CN115321472A - Preparation process of optical glass recombinant mother board - Google Patents
Preparation process of optical glass recombinant mother board Download PDFInfo
- Publication number
- CN115321472A CN115321472A CN202211029119.2A CN202211029119A CN115321472A CN 115321472 A CN115321472 A CN 115321472A CN 202211029119 A CN202211029119 A CN 202211029119A CN 115321472 A CN115321472 A CN 115321472A
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- Prior art keywords
- glass
- lens
- mother board
- baking
- glass substrate
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- 239000005304 optical glass Substances 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 82
- 238000004519 manufacturing process Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 33
- 238000002347 injection Methods 0.000 claims description 17
- 239000007924 injection Substances 0.000 claims description 17
- 238000010276 construction Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 10
- 238000005215 recombination Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000004049 embossing Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007516 diamond turning Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00214—Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Glass Compositions (AREA)
Abstract
The invention discloses a preparation process of an optical glass recombinant mother board. The mother board manufactured by the embossing process technology and the glass lens recombination technology is combined with the optical lens, the gasket and the shielding layer into a whole. Moreover, the optical lens mother board directly manufactured by the glass lenses can reduce the error of the lens shape and increase the stability and uniformity of the performance of the optical lens mother board; the preparation process of the optical glass recombinant mother board reduces the manufacturing cost, simplifies the manufacturing process, and the manufactured mother board can be applied to mass production of high-precision optical modules.
Description
Technical Field
The invention relates to a process technology for manufacturing a mother board by using an embossing process technology and a glass lens recombination technology, in particular to a process for preparing an optical glass recombination mother board, which is suitable for manufacturing the mother board for high-precision micro-optical module packaging and high-precision microelectronic wafer packaging in mass production.
Background
For the mother board for micro-optical module package and microelectronic wafer package, the popular patterning method in the market mainly comprises: the ultraviolet exposure machine utilizes the sensitivity of photoresist to ultraviolet rays, combines a preset mask plate, transfers a pattern to a required photoresist material and then manufactures a mother plate with a gasket structure and a shielding layer structure; or manufacturing a single lens by using a single point diamond turning technology SPDT, and repeatedly copying an optical lens master plate by using the single lens through a nano-imprinting technology. If the product requires a mother plate with a spacer structure and a shielding layer structure for an optical lens, the conventional process is very difficult to manufacture, and the equipment and devices are usually expensive and the process is complicated.
Disclosure of Invention
In order to solve the technical problem, the invention designs a preparation process of an optical glass recombinant mother plate.
The invention adopts the following technical scheme:
a preparation process of an optical glass recombination mother board comprises the following process steps:
s1, pretreatment of a glass substrate: cutting glass into a square glass substrate, and polishing the upper surface and the lower surface of the glass substrate;
s2, manufacturing a lens cavity: lens cavities which are uniformly distributed in an array arrangement are formed in the polished glass substrate;
s3, assembling a working die: manufacturing a working mold, and putting the glass substrate provided with the lens cavity into the working mold to carry out alignment assembly to form a set;
s4, injecting glue, stamping, curing and forming: loading the assembled working mould into an automatic impression packaging machine for glue injection impression molding, injecting a circle of black epoxy resin glue on the outer edge of a lens cavity on a glass substrate, and curing the glue solution by combining ultraviolet rays and high-temperature baking to form a gasket and a shielding layer which are integrally and fixedly connected with the glass substrate;
s5, demoulding of the working mould: the set of working mould after the high-temperature baking glue solution is solidified is dismounted from the oven for cooling, and the packaged mother board is demoulded from the working mould;
s6, dispensing the glass lens: extracting a glass lens, and sticking glue on the back surface of the glass lens;
s7, glass lens construction: placing the glass lens with the bonding glue in a lens cavity of the mother board by using a transplanting machine for bonding and fixing to complete glass lens construction;
s8, repeatedly circulating the steps of dispensing and building the glass lenses: repeating the steps of dispensing glass lenses and building the glass lenses repeatedly until the glass lenses of the mother board in full layout are built;
s9, baking: and (3) putting the mother board built by the glass lenses into an oven for hot baking, and taking out the mother board after baking to finish the preparation process of the whole optical glass recombinant mother board.
