CN115295444A - Semiconductor processing etching machine with fine adjustment structure and adjustment method - Google Patents
Semiconductor processing etching machine with fine adjustment structure and adjustment method Download PDFInfo
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- CN115295444A CN115295444A CN202210866313.XA CN202210866313A CN115295444A CN 115295444 A CN115295444 A CN 115295444A CN 202210866313 A CN202210866313 A CN 202210866313A CN 115295444 A CN115295444 A CN 115295444A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H1/00—Toothed gearings for conveying rotary motion
- F16H1/02—Toothed gearings for conveying rotary motion without gears having orbital motion
- F16H1/04—Toothed gearings for conveying rotary motion without gears having orbital motion involving only two intermeshing members
- F16H1/12—Toothed gearings for conveying rotary motion without gears having orbital motion involving only two intermeshing members with non-parallel axes
- F16H1/16—Toothed gearings for conveying rotary motion without gears having orbital motion involving only two intermeshing members with non-parallel axes comprising worm and worm-wheel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Weting (AREA)
Abstract
The invention relates to the technical field of semiconductor etching equipment, in particular to an etching machine with a fine adjustment structure for semiconductor processing and an adjusting method, wherein the etching machine comprises: the etching end is horizontally and slidably arranged on the surface of the mounting plate, and side fixing plates are arranged on two sides of the mounting plate; the connecting frame is in a shape of Contraband, and two ends of the connecting frame respectively penetrate through the two limiting sliding grooves in the side fixing plate and are fixedly connected with one end of the mounting plate; the driving worm is rotatably arranged on the inner side of the movable frame; the upper end and the lower end of the electric push rod are respectively fixed with the fixed frame and the movable frame; the beneficial effects are that: through be provided with the worm wheel that cup joints with the drive shaft is fixed in one side at drive gear, the drive worm can drive gear slowly and rotate through the meshing between with the worm wheel when rotating, not only can realize the fine setting to the sculpture end, and one-way transmission between drive worm and the worm wheel moreover, when drive worm stall, drive gear can not take place offset because of inertia.
Description
Technical Field
The invention relates to the technical field of semiconductor etching equipment, in particular to an etching machine with a fine adjustment structure for semiconductor processing and an adjusting method.
Background
The etching technique is a technique for selectively etching or stripping a surface of a semiconductor substrate or a surface covering film according to a mask pattern or design requirements in a semiconductor process. Etching techniques are not only basic manufacturing processes for semiconductor devices and integrated circuits, but also applied to the processing of thin film circuits, printed circuits, and other fine patterns.
In the prior art, when the etching machine is used, an etching end of the etching machine needs to be moved continuously to ensure that different positions of a semiconductor workpiece are etched.
At present, the movement of the etching end is generally realized by the meshing of a gear and a rack, but when the gear rotates, the rolling speed of the gear on the rack is high, the position of the etching end is difficult to be micro-regulated, and the gear does not have a limiting effect and is easy to shift under the action of inertia, so that the etching effect of an etching machine on a semiconductor workpiece is influenced. Therefore, the invention provides an etching machine with a fine adjustment structure for semiconductor processing and an adjusting method for solving the problems.
Disclosure of Invention
The invention aims to provide an etching machine with a fine adjustment structure for semiconductor processing and an adjusting method, and aims to solve the problem that the position of an etching end is difficult to be fine adjusted when the etching end is driven to move by gear and rack meshing in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: an etching machine for processing a semiconductor with a fine adjustment structure comprises:
the etching end is horizontally and slidably mounted on the surface of the mounting plate, side fixing plates are arranged on two sides of the mounting plate, and limiting sliding grooves are formed in the upper end and the lower end of the surface of each side fixing plate in a penetrating mode;
the connecting frame is in a shape of Contraband, two ends of the connecting frame penetrate through the two limiting sliding grooves in the side fixing plate respectively and are fixedly connected with one end of the mounting plate, and a driving gear is rotatably arranged on the inner side of the connecting frame;
the rack is positioned below the driving gear and meshed with the driving gear, and the rack is fixedly connected with the surface of the side fixing plate;
the worm wheel is fixedly connected with the side face of the driving gear, a driving worm is arranged above the worm wheel, the driving worm is rotatably arranged on the inner side of the movable frame, the movable frame is slidably arranged on the inner side of the fixed frame, and the fixed frame is fixedly connected with the inner side wall of the connecting frame;
the electric push rod is arranged between the fixed frame and the movable frame, and the fixed frame and the movable frame are respectively fixed at the upper end and the lower end of the electric push rod.
