CN115274571A - Semiconductor packaging module with tilting component - Google Patents
Semiconductor packaging module with tilting component Download PDFInfo
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- CN115274571A CN115274571A CN202211204773.2A CN202211204773A CN115274571A CN 115274571 A CN115274571 A CN 115274571A CN 202211204773 A CN202211204773 A CN 202211204773A CN 115274571 A CN115274571 A CN 115274571A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging module with a tilting component. The semiconductor chip packaging structure comprises a substrate and a semiconductor chip fixed on the substrate, wherein a packaging body is arranged on the substrate, the semiconductor chip fixed on the substrate is packaged through the packaging body, a cavity is formed in the periphery of the semiconductor chip, and the semiconductor chip is upwards matched with the substrate in an inserting mode through a sleeve piece arranged on the periphery of the semiconductor chip from the bottom. The support is used for carrying a lead frame with a connecting part and a tilting part, a fulcrum is provided for the lead frame to form a lever structure, the connecting part is pressed downwards in the process of attaching the packaging body and the substrate, then the tilting part naturally jacks up by utilizing the lever principle, and the tilting part at the jack-up drives the sleeve to move upwards to seal the substrate.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging module with a tilting component.
Background
The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, particularly a material with controllable conductivity ranging from the insulator to the conductor, and is a chip commonly used as a semiconductor material, and with continuous pursuit of working frequency of a packaged semiconductor chip, a wide bandgap semiconductor material represented by gallium nitride (GaN), silicon carbide (SiC) and the like is widely applied to the field of semiconductor packaging because of the advantages of high power density (10-30 times of a second generation semiconductor material such as gallium arsenide, indium phosphide and the like), high breakdown voltage, high electronic saturation drift velocity, small volume, light weight and the like, and has excellent electrical and optical characteristics and good chemical stability.
The problem that electric breakdown or electric leakage exist because of too big operating current has been solved in chinese patent utility model with publication number CN203746820U, specifically provides a semiconductor packaging unit, include: a semiconductor chip, a substrate on which the semiconductor chip is mounted, and a package member packaged on the substrate; the packaging member fixes the semiconductor chip on the substrate, and a cavity is formed between the interior of the packaging member and the outer surface of the semiconductor chip. A cavity is formed between the interior of the packaging component and the outer surface of the semiconductor chip, and the electrical insulation performance between the semiconductor chip and the packaging component is enhanced by utilizing the cavity, so that the occurrence of electrical breakdown and electric leakage can be effectively prevented, and the reliability and the safety of the semiconductor packaging component are improved. Meanwhile, due to the existence of the cavity, the semiconductor chip is not directly contacted with the packaging member, so that the influence on the reliability of the semiconductor packaging unit caused by the internal thermal stress of the packaging member can be effectively reduced.
However, once the cavity is formed, the problem of tightness has to be considered, because the semiconductor chip is fixed on the substrate in a welding mode, the structure of the substrate is inevitably damaged in the welding process, because the substrate cooled after high temperature is likely to generate cracks or pores, so that the tightness of the substrate is influenced, and the joints of the leads and the pins are in the package body, so that the connection of the leads and the pins is influenced when the package body receives vibration or cracks, so that the capacity of preventing electric breakdown and electric leakage is reduced.
Disclosure of Invention
The present invention is directed to a semiconductor package module with a tilting assembly to solve the above problems.
In order to achieve the above object, a semiconductor package module with a tilting component is provided, which includes a substrate and a semiconductor chip fixed on the substrate, wherein a package body is arranged on the substrate, the semiconductor chip fixed on the substrate is packaged by the package body, a cavity is formed at the periphery of the semiconductor chip, and the semiconductor chip is in plug-in fit with the substrate from bottom to top through a sleeve member arranged at the periphery of the semiconductor chip;
be provided with the perk subassembly in the cavity, the perk subassembly comprises a plurality of pairs of support and lead frame, the support is used for carrying the lead frame that has connecting portion and perk portion, and right the lead frame provides a fulcrum and forms lever structure, with the in-process of packaging body and substrate laminating: the upwarping part drives the sleeve to move upwards to seal the substrate.
As a further improvement of the technical scheme, the lead frame connecting part is connected with the semiconductor chip through a lead, and the point where the lead is connected with the lead frame connecting part is positioned in the cavity.
