CN115295452A - Die bonder and die bonding method - Google Patents

Die bonder and die bonding method Download PDF

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Publication number
CN115295452A
CN115295452A CN202210976786.5A CN202210976786A CN115295452A CN 115295452 A CN115295452 A CN 115295452A CN 202210976786 A CN202210976786 A CN 202210976786A CN 115295452 A CN115295452 A CN 115295452A
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China
Prior art keywords
wafer
station
die
turret
picking
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CN202210976786.5A
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Chinese (zh)
Inventor
陈官海
张维伦
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Shenzhen Zhuoxing Advanced Packaging Technology Co ltd
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Shenzhen Zhuoxing Advanced Packaging Technology Co ltd
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Priority to CN202210976786.5A priority Critical patent/CN115295452A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Abstract

The invention provides a die bonder and a die bonding method, wherein the die bonder comprises a turret, a turret driving mechanism, a plurality of wafer pickup devices and a first visual alignment system, the turret driving mechanism is used for driving the turret to rotate, the wafer pickup devices are installed on the turret, the wafer pickup devices can move up and down on the turret along a Z axis and do self-rotation movement, the wafer pickup devices are provided with calibration holes, before the wafer pickup devices do not reach a die bonding station, the first visual alignment system photographs the calibration holes to perform precision compensation on the turret, calculates a compensation value error between the turret and a die bonding table, gives a compensation value of the die bonding table, and ensures that the mounting precision cannot be influenced by the change of the in-place precision of the turret. The beneficial effects of the invention are: the invention can automatically correct the accumulative error of the turret, improve the die bonding precision, and simultaneously has the functions of static electricity removal, automatic wafer angle correction, die taking and die bonding real-time detection and pick-up head cleaning.

Description

Die bonder and die bonding method
Technical Field
The invention relates to the technical field of die bonding, in particular to a die bonding machine and a die bonding method.
Background
The precision of the traditional equipment is guaranteed by depending on the precision of the machine, errors always accumulate in the running process of the equipment, the precision is obviously known to have deviation, but the deviation direction cannot be determined, and especially in the equipment for transferring and attaching chips with high speed and high precision, the traditional mode can not meet the requirement.
Disclosure of Invention
The invention provides a die bonder which comprises a turret, a turret driving mechanism, a plurality of wafer picking devices and a first visual alignment system, wherein the turret driving mechanism is used for driving the turret to rotate, the wafer picking devices are installed on the turret and can perform Z-axis up-and-down movement and self-rotation movement on the turret, the wafer picking devices are provided with calibration holes, before the wafer picking devices do not reach a die bonding station, the first visual alignment system photographs the calibration holes, performs precision compensation on the turret, calculates the compensation value error between the turret and the die bonding table, provides a compensation value of the die bonding table, and ensures that the mounting precision cannot be influenced by the change of the turret in-place precision.
As a further improvement of the invention, the die bonder further comprises an illuminating lamp, wherein the first vision alignment system is positioned above the calibration hole, the illuminating lamp is positioned below the calibration hole, and the illuminating lamp is used for lighting or supplementing light from the bottom of the calibration hole.
As a further improvement of the present invention, the turret driving mechanism is a DD motor, the die bonder further comprises a guide rail, a linear motor, and a micro stepping motor, the guide rail is connected to the turret, the wafer picking device is mounted on the guide rail, and the linear motor drives the wafer picking device to move up and down on the guide rail along the Z axis; the miniature stepping motor drives the wafer pickup device to perform self-rotation movement.
As a further improvement of the invention, the die bonder further comprises a die supply mechanism, a second vision alignment system, a thimble, an electrostatic elimination module, a first vision detection system, a die bonder, a third vision alignment system,
the wafer supply mechanism, the second vision alignment system and the ejector pins are positioned at a wafer taking station, when the wafer picking device rotates to the wafer taking station, the second vision alignment system takes pictures in real time to determine the position of the wafer, the wafer on the wafer supply mechanism is jacked up through the ejector pins, and the wafer picking device picks up the wafer;
the static elimination module is positioned at a static elimination station and is used for eliminating static ions of the wafer picking device when the wafer picking device rotates to the static elimination station;
the first vision detection system is positioned at a wafer correcting station, when the wafer picking device rotates to the wafer correcting station, the first vision detection system photographs the wafer picking device and the wafer to obtain the position of the wafer relative to the wafer picking device, and if the angle of the wafer deflects, the wafer picking device on the turret performs self-rotation correction;
the die bonding table and the third vision alignment system are located at a die bonding station, a circuit board is placed on the die bonding table, when the die picking device rotates to the die bonding station, the third vision alignment system shoots the circuit board to determine the position of a bonding pad on the circuit board, and then the die picking device attaches the die to the bonding pad.
