CN115301352A - Preparation method of epoxy resin - Google Patents
Preparation method of epoxy resin Download PDFInfo
- Publication number
- CN115301352A CN115301352A CN202210964900.2A CN202210964900A CN115301352A CN 115301352 A CN115301352 A CN 115301352A CN 202210964900 A CN202210964900 A CN 202210964900A CN 115301352 A CN115301352 A CN 115301352A
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- grinding
- epoxy resin
- knocking
- cylinder
- grinding cylinder
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 136
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 136
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000002245 particle Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims description 37
- 238000012216 screening Methods 0.000 claims description 30
- 238000004140 cleaning Methods 0.000 claims description 14
- 239000004593 Epoxy Substances 0.000 claims description 13
- 238000007790 scraping Methods 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 2
- 238000007873 sieving Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 description 13
- 239000004744 fabric Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 239000008187 granular material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C15/00—Disintegrating by milling members in the form of rollers or balls co-operating with rings or discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C23/00—Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in preceding groups or not specially adapted to apparatus covered by a single preceding group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/28—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/42—Drive mechanisms, regulating or controlling devices, or balancing devices, specially adapted for screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
- B07B1/46—Constructional details of screens in general; Cleaning or heating of screens
-
- B08B1/165—
-
- B08B1/20—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Abstract
The invention discloses a preparation method of epoxy resin. According to the preparation method of the epoxy resin, epoxy resin processing equipment is adopted to prepare the epoxy resin, the grinding roller is controlled to reciprocate relative to the grinding frame along the radial direction of the grinding cylinder, the distance between the grinding roller and the inner wall of the grinding cylinder is adjusted to control the size of the ground epoxy resin particles according to the particle size of the epoxy resin, the grinding roller is then utilized to rotate relative to the circumferential direction of the grinding cylinder along with the grinding frame in the grinding cylinder, grinding treatment on the epoxy resin between the grinding roller and the inner wall of the grinding cylinder can be formed, accurate grinding treatment on the epoxy resin is further achieved, and the grinding quality of the epoxy resin is improved.
Description
Technical Field
The invention belongs to the technical field of epoxy resin, and particularly relates to a preparation method of epoxy resin.
Background
Epoxy resin is an organic high molecular compound containing two or more than two epoxy groups in a molecule, can be subjected to cross-linking reaction with various curing agents to form an insoluble and infusible three-dimensional network structure polymer, and has excellent mechanical property, adhesive property, electrical insulating property and chemical resistance, so that the epoxy resin is widely applied to the fields of coatings, foods, chemical industry, corrosion prevention, machinery, electronics, electricity and the like.
At present, when the epoxy resin is prepared, the massive epoxy resin generally needs to be ground into powder for adding and using, but the grinding of the epoxy resin in the existing equipment still has the following problems:
1. because the existing grinding equipment generally has complicated control on grinding precision, the required epoxy resin particle size cannot be ground during grinding;
2. in the grinding process, the epoxy resin powder inevitably adheres to the grinding tool, which has certain influence on grinding efficiency and grinding quality, so that the grinding tool needs to be cleaned regularly, but manual cleaning not only wastes time and labor, but also influences the working progress, and the efficiency is not high;
3. in the grinding process, the ground epoxy resin powder generally needs to be screened, and then the epoxy resin which is not screened is poured into a grinding mechanism for grinding again, so that the method has complicated steps and is troublesome to operate;
4. in the screening process, some epoxy resin blocks up on the sieve mesh, hinders the screening for the screening is not smooth and easy, reduces work efficiency, but also can cause epoxy resin's waste.
Disclosure of Invention
In view of the above problems, the present invention discloses a method for preparing an epoxy resin to overcome the above problems or at least partially solve the above problems.
According to the preparation method of the epoxy resin, epoxy resin processing equipment is adopted to carry out preparation operation of the epoxy resin, the epoxy resin processing equipment comprises a hopper, a grinding cylinder and a grinding mechanism, the hopper is positioned above the grinding cylinder and communicated with the grinding cylinder, and the grinding mechanism is positioned in the grinding cylinder; the grinding mechanism comprises a grinding frame and a grinding roller, wherein the grinding roller is connected with the grinding frame and can rotate along the inner part of the grinding cylinder along with the grinding frame relative to the circumferential direction of the grinding cylinder and can move back and forth relative to the grinding frame along the radial direction of the grinding cylinder;
the preparation method of the epoxy resin specifically comprises the following steps:
step S1, preparation: putting the epoxy resin to be ground into the hopper, and enabling the epoxy resin to fall into the grinding cylinder; the grinding roller is controlled to move relative to the grinding frame along the radial direction of the grinding cylinder, and the distance between the grinding roller and the inner wall of the grinding cylinder is adjusted according to the size of the required epoxy resin particles;
step S2, high-speed grinding: and controlling the grinding frame to rotate relatively in the grinding cylinder, so that the grinding cylinder rotates relatively to the inner wall of the grinding cylinder, and grinding operation on epoxy resin is formed between the grinding roller and the inner wall of the grinding cylinder.
