CN115289703A - Temperature control method - Google Patents

Temperature control method Download PDF

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Publication number
CN115289703A
CN115289703A CN202210724381.2A CN202210724381A CN115289703A CN 115289703 A CN115289703 A CN 115289703A CN 202210724381 A CN202210724381 A CN 202210724381A CN 115289703 A CN115289703 A CN 115289703A
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temperature
heat exchange
value
temperature control
circulating liquid
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CN115289703B (en
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刘紫阳
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Beijing Jingyi Automation Equipment Co Ltd
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Beijing Jingyi Automation Equipment Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B7/00Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices
    • F25B49/02Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

The invention relates to the technical field of heat exchange, and provides a temperature control method, which comprises the steps that the operating temperature based on a second circulating liquid loop is in a second set threshold value, and the second set threshold value is divided into a plurality of temperature sections according to set intervals; controlling the operating temperature to be at the minimum value in the current temperature section, controlling the second circulating liquid loop to load a set load, disconnecting the second heat exchange passage, and obtaining the refrigerant evaporation temperature at the inlet end of the second compressor; and controlling the target value of the evaporation temperature at the outlet end of the second heat exchange passage to be less than or equal to the evaporation temperature. According to the temperature control method provided by the invention, the cold energy in an air load state is stored by arranging the cold accumulator, so that the power consumption of the temperature control device is reduced, and the energy utilization rate is improved.

Description

Temperature control method
Technical Field
The invention relates to the technical field of heat exchange, in particular to a temperature control method.
Background
In the etching process in the semiconductor manufacturing field, the radio frequency device can generate a large amount of heat, and the wafer temperature change can influence the etching precision, so the temperature of a processing cavity needs to be accurately controlled in the wafer processing process, a temperature control device using a refrigerating system is generally adopted to continuously introduce a heat exchange medium into a processing platform, the generated heat is taken away in time, and the temperature control of the wafer processing environment is realized. In different processing steps of the etching process, the difference of the required processing environment temperature is large, and the next processing step can be carried out only after the heat exchange medium is adjusted to a new target temperature. In order to shorten the heating and cooling time of a heat exchange medium and improve the wafer processing efficiency, the latest temperature control device adopts a double-channel design, one channel provides a low-temperature medium, the other channel provides a high-temperature medium, when the processing cavity needs high temperature or low temperature, the channel with the corresponding temperature is selected to be communicated with the processing cavity, and the inlet and outlet pipelines of the other channel are in short circuit. The channel communicated with the processing cavity needs to take away heat in the processing cavity in time, the refrigerating system is in the working condition that the heat load continuously changes, the other channel has no external heat load and is in an empty load running state, and the refrigerating system only needs to output a small amount of cold energy to maintain the temperature of the circulating liquid to be constant.
In the related technology, the low-temperature channel temperature control of the double-channel temperature control device can reach-70 ℃ or lower, and a multi-stage cascade refrigeration system is generally used for reaching the target refrigeration temperature; the temperature of the high-temperature channel is controlled at about 10 ℃, and a single-stage refrigeration system is generally used for realizing the temperature control. Due to the low energy efficiency ratio of the cascade refrigeration system, the low-temperature channel is high in power consumption and low in energy efficiency. Meanwhile, in order to maintain stable temperature control during the empty load, the channel in the empty load state needs the compressor to operate in a partial unloading state, which also causes energy waste.
Disclosure of Invention
The invention provides a temperature control method, which is used for solving the defects of high power consumption and low energy efficiency of a refrigeration system in the prior art. According to the operating characteristics of the switching device, at any moment, one channel refrigeration system communicated with the processing cavity is in a working condition of thermal load change, and the other channel is in an empty load state. By arranging the cold accumulator, only a small part of cold energy is needed for maintaining the constant temperature control of the circulating system for the refrigerating system in an empty load state, the redundant cold energy is in a form of supercooling liquid in the cold accumulator, so that the cold energy is transferred into the refrigerating system with the low-temperature channel, the cold energy stored in the supercooled liquid of the cold accumulator is gradually released in the running process of the refrigerating system, the energy efficiency ratio of a refrigerating system loop where a heat absorption channel of the cold accumulator is located is improved, and the power consumption of the temperature control device is reduced. The high temperature channel stores redundant cold energy in the cold accumulator and transfers the redundant cold energy to the low temperature channel, and the energy utilization rate is improved.
The temperature control method provided by the embodiment of the invention is applied to a temperature control device, and the temperature control device comprises the following steps:
the first temperature control channel comprises a first circulating liquid loop and a first refrigeration system exchanging heat with the first circulating liquid loop;
the second temperature control channel comprises a second circulating liquid loop and a second refrigerating system exchanging heat with the second circulating liquid loop, and the second refrigerating system comprises a second compressor;
the switching device is connected with the first circulating liquid loop and the second circulating liquid loop, is suitable for switching the connection and disconnection of the first circulating liquid loop and the load device and is suitable for switching the connection and disconnection of the second circulating liquid loop and the load device;
the cold accumulator comprises a first heat exchange passage and a second heat exchange passage which exchanges heat with the first heat exchange passage, the first heat exchange passage is communicated with the first refrigeration system, the second heat exchange passage is communicated with the second refrigeration system, and the second compressor is positioned at the outlet end of the second heat exchange passage;
the temperature control method comprises the following steps:
based on the fact that the operating temperature of the second circulating liquid loop is at a second set threshold, the second set threshold is divided into a plurality of temperature sections according to set intervals;
controlling the operating temperature to be at the minimum value in the current temperature section, controlling the second circulating liquid loop to load a set load, disconnecting the second heat exchange passage, and obtaining the refrigerant evaporation temperature at the inlet end of the second compressor;
and controlling the target value of the outlet end evaporation temperature of the second heat exchange passage to be less than or equal to the evaporation temperature.
According to the temperature control method provided by the invention, in the step of obtaining the refrigerant evaporation temperature at the inlet end of the second compressor,
and acquiring a pressure value of the inlet end of the second compressor, wherein the evaporation temperature is the evaporation temperature of the refrigerant corresponding to the pressure value.
According to the temperature control method provided by the invention, the set load is a rated load of the second circulating liquid loop.
According to the temperature control method provided by the invention, in the step of controlling the second circulation liquid loop to load the set load,
and disconnecting the second circulating liquid loop and the switching device, controlling the second circulating liquid loop to be connected with the heater, and controlling the power of the heater so as to control the second circulating liquid loop to load the set load through the heater.
