangers are provided in the same module of the thermal management system, different heat exchangers being used to perform different functions. Most of the existing heat exchangers show the color of the base material, at most, the size or the shape of the base material is slightly different, and the base material is difficult to distinguish from the base material in terms of appearance, so that the base material is inconvenient to install, check or maintain. For this purpose, the heat exchanger can be colored on the surface, which makes the heat exchanger easy to distinguish. In the related art, since the surfaces of the heat exchange tube 101, the fins 102 and the collector tube 103 are smooth, it is difficult to firmly bond with the coating.
In some embodiments, as shown in fig. 1, the heat exchanger 100 includes a substrate and a coating 2, the coating 2 covering at least a portion of the surface of the substrate. The matrix comprises a first matrix 11, a second matrix 12 and a third matrix 13, wherein the first matrix 11 is a heat exchange tube 101, the second matrix 12 is a fin 102, and the third matrix 13 is a collecting pipe 103. At least one of the first substrate 11, the second substrate 12, and the third substrate 13 has a groove 3. That is, the grooves 3 may be provided only on one of the first substrate 11, the second substrate 12, and the third substrate 13, may be provided on any two of the first substrate 11, the second substrate 12, and the third substrate 13, and may be provided on each of the first substrate 11, the second substrate 12, and the third substrate 13. The groove 3 includes a first groove 31 and a second groove 32. The groove 3 is formed recessed from the outer surface inward from at least one of the first substrate 11, the second substrate 12, and the third substrate 13. For example, the groove 3 provided in the first base 11 is formed to be recessed inward from the outer surface of the first base 11, as shown in fig. 5 and 6.
The first groove 31 is filled with an adhesive or solder 4, and the adhesive or solder 4 filled in the first groove 31 is in contact with at least two of the first substrate 11, the second substrate 12, and the third substrate 13. That is, the adhesive or solder 4 filled in the first groove 31 may be used to connect any two of the first substrate 11, the second substrate 12, and the third substrate 13, or may be used to connect the first substrate 11, the second substrate 12, and the third substrate 13. For example, if the adhesive or solder 4 filled in the first groove 31 is in contact with the first substrate 11 and the second substrate 12, the adhesive or solder 4 filled in the first groove 31 can achieve the connection of the first substrate 11 and the second substrate 12, as shown in fig. 5 and 6. If the adhesive or solder filled in the first groove 31 is in contact with all of the first substrate 11, the second substrate 12 and the third substrate 13, the adhesive or solder filled in the first groove 31 can achieve the connection of the first substrate 11, the second substrate 12 and the third substrate 13. The adhesive or solder filled in the first groove 31 may be entirely located in the first groove 31, as shown in fig. 5, or the adhesive or solder filled in the first groove 31 may be partially located in the first groove 31 and partially overflowed outside the first groove 31, as shown in fig. 6.
In this way, the first grooves 31 can accommodate more adhesive or solder for connecting at least two of the first substrate 11, the second substrate 12, and the third substrate 13, so that the connection between at least two of the first substrate 11, the second substrate 12, and the third substrate 13 is more reliable, that is, the connection between at least two of the heat exchange tube 101, the fins 102, and the manifold 103 is more reliable.
The coating 2 is provided on the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13, and at least part of the coating 2 is located within said second recess 32, as shown in fig. 5 and 6. The roughness of the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13 is increased through the second grooves 32, so that the bonding force between the coating 2 and the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13 can be improved, and the coating 2 and the heat exchanger substrate can be firmly bonded.
In some embodiments, the first substrate 11 has a first groove 31 and a second groove 32. The adhesive or solder filled in the first groove 31 is in contact with the first substrate 11, and the adhesive or solder filled in the first groove 31 is in contact with at least one of the second substrate 12 and the third substrate 13, as shown in fig. 5 and 6. In this way, the first recess 31 is able to accommodate more adhesive or solder for connecting the first substrate 11 with the second substrate 12, or for connecting the first substrate 11 with the third substrate 13, or for connecting the first substrate 11 with the second substrate 12 and the third substrate 13. The second grooves 32 provided on the first substrate 12 can enhance the roughness of the outer surface of the first substrate 11, so that the coating 2 can be firmly combined with the outer surface of the first substrate 11, that is, the coating 2 and the heat exchange tube 101 are firmly combined.
Specifically, as shown in fig. 3, 5, and 6, for example, the outer surface of the first substrate 11 includes a first face 111 and a second face 112. The first surface 111 meets the second surface 112, and the contour line of the first surface 111 is at least partially the intersection line of the first surface 111 and the second surface 112. The first substrate 11 is connected to at least one of the second substrate 12 and the third substrate 13 via a first surface 111, at least part of the second surface 112 is covered with the coating 2, the first substrate 11 is recessed inwardly from the first surface 111 to form a first recess 31, and the first substrate 11 is recessed inwardly from the second surface 112 to form a second recess 32.
When the first substrate 11 is connected to the second substrate 12 through the first face 111, the adhesive or solder 4 filled in the first groove 31 is in contact with the first face 111, and the adhesive or solder filled in the first groove 31 is in contact with the second substrate 12, as shown in fig. 5 and 6. In this way, the first recess 111 is able to accommodate more adhesive or solder 4 for achieving a reliable connection of the first face 111 with the second substrate 12, i.e. for achieving a reliable connection of the first substrate 11 with the second substrate 12.
When the first substrate 11 is connected to the third substrate 13 through the first face 111, the adhesive or solder filled in the first groove 31 is in contact with the first face 111, and the adhesive or solder filled in the first groove 31 is in contact with the third substrate 13. In this way, the first recess 111 is able to accommodate more adhesive or solder for achieving a reliable connection of the first face 111 with the third substrate 13, i.e. for achieving a reliable connection of the first substrate 11 with the third substrate 13.
At least part of the second surface 112 is covered with the coating 2, and as shown in fig. 5 and 6, the second grooves 32 provided in the first substrate 11 can increase the roughness of the second surface 112, so that the coating 2 can be firmly bonded to the second surface 112, that is, the coating 2 is firmly bonded to the first substrate 11 or the heat exchange tube 101.
In some embodiments, one first substrate 11 has at least two first faces 111, at least a portion of the second face 112 being located between two adjacent first faces 111 of the same first substrate 11, as shown in fig. 7. In some embodiments, the first substrate 11 is connected to the second substrate 12 by at least one of the first faces 111, and the first substrate 11 is connected to the third substrate by at least one of the first faces 111. Specifically, in some embodiments, as shown in fig. 7, the first face 111 includes a first sub-face 1111 and a second sub-face 1112, the first substrate 11 is connected to the second substrate 12 through the first sub-face 1111, and the first substrate 11 is connected to the third substrate 13 through the second sub-face 1112. The first groove 31 includes a first sub groove (not shown) and a second sub groove (not shown). The first sub-groove is formed to be recessed from the first sub-surface 1111 toward the inside of the first base 11, and the second sub-groove is formed to be recessed from the first sub-surface 1112 toward the inside of the first base 11. The first sub-groove is filled with an adhesive or solder, the adhesive or solder filled in the first sub-groove is in contact with the first sub-face 1111, and the adhesive or solder filled in the first sub-groove is in contact with the second substrate 12. In this way, a reliable connection of the first base body 11 and the second base body 12 can be achieved. The second sub-groove is filled with an adhesive or solder, the adhesive or solder filled in the second sub-groove is in contact with the second sub-face 1112, and the adhesive or solder filled in the second sub-groove is in contact with the third substrate 13. In this way, a reliable connection of the first base 11 and the third base 13 can be achieved.
In some embodiments, one first substrate 11 has at least two first sub-faces 1111, with at least a portion of the second face 112 being located between two adjacent first sub-faces 1111 of the same first substrate 11, as shown in fig. 7. In this way, one first substrate 11 is connected to the second substrate 12 via at least two first sub-surfaces 1111, increasing the connection reliability of the first substrate 11 to the second substrate. In some embodiments, at least two first sub-surfaces 1111 are aligned along the length direction of the heat exchange tube (refer to the Z direction shown in fig. 1 and 2). As shown in fig. 3 and 7, the first base 11 has a flat shape, the first base 11 has a side wall 110, the side wall 110 is perpendicular to the thickness direction of the heat exchange tube 101, a plurality of first sub-surfaces 1111 are provided on the outer surface of the side wall 110, and the plurality of first sub-surfaces 1111 are arranged in the length direction (Z direction) of the heat exchange tube, a part of the second surface 112 is provided on the outer surface of the side wall 110, and a part of the second surface 112 is located between two adjacent first sub-surfaces 1111. The second surface 112 intersects the first sub-surface 1111, and the intersection line of the second surface 112 and the first sub-surface 1111 is the contour line of the first sub-surface 1111.
In some embodiments, the first grooves 31 make the first face 111 rough and the second grooves 32 make the second face 112 rough. In some embodiments, the roughness of both the first face 111 and the second face 112 is 0.5 μm to 10 μm. In some embodiments, the roughness of the first and second faces 111, 112 is formed by grit blasting.
