CN115279124A - Cooling system and data center - Google Patents
Cooling system and data center Download PDFInfo
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- CN115279124A CN115279124A CN202210837127.3A CN202210837127A CN115279124A CN 115279124 A CN115279124 A CN 115279124A CN 202210837127 A CN202210837127 A CN 202210837127A CN 115279124 A CN115279124 A CN 115279124A
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- 238000001816 cooling Methods 0.000 title claims abstract description 122
- 238000005057 refrigeration Methods 0.000 claims abstract description 33
- 238000005507 spraying Methods 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 13
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 8
- 239000000110 cooling liquid Substances 0.000 claims description 8
- 238000004146 energy storage Methods 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 239000011737 fluorine Substances 0.000 claims description 8
- 238000005265 energy consumption Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 238000009423 ventilation Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 34
- 238000010586 diagram Methods 0.000 description 22
- 239000003507 refrigerant Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- 239000007921 spray Substances 0.000 description 8
- 239000002826 coolant Substances 0.000 description 7
- 230000005494 condensation Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a cooling system and a data center, which are used for radiating heat of a machine cabinet in a machine room, wherein the cooling system comprises a refrigeration unit, a heat exchanger, a first bypass valve and a second bypass valve; the heat exchanger exchanges heat with the indoor side flow passage through the outdoor side flow passage; the refrigeration unit is used for cooling the interior of the machine room through the condenser and the evaporator, a bypass passage of the non-working cooling component is formed through the design of the first bypass valve and the second bypass valve, different air flow ventilation channels can be selected according to the temperature requirement in the machine room, and therefore wind resistance and energy consumption are reduced, and the heat dissipation efficiency is improved.
Description
Technical Field
The application relates to the technical field of electronic power, in particular to a cooling system and a data center.
Background
The existing data center comprises independent cooling equipment and independent power supply equipment, the system integration level of the data center is low, the field installation workload is large, and the efficiency of refrigerating a machine room is also low.
Currently, cooling equipment in a data center, such as an indirect evaporative cooling unit (EHU), is disposed at a side of a machine room, and hot air in the machine room is sucked into an interior of the machine room, cooled by the cooling equipment, and then blown to the interior of the machine room by an end portion of the machine room, referring to fig. 1 and 2, fig. 1 is a top view of the data center including the cooling equipment, and fig. 2 is a perspective view of the data center including the cooling equipment. In addition, the cooling equipment can also be arranged at the bottom of the machine room.
Because cooling arrangement, power supply unit and computer lab are independent design respectively, cooling arrangement includes that air to air heat exchanger (air to air heat exchanger) and mechanical refrigeration (mechanical refregerating), and the installation distance between computer lab and the cooling arrangement is far away, consequently the distance of supplying air is overlength, the windage is too big, the energy consumption that causes is very high, and the power supply of computer lab also is independent design with cooling arrangement's power supply, consequently, power supply unit's area occupied also can increase, in addition, because computer lab and cooling arrangement are independent each other, the work load of on-the-spot installation above-mentioned equipment also can increase.
In view of the above, it is desirable to design a cooling system to reduce wind resistance of the wind, shorten the distance between the cooling device and the machine room, and reduce the amount of work required for on-site installation.
Disclosure of Invention
The application provides a cooling system and data center, can reduce the air supply windage, shorten the distance between cooling arrangement and the computer lab and reduce the engineering volume of on-the-spot installation.
In a first aspect, the present application provides a cooling system for dissipating heat from a cabinet inside a machine room, the cooling system including: the system comprises a refrigeration unit, a heat exchanger, a first bypass valve and a second bypass valve; the heat exchanger comprises an outdoor side flow channel and an indoor side flow channel; the outdoor side flow channel is communicated with the outside of the machine room and is used for being communicated with air outside the machine room; the indoor side flow passage is communicated with the inside of the machine room, and the outdoor side flow passage and the indoor side flow passage exchange heat; a refrigeration unit comprising: the air conditioner comprises a first evaporator, a first condenser, a second evaporator and a second condenser, wherein the first evaporator is arranged at an air outlet of an outdoor side flow channel, and the first condenser is communicated with the first evaporator; the second evaporator is arranged in the machine room, the second condenser is communicated with the second evaporator, and the heat exchanger, the first evaporator and the first condenser form a first air duct; the first bypass valve is arranged on one side of the indoor side flow passage, and the second bypass valve is arranged on the other side of the indoor side flow passage; when the first bypass valve is closed and the second bypass valve is closed, the heat exchanger, the second evaporator, the second condenser and the interior of the machine room form a second air duct; when the first bypass valve is closed and the second bypass valve is opened, the second evaporator, the second condenser and the interior of the machine room form a third air duct.
Utilize the cooling system that this application provided, can reduce the air supply windage by a wide margin, and this application fuses refrigeration plant and computer lab design, is showing the distance that has shortened refrigeration unit and rack, can also reduce the engineering volume of field installation, this application still through the design of first bypass valve and second bypass valve, as the bypass passageway of non-work cooling part, and can be according to the temperature requirement in the computer lab, select different air flow ventiduct, thereby reduce windage, energy consumption, in order to improve refrigeration efficiency.
