CN115318767B - Semiconductor process equipment and waste gas treatment device - Google Patents
Semiconductor process equipment and waste gas treatment device Download PDFInfo
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- CN115318767B CN115318767B CN202211070720.6A CN202211070720A CN115318767B CN 115318767 B CN115318767 B CN 115318767B CN 202211070720 A CN202211070720 A CN 202211070720A CN 115318767 B CN115318767 B CN 115318767B
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- connecting rod
- air inlet
- cylinder
- exhaust gas
- rod
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 239000002912 waste gas Substances 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 19
- 230000008569 process Effects 0.000 title claims description 18
- 238000004140 cleaning Methods 0.000 claims abstract description 64
- 239000007789 gas Substances 0.000 claims abstract description 45
- 230000007246 mechanism Effects 0.000 claims abstract description 42
- 238000007790 scraping Methods 0.000 claims abstract description 35
- 238000012545 processing Methods 0.000 claims abstract description 15
- 239000000178 monomer Substances 0.000 claims abstract description 11
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 38
- 238000002485 combustion reaction Methods 0.000 claims description 10
- 239000002699 waste material Substances 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 abstract description 14
- 238000013461 design Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 9
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/04—Cleaning the internal surfaces; Removal of blockages using cleaning devices introduced into and moved along the pipes
- B08B9/043—Cleaning the internal surfaces; Removal of blockages using cleaning devices introduced into and moved along the pipes moved by externally powered mechanical linkage, e.g. pushed or drawn through the pipes
- B08B9/0436—Cleaning the internal surfaces; Removal of blockages using cleaning devices introduced into and moved along the pipes moved by externally powered mechanical linkage, e.g. pushed or drawn through the pipes provided with mechanical cleaning tools, e.g. scrapers, with or without additional fluid jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Abstract
The present disclosure relates to a semiconductor processing apparatus, an exhaust gas treatment device, and a blockage cleaning assembly, the assembly including a drive mechanism and a scraper assembly. The driving mechanism comprises at least two air cylinder monomers connected in series, each air cylinder monomer comprises a cylinder barrel, a piston rod movably penetrating through the cylinder barrel and a piston movably arranged in the cylinder barrel and connected with the piston rod, and all the piston rods are sequentially connected in series to form a driving rod. The scraping component is connected with the driving rod and is used for being movably arranged in an air inlet channel of the waste gas treatment device so as to remove the obstruction deposited on the inner wall of the air inlet channel. The blockage cleaning assembly can doubly lift the driving force through the design mode of multiple pistons, so that the cylinder can act more smoothly, hard crystals on the inner wall of the air inlet channel can be cleaned better, and the problems that the traditional cylinder driving force is small, the connecting rod is easy to crystallize, the cylinder is blocked and can not act, and the whole air inlet channel is blocked completely are solved.
Description
Technical Field
The present disclosure relates to the field of semiconductor processing equipment, and more particularly, to a semiconductor processing equipment, an exhaust gas treatment device, and an obstruction cleaning assembly.
Background
Semiconductor processing equipment, including but not limited to a TEL-Trias tool using Chemical Vapor Deposition (CVD) Ti/TiN, produces some of the titanium tetrachloride (TiCl) in the process chamber as the wafer is processed 4 ) Ammonia (NH) 3 ) Hydrogen (H) 2 ) Process exhaust gas such as argon (Ar), which is generally pumped by a process pump to be transferred to an exhaust gas treatment apparatus for combustion treatment, is extremely prone to deposit various hard crystals on the inner wall of an intake passage of the exhaust gas treatment apparatus and cause clogging due to various chemical reactions.
In the conventional art, a blockage cleaning assembly is provided at an air intake passage of an exhaust gas treatment device, and a blockage deposited on an inner wall of the air intake passage is cleaned by the blockage cleaning assembly. However, the blockage cleaning assembly cannot normally operate due to the blockage of the crystals, so that the cleaning efficiency is greatly reduced, and the waste gas treatment device is down due to abnormal pressure caused by the accumulation of the crystals due to the long-term incapability of normally cleaning the crystals, so that the productivity and safety of the semiconductor mainframe are affected.
Disclosure of Invention
Based on this, it is necessary to overcome the defects of the prior art, and to provide a semiconductor process device, an exhaust gas treatment device and a blockage cleaning assembly, which can improve the cleaning capability, reduce the frequency of abnormal downtime, ensure the safe operation and longer service cycle of the semiconductor mainframe, and thereby improve the productivity efficiency of the semiconductor mainframe.
The technical scheme is as follows: an obstruction cleaning assembly, said obstruction cleaning assembly comprising:
the driving mechanism comprises at least two air cylinder monomers connected in series, wherein each air cylinder monomer comprises a cylinder barrel, a piston rod movably penetrating through the cylinder barrel and a piston movably arranged in the cylinder barrel and connected with the piston rod, and all the piston rods are sequentially connected in series to form a driving rod;
the scraping assembly is connected with the driving rod and is used for being movably arranged in an air inlet channel of the waste gas treatment device so as to remove the obstruction deposited on the inner wall of the air inlet channel.
In one embodiment, the obstruction cleaning assembly further comprises a rotating mechanism arranged between the driving rod and the scraping assembly, and the driving rod is connected with the scraping assembly through the rotating mechanism.
