CN115322569A - Polyimide film containing self-lubricating PI microcapsules and preparation method thereof - Google Patents
Polyimide film containing self-lubricating PI microcapsules and preparation method thereof Download PDFInfo
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- CN115322569A CN115322569A CN202211114414.8A CN202211114414A CN115322569A CN 115322569 A CN115322569 A CN 115322569A CN 202211114414 A CN202211114414 A CN 202211114414A CN 115322569 A CN115322569 A CN 115322569A
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- lubricating
- polyimide film
- microcapsules
- self
- film containing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Abstract
The invention discloses a preparation method of a polyimide film containing self-lubricating PI microcapsules, which comprises the following steps: s1, dissolving self-lubricating PI microcapsules: mixing and stirring self-lubricating PI microcapsules and an organic solvent to form a suspension; s2, obtaining a polyamic acid solution: mixing a diamine monomer and a tetracarboxylic dianhydride monomer with the suspension under a stirring state, and carrying out polymerization reaction on the diamine monomer and the tetracarboxylic dianhydride monomer to form a polyamic acid mixture containing self-lubricating microcapsules; s3, preparing a polyimide film: the polyamic acid mixture is converted into a polyimide film through a drying process and a heat treatment process. The polyimide film containing the self-lubricating PI microcapsules and the preparation method thereof can solve the problem of wear failure of the polyimide film in a partially severe friction environment and prolong the service life.
Description
Technical Field
The invention relates to the technical field of polyimide films, in particular to a polyimide film containing self-lubricating PI microcapsules and a preparation method thereof.
Background
Polyimide is one of polymer materials with the best comprehensive performance, and a film product of the polyimide has the properties of lower dielectric constant, good mechanical property, temperature change resistance and the like. In recent years, the method is widely applied to the fields of aerospace, microelectronics, electronic communication, photoelectric display and the like. However, with the gradual expansion of the application field, under a partially severe friction environment, the polyimide film has a wear failure phenomenon because of no excellent self-lubricating property.
At present, the method for reducing the friction coefficient of the polyimide film and improving the self-lubricating property mainly introduces a lubricating material in the preparation process of the polyimide film so as to reduce the friction and the wear of the material. However, both the currently used solid lubricant and liquid lubricant affect the basic properties of the polyimide film, and do not achieve the expected lubricating effect.
Disclosure of Invention
The invention aims to provide a polyimide film containing self-lubricating PI microcapsules and a preparation method thereof, which can solve the problem of wear failure of the polyimide film in a partially severe friction environment and prolong the service life.
In order to realize the aim, the invention provides a preparation method of a polyimide film containing self-lubricating PI microcapsules, which comprises the following steps:
s1, dissolving self-lubricating PI microcapsules: mixing and stirring self-lubricating PI microcapsules and an organic solvent to form a suspension;
s2, obtaining a polyamic acid solution: mixing a diamine monomer and a tetracarboxylic dianhydride monomer with the suspension under stirring, and carrying out polymerization reaction on the diamine monomer and the tetracarboxylic dianhydride monomer to form a polyamic acid mixture containing self-lubricating microcapsules;
s3, preparing a polyimide film: the polyamic acid mixture is converted into a polyimide film through a drying process and a heat treatment process.
Preferably, the particle size of the self-lubricating PI microcapsule is 5-25 mu m.
Preferably, the organic solvent is any one or a combination of several of dimethylformamide, dimethylacetamide, N-methylpyrrolidone and tetrahydrofuran methanol mixed solution.
Preferably, the diamine monomer is any one or combination of p-phenylenediamine, m-phenylenediamine, 4-diaminodiphenylalkane, diaminodiphenyl sulfide and diaminobenzophenone.
Preferably, the tetracarboxylic dianhydride monomer is one or a combination of more of pyromellitic dianhydride, diphenyl ether tetracarboxylic dianhydride, naphthalene dicarboxylic acid glycoside and benzophenone tetracarboxylic dianhydride.
Preferably, the viscosity of the polyamic acid mixture is 1000 to 1500cp.
Preferably, the drying process is performed in a nitrogen atmosphere at a temperature of 200 ℃.