As a further improvement of the present technical solution, the kit disposed at the periphery of the semiconductor chip is a supporting plate, the periphery of the supporting plate is provided with a supporting plate outer edge, an opening is disposed in the substrate, an opening inner edge is disposed at the inner side of the opening, the supporting plate and the opening inner edge are in plug-in fit, and the supporting plate outer edge is blocked by the opening inner edge from moving upwards, wherein:
the outer edge of the supporting plate is provided with a rubber pad;
the periphery of the supporting plate is provided with a connecting groove, and the connecting groove is used for being in butt joint with the tilting part.
As the further improvement of this technical scheme, the support includes the back shaft and sets up the curb plate in the back shaft both sides, the lead frame comprises outer pin, inner pin and effect foot, wherein:
the outer pin and the inner pin form a connecting part of the lead frame, the inner pin is of a V-shaped structure, and the inner pin is used for being connected with the supporting shaft;
the action foot constitutes the perk portion of lead frame alone.
As a further improvement of the technical scheme, a hot melt plate is arranged at the bottom of the periphery of the packaging body.
As a further improvement of the technical scheme, a seal is arranged at the bottom of the packaging body, a groove is reserved at the position, corresponding to the lead frame connecting part, of the seal, and a seal groove connected with the seal is arranged on the substrate.
As a further improvement of the technical scheme, a sinking groove is formed in the position, corresponding to the lead frame connecting part, of the substrate.
As a further improvement of the present technical solution, the bottom of the substrate is provided with solder balls.
As a further improvement of the technical scheme, a falling space is formed at the bottom of the supporting plate under the support of the welding balls, so that the connecting groove is in a position of abutting joint with the tilting part when the supporting plate is attached to the supporting surface.
As a further improvement of the technical scheme, the connecting groove comprises an entering groove and a clamping groove, the entering groove is located on the outer side, the clamping groove is located on the inner side, and the entering groove is provided with an oblique angle relative to the clamping groove so as to clamp the butted tilting part.
Compared with the prior art, the invention has the beneficial effects that:
1. in this semiconductor package module with perk subassembly, the support is arranged in carrying the lead frame that has connecting portion and perk portion to provide a fulcrum to the lead frame and form lever structure, connecting portion can be pushed down at the in-process of packaging body and base plate laminating, then utilize lever principle perk portion to push up naturally, the perk portion that pushes up drives the external member and shifts up and seal the base plate, solve the problem that causes the base plate to appear crack or hole influence leakproofness because of the welding through the mode of external member and base plate grafting.
2. In the semiconductor packaging module with the tilting assembly, the lead frame connecting part is connected with the semiconductor chip through the lead, and the point where the lead is connected with the lead frame connecting part is positioned in the cavity, so that the contact of the lead is separated from the package of the packaging body, the lead is positioned in the cavity, and the influence of the packaging body on the contact is reduced.
3. In the semiconductor packaging module with the tilting assembly, the semiconductor chip is not directly fixed on the substrate but arranged on the supporting plate, so that the thickness of the supporting plate can be increased to protect the semiconductor chip no matter how thin the substrate is arranged, and the situations of electric breakdown and electric leakage are prevented.
4. In the semiconductor package module with the tilting assembly, the semiconductor chip is separated from the substrate by the blade, so that the damage of the substrate, such as bending or bending caused by collision, does not affect the semiconductor chip, but is protected by the thicker blade.
5. In this semiconductor package module with wane subassembly, outer pin, inner pin and effect foot all are in the atress state, and this state can bring prestressing force for outer pin, inner pin and effect foot, and the compressive capacity of outer pin, inner pin and effect foot all can obtain improving at the collision in-process.
6. In the semiconductor packaging module with the tilting assembly, the supporting plate has a falling space through the support of the solder balls, so that the connecting groove is positioned at the butt joint position of the acting pin after the supporting plate is attached to the supporting surface, and the butt joint is more convenient.