In one embodiment, the rotation mechanism comprises a first connecting rod and a sleeve; the sleeve comprises a first end and a second end which are opposite to each other, the first end is connected with the driving mechanism, the first connecting rod movably penetrates through the sleeve, and two ends of the first connecting rod are respectively connected with the driving rod and the scraping assembly; one of the first connecting rod and the sleeve is provided with a guide structure which is bent around the central axis of the rotating mechanism, and the other is provided with a guide piece matched with the guide structure.
In one embodiment, the guiding structure is arranged in a spiral or arc shape around the central axis of the rotating mechanism.
In one embodiment, the guiding structure is a groove, a through hole or a guide rail.
In one embodiment, the number of the guide structures is two, and the two guide structures are respectively positioned at two opposite sides of the first connecting rod or two opposite sides of the sleeve; the guide parts are two, and the two guide parts are correspondingly arranged in the two guide structures.
In one embodiment, the guide member is a needle, a cylinder or a protrusion fixedly connected to the inner wall of the sleeve; the guide structure is a spiral groove formed on the outer wall of the first connecting rod; the guide is inserted into the spiral groove.
In one embodiment, the scraping assembly comprises a coil and a second connecting rod, wherein the coil and the second connecting rod are connected with the first connecting rod, and the second connecting rod penetrates through the coil.
In one embodiment, the coil is a spiral coil, and the coil comprises a first connecting end movably sleeved on the first connecting rod and a first free end arranged opposite to the first connecting end; the second connecting rod comprises a second connecting end connected with the first connecting rod and a second free end arranged opposite to the second connecting end; the inner diameter of the first connecting end is smaller than the outer diameter of the second connecting end.
In one embodiment, the end of the second connecting rod is detachably connected to the end of the first connecting rod.
In one embodiment, the obstruction cleaning assembly further comprises a sealing cover connected to the second end, the sealing cover is provided with a through hole, the first connecting rod is movably arranged in the through hole in a penetrating mode, the first connecting rod is provided with a sealing abutting part, the sealing abutting part is in sealing abutting fit with the inner wall of the sleeve, and a cavity is formed between the sealing abutting part and the sealing cover; the obstruction cleaning assembly further comprises a pressure detector for detecting air pressure inside the chamber.
In one embodiment, the obstruction cleaning assembly further comprises a sealing ring sleeved on the first connecting rod, and the sealing ring is located at the through hole.
In one embodiment, the cylinders of at least two air cylinder units are sequentially connected in series and form an integrated structure.
In one embodiment, the cylinder unit further comprises a first air inlet joint and a second air inlet joint; the first air inlet connector and the second air inlet connector are communicated with the piston chamber of the cylinder barrel and are respectively positioned on two opposite sides of the piston, and the first air inlet connector and the second air inlet connector are also communicated with an air source through an air inlet pipe.
The waste gas treatment device comprises a blockage cleaning assembly and a combustion chamber, wherein the combustion chamber is provided with an air inlet channel and a waste discharge pipeline, the scraping assembly is movably arranged in the air inlet channel, and the waste discharge pipeline is used for being connected with a factory acid discharge receiving end.
The semiconductor process equipment comprises the waste gas treatment device, a semiconductor host machine table, an air exhaust pipeline and a suction pump, wherein a waste discharge port of the semiconductor host machine table is communicated with one end of the air exhaust pipeline, the other end of the air exhaust pipeline is communicated with the air inlet pipeline, and the suction pump is arranged on the air exhaust pipeline in series and is used for providing power to outwards exhaust waste gas in the semiconductor host machine table.
Compared with the traditional single cylinder, the semiconductor process equipment, the waste gas treatment device and the blockage cleaning assembly have the advantages that as the driving mechanism adopts at least two cylinder monomers connected in series, under the condition that the air pressure P provided for the cylinder is unchanged, the pressure F/S is increased based on the formula P=F/S (pressure=pressure/stressed area), and the stress area S is correspondingly increased due to the relative increase of the pistons, namely, the driving force can be increased in a multiple way through the design of multiple pistons, so that the cylinder can be operated more smoothly, the existing hard crystals (also called blockage) on the inner wall of the air inlet channel can be cleaned better, and the problems that the crystallization is very easy to occur at the connecting rod part due to the fact that the driving force of the traditional cylinder is small, the cylinder is blocked and the whole air inlet channel is blocked completely are solved. In addition, the diameter of the cylinder barrel can be kept unchanged, so that the diameter size of the air inlet channel of the exhaust gas treatment device is not required to be increased, the obstruction cleaning assembly in the embodiment can be directly arranged in the space of the air inlet channel, and the driving force can be maximized in the original space of the exhaust gas treatment device.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate and explain the exemplary embodiments of the disclosure and together with the description serve to explain the disclosure, and do not constitute an undue limitation on the disclosure.
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of an obstruction cleaning assembly according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional structural view of an obstruction cleaning assembly according to an embodiment of the present disclosure;
FIG. 3 is an exploded view of an obstruction cleaning assembly according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a piston rod of an embodiment of the present disclosure connected in series to form a drive rod;
FIG. 5 is a schematic view illustrating a structure of a first connecting rod connected to a scraping assembly according to an embodiment of the disclosure;
fig. 6 is a schematic structural diagram of a semiconductor processing apparatus according to an embodiment of the present disclosure.