Preferably, the middle part of drive gear is fixed through connection with the drive shaft, the one end of drive shaft is passed through the bearing and is connected with the middle part of link is rotated, worm wheel and drive shaft fixed socket joint.
Preferably, the axle sleeve has all been cup jointed in the activity at the both ends of drive worm pivot, the tip fixed connection of axle sleeve and adjustable shelf, the tip fixedly connected with limiting plate of axle sleeve, one the surface mounting of limiting plate has worm motor, and worm motor drive worm rotates.
Preferably, the both sides face of mount all runs through to have seted up perpendicular groove, two the axle sleeve respectively with two perpendicular groove activity through connection, the axle sleeve with erect groove looks adaptation, the limiting plate is laminated with the surface of mount.
Preferably, the below of mounting panel is provided with the base, side fixing plate and base fixed connection, the upper surface middle part of base is provided with the workstation, and the workstation is located the sculpture end under.
Preferably, the tip fixedly connected with bar shaped plate of mounting panel, the first connecting block of the equal fixedly connected with in both sides face upper end of bar shaped plate, square cover has all been cup jointed to the upper and lower both sides of link, the equal fixedly connected with second connecting block in both ends of square cover, four second connecting blocks and four first connecting block one-to-ones.
Preferably, both ends of the surface of the second connecting block are provided with first jacks in a penetrating manner, one side of the first connecting block is provided with a Contraband frame, and the end part of the Contraband frame sequentially and movably penetrates through the first connecting block, the limiting sliding groove and the second connecting block and extends to one side of the second connecting block.
Preferably, the middle part of the Contraband type frame is fixedly provided with a fixing ring, the middle part of the first connecting block is penetrated and provided with a first through hole, the middle part of the second connecting block is penetrated and provided with a second through hole, and the fixing ring is fixedly connected with the second connecting block through a tensioning bolt.
Preferably, the outer side wall of the middle part of the connecting frame is fixedly connected with a driving motor, and one end of an output shaft of the driving motor movably penetrates through the middle part of the connecting frame and is fixedly connected with the driving shaft.
An adjusting method of an etching machine for semiconductor processing based on a self-contained fine adjustment structure specifically comprises the following steps:
step one, an external controller controls an electric push rod to work and extend, and the electric push rod drives a movable frame and a driving worm to vertically move downwards when extending until the driving worm is contacted with and meshed with a worm wheel;
and step two, starting a worm motor, driving the driving worm to rotate when the worm motor works, driving the worm to rotate, driving the worm wheel to slowly rotate by meshing with the worm wheel, further driving the driving gear to slowly rotate, rolling the driving gear on the surface of the rack by mutual meshing with the rack, and further driving the mounting plate to slightly adjust the position along the length direction of the side fixing plate.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the worm wheel fixedly sleeved with the driving shaft is arranged on one side of the driving gear, the driving worm is meshed on the upper side of the worm wheel, the driving worm is rotatably arranged on the inner side of the movable frame, the movable frame is slidably arranged on the inner side of the fixed frame, the electric push rod is arranged between the movable frame and the fixed frame, the driving worm can be driven to move up and down to realize separation or meshing with the worm wheel when the electric push rod works, the driving gear can be driven to slowly rotate by meshing with the worm wheel when the driving worm rotates, fine adjustment of an etching end can be realized, unidirectional transmission between the driving worm and the worm wheel is also driven, and when the driving worm stops rotating, the driving gear cannot generate position deviation due to inertia.
