CN115294866A - Composite adhesive tape, shaping method thereof, display panel and display device - Google Patents
Composite adhesive tape, shaping method thereof, display panel and display device Download PDFInfo
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- CN115294866A CN115294866A CN202210916807.4A CN202210916807A CN115294866A CN 115294866 A CN115294866 A CN 115294866A CN 202210916807 A CN202210916807 A CN 202210916807A CN 115294866 A CN115294866 A CN 115294866A
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- layer
- composite tape
- display panel
- flexible display
- composite
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Links
- 239000002131 composite material Substances 0.000 title claims abstract description 92
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000007493 shaping process Methods 0.000 title abstract description 7
- 238000005452 bending Methods 0.000 claims abstract description 46
- 239000004033 plastic Substances 0.000 claims abstract description 27
- 229920003023 plastic Polymers 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims description 142
- 239000000956 alloy Substances 0.000 claims description 10
- 239000006260 foam Substances 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 239000006059 cover glass Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
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- 238000005538 encapsulation Methods 0.000 description 9
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- 229910052779 Neodymium Inorganic materials 0.000 description 2
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- 239000005357 flat glass Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YOZHUJDVYMRYDM-UHFFFAOYSA-N 4-(4-anilinophenyl)-3-naphthalen-1-yl-n-phenylaniline Chemical compound C=1C=C(C=2C(=CC(NC=3C=CC=CC=3)=CC=2)C=2C3=CC=CC=C3C=CC=2)C=CC=1NC1=CC=CC=C1 YOZHUJDVYMRYDM-UHFFFAOYSA-N 0.000 description 1
- MBPCKEZNJVJYTC-UHFFFAOYSA-N 4-[4-(n-phenylanilino)phenyl]aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N(C=2C=CC=CC=2)C=2C=CC=CC=2)C=C1 MBPCKEZNJVJYTC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- 238000007650 screen-printing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the invention discloses a composite adhesive tape, a shaping method thereof, a display panel and a display device. The composite adhesive tape comprises: the plastic deformation board, at least one side edge of plastic deformation board has the first kink of the pre-bending radian, and the pre-bending radian is corresponding with the bending radian of the second kink in the flexible display module, and the second kink can be fitted on the surface of the protruding one side of the first kink. According to the embodiment of the invention, the plastic deformation plate is pre-bent to form the shape corresponding to the bending radian of the flexible display module. The tight and solid fit of the composite adhesive tape is realized, and the problems of virtual fit or tilting of the composite adhesive tape and the like are avoided.
Description
Technical Field
The embodiment of the invention relates to a display panel technology, in particular to a composite adhesive tape, a shaping method of the composite adhesive tape, a display panel and a display device.
Background
With the development of the technology, the OLED technology is gradually mature. So that flexible OLED screens have gradually replaced LCD screens as common display devices for personal intelligent terminal devices. However, the flexible OLED display panel has low rigidity, and in order to enhance the capability of the screen to resist external deformation, a composite tape is often attached to the back surface of the flexible OLED display panel.
However, since the composite tape has a certain rigidity, after the composite tape is attached to the curved flexible OLED display panel, the composite tape cannot be tightly attached to the curved portion of the display panel, which causes problems such as false attachment of the composite tape.
Disclosure of Invention
The embodiment of the invention provides a composite adhesive tape, a shaping method thereof, a display panel and a display device, and aims to solve the problem of virtual sticking of the composite adhesive tape.
In a first aspect, an embodiment of the present invention provides a composite tape, including:
the flexible display module comprises a plastic deformation plate, wherein at least one side edge of the plastic deformation plate is provided with a first bending part with a pre-bending radian, the pre-bending radian is corresponding to the bending radian of a second bending part in the flexible display module, and the second bending part can be attached to the surface of one side, protruding, of the first bending part.
In a second aspect, an embodiment of the present invention further provides a method for shaping a composite tape, for manufacturing the composite tape, including:
placing the unformed composite adhesive tape in a female die;
stamping the unformed composite tape in the female die with a die to form the first bend.
In a third aspect, an embodiment of the present invention further provides a display panel, which includes a flexible display module and the composite tape.
In a fourth aspect, an embodiment of the present invention further provides a display device, including the above composite tape.