10. A driving mechanism; 11. a cylinder monomer; 111. a cylinder; 112. a piston rod; 113. a piston; 114. a driving rod; 1141. a third mounting hole; 115. a first air inlet joint; 116. a second air inlet joint; 20. a scraping assembly; 21. a coil; 211. a first connection end; 22. a second connecting rod; 221. a second connection end; 30. an exhaust gas treatment device; 31. a combustion chamber; 311. an air intake passage; 312. a waste discharge pipe; 40. a rotation mechanism; 41. a first connecting rod; 411. a guide structure; 412. a second mounting hole; 413. sealing the abutting part; 42. a sleeve; 421. a first end; 422. a second end; 423. a guide member; 424. a first mounting hole; 43. a sealed housing; 50. sealing cover; 51. a through hole; 52. a chamber; 53. detecting the joint; 60. a seal ring; 70. a plant acid discharge receiving end; 80. a semiconductor host; 90. an air extraction pipeline; 91. and a suction pump.
Detailed Description
In order that the above-recited objects, features and advantages of the present disclosure will become more readily apparent, a more particular description of the disclosure will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. The present disclosure may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the disclosure, and therefore the disclosure is not to be limited to the specific embodiments disclosed below.
As described in the background art, the problem that the blockage cleaning assembly cannot normally operate due to the gradual accumulation and blockage of the inner wall of the air inlet channel in the prior art is found by the research of the inventor that the blockage cleaning assembly mainly adopts a single cylinder, and when crystals are deposited at the connecting position of the cylinders, the cylinders cannot operate easily due to insufficient driving force of the cylinders, and the scraper cannot perform cleaning work.
For the above reasons, the present application provides a semiconductor process apparatus, an exhaust gas treatment device 30 and a blockage cleaning assembly, which can improve cleaning capability, and prolong the service cycle of the exhaust gas treatment device 30 by improving the cleaning capability of the blockage cleaning assembly, thereby improving productivity utilization efficiency of the semiconductor mainframe 80 and ensuring the cleaning capability of the exhaust gas treatment device 30 to reduce the frequency of abnormal downtime and ensure safe operation of the semiconductor mainframe 80.
Referring to fig. 1, 2 and 6, fig. 1 illustrates a schematic structural diagram of an obstruction cleaning assembly according to an embodiment of the present disclosure, fig. 2 illustrates a schematic sectional structural diagram of an obstruction cleaning assembly according to an embodiment of the present disclosure, and fig. 6 illustrates a schematic structural diagram of a semiconductor process apparatus according to an embodiment of the present disclosure. An embodiment of the present disclosure provides a blockage cleaning assembly, the blockage cleaning assembly includes: the driving mechanism 10 and the scraping assembly 20. The driving mechanism 10 includes at least two cylinder units 11 connected in series, and the cylinder units 11 include a cylinder tube 111, a piston rod 112 movably penetrating the cylinder tube 111, and a piston 113 movably disposed inside the cylinder tube 111 and connected to the piston rod 112. All piston rods 112 are in turn connected in series to form a drive rod 114. The scraping assembly 20 is connected to the driving rod 114, and the scraping assembly 20 is movably disposed in the air inlet channel 311 of the exhaust gas treatment device 30 to remove the obstruction deposited on the inner wall of the air inlet channel 311.
Under the driving of the driving rod 114 of the driving mechanism 10, the scraping assembly 20 can timely clean the blocking objects deposited on the inner wall of the air inlet channel 311 during the internal movement of the air inlet channel 311, so as to avoid the blocking of the air inlet channel 311 caused by the accumulation of the blocking objects in the air inlet channel 311.
Compared with the traditional single cylinder, the above-mentioned blockage cleaning assembly has the advantages that since the driving mechanism 10 adopts at least two cylinder monomers 11 connected in series, under the condition that the air pressure P provided for the cylinder is unchanged, based on the formula p=f/S (pressure=pressure/stressed area), the piston 113 is relatively increased, which is equivalent to increasing the stressed area S, and accordingly the pressure F can be increased, that is, the driving force can be doubly increased by the design mode of the multiple pistons 113, so that the cylinder can be more smoothly operated, and the problem that the traditional cylinder driving force is small, so that the crystallization is very easy to occur at the connecting rod, the cylinder is blocked and the whole air inlet channel 311 is completely blocked is solved. In addition, the diameter of the cylinder tube 111 can be kept unchanged, so that the diameter of the air intake passage 311 of the exhaust gas treatment device 30 does not need to be increased, the obstruction cleaning assembly in the present embodiment can be directly installed in the space of the air intake passage 311, and the driving force can be maximized in the original space of the exhaust gas treatment device 30.
Of course, the diameter of the air intake passage 311 of the exhaust gas treatment device 30 can be flexibly adjusted according to the process requirements. Accordingly, as an alternative, the size of the cylinder tube 111 can be flexibly adjusted and set accordingly, i.e., for example, the diameter of the cylinder tube 111 is increased or decreased to meet the adjustment of the diameter of the intake passage 311 of the exhaust gas treatment device 30.
