CN115260985A - Two-component low-viscosity high-heat-conductivity pouring sealant and preparation method and application thereof - Google Patents
Two-component low-viscosity high-heat-conductivity pouring sealant and preparation method and application thereof Download PDFInfo
- Publication number
- CN115260985A CN115260985A CN202211035226.6A CN202211035226A CN115260985A CN 115260985 A CN115260985 A CN 115260985A CN 202211035226 A CN202211035226 A CN 202211035226A CN 115260985 A CN115260985 A CN 115260985A
- Authority
- CN
- China
- Prior art keywords
- component
- thermal
- silicone oil
- conductivity
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
Abstract
The invention belongs to the technical field of heat-conducting interface materials, and relates to a two-component low-viscosity high-heat-conducting pouring sealant, and a preparation method and application thereof. The two-component low-viscosity high-heat-conductivity pouring sealant comprises a component A and a component B which are independently stored, wherein the component A contains modified vinyl silicone oil, heat-conducting filler, powder treating agent and catalyst, and the component B contains modified vinyl silicone oil, modified hydrogen-containing silicone oil, heat-conducting filler, powder treating agent and inhibitor. Compared with the existing pouring sealant products in the market, the two-component low-viscosity high-thermal conductivity pouring sealant provided by the invention has the advantages of higher thermal conductivity coefficient, better fluidity, no sedimentation after long-time storage and excellent reliability.
Description
Technical Field
The invention belongs to the technical field of heat-conducting interface materials, and relates to a two-component low-viscosity high-heat-conducting pouring sealant, and a preparation method and application thereof.
Background
An on-board charger (OBC) is used as one of key parts of the new energy electric vehicle, converts alternating current into direct current required by a power battery of the electric vehicle, ensures that the battery can be safely and automatically charged, and determines the charging efficiency of the electric vehicle. The OBC design has been integrated to include bidirectional power conversion, DC-DC conversion and other auxiliary device functions, and the integration gives the OBC a more compact overall design. Along with the favor of electric vehicle consumers for higher-efficiency charging, various large electric vehicle manufacturers gradually put forward the demand of higher-efficiency OBC to the market. The trend toward integration and higher efficiency of designs has made thermal management of OBCs increasingly important.
And a gap between the component and the heat radiator needs to be encapsulated by pouring sealant. The organic silicon pouring sealant has the advantages of no heat release during curing, no release of small molecular byproducts, small shrinkage rate, excellent electrical property and chemical stability and the like, so that the organic silicon pouring sealant is a common OBC pouring sealant, and the demand of the organic silicon pouring sealant is increased every year. At present, the heat conductivity coefficient of the organic silicon pouring sealant which is used more in the market is 1-2W/m.K, and most of powder treating agents adopted in the preparation process are long-chain silane of 8-16C. The organic silicon pouring sealant has the advantages of low heat conductivity coefficient, poor heat dissipation effect, high viscosity and inconvenience in pouring, and moreover, the silane contained in the organic silicon pouring sealant is not good in compatibility with silicone oil, so that the heat-conducting filler is easy to settle after being placed for a long time. Therefore, in order to effectively encapsulate the gap between the component and the heat sink, it is urgently needed to develop an organosilicon encapsulating compound which has high heat-conducting performance, high fluidity and difficult sedimentation of heat-conducting filler.
Disclosure of Invention
The invention aims to overcome the defects that the prior organic silicon pouring sealant has poor heat-conducting property and fluidity and the heat-conducting filler is easy to settle, the two-component pouring sealant has the advantages of high heat conductivity coefficient, low viscosity, good fluidity and difficult sedimentation of the filler.
After intensive and extensive research, the inventor of the invention finds that the modified vinyl silicone oil containing alkoxy and the modified hydrogen-containing silicone oil containing alkoxy are introduced into the organic silicon pouring sealant, and the two specific silicone oils can be used as main body materials of the heat-conducting pouring sealant and can also play a role of modifying powder, so that the heat conductivity, the fluidity and the stability of the pouring sealant are improved. The reason is presumably that the modified vinyl silicone oil containing alkoxy groups and the modified hydrogen-containing silicone oil containing alkoxy groups can chemically react with hydroxyl groups on the surface of the heat-conducting filler to reduce the oil absorption value of the heat-conducting filler, so that the viscosity of the system is lower, the fluidity is better, and the function of dragging the heat-conducting filler is achieved, so that the heat-conducting filler is not subjected to settling oil precipitation in the long-term storage process, is uniformly and stably dispersed in the system, and further the heat-conducting performance of the heat-conducting filler can be remarkably improved. Based on this, the present invention has been completed.
The two-component low-viscosity high-thermal-conductivity pouring sealant comprises a component A and a component B which are independently stored, wherein the component A contains 30-50 parts by weight of modified vinyl silicone oil I, 800-1500 parts by weight of thermal conductive filler I, 5-25 parts by weight of powder treating agent I and 1-5 parts by weight of catalyst, and the component B contains 30-50 parts by weight of modified vinyl silicone oil II, 3-10 parts by weight of modified hydrogen-containing silicone oil, 800-1500 parts by weight of thermal conductive filler II, 5-25 parts by weight of powder treating agent II and 1-5 parts by weight of inhibitor; the modified vinyl silicone oil I and the modified vinyl silicone oil II respectively and independently have structures shown in a formula (1), and the modified hydrogen-containing silicone oil has a structure shown in a formula (2);
in the formula (1), R 11 And R 16 Is vinyl, R 12 、R 13 、R 17 And R 18 At least one of them is-O-R 19 And the remainder is C 1 -C 5 Alkyl of R 14 And R 15 Is C 1 -C 5 Alkyl of R 19 Is C 1 -C 5 N is 5 to 1000; or, R 11 、R 12 And R 13 Is C 1 -C 5 Alkoxy of n, R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Is C 1 -C 5 Alkyl of R 16 、R 17 And R 18 Is C 1 -C 5 N is 5 to 1000; or, R 11 And R 16 Is C 1 -C 5 Alkyl of R 12 、R 13 、R 17 And R 18 At least one of them is-O-R 20 And the remainder is C 1 -C 5 N is R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Is C 1 -C 5 Alkyl of R 20 Is C 1 -C 5 N is 5 to 1000;
in the formula (2), R 21 And R 26 Is H, R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 29 And the remainder is C 1 -C 5 Alkyl of R 24 And R 25 Is C 1 -C 5 Alkyl of R 29 Is C 1 -C 5 M is 5 to 1000; or, R 21 、R 22 And R 23 Is C 1 -C 5 Alkoxy of (a), m R 24 And m R 25 At least one of which is H and the remainder R 24 And R 25 Is C 1 -C 5 Alkyl of R 26 、R 27 And R 28 Is C 1 -C 5 M is 5 to 1000; or, R 21 And R 26 Is C 1 -C 5 Alkyl of R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 30 And the remainder is C 1 -C 5 M alkyl groups of R 24 And m R 25 At least one of which is H and the remainder R 24 And R 25 Is C 1 -C 5 Alkyl of R 30 Is C 1 -C 5 M is 5 to 1000.
