CN115303798A - Vacuum adsorption system and method - Google Patents
Vacuum adsorption system and method Download PDFInfo
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- CN115303798A CN115303798A CN202210907886.2A CN202210907886A CN115303798A CN 115303798 A CN115303798 A CN 115303798A CN 202210907886 A CN202210907886 A CN 202210907886A CN 115303798 A CN115303798 A CN 115303798A
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- adsorption
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- adsorption hole
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0266—Control or detection relating to the load carrier(s)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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Abstract
The invention relates to a production detection technology of a semiconductor display module, in particular to a vacuum adsorption system and a method, wherein the system comprises a controller and a plurality of plugging units which are respectively connected with the controller; the plurality of plugging units are arranged in the vacuum adsorption platform and are controlled by the controller; under the control of the controller, the plugging unit reciprocates relative to the adsorption hole site on the vacuum adsorption platform so as to plug or open the adsorption hole site, and the opened adsorption hole site is used for generating suction to an adsorbed object; the vacuum adsorption system at least comprises a first adsorption state, in the first adsorption state, part of the plugging units plug the adsorption hole sites, and part of the plugging units open the adsorption hole sites. The invention can solve the technical problem that the vacuum adsorption component needs to be locally arranged or replaced when the existing display module adsorbs products with different sizes in the production process.
Description
Technical Field
The invention relates to a production detection technology of a semiconductor display module, in particular to a vacuum adsorption system and a method.
Background
In the display industry, the quality of a semiconductor display module has a direct influence on the quality and the service life of display electronic products. Therefore, in the production process of the display screen, the semiconductor display module needs to be correspondingly detected. In the detection process of the display module, the display module needs to be positioned and/or carried; in the handling of display module assembly, the corresponding vacuum adsorption device of current ripe solution for the display module assembly customization of each size model, through the display area of the fixed display module assembly of vacuum adsorption. Wherein the vacuum adsorption device is generally provided with a platform/pressure head for realizing vacuum adsorption.
Because the display screen of display module assembly production, if the screen is dressed to cell-phone, the size is not of uniform size, when carrying out commodity circulation transport, processing procedure operation through the vacuum adsorption display module assembly product, the production demand of the inconsistent display screen of size can't be satisfied simultaneously to the vacuum design part of each platform/pressure head, therefore needs to change the platform/pressure head that accords with the product vacuum adsorption requirement according to different size products.
In addition, the existing vacuum adsorption methods mainly include two types:
the first way is to divide the area into a region A, a region B and a region C by vacuum layout as shown in FIG. 1; the pneumatic switch is used for controlling the required vacuum area, and due to the limitation of the processing technology of the vacuum pipeline, when the vacuum pipeline is adsorbed by products with different sizes, the edges of the individual products can not be completely adsorbed, and the shapes of warping deformation and the like are generated, and deviation and poor bubble are generated during the lamination. As shown in fig. 2, since the sizes of the various screens (i.e., products) are different, the edge position of a specific product covers a half area of the vacuum hole and leaks the half area (as shown by the black dotted line frame in fig. 2), the adhesive tape cannot be completely sealed; when the product size spans to C district vacuum area, because do not cover C district completely, the product border position adsorbs (as shown by the grey dotted line frame of fig. 2), if do not close C district vacuum area then equipment can take place the vacuum adsorption failure warning this moment, if close C district vacuum area then the product border position can't adsorb, the product can flagging/warpage, causes the laminating precision unstable.
The second method is without vacuum partition, as shown in fig. 3, the whole platform/pressure head uses one vacuum partition, and during production, the vacuum holes of the redundant area need to be plugged by using an anti-static adhesive tape, which needs to be replaced periodically, thus consuming time and material. As shown in fig. 4, when the model of the adsorbed product is switched each time, the vacuum holes in the redundant area of the platform/pressure head are blocked by using the anti-static adhesive tape according to the size of the product; and the platform/pressure head anti-static adhesive tape is damaged and needs to be attached again in the production process, foreign matters are easy to generate when the adhesive tape is worn, bad risks exist, and the production process is time-consuming and material-consuming.