According to the temperature control method provided by the invention, the method further comprises the following steps:
acquiring a first temperature of an inlet end of the first heat exchange passage and a set temperature difference between the first heat exchange passage and the second heat exchange passage;
determining the target value, wherein the target value is the difference between the first temperature and the set temperature difference;
acquiring the superheat degree of the inlet end of the second compressor;
determining that the degree of superheat exceeds a first set threshold, and controlling the target value to increase or decrease.
According to the temperature control method provided by the invention, the step of determining that the superheat degree exceeds the first set threshold value and controlling the target value to increase or decrease comprises the following steps:
determining that the degree of superheat is greater than a first threshold, the first threshold being an upper limit of the first set threshold;
controlling the target value to rise by a first set value to obtain the superheat degree within a first preset time length;
if the superheat degrees in a first preset time length are all larger than the first threshold value, the step of controlling the target value to be increased by a first set value to obtain the superheat degrees in the first preset time length is executed in a circulating mode;
until the superheat degree of at least one time in the first preset time length is smaller than or equal to the first threshold value.
According to the temperature control method provided by the present invention, the step of determining that the degree of superheat exceeds a first set threshold value and controlling the target value to increase or decrease includes:
determining that the degree of superheat is less than a second threshold value, wherein the second threshold value is a lower limit of the first set threshold value;
controlling the target value to reduce a second set value, and acquiring the superheat degree within a second preset time length;
determining that the superheat degrees in a second preset time period are all smaller than the second threshold value, and circularly executing the step of controlling the target value to reduce a second set value to obtain the superheat degree in the second preset time period;
until the superheat degree of at least one time in the second preset time length is larger than or equal to the second threshold value.
According to the temperature control method provided by the invention, the method further comprises the following steps:
and adjusting the flow rate of the refrigerant in the second heat exchange passage by a PID algorithm based on the difference value between the evaporation temperature and the target value.
According to the temperature control method provided by the invention, the inlet end of the second compressor is provided with a pressure sensor.
According to the temperature control method provided by the invention, the first refrigeration system comprises a multi-stage refrigeration loop which exchanges heat in sequence, and the first heat exchange passage is connected between the condenser and the throttling element of one stage of the refrigeration loop.
According to the temperature control method provided by the invention, the target value Tesv is controlled to be less than or equal to the upper limit value, namely, the target value Tesv is adjusted on the premise that the target value Tesv is less than or equal to the upper limit value, so that the efficiency, the cold accumulation amount and the running stability of the circulating system of the refrigerating system are optimized, the cold energy in the second refrigerating system is fully utilized, the structure is simple, the utilization rate of the cold energy is high, and the power consumption of the temperature control device is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of a temperature control device according to the present invention;
fig. 2 is a schematic structural diagram of another temperature control device provided by the invention.
Wherein FIG. 1 illustrates a first refrigeration system comprising a two-stage refrigeration circuit with a first heat exchanger in communication with the first stage refrigeration circuit; FIG. 2 illustrates a first refrigeration system including a two-stage refrigeration circuit with a first heat exchanger in communication with a second stage refrigeration circuit;
FIG. 3 is a schematic flow chart of a temperature control method according to the present invention;
FIG. 4 is a second schematic flow chart of the temperature control method provided by the present invention
FIG. 5 is a third schematic flow chart of the temperature control method of the present invention
FIG. 6 is a fourth schematic flow chart of the temperature control method provided by the present invention;
FIG. 7 is a fifth flowchart illustrating a temperature control method according to the present invention;
FIG. 8 is a sixth schematic flow chart of the temperature control method provided by the present invention;
fig. 9 is a seventh schematic flow chart of the temperature control method provided by the present invention.
Reference numerals:
1. a first compressor; 2. a first condenser; 3. a first orifice member; 4. a condensing evaporator; 5. a first temperature sensor; 6. a third compressor; 7. a third throttling element; 8. a first evaporator; 9. a first water tank; 10. a first circulation pump; 11. a second temperature sensor; 12. a switching device; 13. a first heat exchanger; 14. a second compressor; 15. a second condenser; 16. a second orifice member; 17. a second evaporator; 18. a second water tank; 19. a second circulation pump; 20. a third temperature sensor; 21. a fourth orifice; 22. a pressure regulating valve; 23. a fourth temperature sensor; 24. a first pressure sensor; 25. a second pressure sensor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
In addition, in the description of the present invention, "a plurality", and "a plurality" mean two or more unless otherwise specified.
Before describing embodiments of the present invention, an energy efficiency ratio in a refrigeration system will be described. Definition of energy efficiency ratio of refrigeration system: the higher the energy efficiency ratio, the more energy efficient. Assuming that the energy efficiency ratio of the single-stage refrigeration cycle is 2, that is, the compressor power of the refrigeration system of the high-temperature path is 1kw, the refrigerating capacity in the evaporator of the refrigeration system is 2kw.
The same applies to a cascade of single refrigeration circuits, if the capacity of the first evaporator 8 is 2kw, the third compressor 6 requires 1kw of power; the cooling capacity of the condenser-evaporator 4 now needs to be the sum of the third compressor 6 plus the first evaporator 8, i.e. 3kw, so the first compressor 1 power needs to be 1.5kw. In the low-temperature channel, the refrigerating capacity of the entering circulating liquid is 2kw, but the total compressor power is 1.5+1=2.5kw, so the energy efficiency ratio of the cascade refrigeration system is 2/2.5=0.8, and the energy efficiency ratio is much lower than that of a single-stage refrigeration system.
An embodiment of the present invention, as shown in fig. 1 and 2, provides a temperature control device, including: a first temperature control channel, a second temperature control channel, a switching device 12 and a first heat exchanger 13.
In this embodiment and the following embodiments, the first temperature control channel is taken as a low temperature channel, and the second temperature control channel is taken as a high temperature channel for explanation, where the difference between the low temperature channel and the high temperature channel is that the lowest temperature range that can be reached by the low temperature channel is lower than the lowest temperature range that can be reached by the high temperature channel, for example, the lowest temperature that can be reached by the low temperature channel may be-70 ℃, the lowest temperature that can be reached by the high temperature channel may be-10 ℃, and the highest temperature that can be reached by the high temperature channel may be 90 ℃.
