CN115295498B - High-temperature-resistant IGBT power module - Google Patents
High-temperature-resistant IGBT power module Download PDFInfo
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- CN115295498B CN115295498B CN202211233204.0A CN202211233204A CN115295498B CN 115295498 B CN115295498 B CN 115295498B CN 202211233204 A CN202211233204 A CN 202211233204A CN 115295498 B CN115295498 B CN 115295498B
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- 239000000758 substrate Substances 0.000 claims abstract description 61
- 230000001681 protective effect Effects 0.000 claims abstract description 13
- 238000013016 damping Methods 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 23
- 229920001296 polysiloxane Polymers 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 4
- 229920000742 Cotton Polymers 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 18
- 239000000741 silica gel Substances 0.000 abstract description 18
- 229910002027 silica gel Inorganic materials 0.000 abstract description 18
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000499 gel Substances 0.000 description 13
- 230000035939 shock Effects 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 239000011491 glass wool Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/08—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with rubber springs ; with springs made of rubber and metal
- F16F15/085—Use of both rubber and metal springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
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Abstract
The invention relates to the technical field of semiconductor devices, and particularly discloses a high-temperature-resistant IGBT power module which comprises a substrate, a shell, a protective component, a limiting component and a damping component, wherein an electronic element is welded on the top end surface of the substrate, the protective component is arranged on the top end surface of the substrate and is used for preventing the electronic element from being separated from the substrate when silica gel is subjected to drawing force.
Description
Technical Field
The invention relates to the technical field of semiconductor devices, in particular to a high-temperature-resistant IGBT power module.
Background
The IGBT power module is a power module formed by an insulated gate bipolar transistor, the IGBT power module generally uses a copper base plate or a power base plate as the base plate, wherein a power chip is connected to the power base plate through a connecting material to realize mechanical support of the power chip, and heat dissipation is carried out through the power base plate.
However, the following problems exist in the use process of the IGBT power module:
1. when an electronic device in the IGBT power module has a problem and needs to be disassembled, the existing shell is fixedly adhered to the bottom plate through the silicone gel, but the silicone gel forms an elastic material after being hardened, and the silicone gel and an electric element in the IGBT power module are generally integrated into a whole, so that in the process of disassembling the shell, the silicone gel generates a pulling force under the disassembling pressure between the shell and the substrate, and the pulling force easily causes the electronic element connected with the interior of the IGBT power module to be separated from the substrate, thereby causing the damage of the interior of the IGBT power module;
2. the existing IGBT power module is installed on a machine which often generates vibration, and then is fixedly connected with the machine through bolts, so that the vibration is not buffered between the IGBT power module and the machine, although the silica gel in the IGBT power module plays a role in resisting vibration, a chip and a substrate in the IGBT power module are fixedly welded, so that the substrate vibrates under the vibration pressure of the machine, the chip and a connecting material are unstable, and the electrical safety of the IGBT power module is not facilitated.
Disclosure of Invention
In view of this, an object of the present invention is to provide a high temperature resistant IGBT power module, which effectively solves the problems of damage to electronic components caused by a pulling force of silicone gel on the electronic components when the IGBT power module is detached, and lack of shock absorption of the IGBT power module.
In order to achieve the purpose, the invention provides the following technical scheme: a high temperature tolerant IGBT power module comprising:
the electronic component module comprises a substrate, a first connecting piece and a second connecting piece, wherein an electronic component is welded on the top end face of the substrate;
the shell is arranged on the shell of the substrate, and the front end and the rear end of the shell are provided with limit transmission assemblies for driving the shell to move in a limiting manner up and down;
the protective assembly is arranged on the top end face of the substrate and used for preventing the electronic element from being separated from the substrate when the silicone gel is subjected to drawing force, the protective assembly comprises a square frame arranged on the top end face of the substrate, and a plurality of net-shaped protective elastic pieces are arranged on the inner side wall of the square frame;
the limiting assembly is arranged on the outer side wall of the substrate and used for limiting and clamping the substrate;
and the damping component is arranged on the bottom of the substrate and used for buffering the substrate.
Preferably, the fixed block that is the rectangle array is installed to square frame's top corner, all install horizontal sliding rod between the fixed block at both ends about being located, perpendicular slide bar is all installed to the fixed block at both ends around being located, horizontal sliding rod and perpendicular slide bar's the outside all slides and is provided with the arc seat that is linear array, and one side that the one end of arc seat corresponds protection bullet spare is fixed connection.