Referring to fig. 1 to 3 and 5, fig. 3 is an exploded view of an obstruction cleaning assembly according to an embodiment of the present disclosure, and fig. 5 is a view illustrating a structure of a first connecting rod 41 connected to a scraping assembly 20 according to an embodiment of the present disclosure. In one embodiment, the obstruction cleaning assembly further includes a rotation mechanism 40 disposed between the drive rod 114 and the scraper assembly 20. The drive rod 114 is coupled to the scraper assembly 20 via the rotation mechanism 40. So, on the one hand, scrape material subassembly 20 and remove through rotary mechanism 40, the indirect drive scrapes material subassembly 20 action, on the other hand, under rotary mechanism 40's effect, can realize scraping material subassembly 20 rotation, scrape the material subassembly 20 and act on the inner wall in-process of air inlet channel 311 with rotatory mode, will have better scraping the material effect, compare in the linear motion mode, can improve the removal efficiency of hard crystallization on the inner wall of air inlet channel 311 greatly.
It should be noted that, the rotating mechanism 40 drives the scraping assembly 20 in more specific implementation manners, which may be an electric driving manner, or may be obtained by converting a linear driving force of the driving rod 114 through some mechanical structures, or may be implemented in other manners, and may be specifically and flexibly adjusted and set according to actual requirements, so long as the scraping assembly 20 can be driven to rotate.
Referring to fig. 1 to 3 and 5, in one embodiment, the rotation mechanism 40 includes a first connecting rod 41 and a sleeve 42. The sleeve 42 includes opposite first and second ends 421 and 422. The first end 421 is connected to the drive mechanism 10, in particular to the cylinder 111. The first connecting rod 41 movably penetrates the sleeve 42, and two ends of the first connecting rod 41 are respectively connected with the driving rod 114 and the scraping assembly 20. One of the first connecting rod 41 and the sleeve 42 is provided with a guide structure 411 bent around the central axis of the rotation mechanism 40, and the other is provided with a guide 423 matched with the guide structure 411. So, when the driving mechanism 10 works, the driving rod 114 moves back and forth, and when the driving rod 114 acts, the driving rod 114 correspondingly drives the first connecting rod 41 to move back and forth, and in the moving process of the first connecting rod 41, the guide piece 423 moves along the curved guide structure 411, so that the first connecting rod 41 can be driven to rotate back and forth around the central axis of the guide piece, and the first connecting rod 41 correspondingly drives the scraping assembly 20 to rotate back and forth, so that the scraping assembly 20 has linear motion and rotation around the central axis of the scraping assembly 20, and the cleaning capacity of the scraping assembly 20 is greatly improved, so that a better scraping effect is achieved.
Referring to fig. 2, 3 and 5, in one embodiment, the guiding structure 411 is disposed in a spiral or arc shape around the central axis of the rotating mechanism 40. Thus, when the guide 423 moves along the guide structure 411, the first connecting rod 41 can be smoothly driven to rotate, and the moving effect along the spiral or arc-shaped guide structure 411 is smooth.
The number of the guide structures 411 is not limited to one, and for example, at least two guide structures may be provided and spaced apart from each other on the first connecting rod 41 or the sleeve 42. Also, the number of the guide 423 is not limited to one, and for example, at least two may be provided. The guiding element 423 may be correspondingly disposed on one guiding structure 411, or two or other guiding elements 423 may be correspondingly disposed on one guiding structure 411, which is not limited herein, and how to flexibly adjust and set according to actual requirements.
In one embodiment, the guide structure 411 is a groove, a through hole, or a rail.
Referring to fig. 2, 3 and 5, in one embodiment, the number of the guide structures 411 is two, and the two guide structures 411 are respectively located on opposite sides of the first connecting rod 41 or on opposite sides of the sleeve 42. The number of the guide members 423 is two, and the two guide members 423 are correspondingly disposed in the two guide structures 411. In this way, the number of the guide structures 411 is relatively suitable, on one hand, the number of the guide structures 411 is not too small, the stress of the first connecting rod 41 is relatively balanced, the first connecting rod 41 can be stably driven to rotate back and forth, and the phenomenon of blocking caused by unbalanced stress is avoided; on the other hand, the number of the guide structures 411 is not excessive, resulting in a complicated structure making it difficult to process and increase costs.
When at least two guide structures 411 are provided, it is necessary to ensure that the shape and the setting angle of each guide structure 411 are consistent, so that when the driving rod 114 drives the first connecting rod 41 to act, at least two guide pieces 423 can move and guide along at least two guide structures 411 respectively in synchronization, the first connecting rod 41 rotates smoothly, and the phenomenon of jamming is avoided.
In a single stroke of the driving mechanism 10, the driving rod 114 can drive the first connecting rod 41 and the scraping assembly 20 to move from one of the limit positions (for example, the upper limit position) to the other limit position (for example, the lower limit position), at this time, the guide piece 423 moves from one end to the other end of the guide structure 411, and during the movement of the guide piece 423, the first connecting rod 41 can be driven to rotate 180 ° (i.e., half a turn), 360 ° (i.e., one turn), 720 ° (i.e., two turns), etc. around the central axis thereof, and the specific rotation angle of the first connecting rod 41 in a single stroke depends on the winding angle of the guide structure 411 on the first connecting rod 41 or the sleeve 42, and the winding angle of the guide structure 411 on the first connecting rod 41 or the sleeve 42 is flexibly adjusted and set according to the actual requirement, which is not limited herein.