The first temperature control channel comprises a first circulating liquid loop and a first refrigerating system exchanging heat with the first circulating liquid loop, and the second temperature control channel comprises a second circulating liquid loop and a second refrigerating system exchanging heat with the second circulating liquid loop; the switching device 12 is connected with the first circulating liquid loop and the second circulating liquid loop, the switching device 12 is suitable for switching the on-off of the first circulating liquid loop and the load device, and the switching device 12 is suitable for switching the on-off of the second circulating liquid loop and the load device.
The first temperature control channel and the second temperature control channel are matched with the switching device 12, when the load equipment needs to supply low-temperature circulating liquid, the switching device 12 controls the first circulating liquid loop to be communicated with the load device and form a circulating loop, and at the moment, the load device controls the second circulating liquid loop to be in short circuit (the second circulating liquid loop forms the circulating loop); similarly, when the load equipment needs to supply high-temperature circulating liquid, the switching device 12 controls the second circulating liquid circuit to communicate with the load device and form a circulating circuit, and at this time, the load device controls the first circulating liquid circuit to be short-circuited (the first circulating liquid circuit forms a circulating circuit). That is, at any one time, there is only one circulation liquid circuit in communication with the load device, a thermal load change occurs, and the other passage is inevitably in an empty load state.
In some cases, the first temperature controlled passage includes a first circulating liquid loop and a first refrigeration system in heat exchange relationship with the first circulating liquid loop, the first refrigeration system including a multi-stage refrigeration loop in sequential heat exchange relationship. The first refrigeration system provides cold energy for the first circulation liquid loop to cool the circulation liquid, and comprises a multi-stage refrigeration loop which sequentially exchanges heat and combines different refrigerants to lower the evaporation temperature step by step, namely, the lowest temperature which can be reached by the first refrigeration system is lowered step by step, so that the evaporation temperature provided by the refrigerant of the last stage refrigeration loop meets the heat exchange requirement of the circulation liquid in the first circulation liquid loop. The mode of meeting the refrigeration demand through heat transfer step by step, the temperature that can reach is lower, has widened the refrigeration warm area for the temperature that can be reached of first control by temperature change passageway is lower.
The first refrigeration system uses a cascade system, the refrigeration capacity is reduced step by step based on the cascade system, and the upper stage refrigeration capacity = the lower stage refrigeration capacity + the heating value of the lower stage compressor. The energy efficiency ratio of the system decreases as the number of stages of the cascade system increases. The primary application of a cascade system is to use different types of refrigerants to achieve lower temperature requirements in situations where a single refrigerant cannot meet the requirements.
The first temperature control channel adopts a cascade system, and the main reason is that in practical application, the set temperature of the circulating liquid of the first circulating liquid loop is low, so that the circulating liquid cannot be realized by using a single refrigerant, and only a multi-stage cascade system can be used. Several stages are used depending on the temperature, typically-40 ℃ to-80 ℃, two stages of stacking are used, and if below-80 ℃ three stages of stacking are used, it is also possible to use four stages of stacking.
The temperature control device of this embodiment sets up multistage refrigerating circuit among the first refrigerating system, can reduce the capacity of compressor among the first refrigerating system, has reduced temperature control device's whole consumption, and then reduces temperature control device's cost.
Of course, the first refrigeration system includes a multi-stage refrigeration loop, the first heat exchanger 13 includes a first heat exchange path and a second heat exchange path that exchange heat with each other, the first heat exchange path is communicated with one of the stages of the refrigeration loop of the first refrigeration system, and the second heat exchange path is communicated with the second refrigeration system.
The first refrigeration system is communicated with the second refrigeration system through the first heat exchanger 13, and the first heat exchanger 13 can shunt a part of refrigerant in the second refrigeration system. When the system adopts a fixed-frequency compressor, the gas transmission quantity of the compressor is fixed, and when the heat exchange quantity demand of the second evaporator 17 is not high, namely the flow of the refrigerant in the second evaporator 17 is small, the redundant refrigerant flow absorbs heat in the second heat exchange passage of the first heat exchanger 13 through the refrigerant in the second refrigeration system, the suction pressure of the second compressor 14 can also be improved, and the power consumption of the second compressor 14 is reduced.
Of course, when the first refrigeration system is provided with a single-stage refrigeration loop, the first heat exchanger 13 may still be provided, that is, the first heat exchange path of the first heat exchanger 13 is communicated with the refrigeration loop of the first refrigeration system, and the second heat exchange path is communicated with the second refrigeration system.
In some embodiments, referring to fig. 1 and 2, the first heat exchanger 13 is a cold accumulator, the first heat exchange path is a cold accumulation path, and the second heat exchange path is a heat absorption path. The cold accumulator is used for supercooling the refrigerant in the refrigeration loop connected with the cold accumulator, and the refrigeration capacity of the refrigeration loop can be improved after supercooling, so that the refrigeration capacity of the first refrigeration system is improved.
When first refrigerating system sets up multistage refrigerating circuit, every grade of refrigerating circuit all can carry out the heat transfer (not shown in the figure) through first heat exchanger and second refrigerating system, and is exactly, first heat exchanger sets up a plurality ofly, and second refrigerating system communicates with the second heat transfer route of a plurality of first heat exchangers, and every grade of refrigerating circuit of first refrigerating system all communicates with the first heat transfer route of a first heat exchanger.
Referring to fig. 1 and 2, the first refrigeration system is illustrated as including a two-stage refrigeration circuit, which may be referred to as a first stage refrigeration circuit and a second stage refrigeration circuit. The first-stage refrigeration loop comprises a first condenser 2, a first throttling element 3, a condensation evaporator 4 and a first compressor 1 which are connected to form a circulation loop, and the second-stage refrigeration loop comprises a third compressor 6, a condensation evaporator 4, a third throttling element 7 and a first evaporator 8 which are connected to form a circulation loop. The first stage refrigeration circuit may be understood as a high temperature stage refrigeration circuit and the second stage refrigeration circuit may be understood as a low temperature stage refrigeration circuit.
The first-stage refrigeration loop and the second-stage refrigeration loop are suitable for heat exchange, the second-stage refrigeration loop and the first circulating liquid loop are suitable for heat exchange, the first heat exchange passage is communicated with the first-stage refrigeration loop or the second-stage refrigeration loop, and the first heat exchanger 13 can be flexibly arranged.
