CN115284198B

CN115284198B - Fixing device of semiconductor substrate

Info

Publication number: CN115284198B
Application number: CN202211221918.XA
Authority: CN
Inventors: 王伟格; 金加晋; 王稚程; 赵廷唯
Original assignee: Neil Semiconductor Shandong Co ltd
Current assignee: Neil Semiconductor Shandong Co ltd
Priority date: 2022-10-08
Filing date: 2022-10-08
Publication date: 2023-01-17
Anticipated expiration: 2042-10-08
Also published as: CN115284198A

Abstract

The invention discloses a fixing device of a semiconductor substrate, which relates to the technical field of substrate fixing and comprises a main body frame, a placing frame, a clamping assembly, a driving assembly and a locking assembly, wherein the main body frame is provided with a containing cavity which penetrates through the main body frame in the thickness direction and is used for containing the semiconductor substrate; the placing frame is assembled inside the containing cavity and can slide along the height direction of the containing cavity, and the top of the placing frame is flat and provided with a bearing surface for placing the semiconductor substrate. The clamping device can rapidly and stably clamp semiconductor substrates with different thicknesses and sizes, and after clamping and fixing, no matter the size of the semiconductor substrate, the contact point and the contact surface of the clamping part and the semiconductor substrate are the side edges in the thickness direction of the semiconductor substrate, so that the problem of poor heat dissipation caused by large contact area between the substrate and the fixing device can be solved, holes do not need to be punched on the substrate, and the degree of freedom of substrate design is conveniently improved.

Description

Fixing device of semiconductor substrate

Technical Field

The invention relates to the technical field of substrate fixing, in particular to a fixing device of a semiconductor substrate.

Background

The substrate material is a basic material for manufacturing semiconductor elements and printed circuit boards, such as silicon, gallium arsenide, silicon epitaxial needle garnet and the like used in the semiconductor industry, and is prepared by using high-purity aluminum oxide (alumina) as a main raw material through high-pressure forming, high-temperature firing, cutting and polishing, a ceramic substrate is a basic material for manufacturing thick-film and thin-film circuits, a copper-clad laminate is a substrate material for manufacturing printed circuit boards and is used for supporting various components and realizing electrical connection or electrical insulation among the components, a metal substrate is a metal-based copper-clad laminate compounded by a metal thin plate, an insulating medium layer and copper foil, and the metal substrate plays an important role in fields of power electronic components, microelectronic devices, microwave communication, automatic control, power supply conversion, aerospace and the like due to excellent heat dissipation performance, mechanical processing performance, electromagnetic shielding performance, size stability, magnetic performance and multiple functions. At present, the base plate is usually fixed on a fixing device by using screws in the fixing process, the base plate is provided with holes in the fixing mode, the holes occupy the design space of the base plate, the design freedom degree of the base plate is reduced, and the contact area between the bottom of the base plate and the fixing device is larger by fixing the screws, so that the heat dissipation effect of the base plate is poorer.

Disclosure of Invention

The present invention is directed to a semiconductor substrate fixing device to solve the above problems.

In order to achieve the purpose, the invention adopts the following technical scheme:

the invention provides a fixing device of a semiconductor substrate, comprising:

a main body frame having a receiving cavity penetrating therethrough in a thickness direction thereof and receiving the semiconductor substrate;

the placing frame is assembled inside the containing cavity and can slide along the height direction of the containing cavity, and the top of the placing frame is flat and provided with a bearing surface for placing the semiconductor substrate;

the clamping assembly comprises clamping parts which are symmetrically assembled on two sides of the placing rack and can move in opposite directions or back to back, a pair of the clamping parts are arranged in parallel, and a V-shaped clamping opening is formed in the opposite side of each clamping part;

the driving assembly comprises a guide structure arranged on the side wall of the containing cavity below the clamping part, the guide structure is in transmission connection with the corresponding clamping part and guides the pair of clamping parts to move relatively or oppositely when the placing frame slides downwards along the height of the containing cavity or upwards along the height of the containing cavity so as to clamp the semiconductor substrate on the bearing surface or loosen the semiconductor substrate on the bearing surface; and

and the locking assembly is used for locking the sliding of the placing frame after the semiconductor substrate is clamped by the pair of clamping parts.