As a possible implementation manner, when the first bypass valve is closed, the first end air opening of the indoor side flow passage is blocked from being connected to the air path inside the machine room, so that the first end air opening of the indoor side flow passage is connected to the air path inside the machine room through the second condenser, and when the first bypass valve is opened, the first end air opening of the indoor side flow passage is opened to be connected to the air path inside the machine room.
In one possible embodiment, when the second bypass valve is closed, the circulation of the internal air passage in the machine room is blocked to open the second port of the indoor side duct to be connected to the air passage in the machine room, and when the second bypass valve is opened, the circulation of the internal air passage in the machine room is opened. In this way, by switching the on/off state of the first bypass valve and the on/off state of the second bypass valve, the air passage can be adjusted.
As a possible embodiment, the cooling system further comprises: and the spraying unit is arranged at an air inlet of the outdoor side flow channel and is used for starting spraying to reduce the inlet air temperature of the outdoor side flow channel when the outside temperature of the machine room is higher than a target temperature threshold value. The spraying unit can comprise a spraying device/a spraying device which is communicated with the liquid storage tank, a water pump is arranged between a liquid inlet of the spraying assembly and a liquid outlet of the liquid storage tank, and the liquid storage tank is used for supplying liquid for the spraying device/the spraying device. The spraying device/spraying device can cool the first air in the outdoor side flow channel so as to improve the heat exchange effect between the air outside the machine room and the air in the machine room.
As a possible implementation manner, the air inlet of the outdoor side channel further comprises an air inlet valve, and the air inlet valve is used for adjusting the air volume entering the outdoor side channel.
As a possible implementation manner, the cooling system further includes a power conversion circuit, configured to convert the first alternating current provided by the power supply into a first direct current, convert the first direct current into a second alternating current and provide the second alternating current to the cabinet inside the machine room, and further convert the first direct current into a third alternating current to provide the third alternating current to the refrigeration unit.
As a possible embodiment, the cooling system further includes an energy storage battery, and a power conversion circuit, configured to convert a fourth direct current provided by the energy storage battery into a second alternating current and provide the second alternating current to a cabinet inside the machine room, and further convert the fourth direct current into a third alternating current and provide the third alternating current to the refrigeration unit. Therefore, the energy storage battery can be used as a standby power supply to supply power for the refrigeration unit and the cabinet.
In order to achieve a gas-liquid communication between the evaporator and the condenser, as a possible embodiment, a compressor is provided between the outlet of the first evaporator and the inlet of the first condenser and between the outlet of the second evaporator and the inlet of the second condenser.
In order to realize the gas-liquid circulation between the evaporator and the condenser, as a possible embodiment, a first circulation pump is arranged between the inlet of the first evaporator and the outlet of the first condenser, and a second circulation pump is arranged between the inlet of the second evaporator and the outlet of the second condenser.
As a possible embodiment, the first circulation pump and the second circulation pump are fluorine pumps. It can be a liquid floating fluorine pump without oil lubrication or a common fluorine pump, so as to reduce the energy consumption of the whole system.
As a possible embodiment, the first condenser and the second condenser are submerged condensers, and the first condenser and the second condenser are submerged in the cooling liquid. The coolant liquid absorbs the evaporation of gasification behind the heat that first condenser and second condenser distribute, and gaseous coolant liquid is after by cooling for gaseous coolant liquid liquefaction, and the bottom of liquid reserve tank is fallen back to liquid coolant liquid under the action of gravity, realizes the evaporation cooling circulation of coolant liquid.
In a second aspect, the present application provides a data center, comprising: a machine room and a cooling system as in any one of the first aspect for dissipating heat from a cabinet inside the machine room.
For the description of the technical effects that can be achieved by the second aspect, reference is made to the description of the technical effects that can be achieved by any one of the possible designs of the first aspect, and repeated descriptions are omitted.
Drawings
FIG. 1 is a top plan view of a data center including cooling equipment;
FIG. 2 is a perspective view of a data center including a cooling apparatus;
fig. 3A is a first schematic structural diagram of a cooling system according to an embodiment of the present disclosure;
FIG. 3B is a schematic perspective view of a heat exchanger I;
FIG. 3C is a schematic plan view of the outdoor side channel;
FIG. 3D is a perspective view of a second heat exchanger;
FIG. 3E is a schematic diagram of a planar structure of an indoor side flow channel;
fig. 3F is a schematic structural diagram of a cooling system according to an embodiment of the present application;
fig. 3G is a schematic structural diagram of a cooling system according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a cooling system according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a cooling system according to an embodiment of the present application;
fig. 6 is a schematic structural diagram six of a cooling system according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a power conversion circuit according to an embodiment of the present application;
fig. 8 is a schematic structural diagram seven of a cooling system according to an embodiment of the present application;
fig. 9A is a schematic structural diagram of a data center provided in an embodiment of the present application;
fig. 9B is a schematic structural diagram of a multi-tier stacking data center according to an embodiment of the present application;
fig. 9C is a schematic structural diagram of a multi-layer symmetric data center according to an embodiment of the present application;
fig. 9D is a side view of a multi-tiered symmetric data center provided by an embodiment of the present application.