As a further improvement of the present invention, the wafer supply mechanism includes a moving stage, a wafer ring, a guide rail, a magnet linear motor, and a stepping motor, wherein the wafer ring is provided with a blue film, the wafer is arranged on the blue film, the wafer ring is mounted on the moving stage, the moving stage is mounted on the guide rail, the magnet linear motor drives the moving stage to move left and right on the guide rail in X and Y axes, and the stepping motor is used for driving the wafer ring to perform self-rotation.
As a further improvement of the present invention, the first vision detection system includes a CCD vision module and a light source, emits light through the light source, projects the structured light to the substrate to be detected through the LCD pattern generator and the projection lens, acquires an image through one or more high-level cameras, performs preprocessing, analyzes, compares and judges the image by using an image processing algorithm, and finally gives a recognized structure.
As a further improvement of the invention, the wafer picking device comprises a picking head, the picking head is used for completing the crystal taking and the crystal fixing, the crystal fixing machine also comprises a cleaning mechanism (7), and the cleaning mechanism (7) is positioned at a cleaning station; when the wafer pickup apparatus is located the wafer correction station, if first vision detecting system detects that the pickup head has dirty stagnation or wafer damage, then the wafer pickup apparatus skips the solid brilliant station, and wafer pickup apparatus shifts to clean the station, by clean mechanism is cleaned the pickup head, and is cleared up the wafer.
As a further improvement of the invention, the wafer picking device comprises a picking head, the picking head is used for completing wafer picking and wafer fixing, the wafer fixing machine further comprises a second visual detection system and a cleaning mechanism, the second visual detection system is positioned at the detection station, and the cleaning mechanism is positioned at the cleaning station; when accomplishing solid brilliant back at solid brilliant station, the wafer pick-up device transfers to and detects the station, the second vision is listened the system and is shot the wafer pick-up device, if find to pick up overhead the wafer, then the wafer pick-up device transfers to clean station, by clean mechanism clears up the wafer on the head, if find to pick up overhead not have the wafer, then the wafer pick-up device skips clean station, and the wafer pick-up device transfers to and gets brilliant station and get brilliant work.
As a further improvement of the invention, the wafer picking device comprises a picking head, the picking head is used for completing the crystal taking and the crystal fixing, the crystal fixing machine further comprises a cleaning mechanism, the cleaning mechanism is positioned at a cleaning station, and the cleaning mechanism comprises a cleaning medium; the turret is provided with a negative pressure detection mechanism, the negative pressure detection mechanism is used for detecting the pickup head, after the die-bonding of the die pickup device is finished, if a tin paste on the pickup head or a die is not attached to a bonding pad and negative pressure difference is generated, the die pickup device rotates to a cleaning station, and the cleaning mechanism cleans the pickup head through positive pressure and simultaneously cleans the pickup head through Z-axis extension and self-rotation of the pickup head and friction of a cleaning medium in the cleaning station.
The invention also provides a die bonding method, which executes the precision compensation step before the die picking device (12) does not reach the die bonding station,
and (3) precision compensation step: the calibration holes are photographed through the first vision alignment system, the precision compensation is carried out on the turret, the compensation value error between the turret and the die bonding table is calculated, the compensation value of the die bonding table is given, and it is guaranteed that the mounting precision cannot be affected by the change of the in-place precision of the turret.
As a further improvement of the invention, the die bonding method comprises the following steps:
step 1, crystal taking step: the wafer picking device is transferred to a wafer picking station, the second vision alignment system takes pictures in real time to determine the position of the wafer, the wafer on the wafer supply mechanism is jacked up through the thimble, and the wafer is picked up by the wafer picking device;
step 2, static electricity removing step: the wafer picking device is transferred to the static electricity removing station, and static ions of the wafer picking device are removed through the static electricity removing module;
step 3, wafer correction: the wafer picking device rotates to a wafer correcting station, the first vision detection system photographs the wafer picking device and the wafer to obtain the position of the wafer relative to the wafer picking device, and if the angle of the wafer deflects, the wafer picking device on the turret performs self-rotation correction;
step 4, die bonding: wafer pickup assembly shifts to solid brilliant station, is shot the circuit board by third vision counterpoint system, confirms the pad position on the circuit board, then is laminated the wafer on the pad by wafer pickup assembly.