Further, the cross street that holds the chamber is personally submitted the rectangle, the rack includes that the level is located the cross branch that holds intracavity portion, cross branch comprises the quarter butt that holds chamber length direction middle part and the stock of horizontal width direction middle part in, the contained angle department of quarter butt and stock is connected with the down tube.

Further, it is a pair of the both ends of quarter butt are located respectively to the centre gripping part, the both ends of quarter butt all run through along the length direction level and are provided with the sliding tray, the clamping part is including running through and sliding the connecting plate of adaptation in the inside of sliding tray to and connect a pair of movable plate at the connecting plate both ends, one side that the movable plate is close to and holds the chamber center is fixed with the grip block along its length direction equidistance, V type groove has been seted up on the grip block.

Further, the clamping part still includes the vertical grip block of locating between the adjacent grip block, one side that the grip block is close to the grip block is provided with the slide bar perpendicularly, and the slide bar runs through the movable plate, and the one end fixedly connected with linkage plate of grip block is kept away from to a set of slide bar, the clamping part still includes provide damped first reset spring when the grip block moves to movable plate one side.

Furthermore, the guide structure comprises a triangular guide block fixed on the side wall of the accommodating cavity below the connecting plate, the inclined plane of the triangular guide block faces the moving plate, a sliding block is arranged on the inclined plane of the triangular guide block in a sliding mode, and the sliding block is fixedly connected with the moving plate.

Further, the locking subassembly is including fixing the U type card at stock both ends top, U type card is including hugging closely in the main body frame inner wall and fixing in the first vertical portion at stock top, locating the vertical portion of second that the main body frame outer wall kept away from its inner chamber one side to and connect in the vertical portion of second and first vertical portion top arc transition portion.

Further, the locking assembly further comprises a limiting screw vertically penetrating through the second vertical portion, and the limiting screw is in threaded connection with the second vertical portion.

Further, the locking subassembly is including still including setting up the fixture block that the cross-section is right triangle on the vertical portion of second, the inclined plane of fixture block sets up down, be provided with the cardboard on the main body frame of the vertical portion one side of second, the cardboard is close to vertical portion one side of second and evenly is provided with the draw-in groove with fixture block looks adaptation along main body frame thickness direction, the locking subassembly includes when the rack moves down, provides damped second reset spring.

Compared with the prior art, the above one or more technical schemes have the following beneficial effects:

the clamping device can rapidly and stably clamp semiconductor substrates with different thicknesses and sizes, and after clamping and fixing, no matter how large the size of the semiconductor substrate, the contact point and the contact surface of the clamping part and the semiconductor substrate are the side edges in the thickness direction of the semiconductor substrate, so that on one hand, the problem of poor heat dissipation caused by large contact area between the substrate and the fixing device can be avoided, on the other hand, holes do not need to be punched on the substrate, the degree of freedom of substrate design is conveniently improved, in addition, the clamping device does not occupy the circuit layout area of the semiconductor substrate after clamping, and further, the semiconductor substrate can obtain higher degree of freedom of design.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.

FIG. 1 is a schematic overall structure of the present invention;

FIG. 2 is a schematic view of a portion of the structure at A of FIG. 1;

FIG. 3 is a schematic view of the present invention with a clamping portion removed;

FIG. 4 is a schematic view of the structure of the clamping portion of the present invention;

FIG. 5 is a partial schematic view of FIG. 4 at B;

FIG. 6 is a schematic top view of the present invention;

FIG. 7 isbase:Sub>A schematic view of the structure of FIG. 6 taken along line A-A;

FIG. 8 is a schematic view of a portion of FIG. 7 at C;

FIG. 9 is a schematic view of a clamped semiconductor device of the present invention;

FIG. 10 is an overall schematic configuration of the present invention in other embodiments;

fig. 11 is a partial structural view at D of fig. 10.