Referring to fig. 2, 3 and 5, in one embodiment, the guide 423 is a needle, a cylinder or a protrusion fixedly connected to the inner wall of the sleeve 42. The guide structure 411 is a spiral groove formed on the outer wall of the first connecting rod 41. The guide 423 is inserted into the spiral groove. Thus, when the guide 423 is disposed on the sleeve 42, that is, the guide structure 411 is disposed on the outer wall of the first connecting rod 41, the defect that the guide structure 411 is difficult to process on the inner wall of the sleeve 42 is avoided, and the guide structure 411 is relatively easy to process on the first connecting rod 41, and the guide 423 which is relatively easy to install is disposed on the sleeve 42, so that the processing cost is reduced.
It should be noted that the guide 423 is mounted on the sleeve 42 in a plurality of ways, including, but not limited to, bonding, welding, clamping, riveting, or being integrally formed. Referring to fig. 3, in one embodiment, the sleeve 42 is provided with a first mounting hole 424, and the guide 423 is disposed in the first mounting hole 424 and located inside the sleeve 42. In addition, in order to ensure the tightness of the sleeve 42, a sealing shell 43 is further sleeved on the outer wall of the sleeve 42, and the inner wall of the sealing shell 43 is mutually attached to the outer wall of the sleeve 42, so that leakage gas at the mounting hole can be avoided, and the sleeve 42 is protected.
In one embodiment, in order to ensure rotational flexibility of the first connecting rod 41 during the movement of the driving rod 114 along the axial direction thereof, the driving rod 114 is specifically rotatably connected to the first connecting rod 41, for example, a rotational joint (not shown) is added between the driving rod 114 and the first connecting rod 41, and the driving rod 114 is connected to the first connecting rod 41 through the rotational joint, so that the first connecting rod 41 can freely and flexibly rotate under the guiding action of the guiding structure 411 without being limited by the friction force between the piston 113 and the inner wall of the cylinder 111.
Referring to fig. 3 to 5, in one embodiment, the first connecting rod 41 is coaxially sleeved with the end of the driving rod 114, a second mounting hole 412 is provided on the first connecting rod 41, a third mounting hole 1141 corresponding to the second mounting hole 412 is provided on the end of the driving rod 114, and the driving rod 114 and the first connecting rod 41 are fixedly and lockingly connected through fasteners including, but not limited to, screws, pins, rivets, etc. sequentially passing through the first mounting hole 424 and the second mounting hole 412.
It should be noted that the scraping assembly 20 may be any mechanical device that removes hard crystals from the wall of the air intake passage 311 when it moves in the air intake passage 311. However, if the wiper assembly 20 is rigid, hard crystals are more tough, which may potentially deform and damage the wiper assembly 20.
Referring to fig. 2, 3, 5 and 6, in one embodiment, the scraping assembly 20 includes a coil 21, the coil 21 has better flexibility, and the contact manner between the coil 21 and the inner wall of the air inlet channel 311 is beneficial to cleaning a plurality of surfaces of tough deposits, so that a better cleaning effect is achieved. Alternatively, the coils 21 may be configured in various shapes according to practical needs, including but not limited to spiral coils (as shown in fig. 5), or a plurality of coils 21 sequentially spaced on a support frame (as shown in fig. 3), or other combinations.
Wherein the scraping assembly 20 is formed, for example, of a chemically inert, mechanically stable solid material, such as stainless steel.
Referring to fig. 2, 5 and 6, in one embodiment, the scraping assembly 20 includes a coil 21 and a second connecting rod 22. The coil 21 and the second connecting rod 22 are connected with the first connecting rod 41, and the second connecting rod 22 penetrates through the coil 21. On the one hand, the coil 21 can achieve a better cleaning effect on the hard crystals on the inner wall of the air inlet channel 311; on the other hand, it has been found that by adding the second connecting rod 22 connected to the first connecting rod 41 to the inside of the coil 21, the second connecting rod 22 can also perform a certain cleaning function in the process of moving into the air intake passage 311, and further the cleaning effect on the hard crystals on the inner wall of the air intake passage 311 can be enhanced.
Optionally, the length of the second connecting rod 22 is smaller than the length of the coil 21, the length of the second connecting rod 22 being for example 1cm-10cm. Specifically, for example, the length is 2cm to 5 cm. In this way, the length of the second connecting rod 22 is designed to be suitable, on the one hand, so as not to be too long to obstruct the entering exhaust gas, and on the other hand, so as not to be too short to reduce the cleaning force exerted by the second connecting rod.
Referring to fig. 2, 5 and 6, in one embodiment, the coil 21 is a spiral coil, and the coil 21 includes a first connecting end 211 movably sleeved on the first connecting rod 41, and a first free end disposed opposite to the first connecting end 211. In addition, the second connection rod 22 includes a second connection end 221 connected to the first connection rod 41, and a second free end disposed opposite to the second connection end 221. The inner diameter of the first connection end 211 is smaller than the outer diameter of the second connection end 221. Thus, on the one hand, since the inner diameter of the first connecting end 211 is smaller than the outer diameter of the second connecting end 221, the second connecting end 221 can prop against the first connecting end 211, so as to prevent the coil 21 from being separated from the first connecting rod 41; on the other hand, the first connecting end 211 can move on the first connecting rod 41 with a certain amplitude, so that the coil 21 can have a vertical shaking space, and the coil is prevented from being directly blocked by hard crystals.
