CN115307689A - Wireless passive temperature and humidity monitoring device and method - Google Patents
Wireless passive temperature and humidity monitoring device and method Download PDFInfo
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- CN115307689A CN115307689A CN202211223886.7A CN202211223886A CN115307689A CN 115307689 A CN115307689 A CN 115307689A CN 202211223886 A CN202211223886 A CN 202211223886A CN 115307689 A CN115307689 A CN 115307689A
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
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- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
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Abstract
The invention belongs to the field of temperature and humidity monitoring and evaluation, and particularly relates to a wireless passive temperature and humidity monitoring device and method. The wireless passive temperature and humidity monitoring device takes a thermistor as a temperature sensitive element, takes an interdigital electrode capacitive sensor as a humidity sensitive element, and receives impedance change of the sensitive element through an integrated instrument control end, so that temperature and humidity at the sensor unit side are monitored; the method has the characteristics of no need of damaging the measured structure, high monitoring speed, high stability, low cost, miniaturization and strong field practicability. A wireless passive temperature and humidity monitoring device comprises: a sensor unit and an instrument control end; the sensor unit comprises a sensing side multi-turn inductance coil, a thermistor and an interdigital electrode, wherein the thermistor is connected with the sensing side multi-turn inductance coil in series; the instrument control end comprises an instrument control side multi-turn inductance coil, a current sampling module, a phase-locked amplifier, an embedded micro-control unit and a DDS module.
Description
Technical Field
The invention belongs to the field of temperature and humidity monitoring and evaluation, and particularly relates to a wireless passive temperature and humidity monitoring device and method.
Background
Most of the currently used temperature and humidity monitoring systems are active temperature and humidity sensors, and a power supply module needs to be arranged in a measured environment to provide energy for the sensors. The temperature and humidity sensor mode has the defects of troublesome power supply replacement, poor adaptability, difficult maintenance and the like. The wireless passive temperature and humidity sensor has incomparable advantages in these aspects, and particularly has unique advantages in certain special application scenes such as rotating parts and sealing parts.
In the existing wireless passive monitoring technology, an LC passive sensor is formed based on an electromagnetic coupling principle between inductance coils, the sensor is composed of a passive inductor and a capacitor, the inductance coils of an external reading system sense sensor signals through weak field coupling, the sensor component elements and the distance between the two coils can be used as parameter sensing units of a wireless passive sensing system, external energy supply is not needed, non-contact signal receiving and sending can be achieved, the sensor is a key point of testing and researching of wireless passive sensors at home and abroad at present, and the sensor is widely applied to testing of various parameters.
However, after further research, it is found that the existing LC passive temperature and humidity sensors use capacitors as sensitive elements, the change of capacitance values along with the temperature or humidity will cause the change of the resonant frequency of the system, and the current temperature or humidity information is obtained by measuring the resonant frequency, but the disadvantage is that the monitoring of the temperature and the humidity cannot be simultaneously completed by using the same equipment; and equipment is required to continuously generate excitation signals with different frequencies during monitoring, the requirement on the equipment is high, the difficulty in measuring the resonant frequency of the sensor is high, and the measurement is difficult to realize. In addition, two coils of the LC temperature and humidity sensor at the present stage are difficult to center and the distance is difficult to control, so that the application difficulty is higher. Therefore, it is necessary to provide a wireless passive portable in-situ temperature and humidity monitoring device and method which can simultaneously realize temperature and humidity monitoring only by fixed-frequency sinusoidal voltage signal excitation, does not need to damage a measured structure, and has the advantages of high monitoring speed, high stability, low cost, miniaturization and strong field practicability.
Disclosure of Invention
The invention provides a wireless passive temperature and humidity monitoring device and a method, wherein the wireless passive temperature and humidity monitoring device takes a thermistor as a temperature sensitive element and an interdigital electrode capacitance sensor as a humidity sensitive element, and receives the impedance change of the sensitive element through an integrated instrument control end, so that the temperature and humidity at the sensor unit side are monitored; meanwhile, the invention provides a wireless passive temperature and humidity monitoring method excited by a fixed-frequency sinusoidal voltage signal, and the wireless passive temperature and humidity monitoring device and method have the characteristics of no need of damaging a measured structure, high monitoring speed, high stability, low cost, miniaturization, strong field practicability and the like.
In order to solve the technical problem, the invention adopts the following technical scheme:
a wireless passive temperature and humidity monitoring device comprises: a sensor unit and an instrument control end;
the sensor unit comprises a sensing side multi-turn inductance coil, a thermistor and an interdigital electrode, wherein the thermistor is connected with the sensing side multi-turn inductance coil in series;
the instrument control end comprises an instrument control side multi-turn inductance coil, a current sampling module, a phase-locked amplifier, an embedded micro-control unit and a DDS module;
the sensor unit comprises a sensing side multi-turn inductance coil, a thermistor and an interdigital electrode, wherein the sensing side multi-turn inductance coil, the thermistor and the interdigital electrode in the sensor unit are prepared and formed in a flexible printing mode and are embedded into a material substrate to be monitored; the multi-turn inductance coil on the instrument control side and the multi-turn inductance coil on the sensing side form electromagnetic coupling matching.