Preferably, the working die comprises an upper die and a lower die, an upper die plate is installed below the upper die, a lower die plate is installed on the lower die, a groove matched with the glass substrate is formed in the lower die plate in an inward concave mode, the bottom of the upper die plate corresponds to the outer edge of a lens cavity on the glass substrate, an adhesive injection groove corresponding to a gasket and a shielding layer is formed in the inner concave mode of a circle, and adhesive injection holes are formed in the lower die and the upper die plate and are communicated with the adhesive injection groove.
Preferably, in step S1, the upper and lower surfaces are polished to: TTV is less than or equal to 1um.
Preferably, in step S2, the lens cavity is opened by laser etching.
Preferably, in step S4, the process conditions of the ultraviolet combined high temperature baking are as follows: ultraviolet UV365nm for 10 min; baking at 120 ℃ for 20 minutes.
Preferably, in step S5, the cooling process conditions are: cool at room temperature for 20 minutes.
Preferably, in step S9, the thermal baking process conditions are as follows: baking at 85 ℃ for 120 minutes.
The invention has the beneficial effects that: (1) The mother board manufactured by the embossing process technology and the glass lens recombination technology is combined with the optical lens, the gasket and the shielding layer into a whole. Moreover, the optical lens mother board directly manufactured by the glass lenses can reduce the error of the lens shape and increase the stability and uniformity of the performance of the optical lens mother board; (2) The manufacturing process of the optical glass recombinant mother board reduces the manufacturing cost, simplifies the manufacturing process, and the manufactured mother board can be applied to mass production of high-precision optical modules.
Drawings
FIG. 1 is a schematic view of a glass substrate according to the present invention;
FIG. 2 is a schematic diagram of a lens cavity formed in a glass substrate according to the present invention;
FIG. 3 is a schematic structural view of a glass substrate injection mold according to the present invention;
FIG. 4 is a schematic view of a structure for performing a glue injection imprint on a glass substrate according to the present invention;
FIG. 5 is a schematic structural view of the glass substrate glue injection mold after demolding;
FIG. 6 is a schematic view of a glass lens dispensing structure according to the present invention;
FIG. 7 is a schematic view of a glass lens constructed according to the present invention;
FIG. 8 is a schematic view of a full layout glass lens construction of the present invention;
FIG. 9 is a schematic diagram of a finished glass lens precursor after baking according to the present invention;
FIG. 10 is a schematic view of a top platen according to the present invention;
in the figure: 1. glass substrate, 2, lens cavity, 3, upper die, 4, bed die, 5, cope match-plate pattern, 6, lower bolster, 7, the injecting glue hole, 8, gasket and shielding layer, 9, glass lens, 10, bonding glue, 11, injecting glue groove.
Detailed Description
The technical scheme of the invention is further described in detail by the following specific embodiments in combination with the attached drawings:
the embodiment is as follows: as shown in the attached figure 1, the preparation process of the optical glass recombinant mother board comprises the following process steps:
s1, as shown in figure 1, pretreating a glass substrate: cutting glass into a square glass substrate 1, and polishing the upper surface and the lower surface of the glass substrate;
s2, as shown in figure 2, manufacturing a lens cavity: lens cavities 2 which are uniformly distributed in an array arrangement are formed in the polished glass substrate;
s3, as shown in FIG. 3, assembling the working die: manufacturing a working mold, and putting the glass substrate provided with the lens cavity into the working mold to carry out alignment assembly to form a set;
s4, as shown in figure 4, injecting glue, stamping, curing and forming: loading the assembled working mould into an automatic impression packaging machine for glue injection impression molding, injecting a circle of black epoxy resin glue on the outer edge of a lens cavity on a glass substrate, and curing the glue solution by combining ultraviolet rays and high-temperature baking to form a gasket and a shielding layer 8 which are integrally and fixedly connected with the glass substrate;
s5, as shown in FIG. 5, demolding the working mold: the set of working mould after the high-temperature baking glue solution is solidified is dismounted from the oven for cooling, and the packaged mother board is demoulded from the working mould;
s6, as shown in FIG. 6, dispensing the glass lens: extracting a glass lens 9, and sticking glue 10 on the back surface of the glass lens;
s7, as shown in FIG. 7, the glass lens is built: placing the glass lens with the adhesive into a lens cavity of the mother board by using a transplanting machine for bonding and fixing to complete glass lens construction;
s8, as shown in fig. 8, the glass lens dispensing and glass lens forming steps are repeated: repeating the steps of dispensing glass lenses and building the glass lenses repeatedly until the glass lenses of the mother board in full layout are built;
s9, as shown in fig. 9, thermal baking: and (4) putting the mother board built by the glass lenses into an oven for hot baking, and taking out the mother board after baking to finish the whole preparation process of the optical glass recombinant mother board.