In other embodiments, the second substrate 12 has a first groove 31 and a second groove 32. The adhesive or solder filled in the first groove 31 is in contact with the second substrate 12, and the adhesive or solder filled in the first groove 31 is in contact with at least one of the first substrate 11 and the third substrate 13. In this way, the first recess 31 is able to accommodate more adhesive or solder for connecting the second substrate 12 with the first substrate 11 and/or the second substrate 12 with the third substrate 13. The second grooves 32 provided in the second substrate 12 can enhance the roughness of the outer surface of the second substrate 12, so that the coating 2 can be firmly bonded with the outer surface of the second substrate 12, that is, the coating 2 and the fins 102 can be firmly bonded.
In some embodiments, the outer surface of the second substrate 12 includes a third surface 121 and a fourth surface 122, the third surface 121 and the fourth surface 122 meet, and the contour line of the third surface 121 is at least partially the intersection line of the third surface 121 and the fourth surface 122, as shown in fig. 8. The second substrate 12 is connected to at least one of the first substrate 11 and the third substrate 13 through a third surface 121, at least part of the fourth surface 122 is covered with the coating 2, the second substrate 12 is recessed inward from the third surface 121 to form a first groove 31, and the second substrate 12 is recessed inward from the fourth surface 122 to form a second groove 32.
In other embodiments, the third substrate 13 has a first groove 31 and a second groove 32. The adhesive or solder filled in the first groove 31 is in contact with the third substrate 13, and the adhesive or solder filled in the first groove 31 is in contact with at least one of the first substrate 11 and the second substrate 12. In this way, the first recess 31 is able to accommodate more adhesive or solder for connecting the third substrate 13 with the first substrate 11 and/or the third substrate 13 with the second substrate 12. The second grooves 32 arranged on the third substrate 13 can enhance the roughness of the outer surface of the third substrate 13, so that the coating 2 can be firmly combined with the outer surface of the third substrate 13, that is, the coating 2 and the collecting pipe 103 are firmly combined.
In some embodiments, the outer surface of the third substrate 13 includes a fifth face (not shown) and a sixth face (not shown), the fifth face and the sixth face interfacing, the contour of the fifth face being at least partially the intersection of the fifth face and the sixth face. The third substrate 13 is connected to at least one of the first substrate 11 and the third substrate 13 via a fifth surface, at least part of the sixth surface is covered with said coating 2, the third substrate 13 is recessed inwardly from the fifth surface to form a first recess 31, and the third substrate 13 is recessed inwardly from the sixth surface to form a second recess 32.
Because the application environment and the application condition of the heat exchanger have specificity, for example, the temperature change amplitude of the surface of the heat exchanger is large in the heat exchange process, and the like, the composite material provided by the related art is difficult to form a proper colored coating on the surface of the heat exchanger. The colored coating formed by coating the composite material in the related art on the surface of the heat exchanger may be easily peeled off from the surface of the heat exchanger, or the coating may cause a decrease in heat exchange efficiency of the heat exchanger. Still other coatings do not meet green environmental requirements due to the irritating odor generated during the preparation process. Accordingly, the present application also provides colored coatings suitable for use in heat exchangers.
In some embodiments, the coating 2 includes a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye. The colored coating may impart a color to the outer surface of at least one of the first substrate 11, the second substrate 12, and the third substrate 13, thereby having an effect of facilitating the differentiation of the heat exchanger.
In practical application, the surfaces of different heat exchangers or different areas of the heat exchangers can be coated with coatings with different colors according to the use requirements, so that the heat exchangers are convenient to distinguish from the appearance. The color of the colored coating is achieved by formulating the type and amount of pigment therein. In addition, the coating isolates the heat exchanger substrate from the external environment, so that the corrosion of the external environment to the heat exchanger is reduced, and the durability of the heat exchanger is improved to a certain extent.
In some embodiments, the color additive is selected from C 18 H 10 Cl 2 N 2 O 2 ，C 32 Cl 16 CuN 8 ，C 32 H 16 CuN 8 ，C 35 H 23 Cl 2 N 3 O 2 ，C 12 H 10 N 6 O 4 ，C 17 H 13 CaClN 4 O 7 S 2 At least one of mica, titanium dioxide, tin dioxide and a mixture of ferric oxide. That is, the color additive may be selected from C 18 H 10 C l2 N 2 O 2 (pigment Red), C 32 Cl 16 CuN 8 (Green), C 32 H 16 CuN 8 (blue), C 35 H 23 Cl 2 N 3 O 2 (purple), C 12 H 10 N 6 O 4 (orange), C 17 H 13 CaClN 4 O 7 S 2 (yellow), a mixture of any one or two or more of mica, titanium dioxide, tin dioxide and ferric oxide (gold color). In actual tinting, the color of the colored coating may be varied, some of the colors may be formulated with only one organic pigment, inorganic pigment or dye, while others may be formulated with more than two organic pigments, more than two inorganic pigments, more than two dyes, or with a combination of organic pigments, inorganic pigments and dyes. 1l
In some embodiments, the particle size of the color additive is from 1 to 5 μm. The smaller the granularity of the color additive is, the more uniform and fine the color coating is, and the color coating formed on the surface of the heat exchanger is beautiful. The small granularity of the color additive is also beneficial to the stable adhesion of the color additive on the surface of the heat exchanger.
In some embodiments, the thickness of the coating 2 is 8-16 μm. Further, the average thickness of the coating is 10-11 mu m, and the thickness of the coating is thinner, so that the heat exchange efficiency of the heat exchanger is not greatly influenced.
In some embodiments, the thickness standard deviation of the coating 2 is less than 0.8 μm. The film thickness of the colored coating is uniform, so that the adhesion of the colored coating to the surface of the heat exchanger is good in consistency, and the color additive and the partial peeling of the colored coating are reduced.
In some embodiments, the coating 2 comprises silica, at least a portion of the silica surface having functional groups- (CH) bound thereto 2 ) 3 -O-CH 2 -CH-OCH 2 And hydroxy-OH. The addition of the silicon dioxide can increase the adhesive force and the compactness of the coating, and the silicon dioxide has wide sources and low cost. Surface functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 The silica nanoparticles are uniformly dispersed in the sol, so that the silica nanoparticles in the formed coating are also uniformly dispersed, and the uniformity and consistency of the coating are improved. The hydroxyl-OH makes the silica nano particles hydrophilic, so that the colored coating has hydrophilic, water on the surface of the coating is easy to discharge, a large amount of water is reduced to gather on the surface of the coating, the erosion of impurities in the water to the coating can be reduced, and the coating can keep strong adhesion to a substrate permanently. In some embodiments, at least a portion of the silica has a particle size of 55 to 65nm.
In some embodiments, the coating 2 further comprises titanium dioxide. Titanium dioxide has hydrophilicity and photocatalytic activity, and the titanium dioxide is matched with silicon dioxide to form a binary oxide system, so that the hydrophilicity and self-cleaning property of the coating are enhanced. In some embodiments, at least a portion of the titanium dioxide has a particle size of 5 to 10nm.
In some embodiments, the coating 2 has an average thickness, and the thickness of at least a portion of the coating 2 disposed on at least a portion of the surface of the first substrate 11 is less than the average thickness; and/or the thickness of at least part of the coating 2 covering at least part of the surface of said second substrate 12 is smaller than the average thickness.
The coating 2 of the present application is different from hydrophilic, hydrophobic, antimicrobial, etc. coatings that require improved performance over the entire exterior surface of the heat exchanger. The coating 2 of the present application is applied to the surface of the heat exchanger in order to facilitate the differentiation of the heat exchanger from the appearance. Thus, at some surfaces of the heat exchanger, such as those shown in fig. 9 and 10, the first substrate 11 is used to form the inner side 1121 of the outer channel of the heat exchanger 100, the second substrate 12 is used to form the inner side 12-1 of the outer channel in cooperation with the inner side 1121 of the first substrate 11, etc., the coating 2 need not be entirely covered thereon, and the thickness of the coating thereon may not be limited. The coating 2 is coated on the surface of the heat exchanger, so that the color change is not large for the appearance of the heat exchanger, because the space formed between the two heat exchange pipes and between the heat exchange pipes and the fins is small, light is difficult to reach into the space, and a certain visual blind area is caused. In the visual blind area, the color of the surface of the heat exchanger is difficult to distinguish from the appearance of the heat exchanger.
In some embodiments, the channels of the heat exchanger 100 comprise external channels for external fluid communication, the second face 112 of the first substrate 11 comprises an inner face 1121, the inner face 1121 being for forming the external channels, the inner face 1121 having a first edge region 1113, a second edge region 1114, and an intermediate region 1115, as shown in fig. 2 and 9. Along the direction of fluid flow F, the first edge region 1113 is proximate to the fluid inlet e1 relative to the intermediate region 1115, the second edge region 1114 is proximate to the fluid outlet e2 relative to the intermediate region 1115, and the intermediate region 1115 is located between the first edge region 1113 and the second edge region 1114. The first edge region 1113 and the second edge region 1114 each have a coating thickness that is greater than the coating thickness of the intermediate region 1115.