7. In this semiconductor package module with perk subassembly, the curb plate can support the packaging body of deformation, prevents that the packaging body from further deforming, protects the solder ball.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an exploded view of the overall construction of the present invention;
FIG. 3 is a schematic view of a semiconductor chip structure according to the present invention;
FIG. 4 is a schematic diagram of a package structure according to the present invention;
FIG. 5 is a top view of a substrate according to the present invention;
FIG. 6 is a schematic view of a stent structure according to the present invention;
FIG. 7 is a schematic view of a lead frame structure according to the present invention;
FIG. 8 is a bottom view of the substrate of the present invention;
FIG. 9 is a schematic side view of a package to be packaged according to the present invention;
FIG. 10 is an enlarged view of the structure at A of FIG. 9;
fig. 11 is a schematic side view of the packaged package according to the present invention.
The various reference numbers in the figures mean:
100. a package body;
110. a seal; 110A, slotting; 100a, a melt plate;
200. a substrate;
210. a support; 211. a side plate; 212. a support shaft; 220. a lead frame; 220a, outer pins; 220b, inner pins; 220c, acting on feet; 230. a lead wire;
200A, a seal groove; 200B, sinking a groove; 200C, opening; 200a, an open inner edge; 200b, solder balls;
300. a semiconductor chip;
310. a support plate; 311. the outer edge of the supporting plate; 320. a rubber pad;
310A, a card slot; 310B into the slot.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
In addition, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, and particularly is a material with controllable conductivity ranging from the insulator to the conductor, and a chip is commonly used as a semiconductor material.
To this end, the present invention provides a semiconductor package module with a lift-up component, as shown in fig. 1 and 2, the semiconductor package module includes a package body 100, a substrate 200 and a semiconductor chip 300, as in the prior art: the semiconductor chip 300 is fixed on the substrate 200, and the semiconductor chip 300 fixed on the substrate 200 is packaged by the package body 100, and a cavity is formed at the periphery of the semiconductor chip 300, and the cavity is formed by connecting the package body 100 and the substrate 200; the difference from the prior art lies in that: the semiconductor chip 300 is matched with the substrate 200 in an inserting manner from bottom to top through a sleeve arranged on the periphery of the semiconductor chip 300, in addition, a tilting assembly is arranged in the cavity, the tilting assembly is provided with a plurality of groups, and is specifically arranged according to the pin arrangement condition of the semiconductor chip 300, the invention is explained in a way of arranging pins on the periphery, but the pin arrangement mode is not limited to the peripheral arrangement, so that the repeated description is omitted, the tilting assembly consists of a plurality of pairs of supports 210 and lead frames 220 (the number of pairs of the supports 210 and the lead frames 220 is determined according to the number of the pins in each row, and it needs to be explained here that the lead frames 220 in the invention are also the pins), the supports 210 are used for carrying the lead frames 220 with connecting parts and tilting parts, and provide a fulcrum for the lead frames 220 to form a lever structure, the connecting parts are pressed down in the process of attaching the package body 100 and the substrate 200, and then the tilting parts naturally lift up by utilizing the lever principle, and the tilting parts on the top drive the sleeve to move up to seal the substrate 200;
the connection portion of the lead frame 220 is connected with the semiconductor chip 300 through the lead 230, and the connection point of the lead 230 and the connection portion of the lead frame 220 is located in the cavity, so that the contact of the lead 230 is separated from the package of the package body 100 and is located in the cavity, the influence of the package body 100 on the contact is reduced, and the problem that the substrate 200 is cracked or has pores to influence the sealing performance due to welding is solved by inserting the kit and the substrate 200.
On the basis of the above-described structure, the present invention shows a first embodiment of the present invention through figures 3-10,
in fig. 3, the external member disposed on the periphery of the semiconductor chip 300 is a supporting plate 310, the semiconductor chip 300 is disposed on the supporting plate 310, the bottom periphery of the supporting plate 310 is disposed with a supporting plate outer edge 311, and in cooperation therewith: as shown in fig. 5, an opening 200C is formed in the substrate 200, an opening inner edge 200a is formed on the inner side of the top of the opening 200C, the supporting plate 310 is inserted into the opening inner edge 200a, and the opening inner edge 200a blocks the supporting plate outer edge 311 from moving upward, so that the supporting plate 310 inserted upward from the bottom is limited by the opening inner edge 200a, and moreover, a rubber pad 320 is disposed on the supporting plate outer edge 311, once the supporting plate outer edge 311 is limited by the opening inner edge 200a, the rubber pad 320 can be tightly attached to the opening inner edge 200a, so as to achieve a sealing effect, and the environment around the substrate 200 is not changed in the whole process, that is, no welding is required, and the substrate 200 does not go through the process of changing temperature to low temperature.