Preferably, the top end face of the base plate and the outer side of the square frame are provided with the pouring plate, the inner side wall of the pouring plate and the top of the square frame are provided with the parallel and level plate, and the inner side wall of the square frame is provided with the rectangular array vertical groove.
Preferably, the arc-shaped seat is made of elastic materials, and the upper end and the lower end of the arc-shaped seat are provided with the control blocks.
Preferably, a plurality of first grooves that are the rectangular array are seted up to the top of parallel and level board just being located the control block under, and first groove is the setting of tilt up, a plurality of second grooves that are the rectangular array are seted up to the top end face of square frame just being located the control block under, and the second groove is the setting of tilt down.
Preferably, spacing subassembly is including the spacing bottom plate of welding at base plate bottom face, two spacing square poles are all installed at both ends about the base plate, both ends are provided with the T template with two spacing square pole looks sliding connection about the base plate, the through hole that is used for the spacing removal of T template is offered at both ends about the spacing bottom plate, the vertical end of T template is inboard at the through hole, the middle part threaded connection of spacing bottom plate has the horizontal double-threaded screw who sets up, and double-threaded screw pass behind the through hole and with the vertical end threaded connection of T template about, double-threaded screw's left end rotates and passes behind the left side of spacing bottom plate and installs the cap of turning round, two first voussoirs are installed to the opposite side of T template, the second voussoirs of extrudeing mutually with first voussoir are installed at both ends around the base plate.
Preferably, damper includes the shock attenuation board, the transmission groove has been seted up to limiting bottom plate's bottom face, limiting bottom plate's bottom just is located the transmission inslot and is provided with the first commentaries on classics board that is linear array, both ends are passed through the hinged joint mode and are connected with limiting bottom plate and shock attenuation board respectively around the first commentaries on classics board, the middle part transmission of first commentaries on classics board is connected with the second commentaries on classics board, the second commentaries on classics board is kept away from the one end rotation of first commentaries on classics board and is connected with and removes the seat, it is close to one side of limiting bottom plate and rotates and be connected with the ball to remove the seat, limiting bottom face of limiting bottom plate corresponds one side of ball and has seted up the spacing moving groove, and has laid the glass cotton in the spacing moving groove, limiting bottom plate's bottom face just is located the left side of removing the seat and installs the spring telescopic link, the removal end of spring telescopic link is fixed connection on the left side of removing the seat, a plurality of rubber pads that are the rectangular array is installed to the bottom face of shock attenuation board.
Preferably, spacing transmission assembly is including being the solid fixed screw that the rectangle array installed at base plate top face, two shifting chutes have been seted up to the both ends lateral wall around the shell, every group two shifting boxes are installed to the inboard of shifting chute, solid fixed screw's top is rotated the bottom of passing the shifting box and is rotated and be connected with the nut, and solid fixed screw's top slides and passes the top of shifting box, the inner chamber diapire of shifting box rotates and is connected with the first bevel gear with nut fixed connection, two the relative lateral cavity lateral wall of shifting box is connected with the second bevel gear who meshes with first bevel gear through the bearing rotation, two rotate between the shifting box and be connected with the transfer line with second bevel gear fixed connection, the middle part fixedly connected with drive gear of transfer line, the shell is located a side of drive gear and has seted up and has dodged the groove.
Preferably, two transversely set up mounting plates are installed to the top face of base plate, first board groove has been seted up to the inboard of shell, the inboard of shell just is located first board groove bottom and has seted up the second board groove, the third board groove with the mounting plate looks adaptation is seted up at both ends around the shell, one side threaded connection in the third board groove that both ends face corresponds around the shell has the bolt, the one end of bolt is threaded in proper order and is worn to be equipped with between shell and the mounting plate.