In a preferred embodiment, the vinyl group content of the modified vinyl silicone oil I and the modified vinyl silicone oil II is 0.2 to 0.8mmoles/g independently from each other.
In a preferable embodiment, the content of Si-H in the modified hydrogen-containing silicone oil is 1-1.5mmoles/g.
In a preferred embodiment, the modified vinyl silicone oil I and the modified vinyl silicone oil II have a viscosity of 30 to 200cSt, respectively.
In a preferred embodiment, the modified hydrogen-containing silicone oil has a viscosity of 30 to 200cSt.
In a preferred embodiment, the heat-conducting filler i and the heat-conducting filler ii are each independently selected from at least one of alumina, aluminum nitride, silicon nitride, boron nitride, silicon carbide, zinc oxide, aluminum hydroxide, and fine silica powder.
In a preferred embodiment, the total proportion of the heat-conducting filler I and the heat-conducting filler II with the particle size of 0.1-3 microns is 1-30%, the proportion of the heat-conducting filler I and the heat-conducting filler II with the particle size of 5-15 microns is 10-40%, and the proportion of the heat-conducting filler I and the heat-conducting filler II with the particle size of 40-80 microns is 30-70%, based on the total weight of the heat-conducting filler I and the heat-conducting filler II.
In a preferred embodiment, the powder treating agent I and the powder treating agent II are independently selected from at least one of methyltrimethoxysilane, octyltriethoxysilane, dodecyltrimethoxysilane and 3-methacryloxypropyltrimethylsilane.
In a preferred embodiment, the catalyst is selected from at least one of chloroplatinic acid, a platinum-vinylsiloxane complex, and a platinum-alkyne chelate.
In a preferred embodiment, the inhibitor is selected from at least one of a maleate, an alkynol, and a polyvinyl ring.
In a preferred embodiment, the component B further contains a pigment.
In a preferred embodiment, the pigment is present in an amount of 1 to 5 parts by weight.
In a preferred embodiment, the pigment is selected from at least one of carbon black, iron red, cobalt blue, and cadmium yellow.
In a preferred embodiment, when used, the mass ratio of component A to component B is (0.9-1.1): 1.
The invention also provides a preparation method of the two-component low-viscosity high-heat-conductivity pouring sealant, which comprises the following steps:
preparation of component A: uniformly mixing modified vinyl silicone oil I, a heat-conducting filler I and a powder treating agent I at normal temperature, stirring and mixing the obtained mixture I at 100-120 ℃ for 1-2h under a vacuum condition, cooling to room temperature, adding a catalyst, and stirring and mixing at 100-120 ℃ for 1-2h under a vacuum condition to obtain a component A;
preparation of component B: uniformly mixing the modified vinyl silicone oil II, the modified hydrogen-containing silicone oil, the heat-conducting filler II, the powder treating agent II, the inhibitor and the optional pigment, and then stirring and mixing the obtained mixture II for 1-2 hours at 100-120 ℃ under a vacuum condition to obtain a component B.
In addition, the invention also provides application of the two-component low-viscosity high-thermal-conductivity pouring sealant in an electronic heat dissipation component.
Compared with the existing pouring sealant products on the market, the two-component pouring sealant with low viscosity and high heat conductivity provided by the invention has the advantages of higher heat conductivity coefficient, better fluidity, no sedimentation after long-time storage and excellent reliability.
Detailed Description
The two-component low-viscosity high-thermal-conductivity pouring sealant provided by the invention comprises a component A and a component B which are independently stored. The component A contains modified vinyl silicone oil I, heat-conducting filler I, powder treating agent I and catalyst. Wherein, the content of the modified vinyl silicone oil I is 30-50 parts by weight, such as 30, 33, 35, 38, 40, 42, 45, 48, 50 parts by weight and the like. The content of the heat-conducting filler I is 800-1500 parts by weight, such as 800, 850, 900, 950, 1000, 1050, 1100, 1150, 1200, 1250, 1300, 1350, 1400, 1450, 1500 parts by weight and the like. The content of the powder treating agent I is 5-25 parts by weight, such as 5, 8, 10, 12, 15, 18, 20, 22, 25 parts by weight and the like. The content of the catalyst is 1-5 parts by weight, such as 1, 2, 3, 4, 5 parts by weight and the like. The component B contains modified vinyl silicone oil II, modified hydrogen-containing silicone oil, heat-conducting filler II, powder treating agent II and inhibitor. Wherein the content of the modified vinyl silicone oil II is 30-50 parts by weight, such as 30, 33, 35, 38, 40, 42, 45, 48, 50 parts by weight and the like. The content of the modified hydrogen-containing silicone oil is 3-10 parts by weight, such as 3, 4, 5, 6, 7, 8, 9, 10 parts by weight and the like. The content of the heat-conducting filler II is 800-1500 parts by weight, such as 800, 850, 900, 950, 1000, 1050, 1100, 1150, 1200, 1250, 1300, 1350, 1400, 1450, 1500 parts by weight and the like. The content of the powder treating agent II is 5-25 parts by weight, such as 5, 8, 10, 12, 15, 18, 20, 22, 25 parts by weight and the like. The content of the inhibitor is 1-5 parts by weight, such as 1, 2, 3, 4, 5 parts by weight and the like.
In the present invention, the modified vinyl silicone oil contained in component A is referred to as "modified vinyl silicone oil I", and the modified vinyl silicone oil contained in component B is referred to as "modified vinyl silicone oil II"; the heat conductive filler contained in component A is referred to as "heat conductive filler I", and the heat conductive filler contained in component B is referred to as "heat conductive filler II"; the powder treating agent contained in component A is referred to as "powder treating agent I", and the powder treating agent contained in component B is referred to as "powder treating agent II", wherein "I" and "II" are for convenience of distinction and description, and have no special meaning.