Above-mentioned two kinds of vacuum adsorption modes all can not be general to various not unidimensional display module assembly products, all need be according to dedicated platform of display module assembly product installation/pressure head, and the tool expense rises.
Disclosure of Invention
The embodiment of the invention provides a vacuum adsorption system and a vacuum adsorption method, which can solve the technical problem that products with different sizes are adsorbed by an existing display module in the production process and the vacuum adsorption component needs to be locally arranged or replaced.
In one aspect, an embodiment of the present invention provides a vacuum adsorption system, where the vacuum adsorption system includes a controller, and multiple plugging units respectively connected to the controller;
the plurality of plugging units are arranged in the vacuum adsorption platform; under the control of the controller, the plugging unit reciprocates relative to the adsorption hole site on the vacuum adsorption platform so as to plug or open the adsorption hole site, and the opened adsorption hole site is used for generating suction to an adsorbed object;
the vacuum adsorption system at least comprises a first adsorption state, in the first adsorption state, part of the plugging units plug the adsorption hole sites, and part of the plugging units open the adsorption hole sites.
In some embodiments, the vacuum adsorption system further comprises:
the cavity is communicated with the adsorption hole;
the interface is connected with the cavity;
and the air pump is connected with the interface and used for pumping air or exhausting air to the cavity so as to adjust the pressure in the cavity.
In some embodiments, the occlusion unit comprises:
the device comprises an armature, an electromagnet, a plug, a supporting mechanism and a spring;
the supporting mechanism is fixed on the bottom plate, the armature is connected with the supporting mechanism, and the spring is connected between the bottom plate and the armature;
the electromagnet is arranged on the bottom plate corresponding to the armature;
the plug is arranged at the top of the armature, and the armature reciprocates relative to the adsorption hole under the action of the elastic force of the spring and/or the electromagnetic attraction force of the electromagnet;
the supporting mechanism is a sliding rail connected with the armature in a sliding mode, or a telescopic rod fixedly connected with the armature.
In some embodiments, the controller is configured to determine a product placement area corresponding to the adsorbed object in the vacuum adsorption platform according to input information, control the adsorption hole locations in the product placement area to be opened, and block the adsorption hole locations outside the product placement area.
In a further preferred embodiment, the vacuum adsorption system further comprises a human-computer interface connected with the controller, and the plugging control mode of the adsorption hole site comprises the following steps:
the human-computer interface is used for acquiring click operation information of a user for opening or closing the adsorption hole site and inputting a control signal of the opened and/or closed adsorption hole site to the controller; or alternatively
The human-computer interface is used for obtaining the size information of the adsorbed object, and the controller determines and displays the area of the adsorption hole position required to be opened.
In a further preferred embodiment, the control manner of the controller to the plugging unit includes:
the electromagnet generates magnetic force after being electrified, and adsorbs the armature to open the adsorption hole; after the electromagnet is powered off, the armature is reset by the spring to block the adsorption hole position.
On the other hand, the embodiment of the invention also provides a vacuum adsorption method, which comprises the following steps:
acquiring input information;
the controller determines a product placing area corresponding to an adsorbed object in the vacuum adsorption platform according to the input information, controls the adsorption hole sites in the product placing area to be opened, and plugs the adsorption hole sites outside the product placing area;
wherein, a plurality of plugging units are arranged in the vacuum adsorption platform; under the control of the controller, the plugging unit reciprocates relative to the adsorption hole site on the vacuum adsorption platform so as to plug or open the adsorption hole site, and the opened adsorption hole site is used for generating suction force on an adsorbed object.