Preferably, the bottom end surfaces of the second plate groove, the third plate groove and the outer shell are all paved with rubber materials.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the arc-shaped seats of each group slide along the vertical sliding rod or the arc-shaped seat through the protection assembly, so that the square-shaped arrangement is formed between the protection elastic pieces, and when the silica gel and the square-shaped protection elastic pieces are integrated, the silica gel cannot damage an electronic element due to the drawing force generated by the strong disassembly between the shell and the substrate;
2. the double-head screw is driven by the limiting assembly, so that the T-shaped plate and the first wedge block are driven to move relatively, the aim of clamping the base plate in all directions is fulfilled under the pressing action of the horizontal end of the T-shaped plate and the first wedge block, and then the vibration on a machine is sufficiently buffered under the mutual matching of the first rotating plate, the second rotating plate, the moving seat, the ball, the spring telescopic rod and the glass wool of the damping assembly, so that the vibration force generated on the IGBT power module is greatly reduced;
3. according to the invention, the limiting transmission assembly is arranged to drive the driving gear to rotate, so that the moving boxes of each group can move up and down along the fixed screw rod, and the shell can slowly move up and down in the process of disassembling the shell, thereby avoiding the situation that the shell is shaken left and right in the process of disassembling the shell, and further influencing the generation of transverse drawing force of silicone gel on an electronic element.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a view of the present invention without the housing;
FIG. 4 is a partial enlarged view of B in FIG. 3;
FIG. 5 is an illustration of a shield assembly of the present invention;
FIG. 6 is an enlarged view of a portion C of FIG. 5;
FIG. 7 is a longitudinal cross-sectional view of the vertical slide bar, the arcuate seat and the control block of the present invention;
FIG. 8 is a cross-sectional view of a limit drive assembly of the present invention;
FIG. 9 is an inside elevational view of the housing of the present invention;
figure 10 is a cross-sectional view of a shock absorbing assembly of the present invention.
In the figure:
1. a substrate; 101. pouring a plate; 102. a flush plate; 103. a first groove;
2. a housing; 21. a fastening plate; 22. a first plate groove; 23. a second plate groove; 24. a third plate groove; 25. a bolt;
3. an electronic component;
4. a guard assembly; 41. a square frame; 42. a vertical slot; 43. a fixed block; 44. a horizontal sliding bar; 45. a vertical slide bar; 46. an arc-shaped seat; 47. a control block; 48. a second groove; 49. a protective bullet;
5. a limiting component; 51. a limiting bottom plate; 52. a limiting square rod; 53. a T-shaped plate; 54. a through hole; 55. a double-ended screw; 56. a first wedge; 57. a second wedge;
6. a shock absorbing assembly; 61. a damper plate; 62. a first rotating plate; 63. a second rotating plate; 64. a movable seat; 65. a ball bearing; 66. a spring telescopic rod; 67. a rubber pad;
7. a limiting transmission component; 71. fixing the screw rod; 72. a nut; 73. a mobile box; 74. a first bevel gear; 75. a second bevel gear; 76. a transmission rod; 77. a drive gear; 78. avoiding the groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
as shown in fig. 1, fig. 2, fig. 5, fig. 6, fig. 8 and fig. 10, a high temperature resistant IGBT power module includes a substrate 1, a housing 2, a protection component 4, a limiting component 5 and a damping component 6, wherein an electronic component 3 is welded on a top end face of the substrate 1, the housing 2 is installed on the substrate 1, the protection component 4 is disposed on a top end face of the substrate 1, and is used for preventing the electronic component 3 from being separated from the substrate 1 when a silicone gel is subjected to a pulling force, the protection component 4 includes a square frame 41 installed on the top end face of the substrate 1, a plurality of net-shaped protection elastic pieces 49 are disposed on an inner side wall of the square frame 41, fixed blocks 43 in a rectangular array are installed at corners of a top of the square frame 41, horizontal sliding rods 44 are installed between the fixed blocks 43 at left and right ends, vertical sliding rods 45 are installed on the fixed blocks 43 at front and rear ends, arc seats 46 are made of an elastic material, and arc seats 47 are installed at upper and lower ends of the arc seats 46.
Before installing IGBT power module, install square frame 41 at pouring board 101 inboard, then utilize protection bullet 49 on the arc seat 46 to put into electronic component 3 and be a plurality of square grid shape on, it solidifies integratively with the protection bullet 49 of a plurality of square grid shape when being favorable to later stage to put into silica gel to electronic component 3, thereby when being convenient for later stage to dismantle shell 2, the protection bullet 49 of square grid shape extrudes silica gel on electronic component 3, consequently, carry out the pulling force that powerful dismantlement produced between shell 2 and base plate 1 and can not make silica gel cause the damage to electronic component 3, and can utilize control block 47 drive arc seat 46 to remove along horizontal slide bar 44 or vertical slide bar 45, prevent that protection bullet 49 causes the passageway to electronic component 3 and hinder, thereby be convenient for adjust the interval between the protection bullet 49.