In the figure:

100. a main body frame; 200. placing a rack; 300. a clamping assembly; 400. a drive assembly; 500. a locking assembly; 600. fixing the module inner assembly; 700. a chip; 800. a silica gel protective layer; 900. a limit screw;

110. an accommodating chamber;

210. a bearing surface; 220. a cross-shaped strut; 230. a diagonal bar;

310. a clamping portion;

410. a guide structure;

510. a U-shaped card; 520. a clamping block; 530. clamping a plate; 540. a card slot; 550. a second return spring;

220a, a short rod; 220b, a long rod; 220c, a sliding groove;

310a, a connecting plate; 310b, moving plates; 310c, a clamping block; 310d, a V-shaped groove; 310e, a clamping plate; 310f, a slide bar; 310g of linkage plate; 310h, a first return spring;

410a, a triangular guide block; 410b, a slide block;

510a, a first upright portion; 510b, a second upright portion; 510c, an arc-shaped transition.

Detailed Description

In order to make the technical solutions of the present application better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort shall fall within the protection scope of the present application.

Referring to fig. 1 to 11, the present invention provides a fixing device for a semiconductor substrate, including a main body frame 100, a placing frame 200 and a clamping assembly 300, wherein the main body frame 100 has a receiving cavity 110 penetrating therethrough in a thickness direction for receiving the semiconductor substrate. The accommodating cavity 110 is a cavity for accommodating the semiconductor substrate, and the cross section of the accommodating cavity 110 is rectangular according to the shape of the semiconductor substrate, that is, the entire accommodating cavity 110 is rectangular, and the depth of the accommodating cavity 110 is greater than the thickness of the semiconductor substrate.

The placing frame 200 is installed inside the accommodating cavity 110 and can slide along the height direction of the accommodating cavity 110, and the top of the placing frame 200 is flat and has a carrying surface 210 for placing the semiconductor substrate. The placing frame 200 is initially located at the top of the accommodating cavity 110, that is, the bearing surface 210 of the placing frame 200 is flush with the top surface of the main body frame 100, so that the position of the semiconductor substrate can be conveniently adjusted after the semiconductor substrate is placed on the bearing surface 210 of the placing frame 200, and after the position of the semiconductor substrate is adjusted, the placing frame 200 can be pushed to drive the semiconductor substrate to enter the accommodating cavity 110 for fixing.

In consideration of the heat dissipation of the semiconductor substrate and the cost of the fixture, in this embodiment, the rack 200 includes a cross-shaped support rod 220 horizontally disposed inside the accommodating cavity 110, the cross-shaped support rod 220 is composed of a short rod 220a horizontally disposed in the middle of the accommodating cavity 110 in the length direction and a long rod 220b horizontally disposed in the middle of the accommodating cavity in the width direction, and an inclined rod 230 is connected to an included angle between the short rod 220a and the long rod 220 b.

Through the design, on the premise of ensuring the stable placement of the semiconductor substrate, the contact area between the semiconductor substrate and the placing frame 200 is reduced as much as possible, the heat dissipation of the semiconductor substrate is improved, meanwhile, the material usage amount of the design is small, the production cost can be reduced, and the overall weight of the fixing device after production can be reduced.

The clamping assembly 300 includes clamping portions 310 symmetrically mounted on both sides of the placement frame 200 and capable of moving toward or away from each other, and a pair of the clamping portions 310 are parallel to each other.