In some embodiments, the first edge region 1113, the second edge region 1114, and the intermediate region 1115 may have a regular shape, such as a rectangle, square, etc., or the first edge region 1113, the second edge region 1114, and the intermediate region 1115 may have an irregular shape, such as shown in fig. 9.
In some embodiments, none of the first edge region 1113, the second edge region 1114, and the intermediate region 1115 are coated. In some embodiments, the coating thickness of the inner side 1121 of the first substrate 11 is less than 8 μm. In some embodiments, the inner side 1121 of the first base 11 is a sidewall 110 of the first base 11 perpendicular to the thickness direction (X direction).
In some embodiments, the heat exchanger has internal channels for the passage of an internal fluid, such as a refrigerant, coolant, etc., and external channels for the passage of an external fluid, such as air, etc. The external fluid is a refrigerant, a coolant, or the like flowing through the internal passage. In practice, it is preferable that the inner side surface of the first substrate is not coated with a colored coating, and in this case, it is necessary to shield the surface of the heat exchange tube during spraying. However, in the process of spraying the heat exchanger, in order to simplify the process and reduce the processing cost, the inner side surface of the heat exchange tube may not be shielded, but directly sprayed, so that the composite material is inevitably sprayed to some areas of the inner side surface of the heat exchange tube. When in spraying, the spraying direction and the inner side surface of the heat exchange tube can form a certain angle so as to reduce the area or thickness of the colored coating covered on the inner side surface of the heat exchange tube, thereby reducing the reduction of the heat exchange efficiency of the colored coating to the heat exchanger to a greater extent under the condition that the appearance color of the heat exchanger is not influenced.
In some embodiments, the channels of the heat exchanger comprise external channels for external fluid communication, as shown in fig. 2 and 10, the fourth face 122 of the second matrix 12 has a first outer edge region 1221, a second outer edge region 1222, and a central region 1223, the first outer edge region 1221 being adjacent to the fluid inlet e1 relative to the central region 1223, the second outer edge region 1222 being adjacent to the fluid outlet e2 relative to the central region 1223, the central region 1223 being located between the first outer edge region 1221 and the second outer edge region 1222, the first outer edge region 1221 and the second outer edge region 1212 each having a coating thickness greater than the colored coating thickness overlying the central region 1223 along the fluid flow direction F. In some embodiments, the first outer edge region 1221, the second outer edge region 1222, and the central region 1223 may have a regular shape, such as a rectangle, square, etc., or the first outer edge region 1221, the second outer edge region 1222, and the central region 1223 may have an irregular shape, such as shown in fig. 10. In some embodiments, none of the first outer edge region 1221, the second outer edge region 1222, and the central region 1223 is covered with a color coating.
In practice, it is optimal that the inner surface 12-1 of the second substrate 12 is not coated with a colored coating, in which case shielding of the surface of the second substrate 12 is required during spraying. However, in the process of spraying the heat exchanger 100, the inner surface 12-1 of the second substrate 12 may not be shielded, but may be directly sprayed, so that the composite material is inevitably sprayed to some surfaces of the second substrate 12, for the sake of simplifying the process and reducing the cost. During spraying, the spraying direction can form a certain angle with the inner surface 12-1 of the second substrate 12, so as to reduce the area or thickness of the coating layer covered on the second substrate 12, thereby reducing the reduction of the heat exchange efficiency of the coating layer 2 on the heat exchanger 100 to a greater extent under the condition that the appearance color of the heat exchanger 100 is not affected. In some embodiments, the coating thickness of the inner surface 12-1 of the second substrate 12 is less than 8 μm.
The present application also provides a thermal management system, as shown in fig. 17, the thermal management system includes a compressor 2, a first heat exchanger 1001, a throttling device 3, and a second heat exchanger 1002, wherein a color of a surface of the first heat exchanger 1001 is different from a color of a surface of the second heat exchanger 1002; when the heat management system has a refrigerant flowing, the refrigerant flows into the first heat exchanger 1001 through the compressor 2, flows into the throttle device 3 after heat exchange occurs in the first heat exchanger 1001, and then flows into the second heat exchanger 1002 and flows into the compressor 2 again after heat exchange occurs in the second heat exchanger 1002. Since the first heat exchanger 1001 and the second heat exchanger 1002 have different colors, for example, the first heat exchanger surface is red and the second heat exchanger surface is green, it is possible to distinguish the first heat exchanger and the second heat exchanger from each other in appearance. In some embodiments, the first heat exchanger 1001 is a condenser and the second heat exchanger 1002 is an evaporator. In some embodiments, a reversing device 4 is also provided in the thermal management system.
In some embodiments, at least a portion of the surface of one of the first heat exchanger 1001 and the second heat exchanger 1002 is coated with a colored coating, the color of the colored coating being different from the color of the substrate of both the first heat exchanger 1001 and the second heat exchanger 1002; alternatively, at least part of the surface of the first heat exchanger 1001 is covered with a first colored coating, and at least part of the surface of the second heat exchanger 1002 is covered with a second colored coating, the color of the first colored coating being different from the color of the second colored coating. In this way, one of the two heat exchangers is covered with a colored coating, and the first heat exchanger and the second heat exchanger are distinguished by the color difference between the colored coating and the heat exchanger base material; alternatively, the first heat exchanger and the second heat exchanger are distinguished by different colored coatings on the surfaces of the two heat exchangers.
In this application, the colors may be completely different or partially different. The difference in color may be a difference in chromaticity of the color, such as red, green, blue; alternatively, the colors may be different in shade, such as dark red, light red; alternatively, the color may be gradually changed, for example, gradually changed from the outer periphery to the inner periphery, gradually changed from the inner periphery to the outer periphery; or otherwise present a difference in color.
In order to form the coating layer on the surface of the substrate of the heat exchanger, corresponding coating materials can be prepared, and the coating materials are coated on the surface of the heat exchanger in a dip coating, spray coating, brush coating, curtain coating or roller coating mode and are solidified. As described above, since the surfaces of the heat exchange tube, the header and the fins are smooth, it is difficult for the coating layer to be firmly adhered to the surfaces of the heat exchange tube, the header and the fin base. In order to enable a firm adhesion of the coating to the surface of the heat exchanger matrix, the surface to be coated may be sandblasted before the corresponding coating. The sand blasting treatment can increase the surface roughness, so that the binding force between the coating and the surface is increased.
Specifically, after the heat exchanger is assembled, the whole heat exchanger is subjected to sand blasting treatment, and then the composite material is sprayed on the surface of the heat exchanger and cured to form the colored coating 2. However, since the assembled heat exchanger components are shielded from each other during the blasting process, a portion of the outer surface of the heat exchanger cannot be in contact with the blasting. Such as the microchannel heat exchanger 100 shown in fig. 1, the fins 102 are located between two adjacent heat exchange tubes 101, and the gaps between the fins 102 and the adjacent heat exchange tubes 101 are small. During the blasting, it is difficult for the abrasive to reach a part of the outer surface of the heat exchange tube 101, resulting in difficulty in achieving a desired roughness of a part of the outer surface of the heat exchange tube 101 by the blasting. Moreover, during the blasting process, the abrasive is easily stuck between the fins 102 or between the fins 102 and the heat exchange tube 101 due to the large stacking density of the fins 102, which is difficult to clean. Furthermore, the assembled heat exchanger may be damaged by sand blasting, for example, in the sand blasting process, the abrasive ejected at high speed generates impact force on the junction between the heat exchange tube and the collecting pipe and the junction between the heat exchange tube and the fins, resulting in failure of the connection and even leakage of the heat exchange tube.
To this end, the present application provides a method of manufacturing a heat exchanger, as shown in fig. 11, including the steps of:
s1, providing a first substrate 11 and a second substrate 12, at least one of the first substrate 11 and the second substrate 12 having a groove 3, the groove 3 being recessed inwardly from an outer surface of at least one of the first substrate 11 and the second substrate 12, the groove 3 comprising a first groove 31 and a second groove 32.
S2, connecting the first substrate 11 and the second substrate 12, so that the first groove 31 is filled with adhesive or solder, and the adhesive or solder filled in the first groove 31 is in contact with both the first substrate 11 and the second substrate 12.
S3, coating the outer surface of at least one of the first substrate 11 and the second substrate 12 with the coating 2 such that at least part of the coating 2 is located within the second recess 32, the coating 2 comprising a color additive selected from at least one of an organic pigment, an inorganic pigment and a dye.
It will be appreciated that in the present application, the step of providing the first substrate 11 and the second substrate 12 is performed before the step S2 of joining the first substrate 11 and the second substrate 12, and also before the step S3 of coating. That is, the steps of joining and coating are performed only after the first substrate 11 and the second substrate 12 are provided. Therefore, in the present application, step S1 precedes step S2 and step S3. However, the order of step S2 and step S3 is not limited in this application, and step S2 may precede step S3 or follow step S3.