It should be noted that the control blocks 47 arranged in the present invention are in a shape like a Chinese character 'ba', which is beneficial for the U-shaped control blocks 47 to press along the horizontal sliding rod 44 or the vertical sliding rod 45, at this time, the shape of the arc-shaped seat 46 is elastically changed, so that the arc-shaped seat 46 completely enters the outer side wall of the horizontal sliding rod 44 or the vertical sliding rod 45, and the control blocks 47 at both sides can also be relaxed, so that the arc-shaped seat 46 is separated from the horizontal sliding rod 44 or the vertical sliding rod 45, which is beneficial for the installation or disassembly of the protective elastic member 49 at a later stage.
Example two:
the method is substantially the same as the first technical solution of the embodiment, and the difference is that, as shown in fig. 3, fig. 5 and fig. 7, a pouring plate 101 is installed on the top end surface of the substrate 1 and located at the outer side of the square frame 41, a flush plate 102 is installed on the inner side wall of the pouring plate 101 and located at the top of the square frame 41, a vertical slot 42 in a rectangular array is opened on the inner side wall of the square frame 41, a plurality of first grooves 103 in a rectangular array are opened on the top of the flush plate 102 and located right below the control block 47, the first grooves 103 are arranged in an upward inclined manner, a plurality of second grooves 48 in a rectangular array are opened on the top end surface of the square frame 41 and located right below the control block 47, and the second grooves 48 are arranged in a downward inclined manner.
In operation, when the protection elastic members 49 are disposed between each other without affecting the passage of the electronic component 3, the control block 47 is then limited between the first groove 103 and the second groove 48, so as to prevent the IGBT power module from causing the arc-shaped seat 46 to slide left and right along the horizontal sliding rod 44 or the vertical sliding rod 45 under the condition of vibration, thereby limiting the arc-shaped seat 46, and when the protection elastic members 49 need to be moved, the control block 47 located at the upper part can rotate along the top of the first groove 103, and the control block 47 located at the lower part can rotate upward along the second groove 48, which is beneficial for limiting the arc-shaped seat 46 and the control block 47.
When worth noting, square frame 41 is inboard to set up vertical slot 42, is favorable to silica gel to solidify through vertical slot 42 is inboard, and then increases the frictional force between silica gel and the square frame 41 to when later stage is dismantled shell 2 and base plate 1, played firm effect, be favorable to silica gel to continue to keep at square frame 41 inboardly, reduce the damage by a wide margin of silica gel to electronic component 3.
It should be noted that the present invention provides the leveling plate 102 to facilitate the operator to level the silicone gel according to the height of the leveling plate 102, and prevent the silicone gel from transiting less or more, so as to facilitate the protective assembly 4 to achieve better protection.
Example three:
the structure is basically the same as the first technical solution of the embodiment, and the difference is that, as shown in fig. 3, a limiting component 5 is disposed on an outer side wall of a substrate 1 and is used for limiting and clamping the substrate 1, the limiting component 5 includes a limiting bottom plate 51 welded on a bottom end face of the substrate 1, two limiting square rods 52 are mounted at both left and right ends of the substrate 1, a T-shaped plate 53 slidably connected with the two limiting square rods 52 is disposed at both left and right ends of the substrate 1, through holes 54 for limiting and moving the T-shaped plate 53 are formed at both left and right ends of the limiting bottom plate 51, a vertical end of the T-shaped plate 53 is located inside the through hole 54, a transversely-disposed double-headed screw 55 is screwed in a middle part of the limiting bottom plate 51, both left and right ends of the double-headed screw 55 pass through the through holes 54 and are screwed with the vertical end of the T-shaped plate 53, a twist cap is mounted at the left end of the double-headed screw 55, two first wedges 56 are mounted at opposite sides of the T-shaped plate 53, and second wedges 57 extruded with the first wedges 56 are mounted at both front and rear ends of the substrate 1.
During operation, when the substrate 1 is limited, the substrate 1 is placed in the middle of the limiting bottom plate 51, then the torsion cap is driven to drive the double-thread screw 55 to rotate, at the moment, the vertical end of the T-shaped plate 53 moves relatively until the horizontal end of the T-shaped plate 53 presses the outer side wall of the substrate 1 along the limiting square rod 52, and meanwhile, the T-shaped plate 53 drives the first wedge block 56 to slide along the second wedge block 57 on the substrate 1 until the first wedge block 56 and the second wedge block 57 are completely combined, so that the rapid limiting purpose of the substrate 1 is realized, and the substrate 1 is clamped in all directions.
It is noted that the contact surfaces of the first wedge 56 and the second wedge 57 are provided with anti-slip pads so as to increase the clamping stability of the substrate 1 without affecting the heat dissipation effect of the substrate 1.
