CN115283364A - Laser cleaning equipment for chip packaging mold - Google Patents
Laser cleaning equipment for chip packaging mold Download PDFInfo
- Publication number
- CN115283364A CN115283364A CN202210516254.3A CN202210516254A CN115283364A CN 115283364 A CN115283364 A CN 115283364A CN 202210516254 A CN202210516254 A CN 202210516254A CN 115283364 A CN115283364 A CN 115283364A
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- Prior art keywords
- laser
- light
- light processing
- shell
- processing component
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- 238000004140 cleaning Methods 0.000 title claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 title abstract description 11
- 239000000428 dust Substances 0.000 claims abstract description 53
- 238000002955 isolation Methods 0.000 claims description 9
- 238000007493 shaping process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a laser cleaning device for a chip packaging mold, which relates to the technical field of cleaning tools and comprises a shell, a laser, a dust collector, a light processing element and an adjusting element, wherein the laser and the dust collector are both positioned in the shell, the working end of the dust collector extends out of the shell, the light processing element is positioned outside the shell and is communicated with the light emitting end of the laser, the light processing element is used for shaping laser emitted by the laser and shaping the laser emitted by the light emitting end of the laser into uniform parallel light, the working end of the dust collector is arranged close to the light processing element and is used for removing dust, and the adjusting element is connected with the working end of the dust collector and the light processing element and can drive the light processing element and the working end of the dust collector to move on the surface of the mold. This chip package mould laser cleaning equipment can improve the cleaning performance, avoids producing dust pollution simultaneously.
Description
Technical Field
The invention relates to the technical field of cleaning tools, in particular to a laser cleaning device for a chip packaging die.
Background
Packaging techniques are necessary and critical to the chip. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport. The mold is a tool directly contacting with the integrated circuit in the chip injection molding packaging equipment, is the most critical part, and is the most loss-consuming part. Because of the need for elevated temperature and curing molding process, the molding compound will remain on the mold surface. The residual plastic package material can seriously affect the finished product of the integrated circuit package, can seriously affect the demoulding, brings risks to the integrated circuit package and must be removed in time.
Laser cleaning has the characteristics of no grinding, no contact, no thermal effect, suitability for cleaning objects made of various materials and the like, and is considered to be the most reliable and effective solution. And in laser cleaning process, can produce some dust pieces, if not handle in time and can influence the cleaning performance to and staff's health, simultaneously, current laser cleaning head because with the position difference between the mould, often influence the cleaning performance.
Disclosure of Invention
The invention aims to provide a laser cleaning device for a chip packaging die, which is used for solving the problems in the prior art, improving the cleaning effect and avoiding dust pollution.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides a chip packaging die laser cleaning device which comprises a shell, a laser, a dust collector, a light processing element and an adjusting element, wherein the laser and the dust collector are both positioned in the shell, the working end of the dust collector extends out of the shell, the light processing element is positioned outside the shell and is communicated with the light emitting end of the laser, the light processing element is used for shaping laser emitted by the laser and shaping the laser emitted by the light emitting end of the laser into uniform parallel light, the working end of the dust collector is arranged close to the light processing element and is used for removing dust, and the adjusting element is connected with the working end of the dust collector and the light processing element and can drive the light processing element and the working end of the dust collector to move on the surface of a die.
Preferably, a vibration isolation plate is fixed in the shell, the vibration isolation plate is parallel to the horizontal plane, and the laser and the dust collector are both fixed on the vibration isolation plate.
Preferably, the adjustment element is a robotic arm.
Preferably, the upper end face of the shell is further provided with a controller, and the laser, the dust collector and the adjusting element are electrically connected with the controller and control the working state through the controller.
Preferably, a light guide arm is further installed between the laser and the light outlet end of the laser, one end of the light guide arm is connected with the light outlet end of the laser, and the other end of the light guide arm is connected with the light processing element and can guide light to the light processing element.
Preferably, the light guide arm is a seven-joint light guide arm.
Preferably, the light processing element is a shaper, and the shaper comprises a processing shell and a limiter, a convex lens and a concave lens which are sequentially arranged in the processing shell, wherein the limiter is used for homogenizing the spot intensity emitted by the laser, and the convex lens and the concave lens are used for refracting the divergent light emitted by the laser into parallel light.
Preferably, a distance meter is further mounted on the outer wall of the light processing element, and the distance meter is used for measuring the distance between the light processing element and the mold.
Preferably, the lower end of the housing is also provided with a universal wheel.