Drawings
FIG. 1 is a schematic front view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structural connection between the mounting plate and the connecting frame according to the present invention;
FIG. 3 is a schematic view showing the separation of the strip-shaped plate and the connecting frame structure according to the present invention;
FIG. 4 is a perspective view of the connecting frame structure of the present invention;
FIG. 5 is a schematic perspective view of a strip-shaped plate structure according to the present invention;
FIG. 6 is a perspective view of the driving gear of the present invention;
fig. 7 is a schematic diagram of the separation of the fixed frame and the movable frame structure according to the present invention.
In the figure: 1. etching the end; 2. mounting a plate; 3. a side fixing plate; 4. a limiting chute; 5. a connecting frame; 6. a drive gear; 7. a drive shaft; 8. a rack; 9. a worm gear; 10. a fixed mount; 11. a movable frame; 12. an electric push rod; 13. driving the worm; 14. a worm motor; 15. a shaft sleeve; 16. a limiting plate; 17. a vertical slot; 18. a base; 19. a work table; 20. a strip plate; 21. a first connection block; 23. a square sleeve; 24. a second connecting block; 25. a first jack; 26. contraband jig; 27. a fixing ring; 28. a first through hole; 29. a second through hole; 30. tightening the bolts; 31. the motor is driven.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of some embodiments of the invention and are not limiting of the invention, and that all other embodiments obtained by those of ordinary skill in the art without the exercise of inventive faculty are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a," "an," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
For the purposes of simplicity and explanation, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
Referring to fig. 1 to 7, the present invention provides a technical solution:
example one
An etching machine for processing a semiconductor with a fine adjustment structure comprises: etching end 1, link 5, rack 8, worm wheel 9 and electric putter 12.
Specifically, the etching end 1 is horizontally slidably mounted on the surface of the mounting plate 2, the etching end 1 is mounted on a sliding seat, a sliding connection structure between the sliding seat and the mounting plate 2 can be a sliding connection between a dovetail slider and a dovetail chute, and the movement of the etching end 1 is controlled by an air cylinder, which are all structures in the prior art, and are not described herein again, the side fixing plates 3 are respectively arranged on two sides of the mounting plate 2, and the upper and lower ends of the surface of each side fixing plate 3 are respectively provided with a limiting chute 4 in a penetrating manner;
secondly, the connecting frame 5 is in a shape of Contraband, two ends of the connecting frame 5 respectively penetrate through the two limiting sliding grooves 4 on the side fixing plate 3 and are fixedly connected with one end of the mounting plate 2, so that the connecting frame 5 can slide in the grooves of the limiting sliding grooves 4 along the length direction of the limiting sliding grooves 4, and the inner side of the connecting frame 5 is rotatably provided with a driving gear 6;
further, the rack 8 is located below the driving gear 6 and meshed with the driving gear 6, and the rack 8 is fixedly connected with the surface of the side fixing plate 3, so that when the driving gear 6 rotates, the driving gear 6 can roll on the surface of the rack 8 through meshing with the rack 8, and further drives the mounting plate 2 to move along the length direction of the side fixing plate 3, and the connecting frame 5 and the driving gear 6 are both provided with two parts and are respectively located on the outer sides of two ends of the mounting plate 2, so that the mounting plate 2 can move more stably;
in addition, the worm wheel 9 is fixedly connected with the side face of the driving gear 6, a driving worm 13 is arranged above the worm wheel 9, the driving worm 13 is rotatably installed on the inner side of the movable frame 11, the movable frame 11 is slidably installed on the inner side of the fixed frame 10, the fixed frame 10 is fixedly connected with the inner side wall of the connecting frame 5, the electric push rod 12 is arranged between the fixed frame 10 and the movable frame 11, the fixed frame 10 and the movable frame 11 are respectively fixed at the upper end and the lower end of the electric push rod 12, the electric push rod 12 is controlled by an external controller to work, when the electric push rod 12 works and stretches out and draws back, the movable frame 11 and the driving worm 13 can be driven to move up and down in the vertical direction, separation and meshing between the worm wheel 9 are further realized, when the driving worm 13 is meshed with the worm wheel 9, the driving worm 13 rotates to drive the worm wheel 9 to slowly rotate, the driving gear 6 is driven to slowly roll on the surface of the rack 8, so that the position of the mounting plate 2 can be finely adjusted, and the fine adjustment of the position of the etching end 1 is realized.
