CN115302031A - Deformation compensation welding method for microstrip plate and cavity and welding workpiece - Google Patents
Deformation compensation welding method for microstrip plate and cavity and welding workpiece Download PDFInfo
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- CN115302031A CN115302031A CN202210979548.XA CN202210979548A CN115302031A CN 115302031 A CN115302031 A CN 115302031A CN 202210979548 A CN202210979548 A CN 202210979548A CN 115302031 A CN115302031 A CN 115302031A
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- 238000003466 welding Methods 0.000 title claims abstract description 177
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000003825 pressing Methods 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 56
- 238000005476 soldering Methods 0.000 claims description 17
- -1 polytetrafluoroethylene Polymers 0.000 claims description 12
- 230000005496 eutectics Effects 0.000 claims description 10
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004677 Nylon Substances 0.000 claims description 2
- 239000002033 PVDF binder Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims description 2
- 229920001778 nylon Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 230000035515 penetration Effects 0.000 description 8
- 238000005219 brazing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention provides a deformation compensation welding method of a microstrip plate and a cavity and a welding workpiece, wherein the welding method comprises the steps of assembling the microstrip plate and the cavity according to the sequence of the microstrip plate, the cavity or the microstrip plate, the cavity and the microstrip plate, and arranging a solder layer between the microstrip plate and the cavity to obtain a component to be welded; placing the assembly to be welded between a welding cushion block and a welding pressing block for assembly, and arranging a deformation compensation medium layer between the assembly to be welded and the welding cushion block and/or the welding pressing block to obtain a welding workpiece; and carrying out heating welding treatment on the welding workpiece. According to the welding method provided by the invention, the deformation compensation medium layer is designed on the component to be welded and the welding cushion block and/or the welding pressing block, and the microstrip plate and the cavity are extruded by utilizing the thermal expansion of the deformation compensation medium material, so that an acting force is generated, the microstrip plate and the cavity are further tightly pressed, an excellent welding effect can be obtained without changing the original tool form, and the method is simple and effective.
Description
Technical Field
The invention relates to the technical field of welding of microstrip plates, in particular to a deformation compensation welding method and a welding workpiece for a microstrip plate and a cavity.
Background
With the continuous development of electronic information technology, the requirements of modularization and light weight are increasingly improved, and the requirement of assembly integration level is increasingly high. In the fields of aerospace, aviation, electronics and the like, the design of cavity single/double-sided welding microstrip boards is frequently repeated, wherein more functions can be realized under the same volume by adopting the cavity double-sided welding microstrip boards.
When the traditional micro-strip plate is welded in a large area, the welding pressing block is adopted to apply uniform pressure to the surface of the micro-strip plate, when a weldment is welded, the weldment is stressed due to the change of temperature, and the welding pressing block applies pressure to the surface of the micro-strip plate at the moment, so that the micro-strip plate is tightly pressed with a shell of a cavity, and the effects of improving the welding penetration rate of the micro-strip plate and forming good welding are achieved.
For the cavity single/double-sided welding microstrip plate, when the traditional tool is used for clamping, although the microstrip plate can be tightly pressed with the shell of the cavity under the pressure of the welding pressing block, the microstrip plate and the cavity are easy to deform at high welding temperature, and the pressing effect of the welding pressing block is insufficient. Particularly, when the microstrip plates are welded on two sides of the cavity, the upper microstrip plate directly receives pressure of a welding pressing block, the upper microstrip plate is tightly pressed with the shell, a good welding effect can be achieved, but for the lower microstrip plate, the traditional tool cannot directly apply uniform pressure to the lower microstrip plate, and the lower microstrip plate is only supported by the lower welding cushion block and is not enough to tightly press the microstrip plate with the shell (as shown in fig. 1). Therefore, when the microstrip plates are welded on the two sides of the cavity, poor welding phenomena such as low brazing penetration rate and the like easily occur on the lower microstrip plate. High frequency circuits are particularly sensitive to this type of defects which can lead to reduced product performance or even functional non-compliance.