Detailed Description
The existing data center comprises independent cooling equipment and independent power supply equipment, the system integration level of the data center is low, the field installation workload is large, and the efficiency of refrigerating a machine room is also low. In some scenarios, the cooling device is disposed on a side surface or a top portion of a data center machine room, and hot air in the machine room is cooled by the cooling device from an end portion and then is supplied into the machine room from the end portion. In this way, the cooling device is still a separate module, and thus the air supply distance is still long. Furthermore, the individual cooling devices are difficult to balance, resulting in uneven supply air temperature and supply air volume to each cabinet, and the room modules can only be stacked two levels when the cooling devices are arranged on top of the room modules.
In view of this, the embodiment of the present application provides a cooling system capable of dissipating heat for a cabinet inside a machine room. To solve the above problems. In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of this application and the appended claims, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, such as "one or more", unless the context clearly indicates otherwise.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.
Referring to fig. 3A, fig. 3A is a schematic structural diagram of a cooling system 300 according to an embodiment of the present disclosure, where the cooling system is used to cool air in a machine room. In some application scenarios, the computer room may be a computer room of a data center. The cooling system 300 may include a heat exchanger 301, and after the hot air in the machine room rises, the hot air and the outdoor cold air in the heat exchanger 301 exchange heat and cool, and then the hot air is sent back to the machine room, so that the air in the machine room is cooled by the outdoor low-temperature natural cold source through the heat exchanger 301.
The heat exchanger 301 includes an outdoor side flow channel and an indoor side flow channel, as shown in fig. 3B, fig. 3B is a perspective schematic view of a heat exchanger, the heat exchanger 301 may include a plurality of outdoor side flow channels 3011 arranged in parallel, the outdoor side flow channel 3011 has an outdoor side flow channel air inlet W1 and an outdoor side flow channel air outlet W2, as shown in fig. 3C, and fig. 3C is a schematic view of a plane structure of the outdoor side flow channel. The outdoor side flow channel air inlet W1 is used for allowing outdoor first air to flow into, the first air is used for cooling air in the indoor side flow channel 3012, and the outdoor side flow channel air outlet W2 is used for discharging the first air after being heated. In addition, as a possible implementation manner, the air inlet W1 of the outdoor side flow channel may further include an air inlet valve, and the air inlet valve is configured to adjust an air volume entering the outdoor side flow channel.
Referring to fig. 3D, fig. 3D is a perspective schematic view of a heat exchanger, the heat exchanger 301 may include a plurality of indoor side flow channels 3012 arranged in parallel, each indoor side flow channel 3012 has an indoor side flow channel air inlet N1 and an indoor side flow channel air outlet N2, as shown in fig. 3E, fig. 3E is a schematic view of a plane structure of the indoor side flow channel. The indoor side runner air inlet N1 is used for flowing in second air in the machine room, the outdoor side runner 3011 takes away heat of the second air to cool the second air, and the indoor side runner air outlet N2 is used for discharging the cooled second air into the machine room again to achieve air cooling inside the machine room.
As can be seen from fig. 3B and 3D, the outdoor side flow channel 3011 and the indoor side flow channel 3012 are isolated from each other, the outdoor side flow channel 3011 and the indoor side flow channel 3012 are located in different structural layers, the outdoor side flow channel 3011 and the indoor side flow channel 3012 are located in different height levels, when the air conditioner works, the first air circulates in the outdoor side flow channel 3011, the second air circulates in the indoor side flow channel 3012, and heat of the second air can be transferred to the first air through the heat exchange unit, so that the first air can absorb heat of taking away the second air, and air-air cooling heat exchange is achieved. The heat exchange unit can be made of a material with good heat conduction, such as aluminum or aluminum alloy. Among them, the heat exchanger 301 may include a plurality of outdoor side flow passages 3011 arranged in parallel and a plurality of indoor side flow passages 3012 arranged in parallel.
It should be understood that the perspective structures shown in fig. 3B and 3D are only examples, and in practical applications, there are other possible ways to realize the structure of the heat exchanger 301 as long as the first air in the outdoor side flow passage 3011 and the second air in the indoor side flow passage 3012 can exchange heat and cold.
As a possible implementation manner, fig. 4 is a schematic structural diagram of a cooling system provided in an embodiment of the present application; the cooling system 300 further includes: the spraying unit 401 is arranged at an air inlet W1 of the outdoor side flow channel 3011, and the spraying unit 401 is used for starting spraying to reduce the air inlet temperature of the outdoor side flow channel 3011 when the temperature outside the machine room is higher than a target temperature threshold.
Wherein, spray among the unit 401 can include spraying device/spray the device, spraying device/spray device and liquid reserve tank intercommunication, be provided with the water pump between the inlet that sprays the subassembly and the liquid outlet of liquid reserve tank, the liquid reserve tank is used for spraying device/spray the device and supply liquid. The spraying device/sprinkling device may cool the first air in the outdoor side flow passage 3011 to improve a heat exchange effect between air outside the machine room and air inside the machine room.