The composite adhesive tape comprises a plastic deformation plate, wherein at least one side edge of the plastic deformation plate is provided with a first bending part with a pre-bending radian, the pre-bending radian corresponds to the bending radian of a second bending part in the flexible display module, and the second bending part can be attached to the surface of one side of the protrusion of the first bending part. The plastic deformation plate is pre-bent to form a shape corresponding to the bending radian of the flexible display module. The tight and solid fit of the composite adhesive tape is realized, and the problems of virtual fit or tilting of the composite adhesive tape and the like are avoided.
Drawings
FIG. 1 is a schematic structural diagram of a planar composite tape compaction process provided in the related art;
FIG. 2 is a schematic structural view of a composite tape according to an embodiment of the present invention;
FIG. 3 is a schematic view of another composite tape according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a plastically deformable plate according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of another composite tape provided in the embodiments of the present invention;
FIG. 6 is a schematic structural view of another composite tape provided in the embodiments of the present invention;
FIG. 7 is a schematic structural view of another composite tape provided in accordance with an embodiment of the present invention;
fig. 8 is a schematic cross-sectional view illustrating a flexible display panel according to an embodiment of the present invention;
fig. 9 is a schematic view of a method for molding a composite tape according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. It should be noted that the terms "upper", "lower", "left", "right", and the like used in the description of the embodiments of the present invention are used in the angle shown in the drawings, and should not be construed as limiting the embodiments of the present invention. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly formed on "or" under "the other element or be indirectly formed on" or "under" the other element through intervening elements. The terms "first," "second," and the like, are used for descriptive purposes only and not for purposes of limitation, and do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The organic light-emitting diode (OLED) has the advantages of self-luminescence, wide working temperature range, fast response speed, wide viewing angle, high luminous efficiency, capability of being manufactured on a flexible substrate, low driving voltage and energy consumption and the like, and is well accepted by people in the industry. The organic light emitting diode may be disposed on a flexible substrate to form a flexible OLED display module. Because the flexible OLED display module can be bent, the flexible OLED display module can be made into a display panel with any bending shape. For example, one side edge of the flexible OLED display module can be bent toward the back of the display module to form a curved screen. In order to protect the flexible OLED display module, a planar composite tape (SCF) is usually attached to the back of the flexible OLED display module, and the planar composite tape generally has a structure of a copper foil layer, a foam layer and the like, and is used for protecting a screen body and shielding light. The foam mainly plays a role in light absorption and buffering, and the copper foil plays a role in supporting. Fig. 1 is a schematic structural diagram of a planar composite tape compaction process provided in the related art, and reference is made to fig. 1. In the related art, the flat composite tape 01 is usually attached to the back surface of the curved screen 02 by attaching the flat composite tape 01 thereto, and then the flat composite tape 01 is tightly bonded by compressing the flat composite tape 01 with the silica gel head 03. However, the planar composite tape 01 often has certain elasticity, and after a period of pressing, the adhesive force of the planar composite tape 01 is resisted by the elasticity of the planar composite tape 01 to cause degumming, so that the planar composite tape 01 is attached in a virtual manner.
Based on the above problems, embodiments of the present invention provide a composite tape. Fig. 2 is a schematic structural view of a composite tape according to an embodiment of the present invention, and fig. 2 is referred to. The composite tape 1 comprises:
the plastic deformation board 11, at least one side edge of plastic deformation board 11 has the first kink 111 of the pre-bending radian, the pre-bending radian is corresponding with the bending radian of the second kink 21 in the flexible display module 2, and the second kink 21 can be attached to the surface of one side of the first kink 111.
The plastic deformation plate 11 may be any material layer capable of performing plastic deformation in the composite tape 1, and the embodiment of the present invention does not limit the specific material of the plastic deformation plate 11. The plastically deformable plate 11 may comprise a metal layer or a support layer. The metal layer may include a copper foil layer or other metal film layer, and the support layer may include a Polyimide (PI) layer. Can be before the laminating with plastic deformation board 11 among the composite tape 1 buckle in advance to other retes attached form composite tape 1 on plastic deformation board 11 of buckling in advance, perhaps will buckle in advance including the whole sticky tape of plastic deformation board 11, in order to form first kink 111. Because the first bending part 111 of the composite tape 1 corresponds to the bending radian of the second bending part 21 of the flexible display module 2, the two parts can be tightly attached to avoid the virtual attachment problem.