Preferably, the embedded micro control unit selects a chip with the model number of STM32G071CBT 6;
the chip type STM32G071CBT6 embedded micro control unit has VDD pin connected to +3.3V working voltage; the VSS pin of the embedded micro control unit with the chip model number of STM32G071CBT6 is grounded; and an external crystal oscillator is connected and arranged between OSC _ IN pins and OSC _ OUT pins of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
Preferably, the current sampling module is composed of a sampling resistor, a current sampling input end with an SMA connector, a first current sampling amplifying circuit, a current sampling output end with an SMA connector and a second current sampling amplifying circuit;
the first current sampling amplifying circuit is formed by connecting a plurality of stages of first current sampling operational amplifiers in series, and the first operational amplifier is a chip with the model number of LM 7332;
the second current sampling amplifying circuit is formed by connecting a plurality of stages of second current sampling operational amplifiers in series, and the second operational amplifier is a chip with the model number of LM 7332.
Preferably, the DDS module is a chip with the model number of AD9833 BRMZ;
the DDS module with the model number of the AD9833BRMZ is connected with a VDD pin of +3.3V working voltage; the FSYNC pin of the DDS module with the model number of AD9833BRMZ is connected with the PB12 pin of the embedded micro-control unit with the model number of STM32G071CBT 6; the SCLK pin of the DDS module with the model number of AD9833BRMZ is connected with the PB13 pin of the embedded micro-control unit with the model number of STM32G071CBT 6; the SDATA pin of the DDS module with the model number of AD9833BRMZ is connected with the PB15 pin of the embedded micro-control unit with the model number of STM32G071CBT 6.
Preferably, the method further comprises the following steps: the SWD debugging module and the Schmitt trigger phase inverter are connected with the embedded micro-control unit;
the model of the SWD debugging module is JP _ STM32_ SWD; a VCC pin of an SWD debugging module with the model of JP _ STM32_ SWD is connected with +3.3V working voltage; the GND pin of the SWD debugging module with the model of JP _ STM32_ SWD is grounded; the SWCLK pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PA14-BOOT0 pin of the embedded micro control unit with the model of STM32G071CBT 6; the SWDAT pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PA13 pin of the embedded micro control unit with the model of STM32G071CBT 6; the NRST pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PF2-NRST pin of the embedded micro control unit with the model of STM32G071CBT 6;
the Schmitt trigger inverter is a chip with the model number of SN74LVC1G14 DBVR; the chip model is SN74LVC1G14DBVR, and the VCC pin of the Schmitt trigger inverter is connected with +3.3V working voltage; the GND pin of the Schmidt trigger inverter with the chip model number of SN74LVC1G14DBVR is grounded; the Y pin of the Schmidt trigger inverter with the chip model number of SN74LVC1G14DBVR is connected with the PA4 pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
Preferably, the method further comprises the following steps: the display unit connector is used for establishing a data connection relation between the embedded micro-control unit and the display unit;
the product number of the display unit connector is FPC0.5-30P _C132513; wherein, the Pin2 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB8 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin3 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB7 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin4 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB6 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin13 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB5 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin14 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB3 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
Preferably, the method further comprises the following steps: the low dropout regulator comprises a power supply module and a low dropout regulator module;
wherein, the power module selects a chip with the model of LM 2594M; the power supply module with the chip model LM2594M is used for converting +12V input voltage into +/-5V working voltage;
the low-voltage difference voltage stabilizing module adopts a chip with the model of NCP114ASN330T 1G; the low-dropout regulator module with the model number of the chip being NCP114ASN330T1G is used for converting the working voltage of +5V into the working voltage of + 3.3V.
Preferably, the method further comprises the following steps: the filtering unit is arranged between the current sampling module and the phase-locked amplifier; the filtering unit consists of a multistage low-pass buffer filtering amplifier and a low-pass filtering output end with an SMA joint which are connected in series; the low-pass buffer filter amplifier is a chip with the model number of LM 7332.
Preferably, the method further comprises the following steps: a coil centering device for aligning the sensing side multi-turn inductive coil and the instrument control side multi-turn inductive coil;
the coil centering device consists of a sensing side centering unit and an instrument control side centering unit; the sensing side centering unit is formed by a sensing side centering unit main body and a sensing side centering position arranged on the sensing side centering unit main body; the instrument control side centering unit consists of an instrument control side centering unit main body and an instrument control side centering unit arranged on the instrument control side centering unit main body; wherein, the centering and positioning of the sensing side and the centering and positioning of the instrument control side are matched with each other; and the main body of the sensing side centering unit is also provided with a positioning groove matched with the sensing side multi-turn inductance coil.