In the above-mentioned design, when fixing, the semiconductor substrate is clamped by the pair of clamping portions 310 on both sides of the placing frame 200 moving towards each other, in this way, the distance between the pair of clamping portions 310 can be adjusted to adapt to clamping of semiconductor substrates with different sizes, in order to improve the clamping stability, the pair of clamping portions 310 are provided with V-shaped clamping openings on opposite sides, the design of the V-shaped clamping openings not only can limit the lateral movement of the semiconductor substrate, but also can limit the longitudinal movement of the semiconductor substrate (i.e. the semiconductor substrate can abut against both sides of the semiconductor substrate in the thickness direction through the two V-shaped clamping openings during clamping), so that the clamping stability is improved, meanwhile, the design of the V-shaped clamping openings can also clamp semiconductor substrates with different thicknesses (i.e. the semiconductor substrate with small thickness is clamped deeper in the V-shaped clamping openings, and the semiconductor substrate with large thickness is clamped in the V-shaped clamping openings), on the other hand, because the contact points of the pair of clamping portions 310 and the semiconductor substrate are located on the sides of the semiconductor substrate in the thickness direction of the semiconductor substrate, so that the semiconductor substrate can be separated from the clamping surface of the placing frame, and the semiconductor substrate can be fixed, and the semiconductor substrate can be mounted along the side of the placing frame 200 without the side, and the semiconductor substrate, and the semiconductor chip can be fixed in the clamping openings, and the clamping device, and the semiconductor substrate can be fixed in the mounting process, and the semiconductor substrate, therefore, and the semiconductor substrate can be fixed in the mounting process, and the semiconductor device, and the semiconductor substrate can be fixed in the semiconductor device, and the semiconductor substrate mounting process, and the semiconductor device, and the semiconductor substrate can be fixed in the mounting process, the heat dissipation of the semiconductor substrate is not affected after the semiconductor substrate is fixed.

Since the side edge of the semiconductor substrate is clamped and fixed by the pair of clamping portions 310 moving relatively, in order to improve the clamping stability, in this embodiment, the pair of clamping portions 310 are respectively disposed at two ends of the short rod 220a, two ends of the short rod 220a are both horizontally provided with the sliding groove 220c in a penetrating manner along the length direction, the clamping portion 310 includes the connecting plate 310a penetrating and slidably fitted inside the sliding groove 220c, and the pair of moving plates 310b connected to two ends of the connecting plate 310a, clamping blocks 310c are equidistantly fixed on one side of the moving plate 310b close to the center of the accommodating cavity 110 along the length direction thereof, and V-shaped grooves 310d are disposed on the clamping blocks 310 c.

The above-described design allows the pair of holding portions 310 to hold the semiconductor substrate at both sides in the longitudinal direction of the semiconductor substrate, increases the holding fixing points for holding and fixing the semiconductor substrate, and improves the holding stability, and increases the holding fixing points to increase the contact area between the holding portions 310 and the semiconductor substrate, and accordingly, the heat dissipation is slightly affected, but the heat dissipation is negligible due to the above-described holding manner (V-shaped structure).

In the process that the semiconductor substrate slides upwards along the inclined plane at the lower part of the V-shaped clamping opening, the semiconductor substrate may be inclined in the sliding process, so that the semiconductor substrate is not in a horizontal state after being fixed, in this embodiment, the clamping portion 310 further includes a clamping plate 310e vertically arranged between adjacent clamping blocks 310c, one side of the clamping plate 310e, which is close to the moving plate 310b, is vertically provided with a sliding rod 310f, the sliding rod 310f penetrates through the moving plate 310b, one end of one group of sliding rods 310f, which is far away from the clamping plate 310e, is fixedly connected with a linkage plate 310g, and the clamping portion 310 further includes a first return spring 310h for providing damping when the clamping plate 310e moves to one side of the moving plate 310 b.

In the above design, during the process of moving the pair of clamping portions 310 towards each other, the pair of clamping plates 310e will contact with the lateral sides of the semiconductor substrate in the thickness direction for preliminary clamping, so as to ensure that the semiconductor substrate is always in a horizontal state during the process of moving upwards by the contact between the lower inclined surface of the V-shaped groove 310d and the bottom of the semiconductor substrate.