The modified vinyl silicone oil I and the modified vinyl silicone oil II have structures shown in formula (1):
in the formula (1), R 11 And R 16 Is vinyl, R 12 、R 13 、R 17 And R 18 At least one of them is-O-R 19 And the remainder is C 1 -C 5 Alkyl of R 14 And R 15 Is C 1 -C 5 Alkyl of R 19 Is C 1 -C 5 N is 5 to 1000 (i.e., a polydimethylsiloxane vinyl-terminated and having a main chain portion in which the alkyl group is substituted with a trialkoxy group); or, R 11 、R 12 And R 13 Is C 1 -C 5 Alkoxy of n, R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Is C 1 -C 5 Alkyl of R 16 、R 17 And R 18 Is C 1 -C 5 Alkoxy of (2)A group, n is 5 to 1000 (i.e., trialkoxy-terminated and side-chain vinyl-containing polysiloxane); or, R 11 And R 16 Is C 1 -C 5 Alkyl of R 12 、R 13 、R 17 And R 18 At least one of them is-O-R 20 And the remainder is C 1 -C 5 Alkyl of n, R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Is C 1 -C 5 Alkyl of R 20 Is C 1 -C 5 N is 5 to 1000 (i.e., a polysiloxane which is alkyl-terminated and has a vinyl group in a side chain while the alkyl group of the main chain portion is substituted with a trialkoxy group). Wherein, C 1 -C 5 Specific examples of alkyl groups of (a) include, but are not limited to: methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, tert-pentyl or neopentyl. C 1 -C 5 Specific examples of alkoxy groups of (a) include, but are not limited to: methoxy, ethoxy, propoxy, isopropoxy, butoxy or isobutoxy. The vinyl content of the modified vinyl silicone oil I and the modified vinyl silicone oil II is preferably 0.2 to 0.8mmoles/g, such as 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8mmoles/g and the like, independently of each other. The modified vinyl silicone oil I and the modified vinyl silicone oil II preferably have a viscosity of 30 to 200cSt, such as 30, 50, 80, 100, 120, 150, 180, 200cSt, and the like, independently of each other. In the present invention, the viscosities are all viscosities corresponding to 25 ℃.
The modified hydrogen-containing silicone oil has a structure shown in a formula (2);
in the formula (2), R 21 And R 26 Is H, R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 29 And the remainder is C 1 -C 5 Alkyl of R 24 And R 25 Is C 1 -C 5 Alkyl of R 29 Is C 1 -C 5 The alkyl group of (a) is,m is 5 to 1000 (i.e., polydialkylsiloxane having terminal hydrogen and main chain part of alkyl substituted by trialkoxy); or, R 21 、R 22 And R 23 Is C 1 -C 5 Alkoxy of m, R 24 And m R 25 At least one of which is H while remaining R 24 And R 25 Is C 1 -C 5 Alkyl of R 26 、R 27 And R 28 Is C 1 -C 5 M is 5 to 1000 (i.e., a trialkoxy-terminated and pendant hydrogenpolysiloxane); or, R 21 And R 26 Is C 1 -C 5 Alkyl of R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 30 While the remainder is C 1 -C 5 M alkyl groups of R 24 And m R 25 At least one of which is H and the remainder R 24 And R 25 Is C 1 -C 5 Alkyl of R 30 Is C 1 -C 5 M is 5 to 1000 (i.e., an alkyl-terminated and side-chain hydrogenpolysiloxane). Wherein, C 1 -C 5 Specific examples of alkyl groups of (a) include, but are not limited to: methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, tert-pentyl or neopentyl. C 1 -C 5 Specific examples of alkoxy groups of (a) include, but are not limited to: methoxy, ethoxy, propoxy, isopropoxy, butoxy or isobutoxy. The content of Si-H in the modified hydrogen-containing silicone oil is preferably 1-1.5mmoles/g, such as 1, 1.1, 1.2, 1.3, 1.4, 1.5mmoles/g and the like. Further, the viscosity of the modified hydrogen-containing silicone oil is preferably 30 to 200cSt, such as 30, 50, 80, 100, 120, 150, 180, 200cSt, and the like.
The types of the heat conductive filler i and the heat conductive filler ii are not particularly limited in the present invention, and may be conventionally selected in the art, and for example, each may be independently selected from at least one of alumina, aluminum nitride, silicon nitride, boron nitride, silicon carbide, zinc oxide, aluminum hydroxide, and fine silicon powder. The particle size of the heat-conducting filler I and the heat-conducting filler II is preferably 0.1-150 microns, and can be spherical or spheroidal. In a preferred embodiment, based on the total weight of the heat-conducting filler I and the heat-conducting filler II, the total proportion of the heat-conducting filler I and the heat-conducting filler II with the particle size of 0.1-3 microns is 1-30%, the proportion of the heat-conducting filler I and the heat-conducting filler II with the particle size of 5-15 microns is 10-40%, and the proportion of the heat-conducting filler I and the heat-conducting filler II with the particle size of 40-80 microns is 30-70%.
The catalyst can be various conventional addition type liquid silicon rubber catalysts, such as chloroplatinic acid, platinum-vinyl siloxane complexes, platinum-alkyne chelate and the like. The specific types of the platinum-vinylsiloxane complex and the platinum-alkyne chelate are well known to those skilled in the art and are not described herein.
In the present invention, the types of the powder treating agent I and the powder treating agent II are not particularly limited, and each is preferably at least one independently selected from the group consisting of methyltrimethoxysilane, octyltriethoxysilane, dodecyltrimethoxysilane and 3-methacryloxypropyltrimethylsilane.
In the present invention, the inhibitor is used to inhibit the catalytic rate of the chemical reaction catalyst, and specific examples thereof include, but are not limited to: at least one of a maleate, an alkynol, and a polyvinyl ring. Specific examples of the alkynol include, but are not limited to: at least one of vinyl cyclohexanol, 3,5-alkynol, 10-undecenol, and 2-hydroxy-2-methyl-3-butyne. Specific examples of the polyvinyl ring body include, but are not limited to: at least one of cyclic vinyl siloxane and tetravinyltetramethylcyclotetrasiloxane.