On the other hand, the invention provides a wireless passive temperature and humidity monitoring method, which comprises the following steps:
s101: determining the distance h between the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil according to the service environment;
measuring resonance frequency f when the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil are mutually inducted under the condition of the distance h;
s102: controlling the change of the environmental temperature under the constant humidity condition, and fitting to obtain a temperature-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil;
s103: adjusting the compensation capacitor of the sensing side multi-turn inductance coil to enable the frequency of a half-resonance impedance point when the compensation capacitor and the instrument control side multi-turn inductance coil mutually induct to fall on f under the condition that the humidity is 50%;
s104: controlling the change of environmental humidity under the constant temperature condition, and fitting to obtain a humidity-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil;
s105: embedding a sensing side multi-turn inductance coil into a sample of temperature and humidity to be monitored and fixing; aligning and fixing the multi-turn inductance coil at the control side of the instrument and the multi-turn inductance coil at the sensing side, and enabling the distance between the multi-turn inductance coil at the sensing side and the multi-turn inductance coil at the control side of the instrument to be h;
s106: enabling the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil to form excitation matching;
based on the temperature-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil obtained through fitting in the S102 step, temperature monitoring of a sample of temperature and humidity to be monitored is achieved;
and based on the humidity-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil obtained by fitting in the S104, realizing the humidity monitoring of the sample of the temperature and humidity to be monitored.
The invention provides a wireless passive temperature and humidity monitoring device and a method, wherein the wireless passive temperature and humidity monitoring device comprises a sensor unit and an instrument control end; the sensor unit comprises a sensing side multi-turn inductance coil, a thermistor connected with the sensing side multi-turn inductance coil in series, and an interdigital electrode connected with the sensing side multi-turn inductance coil in series; the instrument control end comprises an instrument control side multi-turn inductance coil, a current sampling module, a phase-locked amplifier, an embedded micro-control unit and a DDS module.
Compared with the prior art, the wireless passive temperature and humidity monitoring device and method with the structural characteristics at least have the following beneficial effects:
the measurement of the internal temperature and humidity of the sample to be monitored can be simultaneously finished by excitation at a fixed frequency, and the original structure of the original sample cannot be damaged (operations such as hole opening and the like are not needed); the monitoring device has the characteristics of small device, simple operation process, low cost, high reliability, high portability and the like. In addition, different thermistors and interdigital electrodes can be comprehensively considered and configured according to service environment so as to meet the requirements of different monitoring occasions.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
Fig. 1 is a block diagram of a wireless passive temperature and humidity monitoring device provided in the present invention;
FIG. 2 is a schematic diagram of an equivalent circuit of the monitoring device of the present invention during temperature monitoring;
FIG. 3 is a schematic diagram of an equivalent circuit of the humidity monitoring device of the present invention;
FIG. 4 is a schematic diagram of the equivalent circuit model of FIGS. 2 and 3 further simplified into a port network;
FIG. 5 is a schematic circuit diagram of an embedded micro-control unit of model STM32G071CBT 6;
FIG. 6a is a schematic circuit diagram of a sampling resistor, a current sampling input terminal with an SMA connector, a first current sampling amplifying circuit, and a current sampling output terminal with an SMA connector in a current sampling module;
FIG. 6b is a schematic circuit diagram of a second current sampling amplifying circuit in the current sampling module;
FIG. 7 is a schematic circuit diagram of a DDS module model AD9833 BRMZ;
FIG. 8 is a schematic circuit diagram of an SWD debug module of type JP _ STM32_ SWD;
FIG. 9 is a circuit schematic of a Schmitt trigger inverter model SN74LVC1G14 DBVR;
FIG. 10 is a schematic circuit diagram of a display unit connector model FPC0.5-30P _C132513;
FIG. 11 is a schematic circuit diagram of a power module model LM 2594M;
FIG. 12 is a circuit diagram of a low dropout regulator module of the type NCP114ASN330T 1G;
FIG. 13 is a circuit diagram of a filter unit;
FIG. 14 is a schematic diagram of the structure of the coil centering device;
fig. 15 is a schematic graph of the equivalent input impedance-frequency measured when the multi-turn inductor on the sensing side and the multi-turn inductor on the instrument control side are mutually induced in step S101;
FIG. 16 is a temperature-voltage amplitude variation curve of a sensing-side multi-turn inductor and an instrument control-side multi-turn inductor, which is obtained by plotting under a constant humidity condition;
fig. 17 is a schematic graph of the measured equivalent input impedance-frequency when the frequency of the half-resonance impedance point falls on f after the sensing-side multi-turn inductor and the instrument control-side multi-turn inductor are mutually induced in step S101;
fig. 18 is a graph of humidity-voltage amplitude variation curves of the sensing-side multi-turn inductor and the instrument-control-side multi-turn inductor obtained by plotting under a constant temperature condition.
Reference numerals:
110. a sensing side centering unit; 111. a sensing side centering unit main body; 112. centering and positioning the sensing side; 210. an instrument control side centering unit; 211. an instrument control side centering unit body; 212. the instrument control side is centered.
Detailed Description
The invention provides a wireless passive temperature and humidity monitoring device and a method, wherein the wireless passive temperature and humidity monitoring device takes a thermistor as a temperature sensitive element and an interdigital electrode capacitance sensor as a humidity sensitive element, and receives the impedance change of the sensitive element through an integrated instrument control end, so that the temperature and humidity at the sensor unit side are monitored; meanwhile, the invention provides a wireless passive temperature and humidity monitoring method excited by a fixed-frequency sinusoidal voltage signal, and the wireless passive temperature and humidity monitoring device and method have the characteristics of no need of damaging a measured structure, high monitoring speed, high stability, low cost, miniaturization, strong field practicability and the like.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, the wireless passive temperature and humidity monitoring device provided by the invention specifically comprises: sensor unit and instrument control end. The sensor unit further comprises a sensing side multi-turn inductance coil, a thermistor and an interdigital electrode, wherein the thermistor is connected with the sensing side multi-turn inductance coil in series, and the interdigital electrode is connected with the sensing side multi-turn inductance coil in series. The instrument control end further comprises an instrument control side multi-turn inductance coil, a current sampling module, a phase-locked amplifier, an embedded micro control unit and a DDS module.