With continued reference to fig. 3A, the cooling system 300 further includes a refrigeration unit, the refrigeration unit includes a first evaporator 3021 and a first condenser 3022, the first evaporator 3021 is disposed at the air outlet W2 of the outdoor side flow channel 3011, and the first condenser 3022 is communicated with the first evaporator 3021. The heat exchanger 301, the first evaporator 3021, and the first condenser 3022 constitute a first air passage F1. The first air duct F1 is cooled by the first evaporator 3021 and the first condenser 3022.
The first evaporator 3021 is disposed at the outdoor side flow path outlet W2 to absorb heat of the first air. The liquid refrigerant in the first evaporator 3021 absorbs heat of the first air and is gasified into a gaseous refrigerant and transferred to the first condenser 3022, and the first condenser 3022 condenses the gaseous refrigerant into a liquid refrigerant and returns to the first evaporator 3021 again, thereby absorbing heat of the second air through a gas-liquid state transition. When the first condenser 3022 is specifically disposed, the air outlet W2 of the outdoor side flow channel 3011 may be avoided, so that the air resistance is not increased, and the circulation of the first air is facilitated, thereby improving the heat exchange efficiency between the first air and the second air.
As can be seen from fig. 3A, the first evaporator 3021 and the first condenser 3022 do not interfere with the outlet air of the outdoor side flow channel 3011, the wind resistance of the outdoor side flow channel 3011 is not increased, which is beneficial to the heat exchange between the first air and the second air, the temperature of the first air in the outdoor side flow channel 3011 is increased after the heat exchange of the second air, and the condensation effect of the first condenser 3022 on the air can dissipate heat, in this embodiment, the first condenser 3022 and the outdoor side flow channel 3011 do not interfere with each other, the first air absorbing the heat of the second air does not affect the condensation of the air into the liquid by the first condenser 3022, so that the first evaporator 3021 and the first condenser 3022 can achieve the circulating cooling of the second air.
The refrigeration unit further includes a second evaporator 3023 and a second condenser 3024, which may be installed in the machine room in the form of a wind wall, a room-level air conditioner, an overhead air conditioner, a back panel, or the like, in which case the second evaporator 3023 corresponds to an indoor unit and the second condenser 3024 corresponds to an outdoor unit. The distribution mode can further reduce the wind resistance of the system, thereby improving the energy efficiency. In specific implementation, the second evaporator 3023 can be selectively installed outdoors or indoors as needed to meet different usage scenarios.
In specific use, the boiling point of the refrigerant can be set to be close to the dew point temperature, so that the condensation temperature of the refrigeration unit can be further reduced, and a more efficient evaporative cooling effect is achieved. Alternatively, the cold water close to the evaporation cooling temperature may be directly sent to the first evaporator 3021 or the second evaporator 3023 to cool the first air.
With continued reference to fig. 3A, the cooling system 300 may include a first bypass valve 303 and a second bypass valve 304, wherein the first bypass valve 303 is disposed on one side of the indoor side flow passage 3012, and the second bypass valve 304 is disposed on the other side of the indoor side flow passage 3012. By adjusting the opening or closing of the first bypass valve 303 and the second bypass valve 304, the air passage is adjusted.
Referring to fig. 3F, fig. 3F is a schematic structural diagram of a cooling system according to an embodiment of the present disclosure; when the first bypass valve 303 is closed and the second bypass valve 304 is closed, the heat exchanger 301, the second evaporator 3023, the second condenser 3024, and the machine room interior constitute a second air passage F2.
Referring to fig. 3G, fig. 3G is a schematic structural diagram of a cooling system according to an embodiment of the present disclosure; when the first bypass valve 303 is closed and the second bypass valve 304 is opened, the second evaporator 3023, the second condenser 3024, and the machine room interior constitute a third air passage F3.
When first bypass valve 303 closes, block the first end wind gap of indoor side runner (be indoor side runner 3012 air outlet N2 in this application embodiment) with the inside wind path of computer lab is connected, so that the first end wind gap of indoor side runner 3012 passes through second condenser 3024 with the inside wind path of computer lab is connected when first bypass valve 303 opens, open the first end wind gap of indoor side runner with the inside wind path of computer lab is connected.
When the second bypass valve 304 is closed, the circulation of the internal air passage inside the machine room is blocked, so that the second end air inlet (the air inlet N1 of the indoor side flow passage 3012 in the embodiment of the present application) of the indoor side flow passage 3012 is opened to be connected to the air passage inside the machine room, and when the second bypass valve is opened, the circulation of the internal air passage inside the machine room is opened.
When the first bypass valve 303 is closed and the second bypass valve 304 is closed, after the second air duct F2 is formed by the heat exchanger 301, the second evaporator 3023 and the second condenser 3024, the heat exchanger 301 can exchange heat and cold with the first air in the outdoor side flow passage 3011 and the second air in the indoor side flow passage 3012, and further reduce the temperature inside the machine room through the condensation of the first evaporator 3021 and the first condenser 3022, and at the same time, because the first bypass valve 303 is closed, the first end air inlet of the indoor side flow passage is connected with the air duct inside the machine room through the first condenser 3022 to form a passage. Since the second condenser 3024 is disposed at the first end vent of the indoor side flow passage 3012, the second condenser 3024 can further absorb heat of the second air exhausted from the vent N2 of the indoor side flow passage 3012. The liquid refrigerant in the second evaporator 3023 absorbs heat of the second air and is gasified into a gaseous refrigerant and transferred to the second condenser 3024, thereby improving the cooling efficiency.