Example two
On the basis of embodiment one, in order to avoid drive gear 6 and worm wheel 9 to take place to remove, this application still has and has fixedly through connection has drive shaft 7 at the middle part of drive gear 6, and the one end of drive shaft 7 passes through the bearing and is connected with the middle part of link 5 is rotated, and worm wheel 9 cup joints with drive shaft 7 is fixed, and drive shaft 7 can only rotate and can not take place to remove, therefore worm wheel 9 can only rotate but can not take place to remove with drive gear 6.
EXAMPLE III
On the basis of the second embodiment, in order to ensure that the electric push rod 12 can drive the movable frame 11 and the driving worm 13 to stably move up and down when working and extending, the present application further has the shaft sleeves 15 movably sleeved at both ends of the rotating shaft of the driving worm 13, the shaft sleeves 15 are fixedly connected with the end portions of the movable frame 11, so that the driving worm 13 can only rotate at the inner side of the movable frame 11 without position movement, the end portion of the shaft sleeve 15 is fixedly connected with the limiting plate 16, the surface of one limiting plate 16 is provided with the worm motor 14, the worm motor 14 drives the driving worm 13 to rotate, and the worm motor 14 works to drive the driving worm 13 to rotate.
In addition, all run through at the both sides face of mount 10 and seted up perpendicular groove 17, two axle sleeves 15 respectively with two perpendicular 17 activity through connections in groove, axle sleeve 15 with erect groove 17 looks adaptation, limiting plate 16 and mount 10's surface laminating, consequently, two limiting plate 16 laminating can avoid adjustable shelf 11 to take place to remove at the horizontal direction at the both sides face of mount 10, and axle sleeve 15 only can be at the vertical slip of the inner chamber that erects groove 17, consequently, the drive adjustable shelf 11 that electric putter 12 during operation can be stable reciprocates with drive worm 13.
Example four
On the basis of the third embodiment, in order to determine the placement position of the semiconductor workpiece of the device, the device further comprises a base 18 arranged below the mounting plate 2, the side fixing plate 3 is fixedly connected with the base 18, a workbench 19 is arranged in the middle of the upper surface of the base 18, the workbench 19 is positioned right below the etching end head 1, the semiconductor workpiece is placed on the upper surface of the workbench 19 and clamped and positioned by a clamp (not shown in the figure), and the mounting plate 2 is controlled by the control device and etches the semiconductor workpiece.
EXAMPLE five
On the basis of embodiment four, in order to ensure that the connection between link 5 and mounting panel 2 is more stable, this application still has the tip fixedly connected with bar board 20 at mounting panel 2, the equal fixedly connected with first connecting block 21 of bar board 20's both sides face upper end, the equal fixed square cover 23 that has cup jointed in upper and lower both sides of link 5, the equal fixedly connected with second connecting block 24 in both ends of square cover 23, four second connecting block 24 and four first connecting block 21 one-to-ones, the both ends on second connecting block 24 surface all run through and have seted up first jack 25, one side of first connecting block 21 is provided with Contraband type frame 26, contraband type frame 26's tip activity in proper order runs through first connecting block 21, spacing spout 4 and second connecting block 24 and extend to one side of second connecting block 24, can link together first connecting block 21 and second connecting block 24 through horizontal slip Contraband type frame 26 tentatively, and avoid taking place the dislocation between link 5 and the mounting panel 2.
Moreover, the fixed solid fixed ring 27 that is provided with in the middle part of Contraband type frame 26, first through-hole 28 has been seted up in the middle part of first connecting block 21 runs through, second through-hole 29 has been seted up in the middle part of second connecting block 24 runs through, through tensioning bolt 30 fixed connection between solid fixed ring 27 and the second connecting block 24, tensioning bolt 30 can be to carrying out taut fixed between Contraband type frame 26 and the second connecting block 24, and then carry out taut fixed to first connecting block 21 and second connecting block 24, in order to ensure that the connection between link 5 and the mounting panel 2 is more stable, difficult emergence is buckled.