In the invention, in order to endow the two-component low-viscosity high-thermal-conductivity pouring sealant with a certain color, the component B also contains pigment. The pigment may be present in an amount of 1 to 5 parts by weight, such as 1, 2, 3, 4, 5 parts by weight, and the like. The kind of the pigment can be reasonably selected according to the actual required color, and specific examples thereof include but are not limited to: at least one of carbon black, iron oxide red, cobalt blue and cadmium yellow.
When the two-component low-viscosity high-heat-conductivity pouring sealant is used, the mass ratio of the component A to the component B is (0.9-1.1): 1 generally, so that the modified vinyl silicone oil I and the modified vinyl silicone oil II can fully react with the modified hydrogen-containing silicone oil, and the two-component low-viscosity high-heat-conductivity pouring sealant with high heat conductivity coefficient, good fluidity and long storage time can be obtained.
The preparation method of the two-component low-viscosity high-heat-conductivity pouring sealant provided by the invention comprises the following steps: preparation of component A: uniformly mixing modified vinyl silicone oil I, a heat-conducting filler I and a powder treating agent I at normal temperature, stirring and mixing the obtained mixture I at 100-120 ℃ for 1-2h under a vacuum condition, cooling to room temperature, adding a catalyst, and stirring and mixing at 100-120 ℃ for 1-2h under a vacuum condition to obtain a component A; preparation of component B: uniformly mixing the modified vinyl silicone oil II, the modified hydrogen-containing silicone oil, the heat-conducting filler II, the powder treating agent II, the inhibitor and the optional pigment, and then stirring and mixing the obtained mixture II for 1-2 hours at 100-120 ℃ under a vacuum condition to obtain the component B. Wherein the mixing can be performed in existing mixing devices such as planetary mixers.
In the following examples and comparative examples, the parts of each component are parts by weight.
Example 1 this example is used to illustrate the two-component low-viscosity high-thermal conductivity potting adhesive and the preparation method thereof provided by the present invention.
The two-component low-viscosity high-thermal-conductivity pouring sealant comprises a component A and a component B, wherein the component A comprises the following substances in parts by weight: 40 parts of modified vinyl silicone oil, 10 parts of powder treating agent, 1400 parts of heat-conducting filler and 5 parts of catalyst, wherein the component B comprises the following substances in parts by weight: 30 parts of modified vinyl silicone oil, 10 parts of modified hydrogen-containing silicone oil, 10 parts of powder treating agent, 4 parts of inhibitor, 1400 parts of heat-conducting filler and 1 part of pigment.
The modified vinyl silicone oil is polydimethylsiloxane which is end-capped by vinyl and has a main chain part of methyl substituted by trimethoxy, is purchased from An Ruike, has a trademark of 7171, and has a structure shown in a formula (1), R 11 And R 16 Is vinyl, R 12 、R 13 、R 17 And R 18 At least one of them is-O-R 19 And the remainder being methyl, R 14 And R 15 Is methyl, R 19 Is methyl, n is 5-100, the vinyl content is 0.45mmoles/g, and the viscosity is 70cSt.
The modified hydrogen-containing silicone oil is polydimethylsiloxane with hydrogen-containing end and methyl of a main chain part substituted by trimethoxy, is purchased from An Ruike company and has the mark of UM-998, and has the structure shown in the formula (2), R 21 And R 26 Is H, R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 29 While the remainder being methyl, R 24 And R 25 Is methyl, R 29 Is methyl, m is 5-100, viscosity is 50cSt, si-H content is 1.2mmoles/g.
The heat-conducting filler is aluminum nitride, and is spherical heat-conducting particles with the particle size of 0.1-80 microns. Wherein the particle size of 40-80 microns accounts for 60% of the total amount, the particle size of 5-15 microns accounts for 20% of the total amount, and the particle size of 0.1-3 microns accounts for 20% of the total amount.
The powder treating agent is methyltrimethoxysilane.
The catalyst is chloroplatinic acid.
The inhibitor is maleate.
The pigment is cobalt blue.
The preparation method of the two-component low-viscosity high-heat-conductivity pouring sealant comprises the following steps:
preparing a component A:
s11, uniformly mixing the modified vinyl silicone oil and the powder treating agent to obtain a mixture 1;
s12, uniformly mixing the heat-conducting fillers with different sizes, adding the mixture 1 into the mixture, uniformly stirring the mixture, vacuumizing the mixture, heating the mixture to 120 ℃, and stirring the mixture for 2 hours to obtain a composite material;
s13, cooling the composite material to room temperature, adding a catalyst, vacuumizing, heating to 120 ℃, and stirring for 2 hours to obtain the component A of the heat-conducting pouring sealant.
B, preparation of a component:
s21, uniformly mixing the modified vinyl silicone oil, the modified hydrogen-containing silicone oil, the powder treating agent and the inhibitor to obtain a mixture 2;
s22, uniformly mixing the heat-conducting fillers and the pigments with different sizes, adding the mixture 2, uniformly stirring, vacuumizing, heating to 120 ℃, stirring for 2 hours, and finally cooling to room temperature to obtain the heat-conducting pouring sealant B component.
Embodiment 2 this embodiment is used to illustrate the two-component low-viscosity high-thermal conductivity potting adhesive and the preparation method thereof provided by the present invention.
The two-component low-viscosity high-thermal-conductivity pouring sealant comprises a component A and a component B, wherein the component A comprises the following substances in parts by weight: 40 parts of modified vinyl silicone oil, 10 parts of powder treating agent, 1400 parts of heat-conducting filler and 4 parts of catalyst, wherein the component B comprises the following substances in parts by weight: 30 parts of modified vinyl silicone oil, 10 parts of modified hydrogen-containing silicone oil, 25 parts of powder treating agent, 4 parts of inhibitor, 1400 parts of heat-conducting filler and 1 part of pigment.
The modified vinyl silicone oil is trimethoxy terminated polysiloxane with a side chain containing vinyl, is purchased from Anbia company and has the mark of VS70M, and has the structure shown in the formula (1), R 11 、R 12 、R 13 、R 16 、R 17 And R 18 Is methoxy, n R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Is methyl, n is 5-100, the vinyl content is 0.45mmoles/g, and the viscosity is 70cSt.