When the first bypass valve 303 is closed and the second bypass valve 304 is opened, the second evaporator 3023, the second condenser 3024 and the machine room form a third air passage F3, and then the second condenser 3024 absorbs heat of the third air in the third air passage F3. The liquid refrigerant in the second evaporator 3023 absorbs the heat of the second air and is gasified into a gaseous refrigerant, and transferred to the second condenser 3024.
As such, by switching the on/off state of the first bypass valve 303 and the on/off state of the second bypass valve 304, the air passage can be adjusted. It should be understood that the configuration shown in fig. 3A is only an example, and in practical applications, the first bypass valve 303 and the second bypass valve 304 may be in other positions, as long as different air paths can be adjusted or switched by adjusting the opening or closing of the first bypass valve 303 and the second bypass valve 304, which can be the purpose of the present application. The first bypass valve 303 is closed and the second bypass valve 304 is used for effectively bypassing the non-working cooling part, so that the wind resistance can be reduced, and the energy consumption is further reduced.
The operation of the cooling system provided by the embodiments of the present application will be described. In practical application, the cooling system has a plurality of working modes, and each working mode of the cooling system can be freely selected according to the temperature of a practical application scene. The following description will be made for each operation mode of the cooling system, wherein the operation temperature range corresponding to each operation mode is only used for reference and is not used as a practical limitation for the operation temperature range corresponding to each operation mode.
The temperature reduction mode can be selected according to the temperature inside the machine room, when the temperature outside the machine room is lower than a first temperature, the air-air heat exchange mode is started, heat exchange is realized between first air passing through the outdoor side flow channel 3011 and second air passing through the indoor side flow channel 3012, and when the temperature outside the machine room is higher than a target temperature threshold, spraying is started to reduce the inlet air temperature of the outdoor side flow channel. Under this strategy, only utilize outdoor low temperature nature cold source can cool down to the computer lab indoor to raise the efficiency, save the electric energy.
When the first evaporator 3021, the first condenser 3022, the second evaporator 3023, and the second condenser 3024 of the refrigeration unit are not started, the heat exchanger 301 in the cooling system 300 may implement an uncooled cooling mode, and implement heat exchange between the first air in the outdoor side flow channel 3011 and the second air in the indoor side flow channel 3012 (an air-to-air heat exchange mode), and when the temperature outside the room is higher than the target temperature threshold, start spraying to reduce the temperature of the intake air in the outdoor side flow channel (a spraying mode).
When the first evaporator 3021 and the first condenser 3022 of the refrigeration unit are started, the temperature inside the machine room is reduced through the first evaporator 3021 and the first condenser 3022 (a first cooling mode), and meanwhile, the heat exchanger 301 in the cooling system 300 may also implement a non-cooling mode, in which heat exchange is implemented between the first air passing through the outdoor side flow channel 3011 and the second air passing through the indoor side flow channel 3012 (an air-to-air heat exchange mode), and when the temperature outside the machine room is higher than a target temperature threshold, spraying is started to reduce the intake air temperature of the outdoor side flow channel (a spraying mode).
When the second evaporator 3023 and the second condenser 3024 of the refrigeration unit are started, the first bypass valve 303 is closed and the second bypass valve 304 is opened, the second condenser 3024 absorbs heat of the third air in the third air duct F3 to reduce the temperature inside the machine room (the second cooling and cooling mode), and meanwhile, the heat exchanger 301 in the cooling system 300 may also implement the non-cooling and cooling mode, and implement heat exchange between the first air passing through the outdoor side flow channel 3011 and the second air passing through the indoor side flow channel 3012 (the air-to-air heat exchange mode), and when the temperature outside the machine room is higher than the target temperature threshold, start spraying to reduce the intake air temperature of the outdoor side flow channel (the spraying mode).
When the refrigeration unit first evaporator 3021, first condenser 3022, second evaporator 3023, and second condenser 3024 are activated, the first bypass valve 303 is closed and the second bypass valve 304 is closed, the heat exchanger 301, the second evaporator 3023, the second condenser 3024, and the interior of the machine room form a second air duct F2, the temperature inside the machine room is reduced by the first evaporator 3021 and the first condenser 3022 (first cooling and cooling mode), the heat exchanger 3024 can also absorb heat of the third air in the third air duct F3 to reduce the temperature inside the machine room (second cooling and cooling mode), and the heat exchanger 301 in the cooling system 300 can also realize a non-cooling and cooling mode, and the first air through the outdoor side flow passage 3011 and the second air through the indoor side flow passage 3012 realize air intake (air-to-air heat exchange mode), and when the temperature outside the machine room is higher than a target temperature threshold, spray is activated to reduce the temperature of the outdoor side flow passage (spray mode).