EXAMPLE six
On the basis of the fifth embodiment, in order to drive the driving gear 6 to rotate, the driving gear is further provided with a driving motor 31 fixedly connected to the outer side wall of the middle of the connecting frame 5, one end of an output shaft of the driving motor 31 movably penetrates through the middle of the connecting frame 5 and is fixedly connected with the driving shaft 7, the driving shaft 7 can be driven to rotate when the driving motor 31 works, and therefore after the driving worm 13 is separated from the worm wheel 9, the driving gear 6 can rapidly roll on the surface of the rack 8.
An adjusting method of an etching machine for semiconductor processing based on a self-contained fine adjustment structure specifically comprises the following steps:
step one, an external controller controls an electric push rod 12 to work and extend, and when the electric push rod 12 extends, the electric push rod drives a movable frame 11 and a driving worm 13 to vertically move downwards until the driving worm 13 is contacted with and meshed with a worm wheel 9;
and step two, starting the worm motor 14, driving the worm 13 to rotate when the worm motor 14 works, driving the worm 13 to rotate, driving the worm wheel 9 to slowly rotate through meshing with the worm wheel 9, further driving the driving gear 6 to slowly rotate, enabling the driving gear 6 to roll on the surface of the rack 8 through mutual meshing with the rack 8, and further driving the mounting plate 2 to slightly adjust the position along the length direction of the side fixing plate 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a from sculpture machine for semiconductor processing of taking fine setting structure which characterized in that: the method comprises the following steps:
the etching device comprises an etching end (1), wherein the etching end (1) is horizontally and slidably mounted on the surface of a mounting plate (2), side fixing plates (3) are arranged on two sides of the mounting plate (2), and limiting sliding grooves (4) are formed in the upper end and the lower end of the surface of each side fixing plate (3) in a penetrating manner;
the connecting frame (5) is arranged in a shape of Contraband, two ends of the connecting frame (5) penetrate through the two limiting sliding grooves (4) in the side fixing plate (3) respectively and are fixedly connected with one end of the mounting plate (2), and a driving gear (6) is rotatably arranged on the inner side of the connecting frame (5);
the rack (8) is positioned below the driving gear (6) and meshed with the driving gear (6), and the rack (8) is fixedly connected with the surface of the side fixing plate (3);
the worm wheel (9), the worm wheel (9) is fixedly connected with the side face of the driving gear (6), a driving worm (13) is arranged above the worm wheel (9), the driving worm (13) is rotatably installed on the inner side of the movable frame (11), the movable frame (11) is slidably installed on the inner side of the fixed frame (10), and the fixed frame (10) is fixedly connected with the inner side wall of the connecting frame (5);
the electric push rod (12), electric push rod (12) set up between mount (10) and adjustable shelf (11), mount (10) and adjustable shelf (11) are fixed respectively to electric push rod's (12) upper and lower both ends.
2. The etching machine with the fine adjustment structure for the semiconductor processing according to claim 1, wherein: the middle part fixed through connection of drive gear (6) has drive shaft (7), the middle part of the one end of drive shaft (7) through bearing and link (5) is rotated and is connected, worm wheel (9) and drive shaft (7) are fixed to cup joint.
3. The etching machine with the fine adjustment structure for the semiconductor processing according to claim 2, wherein: the equal activity in both ends of drive worm (13) pivot has cup jointed axle sleeve (15), the tip fixed connection of axle sleeve (15) and adjustable shelf (11), the tip fixedly connected with limiting plate (16) of axle sleeve (15), one the surface mounting of limiting plate (16) has worm motor (14), and worm motor (14) drive worm (13) rotate.
4. The etching machine with the fine adjustment structure for the semiconductor processing according to claim 3, wherein: the both sides face of mount (10) all runs through and has seted up perpendicular groove (17), two axle sleeve (15) respectively with two perpendicular groove (17) activity through connection, axle sleeve (15) with erect groove (17) looks adaptation, limiting plate (16) and the surface laminating of mount (10).