A polyimide film containing self-lubricating PI microcapsules comprises the polyimide film containing self-lubricating PI microcapsules prepared by the method.
The self-lubricating PI microcapsule used in the invention is prepared according to the technical scheme provided by the invention patent with the application number of CN202210179161.6, the application date of 2022, 2 months and 25 days and the name of 'a self-lubricating PI microcapsule and a preparation method thereof'.
Therefore, the polyimide film containing the self-lubricating PI microcapsule and the preparation method thereof in the structure are adopted, the PI microcapsule and the polyimide film are combined, the characteristics of stable thermal expansion coefficient, low static friction coefficient and excellent self-lubricating performance are endowed, the process is simple and convenient, the controllability is good, the performance is optimized, and the production cost is reduced.
The technical solution of the present invention is further described in detail by the following examples.
Detailed Description
The technical solution of the present invention is further illustrated by the following examples.
Examples
A preparation method of a polyimide film containing self-lubricating PI microcapsules comprises the following steps:
s1, dissolving self-lubricating PI microcapsules: and mixing and stirring the self-lubricating PI microcapsules and an organic solvent to form a suspension. The organic solvent is any one or combination of several of dimethylformamide, dimethylacetamide, N-methylpyrrolidone and tetrahydrofuran methanol mixed solution, and is used for completely dispersing the self-lubricating PI microcapsules.
Wherein the particle size of the self-lubricating PI microcapsule is 5-25 mu m. The self-lubricating PI microcapsule used in the invention is prepared according to the technical scheme provided by the invention patent with the application number of CN202210179161.6, the application date of 2022, 2 and 25 months and the name of 'a self-lubricating PI microcapsule and a preparation method thereof'.
S2, obtaining a polyamic acid solution: and mixing the diamine monomer and the tetracarboxylic dianhydride monomer with the suspension under a stirring state, and carrying out polymerization reaction on the diamine monomer and the tetracarboxylic dianhydride monomer to form a polyamic acid mixture containing the self-lubricating microcapsule, wherein the viscosity of the produced polyamic acid mixture is 1000-1500 cp. Wherein the diamine monomer is any one or combination of p-phenylenediamine, m-phenylenediamine, 4-diaminodiphenylalkane, diaminodiphenyl sulfide and diaminobenzophenone; the tetracarboxylic dianhydride monomer is any one or combination of pyromellitic dianhydride, diphenyl ether tetracarboxylic dianhydride, naphthalene dicarboxylic acid glycoside and benzophenone tetracarboxylic dianhydride. .
S3, preparing a polyimide film: the polyamic acid mixture is converted into a polyimide film through a drying process and a heat treatment process. Wherein the drying process is carried out in a nitrogen atmosphere at a temperature of 200 ℃. The drying process and the heat treatment process are common techniques in the field of polyimide film preparation, and therefore are not described herein again.
The polyimide film containing the self-lubricating PI microcapsules prepared by the method is controlled to have the film thickness of 12-100 mu m, the thermal expansion coefficient in any direction on the film surface is less than or equal to 35 ppm/DEG C through measurement, and the static friction coefficient is 0.15.
Therefore, the polyimide film containing the self-lubricating PI microcapsule and the preparation method thereof in the structure are adopted, the PI microcapsule and the polyimide film are combined, the characteristics of stable thermal expansion coefficient, low static friction coefficient and excellent self-lubricating performance are endowed, the process is simple and convenient, the controllability is good, the performance is optimized, and the production cost is reduced.
Finally, it should be noted that: the above embodiments are only intended to illustrate the technical solution of the present invention and not to limit the same, and although the present invention is described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made to the disclosed embodiments without departing from the spirit and scope of the present invention.
Claims (8)
1. A preparation method of a polyimide film containing self-lubricating PI microcapsules is characterized by comprising the following steps: the method comprises the following steps:
s1, dissolving self-lubricating PI microcapsules: mixing and stirring self-lubricating PI microcapsules and an organic solvent to form a suspension;
s2, obtaining a polyamic acid solution: mixing a diamine monomer and a tetracarboxylic dianhydride monomer with the suspension under stirring, and carrying out polymerization reaction on the diamine monomer and the tetracarboxylic dianhydride monomer to form a polyamic acid mixture containing self-lubricating microcapsules;
s3, preparing a polyimide film: the polyamic acid mixture is converted into a polyimide film through a drying process and a heat treatment process.