The modified hydrogen-containing silicone oil is trimethoxy terminated and side chain hydrogen-containing polysiloxane which is purchased from Anbia company and has the trademark XL-2, and the modified hydrogen-containing silicone oil has the structure shown in the formula (2), R 21 、R 22 、R 23 、R 26 、R 27 And R 28 Is methoxy, m R 24 And m R 25 At least one of which is H while remaining R 24 And R 25 Is methyl, m is 5-100, viscosity is 50cSt, si-H content is 1.2mmoles/g.
The heat-conducting filler is aluminum nitride, and is spherical heat-conducting particles with the particle size of 0.1-80 microns. Wherein the particle size of 40-80 microns accounts for 60% of the total amount, the particle size of 5-15 microns accounts for 20% of the total amount, and the particle size of 0.1-3 microns accounts for 20% of the total amount.
The powder treating agent is octyl triethoxysilane.
The catalyst was platinum-vinyl siloxane, available from BTL corporation under the designation CSAT-F1.
The inhibitor is maleate.
The pigment is iron oxide red.
The preparation method of the two-component low-viscosity high-heat-conductivity pouring sealant comprises the following steps:
preparation of a component A:
s11, uniformly mixing the modified vinyl silicone oil and the powder treating agent to obtain a mixture 1;
s12, uniformly mixing the heat-conducting fillers with different sizes, adding the mixture 1 into the mixture, uniformly stirring the mixture, vacuumizing the mixture, heating the mixture to 120 ℃, and stirring the mixture for 2 hours to obtain a composite material;
s13, cooling the composite material to room temperature, adding a catalyst, vacuumizing, heating to 120 ℃, and stirring for 2 hours to obtain the component A of the heat-conducting pouring sealant.
B, preparation of a component:
s21, uniformly mixing the modified vinyl silicone oil, the modified hydrogen-containing silicone oil, the powder treating agent and the inhibitor to obtain a mixture 2;
s22, uniformly mixing the heat-conducting fillers and the pigments with different sizes, adding the mixture 2, uniformly stirring, vacuumizing, heating to 120 ℃, stirring for 2 hours, and finally cooling to room temperature to obtain the component B of the heat-conducting pouring sealant.
Example 3 this example is used to illustrate the two-component low-viscosity high-thermal conductivity potting adhesive and the preparation method thereof provided by the present invention.
The two-component low-viscosity high-thermal-conductivity pouring sealant comprises a component A and a component B, wherein the component A comprises the following substances in parts by weight: 40 parts of modified vinyl silicone oil, 10 parts of powder treating agent, 1400 parts of heat-conducting filler and 5 parts of catalyst, wherein the component B comprises the following substances in parts by weight: 30 parts of modified vinyl silicone oil, 10 parts of modified hydrogen-containing silicone oil, 10 parts of powder treating agent, 4 parts of inhibitor, 1400 parts of heat-conducting filler and 1 part of pigment.
The modified vinyl silicone oil is methyl-terminated and has a side chain containing vinylAnd the main chain part of methyl is substituted by trimethoxy polysiloxane which is purchased from Anbia and has the mark of VS50M and has the structure shown in the formula (1), R 11 And R 16 Is methyl, R 12 、R 13 、R 17 And R 18 At least one of them is-O-R 19 And the remainder being methyl, n R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Methyl, R 19 Is methyl, n is 5-100, the vinyl content is 0.65mmoles/g, and the viscosity is 50cSt.
The modified hydrogen-containing silicone oil is polysiloxane which is methyl-terminated, has hydrogen-containing side chains and is obtained from An Ruike company, has the mark DA71 and has the structure shown in the formula (2), R 21 And R 26 Is methyl, R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 30 While the remainder being methyl groups, m R 24 And m R 25 At least one of which is H and the remainder R 24 And R 25 Is methyl, R 30 Is methyl, m is 5-100, viscosity is 50cSt, si-H content is 1.2mmoles/g.
The high heat conduction filler is alumina which is spherical heat conduction particles with the particle size of 0.1-80 microns, wherein the particle size of 40-80 microns accounts for 60% of the total amount, the particle size of 5-15 microns accounts for 20% of the total amount, and the particle size of 0.1-3 microns accounts for 20% of the total amount.
The powder treating agent is 3-methacryloxypropyltrimethylsilane.
The catalyst is a platinum-alkyne-based chelate purchased from BTL company under the trademark CSAT-F1.
The inhibitor is maleate.
The pigment is cadmium yellow.
The preparation method of the two-component low-viscosity high-heat-conductivity pouring sealant comprises the following steps:
preparation of a component A:
s11, uniformly mixing the modified vinyl silicone oil and the powder treating agent to obtain a mixture 1;
s12, uniformly mixing the heat-conducting fillers with different sizes, adding the mixture 1 into the mixture, uniformly stirring the mixture, vacuumizing the mixture, heating the mixture to 120 ℃, and stirring the mixture for 2 hours to obtain a composite material;
s13, cooling the composite material to room temperature, adding a catalyst, vacuumizing, heating to 120 ℃, and stirring for 2 hours to obtain the component A of the heat-conducting pouring sealant.
B, preparation of a component:
s21, uniformly mixing the modified vinyl silicone oil, the modified hydrogen-containing silicone oil, the powder treating agent and the inhibitor to obtain a mixture 2;
s22, uniformly mixing the heat-conducting fillers and the pigments with different sizes, adding the mixture 2, uniformly stirring, vacuumizing, heating to 120 ℃, stirring for 2 hours, and finally cooling to room temperature to obtain the component B of the heat-conducting pouring sealant.
Example 4 this example is used to illustrate the two-component low-viscosity high-thermal conductivity potting adhesive and the preparation method thereof provided by the present invention.
The two-component low-viscosity high-heat-conductivity pouring sealant comprises the following components in parts by weight: the adhesive comprises a component A and a component B, wherein the component A comprises the following substances in parts by weight: 40 parts of modified vinyl silicone oil, 10 parts of powder treating agent, 1400 parts of heat-conducting filler and 5 parts of catalyst, wherein the component B comprises the following substances in parts by weight: 30 parts of modified vinyl silicone oil, 10 parts of modified hydrogen-containing silicone oil, 10 parts of powder treating agent, 3 parts of inhibitor, 1400 parts of heat-conducting filler and 1 part of pigment.