Fig. 3 is a schematic structural view of another composite tape according to an embodiment of the present invention, referring to fig. 3. The composite tape 1 may include not only the metal layer 12 or the support layer 13, but also a protective layer 14 on the surface of the metal layer 12, which is far from the support layer 13, and the protective layer 14 may include an organic compound. The protective layer 14 can protect the metal layer 12 from being corroded and oxidized by substances in external environments such as water and the like, and the service life of the composite adhesive tape 1 is prolonged.
Fig. 4 is a schematic structural diagram of a plastically deformed plate according to an embodiment of the present invention, and refer to fig. 4. In other embodiments, the two opposite side edges of the plastically deformable plate 11 are provided with first bent portions 111.
When two opposite second bending portions 21 are disposed on two sides of the flexible display module 2, the first bending portion 111 with a bending radian and a bending position corresponding to the second bending portion 21 can be disposed on the plastic deformation plate 11. Make compound sticky tape 1 laminating flexible display module assembly 2's back, improve support and shading effect. Fig. 5 is a schematic structural view of another composite adhesive tape according to an embodiment of the present invention, referring to fig. 5. Optionally, the flexible display module can be a hyperboloid flexible display module, and can also be a three-curved-surface or four-curved-surface flexible display module. The bending radian and the bending position of the first bending part 111 on the plastic deformation plate 11 in the composite adhesive tape 1 can be set to correspond to the second bending part of the flexible display module.
In other embodiments, the plastically deformable plate 11 is made of an alloy material.
The alloy material may include an alloy formed of any two or more metals. Illustratively, the alloy material may include a copper alloy or an aluminum alloy. Because the alloy material often has better hardness than metal simple substance material, consequently choose alloy material for use and make plastic deformation board 11, can make plastic deformation board 11 have higher hardness to reinforcing composite tape 1 supports and the protection effect to flexible display module 2. Meanwhile, the copper alloy or the aluminum alloy has good heat dissipation performance. Therefore, the plastic deformation plate 11 is made of copper alloy or aluminum alloy, and the plastic deformation plate 11 has high hardness and good heat dissipation capability.
Fig. 6 is a schematic structural view of another composite tape according to an embodiment of the present invention, referring to fig. 6. In other embodiments, the composite tape 1 further includes a foam layer 15, and the foam layer 15 is attached to the concave side surface of the plastic deformation plate 11.
Wherein, the foam layer 15 is softer, and attached to the sunken one side of plastic deformation board 11 can avoid external force extrusion to cause plastic deformation board 11 to warp to promote the reliability of compound sticky tape 1.
Fig. 7 is a schematic structural view of another composite tape according to an embodiment of the present invention, referring to fig. 7. In other embodiments, an adhesive layer 16 is further included, and the adhesive layer 16 is attached to a side surface of the foam layer 15 away from the plastically deformable plate 11.
The composite adhesive tape 1 and the flexible display module 2 can be independent from each other and can also be bonded through viscose. The composite tape 1 can be adhered to other members by the adhesive layer 16, so that the composite tape 1 can be more easily fixed.
In other embodiments, the adhesive layer 16 includes an adhesive that is distributed in a grid pattern across the adhesive layer 16.
The viscose is distributed in a grid shape, so that the viscose can be saved, and unnecessary waste is avoided. The laminating face is avoided being formed with bubbles when the laminating more to do benefit to, leads to bonding insecure.
Fig. 8 is a schematic cross-sectional structure view of a flexible display panel according to an embodiment of the present invention, referring to fig. 8. The flexible display panel shown in fig. 8 can be used as a component of any flexible display module in the embodiments of the present invention, and an exemplary flexible display panel structure applicable to any embodiment of the present invention is described. The display panel includes a substrate 10; among other things, the substrate 10 may be flexible and thus stretchable, foldable, bendable, or rollable, so that the touch display panel may be stretchable, foldable, bendable, or rollable. The substrate 10 may be formed of any suitable insulating material having flexibility. The substrate 10 may serve to block oxygen and moisture, prevent moisture or impurities from diffusing through the substrate 10, and form a flat surface on the upper surface of the substrate 10. For example, it may be formed of a polymer material such as Polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP), and the substrate 10 may be transparent, translucent, or opaque. Alternatively, the display panel may further include a buffer layer (not shown in fig. 8) on the substrate 10, and the buffer layer may cover the entire upper surface of the substrate 10. The substrate 10 may also be rigid, for example a glass substrate, forming a rigid display panel.