Example four:
basically the same as the first technical solution of the embodiment, the difference is that, as shown in fig. 1 and fig. 10, the damping assembly 6 is disposed on the bottom of the substrate 1 and is configured to buffer the substrate 1, the damping assembly 6 includes a damping plate 61, a transmission groove is formed in a bottom end surface of the limiting bottom plate 51, a first rotating plate 62 in a linear array is disposed in the transmission groove and at the bottom of the limiting bottom plate 51, front and rear ends of the first rotating plate 62 are respectively connected to the limiting bottom plate 51 and the damping plate 61 through a hinge connection, a second rotating plate 63 is connected to a middle portion of the first rotating plate 62 in a transmission manner, a moving seat 64 is rotatably connected to one end of the second rotating plate 63 far away from the first rotating plate 62, a ball 65 is rotatably connected to one side of the moving seat 64 close to the limiting bottom plate 51, a limiting moving groove is formed in a side of the bottom end surface of the limiting bottom plate 51 corresponding to the ball 65, glass wool is laid in the limiting moving groove, a spring telescopic rod 66 is disposed at a bottom end surface of the limiting bottom plate 51 and at a left side of the moving seat 64, a moving end of the spring telescopic rod 66 is fixedly connected to a left side of the moving seat 64, and a plurality of rubber pads 67 in a rectangular array are disposed on a bottom surface of the damping plate 61.
In operation, when IGBT power module installs on the machine that often produces the vibration, with shock attenuation board 61 laminating on the machine, the vibration force transmission that produces when the machine is on shock attenuation board 61, then shock attenuation board 61 is close to the removal along spacing bottom plate 51, at this moment first commentaries on classics board 62 and second commentaries on classics board 63 take place to rotate, thereby make and remove seat 64 drive ball 65 and slide along spacing moving groove, spring telescopic link 66 follows the natural state and gets into compression state, then get into collision state again, at this moment, the vibration force is cushioned in spring telescopic link 66, and partly vibration force passes through ball 65 transmission on the glass is cotton, and then with vibration force greatly reduced, thereby reduce and produce the vibration force to IGBT power module.
Example five:
basically the same as the first technical solution of the embodiment, the difference is that, as shown in fig. 8 and fig. 9, the front end and the rear end of the housing 2 are provided with limit transmission assemblies 7 for driving the housing 2 to move in a limiting manner up and down, each limit transmission assembly 7 includes a fixed screw 71 installed on the top end surface of the substrate 1 in a rectangular array, two moving grooves are formed in the side walls of the front end and the rear end of the housing 2, two moving boxes 73 are installed inside each moving groove, the top end of the fixed screw 71 rotates to penetrate through the bottom of the moving box 73 and is rotatably connected with a nut 72, the top end of the fixed screw 71 slides to penetrate through the top of the moving box 73, the bottom wall of the inner cavity of the moving box 73 is rotatably connected with a first bevel gear 74 fixedly connected with the nut 72, the side walls of the inner cavities at the opposite sides of the two moving boxes 73 are rotatably connected with second bevel gears 75 engaged with each other through bearings, a transmission rod 76 fixedly connected with the second bevel gears 75 is rotatably connected between the two moving boxes 73, a transmission rod 77 is fixedly connected to the middle part of the transmission rod 76, and a side surface of the housing 2 located on the driving gear 77 is provided with a avoiding groove 78.
When the device works, the driving gear 77 is synchronously twisted from the front side and the rear side of the shell 2 to rotate, the driving rod 76 connected with the driving gear drives the second bevel gear 75 and the first bevel gear 74 to rotate, so that the first bevel gear 74 moves up and down along the fixed screw rod 71, the shell 2 can slowly move up and down in the process of disassembling the shell 2, the shell 2 is prevented from shaking left and right in the process of disassembling, and further the silicone gel is prevented from generating transverse drawing force on the electronic element 3,
in the process that the shell 2 moves up slowly, the silicone gel is bound by the square protective elastic piece 49, so that the silicone gel is easily separated from the inner wall of the shell 2, the damage of the electronic element 3 caused by the dragging of the silicone pad on the electronic element 3 due to the disassembly of the shell 2 is prevented, the protection performance of the electronic element 3 is further improved, the disassembly is simple, convenient and quick, and the threaded holes in the fixing screw rods 71 on the left side and the right side are opposite, so that the first bevel gears 74 on the two sides can move up and down on the fixing screw rods 71 synchronously.