Compared with the prior art, the vacuum adsorption system and the method provided by the embodiment of the invention are universal for display module products with different sizes, and when the products with different sizes are transported by vacuum adsorption, components of an adsorption device do not need to be replaced or arranged, so that the steps and time of cutting a machine are reduced, and the production efficiency of equipment is improved. Because every adsorbs the hole site and all can carry out the shutoff through the end cap, the product of being carried can be adsorbed completely, and has guaranteed precision, stability when product and vacuum adsorption platform laminating. In addition, the plugging area of the adsorption hole position does not need to be plugged by an adhesive tape and the like, so that production consumables are saved; the adsorption hole position is controlled through electromagnetic adsorption, the vacuum hole area can be quickly adjusted through a human-computer interface, the adsorption position is automatically calculated, and quantitative management is easy.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a vacuum sucking mode by vacuum layout partitioning in the prior art;
FIG. 2 is a schematic diagram of a vacuum sucking method by vacuum layout partition in the prior art when sucking a product;
FIG. 3 is a schematic diagram of a vacuum suction method without vacuum partition in the prior art;
FIG. 4 is a schematic diagram of a prior art vacuum suction mode without vacuum zones for sucking a product;
FIG. 5 is a schematic diagram of a vacuum adsorption system provided by an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating selection of a vacuum hole region via a human-machine interface in a control manner according to an embodiment of the present invention;
FIG. 7 is a schematic diagram illustrating the movement of a product to a blocked area after selecting a vacuum hole area via a human-machine interface in a control manner according to an embodiment of the invention;
FIG. 8 is a schematic diagram of the selection of a vacuum hole area through a human-machine interface in another control mode provided by an embodiment of the invention;
fig. 9 is a flow chart of a vacuum adsorption method according to another embodiment of the present invention.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to illustrate the invention, and not to limit the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict. The embodiments will be described in detail below with reference to the accompanying drawings.
Example 1
As shown in fig. 5, the vacuum adsorption system of the present embodiment includes a controller and a plurality of plugging units 2 respectively connected to the controller. The controller in this embodiment adopts the PLC control circuit board 1, and may also be a single chip microcomputer or other embedded systems, which are not described herein again.
The plurality of plugging units are arranged in a vacuum adsorption platform 3 of the adsorption mechanism and are controlled by a PLC control circuit board 1; under the control of the PLC control circuit board 1, the plugging unit reciprocates relative to the adsorption hole site 32 on the vacuum adsorption platform so as to plug or open the adsorption hole site, and the opened adsorption hole site is used for generating suction force on an adsorbed object. The vacuum adsorption system of the embodiment at least comprises a first adsorption state, in the first adsorption state, part of the plugging units plug adsorption hole sites, and part of the plugging units open the adsorption hole sites, so that a product placement area where a measured object is located is further set to be in a vacuum state.
Further, the present embodiment may be further preferably: the vacuum adsorption system also comprises a cavity communicated with the adsorption hole position, an interface connected with the cavity and an air pump connected with the interface, wherein the air pump is used for pumping air or exhausting air to the cavity so as to adjust the pressure in the cavity.
In the present embodiment, the plugging unit includes a bottom plate 26, an armature 21, an electromagnet 22, a plug 24, a support mechanism, and a spring 25; the supporting mechanism is fixed on the bottom plate 26, the armature 21 is connected with the supporting mechanism, and the spring 25 is connected between the bottom plate 26 and the armature 21; the electromagnet 22 is arranged on the bottom plate 26 corresponding to the armature 21; the plug 24 is arranged on the top of the armature 21, and the armature 21 reciprocates relative to the adsorption hole under the action of the elastic force of the spring 25 and/or the electromagnetic attraction force of the electromagnet 22. The supporting mechanism can be realized by a slide rail 23, the electromagnet 22 and the slide rail 23 are fixed on a bottom plate 26, and the armature 21 is connected with the slide rail 23 in a sliding manner. Further preferably, the plug 24 is cylindrical or conical, and a rubber sealing ring can be added on the plugging contact surface of the plug to achieve a better sealing effect; the material of the plug body can be rubber or stainless steel, but is not limited to the above two industrial materials. In addition, the expansion tension of the spring is larger than the vacuum adsorption force of the vacuum adsorption platform, so that vacuum leakage is prevented.