In addition, the inner diameter of the portion of the coil 21 corresponding to the second connection end 221 is larger than the outer diameter of the second connection end 221, so that the coil 21 can be sleeved outside the second connection end 221, and the coil 21 can move along the axial direction of the first connection rod 41 when being stressed. In addition, the first connecting end 211 is also in abutting engagement with the sealing cover 50 or the sealing ring 60, which will be described later, for example, that the sealing cover 50 or the sealing ring 60 can restrict the movement of the coil 21 in a direction approaching the driving mechanism 10 by abutting against the first connecting end 211. Of course, the first connecting end 211 may be fixedly mounted on the first connecting rod 41 by welding, bonding, clamping, or the like.
In one embodiment, the end of the second connecting rod 22 is detachably connected to the end of the first connecting rod 41. Optionally, the second connecting rod 22 is detachably connected to the first connecting rod 41 by means including, but not limited to, threaded connection, snap-fit, etc. Thus, when the second connecting rod 22 is detached, the coil 21 can be detached; on the contrary, after the first connecting end 211 of the coil 21 is sleeved on the first connecting rod 41, the first connecting end is connected with the first connecting rod 41 through the second connecting end 221, so that the coil 21 can be assembled quickly.
Referring to fig. 2 and 3, in one embodiment, the blockage cleaning assembly further includes a seal cap 50 coupled to the second end 422. The sealing cap 50 is provided with a through hole 51. The first connecting rod 41 movably penetrates through the through hole 51, the first connecting rod 41 is provided with a sealing abutting portion 413, the sealing abutting portion 413 is in sealing abutting fit with the inner wall of the sleeve 42, and a chamber 52 is formed between the sealing abutting portion 413 and the sealing cover 50. The obstruction cleaning assembly further includes a pressure detector for detecting the air pressure inside the chamber 52. In this way, when the driving rod 114 drives the first connecting rod 41 to operate, the distance between the sealing abutting portion 413 and the sealing cover 50 changes, and the volume of the chamber 52 changes, and the pressure of the chamber 52 is detected by the pressure detector, so that the magnitude of the applied pressure of the driving mechanism 10 can be indirectly obtained, that is, the operating state of the driving mechanism 10 can be grasped.
Note that, the "sealing abutting portion 413" may be "a portion of the first connecting rod 41", that is, the "sealing abutting portion 413" and "other portion of the first connecting rod 41" are integrally formed; it is also possible that a separate member, i.e. "sealing abutment 413", which is separable from the other part of the first connecting rod 41, may be manufactured separately and then combined with the other part of the first connecting rod 41 as a single body.
Referring to fig. 2 and 3, in one embodiment, the obstruction cleaning assembly further includes a sealing ring 60 sleeved on the first connecting rod 41, and the sealing ring 60 is located at the through hole 51. In this way, the seal ring 60 ensures the tightness of the chamber 52, thereby improving the detection accuracy of the pressure detector.
Referring to fig. 2 and 3, specifically, a detecting joint 53 is provided on the outer wall of the sealing cover 50 and is connected to the chamber 52, and a pressure detector is provided on a pipe connected to the detecting joint 53, for example.
Referring to fig. 1 to 3, in one embodiment, the cylinders 111 of at least two cylinder units 11 are sequentially connected in series and form an integrated structure.
Of course, as an alternative, the cylinder barrels 111 of at least two cylinder units 11 may be of a separate structure, which are sequentially connected in series by fasteners such as bolts, pins, rivets, etc., which are not particularly limited herein.
Referring to fig. 2 and 4, in the present embodiment, there are two air cylinder units 11, wherein an acting force generated by one air cylinder unit 11 on the driving rod 114 is F1 when the other air cylinder unit 11 works, an acting force generated by the other air cylinder unit 11 on the driving rod 114 is F2, and a resultant force F of the driving rods 114 is f=f1+f2. The driving force of the cylinder can be improved by 3 times, and the cleaning effect is effectively improved, so that the situation that the cylinder is blocked due to insufficient driving force is greatly avoided.
The cylinder unit 11 may be a unidirectional cylinder that returns by the elastic force of a spring, or may be a bidirectional cylinder.
Referring to fig. 1 to 3, in one embodiment, the cylinder unit 11 further includes a first air inlet joint 115 and a second air inlet joint 116. The first air inlet joint 115 and the second air inlet joint 116 are both communicated with the piston 113 chamber of the cylinder 111 and are respectively positioned at two opposite sides of the piston 113, and the first air inlet joint 115 and the second air inlet joint 116 are also both communicated with an air source through an air inlet pipe. Thus, the driving mechanism 10 is a double-acting cylinder, and the control is flexible and reliable.
Referring to fig. 1 to 3 and 6, in one embodiment, an exhaust gas treatment device 30, where the exhaust gas treatment device 30 includes the obstruction cleaning assembly according to any of the above embodiments, further includes a combustion chamber 31, the combustion chamber 31 is provided with an air inlet channel 311 and a waste discharge pipe 312, and the scraper assembly 20 is movably disposed in the air inlet channel 311, and the waste discharge pipe 312 is used to connect with the plant acid discharge receiving end 70.