In fig. 6, the bracket 210 includes two side plates 211 and two support shafts 212, the two side plates 211 are respectively disposed on two sides of the support shafts 212, and in fig. 7, the lead frame 220 is composed of an outer pin 220a, an inner pin 220b and an acting pin 220c, in which: the outer lead 220a and the inner lead 220b constitute a connection portion of the lead frame 220, the operation lead 220c alone constitutes a tilting portion of the lead frame 220, and the inner lead 220b has a "V" shaped structure.
The side plate 211 in this embodiment is fixed to the base plate 200.
The working principle is as follows:
the supporting plate 310 on which the semiconductor chip 300 is mounted needs to be inserted into the opening 200C of the substrate 200, which is different from the conventional method of fixing the semiconductor chip 300 to the substrate 200, and the differences are as follows:
first, the semiconductor chip 300 is not directly fixed on the substrate 200, but is disposed on the supporting plate 310, so that no matter how thin the substrate 200 is disposed (the substrate 200 and the package 100 are both relatively thin because of the requirement for the chip volume), the semiconductor chip 300 can be protected by increasing the thickness of the supporting plate 310 (because the thickness of the supporting plate 310 does not affect the space formed by the cavity, only the occupied space of the supporting plate is increased, and the occupied space of the supporting plate does not affect the mounting of the tilting component), and meanwhile, the occurrence of electrical breakdown and electrical leakage can be prevented;
secondly, the semiconductor chip 300 is separated from the substrate 200 by the supporting plate 310, so that the damage of the substrate 200, such as bending or bending caused by collision, does not affect the semiconductor chip 300, but is protected by the thicker supporting plate 310;
thirdly, the insertion manner only needs to insert the supporting plate 310 into the opening 200C without considering the position of the semiconductor chip 300 fixed on the substrate 200, so that the production is more convenient;
then, the action pins 220c are inserted into the connecting slots arranged on the periphery of the supporting plate 310, and the notches at the bottoms of the "V" shaped inner pins 220b are lapped on the supporting shaft 212, at this time, the side plates 211 can limit the inner pins 220b to prevent the inner pins 220b from being separated from the supporting shaft 212, and at this time, the outer pins 220a are in a tilted state, as shown in fig. 9, the package 100 is covered on the substrate 200 along the direction indicated by the arrow a, the lower edge of the package 100 presses the outer pins 220a to be attached to the substrate 200 in the covering process, that is, the main bodies of the outer pins 220a are exposed outside the cavity (the inner pins 220b for connecting with the leads 230 are completely in the cavity, so that the connection between the leads 230 and the inner pins 220b is not affected by the package 100, and the side plates 211 can also support the deformed package 100 to prevent the package 100 from being further deformed and protect the solder balls 200 b), and the outer pins 220a are used for connecting with the integrated circuit board;
when the outer leads 220a are attached to the substrate 200, the inner leads 220b, which are pivoted by the support shaft 212, rotate, the portion of the inner leads 220b connected to the outer leads 220a rotates along the direction indicated by the arrow b, and the portion of the inner leads 220b connected to the action pins 220c drives the action pins 220c to jack up along the direction indicated by the arrow c (that is, the two portions of the inner leads 220b connected to the outer leads 220a and the action pins 220c form a V-shaped inner lead 220 b), because the action pins 220c are connected to the connecting groove on the periphery of the supporting plate 310, the jack-up action pins 220c drive the supporting plate 310 to move upwards (because the semiconductor chip 300 is arranged on the supporting plate 310, the supporting plate 310 moves upwards synchronously) until the outer leads 220a are attached to the substrate 200, and two nodes are generated after the attachment, wherein one of the two nodes, the package 100 and the substrate 200, can perform a fixing operation, and the embodiment directly welds the two nodes; secondly, the upward moving distance of the outer edge 311 of the supporting plate reaches the limit, at this time, the rubber pad 320 is in a pressed state under the blocking of the inner edge 200a of the opening, the pressed rubber pad 320 fills up the surrounding gap to achieve the sealing effect, and at this time, no matter the outer pin 220a, the inner pin 220b or the acting pin 220c is in an acting state, the state can bring prestress to the outer pin 220a, the inner pin 220b and the acting pin 220c, the pressure resistance of the outer pin 220a, the inner pin 220b and the acting pin 220c is improved in the collision process, and finally, the state of packaging the semiconductor chip 300 by the package body 100 and the substrate 200 is as shown in fig. 11.
