CN115268608A - Host and industrial control system - Google Patents

Abstract

The invention relates to the technical field of automation, in particular to a host and an industrial control system, wherein the host comprises: the computer case comprises a case, a first switch and a second switch, wherein one side of the case is provided with a first opening; the mainboard is arranged in the case, one surface of the mainboard, which faces the first opening, is provided with a first chip, a second chip and a circuit element, the thickness of the first chip is smaller than that of the second chip, and the thickness of the second chip is smaller than the maximum thickness of the circuit element; the heat dissipation cover is covered at the first opening, the first chip is connected with the inner wall of the heat dissipation cover through the first heat conduction block, the first heat conduction block is used for transferring heat of the first chip to the heat dissipation cover, a heat conduction medium is filled between the second chip and the inner wall of the heat dissipation cover, the heat conduction medium is used for transferring heat of the second chip to the heat dissipation cover, and the circuit element is in contact with the inner wall of the heat dissipation cover. Through the mode, the heat dissipation efficiency of the components in the host can be improved.

Description

Host and industrial control system

Technical Field

The invention relates to the technical field of automation, in particular to a host and an industrial control system.

Background

With the rapid development of intellectualization, the application of the host in the fields of industrial production and the like is increasingly wide. For a fan-free host, because the tightness of the host needs to be ensured, heat generated by electrical elements on the mainboard needs to be transferred to the heat dissipation cover through the heat conduction block, and the heat conduction block is generally made of metal, so that the heat resistance is high, and the heat dissipation efficiency is low.

Disclosure of Invention

In view of the above problems, the present invention provides a host and an industrial control system, which can improve the heat dissipation efficiency of components inside the host.

According to an aspect of the present invention, there is provided a host comprising: the computer case comprises a case, a first switch and a second switch, wherein one side of the case is provided with a first opening; the mainboard is arranged in the case, a first chip, a second chip and a circuit element are arranged on one surface of the mainboard facing the first opening, the thickness of the first chip is smaller than that of the second chip, and the thickness of the second chip is smaller than the maximum thickness of the circuit element; the heat dissipation cover is covered at the first opening, the first chip is connected with the inner wall of the heat dissipation cover through the first heat conduction block, the first heat conduction block is used for transferring heat of the first chip to the heat dissipation cover, a heat conduction medium is filled between the second chip and the inner wall of the heat dissipation cover, the heat conduction medium is used for transferring heat of the second chip to the heat dissipation cover, and the circuit element is in contact with the inner wall of the heat dissipation cover.

In the host provided by the invention, the thickest circuit element is directly contacted with the inner wall of the heat dissipation cover based on the difference of the thicknesses of the first chip, the second chip and the circuit element on the mainboard, so that the heat dissipation efficiency of the circuit element is improved to the maximum extent. The first chip with smaller thickness is connected with the radiating cover through the first heat conducting block, and the radiating efficiency of the first chip is guaranteed. The heat-conducting medium is filled between the second chip with larger thickness and the inner wall of the heat-radiating cover, compared with a mode of radiating the second chip by adopting the heat-conducting block, the heat-conducting medium has smaller thermal resistance and good heat-radiating effect, and the heat-radiating efficiency of the second chip can be effectively improved. Through the radiating mode of the heating element with different thicknesses on the mainboard which is adaptively adjusted, the overall radiating efficiency of the host can be effectively improved on the premise of ensuring the airtightness and the compact structure of the host.

In an optional mode, the host further comprises a modular circuit board, the modular circuit board is connected to a surface, away from the first chip, of the main board through an electric connector, and a modular circuit structure is arranged on a surface, away from the main board, of the modular circuit board; the host machine further comprises a second heat conduction block, one surface of the second heat conduction block is provided with an accommodating groove matched with the outline of the modular circuit structure, the second heat conduction block is buckled on the modular circuit board, so that the modular circuit structure is accommodated in the accommodating groove, and the second heat conduction block is also contacted with the inner wall of the case to transfer the heat of the modular circuit structure to the case. Therefore, in the host computer that this application provided, through set up detachable modularization circuit board on the mainboard, realize the dismouting maintenance and the change of modularization circuit board, and through set up the storage tank with modularization circuit structure profile adaptation on the second heat conduction piece, make the second heat conduction piece can detain and locate the modularization circuit structure on, and then contact the inner wall of second heat conduction piece and quick-witted case, make the heat that modularization circuit structure produced at the during operation can distribute to quick-witted case through second heat conduction piece fast transfer, guarantee the inside temperature environment of host computer.