In some embodiments, the heat exchanger 100 further comprises a third substrate 13, in particular the method of manufacturing a heat exchanger further comprises the steps of:
s1', providing a third substrate 13;
s2', connects the first substrate 11, the second substrate 12, and the third substrate 13 such that the adhesive or solder filled in the first groove 31 is in contact with each of the first substrate 11, the second substrate 12, and the third substrate 13.
Illustratively, in some embodiments, a method of manufacturing a heat exchanger includes the steps of:
s1, providing a first substrate 11, a second substrate 12 and a third substrate 13, wherein the first substrate 11 is used for forming the heat exchange tube 101, the second substrate 12 is used for forming the fin 102, the third substrate 13 is used for forming the collecting pipe 103, at least one of the first substrate 11, the second substrate 12 and the third substrate 13 is provided with a groove 3, the groove 3 is formed by recessing inwards from the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13, and the groove 3 comprises a first groove 31 and a second groove 32.
S2, connecting the first substrate 11, the second substrate 12 and the third substrate 13, so that the first groove 31 is filled with an adhesive or solder, and the adhesive or solder filled in the first groove 31 is in contact with at least two of the first substrate 11, the second substrate 12 and the third substrate 13.
S3, coating the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13 with the coating 2 such that at least part of the coating 2 is located within the second recess 32, the coating 2 comprising a color additive selected from at least one of an organic pigment, an inorganic pigment and a dye.
In the manufacturing method provided by the application, since the groove 3 is provided on at least one of the first substrate 11, the second substrate 12 and the third substrate 13, the groove 3 includes the first groove 31 and the second groove 32. When the first, second and third substrates 11, 12 and 13 are connected, the first groove 31 can accommodate more adhesive or solder for connecting at least two of the first, second and third substrates 11, 12 and 13, so that the connection between at least two of the first, second and third substrates 11, 12 and 13 is more reliable, that is, the connection between at least two of the header 103, the heat exchange tube 101 and the fin 102 is more reliable. When the coating is applied, the coating 2 is at least partially located within the second recess 32, the second recess 32 being capable of increasing the bonding force of the coating 2 to at least one of the first substrate 11, the second substrate 12 and the third substrate 13. Therefore, according to the manufacturing method provided by the application, the heat exchanger with reliable connection among the heat exchange tube 101, the fins 102 and the collector tube 103 and firm combination of the coating 2 and the heat exchanger matrix can be manufactured.
In some embodiments, the grooves 3 are formed by sand blasting. That is, the present application prepares the first substrate 11 and the second substrate 12 having grooves on the surfaces thereof by a sand blasting process, and then performs a step of joining the first substrate 11 and the second substrate 12, and a step of coating at least one of the first substrate 11 and the second substrate 12 with a coating.
In some embodiments, as shown in fig. 12, step S1, i.e., providing the first substrate 11 and the second substrate 12, includes the steps of:
s11, providing a substrate, wherein the substrate comprises a first substrate for forming a first matrix 11 and a second substrate for forming a second matrix 12;
and S12, carrying out sand blasting on the outer surface of at least one of the first substrate and the second substrate.
In some embodiments, at least one of the first substrate and the second substrate has a size larger than its corresponding matrix, and thus, step S1, i.e., providing the first matrix 11 and the second matrix 12, further includes the steps of:
s13, cutting at least one of the first substrate and the second substrate, as shown in FIG. 12.
The benefits of grit blasting include, in a first aspect, the removal of residual oxide layers, oil stains, etc. from the substrate surface, resulting in a cleaner metal substrate surface. In the second aspect, the abrasive blasting and polishing effects are beneficial to forming a better micro rough surface structure on the surface of the substrate, so that the binding force of the subsequent coating materials and other coating materials is increased, and the leveling and decoration of the coating are facilitated. In the third aspect, the cutting and impact of the sand blasting strengthens the mechanical properties of the surface of the metal substrate, and improves the fatigue resistance of the metal substrate. In the fourth aspect, irregular structures such as burrs on the surface of the metal substrate can be removed by sand blasting, and small fillets are manufactured on the surface of the metal substrate, so that the surface of the metal substrate is smoother and more attractive, and the subsequent treatment is facilitated. After sand blasting treatment, the surface structure morphology of the metal substrate is changed, and the metal grains are finer and denser. After sand blasting treatment, more hydroxyl groups are formed on the surface of the metal substrate, and in the subsequent process of connecting the functional film layers, the hydroxyl groups of the functional film layers are dehydrated and condensed with the hydroxyl groups of the metal substrate, so that the functional film layers and the metal substrate can be connected through covalent bonds, the covalent bond connection mode is relatively stable, and the durability of connection with the functional film layers is improved.
In addition, the processing mode of the sand blasting process has the characteristics of high efficiency, low cost and suitability for cleaning the large surface area of the metal substrate, and furthermore, the abrasive materials adopted in the sand blasting process can be recycled, so that the cost can be further reduced.
Step S1 will be described below by taking a microchannel heat exchanger as an example.
In some embodiments, step S1, i.e. providing the first substrate 11, the second substrate 12 and the third substrate 13, comprises the steps of:
s11, providing a substrate, wherein the substrate comprises a first substrate for forming a first matrix 11, a second substrate for forming a second matrix 12 and a third substrate for forming a third matrix 13;
and S12, carrying out sand blasting on the outer surface of at least one of the first substrate, the second substrate and the third substrate.
In some embodiments, the length, thickness and width of the first substrate are the same as those of the first substrate 11, and the first substrate 11 is obtained after sandblasting the first substrate. In some embodiments, the thickness, width and length of the second substrate are the same as those of the second substrate 12, and the second substrate 12 is obtained after sandblasting the second substrate. In some embodiments, the length, outer diameter, and inner diameter of the third substrate are the same as the third substrate 13, and the third substrate 13 is obtained after sandblasting the third substrate.
In other embodiments, the length of the first substrate is greater than the length of the first substrate 11, the length of the second substrate is greater than the length of the second substrate 12, and the length of the third substrate is greater than the length of the third substrate 13. To obtain the first, second, and third substrates, the first, second, and third substrates need to be cut.
In some embodiments, step S1, i.e. providing the first substrate 11, the second substrate 12 and the third substrate 13, further comprises the steps of:
s13, cutting at least one of the first substrate, the second substrate and the third substrate.
As such, the first substrate and the first base 11 are made to have the same dimensions (e.g., length, width, and thickness), the second substrate and the second base 12 are made to have the same dimensions (e.g., length, width, and thickness), and the third substrate and the third base 13 are made to have the same dimensions (e.g., length, outer diameter, and inner diameter).
In some embodiments, the first substrate has the same thickness and width as the first matrix 11, and the first substrate has the same internal structure as the first matrix 11, and all structural parameters of the first substrate are the same as the first matrix 11 (as shown in fig. 7) except that the first substrate has a length greater than the first matrix 11, and providing the first matrix 11 further comprises: the first base material is cut so that the length of the first base material is the same as the length of the first base body 11. The thickness direction of the first substrate refers to the X direction shown in fig. 1 and 2, and the width direction of the first substrate refers to the Y direction in fig. 2.
In some embodiments, the first substrate has an interior cavity and an opening, the interior cavity of the first substrate is in communication with the exterior of the first substrate through the opening, the interior cavity of the first substrate is for forming an interior cavity of the heat exchange tube 101 for the passage of a cooling fluid or coolant, and the interior cavity of the first substrate includes a plurality of channels that may be used to form a plurality of micro-channels of the heat exchange tube 101. In some embodiments, the openings of the first substrate are plugged prior to grit blasting the outer surface of the first substrate. In this way, the passage of abrasive for blasting through the opening into the interior cavity of the first substrate can be reduced.
In some embodiments, the second substrate has the same thickness and width as the second matrix 12, and all structural parameters of the second substrate are the same as the second matrix 12 (as shown in fig. 8) except that the second substrate has a length greater than the second matrix 12, and providing the second matrix 12 further comprises: the second substrate 12 is cut so that the length of the second substrate is the same as the length of the second base 12. The thickness direction of the second substrate refers to the X direction shown in fig. 1 and 2, and the width direction of the second substrate refers to the Y direction in fig. 2.
In some embodiments, the outer diameter and inner diameter of the third substrate are both the same as the third matrix 13, and the third substrate has the same internal structure as the third matrix 13, and all structural parameters of the third substrate are the same as the third matrix 13 except that the length of the third substrate is greater than the third matrix 13, and providing the third matrix 13 further comprises: the third base material is cut so that the length of the third base material is the same as the length of the third base 13.
In some embodiments, the third substrate has an interior cavity and an opening, the interior cavity of the third substrate is in communication with the exterior of the third substrate through the opening, the interior cavity of the third substrate is for forming an interior cavity of the manifold 103 for the circulation of a cooling fluid or coolant. In some embodiments, the openings of the third substrate are plugged prior to grit blasting the outer surface of the third substrate. In this way, the passage of abrasive for blasting through the opening into the interior cavity of the third substrate can be reduced.