The sensor unit comprises a sensing side multi-turn inductance coil, a thermistor and an interdigital electrode, wherein the sensing side multi-turn inductance coil, the thermistor and the interdigital electrode are prepared and formed in a flexible printing mode and embedded into a material substrate to be monitored. In addition, the instrument control side multi-turn inductance coil and the sensing side multi-turn inductance coil form electromagnetic coupling matching.
It should be noted that, as shown in fig. 2 or fig. 3, fig. 2 is a schematic diagram of an equivalent circuit of the monitoring device of the present invention during temperature monitoring, and fig. 3 is a schematic diagram of an equivalent circuit of the monitoring device of the present invention during humidity monitoring. Wherein, the signal generator Us is used for generating an alternating current sinusoidal excitation signal with fixed frequency; the sampling resistor R1 is used as an output end of a detection signal; l1 is a multi-turn inductance coil at the instrument control side; and an instrument control side compensation capacitor C1 for adjusting an impedance characteristic of the instrument control side.
When temperature monitoring is performed, as shown in fig. 2, a sensing-side multi-turn inductive coil L2 in the sensor unit is used for electromagnetically coupling with an instrument control-side multi-turn inductive coil L1, so that wireless and passive acquisition of internal temperature information of a to-be-monitored (sample) is realized. A thermistor R2 as a temperature sensitive element for sensing the internal temperature change of the (sample) to be monitored; the compensation capacitor C2 (optional) of the multi-turn inductor on the sensing side during temperature monitoring is used to adjust the impedance characteristics of the sensor unit.
When humidity monitoring is performed, as shown in fig. 3, a sensing-side multi-turn inductive coil L3 in the sensor unit is used for electromagnetically coupling with an instrument control-side multi-turn inductive coil L1, so that wireless and passive acquisition of humidity information in a to-be-monitored (sample) is realized. And the interdigital electrode C4 is used for sensing the change of the internal humidity of the (sample) to be monitored. And the compensation capacitor C3 of the multi-turn inductance coil at the sensing side in the humidity monitoring process is used for adjusting the impedance characteristic of the sensor unit. The compensation capacitor C2 (optional) of the multi-turn inductor at the sensing side during humidity monitoring is used to adjust the impedance characteristics of the sensor unit.
Based on the above equivalent circuit, the whole circuit of the monitoring device of the present invention can be further equivalent to a port network when viewed from the instrument control side compensation capacitor C1 to the sensor unit side, as shown in fig. 4. When the thermistor R2 changes resistance due to temperature change, the equivalent input impedance of the monitoring device of the invention changes along with the change of the resistance. Similarly, when the capacitance of the interdigital electrode C4 changes due to humidity change, the equivalent input impedance of the monitoring device of the present invention will change along with the change of the capacitance. At the moment, a low-resistance sampling resistor is connected in series between a voltage excitation source at the instrument control side and the port network, so that the change of the equivalent input impedance of the port network can be reflected through the voltage change at two ends of the sampling resistor, and the temperature and humidity (change) information corresponding to the sensor unit can be obtained through reverse extrapolation.
As a preferred embodiment of the present invention, as shown in fig. 5, the embedded micro control unit is a chip of type STM32G071CBT6, and the embedded micro control unit of type STM32G071CBT6 is configured to control the DDS module to generate a sinusoidal voltage excitation signal with a desired frequency, and perform monitoring calculation on a sampling electrical signal acquired by the current sampling module and formed by electromagnetic coupling of the multi-turn inductor coil on the instrument control side and the multi-turn inductor coil on the sensing side. Besides, the embedded micro control unit of STM32G071CBT6 model is also used to provide a reference signal for the lock-in amplifier.
It is worth noting that the STM32G071CBT6 type embedded micro control unit is a microprocessor chip produced by Italian semiconductor corporation, and has technical support of low pin count packaging, low power consumption and large-capacity memory; in addition, the microprocessor chip has simplified Power connection pins, an excellent EMS protection mechanism and leading hardware safety characteristics of the same level, strengthens the peripheral functions and increases the support to USB Type-C and Power Delivery. Specifically, a VDD pin of an embedded micro-control unit of which the chip model is STM32G071CBT6 is connected with +3.3V working voltage; the VSS pin of the embedded micro control unit with the chip model number of STM32G071CBT6 is grounded; and an external crystal oscillator is connected and arranged between OSC _ IN pins and OSC _ OUT pins of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
As a more preferred embodiment of the present invention, as shown in fig. 6a and 6b, the current sampling module includes a sampling resistor, a current sampling input terminal with an SMA connector, a first current sampling amplifier circuit, a current sampling output terminal with an SMA connector, and a second current sampling amplifier circuit. The current sampling module is specifically used for sampling an electric signal formed by electromagnetic coupling of the multi-turn inductance coil on the instrument control side and the multi-turn inductance coil on the sensing side.