Preferably, the grinding mechanism further comprises a telescopic rod and a V-shaped connecting rod; the bending part of the V-shaped connecting rod is rotatably connected with the grinding frame, one end of the telescopic rod is connected with the grinding frame, the other end of the telescopic rod is rotatably connected with one end of the V-shaped connecting rod, and the grinding roller is arranged at the other end of the V-shaped connecting rod.
Preferably, the grinding mechanism is provided with a plurality of grinding rollers and a plurality of V-shaped connecting rods; the plurality of V-shaped connecting rods are sequentially connected with the grinding rack in a rotating mode along the circumferential direction of the grinding rack, the telescopic rod is connected with one end of one of the V-shaped connecting rods, the plurality of V-shaped connecting rods are sequentially connected through the straight rod, and two ends of the straight rod are respectively connected with two adjacent V-shaped connecting rods in a rotating mode; the grinding rollers are respectively arranged on the V-shaped connecting rods.
Preferably, the grinding cylinder and the grinding frame can rotate, and the grinding cylinder and the grinding frame rotate in opposite directions; and in the high-speed grinding in the step S2, controlling the grinding cylinder to rotate at the same time.
Preferably, the epoxy resin processing equipment further comprises a grinding sleeve, a first bevel gear, a second bevel gear, a third bevel gear, a first straight gear, a second straight gear and a third straight gear; the first bevel gear is coaxially and fixedly connected with the grinding cylinder, the grinding sleeve is coaxially and rotatably arranged with the first bevel gear, and the second bevel gear is sleeved and fixed on the grinding sleeve and is in meshed connection with the first bevel gear through the third bevel gear; one end of the grinding sleeve is positioned in the grinding cylinder and is provided with a first spur gear, the grinding frame is fixedly sleeved on the grinding sleeve, the second spur gear is rotatably arranged on the grinding frame and is in meshed connection with the first spur gear, and the third spur gear is coaxially and fixedly connected with the grinding roller and is in meshed connection with the second spur gear.
Preferably, the epoxy resin processing equipment further comprises a first scraper; the first scraper is arranged on the grinding rack, can move back and forth relative to the grinding rack along the radial direction of the grinding cylinder and is in contact with the inner wall of the grinding cylinder; the preparation method of the epoxy resin further comprises the step S4 of scraping and cleaning: the first scraper is controlled to move towards the direction close to the inner wall of the grinding cylinder relative to the grinding frame and to contact with the inner wall of the grinding cylinder, and then the first scraper slides relative to the inner wall of the grinding cylinder under the driving of the grinding frame, so that the inner wall of the grinding cylinder is scraped and cleaned.
Preferably, the epoxy resin processing equipment further comprises a second scraper; the second scraper blade is arranged on the grinding frame, and the grinding roller can move relative to the grinding frame to be in contact with the second scraper blade and rotate; in the scraping and cleaning process of the step S4, the method further includes controlling the grinding roll to move relative to the grinding rack to contact with the second scraper and rotate to scrape and clean the surface of the grinding roll.
Preferably, the epoxy resin processing equipment further comprises a screen; the screen is positioned at the downstream position of the grinding cylinder and is used for containing and screening the ground epoxy resin particles; the preparation method of the epoxy resin also comprises a step S3 of low-speed screening: and sieving the grinded epoxy resin particles through the screen.
Preferably, the screen serves as the bottom of the grinding cylinder and adopts a V-shaped structure; in the low-speed screening process of the step S3, the rotation speed of the grinding cylinder is reduced, so that the ground epoxy resin particles fall to the screen and complete the screening operation in the process of sliding along the screen slope, and when the grinding cylinder rotates at a high speed again, the epoxy resin particles which fail to pass through the screen move up to between the grinding roller and the inner wall of the grinding cylinder by using centrifugal force to perform the secondary grinding treatment.