In step S1, the upper and lower surfaces are polished to: TTV is less than or equal to 1um.
In the step S2, the lens cavity is opened in a laser etching mode.
In step S4, the process conditions of ultraviolet combined high-temperature baking are as follows: ultraviolet UV365nm for 10 minutes; baking at 120 ℃ for 20 minutes.
In step S5, the cooling process conditions are: cool at room temperature for 20 minutes.
In step S9, the conditions of the thermal baking process are: baking at 85 ℃ for 120 minutes.
As shown in fig. 3 and fig. 10, the working mold comprises an upper mold 3 and a lower mold 4, an upper mold plate 5 is installed under the upper mold, a lower mold plate 6 is installed on the lower mold plate, a groove matched with the glass substrate is formed in the concave portion of the lower mold plate, a glue injection groove corresponding to the gasket and the shielding layer is formed in the concave portion of the outer edge of the bottom of the upper mold plate corresponding to the glass substrate and corresponding to the lens cavity, glue injection holes 7 are formed in the lower mold plate and the upper mold plate, and the glue injection holes are communicated with the glue injection groove 11.
The glass lens positioning precision of the optical glass recombination mother board manufactured by the optical glass recombination mother board manufacturing process can be improved to +/-0.5 um from +/-2 um; the tolerance of the external dimension of the lens is small, and the FE can be improved to +/-0.2 um from +/-1 um; the process steps are short; the service life of the mother plate is long and can be improved from 30 times to 100 times.
The above-described embodiment is a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and other variations and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. A preparation process of an optical glass recombinant mother board is characterized by comprising the following process steps:
s1, pretreatment of a glass substrate: cutting glass into a square glass substrate, and polishing the upper surface and the lower surface of the glass substrate;
s2, manufacturing a lens cavity: lens cavities which are uniformly distributed in an array arrangement are formed in the polished glass substrate;
s3, assembling a working die: manufacturing a working mold, and putting the glass substrate provided with the lens cavity into the working mold to carry out alignment assembly to form a set;
s4, injecting glue, stamping, curing and forming: loading the assembled working mould into an automatic impression packaging machine for glue injection impression forming, injecting a circle of black epoxy resin glue on the outer edge of a lens cavity on a glass substrate, and curing the glue solution by using a mode of combining ultraviolet rays and high-temperature baking to form a gasket and a shielding layer which are integrally and fixedly connected with the glass substrate;
s5, demoulding of the working mould: the complete set of working die after the high-temperature baking glue solution is solidified is dismounted from the oven for cooling, and the packaged mother board is demoulded from the working die;
s6, dispensing the glass lens: extracting a glass lens, and sticking glue on the back surface of the glass lens;
s7, glass lens construction: placing the glass lens with the bonding glue in a lens cavity of the mother board by using a transplanting machine for bonding and fixing to complete glass lens construction;
s8, repeatedly circulating the glass lens dispensing and glass lens building steps: repeating the steps of dispensing glass lenses and building the glass lenses repeatedly until the glass lenses with the full layout of the mother board are built;
s9, baking: and (3) putting the mother board built by the glass lenses into an oven for hot baking, and taking out the mother board after baking to finish the preparation process of the whole optical glass recombinant mother board.
2. The process for preparing the optical glass regrouping mother plate according to claim 1, wherein the working mold comprises an upper mold and a lower mold, an upper mold plate is arranged below the upper mold, a lower mold plate is arranged above the lower mold plate, a groove matched with the glass substrate is arranged on the lower mold plate in a concave manner, a glue injection groove corresponding to the gasket and the shielding layer is arranged on the bottom of the upper mold plate corresponding to the outer edge of the lens cavity on the glass substrate in a concave manner, glue injection holes are arranged on the lower mold and the upper mold plate, and the glue injection holes are communicated with the glue injection groove.