As shown in fig. 1, a first heat exchange path of the first heat exchanger 13 is connected between the first condenser 2 and the first throttling element 3, the first heat exchange path overcools a refrigerant of the first-stage refrigeration circuit (which can be understood as a high-temperature-stage refrigeration circuit), and after the refrigerant is overcooled, the refrigeration capacity of the high-temperature-stage refrigeration circuit is improved, so that the total refrigeration capacity of the first refrigeration system is improved.
As shown in fig. 2, a first heat exchange path of the first heat exchanger 13 is connected between the condensing evaporator 4 and the third throttling element 7, and the first heat exchange path performs liquid supercooling on a refrigerant of the second-stage refrigeration circuit (which can be understood as a low-temperature-stage refrigeration circuit), so as to improve the refrigeration capacity of the low-temperature-stage refrigeration circuit, and further improve the total refrigeration capacity of the first refrigeration system.
As shown in fig. 1 and 2, the first heat exchanger 13 is a tank heat exchanger, the tank heat exchanger includes a casing and a heat exchange pipe disposed in the casing, the first heat exchange path is a space between the casing and the heat exchange pipe, and the second heat exchange path is a space in the heat exchange pipe. The tank type heat exchanger has simple structure and good cold accumulation effect.
The redundant refrigerating capacity in the second refrigerating system is used for additionally supercooling the refrigerant liquid in the first refrigerating system in the tank body through the tank type heat exchanger, and the refrigerating capacity of the refrigerating circuit is improved after the liquid is supercooled, namely the total refrigerating capacity of the first refrigerating system is improved.
In some embodiments, the heat exchange tube is a spiral coil, the heat exchange area of the spiral coil is larger, and the heat exchange effect is better.
In some embodiments, referring to fig. 1 and 2, the second refrigeration system includes a second compressor 14, a second condenser 15, a second throttling member 16 and a second evaporator 17 which are communicated as a circulation loop, a fourth throttling member 21 is provided between an outlet end of the second condenser 15 and an inlet end of the second heat exchange passage, and an outlet end of the second heat exchange passage is located at an inlet end of the second compressor 14. The second heat exchange path plays a role in evaporating and absorbing heat in the second refrigeration system, and then supercooling the refrigerant in the first refrigeration system.
In some embodiments, referring to fig. 2, the outlet end of the second evaporator 17 is provided with a pressure regulating valve 22. The pressure at the outlet end of the second evaporator 17 is kept constant by providing the pressure regulating valve 22.
Referring to fig. 1, the pressure regulating valve 22 is not disposed at the outlet end of the second evaporator 17, and during the operation of the temperature control device, the steam pressure at the outlet end of the second evaporator 17 and the steam pressure at the outlet end of the second heat exchange path are within a preset range, that is, the lowest temperature that can be reached by the condenser evaporator 4 and the second evaporator 17 is within a preset temperature range, the steam pressure at the outlet end of the second evaporator 17 may not be regulated.
The outlet end of the second evaporator 17 shown in fig. 1 may be provided with a pressure regulating valve 22. When the operation of the first-stage refrigeration circuit shown in fig. 1 is adjusted, the pressure regulating valve 22 can ensure stable operation of the second compressor 14.
In some embodiments, referring to fig. 1, the first heat exchange path is in communication with the first stage refrigeration circuit, and a second pressure sensor 25 is disposed between the second compressor 14 and the second evaporator 17 of the second refrigeration system. The second pressure sensor 25 is used to detect the pressure at the inlet end of the second compressor 14.
Based on the difference between the measured value and the target value of the second pressure sensor 25, a PID (proportional integral derivative) algorithm is called to adjust the opening degree of the fourth throttle 21 to control the heat exchange amount in the first heat exchanger 13.
In some embodiments, and as shown with reference to fig. 2, the first heat exchange path is in communication with the second stage refrigeration circuit, and the outlet end of the second heat exchange path is provided with a first pressure sensor 24. The first pressure sensor 24 is used to detect the pressure at the inlet end of the second compressor 14.
Based on the difference between the measured value and the target value of the first pressure sensor 24, a PID (proportional integral derivative) algorithm is invoked to adjust the opening degree of the fourth throttle 21, thereby controlling the amount of heat exchange in the first heat exchanger 13.
As shown in fig. 2, the first pressure sensor 24 cooperates with the pressure regulating valve 22 to make the steam pressure at the inlet end of the second compressor 14 meet the operating condition requirements.
In some embodiments, the first heat exchange path is located before an inlet of a restriction of the refrigeration circuit. Referring to fig. 1 and 2, a first heat exchange path is connected in series with a first condenser 2, and refrigerant is supercooled by two-stage heat exchange.
In some embodiments, as shown in fig. 2, the inlet end of the first heat exchange path is provided with a first temperature sensor 5 to detect the temperature of the refrigerant flowing into the first heat exchange path, that is, the temperature of the refrigerant before being subcooled, so as to adjust the cooling capacity supplied by the second heat exchange path according to the temperature to ensure the subcooling effect.
Referring to fig. 1 and 2, the inlet end of the second compressor 14 is provided with a fourth temperature sensor 23.
Referring to fig. 1 and 2, the first circulating liquid loop includes a first water tank 9, a first circulating pump 10 and a second temperature sensor 11, the circulating liquid in the first water tank 9 flows to the switching device 12 under the action of the first circulating pump 10, the circulating liquid in the first water tank 9 is adapted to flow into the first evaporator 8 and exchange heat with the refrigerant in the first evaporator 8, the first circulating pump 10 can be disposed upstream or downstream of the first evaporator 8, and can be selected according to requirements, and the second temperature sensor 11 is disposed at the inlet end of the switching device 12.
Of course, the first circulating liquid circuit may also be provided with a first heater provided between the outlet end of the first evaporator 8 and the inlet end of the switching device 12 to make a precise adjustment of the temperature of the circulating liquid in the first circulating liquid circuit.
The second circulation liquid loop comprises a second water tank 18, a second circulation pump 19 and a third temperature sensor 20, the circulation liquid in the second water tank 18 flows to the switching device 12 under the action of the second circulation pump 19, the circulation liquid in the second water tank 18 is suitable for flowing into the second evaporator 17 and exchanging heat with the refrigerant in the second evaporator 17, the second circulation pump 19 can be arranged at the upstream or downstream of the second evaporator 17, and the third temperature sensor 20 can be arranged at the inlet end of the switching device 12 according to requirements.
Of course, the second circulation liquid circuit may also be provided with a second heater provided between the outlet end of the second evaporator 17 and the inlet end of the switching device 12 to make a precise adjustment of the temperature of the circulation liquid in the second circulation liquid circuit.