Most of the existing methods for welding the two sides of the cavity with the microstrip plate simultaneously and directly load and weld the upper surface and the lower surface of a part through a G-shaped clamp. According to the method, the tool provides pressing force for the lower-layer micro-strip plate, a special tool needs to be designed according to different structural shapes, the special tool is complex in design and large in heat capacity, so that the matching requirement on welding process design is high, the welding difficulty is high, and the time cost and the material cost are increased by designing the special tool.
Disclosure of Invention
Based on the technical problems in the prior art, the invention provides a deformation compensation welding method for a microstrip plate and a cavity and a welding workpiece, wherein a deformation compensation medium layer is designed on a component to be welded and a welding cushion block and/or a welding pressing block, and the microstrip plate and the cavity are extruded by utilizing the thermal expansion of deformation compensation medium materials, so that an acting force is generated, the microstrip plate and the cavity are further tightly pressed, an excellent welding effect can be obtained without changing the original tool form, and the method is simple and effective.
The invention provides a deformation compensation welding method of a microstrip plate and a cavity, which comprises the following steps:
assembling the microstrip plate and the cavity according to the sequence of the microstrip plate and the cavity or the sequence of the microstrip plate, the cavity and the microstrip plate, and arranging a solder layer between the microstrip plate and the cavity to obtain a component to be welded;
placing the component to be welded between a welding cushion block and a welding pressing block for assembly, and arranging a deformation compensation medium layer between the component to be welded and the welding cushion block and/or the welding pressing block to obtain a welded workpiece;
and carrying out heating welding treatment on the welding workpiece.
In the invention, by designing the deformation compensation medium layer, the material of the deformation compensation medium layer has higher Z-axis thermal expansion coefficient, so that in the heating welding process, the deformation compensation medium layer is adaptive to the deformation of the cavity welding microstrip plate, and the thermal expansion of the deformation compensation medium material generates acting force on the microstrip plate and the cavity, so that the microstrip plate and the cavity are tightly pressed, the loading force of the tool is better acted on the microstrip plate, and the brazing penetration rate and the welding effect are improved.
Preferably, the components to be welded, the welding cushion blocks and the welding pressing blocks are assembled in sequence from bottom to top;
preferably, the welding cushion block is used for bearing the component to be welded; the welding pressing block is used for pressing the assembly to be welded so as to keep smooth and fit.
Preferably, the solder layer is a soldering lug or solder paste, preferably a tin-lead eutectic soldering lug;
preferably, the soldering lug wets the welding surface between the microstrip board and the cavity during the heating welding treatment.
In the invention, the tin-lead eutectic soldering lug can realize effective infiltration and soldering between the micro-strip plate and the cavity.
Preferably, the deformation compensating dielectric layer thermally expands during the heat welding process to accommodate deformation of the components to be welded.
Preferably, the deformation compensation medium layer has a temperature resistance higher than the heat welding process temperature.
According to the invention, the tolerance temperature of the deformation compensation dielectric layer is higher than the heating welding treatment temperature, so that the deformation compensation dielectric layer can not generate any post-welding residue.
Preferably, the material of the deformation compensation medium layer is at least one selected from polytetrafluoroethylene, polyethylene, polypropylene, polyvinylidene fluoride, acetal, nylon, a heat conducting pad, a rubber pad or an epoxy rubber pad, and is preferably polytetrafluoroethylene.
In the invention, the material selection of the deformation compensation medium layer needs to match with welding parameters so as to adapt to welding deformation.
In the invention, when the welding treatment is carried out under the condition that the welding flux layer is a tin-lead eutectic welding piece, the polytetrafluoroethylene has higher thermal expansion coefficient and good temperature resistance, so that when the deformation compensation medium layer is made of the polytetrafluoroethylene, excellent welding effect can be obtained, and no excess is generated after welding.
Preferably, the thickness of the deformation compensation medium layer is 0.5-20mm.
In the invention, the welding treatment is generally low-temperature brazing, and when the thickness of the deformation compensation dielectric layer is 0.5-20mm, a good deformation compensation effect can be generated.
Preferably, the microstrip board is a single-layer board or a multi-layer board;
preferably, the thickness of the microstrip plate is 0.5-4mm.