In an alternative mode, the modular circuit board includes any one of a single-voltage input power supply module and a wide-voltage input power supply module, and the single-voltage input power supply module and the wide-voltage input power supply module are connected to the main board through the same electrical connector; the single-voltage input power supply module is provided with a first modular circuit structure, and the wide-voltage input power supply module is provided with a second modular circuit structure; in the first modular circuit structure and the second modular circuit structure, the same type of circuit elements are respectively arranged at the close positions on the single-voltage input power module and the wide-voltage input power module, the shape of the accommodating groove is matched with the outline of the outer edge of the overlapped first modular circuit structure and the overlapped second modular circuit structure, the accommodating groove can be used for accommodating the first modular circuit structure and the second modular circuit structure, and the second heat-conducting block can be used for buckling on the single-voltage input power module and the wide-voltage input power module. Because single voltage input power module and wide voltage input power module pass through same electric connector and connect on the mainboard, consequently the host computer can be according to the power module that the user demand installation corresponds when dispatching from the factory to need not to design the mainboard alone in addition to different power modules, reduction in production cost, and the user can also change single voltage input power module or wide voltage input power module by oneself at the later stage according to the change to the power module demand, need not to purchase the host computer of different power modules alone again. Through setting up the circuit element of the same type on first modular circuit structure and second modular circuit structure respectively in single voltage input power module and wide voltage input power module similar position, and with the shape of storage tank and the outer fringe profile looks adaptation setting after first modular circuit structure and the second modular circuit structure overlap, it is compatible to increase the second heat conduction piece, make the second heat conduction piece both can be used for the lock joint to install and carry out the heat conduction at single voltage input power module, also can the lock joint install and carry out the heat conduction at wide voltage input power module, thereby need not to design respectively to produce the second heat conduction piece to single voltage input power module and wide voltage input power module, further reduction in production cost.

In an optional mode, an interface is arranged at the edge of one side of the main board, a baffle is arranged on one side, where the interface is located, of the case, a through hole for the interface to pass through is formed in the baffle, and the baffle is detachably connected with the case, so that the baffle matched with the case can be replaced according to the shape and/or the number of the interfaces. Through with baffle and quick-witted case detachable connection to set up the through-hole that supplies the interface to pass on the baffle, so that follow-up dilatation interface quantity on the mainboard, and can change the baffle of looks adaptation conveniently according to the change of interface quantity and/or shape, promote the host computer compatibility.

In an optional mode, the interface includes any one of a single-layer interface or a plurality of layers of interfaces arranged in the thickness direction, the projection of the interface in the thickness direction is positioned outside the heat dissipation cover, so that the baffles with different thicknesses can be replaced according to the number of layers of the interface, a blocking cover is arranged on one side of each baffle, and the blocking cover is arranged between the corresponding baffle and the heat dissipation cover. Through setting up the projection of interface in thickness direction outside the heat dissipation cover for when the number of piles of dilatation interface, can not receive the structure interference of heat dissipation cover, thereby can the more layer interfaces of dilatation, and can dismantle the baffle of changing different thickness with the adaptation interface on quick-witted case according to the dilatation number of piles of interface, establish the fender lid through covering between baffle and heat dissipation cover simultaneously, guarantee the leakproofness of quick-witted incasement portion, guarantee the operational environment of host computer.

In an alternative mode, a second opening is arranged on one side of the case, which is far away from the heat-radiating cover, a clamping mechanism is arranged on the inner side of the second opening, a socket is arranged on one side of the main board, which is far away from the heat-radiating cover, the socket of socket sets up with clamping mechanism relatively, and the socket is used for connecting the storage disc, and clamping mechanism is used for deviating from one side butt of socket with the storage disc in order to fix the storage disc clamp. Consider that the mainboard is limited towards the one side space of heat dissipation lid, consequently with the socket setting in the mainboard one side that deviates from the heat dissipation lid to through set up clamping mechanism in the inboard of second open-ended and the socket relative position of socket, make the storage disc be connected the back with the socket, clamping mechanism can deviate from one side butt of socket with the storage disc and fix the storage disc clamp, prevent that the storage disc from deviating from because of the vibration in the host computer use, promote the structural stability of storage disc.

In an alternative mode, the clamping mechanism comprises a mounting seat, a fastening piece and a sliding abutting piece, the mounting seat is fixed on the inner side of the second opening, the fastening piece is connected to the mounting seat, the sliding abutting piece is connected to the mounting seat in a sliding mode through the fastening piece, the sliding abutting piece is used for sliding in the direction towards or away from the socket to clamp the storage disk or provide a pulling space for the storage disk, and the fastening piece is used for fastening the sliding abutting piece on the mounting seat. Through setting up the mount pad in second open-ended inboard to pass through fastener sliding connection with the butt piece that slides on the mount pad, make and can remove the butt piece that slides through the direction that deviates from the socket towards, for the grafting of storage disc on the socket provides the space, and remove the butt piece that slides through the direction towards the socket, realize fixed to the centre gripping of storage disc, guarantee the structural stability of storage disc after pegging graft on the socket.

In an optional mode, the host further includes a hard disk, two opposite sides of the second opening are provided with brackets, and the hard disk is fixed to the brackets. The supports are arranged on two opposite sides in the second opening, and the hard disk is fixed in the case through the supports, so that the hard disk is conveniently installed in the case.

In an optional mode, a mounting seat is arranged on one side of the hard disk, and one side of the hard disk is fixedly connected with the support through the mounting seat. The mounting seat is arranged on one side of the hard disk, and one side of the hard disk is fixedly connected with the bracket through the mounting seat, so that the mounting structure of the hard disk and the clamping mechanism share the part of the mounting seat, the number of required parts is reduced, the production cost of a host is reduced, the space duty can be reduced, and the compactness of the internal structure of the case is ensured.