The first throttle 3, the second throttle 16 and the third throttle 7 may be thermal expansion valves or electronic expansion valves.
Based on the temperature control device, with reference to fig. 1 to 4, a temperature control method is provided, which includes:
step 110, acquiring a first temperature at an inlet end of a first heat exchange passage and a set temperature difference between the first heat exchange passage and a second heat exchange passage;
referring to fig. 2, the first temperature may be a measured value T1 of the first temperature sensor 5, and the set temperature difference between the first heat exchange path and the second heat exchange path may be a set value in the system, such as 10 ℃, 15 ℃, 20 ℃. The first heat exchange passage and the second heat exchange passage have a temperature difference so that heat exchange is performed between the first heat exchange passage and the second heat exchange passage.
Step 120, determining a target value Tesv of the outlet end evaporation temperature of the second heat exchange passage, wherein the target value Tesv is the difference between the first temperature and the set temperature difference;
the target value Tesv is determined according to the first temperature T1 so as to ensure the heat exchange temperature difference between the first heat exchange path and the second heat exchange path and ensure the heat exchange efficiency of the first heat exchange path and the second heat exchange path, thereby improving the cold accumulation of the first heat exchanger.
Step 130, obtaining the superheat SH of the inlet end of a second compressor, wherein the second compressor is positioned at the outlet end of the second heat exchange passage;
the refrigerant in the second heat exchange path flows to the second compressor, and the refrigerant in the second heat exchange path affects the superheat degree of the inlet end of the second compressor.
The superheat SH is the superheated steam temperature minus the saturation temperature at the corresponding pressure.
The measured value of the first pressure sensor 24 or the second pressure sensor 25 is collected, and the measured value is the corresponding pressure, and the evaporating temperature corresponding to the pressure is calculated according to the characteristics of the refrigerant type of the second refrigeration system. The measurement value of the fourth temperature sensor 23 is collected, and this measurement value is the superheated steam temperature. Based on the two measured values, the degree of superheat SH can be calculated.
In step 140, it is determined that the degree of superheat SH exceeds the first set threshold, and the control target value Tesv is increased or decreased.
The first set threshold is a range of values, such as 8 ℃ to 15 ℃, the superheat SH exceeding the first set threshold is divided into an upper limit (15 ℃) where the superheat is greater than the first set threshold, and a lower limit (8 ℃) where the superheat SH is less than the first set threshold. When the superheat SH is larger than the upper limit of a first set threshold value, controlling the target value Tesv to rise, so that the temperature difference between the first heat exchange passage and the second heat exchange passage is increased, and the heat exchange efficiency between the first heat exchange passage and the second heat exchange passage is improved; when the degree of superheat SH is less than the lower limit of the first set threshold, the control target value Tesv decreases.
Taking the structure shown in fig. 1 and 2 as an example, when the heat exchange amount between the second heat exchange path and the first heat exchange path is constant, when the refrigerant flow rate in the second heat exchange path is small, the superheat SH of the inlet end of the second compressor is large, and when the refrigerant flow rate in the second heat exchange path is large, the superheat SH of the inlet end of the second compressor is small.
The superheat degree SH can be used to characterize whether the heat exchange of the refrigerant is sufficient. The target value Tesv of the evaporation temperature at the inlet end of the second compressor is adjusted by the superheat SH, so that the heat exchange efficiency and the cold accumulation amount can be ensured.
The above process is exemplified by: assuming that the target value of the evaporation temperature of the second heat exchange channel Tesv at this moment is-20 ℃, when the load of the first refrigeration system is high, the liquid in the first heat exchange channel can be cooled to-10 ℃. When the load of the first refrigerating system is reduced, the liquid in the first heat exchange channel is cooled to-15 ℃, because the temperature difference between two sides of the first heat exchanger is too small, heat exchange cannot be continued, and redundant cold energy in the second refrigerating system cannot be stored in the first heat exchange channel continuously. At the moment, the target value Tesv of the evaporation temperature needs to be reduced, and if the target value Tesv is reduced to-25 ℃, the heat exchange temperature difference between the first heat exchange channel and the second heat exchange channel is increased, so that the liquid in the first heat exchange channel can be continuously reduced to-20 ℃, namely, the cold accumulation amount is increased.
However, since the efficiency of the second refrigeration system decreases with a decrease in the target evaporation temperature Tesv, which leads to a decrease in the cold storage rate, it is necessary to increase the target evaporation temperature Tesv to increase the cold storage rate when the load demand of the first refrigeration system increases.
On the basis of the above-described temperature control method, that is, in step 140, that is, in the step of determining that the superheat SH exceeds the first set threshold, the step of increasing or decreasing the control target value Tesv includes:
step 141, determining that the degree of superheat SH is greater than a first threshold, where the first threshold is an upper limit of a first set threshold;
if the first threshold is 15 ℃, but not limited to 15 ℃, the first threshold can be specifically set according to actual needs.
Step 142, controlling the target value Tesv to increase the first set value to obtain the superheat SH within a first preset time length;
the first set value may be 1 ℃, 2 ℃, etc., and may be specifically set as needed.
The first preset time period may be 10 seconds, 20 seconds, 30 seconds, and the like, and may be specifically set as required.
The control target value Tesv is increased by the first set value in order to decrease the superheat SH.
Step 143, determining that the degrees of superheat SH are all larger than a first threshold value, circularly executing the step that the control target value Tesv is increased by a first set value to obtain the degrees of superheat SH within a first preset time length;
and the control target value Tesv is increased once by a first set value, the superheat degree SH obtained in the first preset time length is all larger than the first threshold value, the control target value Tesv is increased again by the first set value, the superheat degree SH obtained in the first preset time length is confirmed to be larger than the first threshold value, the control target value Tesv is increased by the first set value in a circulating mode, and the superheat degree in the first preset time length is obtained, so that the superheat degree SH is reduced to be within the range of the first set threshold value.
And step 144, until the superheat SH in the first preset time period is less than or equal to the first threshold.
In the step of controlling the target value Tesv to increase by the first set value and acquiring the superheat degree in the first preset time period, if at least one superheat degree SH in the first preset time period is less than or equal to the first threshold value, the above cycle is stopped, i.e., the target value Tesv does not need to be increased again, and one adjustment of the target value Tesv is completed.