Preferably, the epoxy resin processing equipment further comprises a boss disc, a knocking disc and a knocking elastic piece; the boss disc is positioned below the screen, the upper surface of the boss disc is fixedly connected with the screen, the lower surface of the boss disc is provided with a knocking plane, a knocking platform and a knocking inclined plane, the knocking platform is arranged along the circumferential direction of the boss disc and is higher than the knocking plane, and the knocking inclined plane is connected with one end of the knocking plane and one end of the knocking platform; the knocking disc is positioned below the boss disc, the upper surface of the knocking disc is provided with a protrusion, and the knocking disc can perform reciprocating movement in the vertical direction and rotation in the circumferential direction relative to the boss disc, so that the protrusion can perform relative movement along the knocking plane, the knocking inclined plane and the knocking platform in sequence; the knocking elastic piece is positioned on the lower surface of the knocking disc and drives the knocking disc to move upwards; in the low-speed screening process of the step S3, the boss disc rotates relative to the knocking disc, the elastic part is knocked on the knocking plane, the knocking platform and the knocking inclined plane are matched with each other, the knocking disc is formed to knock the boss disc in a reciprocating mode in the vertical direction, and the vibrating screening of the screen mesh is formed.
The preparation method of the epoxy resin provided by the invention has the following beneficial technical effects:
1. in the preparation method of the epoxy resin, the distance between the grinding roller and the inner wall of the grinding cylinder can be adjusted according to the particle size of the epoxy resin by controlling the grinding roller to reciprocate relative to the grinding frame along the radial direction of the grinding cylinder, so that the size of the ground epoxy resin particles can be controlled, meanwhile, the grinding roller rotates along with the grinding frame in the grinding cylinder along the circumferential direction of the grinding cylinder, so that the grinding treatment of the epoxy resin between the grinding roller and the inner wall of the grinding cylinder can be formed, the accurate grinding treatment of the epoxy resin is realized, and the grinding quality of the epoxy resin is improved.
2. In the preparation method of the epoxy resin, the plurality of grinding rollers are connected and arranged on the grinding frame by adopting the V-shaped connecting rod and the straight rod, so that the synchronous movement control of the plurality of grinding rollers can be realized by using one telescopic rod as a power source, and the adjustment efficiency of the positions of the grinding rollers is improved.
3. In the preparation method of the epoxy resin, the first scraper blade and the second scraper blade are arranged on the grinding frame, so that the first scraper blade can be used for scraping and cleaning the grinding cylinder in the process of rotating the grinding frame relative to the grinding cylinder, and the second scraper blade can be used for scraping and cleaning the outer surface of the grinding cylinder by utilizing the rotation of the grinding roller, thereby ensuring the grinding quality and efficiency of the epoxy resin.
4. In the preparation method of the epoxy resin, the screen is used as the bottom of the grinding cylinder and the V-shaped structural design is adopted, so that the grinding treatment of the epoxy resin in the high-speed rotation process and the screening operation of the ground epoxy resin particles in the low-speed rotation process can be realized by controlling the rotation speed of the grinding cylinder, and the automatic grinding and screening effects are improved.
5. According to the preparation method of the epoxy resin, the boss disc and the knocking disc are arranged below the screen, so that reciprocating knocking operation on the boss disc is formed by utilizing reciprocating movement of the knocking disc relative to the boss disc in the vertical direction, vibration screening of the screen is further realized, and the screening effect on epoxy resin particles is improved.
Drawings
FIG. 1 is a schematic diagram of the outline structure of the epoxy resin processing apparatus of the present embodiment;
FIG. 2 is a schematic diagram of a first perspective structure of a partial cross section of the epoxy resin processing apparatus according to the present embodiment;
FIG. 3 is a second perspective view of the epoxy resin processing apparatus of the present embodiment;
FIG. 4 is a schematic view of a first viewing angle of the polishing mechanism in a polishing state according to the present embodiment;
FIG. 5 is a schematic view of a second perspective configuration of the polishing mechanism of the present embodiment in a polishing state;
FIG. 6 is a schematic diagram illustrating a third perspective configuration of the polishing mechanism in a polishing state according to the present embodiment;
FIG. 7 is a schematic view of a first perspective configuration of the polishing mechanism in a cleaning state according to the present embodiment;
FIG. 8 is a schematic view of a second perspective configuration of the polishing mechanism of the present embodiment in a cleaning state;
FIG. 9 is a schematic structural diagram of the boss plate according to the present embodiment;
fig. 10 is a schematic structural diagram of the external shape of the knocking disk in the embodiment.
Detailed Description
The technical solution of the present invention will be further described in detail with reference to the accompanying drawings and embodiments.
Referring to fig. 1 to 10, the present embodiment discloses an epoxy resin processing apparatus, which includes a hopper 1, a grinding cylinder 2, and a grinding mechanism. Wherein, the hopper 1 and the grinding cylinder 2 are arranged on the bracket 4 in sequence along the height direction, the outlet of the hopper 1 is communicated with the inlet of the grinding cylinder 2, and the grinding mechanism is positioned in the grinding cylinder 2 and is used for grinding the epoxy resin in the grinding cylinder 2.