When the outside temperature of the machine room is higher than the first temperature and lower than the second temperature, the first temperature is lower than the second temperature, and the spraying mode is started to reduce the air inlet temperature of the outdoor side runner while the air-air heat exchange mode is started. Under this strategy, utilize outdoor low temperature nature cold source + spray the mode that reduces the inlet air temperature to cool down to the computer lab indoor to raise the efficiency, save the electric energy.
When the outside temperature of the machine room is higher than the second temperature and lower than the third temperature, and the second temperature is lower than the third temperature, the air-air heat exchange mode is started, and at the same time, the spraying mode and/or the first cooling and cooling mode is selectively started, so that the temperature inside the machine room is reduced by absorbing the heat of the second air through the first evaporator 3021 and the first condenser 3022, and under this strategy, the air inside the machine room is cooled through the heat exchanger 301, the first evaporator 3021 and the first condenser 3022, respectively.
When the temperature outside the machine room is higher than the third temperature and lower than the fourth temperature, and the third temperature is lower than the fourth temperature, the air-air heat exchange mode is started, and simultaneously, the spraying mode is selectively started and/or the first cooling and cooling mode is started, the first bypass valve 303 is closed, and the second bypass valve 304 is closed, so that the second cooling and cooling mode is started, the heat of the second air is absorbed through the first evaporator 3021 and the first condenser 3022, and the heat of the third air is absorbed through the second evaporator 3023 and the second condenser 3024, so as to reduce the temperature inside the machine room, and in this strategy, the air corresponding to the inside of the machine room is cooled through the heat exchanger 301, the first evaporator 3021, the first condenser 3022, the second evaporator 3023 and the second condenser 3024, respectively, so that a better cooling effect is achieved.
As one possible embodiment of the present invention, referring to fig. 5, fig. 5 is a schematic configuration diagram of a cooling system, in which a compressor 500 and a tank 501 are disposed between an outlet of the first evaporator 3021 and an inlet of the first condenser 3022 and between an outlet of the second evaporator 3023 and an inlet of the second condenser 3024, and a coolant is stored in the tank 501, as shown in fig. 5. The compressor 500 may be disposed between an outlet of the first evaporator 3021 and an inlet of the first condenser 3022, and an outlet of the second evaporator 3023 and the second condenser 3024. Taking the first evaporator 3021 and the first condenser 3022 as an example, the compressor 500 sucks the gaseous refrigerant in the first evaporator 3021, compresses the gaseous refrigerant, increases the pressure of the gas, and sends the compressed gaseous refrigerant to the first condenser 3022. Here, the compressor 500 may be specifically an air suspension compressor or a general compressor, wherein the compressor 500 may be an oil-free compressor, which can improve the reliability of the cooling system 300.
As a possible embodiment, referring to fig. 6, fig. 6 is a schematic diagram of a sixth structure of the cooling system, a first circulation pump 601 is disposed between an inlet of the first evaporator 3021 and an outlet of the first condenser 3022, a second circulation pump 602 is disposed between an inlet of the second evaporator 3023 and an outlet of the second condenser 3024, and the first circulation pump 601 and the second circulation pump 602 may be fluorine pumps.
The first condenser 3022 and the second condenser 3024 condense the gaseous refrigerant into a liquid refrigerant, and return the liquid refrigerant to the first evaporator 3021 and the first evaporator 3023 again. The first and second circulation pumps 601 and 602 are provided in paths through which the first and second condensers 3022 and 3024 feed the liquid refrigerant to the first and second evaporators 3021 and 3023, respectively.
The first circulation pump 601 is disposed between an inlet of the first evaporator 3021 and an outlet of the first condenser 3022, the second circulation pump 602 is disposed between an inlet of the second evaporator 3023 and an outlet of the second condenser 3024, and the first circulation pump 601 and the second circulation pump 602 may be fluorine pumps, specifically, oil-free liquid floating fluorine pumps or ordinary fluorine pumps, so as to reduce energy consumption of the entire system.
In addition, the first condenser 3022 and the second condenser 3024 may be plate-type evaporative condensers or tube-type evaporative condensers, and in this case, the first condenser 3022 and the second condenser 3024 are provided in the liquid storage tank so as not to contact the coolant. In order to improve the heat dissipation effect on the condenser 22, the first condenser 3022 and the second condenser 3024 may also be a submerged condenser, the first condenser 3022 and the second condenser 3024 are immersed in the cooling liquid, and in the example of the submerged condenser, the cooling liquid absorbs the heat dissipated by the first condenser 3022 and the second condenser 3024 and is vaporized and evaporated, the gaseous cooling liquid is cooled to lower the temperature, so that the gaseous cooling liquid is liquefied, and the liquid cooling liquid flows back to the bottom of the liquid storage tank under the gravity effect, thereby implementing an evaporative cooling cycle of the cooling liquid.
With continued reference to fig. 3A, the cooling system 300 further includes a power conversion circuit 305, and the power conversion circuit 305 is configured to convert the first alternating current provided by the power supply into a first direct current, convert the first direct current into a second alternating current and provide the second alternating current to the cabinet inside the machine room, and further convert the first direct current into a third alternating current to provide the refrigeration unit.