Example six:
the structure is basically the same as the technical solution of the embodiment, and the difference is that, as shown in fig. 3, fig. 4 and fig. 9, two fastening plates 21 transversely arranged are installed on the top end surface of the substrate 1, a first plate groove 22 is formed on the inner side of the housing 2, a second plate groove 23 is formed on the inner side of the housing 2 and at the bottom of the first plate groove 22, third plate grooves 24 matched with the fastening plates 21 are formed at the front and rear ends of the housing 2, bolts 25 are connected to one side of the third plate groove 24 corresponding to the front and rear end surfaces of the housing 2 through threads, one end of each bolt 25 sequentially penetrates between the housing 2 and the fastening plate 21 through threads, and rubber materials are laid on the bottom end surfaces of the second plate groove 23, the third plate groove 24 and the housing 2.
When the shell 2 and the base plate 1 are installed, the leveling plate 102 slides along the inner side of the first plate groove 22, the pouring plate 101 slides along the inner side of the second plate groove 23, the fastening plate 21 on the base plate 1 slides along the inner side of the third plate groove 24, and the first plate groove 22, the second plate groove 23 and the third plate groove 24 are arranged in a step shape, so that the sealing performance between the base plate 1 and the shell 2 is improved, and the base plate is convenient to carry out encapsulation operation in the later period.
The working principle is as follows: this an IGBT power module for high temperature resistant, during the use:
firstly: before installing IGBT power module, install square frame 41 at pouring board 101 inboard, then utilize protection bullet 49 on the arc seat 46 to put into electronic component 3 and be a plurality of square grid shape on, it solidifies integratively with the protection bullet 49 of a plurality of square grid shape when being favorable to later stage to put into silica gel to electronic component 3, thereby when being convenient for later stage to dismantle shell 2, the protection bullet 49 of square grid shape extrudes silica gel on electronic component 3, consequently, carry out the pulling force that powerful dismantlement produced between shell 2 and base plate 1 and can not make silica gel cause the damage to electronic component 3, and can utilize control block 47 drive arc seat 46 to remove along horizontal slide bar 44 or vertical slide bar 45, prevent that protection bullet 49 causes the passageway to electronic component 3 and hinder, thereby be convenient for adjust the interval between the protection bullet 49.
Secondly, the method comprises the following steps: when the protection elastic piece 49 is arranged between the protection elastic pieces without influencing the passage of the electronic element 3, the control block 47 is limited between the first groove 103 and the second groove 48, so that the IGBT power module can prevent the arc-shaped seat 46 from sliding left and right along the horizontal sliding rod 44 or the vertical sliding rod 45 under the condition of vibration, thereby limiting the arc-shaped seat 46, and when the protection elastic piece 49 needs to be moved, the control block 47 positioned at the upper part can rotate along the top of the first groove 103, and the control block 47 positioned at the lower part can rotate upwards along the second groove 48, thereby limiting the arc-shaped seat 46.
Thirdly, the steps of: when the substrate 1 is limited, the substrate 1 is placed on the middle of the limiting bottom plate 51, then the torsion cap is driven to drive the double-thread screw 55 to rotate, at the moment, the vertical end of the T-shaped plate 53 moves relatively until the horizontal end of the T-shaped plate 53 presses the outer side wall of the substrate 1 along the limiting square rod 52, meanwhile, the T-shaped plate 53 drives the first wedge block 56 to slide along the second wedge block 57 on the substrate 1 until the first wedge block 56 and the second wedge block 57 are completely combined, so that the rapid limiting purpose of the substrate 1 is realized, and the substrate 1 is clamped in all directions.
Fourthly: when the IGBT power module is installed on the machine which often produces vibration, the shock absorption plate 61 is attached to the machine, the vibration force generated by the machine is transmitted on the shock absorption plate 61, then the shock absorption plate 61 moves close to the limiting bottom plate 51, at the same time, the first rotating plate 62 and the second rotating plate 63 rotate, so that the moving seat 64 drives the balls 65 to slide along the limiting moving groove, then the telescopic spring rod 66 enters a compression state from a natural state and then enters a collision state, at the same time, the vibration force is buffered in the telescopic spring rod 66, and a part of the vibration force is transmitted on the glass wool through the balls 65, and further the vibration force is greatly reduced, so that the vibration force generated on the IGBT power module is reduced.