In order to facilitate clamping of the semiconductor substrate and improve the semiconductor substrate loading and unloading efficiency, the fixing apparatus further includes a driving assembly 400 and a locking assembly 500, the driving assembly 400 includes a guide structure 410 disposed on a sidewall of the accommodating cavity 110 below the clamping portion 310, the guide structure 410 is in transmission connection with the corresponding clamping portion 310, and guides the pair of clamping portions 310 to move relatively or move away from each other when the placing rack 200 slides downwards along the height of the accommodating cavity 110 or upwards along the height of the accommodating cavity 110, so as to clamp the semiconductor substrate on the carrying surface 210 or release the semiconductor substrate on the carrying surface 210; the locking assembly 500 is used for locking the sliding of the placing frame 200 after the semiconductor substrate is clamped by the pair of clamping parts 310.

Foretell design, can make a pair of holder 310 and rack 200 remove and produce the linkage cooperation, concretely, when the installation, only need promote rack 200 and slide into downwards and hold chamber 110, semiconductor substrate on the clamping bearing face 210 of a pair of holder 310 relative movement of guide structure 410 guide, afterwards can accomplish fixing semiconductor substrate through locking assembly 500 locking rack 200, and during the dismantlement, only need remove the fixed of rack 200 with locking assembly 500, upwards stimulate the roll-off and hold chamber 110 with rack 200, alright make a pair of holder 310 remove the fixed of removing semiconductor substrate mutually in back of the body. The whole installation and disassembly process is very convenient, and the semiconductor substrate loading and unloading efficiency can be greatly improved.

In this embodiment, specifically, the guide structure 410 includes a triangular guide block 410a fixed on the side wall of the receiving cavity 110 below the connecting plate 310a, the inclined surface of the triangular guide block 410a faces the connecting plate 310a, and a slide block 410b capable of sliding along the inclined direction of the inclined surface of the triangular guide block 410a is slidably disposed on the inclined surface of the triangular guide block 410a, and the slide block 410b is fixedly connected to the moving plate 310 b. Specifically, the bottom of the sliding block 410b is slidably connected to the inclined surface of the triangular guide block 410a through a key slot, for example, a T-shaped sliding slot (not shown) is formed in the inclined surface of the triangular guide block 410a, and a T-shaped sliding block (not shown) adapted to the T-shaped sliding slot is arranged at the bottom of the sliding block 410 b.

In the downward sliding process of the placing rack 200, since the moving plate 310b is fixedly connected with the connecting plate 310a and the connecting plate 310a is located in the sliding groove 220c of the short rod 220a, when the placing rack 200 slides downward, the connecting plate 310a can drive the moving plate 310b to move downward together, and since the slider 410b is fixed with the moving plate 310b, when the placing rack 200 slides downward, the moving plate 310b can move towards the center of the accommodating cavity 110 to clamp and fix the semiconductor substrate by sliding the slider 410b on the inclined surface of the triangular guide block 410 a.

In this embodiment, specifically, the locking assembly 500 includes a U-shaped clip 510 fixed on the top of the two ends of the long rod 220b, and the U-shaped clip 510 includes a first vertical portion 510a tightly attached to the inner wall of the main body frame 100 and fixed on the top of the end of the long rod 220b, a second vertical portion 510b disposed on the outer wall of the main body frame 100 away from the inner cavity thereof, and an arc-shaped transition portion 510c connected to the top of the second vertical portion 510b and the first vertical portion 510 a. The U-shaped card 510 can be used as a force application point in the installation process, i.e. the sliding of the placement frame 200 can be controlled by pressing or pulling the U-shaped card 510, and the first vertical part 510a of the U-shaped card 510 clings to the inner wall of the main body frame 100, so that the sliding stability of the placement frame 200 can be improved.

The following details the overall workflow of the present invention:

when the placing frame 200 moves downwards, the pair of clamping portions 310 can move towards the center of the accommodating cavity 110 due to the fact that the connecting plates 310a of the clamping portions 310 are limited in the sliding grooves 220c in a sliding mode through the sliding blocks 410b and the inclined surfaces of the triangular guide blocks 410a, and therefore the pair of clamping portions 310 can move towards the center of the accommodating cavity 110 when the placing frame 200 moves downwards, and therefore the pair of clamping portions 310 can move towards each other continuously along with the continuous movement of the placing frame 200 until the semiconductor substrate is clamped;