According to another aspect of the invention, an industrial control system is provided, which comprises the host computer in any one of the above.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

fig. 1 is an exploded schematic view of a host according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional structural diagram of a motherboard and a heat dissipation cover in a host according to an embodiment of the present invention;

fig. 3 is an exploded schematic view of a heat dissipation cover and a motherboard in a host according to an embodiment of the present invention;

fig. 4 is a schematic top structure diagram of a heat dissipation cover in a host according to an embodiment of the present invention;

fig. 5 is an exploded view of another view angle of the heat dissipation cover and the motherboard in the host according to the embodiment of the invention;

fig. 6 is an exploded schematic view of a modular circuit board, a motherboard, and a chassis in a host according to an embodiment of the present invention;

fig. 7 is a schematic diagram of an internal structure of a host according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a single-voltage-input power module in a host according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of a wide voltage input power module in a host according to an embodiment of the present invention;

fig. 10 is an exploded schematic view of a baffle plate and a chassis in a host according to an embodiment of the present invention;

fig. 11 is a schematic structural diagram after an interface is extended in a host according to an embodiment of the present invention;

fig. 12 is a schematic structural diagram of another view angle after an expansion interface in a host according to an embodiment of the present invention;

fig. 13 is a schematic structural diagram of a hard disk and a storage disk installed inside a host according to an embodiment of the present invention;

fig. 14 is a schematic structural diagram of a hard disk installed inside a host according to an embodiment of the present invention;

fig. 15 is a schematic bottom structure diagram of a host according to an embodiment of the present invention.

The reference numbers in the detailed description are as follows:

100. a host; 110. a chassis; 111. a first opening; 112. a second opening; 1121. a mounting wall; 120. a main board; 121. a first chip; 122. a second chip; 1221. a socket; 123. a circuit element; 124. connecting holes; 125. an electrical connector; 1251. arranging needles; 1252. mother arrangement; 126. an interface; 127. a socket; 130. a heat dissipation cover; 1301. a groove; 131. a first heat-conducting block; 132. a heat-conducting medium; 133. a heat dissipating fin; 1331. blind hole nut posts; 134. a stud; 140. a modular circuit board; 141. a modular circuit structure; 142. a single voltage input power supply module; 1421. a first modular circuit structure; 143. a wide voltage input power module; 1431. a second modular circuit structure; 150. a second heat-conducting block; 151. a containing groove; 160. a baffle plate; 161. a through hole; 162. a blocking cover; 170. a clamping mechanism; 171. a mounting seat; 172. a fastener; 173. a sliding abutting member; 1731. a slide rail; 1732. bending edges; 180. a hard disk; 181. a support; 191. a bottom cover; 192. a foot rest;

200. and storing the disk.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

One point of positioning of the fan-free host product is to ensure the airtightness, and some hosts also need to meet the protection level of IP50 and above, so that other openings can not be formed on the chassis except for the interface. The inside space's of host computer restriction and leakproofness requirement, the lateral wall of quick-witted case can't set up the louvre, and quick-witted case internal structure design compactness, and the heat that consequently inside heating element produced can influence each other, if the heat can not in time be discharged, can make quick-witted incasement portion high temperature, causes the host computer to slow down the frequency or even burns out inside components and parts.

The heating element inside the existing host is generally connected with the heat dissipation cover through the heat conduction block, the heat conduction block transfers the heat of the heating element to the heat dissipation cover for heat dissipation, and the heat conduction block is generally made of metal materials such as aluminum and copper, so that the thermal resistance is large, and the heat dissipation efficiency is low.

Based on the difference of the thicknesses of the first chip, the second chip and the circuit elements on the mainboard, the thickest circuit element is directly contacted with the inner wall of the heat dissipation cover, and therefore the heat dissipation efficiency of the circuit element is improved to the maximum extent. The first chip with smaller thickness is connected with the radiating cover through the first heat conducting block, and the radiating efficiency of the first chip is guaranteed. And a heat-conducting medium (for example, heat-conducting silicone grease) is filled between the second chip with the larger thickness and the inner wall of the heat-radiating cover, so that compared with a mode of radiating the second chip by using a heat-conducting block, the heat-conducting medium has smaller thermal resistance and good heat-radiating effect. Through the radiating mode of the heating element with different thicknesses on the mainboard which is adaptively adjusted, the overall radiating efficiency of the host can be effectively improved on the premise of ensuring the host tightness and the structure compactness.

Specifically, referring to fig. 1 and fig. 2, fig. 1 shows an exploded structure of a host according to an embodiment of the present invention, and fig. 2 shows a cross-sectional structure of a motherboard and a heat dissipation cover in the host. As shown in the figure, the host 100 includes a chassis 110, a motherboard 120, and a heat dissipation cover 130. One side of the chassis 110 has a first opening 111, the motherboard 120 is disposed in the chassis 110, a first chip 121, a second chip 122 and a circuit element 123 are disposed on a surface of the motherboard 120 facing the first opening 111, a thickness of the first chip 121 is smaller than a thickness of the second chip 122, and a thickness of the second chip 122 is smaller than a maximum thickness of the circuit element 123. The heat dissipation cover 130 covers the first opening 111, the first chip 121 is connected to an inner wall of the heat dissipation cover 130 through a first heat conduction block 131, the first heat conduction block 131 is used for transferring heat of the first chip 121 to the heat dissipation cover 130, a heat conduction medium 132 is filled between the second chip 122 and the inner wall of the heat dissipation cover 130, the heat conduction medium 132 is used for transferring heat of the second chip 122 to the heat dissipation cover 130, and the circuit element 123 contacts the inner wall of the heat dissipation cover 130.