As a further improvement of the present invention, when the wafer picking device is located at the wafer correcting station, if the first vision detecting system detects that the picking head is dirty or the wafer is damaged, the wafer picking device skips the wafer fixing station, the wafer picking device transfers to the cleaning station, and the cleaning mechanism cleans the picking head and cleans the wafer.
As a further improvement of the invention, the die bonding method further comprises the following steps:
step 5, detection step: wafer pickup assembly rotates and detects the station, and second vision is listened system and is shot wafer pickup assembly, if the discovery pick up overhead have the wafer, then wafer pickup assembly rotates clean station to, will pick up overhead wafer clearance by clean mechanism, if the discovery pick up overhead do not have the wafer, then wafer pickup assembly skips clean station, and wafer pickup assembly rotates and gets brilliant station and get brilliant work.
As a further improvement of the invention, the turret is provided with a negative pressure detection mechanism which is used for detecting the pickup head, after the die-bonding of the wafer pickup device is finished, if the situation that tin paste exists on the pickup head or a wafer is not attached to a bonding pad to generate negative pressure difference is found, the wafer pickup device rotates to a cleaning station, and the cleaning mechanism performs positive pressure cleaning on the pickup head and simultaneously performs Z-axis extension on the pickup head and self-rotation of the pickup head and friction of a cleaning medium at the cleaning station to play a cleaning role.
The invention has the beneficial effects that: the invention can automatically correct the accumulative error of the turret, improve the die bonding precision, and simultaneously has the functions of static electricity removal, automatic wafer angle correction, die taking and die bonding real-time detection and pickup head cleaning.
Drawings
Fig. 1 is a schematic diagram of the principle of the present invention.
Detailed Description
As shown in fig. 1, the invention discloses a die bonder, which comprises a turret 1, a turret driving mechanism, a plurality of wafer pickup devices 12 and a first visual alignment system 9, wherein the turret driving mechanism is used for driving the turret 1 to rotate, the plurality of wafer pickup devices 12 are installed on the turret 1, the wafer pickup devices 12 can perform Z-axis up-and-down movement and self-rotation movement on the turret 1, the wafer pickup devices 12 are provided with calibration holes 11, before the wafer pickup devices 12 do not reach a die bonding station, the first visual alignment system 9 photographs the calibration holes 11 to perform precision compensation on the turret 1, calculates a compensation value error between the turret 1 and the die bonding table 5, provides a compensation value of the die bonding table 5, and ensures that the in-place precision change of the turret 1 does not influence the mounting precision, thereby ensuring die bonding precision and ensuring the die bonding yield of equipment.
The die bonder further comprises an illuminating lamp, the first vision alignment system 9 is located above the calibration hole 11, the illuminating lamp is located below the calibration hole 11, and the illuminating lamp is used for lighting or supplementing light from the bottom of the calibration hole 11.
The turret driving mechanism is a DD motor, and the DD motor is high in response speed and low in noise.
The die bonder further comprises a guide rail, a linear motor and a micro stepping motor, wherein the guide rail is connected with the turret 1, the wafer picking device 12 is installed on the guide rail, and the linear motor drives the wafer picking device 12 to move up and down on the guide rail along the Z axis; the micro stepper motor drives the wafer pick-up device 12 to perform a self-rotating motion.
The wafer pickup device 12 may be a suction nozzle, and the wafer pickup device 12 realizes the up-and-down motion to pick up the wafer, the die bonding function, and the self-rotation wafer angle adjusting function.
The die bonder further comprises a die supply mechanism 2, a second vision alignment system 8, a thimble, an electrostatic elimination module 3, a first vision detection system 4, a die bonding table 5 and a third vision alignment system 10.