in the above clamping process, the pair of clamping plates 310e is firstly contacted with the semiconductor substrate, the pair of clamping plates 310e is contacted with the side edge of the semiconductor substrate in the thickness direction to perform primary clamping, so that the semiconductor substrate is prevented from being inclined, and then along with the continuous movement of the pair of clamping parts, the inclined surface at the lower part of the V-shaped groove 310d of the pair of clamping parts 310 is contacted with the side edge of the semiconductor substrate, and along with the continuous movement of the clamping parts 310, the semiconductor substrate can slide upwards along the inclined surface at the lower part of the V-shaped groove 310d until the semiconductor substrate is clamped into the inclined surface contact with the upper part and the lower part of the V-shaped groove 310d, so that the clamping is completed. After clamping is completed, the rack 200 is locked only by the locking assembly 500.

In some embodiments, as shown in fig. 10 and 11 in combination, the locking assembly 500 further includes a limit screw 900 extending perpendicularly through the second upright portion 510b, the limit screw 900 being threadably coupled to the second upright portion 510 b. When the position locking needs to be carried out on the placement frame 200, the placement frame 200 can be locked only by rotating the limiting screw 900 and abutting against the outer wall of the main body frame 100.

In this embodiment, the locking assembly 500 further includes a locking block 520 disposed on the second vertical portion 510b and having a right triangle-shaped cross section, an inclined surface of the locking block 520 is disposed downward, a locking plate 530 is disposed on the main frame 100 on one side of the second vertical portion 510b, a locking groove 540 adapted to the locking block 520 is uniformly disposed on one side of the locking plate 530 close to the second vertical portion 510b along the thickness direction of the main frame 100, and the locking assembly 500 includes a second return spring 550 providing damping when the placement frame 200 moves downward.

In the downward movement process of the placing rack 200, that is, in the downward pressing process of the U-shaped card 510, the inclined plane of the fixture block 520 fixed to the second vertical portion 510b is opposite to the inclined plane of the fixture groove 540, the arc transition portion 510c of the U-shaped card 510 can deform to enable the fixture block 520 to be sequentially clamped into the fixture groove 540 below, and when the U-shaped card 510 moves upward, due to the structural characteristics of the fixture block 520 (the right-angle surface of the fixture block 520 is opposite to the right-angle surface of the fixture groove 540), the upward sliding of the U-shaped card 510 is further limited, that is, a structure with one-way locking is provided on the placing rack 200 through the above structure, so that when a semiconductor substrate is mounted, the clamping and fixing of the semiconductor substrate can be completed only by pushing the U-shaped card 510 downward, and when the semiconductor substrate needs to be dismounted, only the second vertical portion 510b of the U-shaped card 510 needs to be outwardly moved to release the locking, and then, under the action of the second restoring spring 550, the placing rack 200 can be reset, so as to finish the dismounting work of the semiconductor substrate.

As shown in fig. 9, the present invention further provides a semiconductor device clamped and fixed by a fixing device, which includes a copper-clad ceramic substrate, wherein a fixed module 600 is disposed on an upper surface of the copper-clad ceramic substrate, the fixed module includes a chip 700, a silicon protective layer 800 is disposed on the chip 700, and one or more chips 700 are soldered on the copper-clad ceramic substrate.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. A semiconductor substrate fixing apparatus, comprising:

a main body frame (100) having a receiving cavity (110) penetrating in a thickness direction thereof and receiving a semiconductor substrate;

the placing frame (200) is assembled inside the accommodating cavity (110) and can slide along the height direction of the accommodating cavity (110), and the top of the placing frame (200) is flat and provided with a bearing surface (210) for placing a semiconductor substrate;

the clamping assembly (300) comprises clamping parts (310) which are symmetrically assembled on two sides of the placing rack (200) and can move in opposite directions or in opposite directions, the pair of clamping parts (310) are parallel to each other, and V-shaped clamping openings are formed in opposite sides of the pair of clamping parts (310);