As an optional embodiment, the slide rail is used as a supporting mechanism for realizing the up-and-down movement of the plug, and a telescopic rod can be used for replacing the slide rail, the armature is fixedly connected with the telescopic rod, and the reciprocating movement of the plug relative to the adsorption hole position is realized through the expansion and contraction of the telescopic rod.
As an optional embodiment, the PLC control circuit board is disposed outside the vacuum adsorption platform 3, and the plurality of plugging units are fixed in the vacuum adsorption platform; the electromagnet of each plugging unit is connected with the PLC control circuit board through a control cable, and the control cable penetrates through the bottom 31 of the vacuum adsorption platform and is connected to the PLC control circuit board. And sealing glue is used for plugging the through hole of the control cable at the bottom of the platform, so that vacuum leakage is prevented.
As an optional embodiment, the PLC control circuit board determines a product placement area corresponding to the adsorbed object in the vacuum adsorption platform according to input information (for example, product size), and controls the adsorption hole sites in the product placement area to open through a program of the circuit board, and controls the plugging unit to plug the excess adsorption hole sites outside the product placement area on the platform.
The vacuum adsorption system of this embodiment still include with the human-computer interface that the controller is connected, the shutoff control mode of adsorbing the hole site includes:
the human-computer interface is used for acquiring click operation information of a user for opening or closing the adsorption hole site and inputting a control signal of the opened and/or closed adsorption hole site to the controller; or alternatively
The human-computer interface is used for obtaining the size information of the adsorbed object, and the controller determines and displays the area of the adsorption hole position required to be opened.
Namely, the specific plugging control modes of the adsorption hole position can be two, wherein the first plugging control mode is as follows:
firstly, clicking and selecting a corresponding touchable selector switch 41 on a human-computer interface through the equipment human-computer interface 4, so as to input an adsorption hole position needing to be opened and/or closed to a PLC control circuit board;
secondly, the PLC control circuit board controls the plugging unit to move upwards to plug the vacuum holes, and as shown in figure 6, a vacuum hole area with 3-4 matrix gray dots is shown;
and thirdly, conveying and placing the product 5 (namely, the display module) into the set vacuum hole area through a conveying mechanism according to the determined vacuum hole area, as shown in fig. 7.
The second control mode can realize automatic calculation according to the product size, and specifically comprises the following steps:
inputting the size of a vacuum adsorption platform and the size of a product into a human-computer interface of equipment, automatically calculating a vacuum hole area required to be used by a controller, and displaying the vacuum hole area on the human-computer interface, as shown in a gray area of fig. 8;
and secondly, calculating the carrying and placing position of the product by the PLC according to the determined vacuum hole area.
In the two control modes, the control modes of the PLC control circuit board to the plugging unit are the same and are as follows: the electromagnetic coil generates magnetic force after being electrified, the armature is absorbed by the electromagnet, namely the armature is absorbed by the electromagnet, and the absorption hole position is opened; after the electromagnetic coil is powered off, the spring pulls the armature up, namely, the armature is reset, so that the adsorption hole position is blocked.
In a further preferred embodiment, the plurality of plugging units are arranged in one-to-one correspondence with the plurality of adsorption hole sites on the vacuum adsorption platform, and the opening or closing of each adsorption hole site is independently controlled, so that the vacuum adsorption platform is suitable for products with any shapes and cross adsorption requirements, such as a module mobile phone and a wearable product containing a display screen body and a Flexible Printed Circuit (FPC). The existing vacuum adsorption mode needs to separately increase an adsorption mechanism of a Flexible Printed Circuit (FPC), the vacuum hole part of the platform/pressure head cannot be separately opened and/or closed, if the adsorption hole position needing to be opened is needed to be adsorbed, the adsorption hole position of the whole platform/pressure head can be vacuumized, and therefore vacuum alarm is achieved. In the preferred embodiment of the invention, each adsorption hole position can be independently controlled, so that the hole position can be set and opened according to different FPC shapes of the flexible circuit board, the optimal position is selected for opening, and the FPC with various shapes can be compatible and suitable.