Specifically, please refer to fig. 2 with further reference to fig. 3, which shows an exploded structure of a motherboard and a heat dissipation cover in a host according to an embodiment of the present invention. As shown in the figure, the first chip 121 may be a south bridge chip, the second chip 122 may be a CPU, the second chip 122 is mounted on the motherboard 120 through a socket 1221, and a groove 1301 is disposed on the heat dissipation cover 130 at a position corresponding to the second chip 122, where a size of the groove 1301 is determined by a standard package size and a component height size of the second chip 122. The first chip 121 and the second chip 122 have different external shapes, and the heat generation amount of the first chip 121 is much larger than that of the second chip 122, so the second chip 122 requires higher heat dissipation efficiency than the first chip 121. Since the thickness of the first chip 121 is very small, about 2mm, and after the second chip 122 is fixed on the motherboard 120 through the socket 1221, the total thickness of the second chip 122 and the socket 1221 is about 7mm, the maximum thickness of the circuit element 123 is generally slightly greater than 7mm, after the circuit element 123 contacts the inner wall of the heat dissipation cover 130, a small gap exists between the second chip 122 and the inner wall of the heat dissipation cover 130, in order to sufficiently improve the heat dissipation efficiency of the second chip 122 and meet the heat dissipation requirement of the second chip 122, the gap between the second chip 122 and the inner wall of the heat dissipation cover 130 is filled with the heat-conducting medium 132, and the heat-conducting medium 132 may be heat-conducting silicone grease, a heat-conducting silicone sheet, a phase-change heat-conducting material, a heat-conducting double-sided adhesive, and the like. After the circuit element 123 contacts the inner wall of the heat dissipation cover 130, a large gap still exists between the first chip 121 and the inner wall of the heat dissipation cover 130, and a heat conducting medium is filled in the gap, which cannot achieve a good heat dissipation effect, so that the first heat conduction block 131 is still used between the first chip 121 and the inner wall of the heat dissipation cover 130 for heat dissipation, so as to take account of the heat dissipation effect of the first chip 121 and the structural stability. The first heat conduction block 131 is preferably made of aluminum or aluminum alloy, the aluminum has good heat conduction performance, the heat conduction performance of the aluminum alloy is slightly inferior to that of the aluminum, but the aluminum alloy has high strength and good structural stability.

Referring to fig. 3, and with further reference to fig. 4 and 5, fig. 4 shows a top view structure of a heat dissipation cover in a host according to an embodiment of the present invention, and fig. 5 shows another view structure of a motherboard and the heat dissipation cover. As shown in fig. 4, the heat dissipating cover 130 may be made of an aluminum profile, heat dissipating fins 133 are disposed on a side of the heat dissipating cover 130 away from the main board 120, and the width and the distance of the heat dissipating fins 133 meet the requirement of the surface area of the heat dissipating cover 130, and it is ensured that four blind nut posts 1331 can be press-riveted on the heat dissipating fins 133, and the distance between the four blind nut posts 1331 is 75 × 75mm, which meets the requirement of Video Electronics Standards Association (VESA) on the support arm mounting hole. As shown in fig. 5, a stud 134 is disposed on a side of the heat dissipating cover 130 away from the heat dissipating fins 133, a connecting hole 124 is disposed on the main board 120 at a position corresponding to the stud 134, and after the connecting hole 124 is aligned with the stud 134, the main board 120 is fixed on the heat dissipating cover 130 in parallel by a threaded fastener.

In the host 100 provided by the present invention, based on the difference in thickness between the first chip 121, the second chip 122 and the circuit element 123 on the motherboard 120, the thickest circuit element 123 is in direct contact with the inner wall of the heat dissipation cover 130, thereby maximizing the heat dissipation efficiency of the circuit element 123. The first chip 121 with a smaller thickness is connected to the heat dissipation cover 130 through the first heat conduction block 131, so as to ensure the heat dissipation efficiency of the first chip 121. The heat-conducting medium 132 is filled between the second chip 122 with a larger thickness and the inner wall of the heat-dissipating cover 130, and compared with a method of dissipating heat of the second chip 122 by using a heat-conducting block, the heat-conducting medium 132 has a smaller thermal resistance and a good heat-dissipating effect, and the heat-dissipating efficiency of the second chip 122 can be effectively improved. By adaptively adjusting the heat dissipation manner of the heating elements with different thicknesses on the motherboard 120, the overall heat dissipation efficiency of the host 100 can be effectively improved on the premise of ensuring the airtightness and the structural compactness of the host 100.