Furthermore, fig. 11 shows a second embodiment of the invention,
in fig. 11, a thermal melting plate 100a is disposed at the bottom of the periphery of the package 100 so as to directly connect the package 100 and the substrate 200 through the thermal melting plate 100a heated, and the thermal melting plate 100a covers the outer leads 220a so that the melted thermal melting plate 100a can integrally connect the package 100, the substrate 200 and the outer leads 220a, which can improve the sealing property of the connection between the package 100 and the outer leads 220a and the stability of the bonding between the outer leads 220a and the substrate 200.
Figures 4 and 5 also show a third embodiment of the invention,
in fig. 4, a seal 110 is disposed at the bottom of the package body 100, a slot 110A is reserved at a position of the seal 110 corresponding to a connection portion of the lead frame 220 (i.e., a position of the outer pin 220A), in fig. 5, a seal groove 200A is disposed on the substrate 200, when the package body 100 is covered on the substrate 200, the seal 110 needs to be clamped into the seal groove 200A, on one hand, the position of the package body 100 attached to the substrate 200 is located, on the other hand, the seal groove 200A is filled through the seal 110, so as to improve the sealing property of the connection between the package body 100 and the substrate 200, and in fig. 5, a sinking groove 200B is disposed at a position of the substrate 200 corresponding to the connection portion of the lead frame 220 (i.e., a position of the outer pin 220A), so that the outer pin 220A attached to the substrate 200 can enter the sinking groove 200B, and the outer pin 220A is restricted by the sinking groove 200B, thereby improving the stability of the package body after packaging.
Figures 8 and 9 show a fourth embodiment of the invention,
in fig. 8, the bottom of the substrate 200 is provided with solder balls 200B, which mainly aim to facilitate the mounting of the substrate 200 on the ic board, and fig. 9 also shows another function of the solder balls 200B, the supporting plate 310 has a falling space through the support of the solder balls 200B, so that when the supporting plate 310 is attached to the supporting surface, the receiving slot is in a position of being butted with the acting pin 220c, which is more convenient for butting, and as shown in fig. 10, the receiving slot includes an entering slot 310B and a catching slot 310A, the entering slot 310B is located at the outer side, the catching slot 310A is located at the inner side, and the entering slot 310B has an oblique angle relative to the catching slot 310A, which can catch the butted acting pin 220c, and then the acting pin 220c is separated from the entering slot 310B and enters the catching slot 310A until completely entering the catching slot 310A with the acting pin 220c being jacked up.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, which fall within the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides a semiconductor package module with perk subassembly, its includes base plate (200) and fixes semiconductor chip (300) on base plate (200), be provided with packaging body (100) on base plate (200), through packaging body (100) is to fixing semiconductor chip (300) on base plate (200) and semiconductor chip (300) periphery formation cavity, its characterized in that: the semiconductor chip (300) is in plug fit with the substrate (200) from bottom to top through a sleeve arranged on the periphery of the semiconductor chip;
be provided with the perk subassembly in the cavity, the perk subassembly comprises a plurality of pairs of support (210) and lead frame (220), support (210) are used for carrying lead frame (220) that have connecting portion and perk portion, and right lead frame (220) provide a fulcrum and form lever structure, with the in-process of packaging body (100) and base plate (200) laminating: the upturned part on the upper top drives the sleeve to move upwards to seal the substrate (200).
2. The semiconductor package module with the tilting assembly according to claim 1, wherein: the lead frame (220) connecting part is connected with the semiconductor chip (300) through a lead (230), and the point where the lead (230) is connected with the lead frame (220) connecting part is positioned in the cavity.
3. The semiconductor package module with the tilting assembly according to claim 1, wherein: the external member that semiconductor chip (300) periphery set up is layer board (310), the periphery of layer board (310) is provided with layer board outer fringe (311), open mouth (200C) has been seted up in base plate (200), the inboard of open mouth (200C) is provided with opening inner edge (200 a), layer board (310) and opening inner edge (200 a) plug-in fit, through opening inner edge (200 a) block layer board outer fringe (311) and shift up, wherein:
a rubber pad (320) is arranged on the outer edge (311) of the supporting plate;
the periphery of the supporting plate (310) is provided with a connecting groove, and the connecting groove is used for being in butt joint with the tilting portion.