A pixel circuit layer 20 on one side of the substrate 10; the pixel circuit layer 20 is located on the side of the substrate 10 facing the display surface or touch surface of the display panel. The pixel circuit layer 20 may include a plurality of Thin Film transistors 210 (TFTs) and a pixel circuit composed of the TFTs 210 for driving a light emitting element in the display layer. In this embodiment, a structure of a top gate thin film transistor will be described as an example. Thin-film-transistor layer 21 includes: an active layer 211 on the substrate 10; the active layer 211 may be an amorphous silicon material, a polysilicon material, a metal oxide material, or the like. When the active layer 211 is made of a polysilicon material, the active layer may be formed by a low temperature amorphous silicon technique, that is, the amorphous silicon material is melted by laser to form the polysilicon material. In one embodiment, optionally, the pixel circuit layer 21 includes a plurality of thin film transistors 210, and the thin film transistors 210 include low temperature polysilicon-based thin film transistors and metal oxide semiconductor-based thin film transistors. The oxide semiconductor can comprise Indium Gallium Zinc Oxide (IGZO), the IGZO has the characteristics of high transmittance, low electron mobility, large on-off ratio, low power consumption and the like compared with LTPS, and a pixel circuit formed by the two transistors has better performance. In addition, various methods such as a Rapid Thermal Annealing (RTA) method, a Solid Phase Crystallization (SPC) method, an Excimer Laser Annealing (ELA) method, a Metal Induced Crystallization (MIC) method, a Metal Induced Lateral Crystallization (MILC) method, or a Sequential Lateral Solidification (SLS) method may also be used. The active layer 211 further includes source and drain regions formed by doping N-type impurity ions or P-type impurity ions, and a channel region is formed between the source and drain regions. The pixel circuit layer 20 further includes a gate insulating layer 212 on the active layer 211; the gate insulating layer 212 includes an inorganic layer such as silicon oxide, silicon nitride, and may include a single layer or a plurality of layers. Thin-film-transistor layer 21 further includes a gate 213 located on gate insulating layer 212; the gate electrode 213 may include a single layer or a plurality of layers of gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminum (Al), molybdenum (MO), or chromium (Cr), or a material such as aluminum (Al): neodymium (Nd) alloy or Molybdenum (MO): the tungsten (W) alloy may be selected according to actual conditions. The pixel circuit layer 20 further includes an interlayer insulating layer 214 on the gate electrode 213; the interlayer insulating layer 214 may include an inorganic material or an organic material. The inorganic material may include at least one selected from silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride. The organic material may include at least one selected from acrylic resins, methacrylic resins, polyisoprene, vinyl resins, epoxy resins, urethane resins, cellulose resins, and perylene resins. Thin-film-transistor layer 21 also includes a source electrode 2151 and a drain electrode 2152 on interlayer insulating layer 214. The source and drain electrodes 2151 and 2152 are electrically connected to the source and drain regions, respectively, through contact holes, which may be formed by selectively removing the gate insulating layer 212 and the interlayer insulating layer 214.
The pixel circuit layer 20 may also include a passivation layer 22. Optionally, a passivation layer 22 is positioned on the source and drain electrodes 2151 and 2152 of the thin film transistor 210. The passivation layer 22 may be formed of an inorganic material such as silicon oxide or silicon nitride, or may be formed of an organic material. The display panel may further include a planarization layer 23. Optionally, a planarization layer 23 is located on the passivation layer 22. The planarization layer 23 may include an organic material such as acryl, polyimide (PI), or benzocyclobutene (BCB), and the planarization layer 23 has a planarization function.
And a display layer 30 positioned on a side of the pixel circuit layer 20 facing away from the substrate 10, the display layer 30 including a plurality of light emitting elements 31. Optionally, the display layer 30 is located on the planarization layer 23. The display layer 30 includes a first electrode layer 311, a light-emitting layer 312, and a second electrode layer 313 sequentially arranged in a direction away from the substrate 10. The first electrode layer 311 may be formed of various conductive materials. For example, the first electrode layer 311 may be an anode layer, and may be formed as a transparent electrode or a reflective electrode according to its use. When the anode is formed as a transparent electrode, indium Tin Oxide (ITO), indium Zinc Oxide (IZO), zinc oxide (ZnO), or indium oxide (In) may be included 2 O 3 ) Etc., when the anode is formed as the reflective electrode, the reflective layer may be formed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a mixture thereof, and ITO, IZO, znO, or In 2 O 3 Etc. may be formed on the reflective layer. The light emitting layer 312 may include a low molecular material or a high molecular material. When the light emitting layer 312 includes a low molecular material, the light emitting layer 312 may include an emission layer (EML), and may further include at least one of a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an Electron Transport Layer (ETL), and an Electron Injection Layer (EIL). The light emitting layer 312 may include various organic materials, for example, copper phthalocyanine (CuPc), N '-di (naphthalene-1-yl) -N, N' -diphenyl-benzidine (NPB), tris-8-hydroxyquinoline-aluminum (Alq 3), or the like. The light emitting layer 312 may be formed by vapor deposition.