Referring to fig. 6 and 7, structures of a modular circuit board and a second heat conduction block in a host according to an embodiment of the invention are respectively shown. As shown in the figure, in some embodiments, the host 100 further includes a modular circuit board 140, the modular circuit board 140 is connected to a side of the motherboard 120 away from the first chip 121 through the electrical connector 125, and a modular circuit structure 141 is disposed on a side of the modular circuit board 140 away from the motherboard 120. The host 100 further includes a second heat-conducting block 150, one surface of the second heat-conducting block 150 is provided with a receiving groove 151 adapted to the contour of the modular circuit structure 141, the second heat-conducting block 150 is fastened to the modular circuit board 140, so that the modular circuit structure 141 is received in the receiving groove 151, and the second heat-conducting block 150 is further in contact with the inner side wall of the case 110 to transfer the heat of the modular circuit structure 141 to the case 110.

The modular circuit board 140 may be a circuit board of a single functional module, such as a power module, a communication module, and the like. As shown in fig. 6, electrical connector 125 may include pin header 1251 disposed on motherboard 120 and box header 1252 disposed on modular circuit board 140, box header 1252 being pluggable into pin header 1251 so that modular circuit board 140 and motherboard 120 are secured to one another and form an electrical connection. By detachably connecting the modular circuit board 140 to the main board 120, it is convenient to replace the modular circuit board 140 with different functions or different models, and to disassemble, assemble and maintain the modular circuit board 140.

In consideration of the heat generation problem of the modular circuit board 140, by providing the second heat-conducting block 150 and providing the accommodating groove 151 adapted to the profile of the modular circuit structure 141 on one side of the second heat-conducting block 150, the second heat-conducting block 150 can be fastened to the modular circuit structure 141, and at the same time, the second heat-conducting block 150 contacts with the inner wall of the case 110, specifically, the second heat-conducting block 150 contacts with the inner wall of the case 110 or the bottom wall deviating from the heat dissipation cover 130, so that the second heat-conducting block 150 can rapidly transfer the heat generated by the modular circuit structure 141 to the case 110 for dissipation, thereby further improving the heat dissipation efficiency of the host 100.

Therefore, in the host 100 provided by the present application, by providing the detachable modular circuit board 140 on the motherboard 120, the disassembly, assembly, maintenance and replacement of the modular circuit board 140 are realized, and by providing the accommodating groove 151 matched with the profile of the modular circuit structure 141 on the second heat conducting block 150, the second heat conducting block 150 can be fastened on the modular circuit structure 141, and further, the second heat conducting block 150 contacts with the inner wall of the case 110, so that the heat generated by the modular circuit structure 141 during operation can be rapidly transferred to the case 110 through the second heat conducting block 150 for dissipation, thereby ensuring the temperature environment inside the host 100.

Referring to fig. 8 and 9, two different modular circuit boards according to embodiments of the present invention are shown. As shown in the figures, in some embodiments, the modular circuit board 140 includes any one of a single voltage input power module 142 and a wide voltage input power module 143, the single voltage input power module 142 and the wide voltage input power module 143 being connected to the motherboard 120 by the same electrical connector 125. The single-voltage input power module 142 is provided with a first modular circuit structure 1421, the wide-voltage input power module 143 is provided with a second modular circuit structure 1431, in the first modular circuit structure 1421 and the second modular circuit structure 1431, circuit elements of the same type are respectively disposed at positions close to the single-voltage input power module 142 and the wide-voltage input power module 143, the shape of the accommodating groove 151 is adapted to the outer edge contour after the first modular circuit structure 1421 and the second modular circuit structure 1431 are overlapped, the accommodating groove 151 can be used for accommodating the first modular circuit structure 1421 and can also be used for accommodating the second modular circuit structure 1431, so that the second heat conduction block 150 can be used for being buckled on the single-voltage input power module 142 and can also be buckled on the wide-voltage input power module 143.

The single voltage input power module 142 and the wide voltage input power module 143 are both independent modular circuit boards 140, the single voltage input power and the wide voltage input power refer to the ac input end of the dc stabilized power supply, the allowable fluctuation range of the single voltage is small, and the allowable fluctuation range of the wide voltage is large.

The first modular circuit structure 1421 of the single voltage input power module 142 omits related components of the voltage regulator circuit and other related components of the circuit are substantially the same as the second modular circuit structure 1431 of the wide voltage input power module 143.

The circuit elements of the same type in the first modular circuit structure 1421 and the second modular circuit structure 1431 are respectively disposed at positions close to the single-voltage-input power module 142 and the wide-voltage-input power module 143, which means that after the single-voltage-input power module 142 and the wide-voltage-input power module 143 are placed at the same angle, the position of the circuit element of a certain type in the first modular circuit structure 1421 on the single-voltage-input power module 142 is substantially the same as the position of the circuit element of the same type in the second modular circuit structure 1431 on the wide-voltage-input power module 143, and therefore, the layout mode of the circuit elements in the single-voltage-input power module 142 is the same as the layout mode of the circuit elements in the wide-voltage-input power module 143.

The shape of the receiving groove 151 is adapted to the outer edge contour of the overlapped first modular circuit structure 1421 and the overlapped second modular circuit structure 1431, which means that the single voltage input power module 142 and the wide voltage input power module 143 are placed at the same angle and horizontally overlapped with each other, the same type of circuit components in the first modular circuit structure 1421 and the second modular circuit structure 1431 are also at least partially overlapped, and the shape of the receiving groove 151 needs to be ensured to be adapted to the at least partially overlapped same type of circuit components at the same time, that is, the receiving groove 151 can be fastened to the overlapped first modular circuit structure 1421 and the second modular circuit structure 1431, so as to ensure that the receiving groove 151 can be fastened to the first modular circuit structure 1421 and also to the overlapped second modular circuit structure 1431.