The power conversion circuit 305 may include a direct current-to-direct current (AC/DC) circuit and a direct current-to-direct current (DC/AC) circuit, the DC/AC conversion unit and the AC-DC conversion unit may include a plurality of switching devices, and the switching devices may be one or more of various switching devices such as MOSFETs, bipolar Junction Transistors (BJTs), insulated Gate Bipolar Transistors (IGBTs), silicon carbide (SiC) power tubes, and the like. Each switching device may include a first electrode, a second electrode, and a control electrode, wherein the control electrode is for controlling the switching on or off of the switch. When the switch is turned on, current can be transmitted between the first electrode and the second electrode of the switch, and when the switch is turned off, current cannot be transmitted between the first electrode and the second electrode of the switch. Taking a MOSFET as an example, the control electrode of the switch is a gate, the first electrode of the switch may be the source of the switching device and the second electrode may be the drain of the switching device, or the first electrode may be the drain of the switch and the second electrode may be the source of the switch.
Referring to fig. 7, the cooling system 300 may include a first AC/DC circuit 701, a first DC/AC circuit 702, and a second DC/AC circuit 703, wherein an input terminal of the first AC/DC circuit 701 is connected to a power supply 704, and an output terminal of the first AC/DC circuit 701 is connected to an input terminal of the first DC/AC circuit 702 and an input terminal of the second DC/AC circuit 703, respectively. The output end of the first DC/AC circuit 702 is connected to the refrigeration unit for supplying power to the refrigeration unit 702, and the output end of the second DC/AC circuit 703 is connected to the cabinet for supplying power to the cabinet, and the power conversion circuit 305 of the present application can supply power to the refrigeration unit and the cabinet at the same time. Alternatively, the first AC/DC circuit 701, the first DC/AC circuit 702, and the second DC/AC circuit 703 in the power conversion circuit 305 may be located in the same cabinet, or may be separately arranged and securely connected to each other. Illustratively, the first AC/DC circuit 701 is a 300KW power module, the second DC/AC circuit 703 is a 50KW power module, and the amount of power in the first DC/AC circuit 702 is related to the operating power of the refrigeration unit.
As a possible implementation manner, the cooling system 300 further includes an energy storage battery, and the power conversion circuit 305 is configured to convert a fourth direct current provided by the energy storage battery into a second alternating current provided to the cabinet inside the machine room, and further convert the fourth direct current into a third alternating current provided to the refrigeration unit. The energy storage battery is used as a standby power supply to supply power for the refrigeration unit and the cabinet.
As a possible implementation manner, the cooling system 300 may be a symmetrical design, and is used for supplying power and dissipating heat for two symmetrical rows of cabinets inside a machine room, as shown in fig. 8, fig. 8 is a schematic structural diagram seven of a cooling system provided in this embodiment of the present application; the cooling system 300 may further include: second heat exchanger 801, third heat exchanger 802, third evaporator 803, third condenser 804, fourth evaporator 805, fourth condenser 806, fifth evaporator 807, fifth condenser 808, third bypass valve 809, fourth bypass valve 810, fifth bypass valve 811, and sixth bypass valve 812. The embodiment of the present application and the above embodiments are based on the same concept, and will not be described herein.
Utilize the cooling system that this application provided, can reduce the air supply windage by a wide margin, the cryogenic efficiency of lift system, and this application fuses refrigeration plant and computer lab design, show the distance that has shortened refrigeration unit and rack, can also reduce the engineering volume of on-the-spot installation, this application is still through the design of first bypass valve and second bypass valve, the bypass passageway as non-work cooling part, according to the temperature requirement in the computer lab, select different air flow ventilation ducts, thereby reduce the windage, the energy consumption, in order to improve refrigeration efficiency.
Based on the same concept, referring to fig. 9A, fig. 9A is a schematic structural diagram of a data center provided in the embodiment of the present application; the data center 900 includes: a cabinet 901 and a cooling system 300 as described in the above embodiments, wherein the cooling system 300 is used for dissipating heat from the cabinet 901.
The data center 900 may be installed in a manner of multi-layer stacking arrangement, as shown in fig. 9B, fig. 9B is a schematic structural diagram of a multi-layer stacking data center of the present application, in addition, the data center 800 may adopt multi-layer symmetrical arrangement, as shown in fig. 9C, fig. 9C is a schematic structural diagram of a multi-layer symmetrical data center of the present application, wherein the multi-layer symmetrical data center of fig. 9C uses the same exhaust duct, thereby saving area, and fig. 9D is a side view of the multi-layer symmetrical data center of the present application, and the data center 900 provided by the present application may implement flexible expansion, flexible design, and reduced floor space according to user needs. Exemplarily, in a data center cluster, if a plurality of data centers need to be installed, the layout is performed by using the existing prefabricated modules, a large area needs to be occupied, the layout can be performed by adopting a multi-layer and multi-column mode, and compared with the existing prefabricated module layout mode, the layout can save more than six times of occupied area, and the number of boxes can be reduced, thereby saving the cost.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (12)
1. A cooling system for dissipating heat from a cabinet inside a machine room, the cooling system comprising: the system comprises a refrigeration unit, a heat exchanger, a first bypass valve and a second bypass valve; the heat exchanger comprises an outdoor side flow channel and an indoor side flow channel; the outdoor side flow channel is communicated with the outside of the machine room and is used for communicating with the air outside the machine room; the indoor side flow channel is communicated with the interior of the machine room, and the outdoor side flow channel and the indoor side flow channel exchange heat;
the refrigeration unit, comprising: the air conditioner comprises a first evaporator, a first condenser, a second evaporator and a second condenser, wherein the first evaporator is arranged at an air outlet of an outdoor side flow channel, and the first condenser is communicated with the first evaporator; the second evaporator is arranged in the machine room, the second condenser is communicated with the second evaporator, and the heat exchanger, the first evaporator and the first condenser form a first air duct;
wherein the first bypass valve is provided at one side of the indoor-side flow passage, and the second bypass valve is provided at the other side of the indoor-side flow passage;
when the first bypass valve is closed and the second bypass valve is closed, the heat exchanger, the second evaporator, the second condenser and the machine room form a second air duct;
and when the first bypass valve is closed and the second bypass valve is opened, the second evaporator, the second condenser and the inside of the machine room form a third air duct.