The step of cutting the first substrate, the second substrate, and the third substrate may be performed before or after the blasting. Taking the first substrate being processed into the first base body 11 as an example, the thickness and the width of the first substrate are the same as those of the first base body 11, the outer surface of the first substrate can be firstly subjected to sand blasting treatment, and then the first base body subjected to sand blasting treatment is cut according to the length of the first base body 11 to obtain the first base body 11; alternatively, the first base material subjected to the blast treatment is cut according to the length of the first base material, and then the blast treatment is performed on the cut first base material to obtain the first base material 11.
In some embodiments, step S12, i.e., blasting the outer surface of at least one of the first substrate, the second substrate, and the third substrate, comprises: the abrasive is mixed in the compressed air and sprayed through the spray gun toward the outer surface of at least one of the first substrate, the second substrate, and the third substrate. Further, the abrasive may be sand of corundum material, such as brown corundum, white corundum, black corundum, garnet, etc. The abrasive may also be a grit of the silicon carbide class, such as black silicon carbide, green silicon carbide, and the like. Of course, when selecting the abrasive, other kinds of grits may be selected, such as glass beads, steel shot, steel grit, ceramic grit, resin grit, walnut grit, etc.
In some embodiments, the abrasive has a particle size between 30 mesh and 280 mesh. Specifically, the abrasive may have a particle size of 30 mesh, 50 mesh, 80 mesh, 120 mesh, 150 mesh, 180 mesh, 200 mesh, 220 mesh, 250 mesh, 280 mesh, or the like. The grain size selection of the abrasive can affect the construction of the rough surface of the metal substrate, when the grain size of the abrasive is relatively large, the rough surface of the metal substrate can be finer, and when the grain size is too large, the roughness of the rough surface can be difficult to ensure. When the particle size is too small, the rough surface with a certain roughness is constructed relatively slowly, and the rough effect is poor. In some embodiments, the abrasive may have a particle size ranging between 100 mesh and 200 mesh. Thus, the grain size of the abrasive is not too large or too small, and accordingly, a more ideal rough surface structure is easier to obtain.
In some embodiments, the distance between the spray gun and the spray location corresponding to the outer surface of at least one of the first substrate, the second substrate, and the third substrate is between 20mm and 100 mm. Specifically, the distance between the spray nozzle of the spray gun and the corresponding spray position on the outer surface of the heat exchanger is simply recorded as the sand blasting distance, the sand blasting distance is too short, pits are easy to appear on the surface of the metal substrate, the overall rough surface appearance is poor, the sand blasting distance is too long, the impact force of the abrasive is poor, and the surface morphology degree of the metal substrate is poor. The blasting distance may be selected from 20mm, 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm, 100mm, etc. in the present application. In some embodiments, the grit blast distance may be between 50mm and 100 mm.
In some embodiments, the spray angle α of the spray gun satisfies 0 < α+.90 °. The injection angle of the spray gun refers to an included angle between the incident direction of the abrasive and a plane of the outer surface of at least one of the first substrate, the second substrate and the third substrate, and specifically, the injection angle α of the spray gun is 15 °, 30 °, 45 °, 60 °, 75 °, 90 ° and so on. The spray angle alpha of the spray gun is too small, the interference angle between the metal base material and the abrasive is small, a rough surface is difficult to form, and the spray angle alpha of the spray gun can be an acute angle smaller than or equal to 90 degrees. In some embodiments of the present application, the spray angle α of the spray gun is 45 °.
In some embodiments, the pressure of the compressed air is between 0.45MPa and 0.65MPa, specifically, the pressure of the compressed air is between 0.45MPa, 0.5MPa, 0.55MPa, 0.6MPa, 0.65MPa. Because the collecting pipe, the fins and the heat exchange pipe of each part of the heat exchanger are made of aluminum materials, and correspondingly, the aluminum materials are relatively soft, the pressure of compressed air cannot be excessive, otherwise, the parts are easy to damage. Of course, the pressure of the compressed air cannot be too low, otherwise it is difficult to form a rough surface. In some embodiments of the present application, the pressure of the compressed air is 0.45MPa.
In some embodiments, the outer surface of at least one of the first substrate, the second substrate, and the third substrate may be sandblasted using a sandblasting machine.
In some embodiments, as shown in fig. 13, an outer surface of at least one of the first substrate 11 and the second substrate 12 is provided with solder, and step S2, connecting the first substrate 11 and the second substrate 12, includes the steps of:
s21, assembling the first substrate 11 and the second substrate 12;
s22, heating the first substrate 11 and the second substrate 12 to melt the solder;
s23, cooling the first substrate 11 and the second substrate 12 to solidify the solder.
In other embodiments, as shown in fig. 14, step S2, i.e., connecting the first substrate 11 and the second substrate 12, includes the steps of:
s21', coating an adhesive on at least one of the first substrate 11 and the second substrate 12;
s22' assembling the first base 11 and the second base 12;
s23', curing the adhesive.
Assembling the first base 11 and the second base 12 means that the first base 11 and the second base 12 are placed in the heat exchanger 100 according to their positions.
Step S2 will be described below by taking the microchannel heat exchanger described above as an example. In some embodiments, in step S2, the first substrate 11, the second substrate 12, and the third substrate 13 are connected by an adhesive or solder. For the connection of the first substrate 11 and the second substrate 12, the first substrate 11 may be connected to the second substrate 12 by solder or adhesive. For example, all of the first substrates 11 may be connected to the second substrate 12 by solder, or all of the first substrates 11 may be connected to the second substrate by an adhesive, or a part of the first substrates 11 may be connected to the second substrate 12 by solder, another part of the first substrates 11 may be connected to the second substrate 12 by an adhesive, or some of the plurality of first substrates 11 may be connected to the second substrate 12 by solder, and some other of the plurality of first substrates 11 may be connected to the second substrate 12 by an adhesive. Likewise, the connection of the first substrate 11 to the third substrate 13, and the connection of the second substrate 12 to the third substrate 13, can be made in a variety of ways.
In some embodiments, at least one of the first substrate 11, the second substrate 12, and the third substrate 13 is coated with solder, and step S2, that is, connecting the first substrate 11, the second substrate 12, and the third substrate 13, includes:
s21, assembling the first substrate 11, the second substrate 12 and the third substrate 13;
s22, heating the first substrate 11, the second substrate 12 and the third substrate 13 to melt the solder;
s23, cooling the first substrate 11, the second substrate 12, and the third substrate 13 to solidify the solder.
For example, when the first substrate 11, the second substrate 12, and the third substrate 13 are connected, first, solder is coated on the second substrate 12 and the third substrate 13, and the groove 3 is provided on the first substrate 11. Then, the first substrate 11, the second substrate 12, and the third substrate 13 are assembled, and then the first substrate 11, the second substrate 12, and the third substrate 13 are put into a heating furnace to be heated, so that the solder is melted and filled into the first grooves 31 provided in the first substrate 11. The solder filled in the first recess 31 recessed from the first sub-surface 111 toward the inside of the first substrate 11 is in contact with the first substrate 11 and the second substrate 12, and this solder is used to achieve connection of the first substrate 11 and the second substrate 12. The solder filled in the first groove 31 recessed from the second sub-surface 112 toward the inside of the first substrate 11 is in contact with the first substrate 11 and the third substrate 13, and this solder is used to achieve connection of the first substrate 11 and the third substrate 13. In the present application, the first face 111, the second face 112, the first sub-face 1111, and the second sub-face 1112 are not areas divided in advance before the first base 11, the second base 12, and the third base 13 are assembled, but are areas defined according to the relative positional relationship of the first base 11 and the second base 12, and the relative positional relationship of the first base 11 and the third base 13 after the first base 11, the second base 12, and the third base 13 are assembled. For example, the area of the outer surface of the side wall 110 of the first base 11 for connection with the second base 12 is defined as a first sub-face 1111, and the area of the outer surface of the side wall 110 of the first base 11 for connection with the third base 13 is defined as a second sub-face 1112.
The solder may be melted by heating the first substrate 11, the second substrate 12, and the third substrate 13 in a heating furnace after the first substrate, the second substrate, and the third substrate are integrally assembled. In the present application, the grooves provided on the outer surface of at least one of the first substrate 11, the second substrate 12, and the third substrate 13 are not affected by the blast treatment at a high temperature in a temperature range where the solder melts, or in a temperature range where the solder passes through the furnace, that is, the roughness of the outer surfaces of the first substrate 11, the second substrate 12, and the third substrate 13 on which the grooves are formed is kept substantially unchanged before and after the passage through the furnace.
In other embodiments, step S2, i.e. connecting the first substrate 11, the second substrate 12 and the third substrate 13, comprises:
s21' coating an adhesive on at least one of the first substrate 11, the second substrate 12, and the third substrate 13;
s22' assembling the first base 11, the second base 12, and the third base 13;
s23', curing the adhesive.