5. The etching machine with the fine tuning structure for the semiconductor processing according to claim 4, wherein: the below of mounting panel (2) is provided with base (18), side fixing plate (3) and base (18) fixed connection, the upper surface middle part of base (18) is provided with workstation (19), and workstation (19) are located under sculpture end (1).
6. The etching machine with the fine tuning structure for the semiconductor processing according to claim 5, wherein: the tip fixedly connected with bar board (20) of mounting panel (2), the first connecting block of the equal fixedly connected with in both sides face upper end (21) of bar board (20), square cover (23) have all been fixed to the upper and lower both sides of link (5) and have been cup jointed, the equal fixedly connected with second connecting block (24) in both ends of square cover (23), four second connecting blocks (24) and four first connecting blocks (21) one-to-one.
7. The etching machine with the fine tuning structure for the semiconductor processing according to claim 6, wherein: the two ends of the surface of the second connecting block (24) are both provided with first insertion holes (25) in a penetrating mode, one side of the first connecting block (21) is provided with a Contraband type frame (26), and the end portion of the Contraband type frame (26) sequentially penetrates through the first connecting block (21), the limiting sliding groove (4) and the second connecting block (24) in a moving mode and extends to one side of the second connecting block (24).
8. The etcher with the fine tuning structure for semiconductor processing, according to claim 7, wherein: the middle part of Contraband type frame (26) is fixed and is provided with solid fixed ring (27), the middle part of first connecting block (21) is run through and is seted up first through-hole (28), the middle part of second connecting block (24) is run through and is seted up second through-hole (29), gu pass through tie bolt (30) fixed connection between fixed ring (27) and second connecting block (24).
9. The etcher with the fine tuning structure for semiconductor processing as claimed in claim 8, wherein: the middle outer side wall of the connecting frame (5) is fixedly connected with a driving motor (31), and one end of an output shaft of the driving motor (31) movably penetrates through the middle of the connecting frame (5) and is fixedly connected with the driving shaft (7).
10. An adjusting method of an etching machine for semiconductor processing based on a self-contained fine adjustment structure is characterized in that: the method specifically comprises the following steps:
step one, an external controller controls an electric push rod (12) to work and extend, and the electric push rod (12) drives a movable frame (11) and a driving worm (13) to vertically move downwards when extending until the driving worm (13) is contacted with and meshed with a worm wheel (9);
and step two, starting a worm motor (14), driving a driving worm (13) to rotate when the worm motor (14) works, driving the worm (13) to rotate, driving a worm wheel (9) to slowly rotate through meshing with the worm wheel (9), further driving a driving gear (6) to slowly rotate, rolling the driving gear (6) on the surface of a rack (8) through mutual meshing with the rack (8), and further driving a mounting plate (2) to slightly adjust the position along the length direction of the side fixing plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210866313.XA CN115295444A (en) | 2022-07-22 | 2022-07-22 | Semiconductor processing etching machine with fine adjustment structure and adjustment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210866313.XA CN115295444A (en) | 2022-07-22 | 2022-07-22 | Semiconductor processing etching machine with fine adjustment structure and adjustment method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115295444A true CN115295444A (en) | 2022-11-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210866313.XA Pending CN115295444A (en) | 2022-07-22 | 2022-07-22 | Semiconductor processing etching machine with fine adjustment structure and adjustment method |
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| CN (1) | CN115295444A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116021215A (en) * | 2023-02-22 | 2023-04-28 | 四川九华光子通信技术有限公司 | Clamp for welding SFP connector |
-
2022
- 2022-07-22 CN CN202210866313.XA patent/CN115295444A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116021215A (en) * | 2023-02-22 | 2023-04-28 | 四川九华光子通信技术有限公司 | Clamp for welding SFP connector |
| CN116021215B (en) * | 2023-02-22 | 2023-05-30 | 四川九华光子通信技术有限公司 | Clamp for welding SFP connector |
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