The wafer supply mechanism 2, the second vision alignment system 8 and the ejector pins are positioned at a wafer taking station, when the wafer picking device 12 rotates to the wafer taking station, the second vision alignment system 8 takes a picture in real time to determine the position of the wafer, the wafer on the wafer supply mechanism 2 is jacked up through the ejector pins, and the wafer is picked up by the wafer picking device 12; the wafer supply mechanism 2 comprises a moving platform, a wafer ring, a guide rail, a magnet linear motor and a stepping motor, wherein a blue film is arranged on the wafer ring, the wafer is arranged on the blue film, the wafer ring is arranged on the moving platform, the moving platform is arranged on the guide rail, the magnet linear motor drives the moving platform to move left and right of X and Y axes on the guide rail, and the stepping motor is used for driving the wafer ring to perform self-rotation. The second vision alignment system 8 is fixedly installed, the second vision alignment system 8 is accurately aligned with the pick-up head and the thimble by three points, and when the wafer is picked up, the second vision alignment system 8 and the wafer are relatively static. When picking up the wafer, the thimble is installed under the crystal-member ring and the blue film, before the thimble is lifted up, the negative pressure sucks the blue film, then the thimble lifts up the wafer to make it leave the blue film, and then the picking-up head of the wafer picking-up device 12 picks up the wafer.
The static elimination module 3 is located at a static elimination station, and when the wafer picking device 12 is rotated to the static elimination station, the static elimination module 3 is used for eliminating static ions of the wafer picking device 12 to prevent damage to components.
The first vision detection system 4 is located at a wafer correction station, when the wafer picking device 12 rotates to the wafer correction station, the first vision detection system 4 takes a picture of the wafer picking device 12 and the wafer to obtain the position of the wafer relative to the wafer picking device 12, and if the wafer angle deflects, the wafer picking device 12 on the turret 1 is subjected to self-rotation deviation correction to correct the wafer angle in time (when the position of the wafer is adjusted, the turret 1 can move or stop to finish the correction); the first visual detection system 4 comprises a CCD visual module and a light source, light is emitted through the light source, the structured light is projected to a substrate to be detected through an LCD pattern generator and a projection lens, images are collected through one or more high-level cameras at last, after preprocessing is carried out, an algorithm of image processing is adopted, the images are analyzed, compared and judged, and finally a recognized structure is given.
The die bonding table 5 and the third vision alignment system 10 are located at a die bonding station, a circuit board is placed on the die bonding table 5, when the die picking device 12 rotates to the die bonding station, the third vision alignment system 10 shoots the circuit board to determine the position of a bonding pad on the circuit board, and then the die picking device 12 attaches the die to the bonding pad.
The wafer picking device 12 comprises a picking head, and the wafer picking and die bonding are completed through the picking head, and the die bonding machine further comprises a cleaning mechanism 7, wherein the cleaning mechanism 7 is positioned at a cleaning station; when the wafer picking device 12 is located at the wafer correction station, if the first vision detection system 4 detects that the picking head is dirty or the wafer is damaged, the wafer picking device 12 skips the wafer fixing station, the wafer picking device 12 transfers to the cleaning station, and the cleaning mechanism 7 cleans the picking head and cleans the wafer.
The die bonder further comprises a second visual detection system 6, the second visual detection system 6 is located at a detection station, when die bonding is completed at the die bonding station, the wafer picking device 12 is transferred to the detection station, the second visual detection system 6 shoots the wafer picking device 12, if a wafer is found on the picking head, the wafer picking device 12 is transferred to a cleaning station, the wafer on the picking head is cleaned by the cleaning mechanism 7, if no wafer is found on the picking head, the wafer picking device 12 skips the cleaning station, and the wafer picking device 12 is transferred to the die bonding station to perform die bonding.
The wafer picking device 12 comprises a picking head, crystal picking and crystal fixing are completed through the picking head, the crystal fixing machine further comprises a cleaning mechanism 7, the cleaning mechanism 7 is located at a cleaning station, and the cleaning mechanism 7 comprises cleaning media; the turret 1 is provided with a negative pressure detection mechanism which is used for detecting the pickup head, when the wafer fixing of the wafer pickup device 12 is finished, if a tin paste on the pickup head or a wafer is not attached to a bonding pad and negative pressure difference is generated, the wafer pickup device 12 rotates to a cleaning station, and the cleaning mechanism 7 cleans the pickup head through positive pressure and simultaneously cleans the pickup head through Z-axis extension and cleaning medium friction between the pickup head and the cleaning station.