Compared with the conventional single cylinder, the exhaust gas treatment device 30 described above uses at least two cylinder units 11 connected in series as the driving mechanism 10, so that under the condition that the air pressure P provided to the cylinder is unchanged, based on the formula p=f/S (pressure=pressure/stressed area), the piston 113 is relatively increased, which is equivalent to increasing the stressed area S, and accordingly increasing the pressure F, that is, by means of the design of multiple pistons 113, the driving force can be increased by times, so that the cylinder can be operated more smoothly, and the problem that the existing hard crystals on the inner wall of the air inlet channel 311 can be cleaned better, and the problem that the crystals are very easy to appear at the connecting rod and the air cylinder is blocked and cannot be operated, so that the whole air inlet channel 311 is blocked completely due to the small driving force of the conventional cylinder is solved. In addition, the diameter of the cylinder tube 111 can be kept unchanged, so that the diameter of the air intake passage 311 of the exhaust gas treatment device 30 does not need to be increased, the obstruction cleaning assembly in the present embodiment can be directly installed in the space of the air intake passage 311, and the driving force can be maximized in the original space of the exhaust gas treatment device 30.
Further, specifically, the cylinder tube 111 is connected to the wall of the combustion chamber 31, and protrudes to the outside of the combustion chamber 31, for example.
Referring to fig. 1 to 3 and 6, in one embodiment, a semiconductor processing apparatus includes the exhaust gas treatment device 30 of any of the above embodiments, further includes a semiconductor host 80, an exhaust pipe 90 and a suction pump 91, where a waste outlet of the semiconductor host 80 is connected to one end of the exhaust pipe 90, the other end of the exhaust pipe 90 is connected to an air inlet pipe, and the suction pump 91 is serially arranged on the exhaust pipe 90 for providing power to draw out the exhaust gas inside the semiconductor host 80.
Compared with the traditional single cylinder, the semiconductor processing equipment adopts at least two cylinder monomers 11 connected in series by the driving mechanism 10, so that under the condition that the air pressure P provided for the cylinder is unchanged, the problem that the traditional cylinder driving force is smaller, the connecting rod is extremely easy to crystallize, the cylinder is blocked and can not be actuated, and the whole air inlet channel 311 is completely blocked because the stress area S is correspondingly increased and the pressure F can be correspondingly increased because the stress area S is correspondingly increased because the piston 113 is relatively increased, namely, the driving force can be doubly increased by the design mode of the multiple pistons 113, so that the cylinder actuation is smoother, and the existing hard crystallization on the inner wall of the air inlet channel 311 can be better cleaned. In addition, the diameter of the cylinder tube 111 can be kept unchanged, so that the diameter of the air intake passage 311 of the exhaust gas treatment device 30 does not need to be increased, the obstruction cleaning assembly in the present embodiment can be directly installed in the space of the air intake passage 311, and the driving force can be maximized in the original space of the exhaust gas treatment device 30.
In summary, the semiconductor processing apparatus, the exhaust gas treatment device 30 and the obstruction cleaning assembly of the present embodiment have at least the following advantages:
1. compared with the traditional single cylinder, the above-mentioned blockage cleaning assembly has the advantages that since the driving mechanism 10 adopts at least two cylinder monomers 11 connected in series, under the condition that the air pressure P provided for the cylinder is unchanged, based on the formula p=f/S (pressure=pressure/stressed area), the piston 113 is relatively increased, which is equivalent to increasing the stressed area S, and accordingly the pressure F can be increased, that is, the driving force can be doubly increased by the design mode of the multiple pistons 113, so that the cylinder can be more smoothly operated, and the problem that the traditional cylinder driving force is small, so that the crystallization is very easy to occur at the connecting rod, the cylinder is blocked and the whole air inlet channel 311 is completely blocked is solved. In addition, the diameter of the cylinder tube 111 can be kept unchanged, so that the diameter of the air intake passage 311 of the exhaust gas treatment device 30 does not need to be increased, the obstruction cleaning assembly in the present embodiment can be directly installed in the space of the air intake passage 311, and the driving force can be maximized in the original space of the exhaust gas treatment device 30.
2. Through research, the driving force of the driving mechanism 10 is improved, and meanwhile, the cleaning mode of the original cylinder linear motion is changed into a rotary cleaning mode, so that the condition that the cylinder is blocked due to insufficient driving force is effectively avoided, and meanwhile, the crystallization of the air inlet of the combustion cavity can be effectively removed.
3. After the obstruction cleaning component of the embodiment is installed at the air inlet channel 311, the obstruction generated by the air inlet channel 311 can be cleaned in time by using the TEL-Trias-Ti/TiN-CVD 60K machine configuration calculation, so that the unnecessary shutdown maintenance time of the machine can be greatly reduced, and the unnecessary shutdown maintenance time can reach 1.5% of the normal operation time, thereby improving the productivity of the machine.
4. The downtime of the exhaust gas treatment device 30 at an unintended time is reduced, thereby greatly improving safety. Because the main machine station is still in normal flow when the exhaust gas treatment device 30 is suddenly down, the exhaust gas generated by the main machine station cannot be treated normally and timely, and the safety hazard exists.