The modified vinyl silicone oil is trimethoxy terminated and side chain vinyl-containing polysiloxane which is purchased from Anbia and has the trade name of VS70M, and has the structure shown in the formula (1), R 11 、R 12 、R 13 、R 16 、R 17 And R 18 Is methoxy, n R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Is methyl, n is 5-100, the vinyl content is 0.45mmoles/g, and the viscosity is 70cSt.
The modified hydrogen-containing silicone oil is polydimethylsiloxane with hydrogen-containing end and methyl of a main chain part substituted by trimethoxy, is purchased from An Ruike company and has the mark of UM-998, and has the structure shown in the formula (2), R 21 And R 26 Is H, R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 29 While the remainder being methyl, R 24 And R 25 Is methyl, R 29 Is methyl, m is 5-100, viscosity is 50cSt, si-H content is 1.2mmoles/g.
The heat-conducting filler is aluminum nitride, and is spherical heat-conducting particles with the particle size of 0.1-80 microns. Wherein the particle size of 40-80 microns accounts for 60% of the total amount, the particle size of 5-15 microns accounts for 20% of the total amount, and the particle size of 0.1-3 microns accounts for 20% of the total amount.
The powder treating agent is methyltrimethoxysilane.
The catalyst is chloroplatinic acid.
The inhibitor is maleate.
The pigment is carbon black.
The preparation method of the two-component low-viscosity high-heat-conductivity pouring sealant comprises the following steps:
preparing a component A:
s11, uniformly mixing the modified vinyl silicone oil and the powder treating agent to obtain a mixture 1;
s12, uniformly mixing the heat-conducting fillers with different sizes, adding the mixture 1 into the mixture, uniformly stirring the mixture, vacuumizing the mixture, heating the mixture to 120 ℃, and stirring the mixture for 2 hours to obtain a composite material;
s13, cooling the composite material to room temperature, adding a catalyst, vacuumizing, heating to 120 ℃, and stirring for 2 hours to obtain the component A of the heat-conducting pouring sealant.
B, preparation of a component:
s21, uniformly mixing the modified vinyl silicone oil, the modified hydrogen-containing silicone oil, the powder treating agent and the inhibitor to obtain a mixture 2;
s22, uniformly mixing the heat-conducting fillers and the pigments with different sizes, adding the mixture 2, uniformly stirring, vacuumizing, heating to 120 ℃, stirring for 2 hours, and finally cooling to room temperature to obtain the component B of the heat-conducting pouring sealant.
Example 5
The two-component low-viscosity high-thermal-conductivity pouring sealant is prepared according to the method of the embodiment 1, except that the particle size of the thermal-conductivity filler is controlled to be 40-80 microns, and the rest conditions are the same as those of the embodiment 1, so that the thermal-conductivity silicone gel is obtained.
Comparative example 1
A two-component low-viscosity high-thermal-conductivity potting adhesive was prepared as in example 5, except that the same parts by weight of hydroxyl-terminated silicone oil (available from Ambia corporation, brand DA30, having a structure represented by formula (1)), R, was used as the modified vinyl silicone oil 11 And R 16 Are each hydroxy, R 12 、R 13 、R 14 、R 15 、R 17 And R 18 All methyl) and the other conditions are the same as in example 5, thus obtaining the reference two-component pouring sealant with low viscosity and high thermal conductivity.
Comparative example 2
A two-component, low-viscosity, high-thermal conductivity potting adhesive was prepared as in example 5, except that the modified vinyl silicone oil was the same weight parts of vinyl-terminated polydimethylsiloxane (available from Anbia, inc., designation VS100M, having the structure shown in formula (1), R 11 Is vinyl, R 12 、R 13 、R 14 、R 15 、R 16 、R 17 And R 18 Methyl, the vinyl content is 0.37mmoles/g, the viscosity is 100 cSt) and the rest conditions are the same as those in example 5, thus obtaining the reference two-component low-viscosity high-thermal-conductivity pouring sealant.
Comparative example 3
A two-component low-viscosity high-thermal-conductivity pouring sealant is prepared according to the method of example 5, except that the modified hydrogen-containing silicone oil adopts the same weight parts of hydrogen-terminated polydimethylsiloxane (which is purchased from An Ruike company, and has the brand number of DA100 and the structure shown in formula (2), R 21 And R 28 Are all H, R 22 、R 23 、R 24 、R 25 、R 26 And R 27 All methyl, wherein the Si-H content is 0.4mmoles/g, the viscosity is 100 cSt), and the rest conditions are the same as those in example 5, so that the reference two-component low-viscosity high-thermal-conductivity pouring sealant is obtained.
Test example
(1) Viscosity: component A and component B from each of the above examples and comparative examples were mixed uniformly at room temperature in a mass ratio of 1:1, after which the viscosity of the resulting mixture was tested at 100rpm using a Brookfield 14# rotor. In addition, the viscosity of commercially available potting adhesive 1 (obtained from lode corporation, under the designation 324, the same applies hereinafter) and commercially available potting adhesive 2 (obtained from IBOX corporation, under the designation IBOX-1400GF, the same applies hereinafter) was measured by the same method. The results are shown in Table 1.
(2) Coefficient of thermal conductivity:
the component A and the component B obtained in each of the above examples and comparative examples were mixed uniformly at room temperature in a mass ratio of 1:1, and then the thermal conductivity of the resulting mixture was measured according to the method of ASTM-D547. In addition, the thermal conductivity of the above commercially available potting adhesive 1 and commercially available potting adhesive 2 was also measured in accordance with ASTM-D547. The results are shown in Table 1.
(3) Self-leveling property:
the component A and the component B obtained in the above examples and comparative examples are uniformly mixed at room temperature according to the mass ratio of 1:1, 1mL of the obtained sample is taken and dropped on a glass plate, waiting for 5min, and the diameter of the sample finally spread is examined. In addition, the self-leveling properties of the commercially available potting adhesive 1 and the commercially available potting adhesive 2 were measured by the same method, and the results are shown in table 1.
(4) Settling property:
the components A and B obtained in the above examples and comparative examples were left for three months and then observed to see if there was separation of oil and powder on the surface, and the results are shown in Table 1.