Fifth: the driving gear 77 is synchronously twisted from the front side and the rear side of the shell 2 to rotate, the driving rod 76 connected with the driving gear drives the second bevel gear 75 and the first bevel gear 74 to rotate, so that the first bevel gear 74 moves up and down along the fixed screw rod 71, the shell 2 can slowly move up and down in the process of disassembling the shell 2, the situation that the shell 2 shakes left and right during disassembling the shell 2 to influence the transverse pulling force of the silica gel on the electronic element 3 is avoided, the silica gel is bound by the square protective elastic piece 49 in the process of moving up and down slowly, the silica gel is easily separated from the inner wall of the shell 2, the situation that the disassembly of the shell 2 causes the silica gel pad to drag the electronic element 3 to damage the electronic element 3 is prevented, the protection performance of the electronic element 3 is improved, the disassembly is simple, convenient and quick, and convenient, the threaded holes in the fixed screw rods 71 on the left side and the right side of the invention are opposite, and the first bevel gears 74 on the fixed screw rods 71 on the two sides synchronously move up and down.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a high temperature resistant IGBT power module which characterized in that: the method comprises the following steps:
a substrate (1); an electronic element (3) is welded on the top end face of the substrate (1);
the shell (2) is arranged on the shell (2) of the substrate (1), and the front end and the rear end of the shell (2) are provided with limit transmission assemblies (7) for driving the shell (2) to move up and down in a limiting manner;
the protective component (4) is arranged on the top end face of the substrate (1) and used for preventing the electronic element (3) from being separated from the substrate (1) when the silicone gel is subjected to drawing force, the protective component (4) comprises a square frame (41) installed on the top end face of the substrate (1), and a plurality of net-shaped protective elastic pieces (49) are arranged on the inner side wall of the square frame (41);
the limiting assembly (5) is arranged on the outer side wall of the substrate (1) and used for limiting and clamping the substrate (1);
and the damping component (6) is arranged on the bottom of the substrate (1) and used for buffering the substrate (1).
2. The IGBT power module with high temperature resistance of claim 1, characterized in that: the top corner of square frame (41) installs fixed block (43) that are the rectangle array, is located both ends about all install horizontal slide bar (44) between fixed block (43), both ends around being located vertical slide bar (45) are all installed in fixed block (43), the outside of horizontal slide bar (44) and vertical slide bar (45) is all slided and is provided with arc seat (46) that are the linear array, and one side that the one end of arc seat (46) corresponds protection bullet piece (49) is fixed connection.
3. The high temperature resistant IGBT power module according to claim 1 or 2, characterized in that: the top end face of base plate (1) just is located the outside of square frame (41) and installs and pours board (101), pour the inside wall of board (101) and be located the top of square frame (41) and install parallel and level board (102), vertical groove (42) that are the rectangle array are seted up to the inside wall of square frame (41).
4. The IGBT power module with high temperature resistance of claim 2, characterized in that: the arc-shaped seat (46) is made of elastic materials, and control blocks (47) are installed at the upper end and the lower end of the arc-shaped seat (46).
5. The IGBT power module with high temperature resistance of claim 3, characterized in that: the top of parallel and level board (102) is equipped with a plurality of first recess (103) that are the rectangle array, and just first recess (103) are located control block (47) under, and just first recess (103) are the setting of tilting up, the top face of square frame (41) is equipped with a plurality of second recess (48) that are the rectangle array, and second recess (48) are located control block (47) under, and second recess (48) are the setting of tilting down.
6. The IGBT power module with high temperature resistance of claim 3, characterized in that: spacing subassembly (5) are including welding spacing bottom plate (51) at base plate (1) bottom face, two spacing square pole (52) are all installed at both ends about base plate (1), both ends are provided with T template (53) with two spacing square pole (52) looks sliding connection about base plate (1), through hole (54) that are used for T template (53) spacing removal are offered at both ends about spacing bottom plate (51), the vertical end of T template (53) is inboard at through hole (54), the middle part threaded connection of spacing bottom plate (51) has horizontal double threaded screw (55) that sets up, and double threaded screw (55) about both ends pass behind through hole (54) and with the vertical end threaded connection of T template (53), the left end of double threaded screw (55) is rotated and is passed behind the left side of spacing bottom plate (51) and is installed and is turned round the cap, two first voussoir (56) are installed to the opposite side of T (53), second voussoir (57) extruded mutually with first voussoir (56) are installed at both ends around base plate (1).