The invention also provides a welding workpiece of the microstrip plate and the cavity, which comprises a welding cushion block, a deformation compensation medium layer, a component to be welded, a welding flux layer and a welding pressing block;
the assembly to be welded comprises a microstrip plate, a cavity or a microstrip plate, a cavity and a microstrip plate which are assembled in sequence, and the solder layer is arranged between the microstrip plate and the cavity;
the component to be welded is arranged between the welding cushion block and the welding pressing block, and the deformation compensation medium layer is arranged between the component to be welded and the welding cushion block and/or the welding pressing block.
The invention also provides a finished product of the welding assembly of the microstrip plate and the cavity, which is obtained by welding by the welding method.
In the invention, in order to obtain a good welding effect, the deformation compensation welding method of the microstrip plate and the cavity mainly needs to control the following three aspects:
firstly, selecting a proper deformation compensation medium layer according to the welding temperature, calculating the thickness of the required deformation compensation medium layer according to the thermal expansion coefficient of the deformation compensation medium layer and the thermal expansion coefficient and thickness of the microstrip plate, and designing the deformation compensation medium layer with a certain thickness; secondly, designing a rigid welding cushion block, clamping a compensation medium layer between the component to be welded and the rigid welding cushion block or a welding pressing block, and assembling into a welding workpiece; thirdly, designing a proper welding temperature curve and starting welding.
Compared with the prior art, the invention has the following beneficial effects:
(1) The invention can adapt to welding the microstrip plate on one side of the cavity, and the deformation compensation medium layer is arranged and thermally expands during heating welding treatment, so that acting force is generated on the microstrip plate or the cavity, the microstrip plate and the cavity are tightly pressed, the tool loading force acts on the microstrip plate better, and the welding effect is improved.
(2) The invention can also be adapted to the cavity double-side welding microstrip plate, and the deformation compensation medium layer is arranged and thermally expands during the heating welding treatment so as to adapt to the deformation of the cavity double-side welding microstrip plate and generate acting force on the microstrip plate or the cavity, and the microstrip plate and the cavity are tightly pressed together as well, thereby realizing the high brazing penetration rate of the cavity double-side welding microstrip plate.
(3) The welding method only additionally designs and adds a deformation compensation medium layer, does not change the original welding tool form, and has low cost and simple operation; the method has the advantages of low matching requirement on welding process design, small welding difficulty, greatly improved assembly efficiency and product quality due to implementation effect, and simplicity and effectiveness.
(4) The welding method has universality, and can be used for adapting to welding deformation only by selecting the material of the deformation compensation medium layer matched with the welding parameters, so that the welding method is applicable to welding deformation of other similar structures.
Drawings
FIG. 1 is a schematic view of a tooling assembly structure of a traditional cavity double-sided welding microstrip plate;
FIG. 2 is a schematic view of a tooling assembly structure for welding micro-strip plates on both sides of a cavity according to the present invention;
FIG. 3 is a schematic view of a tooling assembly structure for welding a microstrip plate on a single side of a cavity according to the invention.
Detailed Description
Hereinafter, the technical solution of the present invention will be described in detail by specific examples, but these examples should be explicitly proposed for illustration, but should not be construed as limiting the scope of the present invention.