Because the single voltage input power module 142 and the wide voltage input power module 143 are connected to the motherboard 120 through the same electrical connector 125, the host 100 can install the corresponding power module according to the user's requirement when leaving the factory, so that it is not necessary to separately design the motherboard 120 in addition according to different voltage requirements, thereby reducing the production cost, and the user can also replace the single voltage input power module 142 or the wide voltage input power module 143 by himself at the later stage according to the change of the requirement for the power module, and it is not necessary to purchase the host 100 with different voltage inputs separately. By respectively arranging the same type of circuit elements on the first modular circuit structure 1421 and the second modular circuit structure 1431 at the close positions on the single voltage input power module 142 and the wide voltage input power module 143, and arranging the shape of the accommodating groove 151 in a manner of being matched with the outer edge profile of the overlapped first modular circuit structure 1421 and the second modular circuit structure 1431, compatibility of the second heat conduction block 150 is increased, so that the second heat conduction block 150 can be installed in a buckled manner on the single voltage input power module 142 for heat conduction, or in a buckled manner on the wide voltage input power module 143 for heat conduction, and thus, the second heat conduction block 150 does not need to be designed and produced for the single voltage input power module 142 and the wide voltage input power module 143, and production cost is further reduced.

Referring to fig. 10, an internal structure of a host according to an embodiment of the invention is shown. As shown in the drawings, in some embodiments, an edge of one side of the motherboard 120 is provided with the interface 126, a baffle 160 is provided on one side of the chassis 110 located at the interface 126, a through hole 161 for the interface 126 to pass through is provided on the baffle 160, and the baffle 160 is detachably connected to the chassis 110, so that the matched baffle 160 can be replaced according to the shape and/or number of the interface 126.

Specifically, the bezel 160 may be removably coupled to the chassis 110 via a snap-fit structure or threaded fasteners. The number and shape of the interfaces 126 may be adaptively designed as needed, or the number of the interfaces 126 may continue to be expanded on the already manufactured motherboard 120, and specifically, the expansion of the number of the interfaces 126 may be realized by installing an interface expansion board on the motherboard 120.

The baffle 160 is detachably connected with the chassis 110, and the through hole for the interface 126 to pass through is arranged on the baffle 160, so that the number of the interfaces can be expanded on the mainboard 120 in the following process, and the adaptive baffle 160 can be conveniently replaced according to the number and/or the shape of the interfaces 126, thereby improving the compatibility of the host 100.

Further, in order to increase the number of interfaces sufficiently and meet the user requirement, in some embodiments, in addition to the edge of the side where the interface 126 is disposed on the motherboard 120, the edge of the other side may also be disposed with another single-layer interface, and an opening may be directly formed on the sidewall of the chassis 110 to expose the another single-layer interface, so as to achieve sufficient expansion of the number of interfaces on the host 100.

Further, referring to fig. 1 again, and with further reference to fig. 11 and 12, fig. 11 shows a three-dimensional structure of a host according to an embodiment of the present invention, and fig. 12 shows a three-dimensional structure of another perspective of the host according to an embodiment of the present invention. As shown in the drawings, in some embodiments, the interface 126 includes any one of a single-layer interface or a multi-layer interface arranged in a thickness direction (a direction indicated by a z-axis in fig. 11), a projection of the interface 126 in the thickness direction is located outside the heat dissipation cover 130, so that the baffles 160 with different thicknesses can be replaced according to the number of layers of the interface 126, a blocking cover 162 is arranged on one side of the baffles 160, and the blocking cover 162 is arranged between the baffles 160 and the heat dissipation cover 130.

Through setting up interface 126 outside heat dissipation cover 130 in the ascending projection of thickness direction for when the number of piles of dilatation interface 126, can not receive the structure interference of heat dissipation cover 130, thereby can expand more layers of interface 126, and can dismantle the baffle 160 of changing different thickness on quick-witted case 110 according to the number of piles of dilatation of interface 126 with adaptation interface 126, establish fender cover 162 through covering between baffle 160 and heat dissipation cover 130 simultaneously, guarantee the inside leakproofness of quick-witted case 110, guarantee the operational environment of host computer 100.

Referring to fig. 13, a bottom structure of a host according to an embodiment of the invention is shown. As shown in the drawings, in some embodiments, a side of the chassis 110 away from the heat dissipation cover 130 is provided with a second opening 112, an inner side of the second opening 112 is provided with a clamping mechanism 170, a side of the main board 120 away from the heat dissipation cover 130 is provided with a socket 127, a socket of the socket 127 is arranged opposite to the clamping mechanism 170, the socket 127 is used for connecting the storage disk 200, and the clamping mechanism 170 is used for abutting against a side of the storage disk 200 away from the socket 127 to clamp and fix the storage disk 200.

Specifically, the socket 127 may be a USB socket, the storage disk 200 may be a USB disk, and after the storage disk 200 is plugged into the socket 127, the motherboard 120 may be used to read data in the storage disk 200 and store data in the storage disk 200.