It should be noted that, if at least one superheat SH in the first preset time period is less than or equal to the first threshold, it may be indicated that the superheat SH fluctuates around the first threshold, that is, the superheat SH approaches the first set threshold, and the specific value of the superheat SH is not strictly limited.
In a different embodiment from the above-mentioned steps 141 to 144, the step 140, namely, the step of determining that the degree of superheat SH exceeds the first set threshold and the control target value Tesv is increased or decreased, further includes:
step 145, determining that the degree of superheat SH is smaller than a second threshold value, wherein the second threshold value is the lower limit of the first set threshold value;
if the first threshold is 8 ℃, but not limited to 8 ℃, the first threshold can be set according to actual needs.
Step 146, controlling the target value Tesv to reduce the second set value, and obtaining the superheat SH within a second preset time length;
the second set value can be the same as or different from the first set value, for example, the second set value is 1 ℃ and 2 ℃, and can be specifically selected according to requirements.
The second preset time period may be the same as or different from the first preset time period, such as 10 seconds, 20 seconds or 30 seconds, and may be selected according to the requirement.
Step 147, determining that the degrees of superheat SH are all smaller than the second threshold value, circularly executing the step of reducing the control target value Tesv to a second set value to obtain the degree of superheat SH within a second preset time period,
and the control target value Tesv is reduced by the second set value once, the superheat degree SH obtained in the second preset time period is all smaller than the second set value, the control target value Tesv is controlled to reduce the second set value again, the superheat degree SH obtained in the second preset time period is confirmed to be smaller than the second set value again, the control target value Tesv is circulated to reduce the second set value, and the superheat degree in the second preset time period is obtained, so that the superheat degree SH is increased to be within the range of the first set threshold value.
And 148, until the superheat SH within the second preset time period is larger than or equal to a second threshold value.
In the step of controlling the target value Tesv to decrease the second set value and acquiring the degree of superheat within the second preset duration, if at least one degree of superheat SH within the second preset duration is greater than or equal to the second threshold, the above-mentioned cycle is stopped, i.e., the target value Tesv does not need to be decreased again, and the adjustment of the target value Tesv is completed once.
It should be noted that, if at least one superheat SH in the second preset time period is greater than or equal to the second threshold, it may be indicated that the superheat SH fluctuates around the second threshold, that is, the superheat SH approaches the first set threshold, and the specific value of the superheat SH is not strictly limited.
Steps 141 to 144 are parallel to steps 145 to 148, and one of them is selected and executed in accordance with actual circumstances, and is not executed in the order of step numbers. As shown in fig. 4, an embodiment of the temperature control method includes: and calculating to obtain a target value Tesv of the outlet end evaporation temperature of the second heat exchange passage according to the inlet end temperature value T1 of the first heat exchange passage, and adjusting the target value Tesv according to the superheat SH of the inlet end of the second compressor 14.
The measured value of the first temperature sensor 5 is acquired as T1, the set temperature difference between the first heat exchange passage and the second heat exchange passage is 15 ℃, and the target value Tesv = T1-15 of the evaporation temperature at the outlet end of the second heat exchange passage is obtained through calculation.
Setting a proper range of the superheat degree SH, for example, setting a first set threshold value to be 8-15 ℃, when the superheat degree SH is higher than 15 ℃, setting a first preset time length to be 30 seconds, increasing the target value Tesv value by 1 ℃ every 30 seconds, and stopping adjustment until at least one time of the superheat degree SH acquired within 30 seconds is not higher than 15 ℃; and when the superheat SH is less than 8 ℃, the second preset time is 30 seconds, the target Tesv value is reduced by 1 ℃ every 30 seconds, and the adjustment is stopped until at least one time of the superheat SH acquired within 30 seconds is not less than 8 ℃.
As shown in fig. 5, the temperature control method further includes:
step 210, determining an upper limit value of a target value Tesv based on the operating temperature of the second circulating system;
in step 220, the control target value Tesv is less than or equal to the upper limit value.
An upper limit value of the target value is determined based on the operating temperature of the second circulation system, and the target value is controlled to be equal to or less than the upper limit value.
The operating temperature of the second circulation system may be in a temperature range, for example, the operating temperature of the second circulation system is 10 ℃ to 90 ℃, and the current temperature range is 20 ℃ to 30 ℃.
During the operation of the second circulation system in the current temperature range, the evaporation temperature Teh of the refrigerant corresponding to the pressure value at the inlet end of the second compressor can be used as the upper limit value of the target value Tesv, and the target value Tesv is controlled to be less than or equal to the upper limit value.
In other temperature control methods for adjusting the target value Tesv, the target value Tesv can be ensured to be smaller than or equal to the upper limit value, namely, the target value Tesv is adjusted by other methods on the premise that the target value Tesv is smaller than or equal to the upper limit value, so as to optimize the efficiency, the cold accumulation amount and the operation stability of the circulating system of the refrigerating system.
The temperature control method can be applied to a temperature control device without a pressure regulating valve.
On the basis of the above-described embodiment, referring to fig. 6, in step 210, that is, in the step of determining the upper limit value of the target value based on the operating temperature of the second circulation system,
step 410, based on that the temperature range of the second circulation liquid loop is in a second set threshold, dividing the second set threshold into a plurality of temperature sections according to a set interval;
for example, the second threshold is set to 10 ℃ to 90 ℃ and the interval is set to 10 ℃, the second threshold is divided into 8 sections every 10 ℃, and the current temperature section is 20 ℃ to 30 ℃.
Step 420, controlling the operation temperature to be the minimum value in the current temperature section, disconnecting the second heat exchange passage, and obtaining the evaporation temperature Teh of the refrigerant at the inlet end of the second compressor;
in step 430, the evaporation temperature Teh is determined as the upper limit value of the target value.
The evaporation temperature of the refrigerant at the inlet end of the second compressor can be obtained by obtaining the pressure value at the inlet end of the second compressor, and obtaining the evaporation temperature of the refrigerant at the pressure value based on the pressure value and the type of the refrigerant. Of course, the evaporation temperature of the refrigerant may be obtained by other methods.
And controlling the operating temperature of the second circulating system to be at the minimum value of 20-30 ℃, namely, the operating temperature to be at 20 ℃, controlling the second heat exchange passage to be disconnected, stopping cold accumulation, acquiring the pressure value of the inlet end of the second compressor at the moment, acquiring the evaporation temperature Teh of the refrigerant corresponding to the pressure value according to the pressure value, and taking the evaporation temperature Teh as the upper limit value of the target value Tesv. As shown in fig. 7, the system to which the pressure regulating valve 22 is not provided, which is applied to the system shown in fig. 1, includes: and setting an upper limit value of a target value Tesv of the evaporation temperature at the outlet end of the second heat exchange passage according to the operating temperature of the second circulating liquid loop.