7. The IGBT power module with high temperature resistance of claim 6, characterized in that: damping component (6) are including damper plate (61), the transmission groove has been seted up to the bottom face of limiting bottom plate (51), the bottom of limiting bottom plate (51) just is located the transmission inslot and is provided with first rotor plate (62) that is linear array, both ends are connected with limiting bottom plate (51) and damper plate (61) respectively through the hinged joint mode around first rotor plate (62), the middle part transmission of first rotor plate (62) is connected with second rotor plate (63), the one end that first rotor plate (62) were kept away from in second rotor plate (63) is rotated and is connected with removal seat (64), it is connected with ball (65) to remove one side rotation that seat (64) is close to limiting bottom plate (51), spacing moving groove has been seted up to one side that the bottom face of limiting bottom plate (51) corresponds ball (65), and has laid the glass cotton in the spacing moving groove, spring telescopic link (66) is installed to the bottom face of limiting bottom plate (51) and the left side that is located removal seat (64), the removal end of spring telescopic link (66) is the left side of removal seat (64), damper plate (61) is the fixed connection rubber pad (67).
8. The IGBT power module with high temperature resistance of claim 6, characterized in that: spacing transmission subassembly (7) are including being the fixed screw (71) that the rectangle array installed at base plate (1) top terminal surface, two shifting chutes have been seted up to the front and back both ends lateral wall of shell (2), every group two movable box (73) are installed to the inboard of shifting chute, the top of fixed screw (71) is rotated and is passed the bottom of movable box (73) and rotate and be connected with nut (72), and the top of fixed screw (71) slides and pass the top of movable box (73), the inner chamber diapire of movable box (73) rotates and is connected with first bevel gear (74) with nut (72) fixed connection, two the relative side inner chamber lateral wall of movable box (73) is rotated through the bearing and is connected with second bevel gear (75) that mesh with first bevel gear (74), two it is connected with transfer line (76) with second bevel gear (75) fixed connection to rotate between movable box (73), the middle part fixedly connected with drive gear (77) of transfer line (76), a side that shell (2) are located drive gear (77) has seted up and has avoided groove (78).
9. The IGBT power module with high temperature resistance of claim 8, characterized in that: two transversely-arranged fastening plates (21) are installed on the top end face of the base plate (1), a first plate groove (22) is formed in the inner side of the shell (2), a second plate groove (23) is formed in the inner side of the shell (2) and located at the bottom of the first plate groove (22), a third plate groove (24) matched with the fastening plates (21) is formed in the front end and the rear end of the shell (2), a bolt (25) is connected to one side of the third plate groove (24) corresponding to the front end face and the rear end face of the shell (2) in a threaded mode, and the shell (2) and the fastening plates (21) are arranged at one end of the bolt (25) in a threaded mode in sequence.
10. The high temperature resistant IGBT power module of claim 9, wherein: and rubber materials are laid on the bottom end surfaces of the second plate groove (23), the third plate groove (24) and the shell (2).
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| CN202211233204.0A CN115295498B (en) | 2022-10-10 | 2022-10-10 | High-temperature-resistant IGBT power module |
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| CN202211233204.0A CN115295498B (en) | 2022-10-10 | 2022-10-10 | High-temperature-resistant IGBT power module |
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| CN115295498B true CN115295498B (en) | 2023-01-24 |
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| JP4075992B2 (en) * | 2003-05-07 | 2008-04-16 | トヨタ自動車株式会社 | Semiconductor module manufacturing method, semiconductor module, integrated motor using the same, and automobile equipped with the integrated motor |
| CN102832142A (en) * | 2011-06-14 | 2012-12-19 | 弘凯光电股份有限公司 | Manufacturing method for packaging structure |
| CN105448846B (en) * | 2015-12-23 | 2017-12-05 | 江苏宏微科技股份有限公司 | Low inductance light and thin type power model |
| CN216600181U (en) * | 2021-10-19 | 2022-05-24 | 信丰福昌发电子有限公司 | Shock attenuation formula high density HDI circuit board with safeguard mechanism |
| CN217426714U (en) * | 2021-12-01 | 2022-09-13 | 合肥中恒微半导体有限公司 | IGBT module packaging structure |
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Application publication date: 20221104 Assignee: Anhui Xingtai Financial Leasing Co.,Ltd. Assignor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Contract record no.: X2024980005797 Denomination of invention: A High Temperature Resistant IGBT Power Module Granted publication date: 20230124 License type: Exclusive License Record date: 20240517 |
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Denomination of invention: A High Temperature Resistant IGBT Power Module Granted publication date: 20230124 Pledgee: Anhui Xingtai Financial Leasing Co.,Ltd. Pledgor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Registration number: Y2024980017926 |