Considering that the space of the side of the motherboard 120 facing the heat dissipation cover 130 is limited, the socket 127 is disposed on the side of the motherboard 120 facing away from the heat dissipation cover 130, and the clamping mechanism 170 is disposed on the inner side of the second opening 112 and opposite to the socket of the socket 127, so that after the storage disk 200 is connected to the socket 127, the clamping mechanism 170 can abut against the side of the storage disk 200 facing away from the socket 127 to clamp and fix the storage disk 200, thereby preventing the storage disk 200 from being separated due to vibration during the use of the host 100, and improving the structural stability of the storage disk 200.

One side of the chassis 110 away from the heat dissipation cover 130 is generally closed by a bottom cover, and considering that the storage disk 200 is frequently replaced, the socket 127 is disposed on one side of the motherboard 120 away from the heat dissipation cover 130, so that a user can directly disassemble and assemble or replace the storage disk by disassembling the bottom cover, and the operation is convenient and fast.

With respect to the specific structure of the clamping mechanism 170, the present application further proposes an embodiment, and with specific reference to fig. 13, the clamping mechanism 170 includes a mounting seat 171, a fastening member 172 and a sliding abutment member 173, the mounting seat 171 is fixed inside the second opening 112, the fastening member 172 is connected to the mounting seat 171, the sliding abutment member 173 is slidably connected to the mounting seat 171 through the fastening member 172, the sliding abutment member 173 is configured to slide in a direction toward or away from the socket 127 to clamp the storage tray 200 or provide a space for extracting the storage tray 200, and the fastening member 172 is configured to fasten the sliding abutment member 173 to the mounting seat 171.

In the specific embodiment shown in fig. 13, the sliding rail 1731 is disposed on the sliding abutment 173, the fastening member 172 may be a threaded fastening member, and the fastening member 172 passes through the sliding rail 1731 to be screwed with the mounting seat 171, so that when the fastening member 172 is loosened, the sliding abutment 173 can move relative to the fastening member 172 in a direction towards or away from the socket 127 through the sliding rail 1731, and when the sliding abutment 173 moves to a proper position, the fastening member 172 is tightened to fix the sliding abutment 173 on the mounting seat 171, thereby clamping and fixing the storage disk 200. Specifically, one end of the sliding abutting piece 173 facing the socket 127 has a bent edge 1732, and the bent edge 1732 is used for abutting against one surface of the storage disk 200 departing from the socket 127, so as to ensure stability when clamping and fixing the storage disk 200, and increase the structural strength of the sliding abutting piece 173.

By arranging the mounting seat 171 on the inner side of the second opening 112 and slidably connecting the sliding abutting part 173 to the mounting seat 171 through the fastening member 172, a space can be provided for the insertion of the storage disk 200 on the socket 127 by moving the sliding abutting part 173 in a direction away from the socket 127, and the storage disk 200 can be clamped and fixed by moving the sliding abutting part 173 in a direction towards the socket 127, so that the structural stability of the storage disk 200 after the insertion on the socket 127 is ensured.

Referring to fig. 14, a bottom structure of a host according to another embodiment of the invention is shown. As shown in the figure, in some embodiments, the host 100 further includes a hard disk 180, two opposite sides of the second opening 112 are provided with brackets 181, and the hard disk 180 is fixed to the brackets 181.

Specifically, two opposite sides of the second opening 112 may be bent inward to form a mounting wall 1121, the bracket 181 may be fixed to the mounting wall 1121 through a rivet, and two sides of the hard disk 180 may be connected to the bracket 181 through a connecting piece, so as to achieve the mounting and fixing of the hard disk 180 in the chassis 110.

The brackets 181 are arranged on two opposite sides in the second opening 112, and the hard disk 180 is fixed in the case 110 through the brackets 181, so that the hard disk 180 can be conveniently installed in the case 110.

Referring to fig. 13 again, in some embodiments, a mounting seat 171 is disposed on one side of the hard disk 180, and one side of the hard disk 180 is fixedly connected to the bracket 181 through the mounting seat 171.

Specifically, the mounting seat 171 may be a connecting piece for connecting the hard disk 180 and the bracket 181 shown in fig. 13.

By arranging the mounting seat 171 on one side of the hard disk 180 and fixedly connecting one side of the hard disk 180 with the bracket 181 through the mounting seat 171, the mounting structure of the hard disk 180 and the clamping mechanism 170 share the mounting seat 171, so that the number of required components is reduced, the production cost of the host 100 is reduced, space occupation can be reduced, and the compactness of the internal structure of the case 110 is ensured.

Further, referring to fig. 15, a structure of a bottom of a host according to an embodiment of the present invention is shown. As shown in the drawings, in some embodiments, a bottom cover 191 is provided on the second opening 112, and foot rests 192 are provided on opposite sides of the bottom cover 191.

Specifically, the bottom cover 191 and the foot rest 192 may be an integral structure, or may be separately manufactured and mounted on the chassis 110. Bottom cover 191 and foot rest 192 all can be through threaded fastener or the mode of joint with quick-witted case fixed connection, and bottom cover 191 is used for sealed quick-witted case 110, guarantees the leakproofness of quick-witted case 110 inner space, and foot rest 192 can be used for placing quick-witted case 110, also can be used for being connected with outside mounting platform to fix host computer 100 on mounting platform.