Compared with the prior art, the invention achieves the following technical effects:
according to the laser cleaning equipment for the chip packaging mold, the laser and the dust collector are located in the shell, the working end of the dust collector extends out of the shell, dust can be conveniently treated in the laser cleaning process, the optical processing element is located outside the shell and is communicated with the light emitting end of the laser, the optical processing element is used for shaping laser emitted by the laser and shaping diffused laser emitted by the light emitting end of the laser into uniform parallel light, so that the laser cleaning effect is improved, the working end of the dust collector is arranged close to the optical processing element and is used for removing dust, dust is removed at the source position where the dust is generated, the dust removal effect is improved, the body health of workers is effectively guaranteed, the adjusting element is connected with the working end of the dust collector and the optical processing element and can drive the optical processing element to move on the surface of the mold, the light emitting end of the optical processing element can be enabled to irradiate the surface of the mold, meanwhile, the light emitting end of the optical processing element is enabled to carry out laser cleaning on different positions of the surface of the mold, the cleaning effect and the cleaning efficiency are improved, and the working end of the dust collector is always close to the optical processing element.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a laser cleaning apparatus for a chip package mold according to the present invention;
FIG. 2 is a schematic diagram of the internal structure of the light management component of the present invention;
in the figure: 100. chip packaging mould laser cleaning equipment; 1. a housing; 2. a vibration isolation plate; 3. a controller; 4. an adjustment element; 5. a vacuum cleaner; 6. a laser; 7. a light guide arm; 8. a light processing element; 9. a distance meter; 10. treating the shell; 11. an amplitude limiter; 12. a convex lens; 13. a concave lens; 14. a universal wheel.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a laser cleaning device for a chip packaging die, which aims to solve the technical problems that the existing die is poor in cleaning effect and the cleaning process influences the health of workers.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1-2, the present invention provides a laser cleaning apparatus 100 for a chip package mold, including a housing 1, a laser 6, a dust collector 5, a light processing element 8, and an adjusting element 4, wherein the laser 6 and the dust collector 5 are both located in the housing 1, and a working end of the dust collector 5 extends out of the housing 1, so as to process dust during a laser cleaning process, the light processing element 8 is located outside the housing 1 and is communicated with a light emitting end of the laser 6, and the light processing element 8 is configured to shape laser emitted from the laser 6, and shape the laser emitted from the light emitting end of the laser 6 into uniform parallel light, so as to improve a laser cleaning effect, the working end of the dust collector 5 is disposed close to the light processing element 8, and is used for removing dust at a source that generates dust, so as to improve a dust removal effect, thereby effectively ensuring physical health of workers, the adjusting element 4 is connected to the working end of the dust collector 5 and the light processing element 8, and can drive the light processing element 8 to move on a surface of the mold, thereby cleaning ends that an upper surface and a lower surface are planar surface, and cleaning ends of the light processing element are both can be cleaned, and the light processing element 8, so as to ensure that the cleaning efficiency of the light processing element is improved when the light cleaning element 5 and the light cleaning element 8 is also improved.
Specifically, casing 1 internal fixation has vibration isolation plate 2, and vibration isolation plate 2 is parallel with the horizontal plane to realize the stable installation of laser instrument 6 and dust catcher 5, laser instrument 6 and dust catcher 5 are all fixed on vibration isolation plate 2, and then reduce the vibration of laser cleaning and dust removal in-process, avoid vibrating too big part damage that leads to, and influence cleaning performance and dust removal effect.
Adjusting element 4 is the arm, and the arm is installed in 1 up end of casing, and the arm can drive the work end and the light processing component 8 of dust catcher 5 and remove on the mould surface, and then improves the cleaning performance, simultaneously, does not need the direct manual operation of manual work, practices thrift the labour.
The upper end face of the shell 1 is also provided with a controller 3, and the laser 6, the dust collector 5 and the adjusting element 4 are all electrically connected with the controller 3, and the working state is controlled by the controller 3, so that automatic control is realized.
Still install leaded light arm 7 between the light-emitting end of laser instrument 6 and laser instrument 6, the one end of leaded light arm 7 is connected with the light-emitting end of laser instrument 6, and the other end and the light processing component 8 of leaded light arm 7 are connected to can lead the light to light processing component 8, and then through the setting of leaded light arm 7, lead to the laser that the light-emitting end of laser instrument 6 sent, so that it gets into light processing component 8, and handle laser through light processing component 8. The laser 6 is preferably a solid laser, the wavelength is 1064nm, the output frequency is 1Hz-20Hz and adjustable, the diameter of an output light spot is 2mm-10mm and adjustable, the single pulse energy is 100mJ-1000mJ and adjustable, the laser 6 is a large-energy short pulse laser 6, the frequency is low, and the energy is large.