The operation range of the outlet temperature of the second circulation liquid loop is divided into a plurality of sections, the second circulation liquid loop operates at the lowest temperature in each section, the fourth throttling element 21 is closed so that the second circulation liquid loop stably operates at the maximum rated load, the measurement value of the second pressure sensor 25 at the moment is recorded, and the evaporation temperature Teh of the refrigerant obtained through conversion is obtained according to the measurement value of the second pressure sensor 25 and the type of the refrigerant, and is the upper limit value of the target value Tesv of the outlet end evaporation temperature of the second heat exchange passage corresponding to the temperature section. In the adjustment of the target value Tesv by other temperature control methods, it is necessary to secure the target value Tesv < = the evaporation temperature Teh of the refrigerant.
The above-described method illustrates: the temperature of the second circulating liquid loop is set to be 10-90 ℃, and the second circulating liquid loop is divided into 16 sections every 5 ℃. For the temperature range of 20 ℃ to 25 ℃, the minimum temperature of the temperature range is 20 ℃ when the temperature range is operated, the fourth throttling element 21 is closed, after the second circulation liquid loop is stably operated under the load of the rated load, the pressure value measured by the second pressure sensor 25 is 0.5MPa, and assuming that the refrigerant of the second refrigeration system is R404A, the evaporation temperature of the R404A is-6 ℃ under the pressure of 0.5 MPa. Then the upper limit value of the target value Tesv of the evaporation temperature at the outlet end of the second heat exchange passage is-6 ℃, and if the Tesv calculated according to the first temperature T1 and the superheat SH measured by the first temperature sensor 5 is higher than-6 ℃, the Tesv is constantly-6 ℃.
In step 420, the second circulation loop may be controlled to operate under the set load in the machine production debugging process, at this time, the second circulation loop needs to be connected to a heater without being connected to the switching device, the heater outputs a certain power, the power may be adjusted according to needs, the thermal load corresponding to the power is the set load, and in some cases, the set load may be a rated load designed for the second circulation system.
As shown in fig. 8 and 9, the temperature control method further includes:
step 310, acquiring a pressure value of an inlet end of the second compressor;
the pressure value may be measured by the second pressure sensor 25 shown in fig. 1 or the second pressure sensor 24 shown in fig. 2.
Step 320, determining the evaporation temperature Tepv of the refrigerant based on the pressure value and the refrigerant type at the inlet end of the second compressor;
for example, when the pressure value measured by the second pressure sensor 25 is 0.5MPa, the evaporation temperature Tepv of the refrigerant R404A is-6 ℃, and-6 ℃ is the evaporation temperature Tepv.
And 330, adjusting the flow rate of the refrigerant in the second heat exchange passage through a PID algorithm based on the difference value between the evaporation temperature Tepv and the target value Tesv.
The flow rate of the refrigerant in the second heat exchange path, that is, the opening degree of the fourth throttle member 21 is controlled by the PID algorithm so that the target value Tesv approaches the evaporation temperature Tepv.
In this embodiment, the evaporation temperature Tepv is obtained in The same manner as The evaporation temperature so in The above embodiment, except that a specific operation condition is not limited in this embodiment.
An embodiment of the temperature control method, as shown in fig. 9, includes: according to the difference value between the target evaporation temperature Tesv at the outlet end of the second heat exchange path and the evaporation temperature Tepv at the inlet end of the second compressor 14, wherein the evaporation temperature Tepv at the inlet end of the second compressor 14 is the evaporation temperature corresponding to the pressure value measured by the second pressure sensor 25, a PID algorithm is invoked to control the opening degree of the second heat exchange path (the fourth throttling element 21), thereby controlling the heat exchange amount in the first heat exchanger 13.
The value method of the evaporation temperature target value Tesv can adopt the temperature control method.
Taking the temperature control device for regulating and controlling the temperature of the heating cavity as an example, the circulating pump is used for pumping the circulating liquid into the switching device 12, wherein one path of circulating liquid enters the processing cavity of the etching equipment to absorb heat in the etching process, so that the temperature in the processing cavity is constant, and the circulating liquid returns to the original circulating channel through the switching device 12; the other circulation liquid is directly returned to the original circulation system in the switching device 12.
When the circulating liquid in the first circulating liquid loop (low temperature) enters the processing cavity for controlling the temperature, the second circulating liquid loop (high temperature) runs without heat load or with low heat load. On the premise that the heat exchange quantity in the evaporator 17 of the second circulating liquid loop (high temperature) meets the requirement, the fourth throttling element 21 in the second refrigeration system can be started to ensure that the second heat exchange channel of the first heat exchanger 13 exchanges heat with the first heat exchange channel, so that the liquid refrigerant in a certain refrigeration loop in the first refrigeration system is supercooled, on one hand, redundant cold quantity of the second refrigeration system is transferred into the first refrigeration system, and the liquid refrigerant with the first heat exchange channel positioned in the first heat exchanger 13 is used as a cold accumulation medium to store the redundant cold quantity of the second refrigeration system; on the other hand, the supercooled refrigerant liquid improves the refrigerating output of the first refrigerating system so as to meet the high load requirement.
Since the load of the first refrigeration system fluctuates according to the working conditions, the amount of cold storage consumption in the first heat exchanger 13 is reduced at the time when the load of the first refrigeration system is not high. In order to ensure that the second refrigeration system can continuously store redundant cold energy in the first heat exchanger 13, the evaporation temperature in the second heat exchange channel needs to be reduced, namely the temperature of the liquid in the first heat exchange channel is cooled to a lower temperature, and the cold accumulation process can be continuously carried out.
Based on the temperature control device, another temperature control method is also provided, which includes:
and obtaining a first temperature difference value delta T1 according to a first outlet temperature measured value PV1 of the first circulating liquid loop and a first outlet temperature set value SV1 of the first circulating liquid loop, adjusting the opening degree of throttling pieces (such as a first throttling piece 3 and a third throttling piece 7 in figures 1 and 2) in each stage of refrigerating loops in the first refrigerating system according to the first temperature difference value delta T1, and adjusting the heat exchange quantity of evaporators (such as a condensing evaporator 4 and a first evaporator 8 in figures 1 and 2) in each stage of refrigerating loops, thereby realizing the accurate control of the outlet temperature of the first temperature control channel.