As shown in fig. 6a, the first current sampling and amplifying circuit is formed by connecting multiple stages of first current sampling operational amplifiers in series (the first current sampling and amplifying circuit in fig. 6a is formed by three stages of first current sampling operational amplifiers), and the first operational amplifier is a chip with a model of LM 7332. As shown in fig. 6b, the second current sampling amplifying circuit is formed by connecting multiple stages of second current sampling operational amplifiers in series (in fig. 6b, the second current sampling amplifying circuit is formed by six stages of second current sampling operational amplifiers), and the second operational amplifier is a chip with a model number LM 7332.
As a preferred embodiment of the present invention, as shown in fig. 7, a chip with model number AD9833BRMZ is selected as the DDS module. The DDS module is used for generating a sinusoidal voltage excitation signal required by electromagnetic coupling of the sensing-side multi-turn inductance coil and the instrument control-side multi-turn inductance coil.
It is worth noting that the DDS module with the model AD9833BRMZ is a low-power, programmable waveform generator capable of generating sine wave, triangle wave and square wave outputs; the DDS module of the AD9833BRMZ model does not need external elements, and the output frequency and the phase can be programmed and adjusted through software. In addition, the DDS module of the AD9833BRMZ model is also provided with the following characteristics: a frequency register with 28 bit width is configured, and when the clock rate is 25MHz, the resolution of 0.1Hz can be realized; when the clock rate is 1MHz, the resolution of 0.004Hz can be realized; has a power saving function, thereby allowing unused parts in the device to be turned off and reducing power consumption to a low point. Specifically, a VDD pin of a DDS module with a chip model of AD9833BRMZ is connected with +3.3V working voltage; the FSYNC pin of the DDS module with the model number of AD9833BRMZ is connected with the PB12 pin of the embedded micro-control unit with the model number of STM32G071CBT 6; the SCLK pin of the DDS module with the model number of AD9833BRMZ is connected with the PB13 pin of the embedded micro-control unit with the model number of STM32G071CBT 6; the SDATA pin of the DDS module with the model number of AD9833BRMZ is connected with the PB15 pin of the embedded micro-control unit with the model number of STM32G071CBT 6.
As a more preferred embodiment of the present invention, as shown in fig. 8 or 9, the present invention further includes: and the SWD debugging module is connected with the embedded micro-control unit and the Schmitt trigger phase inverter. The SWD debugging module is used for completing simulation debugging of the embedded micro control unit with the chip model number of STM32G071CBT 6. The Schmitt trigger inverter is used as an independent inverter controller, and when the output is forbidden when the device is powered off, for example, the Schmitt trigger inverter can prevent the damage of abnormal current to each circuit device of the device when the power is off.
As shown in fig. 8, the model of the SWD debug module is JP _ STM32_ SWD; a VCC pin of an SWD debugging module with the model of JP _ STM32_ SWD is connected with +3.3V working voltage; the GND pin of the SWD debugging module with the model of JP _ STM32_ SWD is grounded; the SWCLK pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PA14-BOOT0 pin of the embedded micro control unit with the model of STM32G071CBT 6; the SWDAT pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PA13 pin of the embedded micro control unit with the model of STM32G071CBT 6; the NRST pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PF2-NRST pin of the embedded micro control unit with the model of STM32G071CBT 6;
as shown in fig. 9, the schmitt trigger inverter is a chip with model number SN74LVC1G14 DBVR; the chip model is SN74LVC1G14DBVR, and the VCC pin of the Schmitt trigger inverter is connected with +3.3V working voltage; the GND pin of the Schmitt trigger inverter with the chip model number of SN74LVC1G14DBVR is grounded; the Y pin of the Schmidt trigger inverter with the chip model number of SN74LVC1G14DBVR is connected with the PA4 pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
As a more preferred embodiment of the present invention, as shown in fig. 10, the present invention further includes: a display unit connector. The display unit connector is used for establishing a data connection relation between the embedded micro-control unit and the display unit.
Specifically, the product number of the display unit connector is FPC0.5-30p _c132513. Wherein, the Pin2 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB8 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin3 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB7 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin4 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB6 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin13 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB5 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin14 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB3 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
As a more preferred embodiment of the present invention, as shown in fig. 11 or 12, the present invention further includes: the low dropout regulator comprises a power supply module and a low dropout regulator module; the power module is used for supplying power to the wireless passive temperature and humidity monitoring device (for example, converting +12V voltage into +/-5V working voltage). And the low-dropout voltage stabilizing module is used for further converting the +5V working voltage into the +3.3V working voltage so as to supply power for the embedded micro control unit, the SWD debugging module, the DDS module and the like.
Specifically, as shown in fig. 11, the power module is a chip with a model number LM 2594M; the power supply module with the chip model LM2594M is used for converting the +12V input voltage into +/-5V working voltage. As shown in fig. 12, the low dropout regulator module is a chip with the model number NCP114ASN330T 1G; the low-dropout regulator module with the model number of the chip being NCP114ASN330T1G is used for converting the working voltage of +5V into the working voltage of + 3.3V.