The grinding mechanism comprises a grinding frame 5 and three grinding rollers 6, wherein the three grinding rollers 6 are uniformly distributed on the grinding frame 5 along the circumferential direction, and the three grinding rollers 6 can rotate along with the grinding frame 5 in the inner part of the grinding cylinder 2 along the circumferential direction of the grinding cylinder 2 and can move in a reciprocating manner along the radial direction of the grinding cylinder 2 relative to the grinding frame 5.
At the moment, epoxy resin to be ground is put into the hopper and enters the grinding cylinder, the three grinding rollers are used for reciprocating relative to the grinding frame along the radial direction of the grinding cylinder, the distance between the grinding rollers and the inner wall of the grinding cylinder can be adjusted according to the particle size of the epoxy resin, so that the particle size of the ground epoxy resin is controlled, meanwhile, the three grinding rollers are used for rotating relative to the circumferential direction of the grinding cylinder along with the grinding frame in the grinding cylinder, the grinding treatment on the epoxy resin between the grinding rollers and the inner wall of the grinding cylinder can be realized, the accurate grinding treatment on the epoxy resin is realized, and the grinding quality on the epoxy resin is improved.
As shown in fig. 4 and 5, in the present embodiment, the grinding frame 5 has a triangular plate structure, and is connected to the three grinding rolls 6 by the telescopic rod 7 and the three V-shaped links 8. Wherein, three V type connecting rod 8 is located the three corner of grinding frame 5 respectively, and V type connecting rod 8 buckle position and grinding frame 5 formation are rotated and are connected, V type connecting rod 8's one end and grinding roller 6 rotate and are connected, the other end is connected or is connected with telescopic link 7 through straight-bar 9 and adjacent V type connecting rod 8, thereby make three V type connecting rod 8 connect gradually through two straight-bars 9, and the both ends of straight-bar 9 all rotate with V type connecting rod 8 and be connected, telescopic link 7 adopts pole structural style and one end and grinding frame 5 to rotate and be connected, the other end rotates with one of them V type connecting rod 8 to be connected.
At the moment, by controlling the telescopic action of the telescopic rod, the three grinding rollers can be simultaneously controlled to move relative to the grinding frame through the V-shaped connecting rod and the straight rod, so that the radial reciprocating movement of the grinding rollers is formed, and the distance between the grinding rollers and the inner wall of the grinding cylinder is changed.
Of course, in other embodiments, the number of the grinding rollers can be adjusted, for example, increased or decreased, or even only one grinding roller can be provided, according to the size of the grinding cylinder. In addition, the movement of the grinding roller relative to the grinding frame may be controlled in other manners according to the control manner, for example, a telescopic rod is separately provided for each grinding roller, and the movement of the grinding roller relative to the grinding frame is directly controlled by the telescopic rod.
As shown in fig. 1 and 2, a grinding sleeve 10, a first bevel gear 11, a second bevel gear 12, a third bevel gear 13, a first spur gear 14, a second spur gear 15, and a third spur gear 16 are further provided in the epoxy resin processing apparatus of the present embodiment.
Wherein, the grinding cylinder 2 is rotatably arranged on the bracket 4, the top of the grinding cylinder is provided with a first belt pulley 17, the first belt pulley 17 is in transmission connection with a second belt pulley 19 at the output end of a motor 18 through a belt, and the motor 18 is fixed on the bracket 4. The first bevel gear 11 is coaxially and fixedly connected with the grinding cylinder 2, the grinding sleeve 10 is sleeved outside the hopper 1 and coaxially and rotatably arranged with the first bevel gear 11, and the second bevel gear 12 is sleeved and fixed on the grinding sleeve 10 and is in meshed connection with the first bevel gear 11 through a third bevel gear 13 rotatably arranged on the support 4. The lower end of the grinding sleeve 10 extends to be positioned in the grinding cylinder 2 and is provided with a first spur gear 14, the grinding frame 5 is sleeved and fixed outside the grinding sleeve 10, a second spur gear 15 is rotatably arranged at the position where the V-shaped connecting rod 8 is connected with the grinding frame 5 and is in meshed connection with the first spur gear 14, and a third spur gear 16 is coaxially and fixedly connected with the grinding roller 6 and is in meshed connection with the second spur gear 15.
At the moment, when the motor drives the grinding cylinder to rotate through the belt pulley, on one hand, the grinding cylinder drives the grinding frame to rotate through the first bevel gear, the second bevel gear, the third bevel gear and the grinding sleeve, and the rotation direction of the grinding frame is opposite to that of the grinding cylinder, so that the grinding roller synchronously rotates reversely with the grinding cylinder along with the grinding frame, and the grinding effect on the epoxy resin is improved; on the other hand, the rotation of the grinding rack drives the grinding roller to rotate through the first straight gear, the second straight gear and the third straight gear, so that the grinding effect on the epoxy resin is further improved.