The invention also discloses a die bonding method, which executes the precision compensation step before the die picking device 12 does not reach the die bonding station.
And (3) precision compensation step: the calibration hole 11 is photographed through the first vision alignment system 9, the turret 1 is subjected to precision compensation, the compensation value error between the turret 1 and the die bonding table 5 is calculated, the compensation value of the die bonding table 5 is given, and the fact that the mounting precision is not affected by the change of the in-place precision of the turret 1 is guaranteed.
The die bonding method comprises the following steps:
step 1, crystal taking step: the wafer picking device 12 is rotated to a wafer picking station, the second vision alignment system 8 takes a picture in real time to determine the position of the wafer, the wafer on the wafer supply mechanism 2 is jacked up through a thimble, and the wafer is picked up by the wafer picking device 12;
step 2, static electricity removing step: the wafer picking device 12 is transferred to the static electricity removing station, and static ions of the wafer picking device 12 are removed through the static electricity removing module 3;
step 3, wafer correction: the wafer picking device 12 rotates to a wafer correcting station, the first vision detection system 4 photographs the wafer picking device 12 and the wafer to obtain the position of the wafer relative to the wafer picking device 12, and if the angle of the wafer deflects, the wafer picking device 12 on the turret 1 performs self-rotation correction;
step 4, die bonding: wafer pickup assembly 12 changes to solid brilliant station, is shot the circuit board by third vision alignment system 10, confirms the pad position on the circuit board, then is laminated the wafer on the pad by wafer pickup assembly 12.
When wafer pickup apparatus 12 is located the wafer and rectifies the station, if first vision detecting system 4 detects that the pickup head has dirty stagnated or the wafer damage, then wafer pickup apparatus 12 skips solid brilliant station, and wafer pickup apparatus 12 turns to clean the station, is cleaned the pickup head by clean mechanism 7, and clears up the wafer.
The die bonding method also comprises the following steps:
step 5, detection step: wafer pickup apparatus 12 changes the detection station, and second vision is listened system 6 and is shot wafer pickup apparatus 12, if the discovery has the wafer on picking up the head, then wafer pickup apparatus 12 changes clean station to, is cleared up the wafer on picking up the head by clean mechanism 7, if the discovery does not have the wafer on picking up the head, then wafer pickup apparatus 12 skips clean station, and wafer pickup apparatus 12 changes and gets brilliant work to getting brilliant station.
The turret 1 is provided with a negative pressure detection mechanism which is used for detecting the pickup head, when the wafer fixing of the wafer pickup device 12 is finished, if a tin paste on the pickup head or a wafer is not attached to a bonding pad and negative pressure difference is generated, the wafer pickup device 12 rotates to a cleaning station, and the cleaning mechanism 7 cleans the pickup head through positive pressure and simultaneously cleans the pickup head through Z-axis extension and cleaning medium friction between the pickup head and the cleaning station.
The invention can automatically correct the accumulated error of the turret 1 and has the functions of static electricity removal, wafer angle automatic correction, crystal taking and fixing real-time detection and pickup head cleaning.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims (14)

1. A die bonder is characterized in that: the visual alignment system comprises a turret (1), a turret driving mechanism, a plurality of wafer picking devices (12) and a first visual alignment system (9), wherein the turret driving mechanism is used for driving the turret (1) to rotate, the wafer picking devices (12) are installed on the turret (1), the wafer picking devices (12) can move up and down on the Z axis and do self-rotation movement, the wafer picking devices (12) are provided with calibration holes (11), before the wafer picking devices (12) do not reach a die bonding station, the first visual alignment system (9) photographs the calibration holes (11), the precision of the turret (1) is compensated, the compensation value error between the turret (1) and the die bonding station (5) is calculated, the compensation value of the die bonding station (5) is given, and the fact that the in-place precision of the turret (1) cannot be changed and the mounting precision cannot be affected is guaranteed.
2. The die bonder of claim 1, wherein: the die bonder further comprises an illuminating lamp, the first vision alignment system (9) is located above the calibration hole (11), the illuminating lamp is located below the calibration hole (11), and the illuminating lamp is used for lighting or supplementing light from the bottom of the calibration hole (11).