As a more preferred embodiment of the present invention, as shown in fig. 13, the present invention further includes: and the filtering unit is arranged between the current sampling module and the phase-locked amplifier. The filtering unit is used for filtering and denoising voltage signals acquired by the sampling resistor in the current sampling module. Specifically, the filtering unit is composed of a multistage low-pass buffer filtering amplifier and a low-pass filtering output end with an SMA joint which are connected in series; the low-pass buffer filter amplifier is a chip with the model number of LM 7332.
In addition, as a preferred embodiment of the present invention, as shown in fig. 14, the wireless passive temperature and humidity monitoring device further includes a coil centering device, and the coil centering device can be used to align the sensing-side multi-turn inductor coil and the instrument control-side multi-turn inductor coil, so as to improve the electromagnetic coupling cooperation effect of the sensing-side multi-turn inductor coil and the instrument control-side multi-turn inductor coil to the maximum extent.
Specifically, as shown in fig. 14, the coil centering device is composed of a sensing-side centering unit and an instrument control-side centering unit; the sensing side centering unit is formed by a sensing side centering unit main body and a sensing side centering position arranged on the sensing side centering unit main body; the instrument control side centering unit consists of an instrument control side centering unit main body and an instrument control side centering unit arranged on the instrument control side centering unit main body; wherein, the centering and positioning of the sensing side and the centering and positioning of the instrument control side are matched with each other; and the main body of the sensing side centering unit is also provided with a positioning groove matched with the sensing side multi-turn inductance coil.
On the other hand, the invention also provides a wireless passive temperature and humidity monitoring method, which comprises the following steps:
s101: determining the distance h between the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil according to the service environment;
and measuring to obtain the resonant frequency f when the multi-turn inductance coil at the sensing side and the multi-turn inductance coil at the instrument control side are mutually inducted under the condition of the distance h.
Specifically, firstly, a technician determines the distance h between the sensing-side multi-turn inductance coil and the instrument control-side multi-turn inductance coil according to the service environment. For example: and aligning and adjusting the distance between the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil by using a coil centering device.
Further, measuring to obtain the resonant frequency f when the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil are mutually inducted under the condition of the distance h. It is noted that adjusting the ambient temperature of the sensor unit during the measurement results in a curve as shown in fig. 15. Namely: when the temperature changes, the resonance frequency of an LC resonance system formed by mutual inductance of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil changes slightly, and the input impedance of the LC resonance system changes greatly, so that a method of exciting by a sine voltage excitation signal with fixed frequency and then measuring the voltage at two ends of a sampling resistor in a current sampling module can be adopted to obtain temperature change information.
S102: and controlling the change of the environmental temperature under the constant humidity condition, and fitting to obtain a temperature-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil.
For example, the monitoring device is placed under a constant humidity condition (in a constant temperature and humidity box), the humidity of the constant temperature and humidity box is controlled to be constant, and the temperature of the constant temperature and humidity box is controlled to be changed step by step from 20 ℃ to 100 ℃ according to the amplitude of 0.5 ℃; the voltage amplitude change corresponding to each step of the electrical signal (including the real voltage part and the imaginary voltage part) is recorded, and a temperature-voltage amplitude change curve of the sensing-side multi-turn inductor and the instrument control-side multi-turn inductor is drawn, as shown in fig. 16. And then, fitting the change curve by using MATLAB software to obtain a temperature-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil.
S103: and adjusting the compensation capacitor of the multi-turn inductance coil on the sensing side to enable the frequency of a half-resonance impedance point when the multi-turn inductance coil on the instrument control side is mutually inducted to fall on f under the condition that the humidity is 50%.
According to the theory of the semi-resonant impedance point, the monitoring device can realize the simultaneous monitoring of the temperature and the humidity under the sine voltage excitation signal with fixed frequency. Specifically, before humidity calibration, the compensation capacitors of the sensor unit and the instrument control end are adjusted, so that the frequency of the corresponding half-resonant impedance point falls on f when the ambient humidity is 50%. At this time, the adjustment changes the ambient humidity of the sensor unit, and a curve as shown in fig. 17 can be obtained. And then when the humidity changes, exciting the instrument control side multi-turn inductance coil by a sine voltage signal with fixed frequency f, wherein the equivalent input impedance of an LC resonance system formed by the mutual inductance of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil has larger change, and temperature change information can be obtained by measuring the voltage change at two ends of a sampling resistor in the current sampling module. This also demonstrates the effectiveness of the wireless passive humidity monitoring method by using fixed frequency voltage signal excitation.
S104: and controlling the change of the environmental humidity under the constant temperature condition, and fitting to obtain a humidity-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil.
Similarly, the monitoring device is placed under a constant humidity condition (in a constant temperature and humidity box), the temperature of the constant temperature and humidity box is controlled to be constant, and the humidity of the test box is controlled to change step by step from 10% to 90% according to the amplitude of 1%; the voltage amplitude change corresponding to each step of the electrical signal (including the real voltage part and the imaginary voltage part) is recorded, and a humidity-voltage amplitude change curve of the sensing-side multi-turn inductive coil and the instrument-control-side multi-turn inductive coil is drawn, as shown in fig. 18. And then, fitting the change curve by using MATLAB software to obtain a humidity-voltage amplitude function of the sensing side multi-turn inductive coil and the instrument control side multi-turn inductive coil.