Of course, in other embodiments, the first bevel gear, the second bevel gear, the third bevel gear and the grinding sleeve can be omitted, and the epoxy resin can be ground only by the rotation of the grinding cylinder relative to the grinding roller according to different designs and use conditions. Alternatively, the first pulley is provided on the polishing sleeve to directly drive the polishing holder to rotate relative to the polishing cylinder, and the epoxy resin is polished by the rotation of the polishing roller relative to the polishing cylinder. Even, the arrangement of the first spur gear, the second spur gear and the third spur gear can be omitted, and the epoxy resin can be ground only by the relative rotation between the grinding roller and the grinding cylinder.
Referring to fig. 1 to 8, the epoxy resin processing apparatus of the present embodiment further includes a first blade 21. Wherein the first scraper 21 is arranged on the grinding frame 5, particularly at the end of the V-shaped connecting rod 8 where the grinding roller 6 is not arranged, and the first scraper 21 is parallel to the grinding roller 6.
At the moment, the rotation of the two ends of the V-shaped connecting rod can be utilized to extend the first scraper and recover the grinding roller by controlling the extending action of the telescopic rod, so that the first scraper is moved to be in contact with the inner wall of the grinding cylinder, the scraping and cleaning operation of residual epoxy resin can be carried out on the inner wall of the grinding cylinder by utilizing the first scraper in the process of relative rotation of the grinding frame and the grinding cylinder, and the grinding efficiency and quality of the epoxy resin are improved. On the contrary, when the telescopic rod is controlled to contract, the first scraper blade can be recovered and the grinding roller can be extended out, so that the grinding roller and the grinding cylinder are matched again to grind the epoxy resin.
Further, in the case where the grinding roll 6 is capable of rotating on its own axis in the present embodiment, the epoxy resin processing apparatus is further provided with a second blade 22. The second scraper 22 is fixedly arranged directly on the grinding carriage 5 and likewise remains parallel to the grinding roller 6. At the moment, when the telescopic rod extends to move and the grinding roller is recovered, the grinding roller can be moved to a position in contact with the second scraper blade, so that the second scraper blade can be used for scraping and cleaning epoxy resin remained on the outer surface of the grinding roller in the rotation process of the grinding roller, and the grinding efficiency and quality of the epoxy resin are further improved.
Referring to fig. 2, in the epoxy resin processing apparatus of the present embodiment, a screen 23 is further provided. The screen 23 is located at the downstream position of the grinding cylinder 2 and is used for receiving and screening the ground epoxy resin particles, so that the epoxy resin particles obtained after grinding can be screened, the consistency of the obtained epoxy resin particles is ensured, and the preparation quality of the epoxy resin is improved.
Further, in the present embodiment, the screen 23 directly serves as the bottom of the grinding cylinder 2 and adopts a V-shaped structure. At this moment, not only can utilize the gliding process of epoxy granule along V type screen cloth after the grinding, accomplish the screening operation automatically, improve screening efficiency, and the rotation of cooperation grinding vessel, just can be in the grinding stage through the rotational speed that improves the grinding vessel, make epoxy move up to carry out the grinding operation between grinding vessel and the grinding roller along the screen cloth under the centrifugal force effect, treat after grinding through the rotational speed that reduces the grinding vessel, just can make epoxy slide along the screen cloth under the dead weight effect, thereby accomplish the screening operation, and the large granule epoxy that can't pass through the screen cloth just can carry out the grinding operation once more when the high-speed rotation once more of grinding vessel.
As shown in fig. 2, a collection bin 24 is disposed below the screen 23 of this embodiment, and is used for temporarily collecting the screened epoxy resin particles, so that a subsequent operator can perform a centralized collection operation.
As shown in fig. 2, 9 and 10, the epoxy resin processing apparatus of the present embodiment further includes a boss plate 25, a knocking plate 26 and a knocking elastic member 27. Wherein, under the condition that screen cloth 23 can carry out synchronous rotation along with grinding vessel 2, boss dish 25 is located the below of screen cloth 23 to boss dish 25 carries out coaxial fixed connection through its upper surface and screen cloth 23, and the lower surface of boss dish 25 then is equipped with strikes plane 28, strikes platform 29 and strikes inclined plane 30, strikes platform 29 and sets up and be higher than and strike plane 28 along the circumferencial direction of boss dish 25, strikes one end in inclined plane 30 connection strikes plane 28 and the platform 29 of strikeing. The striking plate 26 is located below the boss plate 25, the upper surface of the striking plate 26 is provided with a protrusion 31, and the striking plate 26 is connected with the bracket 4 in a sliding manner along the vertical direction through a flat key 32. The striking elastic member 27 is a coil spring, is located on the lower surface of the striking plate 26, and drives the striking plate 26 to move upward so that the projection 31 is held in a position contacting the boss plate 25.