TABLE 1
As can be seen from Table 1, the two-component low-viscosity high-thermal-conductivity pouring sealant provided by the invention has the advantages of higher thermal conductivity, lower viscosity, better spreading performance and better stability.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (13)
1. The two-component low-viscosity high-thermal-conductivity pouring sealant is characterized by comprising a component A and a component B which are independently stored, wherein the component A contains 30-50 parts by weight of modified vinyl silicone oil I, 800-1500 parts by weight of thermal-conductivity filler I, 5-25 parts by weight of powder treating agent I and 1-5 parts by weight of catalyst, and the component B contains 30-50 parts by weight of modified vinyl silicone oil II, 3-10 parts by weight of modified hydrogen-containing silicone oil, 800-1500 parts by weight of thermal-conductivity filler II, 5-25 parts by weight of powder treating agent II and 1-5 parts by weight of inhibitor; the modified vinyl silicone oil I and the modified vinyl silicone oil II respectively and independently have structures shown in a formula (1), and the modified hydrogen-containing silicone oil has a structure shown in a formula (2);
in the formula (1), R 11 And R 16 Is vinyl, R 12 、R 13 、R 17 And R 18 At least one of them is-O-R 19 And the remainder is C 1 -C 5 Alkyl of R 14 And R 15 Is C 1 -C 5 Alkyl of R 19 Is C 1 -C 5 N is 5 to 1000; or, R 11 、R 12 And R 13 Is C 1 -C 5 Alkoxy of n, R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Is C 1 -C 5 Alkyl of R 16 、R 17 And R 18 Is C 1 -C 5 N is 5 to 1000; or, R 11 And R 16 Is C 1 -C 5 Alkyl of R 12 、R 13 、R 17 And R 18 At least one of them is-O-R 20 And the remainder is C 1 -C 5 Alkyl of n, R 14 And n R 15 At least one of which is vinyl and the remainder R 14 And R 15 Is C 1 -C 5 Alkyl of R 20 Is C 1 -C 5 N is 5 to 1000;
in the formula (2), R 21 And R 26 Is H, R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 29 And the remainder is C 1 -C 5 Alkyl of R 24 And R 25 Is C 1 -C 5 Alkyl of R 29 Is C 1 -C 5 M is 5 to 1000; or, R 21 、R 22 And R 23 Is C 1 -C 5 Alkoxy of m, R 24 And m R 25 At least one of which is H and the remainder R 24 And R 25 Is C 1 -C 5 Alkyl of R 26 、R 27 And R 28 Is C 1 -C 5 M is 5 to 1000; or, R 21 And R 26 Is C 1 -C 5 Alkyl of R 22 、R 23 、R 27 And R 28 At least one of them is-O-R 30 And the remainder is C 1 -C 5 M alkyl groups of R 24 And m R 25 At least one of which is H and the remainder R 24 And R 25 Is C 1 -C 5 Alkyl of R 30 Is C 1 -C 5 M is 5 to 1000.
2. The two-component low-viscosity high-thermal-conductivity pouring sealant as claimed in claim 1, wherein the vinyl contents of the modified vinyl silicone oil I and the modified vinyl silicone oil II are respectively and independently 0.2-0.8mmoles/g.
3. The two-component low-viscosity high-thermal-conductivity pouring sealant as claimed in claim 1, wherein the modified hydrogen-containing silicone oil contains Si-H in an amount of 1-1.5mmoles/g.
4. The two-component low-viscosity high-thermal-conductivity pouring sealant as claimed in claim 1, wherein the modified vinyl silicone oil I and the modified vinyl silicone oil II have viscosities of 30-200cSt independently; the viscosity of the modified hydrogen-containing silicone oil is 30-200cSt.
5. The two-component pouring sealant with low viscosity and high thermal conductivity as claimed in claim 1, wherein the thermal conductive filler I and the thermal conductive filler II are respectively and independently selected from at least one of alumina, aluminum nitride, silicon nitride, boron nitride, silicon carbide, zinc oxide, aluminum hydroxide and silicon micropowder.
6. The two-component low-viscosity high-thermal-conductivity pouring sealant as claimed in claim 5, wherein based on the total weight of the thermal-conductivity filler I and the thermal-conductivity filler II, the total proportion of the thermal-conductivity filler I and the thermal-conductivity filler II with the particle size of 0.1-3 microns is 1-30%, the proportion of the thermal-conductivity filler I and the thermal-conductivity filler II with the particle size of 5-15 microns is 10-40%, and the proportion of the thermal-conductivity filler I and the thermal-conductivity filler II with the particle size of 40-80 microns is 30-70%.
7. The two-component low-viscosity high-thermal-conductivity pouring sealant as claimed in claim 1, wherein the powder treating agent I and the powder treating agent II are independently selected from at least one of methyltrimethoxysilane, octyltriethoxysilane, dodecyltrimethoxysilane and 3-methacryloxypropyltrimethylsilane.
8. The two-component low-viscosity high-thermal-conductivity pouring sealant according to claim 1, wherein the catalyst is at least one selected from chloroplatinic acid, a platinum-vinylsiloxane complex and a platinum-alkyne chelate.
9. The two-component low viscosity high thermal conductivity potting adhesive of claim 1, wherein the inhibitor is selected from at least one of a maleate, an alkynol, and a polyvinyl ring.
10. The two-component low-viscosity high-thermal-conductivity pouring sealant as claimed in claim 1, wherein the component B further contains a pigment; the content of the pigment is 1-5 parts by weight; the pigment is at least one selected from carbon black, iron oxide red, cobalt blue and cadmium yellow.
11. The two-component pouring sealant with low viscosity and high thermal conductivity as claimed in claim 1, wherein the mass ratio of the component A to the component B is (0.9-1.1): 1 when in use.
12. The preparation method of the two-component low-viscosity high-thermal-conductivity pouring sealant as claimed in any one of claims 1 to 11, characterized in that the method comprises the following steps:
preparation of component A: uniformly mixing modified vinyl silicone oil I, a heat-conducting filler I and a powder treating agent I at normal temperature, stirring and mixing the obtained mixture I at 100-120 ℃ for 1-2h under a vacuum condition, cooling to room temperature, adding a catalyst, and stirring and mixing at 100-120 ℃ for 1-2h under a vacuum condition to obtain a component A;
preparation of component B: uniformly mixing the modified vinyl silicone oil II, the modified hydrogen-containing silicone oil, the heat-conducting filler II, the powder treating agent II, the inhibitor and the optional pigment, and then stirring and mixing the obtained mixture II for 1-2 hours at 100-120 ℃ under a vacuum condition to obtain the component B.