For example, when the first substrate 11, the second substrate 12, and the third substrate 13 are connected, first, the adhesive is coated on the second substrate 12 and the third substrate 13, and the groove 3 is provided on the first substrate 11. The first substrate 11, the second substrate 12 and the third substrate 13 are then assembled such that at least part of the adhesive provided on the second substrate 12 and the third substrate 13 flows into the first recess 31 provided on the first substrate 11 before the adhesive cures. The adhesive filled in the first groove 31 recessed from the first sub-surface 111 toward the inside of the first substrate 11 is in contact with the first substrate 11 and the second substrate 12, and this adhesive is used to connect the first substrate 11 and the second substrate 12. The adhesive filled in the first groove 31 recessed from the second sub-surface 112 toward the inside of the first substrate 11 is in contact with the first substrate 11 and the third substrate 13, and this adhesive serves to connect the first substrate 11 and the third substrate 13. The manner in which the adhesive cures varies depending on the type of adhesive, for example, some adhesives may be cured by natural air drying.
In some embodiments, as shown in fig. 15, step S3, that is, coating the outer surface of at least one of the first substrate 11 and the second substrate 12 with the coating 2, includes the steps of:
s31 providing a composite material for forming the coating layer 2, the composite material comprising a color additive selected from at least one of an organic pigment, an inorganic pigment and a dye;
and S32, coating the composite material on at least part of the outer surface of at least one of the first substrate 11 and the second substrate 12, and curing to form the coating 2.
Step S3 will be described below by taking the microchannel heat exchanger described above as an example. In some embodiments, step S3, i.e. coating the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13 with the coating 2, comprises the steps of:
s31 providing a composite material for forming the coating layer 2, the composite material comprising a color additive selected from at least one of an organic pigment, an inorganic pigment and a dye;
and S32, coating the composite material on at least part of the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13, and curing to form the coating 2.
In some embodiments, the composite material comprises 90-99 parts of a sol and 1-10 parts of a color additive, wherein the sol comprises an alcohol solvent, and the proportion of the alcohol solvent in the sol is 15% -30%.
In some embodiments, the sol contains silica nanoparticles, wherein at least a portion of the silica nanoparticle surface is bound with functional groups- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 And hydroxy-OH. Surface functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 The silica nanoparticles are uniformly dispersed in the sol, so that the silica nanoparticles in the formed coating are also uniformly dispersed, and the uniformity and consistency of the coating are improved. The hydroxyl-OH makes the silica nano particles hydrophilic, so that the colored coating has hydrophilic, water on the surface of the coating is easy to discharge, a large amount of water is reduced to gather on the surface of the coating, the erosion of impurities in the water to the coating can be reduced, and the coating can keep strong adhesion to a substrate permanently. In some embodiments, at least a portion of the silica nanoparticles have a particle size of 55 to 65nm. In some embodiments, the sol comprises an alcohol-soluble sol comprising silica nanoparticles having a surface bound with functional groups- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 And hydroxy-OH. The alcohol-soluble sol means that colloidal particles are dispersed in an alcohol solvent.
In some embodiments, the sol contains titanium dioxide nanoparticles. The addition of the titanium dioxide nano particles enables the silicon dioxide and the titanium dioxide to form a binary oxide system in the sol, and the interaction and substitution of titanium and silicon atoms with different coordination states can stabilize Ti-O and Si-O structures, so that the adhesive force of the sol is enhanced, and the hydrophilic performance of the coating is improved. In some embodiments, at least a portion of the titanium dioxide nanoparticles have a particle size of 5 to 10nm.
In some embodiments, step 31, i.e. providing a composite material for forming the coating 2, comprises the steps of:
s311, preparing sol, wherein the sol comprises an alcohol solvent, and the proportion of the alcohol solvent in the sol is 15% -30%;
s312, mixing 90-99 parts of the sol with 1-10 parts of color additives according to parts by mass to obtain the composite material.
The preparation method of the composite material and the composite material are based on the same inventive concept, and the description of the composite material can be referred to for relevant characteristics of the composition, the proportion and the like of the raw materials of the composite material, and the description is omitted herein.
The above-mentioned manner of mixing the sol with the color additive includes, but is not limited to, mechanical mixing, and in other embodiments, various conventional mixing manners well known in the art, such as ultrasonic mixing or a combination of mechanical mixing and ultrasonic mixing, etc., which are not particularly limited in this application, and the sol can be uniformly mixed with the color additive.
In some embodiments, step S311, i.e., preparing the sol, comprises the steps of: 34-36 parts of alcohol-soluble silica sol, 55-57 parts of water-soluble silica sol and 4-6 parts of titanium dioxide sol are weighed according to parts by mass, the pH is regulated to 3.0-4.0 by 3-5 parts of pH regulator, and the mixture is stirred in a water bath at 40-60 ℃ for 3-5 hours. The alcohol-soluble sol refers to a sol in which colloidal particles are distributed in an alcohol solvent, and the water-soluble sol refers to a sol in which colloidal particles are distributed in water. In some embodiments, the titania sol is a water-soluble sol or an alcohol-soluble sol.
In some embodiments, the silica nanoparticles in the water-soluble silica sol have a particle size of 55 to 65nm and a solids content of 45% to 55%. In some embodiments, the particle size of the silica nanoparticles in the alcohol-soluble silica sol is smaller than the particle size of the silica nanoparticles in the water-soluble silica sol. In some embodiments, the silica nanoparticles in the silica sol have a particle size of 60nm and a solids content of 50%. In some embodiments, the PH of the water-soluble silica sol is 9.
In some embodiments, the alcohol-soluble silica sol may be prepared by: weighing 50-56 parts of alcohol solvent and 0.5-1.5 parts of surfactant according to parts by mass, and performing ultrasonic dispersion for 5-15 min; adding 36-40 parts of silane precursor, mixing in water bath at 40-60 ℃ for 20-40 min, and stirring at 200-300 rpm; dropwise adding 5-7 parts of water and 0.5-2 parts of pH regulator, controlling the completion of dropwise adding within 5-15 min, and carrying out water bath reaction for 22-26 h to obtain alcohol-soluble silica sol, wherein at least part of silane precursor contains functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 。
In some embodiments, the alcohol solvent includes an alcohol solvent having 1 to 10 carbon atoms, preferably an alcohol solvent having 1 to 8 carbon atoms, and more preferably an alcohol solvent having 1 to 4 carbon atoms. Further, in some embodiments, the solvent is any one or a mixture of any two or more of methanol, ethanol, isopropanol, benzyl alcohol, and ethylene glycol in any ratio. Therefore, the method has wide sources, is easy to obtain and has lower cost.
In some embodiments, the surfactant includes, but is not limited to, at least one of sodium dodecyl sulfate, sodium dodecyl sulfonate, sodium dodecyl benzene sulfonate, and hexadecyl benzene sulfonate. Further, in some embodiments, the surfactant is sodium dodecyl sulfate. Therefore, the cost is lower, the source is wide, and the use effect is good.
In some embodiments, the silane precursor includes glycidyl ether oxypropyl trimethoxysilane (KH-560 for short) and ethyl orthosilicate. Thus, the surface of the silica nanoparticle contained in the prepared sol is combined with a functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 And hydroxy-OH. In other embodiments, other types of silane precursors may also be used.
In some embodiments, the pH adjuster comprises an organic acid or an inorganic acid. In some embodiments, the pH adjuster includes, but is not limited to, at least one of formic acid, acetic acid. Further, in some embodiments, the pH adjuster is formic acid.
The alcohol-soluble silica sol prepared by the method can be represented by the following equation or reaction mechanism:
1) Hydrolysis condensation of ethyl orthosilicate: si (OCH) 2 CH 3 ) 4 +2H 2 O→SiO 2 +4C 2 H 5 OH。
2) KH560 hydrolysis: R-Si (OCH) 3 ) 3 +3H 2 O→R-Si(OH) 3 +CH 3 OH
KH560 polycondensation: R-Si (OH) 3 +R-Si(OH) 3 →R-Si(OH) 2 -O-Si(OH) 2 -R+H 2 O
R-Si(OH) 3 +R-Si(OCH 3 ) 3 →R-Si(OH) 2 -O-Si(OH) 2 -R+CH 3 OH
Wherein R represents a long chain group- (CH) in KH560 2 ) 3 -O-CH 2 -CH-OCH 2 KH560 has the following structural formula (I):
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3) Condensation of KH560 with silicon hydroxyl: R-Si (OH) 3 +Si(OH) 4 →R-Si(OH) 2 -O-Si(OH) 3 +H 2 O。
The silica nano particles in the sol prepared by the application are combined with a functional group- (CH) on the surface through in-situ synthesis 2 ) 3 -O-CH 2 -CH-OCH 2 The silicon dioxide nano particles in the coating formed by the composite material are uniformly distributed, so that the uniformity and consistency of the coating are improved. The alcohol-soluble silica sol prepared by the method can be independently formed into a film on the surface of a substrate. Because the surface of the silicon dioxide nano particle contains a large number of hydroxyl (-OH) hydrophilic groups, the hydroxyl groups are dehydrated and condensed to form a space network structure. Since the silica sol is an alcohol-soluble sol prepared by an alcohol solvent, the alcohol solvent can uniformly disperse the color additive. In the process of forming the colored coating of the composite material, the silica sol is dehydrated and condensed to enable the pigment to be formed The color additive and the silicon dioxide nano particles are uniformly adhered to the surface of the substrate to form a colored coating with strong adhesion, uniform film thickness and color and good durability. In addition, the hydroxyl groups on the surfaces of the silicon dioxide nano particles enable the coating to show hydrophilicity, enhance the drainage effect of the colored coating, reduce the erosion of impurities in the outside water or air to the coating, and further improve the durability of the colored coating.