According to another aspect of the embodiment of the present invention, an industrial control system is further provided, and the industrial control system includes the host 100 in any one of the above embodiments.

Further, in some embodiments, a fan may be further disposed in the industrial control system, and the fan is disposed toward the heat dissipation cover 130, and is configured to blow air to the heat dissipation cover 130 for heat dissipation, so as to ensure that heat on the heat dissipation cover 130 can be dissipated quickly.

It is to be noted that technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which embodiments of the present invention belong, unless otherwise specified.

In the description of the embodiments of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate the orientations and positional relationships indicated in the drawings, which are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention.

Furthermore, the technical terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are used broadly and may be, for example, fixedly connected, detachably connected, or integrated; mechanical connection or electrical connection is also possible; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Furthermore, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely below the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims (10)

1. A host, comprising:

the computer case comprises a case, a first switch and a second switch, wherein one side of the case is provided with a first opening;

the mainboard is arranged in the case, one surface of the mainboard, which faces the first opening, is provided with a first chip, a second chip and a circuit element, the thickness of the first chip is smaller than that of the second chip, and the thickness of the second chip is smaller than the maximum thickness of the circuit element;

the heat dissipation cover is covered at the first opening, the first chip is connected with the inner wall of the heat dissipation cover through a first heat conduction block, the first heat conduction block is used for transferring the heat of the first chip to the heat dissipation cover, a heat conduction medium is filled between the second chip and the inner wall of the heat dissipation cover, the heat conduction medium is used for transferring the heat of the second chip to the heat dissipation cover, and the circuit element is in contact with the inner wall of the heat dissipation cover.

2. The host computer according to claim 1, further comprising a modular circuit board, wherein the modular circuit board is connected to a side of the motherboard away from the first chip through an electrical connector, and a modular circuit structure is disposed on a side of the modular circuit board away from the motherboard;

the host machine further comprises a second heat conduction block, one surface of the second heat conduction block is provided with an accommodating groove matched with the outline of the modular circuit structure, the second heat conduction block is buckled on the modular circuit board, so that the modular circuit structure is accommodated in the accommodating groove, and the second heat conduction block is further contacted with the inner wall of the case to transfer heat of the modular circuit structure to the case.

3. The host of claim 2, wherein the modular circuit board comprises any one of a single voltage input power module and a wide voltage input power module, the single voltage input power module and the wide voltage input power module being connected to the motherboard by the same electrical connector;

the single-voltage input power supply module is provided with a first modular circuit structure, and the wide-voltage input power supply module is provided with a second modular circuit structure;

in the first modular circuit structure and the second modular circuit structure, the same type of circuit elements are respectively arranged at the positions close to the single voltage input power module and the wide voltage input power module, the shape of the accommodating groove is matched with the outline of the outer edge of the overlapped first modular circuit structure and the overlapped second modular circuit structure, and the accommodating groove can be used for accommodating the first modular circuit structure and the second modular circuit structure, so that the second heat-conducting block can be buckled on the single voltage input power module and the wide voltage input power module.

4. The host computer according to any one of claims 1 to 3, wherein an interface is disposed on an edge of one side of the motherboard, a baffle is disposed on a side of the chassis where the interface is located, a through hole for the interface to pass through is disposed on the baffle, and the baffle is detachably connected to the chassis, so that the baffle can be changed according to the shape and/or number of the interface.

5. The mainframe according to claim 4, wherein the interface includes any one of a single-layer interface or a plurality of layers of interfaces arranged in a thickness direction, a projection of the interface in the thickness direction is located outside the heat dissipation cover, so that the baffles with different thicknesses can be replaced according to the number of layers of the interface, a blocking cover is arranged on one side of each baffle, and the blocking cover is arranged between the baffle and the heat dissipation cover.

6. The host according to any one of claims 1 to 3, wherein a second opening is provided on a side of the chassis facing away from the heat dissipation cover, a clamping mechanism is provided on an inner side of the second opening, a socket is provided on a side of the motherboard facing away from the heat dissipation cover, a socket of the socket is disposed opposite to the clamping mechanism, the socket is used for connecting a storage disk, and the clamping mechanism is used for abutting against a side of the storage disk facing away from the socket to clamp and fix the storage disk.

7. The host computer of claim 6, wherein the clamping mechanism comprises a mounting seat fixed inside the second opening, a fastening member connected to the mounting seat, and a sliding abutment member slidably connected to the mounting seat by the fastening member, the sliding abutment member is configured to slide in a direction toward or away from the socket to clamp the storage tray or provide a space for extracting the storage tray, and the fastening member is configured to fasten the sliding abutment member to the mounting seat.

8. The host according to claim 7, further comprising a hard disk, wherein two opposite sides of the second opening are provided with a bracket, and the hard disk is fixed to the bracket.

9. The host according to claim 8, wherein the mounting seat is disposed on one side of the hard disk, and one side of the hard disk is fixedly connected to the bracket through the mounting seat.

10. An industrial control system, comprising a host machine according to any one of claims 1-9.

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