S105: embedding and fixing a sensing side multi-turn inductance coil into a sample of temperature and humidity to be monitored; the multi-turn inductance coil on the control side of the instrument and the multi-turn inductance coil on the sensing side are aligned and fixed, and the distance between the multi-turn inductance coil on the sensing side and the multi-turn inductance coil on the control side of the instrument is h.
S106: enabling the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil to form excitation matching;
based on the temperature-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil obtained by fitting in the S102, temperature monitoring of a sample of temperature and humidity to be monitored is achieved;
and based on the humidity-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil obtained by fitting in the S104, realizing the humidity monitoring of the sample of the temperature and humidity to be monitored.
It should be noted that, on the basis of the temperature-voltage amplitude function of the sensing-side multi-turn inductor coil and the instrument-control-side multi-turn inductor coil obtained by fitting in step S102 and the humidity-voltage amplitude function of the sensing-side multi-turn inductor coil and the instrument-control-side multi-turn inductor coil obtained by fitting in step S104, the temperature monitoring process and the humidity monitoring process of the sample to be monitored for the temperature and humidity can be respectively realized in steps after the coil centering device is used for accurately controlling the distance between the sensing-side multi-turn inductor coil and the instrument-control-side multi-turn inductor coil, and thus, redundant description is not repeated here.
Therefore, the wireless passive temperature and humidity monitoring device provided by the invention completes the whole evaluation process of temperature monitoring and humidity monitoring of the sample of the temperature and humidity to be monitored.
The invention provides a wireless passive temperature and humidity monitoring device and a method, wherein the wireless passive temperature and humidity monitoring device comprises a sensor unit and an instrument control end; the sensor unit comprises a sensing side multi-turn inductance coil, a thermistor and an interdigital electrode, wherein the thermistor is connected with the sensing side multi-turn inductance coil in series; the instrument control end comprises an instrument control side multi-turn inductance coil, a current sampling module, a phase-locked amplifier, an embedded micro-control unit and a DDS module.
Compared with the prior art, the wireless passive temperature and humidity monitoring device and method with the structural characteristics at least have the following beneficial effects:
the measurement of the internal temperature and humidity of the sample to be monitored can be simultaneously finished by excitation at a fixed frequency, and the original structure of the original sample cannot be damaged (operations such as hole opening and the like are not needed); the monitoring device has the characteristics of small device, simple operation process, low cost, high reliability, high portability and the like. In addition, different thermistors and interdigital electrodes can be comprehensively considered and configured according to the service environment so as to meet the requirements of different monitoring occasions.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The utility model provides a wireless passive temperature and humidity monitoring device which characterized in that, including: a sensor unit and an instrument control end;
the sensor unit comprises a sensing side multi-turn inductance coil, a thermistor and an interdigital electrode, wherein the thermistor is connected with the sensing side multi-turn inductance coil in series;
the instrument control end comprises an instrument control side multi-turn inductance coil, a current sampling module, a phase-locked amplifier, an embedded micro-control unit and a DDS module;
the sensor unit comprises a sensing side multi-turn inductance coil, a thermistor and an interdigital electrode, wherein the sensing side multi-turn inductance coil, the thermistor and the interdigital electrode in the sensor unit are prepared and formed in a flexible printing mode and are embedded into a material substrate to be monitored; the multi-turn inductance coil at the instrument control side and the multi-turn inductance coil at the sensing side form electromagnetic coupling matching.
2. The wireless passive temperature and humidity monitoring device according to claim 1, wherein the embedded micro control unit is a chip with a model number of STM32G071CBT 6;
the chip type STM32G071CBT6 embedded micro control unit has VDD pin connected to +3.3V working voltage; the VSS pin of the embedded micro control unit with the chip model number of STM32G071CBT6 is grounded; and an external crystal oscillator is connected and arranged between OSC _ IN pins and OSC _ OUT pins of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
3. The wireless passive temperature and humidity monitoring device according to claim 2, wherein the current sampling module is composed of a sampling resistor, a current sampling input end with an SMA connector, a first current sampling amplifying circuit, a current sampling output end with an SMA connector, and a second current sampling amplifying circuit;
the first current sampling amplifying circuit is formed by connecting a plurality of stages of first current sampling operational amplifiers in series, and the first operational amplifier is a chip with the model number of LM 7332;
the second current sampling amplifying circuit is formed by connecting a plurality of stages of second current sampling operational amplifiers in series, and the second operational amplifier is a chip with the model number of LM 7332.
4. The wireless passive temperature and humidity monitoring device according to claim 2, wherein the DDS module is a chip with a model number of AD9833 BRMZ;
the DDS module with the model number of the AD9833BRMZ is connected with a VDD pin of +3.3V working voltage; the FSYNC pin of the DDS module with the model number of AD9833BRMZ is connected with the PB12 pin of the embedded micro-control unit with the model number of STM32G071CBT 6; the SCLK pin of the DDS module with the model number of AD9833BRMZ is connected with the PB13 pin of the embedded micro-control unit with the model number of STM32G071CBT 6; the SDATA pin of the DDS module with the model number of AD9833BRMZ is connected with the PB15 pin of the embedded micro-control unit with the model number of STM32G071CBT 6.