At this moment, the grinding vessel just can drive the boss dish through the screen cloth and carry out synchronous rotation, thereby make the protruding formation of knocking on the dish along knocking the plane in proper order, strike the inclined plane, strike the platform and strike the relative movement of plane order, and form the compression of knocking the elastic component at the in-process that moves to knocking the platform by knocking the inclined plane, and strike the dish rebound formation and strike the boss dish by knocking the elastic component release compressive force again and drive by knocking the planar in-process by knocking the platform, and then form to strike vibrations to the screen cloth, reach the vibrations screening operation to epoxy, improve the screening efficiency to epoxy.
Of course, in other embodiments, if the grinding cylinder cannot drive the cam plate to rotate through the screen, the knocking plate can be simultaneously rotated relative to the cam plate, so that the knocking operation on the cam plate is formed. And even, the actively-controlled telescopic rod is selected as the knocking elastic piece, so that the knocking disc is directly controlled to reciprocate along the vertical direction, and the aim of vibrating the screen is fulfilled.
With reference to fig. 1 to 10, a method for preparing an epoxy resin by using an epoxy resin processing apparatus specifically includes the following steps:
step S1, preparation: on one hand, the epoxy resin to be ground is put into a hopper 1, and the epoxy resin falls into a grinding cylinder 2 through an outlet of the hopper 1; on the other hand, the grinding roller 6 is controlled to move relative to the grinding frame 5 along the radial direction of the grinding cylinder 2, the distance between the grinding roller 6 and the inner wall of the grinding cylinder 2 is adjusted according to the size of the required epoxy resin particles, specifically, the telescopic rod 7 is controlled to stretch and retract, the three V-shaped connecting rods 8 are driven to rotate through the straight rods 9, the distances between the three grinding rollers 6 and the inner wall of the grinding cylinder 2 are adjusted simultaneously according to the size of the required ground epoxy resin particles, and the telescopic rod 7 is stopped being continuously controlled until the adjustment is completed.
Step S2, high-speed grinding: and controlling the grinding frame to rotate relatively in the grinding cylinder, so that the grinding cylinder rotates relatively to the inner wall of the grinding cylinder, and grinding operation on the epoxy resin is formed between the grinding roller and the inner wall of the grinding cylinder.
To the epoxy processing equipment of this embodiment, carry out the concrete process that high rotational speed ground: the motor 18 is started to rotate at a high speed, the grinding cylinder 2 is driven to rotate at a high speed through the second belt pulley 19 and the first belt pulley 17, so that the epoxy resin on the screen 23 moves up to the grinding cylinder 2 along the screen 23 under the action of centrifugal force, meanwhile, the rotation of the grinding cylinder 2 not only drives the grinding rack 5 to rotate opposite to the grinding cylinder 2 through the first bevel gear 11, the second bevel gear 12, the third bevel gear 13 and the grinding sleeve 10, namely, drives the three grinding rollers 6 to rotate opposite to the grinding cylinder 2, but also drives the grinding rollers 6 to rotate through the first spur gear 14, the second spur gear 15 and the third spur gear 16 by the rotation of the grinding rack 5, so that the high-speed grinding treatment is performed on the epoxy resin under the conditions that the grinding rollers 6 and the grinding cylinder 2 rotate oppositely and the grinding rollers 6 rotate.
Step S3, low-speed screening: the epoxy resin particles subjected to the grinding treatment were sieved through a sieve. Further, by reducing the rotation speed of the grinding cylinder, the ground epoxy resin particles fall to the screen and complete the screening operation in the process of sliding along the inclined plane of the screen, and when the grinding cylinder rotates at high speed again, the epoxy resin particles which fail to pass through the screen move upwards to a position between the grinding roller and the inner wall of the grinding cylinder by using centrifugal force to be ground again.
To the epoxy processing equipment of this embodiment, carry out the specific process of low-speed screening: after the epoxy resin is ground, the motor 18 is controlled to rotate at a low speed, so that the rotation of the grinding cylinder 2 is reduced, the centrifugal force formed by the epoxy resin is reduced, and the epoxy resin slides downwards along the screen 23, so that the epoxy resin particles are screened in a low-speed state, wherein the epoxy resin particles passing through the screen 23 fall into the collection bin 24 at the lower end of the epoxy resin particles for temporary storage, and when the grinding cylinder 2 rotates at a high speed again, the epoxy resin particles failing to pass through the screen 23 can move upwards to the space between the grinding roller 6 and the inner wall of the grinding cylinder 2 by using the centrifugal force for grinding again.