Example 1
In order to obtain a high-frequency welding assembly in which the microstrip plate needs to be assembled on both the front side and the back side of the cavity, and the welding penetration rate of the microstrip plate is not less than 85%, the embodiment provides a deformation compensation welding method for the microstrip plate and the cavity, which includes:
(1) Providing a raw material: welding a pressing block 2-01, wherein the material is brass, and the thickness is 16mm; the microstrip board 2-02 and the microstrip board 2-04 are double-layer boards made of dielectric materials RO6002 (the thermal expansion coefficients of X, Y and Z axes are 16, 16 and 24 respectively, and the unit is 10E-6 ppm/DEG C), wherein the thickness of a copper-clad layer is 0.035mm, the thickness of a dielectric layer is 0.508mm, the thickness of the whole board is 0.618mm, and the size of the microstrip board is 75mm multiplied by 35mm; 2-03, the material of the cavity is 2A12 aluminum alloy, the thickness is 2mm, and the surface of the aluminum alloy is subjected to silver plating treatment; the deformation compensation medium layer 2-05 is made of polytetrafluoroethylene, the size of the deformation compensation medium layer is matched with the appearance of the microstrip plate, the thermal expansion coefficient is 135 multiplied by 10E-6 ppm/DEG C, the long-term tolerance temperature is 260 ℃, and the thickness is 2mm; the number of the rigid welding cushion block is 2-06, the material is brass, and the thickness is 12mm; the eutectic soldering lug of tin and lead has the eutectic temperature of 183 ℃ and the peak soldering temperature of 215-220 ℃;
(2) Pretreatment: baking the micro-strip plate 2-02 and the micro-strip plate 2-04 according to the general requirements, coating tin and removing gold, cutting a soldering lug according to the appearance of the micro-strip plate, and coating soldering flux on two sides;
(3) Welding and assembling: referring to FIG. 2, a rigid welding cushion block 2-06, a deformation compensation dielectric layer 2-05, a microstrip plate 2-04, a tin-lead eutectic soldering lug, a cavity 2-03, a tin-lead eutectic soldering lug, a microstrip plate 2-02 and a welding pressing block 2-01 are assembled into a whole from bottom to top to obtain a welding workpiece;
(4) Welding treatment: placing a rigid welding cushion block in a welding workpiece on the bottommost layer, placing the welding workpiece in a brazing furnace to start welding, wherein the welding peak temperature is 215-220 ℃, and the welding time is 60-120 s, so as to obtain a welded assembly;
(5) And (3) post-treatment: and after welding is finished, cleaning and inspecting the obtained welded assembly.
Comparative example 1
In order to obtain a high-frequency welding assembly with a cavity body of which the front and back sides are both required to be provided with the microstrip plates, the comparative example also provides a welding method of the microstrip plates and the cavity body, and the operation is the same as that of the embodiment 1 except that the deformation compensation medium layers 2-05 are not additionally arranged during welding assembly;
the welded assembly welded according to the method of this comparative example had a reverse micro-strip plate weld penetration of much less than 85%.
Example 2
In order to obtain a welded assembly for assembling a microstrip plate on a single surface of a cavity in a large area, wherein the welding penetration rate of the microstrip plate is not less than 85%, the embodiment provides a deformation compensation welding method for the microstrip plate and the cavity, which comprises the following steps:
(1) Providing raw materials: 3-01 of a welding pressing block, wherein the material is brass, and the thickness is 16mm; the deformation compensation medium layer 3-02 is made of polytetrafluoroethylene, the size of the deformation compensation medium layer is matched with the appearance of the microstrip plate, the thermal expansion coefficient is 135 multiplied by 10E-6 ppm/DEG C, the long-term tolerance temperature is 260 ℃, and the thickness is 5mm; the microstrip plate 3-03 is a large-size microstrip plate, the material of the microstrip plate is also a double-layer plate made of a dielectric material RO6002 (the thermal expansion coefficients of X, Y and Z axes are respectively 16, 16 and 24, and the unit is 10E-6 ppm/DEG C), the thickness of the whole plate is 1.6mm, and the size of the microstrip plate is 150mm multiplied by 30mm; the cavity 3-04 is made of 2A12 aluminum alloy, the thickness of the cavity is 2mm, and the surface of the aluminum alloy is subjected to silver plating treatment; the eutectic temperature of the tin-lead soldering lug is 183 ℃, and the peak welding temperature is 215-220 ℃;
(2) Pretreatment: baking the micro-strip plate 3-02 according to general requirements, coating tin and removing gold, cutting a soldering lug according to the appearance of the micro-strip plate, and coating soldering flux on two sides;
(3) Welding and assembling: referring to FIG. 3, assembling a cavity 3-04, a tin-lead eutectic soldering lug, a micro-strip plate 3-03, a deformation compensation medium layer 3-02 and a welding pressing block 3-01 into a whole from bottom to top to obtain a welding workpiece;
(4) Welding treatment: putting the welding workpiece into a brazing furnace to start welding, wherein the welding peak temperature is 215-220 ℃, and the time is 60-120 s, so as to obtain a welding assembly;
(5) And (3) post-treatment: and after welding is finished, cleaning and inspecting the obtained welded assembly.