Wherein Δ T1= SV1-PV1. The opening degree of each throttling element is adjusted according to a PID algorithm.
Another method for controlling temperature comprises: and obtaining a second temperature difference value delta T2 according to a second outlet temperature measured value PV2 of the second circulating liquid loop and a second outlet temperature set value SV2 of the second circulating liquid loop, adjusting the opening degree of a second throttling element 16 in the second refrigerating system according to the second temperature difference value delta T2, and adjusting the heat exchange quantity of a second evaporator 17, thereby realizing the accurate control of the outlet temperature of the second temperature control channel.
Wherein Δ T2= SV2-PV2. The opening degree of the second throttling member 16 is adjusted according to the PID algorithm.
Another method for controlling temperature comprises: the method comprises the steps of obtaining preset temperature and actual superheat degree of superheat degree, wherein the actual superheat degree is the superheat degree of refrigerant between an outlet end of an evaporator and an inlet end of a compressor in each refrigeration circuit, and adjusting the opening degree of a throttling piece according to deviation of the actual superheat degree and the preset temperature.
The preset temperature may be a point value or a range of values.
As shown in fig. 1 and 2, in the first-stage refrigeration circuit, the opening degree of the first throttling element 3 is adjusted between the outlet end of the condenser-evaporator 4 and the inlet end of the first compressor 1 according to the deviation of the first actual superheat degree from the first preset temperature.
In the second-stage refrigeration circuit, the opening degree of the third throttling element 7 is adjusted between the outlet end of the first evaporator 8 and the inlet end of the third compressor 6 according to the deviation of the second actual superheat degree and the second preset temperature.
In the second refrigeration system, the opening degree of the second throttling element 16 is adjusted between the outlet end of the second evaporator 17 and the inlet end of the second compressor 14 according to the deviation of the third actual superheat degree and the third preset temperature.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A temperature control method is characterized by being applied to a temperature control device, and the temperature control device comprises:
the first temperature control channel comprises a first circulating liquid loop and a first refrigerating system exchanging heat with the first circulating liquid loop;
the second temperature control channel comprises a second circulating liquid loop and a second refrigerating system exchanging heat with the second circulating liquid loop, and the second refrigerating system comprises a second compressor;
the switching device is connected with the first circulating liquid loop and the second circulating liquid loop, is suitable for switching the connection and disconnection of the first circulating liquid loop and the load device and is suitable for switching the connection and disconnection of the second circulating liquid loop and the load device;
the cold accumulator comprises a first heat exchange passage and a second heat exchange passage which exchanges heat with the first heat exchange passage, the first heat exchange passage is communicated with the first refrigeration system, the second heat exchange passage is communicated with the second refrigeration system, and the second compressor is positioned at the outlet end of the second heat exchange passage;
the temperature control method comprises the following steps:
based on the fact that the operating temperature of the second circulating liquid loop is at a second set threshold, the second set threshold is divided into a plurality of temperature sections according to set intervals;
controlling the operating temperature to be at the minimum value in the current temperature section, controlling the second circulating liquid loop to load a set load, disconnecting the second heat exchange passage, and obtaining the refrigerant evaporation temperature at the inlet end of the second compressor;
and controlling the target value of the outlet end evaporation temperature of the second heat exchange passage to be less than or equal to the evaporation temperature.
2. The temperature control method according to claim 1, wherein in the step of obtaining the refrigerant evaporating temperature at the inlet end of the second compressor,
and acquiring a pressure value of the inlet end of the second compressor, wherein the evaporation temperature is the evaporation temperature of the refrigerant corresponding to the pressure value.
3. The temperature control method according to claim 1, wherein the set load is a rated load of the second circulating liquid circuit.
4. The temperature control method according to claim 1, wherein in the step of controlling the second circulating liquid circuit to be loaded with a set load,
and disconnecting the second circulating liquid loop and the switching device, controlling the second circulating liquid loop to be connected with the heater, and controlling the power of the heater so as to control the second circulating liquid loop to load the set load through the heater.
5. The temperature control method according to claim 1, further comprising:
acquiring a first temperature of an inlet end of the first heat exchange passage and a set temperature difference between the first heat exchange passage and the second heat exchange passage;
determining the target value, wherein the target value is the difference between the first temperature and the set temperature difference;
acquiring the superheat degree of the inlet end of the second compressor;
determining that the degree of superheat exceeds a first set threshold, and controlling the target value to increase or decrease.
6. The temperature control method according to claim 5, wherein the step of determining that the degree of superheat exceeds a first set threshold value, and controlling the target value to be increased or decreased, comprises:
determining that the degree of superheat is greater than a first threshold value, the first threshold value being an upper limit of the first set threshold value;
controlling the target value to rise by a first set value, and acquiring the superheat degree in a first preset time length;
if the superheat degrees in a first preset time length are all larger than the first threshold value, the step of controlling the target value to be increased by a first set value to obtain the superheat degrees in the first preset time length is executed in a circulating mode;
until the superheat degree is less than or equal to the first threshold value for at least one time in the first preset time period.
7. The temperature control method according to claim 5, wherein the step of determining that the degree of superheat exceeds a first set threshold value, and controlling the target value to be increased or decreased, comprises:
determining that the degree of superheat is less than a second threshold value, wherein the second threshold value is a lower limit of the first set threshold value;
controlling the target value to reduce a second set value, and acquiring the superheat degree within a second preset time length;
determining that the superheat degrees in a second preset time period are all smaller than a second threshold value, and circularly executing the step of controlling the target value to reduce a second set value to obtain the superheat degree in the second preset time period;
until the superheat degree in the second preset time period is larger than or equal to the second threshold value at least once.
8. The temperature control method according to any one of claims 1 to 7, further comprising:
and adjusting the flow rate of the refrigerant in the second heat exchange passage by a PID algorithm based on the difference value between the evaporation temperature and the target value.
9. The temperature control method according to any one of claims 1 to 7, wherein an inlet end of the second compressor is provided with a pressure sensor.
10. The temperature control method according to any one of claims 1 to 7, wherein the first refrigeration system comprises a multi-stage refrigeration circuit that exchanges heat in sequence, and the first heat exchange path is connected between a condenser and a throttle member of one of the stages of the refrigeration circuit.
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