The light guide arm 7 is a seven-joint light guide arm, so that when the adjusting element 4 drives the light processing element 8 to move, the light guide arm 7 can adapt to the movement of the light processing element 8, so that the light guide is not affected, and the seven-joint light guide arm is a common seven-joint light guide arm in the prior art, and the structure and the principle of the seven-joint light guide arm are not described in detail herein.
The light processing element 8 is a shaper, the shaper comprises a processing shell 10, an amplitude limiter 11, a convex lens 12 and a concave lens 13 which are sequentially arranged in the processing shell 10, the processing shell 10 is connected with one end of the light guide arm 7, the amplitude limiter 11 is used for homogenizing the light spot intensity emitted by the laser 6, namely, the light spots with different intensities are shielded to different degrees through the arrangement of the amplitude limiter 11, so that the intensity is uniform, the convex lens 12 and the concave lens 13 are used for refracting the divergent light emitted by the laser 6 into parallel light, the size of the light beam (namely the diameter of the light spot) can be adjusted, so that the light irradiated on the surface of the die after being shaped by the light processing element 8 is the parallel light with uniform light intensity, and the laser cleaning effect is improved.
Still install distancer 9 on light treatment element 8's the outer wall, distancer 9 is used for measuring the distance between light treatment element 8 and the mould, and then is convenient for to distance real time control to satisfy better laser cleaning effect.
The lower end of the shell 1 is also provided with universal wheels 14, so that the integral movement is convenient.
The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above description of the embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In summary, this summary should not be construed to limit the present invention.
Claims (9)
1. The utility model provides a chip package mold laser cleaning equipment which characterized in that: including casing, laser instrument, dust catcher, light processing component and adjusting element, the laser instrument with the dust catcher all is located in the casing, just the work end of dust catcher stretches out the casing, light processing component is located the casing is outside, and with the light-emitting end intercommunication of laser instrument, just light processing component is used for right the laser that the laser instrument sent carries out the plastic, and makes the laser plastic that the light-emitting end of laser instrument sent is even parallel light, the work end of dust catcher is close to light processing component sets up, and is used for removing dust, adjusting element with the work end of dust catcher with light processing component connects, and can drive light processing component with the work end of dust catcher removes on the surface of mould.
2. The chip package mold laser cleaning apparatus according to claim 1, wherein: and a vibration isolation plate is fixed in the shell and is parallel to the horizontal plane, and the laser and the dust collector are fixed on the vibration isolation plate.
3. The chip package mold laser cleaning apparatus according to claim 1, wherein: the adjusting element is a mechanical arm.
4. The chip package mold laser cleaning apparatus according to claim 1, wherein: the upper end face of the shell is further provided with a controller, and the laser, the dust collector and the adjusting element are electrically connected with the controller and control the working state through the controller.
5. The chip package mold laser cleaning apparatus according to claim 1, wherein: the laser instrument with still install leaded light arm between the light-emitting end of laser instrument, the one end of leaded light arm with the light-emitting end of laser instrument is connected, the other end of leaded light arm with the light processing component is connected, and can to the light processing component leaded light.
6. The laser cleaning device for the chip package mold according to claim 5, wherein: the light guide arm is a seven-joint light guide arm.
7. The chip package mold laser cleaning apparatus according to claim 1, wherein: the light processing element is a shaper, the shaper comprises a processing shell, and a limiter, a convex lens and a concave lens which are sequentially arranged in the processing shell, the limiter is used for homogenizing the spot intensity emitted by the laser, and the convex lens and the concave lens are used for refracting divergent light emitted by the laser into parallel light.
8. The laser cleaning device for the chip package mold according to claim 1, wherein: still install the distancer on the outer wall of light processing component, the distancer is used for measuring the distance between light processing component and the mould.
9. The chip package mold laser cleaning apparatus according to claim 1, wherein: the lower end of the shell is also provided with universal wheels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210516254.3A CN115283364A (en) | 2022-05-12 | 2022-05-12 | Laser cleaning equipment for chip packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210516254.3A CN115283364A (en) | 2022-05-12 | 2022-05-12 | Laser cleaning equipment for chip packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115283364A true CN115283364A (en) | 2022-11-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210516254.3A Pending CN115283364A (en) | 2022-05-12 | 2022-05-12 | Laser cleaning equipment for chip packaging mold |
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| US6603790B1 (en) * | 2000-02-22 | 2003-08-05 | Hans Kodeda | Gas laser and a dedusting unit thereof |
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-
2022
- 2022-05-12 CN CN202210516254.3A patent/CN115283364A/en active Pending
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