Example 2
The invention also provides a specific implementation mode of the vacuum adsorption method through the embodiment based on the same inventive concept as the vacuum adsorption system provided by the embodiment 1. As shown in fig. 9, the vacuum adsorption method of the present embodiment includes the steps of:
inputting information through a human-computer interface;
the controller determines a product placing area corresponding to an adsorbed object in a vacuum adsorption platform of the display module according to information input by the human-computer interface, controls adsorption hole sites in the product placing area to be opened, and plugs the adsorption hole sites outside the product placing area;
wherein, a plurality of plugging units are arranged in the vacuum adsorption platform; under the control of the controller, the plugging unit reciprocates relative to the adsorption hole site on the vacuum adsorption platform so as to plug or open the adsorption hole site, and the opened adsorption hole site is used for generating suction force on an adsorbed object;
the plugging unit comprises an armature, an electromagnet, a plug, a supporting mechanism and a spring, wherein the supporting mechanism is fixed on the bottom plate, the armature is connected with the supporting mechanism, and the spring is connected between the bottom plate and the armature; the electromagnet is arranged on the bottom plate corresponding to the armature; the plug is arranged at the top of the armature, and the armature reciprocates relative to the adsorption hole under the action of the elastic force of the spring and/or the electromagnetic attraction force of the electromagnet.
In this embodiment, the input information is click operation information of a user for opening or closing the adsorption hole, or size information of an adsorbed object; there are two plugging control modes for the adsorption hole site, which are the same as those in embodiment 1 and are not repeated.
It is to be understood that the present application is not limited to the particular arrangements and instrumentality described above and shown in the attached drawings. A detailed description of known methods is omitted herein for the sake of brevity. In the above embodiments, several specific steps are described and shown as examples. However, the method processes of the present application are not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications, and additions or change the order between the steps after comprehending the spirit of the present application.
The functional blocks shown in the above structural block diagrams may be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it may be, for example, an electronic circuit, an Application Specific Integrated Circuit (ASIC), suitable firmware, plug-in, function card, or the like. When implemented in software, the elements of the present application are the programs or code segments used to perform the required tasks. The program or code segments may be stored in a machine-readable medium or transmitted by a data signal carried in a carrier wave over a transmission medium or a communication link. A "machine-readable medium" may include any medium that can store or transfer information. Examples of a machine-readable medium include an electronic circuit, a semiconductor memory device, a ROM, a flash memory, an Erasable ROM (EROM), a floppy disk, a CD-ROM, an optical disk, a hard disk, an optical fiber medium, a Radio Frequency (RF) link, and so forth. The code segments may be downloaded via computer networks such as the internet, intranets, etc.
It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
Aspects of the present disclosure are described above with reference to flowchart illustrations and/or block diagrams of methods, apparatus and computer program products according to embodiments of the disclosure. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions/acts specified in the flowchart and/or block diagram block or blocks. Such a processor may be, but is not limited to, a general purpose processor, a special purpose processor, an application specific processor, or a field programmable logic circuit. It will also be understood that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware for performing the specified functions or acts, or combinations of special purpose hardware and computer instructions.
As will be apparent to those skilled in the art, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application.