13. The use of the two-component, low-viscosity, high-thermal conductivity potting adhesive of any of claims 1-11 in electronic heat dissipating components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211035226.6A CN115260985A (en) | 2022-08-26 | 2022-08-26 | Two-component low-viscosity high-heat-conductivity pouring sealant and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211035226.6A CN115260985A (en) | 2022-08-26 | 2022-08-26 | Two-component low-viscosity high-heat-conductivity pouring sealant and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115260985A true CN115260985A (en) | 2022-11-01 |
Family
ID=83754417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211035226.6A Pending CN115260985A (en) | 2022-08-26 | 2022-08-26 | Two-component low-viscosity high-heat-conductivity pouring sealant and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115260985A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116396716A (en) * | 2023-02-23 | 2023-07-07 | 东莞市德聚胶接技术有限公司 | Double-component low-density heat-conducting type organic silicon pouring sealant and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1528000A (en) * | 2001-04-06 | 2004-09-08 | ����Ʋ��ɷ�����˾ | Electrically conductive silicones and method of manufacture thereof |
| JP2005162975A (en) * | 2003-12-05 | 2005-06-23 | Ge Toshiba Silicones Co Ltd | Heat conductive silicone composition |
| CN109593510A (en) * | 2018-12-17 | 2019-04-09 | 杭州之江新材料有限公司 | Alkoxy end-capped organosilicon polymer, preparation method and single-component de-alcoholized organosilicon sealant |
| CN112778766A (en) * | 2020-12-31 | 2021-05-11 | 广东皓明有机硅材料有限公司 | High-reliability high-thermal-conductivity silicone gel composition and preparation method and application thereof |
| CN113736266A (en) * | 2021-09-27 | 2021-12-03 | 广州集泰化工股份有限公司 | Double-component heat-conducting gel and preparation method and application thereof |
-
2022
- 2022-08-26 CN CN202211035226.6A patent/CN115260985A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1528000A (en) * | 2001-04-06 | 2004-09-08 | ����Ʋ��ɷ�����˾ | Electrically conductive silicones and method of manufacture thereof |
| JP2005162975A (en) * | 2003-12-05 | 2005-06-23 | Ge Toshiba Silicones Co Ltd | Heat conductive silicone composition |
| CN109593510A (en) * | 2018-12-17 | 2019-04-09 | 杭州之江新材料有限公司 | Alkoxy end-capped organosilicon polymer, preparation method and single-component de-alcoholized organosilicon sealant |
| CN112778766A (en) * | 2020-12-31 | 2021-05-11 | 广东皓明有机硅材料有限公司 | High-reliability high-thermal-conductivity silicone gel composition and preparation method and application thereof |
| CN113736266A (en) * | 2021-09-27 | 2021-12-03 | 广州集泰化工股份有限公司 | Double-component heat-conducting gel and preparation method and application thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116396716A (en) * | 2023-02-23 | 2023-07-07 | 东莞市德聚胶接技术有限公司 | Double-component low-density heat-conducting type organic silicon pouring sealant and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2998376B1 (en) | Thermally conductive silicone adhesive composition for reactor and reactor | |
| US6040362A (en) | Heat-conducting polymer composition | |
| CN103102689B (en) | Organic-silicon pouring sealant composition with high thermal conductivity and application thereof | |
| CN100395303C (en) | Extrudable bridged grease-like heat radiating material, container sealingly filled with material, method of mfg. container, and method of radiating heat by use thereof | |
| CN110088206A (en) | The protective agent or adhesive composition of curable organopolysiloxane composition and electric and electronic components | |
| CN109890900A (en) | One-part curable type heat conductive silicone grease composition and electronic/electrical pneumatic module | |
| EP2094805A2 (en) | Silicone adhesive composition and method for preparing the same | |
| CN103030976A (en) | Single-component heat-curing liquid silicone rubber and preparation method thereof | |
| US6069201A (en) | Zinc oxide-filled addition-curable silicone rubber compositions | |
| CN113136140B (en) | Organic silicon fireproof heat-insulating coating and preparation method thereof | |
| CN111394055B (en) | Organic silicon pouring sealant, preparation method and novel electric drive motor | |
| CN107141815A (en) | A kind of low modulus heat conduction organosilicon material of high temperature resistant and preparation method thereof | |
| CN112226199B (en) | Curable ultrahigh-heat-conduction paste-shaped insulating composition and preparation method thereof | |
| TW201700616A (en) | Thermal conductive silicone composition and cured product, and composite sheet | |
| CN110982277B (en) | Single-component temperature-resistant heat-conducting silicon mud composition and preparation method thereof | |
| CN114032063B (en) | High-heat-conductivity low-viscosity bi-component organic silicon pouring sealant and preparation method thereof | |
| CN115260985A (en) | Two-component low-viscosity high-heat-conductivity pouring sealant and preparation method and application thereof | |
| CN114958002A (en) | Heat-conducting silica gel and preparation method thereof | |
| KR102075461B1 (en) | Liquid silicone composition with high heat dissipation | |
| EP3664169A1 (en) | Dispersion liquid, composition, sealing member, light-emitting device, illumination tool, display device, and method for producing light-emitting device | |
| JP2022060339A (en) | Heat conductive silicone composition | |
| CN114196209A (en) | Addition-curable two-component high-stability heat-conducting organic silicon composition and preparation method thereof | |
| CN104530436A (en) | Benzoxazine modified silicon boron tackifier and preparation method and application thereof | |
| CN106995530A (en) | Silicone epoxy, curable silicon composition and its application | |
| CN115074079A (en) | Single-component addition type organic silicon heat-conducting adhesive and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: No. 1-2, Xincuo North Road, Tongxianggao New Town, Xiamen Torch Hi-tech Zone, Tong'an District, Xiamen City, Fujian Province, 361001 Applicant after: Weiertong Technology Co.,Ltd. Address before: 361001 room w704a, Taiwan Science and technology enterprise education center, No. 88, Xiangxing Road, torch high tech Zone (Xiang'an) Industrial Zone, Xiamen, Fujian Applicant before: Weiertong (Xiamen) Technology Co.,Ltd. |