Preferably, in the low-speed screening process of step S3, the boss disc 25 rotates relative to the knocking disc 26 along with the rotation of the screen 23, so that the knocking disc 26 performs reciprocating knocking on the boss disc 25 in the vertical direction under the mutual cooperation of the knocking elastic member 27, the knocking plane 28, the knocking platform 29 and the knocking inclined plane 30, thereby forming vibration on the screen 23 and realizing vibration screening operation on epoxy resin particles.
Step S4, scraping and cleaning: the first scraper is controlled to move towards the direction close to the inner wall of the grinding cylinder relative to the grinding frame and to be in contact with the inner wall of the grinding cylinder, and then the first scraper slides relative to the inner wall of the grinding cylinder under the driving of the grinding frame, so that the inner wall of the grinding cylinder is scraped and cleaned; and controlling the grinding roller to move relative to the grinding frame to be in contact with the second scraper and rotate so as to scrape and clean the surface of the grinding roller.
To the epoxy processing equipment of this embodiment, scrape the specific process of clearance: the motor 18 is controlled to rotate at a low speed, the telescopic rod 7 is controlled to extend, the first scraper 21 is extended and the grinding roller 6 is retracted by the rotation of the two ends of the V-shaped connecting rod 8, so that the first scraper 21 is moved to be in contact with the inner wall of the grinding cylinder 2 and the grinding roller 6 is moved to be in contact with the second scraper 22, at the moment, under the condition that the grinding frame 5 drives the first scraper 21 to rotate relative to the grinding cylinder 2 and the grinding roller 6 rotates, the first scraper 21 is used for scraping and cleaning residual epoxy resin on the inner wall of the grinding cylinder 2, and the second scraper 22 is used for scraping and cleaning the epoxy resin on the outer surface of the grinding roller 6.
Step S5, circularly preparing: the epoxy resin is continuously ground by repeating the steps S1 to S4, and the epoxy resin particles obtained by the grinding preparation are temporarily collected in the collection bin 24, and then collectively collected and bagged by the operator. The operation sequence of step S3 and step S4 may be reversed, or the operation of step S3 and step S4 may be performed simultaneously.
Claims (10)
1. The preparation method of the epoxy resin is characterized in that epoxy resin processing equipment is adopted for preparing the epoxy resin, the epoxy resin processing equipment comprises a hopper, a grinding cylinder and a grinding mechanism, the hopper is positioned above the grinding cylinder and communicated with the grinding cylinder, and the grinding mechanism is positioned in the grinding cylinder; the grinding mechanism comprises a grinding frame and a grinding roller, wherein the grinding roller is connected with the grinding frame and can rotate along the inner part of the grinding cylinder along with the grinding frame relative to the circumferential direction of the grinding cylinder and can move back and forth relative to the grinding frame along the radial direction of the grinding cylinder;
the preparation method of the epoxy resin specifically comprises the following steps:
step S1, preparation: putting the epoxy resin to be ground into the hopper, and enabling the epoxy resin to fall into the grinding cylinder; controlling the grinding roller to move relative to the grinding frame along the radial direction of the grinding cylinder, and adjusting the distance between the grinding roller and the inner wall of the grinding cylinder according to the size of the required epoxy resin particles;
step S2, high-speed grinding: and controlling the grinding frame to rotate relatively in the grinding cylinder, so that the grinding cylinder rotates relatively to the inner wall of the grinding cylinder, and grinding operation on epoxy resin is formed between the grinding roller and the inner wall of the grinding cylinder.
2. The method for preparing epoxy resin according to claim 1, wherein the grinding mechanism further comprises a telescopic rod and a V-shaped link; the bending part of the V-shaped connecting rod is rotatably connected with the grinding frame, one end of the telescopic rod is connected with the grinding frame, the other end of the telescopic rod is rotatably connected with one end of the V-shaped connecting rod, and the grinding roller is arranged at the other end of the V-shaped connecting rod.
3. The method for producing an epoxy resin according to claim 2, wherein the grinding mechanism is provided with a plurality of grinding rollers and a plurality of V-shaped links; the plurality of V-shaped connecting rods are sequentially connected with the grinding rack in a rotating mode along the circumferential direction of the grinding rack, the telescopic rod is connected with one end of one of the V-shaped connecting rods, the plurality of V-shaped connecting rods are sequentially connected through the straight rod, and two ends of the straight rod are respectively connected with two adjacent V-shaped connecting rods in a rotating mode; the grinding rollers are respectively arranged on the V-shaped connecting rods.