Comparative example 2
In order to obtain a welding assembly for assembling the micro-strip plate on the single surface of the cavity in a large area, the comparative example also provides a welding method for the micro-strip plate and the cavity, and the operation is the same as that of the embodiment 2 except that the deformation compensation medium layer 3-02 is not additionally arranged during welding assembly;
the resulting welded assembly, welded as described in this comparative example, also had a weld penetration of less than 85%.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. A deformation compensation welding method for a microstrip plate and a cavity is characterized by comprising the following steps:
assembling the microstrip plate and the cavity according to the sequence of the microstrip plate and the cavity or the sequence of the microstrip plate, the cavity and the microstrip plate, and arranging a solder layer between the microstrip plate and the cavity to obtain a component to be welded;
placing the assembly to be welded between a welding cushion block and a welding pressing block for assembly, and arranging a deformation compensation medium layer between the assembly to be welded and the welding cushion block and/or the welding pressing block to obtain a welding workpiece;
and carrying out heating welding treatment on the welding workpiece.
2. The deformation compensation welding method for the microstrip plate and the cavity according to claim 1, wherein the components to be welded, the welding cushion block and the welding pressing block are assembled in the order from bottom to top;
preferably, the welding cushion block is used for bearing the component to be welded; the welding pressing block is used for pressing the assembly to be welded so as to keep smooth and fit.
3. The deformation compensation soldering method of the microstrip board and the cavity according to claim 1 or 2, wherein the solder layer is a solder piece or solder paste, preferably a tin-lead eutectic solder piece;
preferably, the soldering lug wets the welding surface between the microstrip board and the cavity during the heating welding treatment.
4. A method for distortion compensation welding of a microstrip plate to a cavity according to any one of claims 1 to 3 wherein said distortion compensation medium layer is thermally expanded during the heat welding process to adapt to the distortion of the components to be welded.
5. A method for distortion compensation welding of a microstrip plate to a cavity according to any one of claims 1 to 4 wherein said distortion compensation dielectric layer is resistant to temperatures higher than the heat welding process temperature.
6. A method for welding a microstrip plate to a cavity according to any one of claims 1 to 5, wherein the material of the deformation compensation medium layer is at least one selected from the group consisting of polytetrafluoroethylene, polyethylene, polypropylene, polyvinylidene fluoride, acetal, nylon, heat conductive gasket, rubber gasket and epoxy gasket, preferably polytetrafluoroethylene.
7. The method of any one of claims 1 to 6, wherein the thickness of the strain-compensating dielectric layer is 0.5 to 20mm.
8. A method for distortion compensation welding of a microstrip plate to a cavity according to any one of claims 1 to 7 wherein said microstrip plate is a single layer plate or a multilayer plate;
preferably, the thickness of the microstrip plate is 0.5-4mm.
9. A welding workpiece of a microstrip plate and a cavity is characterized by comprising a welding cushion block, a deformation compensation medium layer, a component to be welded, a welding flux layer and a welding pressing block;
the assembly to be welded comprises a microstrip plate, a cavity or a microstrip plate, a cavity and a microstrip plate which are assembled in sequence, and the solder layer is arranged between the microstrip plate and the cavity;
the component to be welded is arranged between the welding cushion block and the welding pressing block, and the deformation compensation medium layer is arranged between the component to be welded and the welding cushion block and/or the welding pressing block.
10. A finished product of a welded assembly of a microstrip plate and a cavity, which is obtained by welding according to the welding method of any one of claims 1 to 8.
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| CN202210979548.XA CN115302031A (en) | 2022-08-16 | 2022-08-16 | Deformation compensation welding method for microstrip plate and cavity and welding workpiece |
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| CN202210979548.XA CN115302031A (en) | 2022-08-16 | 2022-08-16 | Deformation compensation welding method for microstrip plate and cavity and welding workpiece |
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Application publication date: 20221108 |