3. The process for producing an optical glass regrouping mother plate according to claim 1, wherein in step S1, the upper and lower surfaces are polished to: TTV is less than or equal to 1um.
4. The process for preparing an optical glass recombinant mother plate according to claim 1, wherein in step S2, the lens cavity is opened by laser etching.
5. The process for preparing a recombined mother plate of optical glass according to claim 1, wherein in step S4, the process conditions of combining ultraviolet rays and high-temperature baking are as follows: ultraviolet UV365nm for 10 minutes; baking at 120 ℃ for 20 minutes.
6. The process for preparing a recombined mother plate of optical glass according to claim 1, wherein in step S5, the cooling process conditions are as follows: cool at room temperature for 20 minutes.
7. The process for preparing a recombined mother plate of optical glass according to claim 1, wherein in step S9, the thermal baking process conditions are as follows: baking at 85 ℃ for 120 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211029119.2A CN115321472A (en) | 2022-08-26 | 2022-08-26 | Preparation process of optical glass recombinant mother board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211029119.2A CN115321472A (en) | 2022-08-26 | 2022-08-26 | Preparation process of optical glass recombinant mother board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115321472A true CN115321472A (en) | 2022-11-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211029119.2A Pending CN115321472A (en) | 2022-08-26 | 2022-08-26 | Preparation process of optical glass recombinant mother board |
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| Country | Link |
|---|---|
| CN (1) | CN115321472A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101144879A (en) * | 2006-09-15 | 2008-03-19 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing optical element |
| US20090231688A1 (en) * | 2008-03-11 | 2009-09-17 | San-Woei Shyu | Optical glass lens set and manufacturing method thereof |
| CN111403580A (en) * | 2020-03-24 | 2020-07-10 | 营口众恩光电科技有限公司 | Ultraviolet L ED packaging structure and packaging method |
| CN215235470U (en) * | 2021-04-14 | 2021-12-21 | 东莞市亮成电子有限公司 | CNC loading attachment of glass lens is dressed to intelligence |
| CN215855107U (en) * | 2022-01-13 | 2022-02-18 | 美迪凯(浙江)智能光电科技有限公司 | Special optical wafer structure for wafer-level imprinting molding |
| CN114200773A (en) * | 2021-12-20 | 2022-03-18 | 美迪凯(浙江)智能光电科技有限公司 | Process for manufacturing optical motherboard by high-precision gray scale photoetching method |
| CN114823932A (en) * | 2022-05-06 | 2022-07-29 | 美迪凯(浙江)智能光电科技有限公司 | Wafer-level optical composite filter impressing process |
| CN217169571U (en) * | 2022-01-24 | 2022-08-12 | 美迪凯(浙江)智能光电科技有限公司 | Wafer level imprinting optical module |
-
2022
- 2022-08-26 CN CN202211029119.2A patent/CN115321472A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101144879A (en) * | 2006-09-15 | 2008-03-19 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing optical element |
| US20090231688A1 (en) * | 2008-03-11 | 2009-09-17 | San-Woei Shyu | Optical glass lens set and manufacturing method thereof |
| CN111403580A (en) * | 2020-03-24 | 2020-07-10 | 营口众恩光电科技有限公司 | Ultraviolet L ED packaging structure and packaging method |
| CN215235470U (en) * | 2021-04-14 | 2021-12-21 | 东莞市亮成电子有限公司 | CNC loading attachment of glass lens is dressed to intelligence |
| CN114200773A (en) * | 2021-12-20 | 2022-03-18 | 美迪凯(浙江)智能光电科技有限公司 | Process for manufacturing optical motherboard by high-precision gray scale photoetching method |
| CN215855107U (en) * | 2022-01-13 | 2022-02-18 | 美迪凯(浙江)智能光电科技有限公司 | Special optical wafer structure for wafer-level imprinting molding |
| CN217169571U (en) * | 2022-01-24 | 2022-08-12 | 美迪凯(浙江)智能光电科技有限公司 | Wafer level imprinting optical module |
| CN114823932A (en) * | 2022-05-06 | 2022-07-29 | 美迪凯(浙江)智能光电科技有限公司 | Wafer-level optical composite filter impressing process |
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