2. The cooling system as claimed in claim 1, wherein when the first bypass valve is closed, the first end air inlet of the indoor side flow passage is blocked from being connected to the air passage inside the machine room, so that the first end air inlet of the indoor side flow passage is connected to the air passage inside the machine room through the second condenser, and when the first bypass valve is opened, the first end air inlet of the indoor side flow passage is opened to be connected to the air passage inside the machine room.
3. The cooling system according to claim 1 or 2, wherein when the second bypass valve is closed, the internal air passage circulation in the machine room is blocked to open the second port of the indoor side duct to be connected to the air passage in the machine room, and when the second bypass valve is opened, the internal air passage circulation in the machine room is opened.
4. The cooling system according to any one of claims 1 to 3, further comprising: the spraying unit is arranged at the air inlet of the outdoor side runner and used for starting spraying to reduce the air inlet temperature of the outdoor side runner when the external temperature of the machine room is higher than a target temperature threshold value.
5. The cooling system as claimed in any one of claims 1 to 4, wherein the air inlet of the outdoor side flow path further comprises an air inlet valve for adjusting an amount of air entering the outdoor side flow path.
6. The cooling system according to any one of claims 1 to 5, further comprising: the power conversion circuit is used for converting first alternating current provided by the power supply into first direct current, converting the first direct current into second alternating current and providing the second alternating current for the cabinet inside the machine room, and converting the first direct current into third alternating current and providing the third alternating current for the refrigeration unit.
7. The cooling system according to claim 6, wherein the cooling system further comprises an energy storage battery, and the power conversion circuit is configured to convert a fourth dc power provided by the energy storage battery into a second ac power and provide the second ac power to the cabinet inside the machine room, and further convert the fourth dc power into a third ac power and provide the third ac power to the refrigeration unit.
8. A cooling system according to any one of claims 1-7, characterised in that a compressor is arranged between the outlet of the first evaporator and the inlet of the first condenser and between the outlet of the second evaporator and the inlet of the second condenser.
9. The cooling system according to any one of claims 1 to 8, wherein a first circulation pump is provided between an inlet of the first evaporator and an outlet of the first condenser, and a second circulation pump is provided between an inlet of the second evaporator and an outlet of the second condenser.
10. The cooling system of claim 9, wherein the first and second circulation pumps are fluorine pumps.
11. The cooling system according to any one of claims 1 to 10, wherein the first condenser and the second condenser are submerged condensers, the first condenser and the second condenser being submerged in a cooling liquid.
12. A data center, comprising: a machine room and a cooling system as claimed in any one of claims 1 to 11 for dissipating heat from a cabinet inside the machine room.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210837127.3A CN115279124A (en) | 2022-07-15 | 2022-07-15 | Cooling system and data center |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210837127.3A CN115279124A (en) | 2022-07-15 | 2022-07-15 | Cooling system and data center |
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| CN115279124A true CN115279124A (en) | 2022-11-01 |
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| CN204629718U (en) * | 2015-03-19 | 2015-09-09 | 合肥天鹅制冷科技有限公司 | The shelter air conditioner device of refrigerating operaton in low temperature environment |
| CN205351609U (en) * | 2016-01-13 | 2016-06-29 | 腾讯科技（深圳）有限公司 | Computer lab air cooling apparatus |
| WO2017193851A1 (en) * | 2016-05-10 | 2017-11-16 | 比亚迪股份有限公司 | Heat pump air-conditioning system and electric vehicle |
| CN208886944U (en) * | 2018-09-18 | 2019-05-21 | 广东一也节能科技有限公司 | A kind of data center's moistening and lowering temperature system |
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2022
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204629718U (en) * | 2015-03-19 | 2015-09-09 | 合肥天鹅制冷科技有限公司 | The shelter air conditioner device of refrigerating operaton in low temperature environment |
| CN205351609U (en) * | 2016-01-13 | 2016-06-29 | 腾讯科技（深圳）有限公司 | Computer lab air cooling apparatus |
| WO2017193851A1 (en) * | 2016-05-10 | 2017-11-16 | 比亚迪股份有限公司 | Heat pump air-conditioning system and electric vehicle |
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