2. The method for preparing polyimide film containing self-lubricating PI microcapsules as claimed in claim 1, wherein: the particle size of the self-lubricating PI microcapsule is 5-25 mu m.
3. The method for preparing polyimide film containing self-lubricating PI microcapsules according to claim 1, wherein the method comprises the following steps: the organic solvent is any one or a combination of several of dimethylformamide, dimethylacetamide, N-methylpyrrolidone and tetrahydrofuran methanol mixed liquor.
4. The method for preparing polyimide film containing self-lubricating PI microcapsules according to claim 1, wherein the method comprises the following steps: the diamine monomer is any one or combination of p-phenylenediamine, m-phenylenediamine, 4-diaminodiphenyl alkane, diaminodiphenyl sulfide and diaminobenzophenone.
5. The method for preparing polyimide film containing self-lubricating PI microcapsules according to claim 1, wherein the method comprises the following steps: the tetracarboxylic dianhydride monomer is any one or a combination of more of pyromellitic dianhydride, diphenyl ether tetracarboxylic dianhydride, naphthalene dicarboxylic acid glycoside and benzophenone tetracarboxylic dianhydride.
6. The method for preparing polyimide film containing self-lubricating PI microcapsules according to claim 1, wherein the method comprises the following steps: the viscosity of the polyamic acid mixture is 1000-1500 cp.
7. The method for preparing polyimide film containing self-lubricating PI microcapsules according to claim 1, wherein the method comprises the following steps: the drying process was carried out in a nitrogen atmosphere at a temperature of 200 ℃.
8. Polyimide film containing self-lubricating PI-microcapsules according to claims 1-7, characterized in that: comprises the polyimide film containing the self-lubricating PI microcapsule prepared by the method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211114414.8A CN115322569A (en) | 2022-09-14 | 2022-09-14 | Polyimide film containing self-lubricating PI microcapsules and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211114414.8A CN115322569A (en) | 2022-09-14 | 2022-09-14 | Polyimide film containing self-lubricating PI microcapsules and preparation method thereof |
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| CN115322569A true CN115322569A (en) | 2022-11-11 |
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| CN202211114414.8A Pending CN115322569A (en) | 2022-09-14 | 2022-09-14 | Polyimide film containing self-lubricating PI microcapsules and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0820721A (en) * | 1994-07-05 | 1996-01-23 | Shin Etsu Chem Co Ltd | Polyimide film and its production |
| US20100311900A1 (en) * | 2006-04-06 | 2010-12-09 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Thermally stable matrix microparticles and microcapsules for polymer additization and process for their production |
| US20120321828A1 (en) * | 2011-06-16 | 2012-12-20 | United States Of America As Represented By The Administrator Of The National Aeronautics And Spac | Self-Healing Polymer Materials for Wire Insulation, Polyimides, Flat Surfaces, and Inflatable Structures |
| CN114471391A (en) * | 2022-02-25 | 2022-05-13 | 明士新材料有限公司 | Self-lubricating PI microcapsule and preparation method thereof |
-
2022
- 2022-09-14 CN CN202211114414.8A patent/CN115322569A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0820721A (en) * | 1994-07-05 | 1996-01-23 | Shin Etsu Chem Co Ltd | Polyimide film and its production |
| US20100311900A1 (en) * | 2006-04-06 | 2010-12-09 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Thermally stable matrix microparticles and microcapsules for polymer additization and process for their production |
| US20120321828A1 (en) * | 2011-06-16 | 2012-12-20 | United States Of America As Represented By The Administrator Of The National Aeronautics And Spac | Self-Healing Polymer Materials for Wire Insulation, Polyimides, Flat Surfaces, and Inflatable Structures |
| CN114471391A (en) * | 2022-02-25 | 2022-05-13 | 明士新材料有限公司 | Self-lubricating PI microcapsule and preparation method thereof |
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