5. The wireless passive temperature and humidity monitoring device according to claim 2, further comprising: the SWD debugging module and the Schmitt trigger phase inverter are connected with the embedded micro-control unit;
the model of the SWD debugging module is JP _ STM32_ SWD; a VCC pin of an SWD debugging module with the model of JP _ STM32_ SWD is connected with +3.3V working voltage; the GND pin of the SWD debugging module with the model of JP _ STM32_ SWD is grounded; the SWCLK pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PA14-BOOT0 pin of the embedded micro-control unit with the model of STM32G071CBT 6; the SWDAT pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PA13 pin of the embedded micro control unit with the model of STM32G071CBT 6; the NRST pin of the SWD debugging module with the model of JP _ STM32_ SWD is connected with the PF2-NRST pin of the embedded micro control unit with the model of STM32G071CBT 6;
the Schmitt trigger inverter is a chip with the model number of SN74LVC1G14 DBVR; the chip model is SN74LVC1G14DBVR, and a VCC pin of a Schmidt trigger inverter is connected with +3.3V working voltage; the GND pin of the Schmitt trigger inverter with the chip model number of SN74LVC1G14DBVR is grounded; the Y pin of the Schmidt trigger inverter with the chip model number of SN74LVC1G14DBVR is connected with the PA4 pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
6. The wireless passive temperature and humidity monitoring device according to claim 2, further comprising: the display unit connector is used for establishing a data connection relation between the embedded micro-control unit and the display unit;
the product number of the display unit connector is FPC0.5-30P _C132513; wherein, the Pin2 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB8 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin3 interface of the display unit connector with the product number of FPC0.5-30P \uC132513 is connected with the PB7 Pin of the embedded micro control unit with the chip model number of STM32G071CBT 6; the Pin4 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB6 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6; the Pin13 interface of the display unit connector with the product number of FPC0.5-30P \uC132513 is connected with a PB5 Pin of an embedded micro control unit with the chip model number of STM32G071CBT 6; the Pin14 interface of the display unit connector with the product number of FPC0.5-30P _C132513is connected with the PB3 Pin of the embedded micro-control unit with the chip model number of STM32G071CBT 6.
7. The wireless passive temperature and humidity monitoring device according to claim 2, further comprising: the low dropout regulator comprises a power supply module and a low dropout regulator module;
the power supply module is a chip with the model of LM 2594M; the power supply module with the chip model LM2594M is used for converting +12V input voltage into +/-5V working voltage;
the low-voltage difference voltage stabilizing module adopts a chip with the model of NCP114ASN330T 1G; the low-dropout regulator module with the model number of the chip being NCP114ASN330T1G is used for converting the working voltage of +5V into the working voltage of + 3.3V.
8. The wireless passive temperature and humidity monitoring device according to claim 1, further comprising: the filtering unit is arranged between the current sampling module and the phase-locked amplifier; the filtering unit consists of a multistage low-pass buffer filtering amplifier and a low-pass filtering output end with an SMA joint which are connected in series; the low-pass buffer filter amplifier is a chip with the model number of LM 7332.
9. The wireless passive temperature and humidity monitoring device according to claim 1, further comprising: the coil centering device is used for aligning the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil;
the coil centering device consists of a sensing side centering unit and an instrument control side centering unit; the sensing side centering unit is formed by a sensing side centering unit main body and a sensing side centering position arranged on the sensing side centering unit main body; the instrument control side centering unit consists of an instrument control side centering unit main body and an instrument control side centering unit arranged on the instrument control side centering unit main body; wherein, the centering and positioning of the sensing side and the centering and positioning of the instrument control side are matched with each other; and the main body of the sensing side centering unit is also provided with a positioning groove matched with the sensing side multi-turn inductance coil.
10. A wireless passive temperature and humidity monitoring method is characterized by comprising the following steps:
s101: determining the distance h between the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil according to the service environment;
measuring resonance frequency f when the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil are mutually inducted under the condition of the distance h;
s102: controlling the change of the environmental temperature under the constant humidity condition, and fitting to obtain a temperature-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil;
s103: adjusting the compensation capacitor of the sensing side multi-turn inductance coil to enable the frequency of a half-resonance impedance point when the compensation capacitor and the instrument control side multi-turn inductance coil mutually induct to fall on f under the condition that the humidity is 50%;
s104: controlling the change of the environmental humidity under the constant temperature condition, and fitting to obtain a humidity-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil;
s105: embedding and fixing a sensing side multi-turn inductance coil into a sample of temperature and humidity to be monitored; aligning and fixing the multi-turn inductance coil at the control side of the instrument and the multi-turn inductance coil at the sensing side, and enabling the distance between the multi-turn inductance coil at the sensing side and the multi-turn inductance coil at the control side of the instrument to be h;
s106: enabling the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil to form excitation matching;
based on the temperature-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil obtained by fitting in the S102, temperature monitoring of a sample of temperature and humidity to be monitored is achieved;
and based on the humidity-voltage amplitude function of the sensing side multi-turn inductance coil and the instrument control side multi-turn inductance coil obtained by fitting in the S104, realizing the humidity monitoring of the sample of the temperature and humidity to be monitored.
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