In some embodiments, before step S2 (i.e. connecting the first substrate 11 and the second substrate 12), or before step S3 (i.e. coating the outer surface of at least one of the first substrate 11 and the second substrate 12), the following steps are further included:
s41, performing ultrasonic cleaning treatment on at least one of the first substrate 11 and the second substrate 12;
s42, drying at least one of the first substrate 11 and the second substrate 12 after ultrasonic cleaning treatment.
Step S41 may clean the abrasive remaining on the outer surface of at least one of the first base 11 and the second base 12, reducing the remaining of the abrasive on the outer surfaces of the first base 11 and the second base 12.
Steps S41 and S42 will be described below taking the microchannel heat exchanger described above as an example. In some embodiments, before step S2 (i.e. connecting the first substrate 11, the second substrate 12 and the third substrate 13), or before step S3 (i.e. coating the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13), the following steps are further included:
S41, performing ultrasonic cleaning treatment on at least one of the first substrate 11, the second substrate 12 and the third substrate 13;
s42, drying at least one of the first substrate 11, the second substrate 12 and the third substrate 13 after ultrasonic cleaning treatment.
Step S41 may clean the abrasive remaining on the outer surface of at least one of the first, second, and third substrates 11, 12, and 13 to prevent the abrasive remaining on the outer surface of the first, second, or third substrates 11, 12, or 13 from affecting the heat exchange efficiency of the heat exchanger and the application of the subsequent coating.
To facilitate an understanding of the present invention, a number of experimental runs were made. In order to facilitate performance detection, the first base material used for forming the heat exchange tube is subjected to sand blasting, and the outer surface of the first base material subjected to sand blasting is coated with a color coating.
Example 1
Step 1 Sand blasting
And obtaining a first base material, wherein the width and the thickness of the first base material are the same as those of the heat exchange tube, and the internal structure of the first base material is the same as that of the heat exchange tube. The outer surface of the first substrate is relatively smooth.
And sealing the opening of the first substrate by using sealant to prevent abrasive materials from entering the inner cavity in the sand blasting process, and then putting the sealed first substrate into a sand blasting machine for sand blasting treatment to obtain a first substrate (sand blasting heat exchange tube). The grain diameter of the abrasive is 120 meshes, the pressure of the compressed air is 0.45MPa, the sand blasting angle is 45 degrees, namely, the included angle between the spraying direction and the outer surface of the first base material is 45 degrees, and the distance between the spray gun and the first base material during sand blasting is 50mm.
And (3) carrying out sand blasting on the first substrate, then carrying out spray washing on the first substrate by using absolute ethyl alcohol, removing abrasive materials remained on the surface, and then naturally airing or drying at 40 ℃.
Step 2 coating
Step 2.1 preparation of composite Material
In this embodiment, the sol includes an alcohol-soluble silica sol, a water-soluble silica sol, and a titania sol. Wherein the alcohol-soluble silica sol is prepared by self, and is transparent sol from the appearance, and the content of absolute ethyl alcohol in the alcohol-soluble silica sol is approximately 54%. Both the water-soluble silica sol and the titanium dioxide sol are commercial products, and the titanium dioxide sol is also the water-soluble sol. Wherein, the particle diameter of colloid particles in the water-soluble silica sol is 55-65 nm, the solid content is about 50%, and the pH value is 9. The particle size of the colloid particles in the titanium dioxide sol is 5-10 nm, and the solid content of the titanium dioxide sol is about 3%. The color additive is pigment red 254, which is commercially available, and the chemistry is thatThe composition is C 18 H 10 Cl 2 N 2 O 2 。
2.1.1 preparation of sols
According to the mass parts, 54 parts of absolute ethyl alcohol and 1 part of sodium dodecyl sulfate are ultrasonically dispersed for 10min; adding 31 parts of KH-560 and 7 parts of ethyl orthosilicate, mechanically stirring for 30min at a water bath condition of 50 ℃ and a stirring speed of 250rpm, then dripping 6 parts of water and 1 part of formic acid into the system, controlling the dripping to be finished for 10min, and reacting for 24h at a water bath condition of 50 ℃ to obtain alcohol-soluble silica sol, wherein the surfaces of silica nanoparticles contained in the alcohol-soluble silica sol are combined with functional groups- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 And hydroxy-OH.
Mixing 35 parts of the prepared alcohol-soluble silica sol, 56 parts of the water-soluble silica sol and 5 parts of the water-soluble titanium dioxide sol uniformly, regulating the pH value of a system to about 3.0 by adopting 4 parts of a pH value regulator formic acid, and stirring and reacting for about 4 hours under the water bath condition of about 50 ℃ to obtain the sol. After mixing, the ratio of absolute ethanol in the mixed sol was about 24%, wherein the ratio of absolute ethanol added during the preparation of the alcohol-soluble sol was 18.9%.
2.1.2 mixing the Sol with color additives
According to the mass parts, 95 parts of sol and 5 parts of red pigment are mechanically mixed for 20min, and sand grinding is carried out for 30min by using a sand mill, so that the composite material is obtained.
Step 2.2 formation of coating
Spraying the composite material prepared in the step 2.1 on the first substrate which is obtained in the step 1 and is subjected to sand blasting treatment, but the surface of the first substrate is not covered with the coating, namely coating the composite material on the surface of the first substrate in a spraying mode, and curing the composite material in a baking oven at 200 ℃ for 30min after the dip-coating is finished, so as to obtain a sample with a red coating on the surface.
Examples 2 to 7
Examples 2 to 7 differ from example 1 in the kind of the color additive and/or the parts by weight of the sol to the color additive, and the rest of examples 2 to 7 are the same as example 1.
In practiceIn example 2, 95 parts of the sol and 5 parts of pigment green 7 were mixed, the main chemical composition of pigment green 7 being C 32 Cl 16 CuN 8 。
In example 3, 95 parts of sol and 5 parts of pigment blue 15:3 mixing, pigment blue 15:3 has the main chemical composition of C 32 H 16 CuN 8 。
In example 4, 95 parts of the sol and 5 parts of pigment violet 23 are mixed, the main chemical composition of pigment violet 23 being C 35 H 23 Cl 2 N 3 O 2 。
In example 5, 92 parts of sol and 8 parts of gold color pigment are mixed, wherein the gold color pigment is a mixture of mica, titanium dioxide, tin dioxide, and ferric oxide.
In example 6, 90 parts of sol and 10 parts of pigment orange 64 are mixed, the main chemical composition of pigment orange 64 being C 12 H 10 N 6 O 4 。
In example 7, 90 parts of sol and 10 parts of pigment yellow 191 are mixed, the main chemical composition of pigment yellow 191 being C 17 H 13 CaClN 4 O 7 S 2 。
Comparative example 1
In the actual production process of the heat exchanger, in order to realize the assembly of the heat exchange tube, the fins and the collector, the outer surfaces of the fins and the collector are covered with solder, and in order to melt the solder, the heat exchange tube, the fins and the collector are required to be heated. In order to simulate the actual production process of the heat exchanger to examine whether the process of heating by the furnace would affect the roughness of the blasting surface, samples were prepared in the method of this comparative example.
This comparative example differs from example 1 in that the first substrate was subjected to furnace heating after step 1 and before step 2. Specifically, in this embodiment, the following steps are further included after step 1 and before step 2: heating the first matrix at 580-620 deg.c for 40-60 min.
Comparative example 2
In order to examine whether the order of the blasting and the furnace-passing heating steps would affect the roughness of the blasted surface, the present comparative example put the heating step in comparative example 1 before step 1 (i.e., blasting).
The present comparative example is different from comparative example 1 in that the first substrate was heated first, and then the first substrate subjected to the heat treatment was subjected to the blast treatment, and the rest of the present comparative example was the same as comparative example 1.
Performance testing
1. Roughness test
FIG. 16 is a scanning electron microscope image of the surface of the first substrate subjected to the sand blasting treatment in example 1. As can be seen from fig. 16, the sand blasting treatment roughens the outer surface of the first substrate.