4. The method for preparing epoxy resin according to claim 1, wherein the grinding cylinder and the grinding frame are both rotatable, and the grinding cylinder and the grinding frame are rotated in opposite directions; and in the high-speed grinding in the step S2, controlling the grinding cylinder and the grinding frame to rotate simultaneously.
5. The method of claim 4, wherein the epoxy processing equipment further comprises a grinding sleeve, a first bevel gear, a second bevel gear, a third bevel gear, a first straight gear, a second straight gear, and a third straight gear; the first bevel gear is coaxially and fixedly connected with the grinding cylinder, the grinding sleeve is coaxially and rotatably arranged with the first bevel gear, and the second bevel gear is sleeved and fixed on the grinding sleeve and is in meshed connection with the first bevel gear through the third bevel gear; one end of the grinding sleeve is positioned in the grinding cylinder and is provided with a first spur gear, the grinding frame is fixedly sleeved on the grinding sleeve, the second spur gear is rotatably arranged on the grinding frame and is in meshed connection with the first spur gear, and the third spur gear is coaxially and fixedly connected with the grinding roller and is in meshed connection with the second spur gear.
6. The method of claim 1, wherein the epoxy processing equipment further comprises a first scraper; the first scraper is arranged on the grinding rack, can move back and forth relative to the grinding rack along the radial direction of the grinding cylinder and is in contact with the inner wall of the grinding cylinder;
the preparation method of the epoxy resin further comprises the step S4 of scraping and cleaning: the first scraper is controlled to move towards the direction close to the inner wall of the grinding cylinder relative to the grinding frame and to contact with the inner wall of the grinding cylinder, and then the first scraper slides relative to the inner wall of the grinding cylinder under the driving of the grinding frame, so that the inner wall of the grinding cylinder is scraped and cleaned.
7. The method of claim 6, wherein the epoxy processing equipment further comprises a second blade; the second scraper is arranged on the grinding rack, and the grinding roller can move relative to the grinding rack to be in contact with the second scraper and rotate; in the scraping and cleaning process of the step S4, the method further includes controlling the grinding roll to move relative to the grinding rack to contact with the second scraper and rotate to scrape and clean the surface of the grinding roll.
8. The method of claim 1, wherein the epoxy processing equipment further comprises a screen; the screen is positioned at the downstream position of the grinding cylinder and is used for containing and screening the ground epoxy resin particles;
the preparation method of the epoxy resin also comprises a step S3 of low-speed screening: and sieving the grinded epoxy resin particles through the screen.
9. The method for preparing epoxy resin according to claim 8, wherein the screen is used as a bottom of a grinding cylinder and adopts a V-shaped structure;
in the low-speed screening process of the step S3, the rotation speed of the grinding drum is reduced, so that the ground epoxy resin particles fall to the screen and complete the screening operation in the process of sliding along the inclined plane of the screen, and when the grinding drum rotates at a high speed again, the epoxy resin particles which fail to pass through the screen move upwards between the grinding roller and the inner wall of the grinding drum by using centrifugal force to perform the grinding treatment again.
10. The method for preparing the epoxy resin according to claim 8, wherein the epoxy resin processing equipment further comprises a boss plate, a knocking plate and a knocking elastic member; the boss disc is positioned below the screen, the upper surface of the boss disc is fixedly connected with the screen, the lower surface of the boss disc is provided with a knocking plane, a knocking platform and a knocking inclined plane, the knocking platform is arranged along the circumferential direction of the boss disc and is higher than the knocking plane, and the knocking inclined plane is connected with one end of the knocking plane and one end of the knocking platform; the knocking disc is positioned below the boss disc, the upper surface of the knocking disc is provided with a protrusion, and the knocking disc can perform reciprocating movement in the vertical direction and rotation in the circumferential direction relative to the boss disc, so that the protrusion can perform relative movement along the knocking plane, the knocking inclined plane and the knocking platform in sequence; the knocking elastic piece is positioned on the lower surface of the knocking disc and drives the knocking disc to move upwards;
in the low-speed screening process of the step S3, the boss disc rotates relative to the knocking disc, the elastic part is knocked on the knocking plane, the knocking platform and the knocking inclined plane are matched with each other, the knocking disc is formed to knock the boss disc in a reciprocating mode in the vertical direction, and the vibrating screening of the screen mesh is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210964900.2A CN115301352B (en) | 2022-08-12 | Preparation method of epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210964900.2A CN115301352B (en) | 2022-08-12 | Preparation method of epoxy resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115301352A true CN115301352A (en) | 2022-11-08 |
| CN115301352B CN115301352B (en) | 2024-05-10 |
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