4. The semiconductor package module with the tilting assembly according to claim 1, wherein: the support (210) includes support shaft (212) and sets up curb plate (211) in support shaft (212) both sides, lead frame (220) constitute by outer pin (220 a), interior pin (220 b) and effect foot (220 c), wherein:
the outer pin (220 a) and the inner pin (220 b) form a connecting part of the lead frame (220), the inner pin (220 b) is of a V-shaped structure, and the inner pin (220 b) is used for being connected with the supporting shaft (212);
the action foot (220 c) independently forms a tilting part of the lead frame (220).
5. The semiconductor package module with the tilt assembly of claim 1, wherein: the bottom of the periphery of the packaging body (100) is provided with a hot melting plate (100 a).
6. The semiconductor package module with the tilt assembly of claim 1, wherein: the packaging structure is characterized in that a seal (110) is arranged at the bottom of the packaging body (100), a groove (110A) is reserved in the position, corresponding to the connecting portion of the lead frame (220), of the seal (110), and a seal groove (200A) connected with the seal (110) is formed in the substrate (200).
7. The semiconductor package module with the tilt assembly of claim 1, wherein: a sunken groove (200B) is formed in the position, corresponding to the connecting portion of the lead frame (220), of the substrate (200).
8. The semiconductor package module with the tilt assembly of claim 3, wherein: and the bottom of the substrate (200) is provided with a solder ball (200 b).
9. The semiconductor package module with the tilting assembly according to claim 8, wherein: under the support of the solder balls (200 b), a falling space is formed at the bottom of the supporting plate (310) so that the connecting groove is in a position of abutting against the tilting part when the supporting plate (310) is attached to the supporting surface.
10. The semiconductor package module with the tilting assembly according to claim 3, wherein: the connecting groove comprises an entering groove (310B) and a clamping groove (310A), the entering groove (310B) is located on the outer side, the clamping groove (310A) is located on the inner side, and the entering groove (310B) has an oblique angle relative to the clamping groove (310A) so as to clamp the butted tilting portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211204773.2A CN115274571B (en) | 2022-09-30 | 2022-09-30 | Semiconductor packaging module with tilting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211204773.2A CN115274571B (en) | 2022-09-30 | 2022-09-30 | Semiconductor packaging module with tilting component |
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| Publication Number | Publication Date |
|---|---|
| CN115274571A true CN115274571A (en) | 2022-11-01 |
| CN115274571B CN115274571B (en) | 2022-12-16 |
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| CN202211204773.2A Active CN115274571B (en) | 2022-09-30 | 2022-09-30 | Semiconductor packaging module with tilting component |
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| CN1334603A (en) * | 2000-06-28 | 2002-02-06 | 国际商业机器公司 | Planar plastic packaged module of integrated circuit |
| US20050199985A1 (en) * | 2004-01-29 | 2005-09-15 | Tan Xiaochun | Semiconductor device with interlocking clip |
| CN110556303A (en) * | 2019-09-06 | 2019-12-10 | 东和半导体设备(南通)有限公司 | semiconductor packaging mold and packaging process thereof |
| CN216375759U (en) * | 2021-11-12 | 2022-04-26 | 韦峰 | Sealed lever reverse drive structure of using |
-
2022
- 2022-09-30 CN CN202211204773.2A patent/CN115274571B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1334603A (en) * | 2000-06-28 | 2002-02-06 | 国际商业机器公司 | Planar plastic packaged module of integrated circuit |
| US20050199985A1 (en) * | 2004-01-29 | 2005-09-15 | Tan Xiaochun | Semiconductor device with interlocking clip |
| CN110556303A (en) * | 2019-09-06 | 2019-12-10 | 东和半导体设备(南通)有限公司 | semiconductor packaging mold and packaging process thereof |
| CN216375759U (en) * | 2021-11-12 | 2022-04-26 | 韦峰 | Sealed lever reverse drive structure of using |
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| CN115274571B (en) | 2022-12-16 |
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