The surface roughness of the first substrate which was not subjected to the blast treatment, the first substrate which was subjected to the blast treatment only in example 1, the first substrate which was subjected to the blast treatment and the blast treatment in comparative example 1, and the first substrate which was subjected to the blast treatment and the blast treatment in comparative example 2 were each examined.
The surface roughness of the first substrate without sandblasting was 0.2047. The surface roughness of the first substrate subjected to only the blast treatment in example 1 was 2.7600. The surface roughness of the first substrate after the blast treatment and the furnace heating in this order in comparative example 1 was 2.8368. The surface roughness of the first substrate after the furnace heating and the blast treatment in this order in comparative example 2 was 2.8369.
It follows that the furnace-passing heating, whether performed before or after the blasting, does not have a great influence on the surface roughness of the blasted first substrate.
2. Adhesion test
The test samples of examples 1 to 7 were subjected to the grippy test. The griffe test is to cut and penetrate the coating on the substrate in a lattice pattern, and the patterns after the cutting are classified according to six grades, so as to evaluate the separation resistance of the coating from the substrate.
Gritty test ISO grade:
level 0: the edges of the cuts were perfectly smooth and the edges of the grids did not peel off any;
stage 1: the small piece is peeled off at the intersection of the cuts, and the actual breakage in the scribing area is not more than 5%;
2 stages: the edges and/or the intersections of the cuts are peeled off, and the peeled off area is 5% -15% of the cross-cut area;
3 stages: part of the grids are peeled off or peeled off in whole along the edges of the notch, and/or part of the grids are peeled off in whole, and the peeled area is 15% -35% of the cross-cut area;
4 stages: the edges of the notch are peeled off in large pieces and/or some square lattices are peeled off partially or completely, and the peeled area is 35% -65% of the cross-cut area;
5 stages: exceeding the previous level.
The test samples of examples 1-7 all have a grippy test ISO rating of 0. It can be seen that the colored coating of the present application has a strong adhesion to the substrate.
3. Coating thickness test
The coating thicknesses of examples 1 to 7 were measured by a high-precision chart plating thickness gauge, and the results are shown in Table 1.
TABLE 1 coating thicknesses for examples 1-7
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 | |
| Thickness (μm) | 11.9 | 14.0 | 15.7 | 14.3 | 15.0 | 8.1 | 10.1 |
From the results in Table 1, it is clear that the thickness of the colored coating formed by curing on the surface of the heat exchanger is in the range of 8 to 16. Mu.m, and the effect of the thinner colored coating on the heat exchange efficiency of the heat exchanger is small.
The application also carries out film thickness uniformity test on the colored coating on the surface of the sample prepared in the example 1 and the example 5, and the specific test method is as follows: 10 test points are randomly selected on the surface of the sample with the colored coating, and film thickness tests are respectively carried out.
The thickness of the red coating measured at the test point on the sample surface of example 1 was: 11.2 μm, 10.2 μm, 10.1 μm, 11.8 μm, 10.4 μm, 9.6 μm, 10.5 μm, 9.4 μm, 9.7 μm, 9.5 μm, 10.2 μm. The average film thickness was 10.2. Mu.m, and the standard deviation was 0.736. Mu.m.
The gold color coating thickness measured by the test points on the surface of the sample of example 5 was: 11.8 μm, 12.0 μm, 11.3 μm, 11.1 μm, 12.8 μm, 12.1 μm, 12.8 μm, 11.2 μm, 10.3 μm, 12.6 μm, 11.8 μm. The average film thickness was 11.8. Mu.m, and the standard deviation was 0.782. Mu.m.
From the test results, the color additives and the fillers in the composite material are uniformly distributed in the coating, so that the thickness of the colored coating on the surface of the sample has good consistency, and the adhesive force is strong and the consistency is good.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A heat exchanger, characterized in that: the heat exchanger comprises a substrate and a coating, wherein the coating is coated on at least part of the surface of the substrate,
The substrate includes a first substrate and a second substrate, at least one of the first substrate and the second substrate having a groove formed recessed inwardly from an outer surface of at least one of the first substrate and the second substrate;
the groove comprises a first groove and a second groove, wherein an adhesive or solder is filled in the first groove, the adhesive or the solder filled in the first groove is in contact with the first substrate and the second substrate, the coating is covered on the outer surface of at least one of the first substrate and the second substrate, and at least part of the coating is positioned in the second groove;
the coating includes a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
2. The heat exchanger of claim 1, wherein: the substrate comprises a third substrate, and the adhesive or the solder filled in the first groove is in contact with the third substrate; the coating is coated on the outer surface of at least one of the first substrate, the second substrate and the third substrate, and at least part of the coating is positioned in the second groove.
3. The heat exchanger of claim 1, wherein: the heat exchanger comprises a heat exchange tube, fins and a collecting pipe, wherein the first substrate is the heat exchange tube, and the second substrate is the fins or the collecting pipe;
the first substrate is provided with a first groove and a second groove, the outer surface of the first substrate comprises a first surface and a second surface, the first surface is connected with the second surface in a crossing mode, the first substrate is connected with the second substrate through the first surface, at least part of the second surface is covered with the coating, the first substrate is recessed inwards from the first surface to form the first groove, and the first substrate is recessed inwards from the second surface to form the second groove.
4. A heat exchanger according to claim 3, wherein: the first substrate is provided with at least two first surfaces, and at least part of the second surfaces are positioned between two adjacent first surfaces of the same first substrate.
5. A heat exchanger according to claim 3, wherein: the first surface and the second surface are rough surfaces, and the roughness ranges of the first surface and the second surface are 0.5-10 mu m.
6. A method of manufacturing a heat exchanger, the method comprising the steps of:
providing a first substrate and a second substrate, at least one of the first substrate and the second substrate having a groove recessed inwardly from an outer surface of at least one of the first substrate and the second substrate, the groove comprising a first groove and a second groove;
connecting the first substrate and the second substrate, so that an adhesive or solder is filled in the first groove, and the adhesive or the solder filled in the first groove is in contact with both the first substrate and the second substrate;
a coating is applied to at least a portion of an outer surface of at least one of the first substrate and the second substrate such that at least a portion of the coating is positioned within the second recess, the coating including a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
7. The method of manufacturing a heat exchanger according to claim 6, wherein the method of manufacturing comprises the steps of:
providing a third substrate;
and connecting the first substrate, the second substrate and the third substrate so that the adhesive or the solder filled in the first groove is in contact with all of the first substrate, the second substrate and the third substrate.
8. The method of manufacturing according to claim 6, wherein the providing of the first substrate and the second substrate comprises the steps of:
providing a substrate comprising a first substrate for forming the first matrix and a second substrate for forming the second matrix;
and performing sand blasting on the outer surface of at least one of the first substrate and the second substrate.
9. The method of manufacturing according to claim 8, wherein the providing of the first substrate and the second substrate comprises the steps of:
cutting at least one of the first substrate and the second substrate.
10. The method of manufacturing according to claim 6, wherein a coating is provided on at least a part of an outer surface of at least one of the first substrate and the second substrate, comprising the steps of:
providing a composite material for forming the coating, the composite material comprising a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye;
and coating at least part of the outer surface of at least one of the first matrix and the second matrix with the composite material, and curing and forming the coating.
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| WO2024002119A1 (en) * | 2022-07-01 | 2024-01-04 | 杭州三花研究院有限公司 | Heat exchanger and manufacturing method therefor |
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| GB813244A (en) * | 1954-12-17 | 1959-05-13 | Foster Wheeler Ltd | Improvements in the bonding of fins to tubes, plates and the like |
| JP2007051787A (en) * | 2005-08-15 | 2007-03-01 | Mitsubishi Alum Co Ltd | Extruded tube for heat exchanger, and heat exchanger |
| CN103555114A (en) * | 2013-10-25 | 2014-02-05 | 广州慧谷化学有限公司 | Coating composition for hydrophilic treatment of air-conditioning parallel flow heat exchanger |
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| CN112625468A (en) * | 2019-09-24 | 2021-04-09 | 舾蒙新材料科技(上海)有限公司 | Multifunctional composite coating and preparation method thereof |
| CN114479656A (en) * | 2020-11-11 | 2022-05-13 | 杭州三花研究院有限公司 | Coating, preparation method of coating, heat exchanger containing coating and preparation method of heat exchanger |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3561434B1 (en) * | 2016-12-21 | 2023-03-29 | Mitsubishi Electric Corporation | Heat exchanger, method for manufacturing same, and refrigeration cycle device |
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| GB813244A (en) * | 1954-12-17 | 1959-05-13 | Foster Wheeler Ltd | Improvements in the bonding of fins to tubes, plates and the like |
| JP2007051787A (en) * | 2005-08-15 | 2007-03-01 | Mitsubishi Alum Co Ltd | Extruded tube for heat exchanger, and heat exchanger |
| CN103555114A (en) * | 2013-10-25 | 2014-02-05 | 广州慧谷化学有限公司 | Coating composition for hydrophilic treatment of air-conditioning parallel flow heat exchanger |
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