5. If the requirement is applicable to other equipment which is easy to generate crystallization and needs to use the waste gas treatment device 30 due to the process requirement, the cleaning effect can be better improved.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples represent only a few embodiments of the present disclosure, which are described in more detail and detail, but are not to be construed as limiting the scope of the disclosure. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.
In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.
In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.
In this disclosure, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Claims (12)
1. An exhaust gas treatment device of a semiconductor process apparatus, comprising:
a blockage cleaning assembly, the blockage cleaning assembly comprising: the driving mechanism comprises at least two air cylinder monomers connected in series, wherein each air cylinder monomer comprises a cylinder barrel, a piston rod movably penetrating through the cylinder barrel and a piston movably arranged in the cylinder barrel and connected with the piston rod, and all the piston rods are sequentially connected in series to form a driving rod;
the scraping assembly is connected with the driving rod and is used for being movably arranged in an air inlet channel of the waste gas treatment device so as to remove the obstruction deposited on the inner wall of the air inlet channel;
the combustion chamber is provided with an air inlet channel and a waste discharge pipeline, the scraping component is movably arranged in the air inlet channel, and the waste discharge pipeline is used for being connected with a factory acid discharge receiving end;
the rotating mechanism is arranged between the driving rod and the scraping assembly, the driving rod is connected with the scraping assembly through the rotating mechanism, and the rotating mechanism comprises a first connecting rod and a sleeve; the sleeve comprises a first end and a second end which are opposite to each other, the first end is connected with the driving mechanism, the first connecting rod movably penetrates through the sleeve, and two ends of the first connecting rod are respectively connected with the driving rod and the scraping assembly; one of the first connecting rod and the sleeve is provided with a guide structure which is bent around the central axis of the rotating mechanism, and the other is provided with a guide piece matched with the guide structure; the guide piece is a needle body, a column body or a convex part fixedly connected to the inner wall of the sleeve; the guide structure is a spiral groove formed on the outer wall of the first connecting rod; the guide is inserted into the spiral groove.
2. The apparatus for treating an exhaust gas of a semiconductor processing device according to claim 1, wherein the guide structure is spiral around a central axis of the rotating mechanism.
3. The apparatus of claim 1, wherein the guide structure is a groove, a through hole, or a rail.
4. The apparatus according to claim 1, wherein the number of the guide structures is two, and the two guide structures are respectively located at opposite sides of the first connecting rod; the guide parts are two, and the two guide parts are correspondingly arranged in the two guide structures.
5. The apparatus of claim 1, wherein the scraping assembly comprises a coil and a second connecting rod, the coil and the second connecting rod are connected to the first connecting rod, and the second connecting rod is disposed through the coil.
6. The apparatus of claim 5, wherein the coil is a spiral coil, the coil including a first connection end movably sleeved on the first connection rod and a first free end disposed opposite the first connection end; the second connecting rod comprises a second connecting end connected with the first connecting rod and a second free end arranged opposite to the second connecting end; the inner diameter of the first connecting end is smaller than the outer diameter of the second connecting end.
7. The apparatus of claim 6, wherein the end of the second connecting rod is detachably connected to the end of the first connecting rod.
8. The apparatus according to claim 1, wherein the obstruction cleaning assembly further comprises a sealing cover connected to the second end, the sealing cover is provided with a through hole, the first connecting rod is movably inserted into the through hole, the first connecting rod is provided with a sealing abutting part, the sealing abutting part is in sealing abutting fit with the inner wall of the sleeve, and a chamber is formed between the sealing abutting part and the sealing cover; the obstruction cleaning assembly further comprises a pressure detector for detecting air pressure inside the chamber.
9. The apparatus of claim 8, wherein the obstruction cleaning assembly further comprises a seal ring sleeved on the first connecting rod, the seal ring being positioned at the through hole.
10. The exhaust gas treatment device of a semiconductor processing apparatus according to claim 1, wherein the cylinders of at least two of the cylinder units are sequentially connected in series and form an integrated structure.
11. The apparatus for treating an exhaust gas of a semiconductor processing device according to claim 1, wherein the cylinder block further comprises a first air inlet joint and a second air inlet joint; the first air inlet connector and the second air inlet connector are communicated with the piston chamber of the cylinder barrel and are respectively positioned on two opposite sides of the piston, and the first air inlet connector and the second air inlet connector are also communicated with an air source through an air inlet pipe.
12. A semiconductor processing apparatus, characterized in that the semiconductor processing apparatus comprises an exhaust gas treatment device of the semiconductor processing apparatus according to any one of claims 1 to 11, further comprising a semiconductor main stage, an exhaust gas pipe and a suction pump, wherein a waste discharge port of the semiconductor main stage is communicated with one end of the exhaust gas pipe, the other end of the exhaust gas pipe is communicated with the air intake passage, and the suction pump is arranged on the exhaust gas pipe in series for providing power to draw out the exhaust gas inside the semiconductor main stage.
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| CN202211070720.6A CN115318767B (en) | 2022-09-02 | 2022-09-02 | Semiconductor process equipment and waste gas treatment device |
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| CN202211070720.6A CN115318767B (en) | 2022-09-02 | 2022-09-02 | Semiconductor process equipment and waste gas treatment device |
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