3. The die bonder of claim 1, wherein: the die bonder is characterized in that the turret driving mechanism is a DD motor, the die bonder further comprises a guide rail, a linear motor and a micro stepping motor, the guide rail is connected with the turret (1), the die picking device (12) is installed on the guide rail, and the linear motor drives the die picking device (12) to move up and down on the guide rail along the Z axis; the micro stepping motor drives the wafer pickup device (12) to perform self-rotation movement.
4. The die bonder of claim 1, wherein: the die bonder also comprises a die supply mechanism (2), a second vision alignment system (8), a thimble, a static elimination module (3), a first vision detection system (4), a die bonding table (5) and a third vision alignment system (10),
the wafer supply mechanism (2), the second vision alignment system (8) and the ejector pins are located at a wafer taking station, when the wafer picking device (12) rotates to the wafer taking station, the second vision alignment system (8) takes pictures in real time to determine the position of the wafer, the wafer on the wafer supply mechanism (2) is jacked up through the ejector pins, and the wafer is picked up by the wafer picking device (12);
the static elimination module (3) is positioned at a static elimination station, and when the wafer picking device (12) rotates to the static elimination station, the static elimination module (3) is used for eliminating static ions of the wafer picking device (12);
the first vision detection system (4) is positioned at a wafer correction station, when the wafer picking device (12) rotates to the wafer correction station, the first vision detection system (4) photographs the wafer picking device (12) and the wafer to obtain the position of the wafer relative to the wafer picking device (12), and if the angle of the wafer deflects, the wafer picking device (12) on the turret (1) performs self-rotation correction;
the die bonding table (5) and the third vision alignment system (10) are located at a die bonding station, a circuit board is placed on the die bonding table (5), when the die picking device (12) is transferred to the die bonding station, the third vision alignment system (10) shoots the circuit board to determine the position of a bonding pad on the circuit board, and then the die picking device (12) attaches the die to the bonding pad.
5. The die bonder of claim 4, wherein: the wafer supply mechanism (2) comprises a moving platform, a wafer ring, a guide rail, a magnet linear motor and a stepping motor, wherein a blue film is arranged on the wafer ring, a wafer is arranged on the blue film, the wafer ring is arranged on the moving platform, the moving platform is arranged on the guide rail, the magnet linear motor drives the moving platform to move left and right at X and Y axes on the guide rail, and the stepping motor is used for driving the wafer ring to perform self-rotation.
6. The die bonder of claim 4, wherein: the first vision detection system (4) comprises a CCD vision module and a light source, light is emitted through the light source, structured light is projected to a substrate to be detected through an LCD pattern generator and a projection lens, images are collected through one or more high-level cameras at last, after preprocessing is carried out, an algorithm of image processing is adopted, the images are analyzed, compared and judged, and finally a recognized structure is given.
7. The die bonder of claim 4, wherein: the wafer picking device (12) comprises a picking head, crystal taking and crystal fixing are completed through the picking head, the crystal fixing machine further comprises a cleaning mechanism (7), and the cleaning mechanism (7) is positioned at a cleaning station; when wafer pickup attachment (12) is located the wafer and corrects the station, if first vision detecting system (4) detects that the pickup head has dirty stagnation or wafer damage, then wafer pickup attachment (12) skips the solid brilliant station, and wafer pickup attachment (12) turn to clean the station, by clean mechanism (7) clean the pickup head, and clear up the wafer.
8. The die bonder of claim 4, wherein: the wafer picking device (12) comprises a picking head, and the wafer picking and die bonding are completed through the picking head, the die bonding machine further comprises a second vision detection system (6) and a cleaning mechanism (7), the second vision detection system (6) is positioned at a detection station, and the cleaning mechanism (7) is positioned at a cleaning station; after the die bonding is completed at the die bonding station, the wafer picking device (12) is transferred to the detection station, the second visual detection system (6) shoots the wafer picking device (12), if the wafer is found on the picking head, the wafer picking device (12) is transferred to the cleaning station, the wafer on the picking head is cleaned by the cleaning mechanism (7), if no wafer is found on the picking head, the wafer picking device (12) skips the cleaning station, and the wafer picking device (12) is transferred to the wafer taking station to carry out the wafer taking operation.