When the light emitting layer 312 includes a high polymer material, the light emitting layer 312 may include an HTL and an EML. The HTL may include PEDOT, and the EML may include polyphenylene vinylene (PPV) based and polyfluorene based polymer materials. The light emitting layer 320 may be formed by screen printing, inkjet printing, laser Induced Thermal Imaging (LITI), or the like.
However, the light emitting layer 312 is not limited to the above example. The light emitting layer 312 may include a single layer across the plurality of first electrode layers 311 or a plurality of layers patterned with respect to each of the first electrode layers 311. The display layer 30 further includes a pixel defining layer 32 on a side of the first electrode layer 311 away from the pixel circuit layer 20. The pixel defining layer 32 may be formed of an organic material such as Polyimide (PI), polyamide, benzocyclobutene (BCB), acryl resin, or phenol resin, or an inorganic material such as SiNx. When the second electrode layer 313 (cathode layer) is formed as a transparent electrode, a compound having a small work function, such as lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/Ca), lithium fluoride/aluminum (LiF/Al), aluminum (Al), magnesium (Mg), or a combination thereof, may be initially deposited on the light emitting layer by evaporation, and a compound having a small work function, such as ITO, IZO, znO, or In 2 O 3 Etc. a transparent electrode-forming material may be deposited on the compound. When the cathode is formed as a reflective electrode, the cathode may be formed by evaporating Li, ca, liF/Al, mg or a mixture thereof on the entire surface of the substrate.
Optionally, the first electrode layer 311 includes a plurality of anode patterns corresponding to the pixels one to one, and the anode patterns in the first electrode layer 311 are connected to the source electrode 2151 or the drain electrode 2152 of the thin film transistor 210 through the via holes on the planarization layer 23. The pixel defining layer 32 includes a plurality of openings exposing the first electrode layer 311, and the pixel defining layer 32 may cover edges of the first electrode layer 311 pattern. The light emitting layer 312 at least partially fills the opening of the pixel defining layer 32 and contacts the first electrode layer 311.
Optionally, the first electrode layer 311, the light emitting layer 312, and the second electrode layer 313 defined by the opening of each pixel defining layer 32 constitute a light emitting element 31 (shown in a dashed line frame in fig. 8), each light emitting element 31 can emit light of different colors according to different light emitting layers 312, each light emitting element 31 constitutes a sub-pixel, and a plurality of sub-pixels collectively perform display of a picture.
Optionally, the display panel further includes an encapsulation layer 40 on the display layer 30 and completely covers the display layer 30 to seal the display layer 30. In order to planarize the display layer 30, a planarization layer 33 is further disposed above the display layer 30. Optionally, the encapsulation layer 40 may be a thin film encapsulation layer, and is located on the planarization layer 33, and includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer (a specific film layer of the encapsulation layer 40 is not shown in fig. 8) sequentially arranged in a direction away from the substrate 10, so as to prevent water and oxygen from corroding the light emitting element 31. Of course, in other alternative embodiments of the present invention, the encapsulation layer 40 may include any number of stacked organic and inorganic materials, but at least one layer of organic material and at least one layer of inorganic material are alternately deposited, and the lowermost layer and the uppermost layer are made of inorganic materials.
The display panel further includes a touch functional layer 50 located on the encapsulation layer 40, the touch functional layer 50 includes a plurality of touch electrodes, and a self-capacitance manner or a mutual capacitance manner may be adopted when implementing the touch function, the touch functional layer 50 may be provided with a single-layer touch electrode or a double-layer touch electrode, and may also be provided with a metal mesh-shaped touch electrode, the metal mesh-shaped touch electrode includes a plurality of metal wires extending along two mutually intersecting directions, the metal wires extending in different directions intersect to form a mesh, and the touch functional layer 50 may be selected according to actual conditions when implementing the touch function.