Claims (10)
1. The vacuum adsorption system is characterized by comprising a controller and a plurality of plugging units which are respectively connected with the controller;
the plurality of plugging units are arranged in the vacuum adsorption platform; under the control of the controller, the plugging unit reciprocates relative to the adsorption hole site on the vacuum adsorption platform so as to plug or open the adsorption hole site, and the opened adsorption hole site is used for generating suction to an adsorbed object;
the vacuum adsorption system at least comprises a first adsorption state, in the first adsorption state, part of the plugging units plug the adsorption hole sites, and part of the plugging units open the adsorption hole sites.
2. The vacuum adsorption system of claim 1, further comprising:
the cavity is communicated with the adsorption hole position;
an interface connected with the cavity;
and the air pump is connected with the interface and used for pumping air or exhausting air to the cavity so as to adjust the pressure in the cavity.
3. The vacuum sorption system of claim 1, wherein the plugging unit comprises:
the device comprises an armature, an electromagnet, a plug, a supporting mechanism and a spring;
the supporting mechanism is fixed on the bottom plate, the armature is connected with the supporting mechanism, and the spring is connected between the bottom plate and the armature;
the electromagnet is arranged on the bottom plate corresponding to the armature;
the plug is arranged at the top of the armature, and the armature reciprocates relative to the adsorption hole under the action of the elastic force of the spring and/or the electromagnetic attraction force of the electromagnet;
preferably, the support mechanism is a slide rail connected with the armature in a sliding manner, or a telescopic rod fixedly connected with the armature.
4. The vacuum adsorption system of claim 3, wherein the plug is cylindrical or conical, and a rubber sealing ring is arranged on a plugging contact surface of the plug.
5. The vacuum adsorption system of claim 3, wherein the controller is disposed outside the vacuum adsorption platform, the electromagnet of each plugging unit is connected to the controller through a control cable, and the control cable passes through the bottom of the vacuum adsorption platform and is connected to the controller.
6. The vacuum adsorption system of claim 1, wherein the controller is configured to determine a product placement area corresponding to the adsorbed object in the vacuum adsorption platform according to input information, control the adsorption hole locations in the product placement area to be opened, and block the adsorption hole locations outside the product placement area.
7. The vacuum adsorption system of claim 6, further comprising a human-machine interface connected to the controller, wherein the plugging control of the adsorption hole site comprises:
the human-computer interface is used for acquiring click operation information of a user for opening or closing the adsorption hole site and inputting a control signal of the opened and/or closed adsorption hole site to the controller; or
The human-computer interface is used for obtaining the size information of the adsorbed object, and the controller determines and displays the area of the adsorption hole position required to be opened.
8. The vacuum adsorption system of claim 3, wherein the controller controls the plugging unit in a manner comprising:
the electromagnet generates magnetic force after being electrified, and adsorbs the armature to open the adsorption hole; after the electromagnet is powered off, the armature is reset by the spring to block the adsorption hole position.
9. The vacuum adsorption system of claim 1, wherein a plurality of the plugging units are arranged in one-to-one correspondence with the adsorption hole sites, and the opening or closing of each adsorption hole site is individually controlled by the plugging units.
10. A vacuum adsorption method, comprising the steps of:
acquiring input information;
the controller determines a product placing area corresponding to an adsorbed object in the vacuum adsorption platform according to the input information, controls the adsorption hole sites in the product placing area to be opened, and plugs the adsorption hole sites outside the product placing area;
wherein, a plurality of plugging units are arranged in the vacuum adsorption platform; under the control of the controller, the plugging unit reciprocates relative to the adsorption hole site on the vacuum adsorption platform so as to plug or open the adsorption hole site, and the opened adsorption hole site is used for generating suction force on an adsorbed object.
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| CN202210907886.2A CN115303798A (en) | 2022-07-29 | 2022-07-29 | Vacuum adsorption system and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115338806A (en) * | 2022-10-20 | 2022-11-15 | 苏州科韵激光科技有限公司 | Subregion vacuum adsorption device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115338806A (en) * | 2022-10-20 | 2022-11-15 | 苏州科韵激光科技有限公司 | Subregion vacuum adsorption device |
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