9. The die bonder of claim 4, wherein: the wafer picking device (12) comprises a picking head, the picking head is used for picking and fixing the wafer, the wafer fixing machine further comprises a cleaning mechanism (7), the cleaning mechanism (7) is positioned at a cleaning station, and the cleaning mechanism (7) comprises a cleaning medium; the turret (1) is provided with a negative pressure detection mechanism, the negative pressure detection mechanism is used for detecting the pickup head, after the die-bonding of the wafer pickup device (12) is finished, if the negative pressure difference is generated when the solder paste or the wafer on the pickup head is not attached to the bonding pad, the wafer pickup device (12) rotates to a cleaning station, and the cleaning mechanism (7) cleans the pickup head at positive pressure and simultaneously rubs the cleaning medium for extending the Z axis and automatically rotating the pickup head and cleaning the position to play a cleaning role.
10. A die bonding method is characterized in that a precision compensation step is executed before a die pickup device (12) does not reach a die bonding station,
and (3) precision compensation step: the calibration hole (11) is photographed through the first vision alignment system (9), the precision compensation is carried out on the turret (1), the compensation value error between the turret (1) and the die bonding table (5) is calculated, the compensation value of the die bonding table (5) is given, and the mounting precision cannot be influenced by the change of the in-place precision of the turret (1).
11. The die bonding method according to claim 10, comprising the steps of:
step 1, crystal taking step: the wafer picking device (12) is rotated to a wafer taking station, the second vision alignment system (8) takes pictures in real time to determine the position of the wafer, the wafer on the wafer supply mechanism (2) is jacked up through a thimble, and the wafer is picked up by the wafer picking device (12);
step 2, static electricity removing step: the wafer picking device (12) is transferred to the static electricity removing station, and static ions of the wafer picking device (12) are removed through the static electricity removing module (3);
step 3, wafer correction: the wafer picking device (12) rotates to a wafer correcting station, the first vision detection system (4) photographs the wafer picking device (12) and the wafer to obtain the position of the wafer relative to the wafer picking device (12), and if the angle of the wafer deflects, the wafer picking device (12) on the turret (1) rotates automatically to correct the deviation;
step 4, a die bonding step: wafer pickup attachment (12) transfer to solid brilliant station, are shot the circuit board by third vision counterpoint system (10), confirm the pad position on the circuit board, then are laminated the wafer on the pad by wafer pickup attachment (12).
12. The die bonding method according to claim 11, wherein when the die pick-up device (12) is located at the die alignment station, if the first vision detection system (4) detects that the pick-up head is dirty or damaged, the die pick-up device (12) skips the die bonding station, the die pick-up device (12) moves to the cleaning station, and the cleaning mechanism (7) cleans the pick-up head and cleans the die.
13. The die bonding method according to claim 11, further comprising: step 5, detection step: wafer pickup attachment (12) are transferred to and are detected the station, and second vision is listened system (6) and is taken a picture wafer pickup attachment (12), if find pick up overhead have the wafer, then wafer pickup attachment (12) are transferred to clean the station, clear up the wafer on picking up overhead by clean mechanism (7), if find pick up overhead not have the wafer, clean station is skipped in then wafer pickup attachment (12), wafer pickup attachment (12) are transferred to and are got the brilliant station and get brilliant work.
14. The die bonding method according to claim 11, wherein: the turret (1) is provided with a negative pressure detection mechanism, the negative pressure detection mechanism is used for detecting the pickup head, after the die-bonding of the wafer pickup device (12) is finished, if the negative pressure difference is generated when the solder paste or the wafer on the pickup head is not attached to the bonding pad, the wafer pickup device (12) rotates to a cleaning station, and the cleaning mechanism (7) cleans the pickup head at positive pressure and simultaneously rubs the cleaning medium for extending the Z axis and automatically rotating the pickup head and cleaning the position to play a cleaning role.
CN202210976786.5A 2022-08-15 2022-08-15 Die bonder and die bonding method Pending CN115295452A (en)

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Application Number Priority Date Filing Date Title
CN202210976786.5A CN115295452A (en) 2022-08-15 2022-08-15 Die bonder and die bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210976786.5A CN115295452A (en) 2022-08-15 2022-08-15 Die bonder and die bonding method

Publications (1)

Publication Number Publication Date
CN115295452A true CN115295452A (en) 2022-11-04

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CN202210976786.5A Pending CN115295452A (en) 2022-08-15 2022-08-15 Die bonder and die bonding method

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