The display panel further includes a color resist layer 60, and the color resist layer 60 includes a plurality of color resists 61 corresponding to the light emitting elements 31. The display panel further includes a protective layer 70 on the color resist layer 60. Optionally, the protective layer 70 is a film layer on the outermost side of the display panel, and may be a protective cover or a protective film. The protective layer 70 may be adhered to a film layer inside an adjacent display panel by an Optically Clear Adhesive OCA (optical Clear Adhesive), and a surface of the protective layer 70 is an operation surface touched by the display panel. In other embodiments, the touch functional layer may also be located above the color resist layer to form a TPOC (TP on CF) structure, which may be designed according to actual situations during specific implementation.
Fig. 9 is a schematic view of a method for molding a composite tape according to an embodiment of the invention, referring to fig. 9. The embodiment of the invention also provides a method for shaping the composite adhesive tape, which is used for manufacturing any one of the composite adhesive tapes, and the method comprises the following steps:
s1: the unformed composite tape was placed in a female mold.
S2: the unformed composite tape in the female die is stamped with a die to form a first bend.
In order to form the first bent portion on the composite tape, a stamping and bending die capable of stamping the unformed composite tape to form the first bent portion can be manufactured. The female die in the stamping and bending die is provided with a structure with a radian corresponding to the first bending part of the composite adhesive tape. The unformed composite adhesive tape is formed in one step by a stamping mode, and the bending efficiency is high.
The embodiment of the invention also provides a display panel which comprises a flexible display module and any one of the composite tapes.
The display panel includes the composite tape provided in any of the embodiments described above, and therefore has the same beneficial effects as the composite tape described above, and reference may be made to the description of the embodiments of the composite tape for the same points, which are not repeated herein.
In other embodiments, the flexible display module comprises a cover glass and a flexible display panel, and the flexible display panel is attached to the surface of one concave side of the cover glass.
Because the cover plate glass is hard in texture, the flexible display panel is attached to the concave side of the cover plate glass, and the flexible display panel can be protected from being damaged by external force extrusion. The reliability of the flexible display module is improved.
In other embodiments, the flexible display panel comprises an OLED flexible display panel.
The flexible display panel has the advantages of high response speed, wide viewing angle, high luminous efficiency and the like, so that the flexible display panel has better performance by selecting the OLED flexible display panel.
The embodiment of the invention also provides a display device which comprises any one of the composite adhesive tapes in the embodiments.
The display device includes the composite tape provided in any of the embodiments, and thus has the same beneficial effects as the composite tape, and reference may be made to the description of the embodiments of the composite tape for the same points, which are not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone, and can also be any electronic product with a display function, including but not limited to the following categories: the touch screen display system comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the invention is not particularly limited in this respect.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (12)
1. A composite tape, comprising:
the flexible display module comprises a plastic deformation plate, wherein at least one side edge of the plastic deformation plate is provided with a first bending part with a pre-bending radian, the pre-bending radian is corresponding to the bending radian of a second bending part in the flexible display module, and the second bending part can be attached to the surface of one side, protruding, of the first bending part.
2. The composite tape according to claim 1, wherein the two opposite side edges of the plastically deformed sheet each have the first bent portion.
3. The composite tape of claim 1 wherein the plastically deformable plate is of an alloy material.
4. The composite tape of claim 3 wherein the alloy material comprises a copper alloy or an aluminum alloy.
5. The composite tape of claim 1, further comprising a foam layer attached to a side surface of the recess of the plastically deformable plate.
6. The composite tape of claim 5, further comprising an adhesive layer attached to a surface of the foam layer on a side away from the plastically deformable plate.
7. The composite tape of claim 6, wherein the adhesive layer comprises adhesive distributed in a grid pattern.
8. A method for molding a composite tape, for making the composite tape of claims 1-7, comprising:
placing the unformed composite adhesive tape in a female die;
stamping the unformed composite tape in the female die with a die to form the first bend.
9. A display panel comprising a flexible display module and the composite tape of any one of claims 1-7.
10. The display panel according to claim 9, wherein the flexible display module comprises a cover glass and a flexible display panel, and the flexible display panel is attached to a surface of one side of the concave portion of the cover glass.
11. The display panel of claim 10, wherein the flexible display panel comprises an OLED flexible display panel.
12. A display device comprising the composite tape according to any one of claims 1 to 7.
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