the driving assembly (400) comprises a guide structure (410) arranged on the side wall of the accommodating cavity (110) below the clamping parts (310), and the guide structure (410) is in transmission connection with the corresponding clamping parts (310) and guides the pair of clamping parts (310) to move relatively or oppositely so as to clamp the semiconductor substrate on the bearing surface (210) or release the semiconductor substrate on the bearing surface (210) when the placing frame (200) slides downwards along the height direction of the accommodating cavity (110) or slides upwards along the height direction of the accommodating cavity (110); and

and a locking assembly (500) for locking the sliding of the placing frame (200) after the semiconductor substrate is clamped by the pair of clamping parts (310).

2. The semiconductor substrate fixing apparatus according to claim 1, wherein: the cross street who holds chamber (110) is personally submitted the rectangle, rack (200) locate the cross branch (220) that hold chamber (110) inside including the level, cross branch (220) comprise short pole (220 a) that hold chamber (110) length direction middle part and long pole (220 b) that transversely arrange the width direction middle part in by transversely arranging, the contained angle department of short pole (220 a) and long pole (220 b) is connected with down tube (230).

3. A semiconductor substrate fixing apparatus according to claim 2, wherein: it is a pair of both ends of quarter butt (220 a) are located respectively in clamping part (310), the both ends of quarter butt (220 a) all run through along the length direction level and are provided with sliding tray (220 c), clamping part (310) is including running through and sliding adaptation at inside connecting plate (310 a) of sliding tray (220 c) to and connect a pair of movable plate (310 b) at connecting plate (310 a) both ends, movable plate (310 b) are close to and hold one side at chamber (110) center and are fixed with grip block (310 c) along its length direction equidistance, V type groove (310 d) have been seted up on grip block (310 c).

4. A semiconductor substrate fixing apparatus according to claim 3, wherein: clamping part (310) still includes vertical grip block (310 e) of locating between adjacent grip block (310 c), one side that grip block (310 e) are close to grip block (310 e) is provided with slide bar (310 f) perpendicularly, and slide bar (310 f) run through movable plate (310 b), one end fixedly connected with linkage plate (310 g) that grip block (310 e) were kept away from in a set of slide bar (310 f), clamping part (310) still includes first reset spring (310 h) that provides damped when grip block (310 e) removes to movable plate (310 b) one side.

5. A semiconductor substrate fixing apparatus according to claim 2, wherein: guide structure (410) is including fixing triangle-shaped guide block (410 a) that holds chamber (110) lateral wall below movable plate (310 b), the inclined plane of triangle-shaped guide block (410 a) is towards movable plate (310 b), just it is provided with slider (410 b) to slide on the inclined plane of triangle-shaped guide block (410 a), slider (410 b) and movable plate (310 b) fixed connection.

6. A semiconductor substrate fixing apparatus according to claim 2, wherein: locking subassembly (500) are including fixing U type card (510) at stock (220 b) both ends top, U type card (510) are including hugging closely in main body frame (100) inner wall and fixing first vertical portion (510 a) at stock (220 b) top, locate main body frame (100) outer wall and keep away from the vertical portion of second (510 b) of its inner chamber one side to and connect in the vertical portion of second (510 b) and first vertical portion (510 a) top arc transition portion (510 c).

7. The semiconductor substrate fixing apparatus according to claim 6, wherein: the locking assembly (500) further comprises a limit screw vertically penetrating through the second vertical portion (510 b), and the limit screw is in threaded connection with the second vertical portion (510 b).

8. The semiconductor substrate fixing apparatus according to claim 6, wherein: locking subassembly (500) including still including setting up fixture block (520) that the cross-section is right triangle on second vertical portion (510 b), the inclined plane of fixture block (520) sets up down, be provided with cardboard (530) on main body frame (100) of second vertical portion (510 b) one side, cardboard (530) are close to second vertical portion (510 b) one side and evenly are provided with draw-in groove (540) with fixture block (520) looks adaptation along main body frame (100) thickness direction, locking subassembly (500) include when rack (200) move down, provide damped second reset spring (550).