CN115260647A - Polypropylene-high temperature resistant polymer blend film, preparation method thereof and capacitor core - Google Patents

Polypropylene-high temperature resistant polymer blend film, preparation method thereof and capacitor core Download PDF

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Publication number
CN115260647A
CN115260647A CN202110485237.3A CN202110485237A CN115260647A CN 115260647 A CN115260647 A CN 115260647A CN 202110485237 A CN202110485237 A CN 202110485237A CN 115260647 A CN115260647 A CN 115260647A
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polypropylene
resistant polymer
high temperature
temperature resistant
resin
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CN202110485237.3A
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Inventor
张志成
蔡颖辉
刘振学
胡习光
解云川
董博
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Xian Jiaotong University
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Xian Jiaotong University
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors 
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/10Homopolymers or copolymers of propene
    • C08J2323/12Polypropene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/18Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08J2423/20Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2445/00Characterised by the use of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Derivatives of such polymers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)

Abstract

The invention discloses a polypropylene-high temperature resistant polymer blend film, a preparation method thereof and a capacitor core, wherein the film is prepared from the following raw materials in parts by weight: polypropylene resin: 1, the preparation method of the high temperature resistant polymer resin = 1:1-12 comprises the following steps: the polypropylene resin is used as a main material, a certain amount of high-temperature resistant thermoplastic polymer resin, such as poly 4-methylpentene (TPX), cyclic Olefin Copolymer (COC) and the like, is added into the polypropylene resin through physical blending to obtain polymer blend resin, and the polymer blend resin is used as a raw material to be subjected to melt extrusion casting and biaxial stretching in the conventional industrial production line to prepare a film. The polypropylene-high temperature resistant polymer blend film for the capacitor has heat resistance not lower than 125 ℃, and can be used in the fields of capacitors for smart power grids, new energy automobiles and pulse power equipment.

Description

Polypropylene-high temperature resistant polymer blend film, preparation method thereof and capacitor core
Technical Field
The invention belongs to the technical field of electronic materials, and particularly relates to a polypropylene-high temperature resistant polymer blend film, a preparation method thereof and a capacitor core.
Background
In recent years, with the emergence of application scenes of military and civil high-end equipment such as smart grids, new energy automobiles, pulse power capacitors and the like, film capacitors with high-temperature resistance characteristics are receiving close attention. The core of the Capacitor is mostly formed by winding a single-sided Metallized Film, and belongs to a Metallized Film Capacitor (MFC). The core material metallized film in the MFC consists of a polymer dielectric and a metal electrode and plays the roles of storing and releasing electric energy. The polymer dielectric medium is usually a flexible polymer film with the thickness of 2-10 μm, and the temperature resistance and the electrical performance of the film determine the service temperature, the dielectric energy storage and other related performances of the capacitor.
At present, polypropylene (PP) is the most commonly used dielectric material in MFC commercial products, and has the advantages of low price, easy stretching into a thin film, high voltage resistance (500-700 MV/m), low loss (dielectric loss is 10 MV/m)-4Magnitude order), high charging and discharging speed, and the like, but the temperature resistance is poor, and the instability and even breakdown damage of a corresponding capacitor can be caused by high-temperature softening of the PP material at the temperature of more than 85 ℃, so that the application of the MFC under the high-temperature working condition is greatly limited. Therefore, the development of polypropylene-high temperature resistant polymer blend film dielectrics for capacitors (>125 ℃ C.) is already in force. Several types of commonly used commercial high temperature resistant polymer materials reported in the literature, such as Polycarbonate (PC), polyphenylene sulfide (PPS), polyetherimide (PEI), polyetheretherketone (PEEK), and the like, have high dielectric loss values, cause excessive loss, have low breakdown fields, are easy to break down, have a molecular structure which is difficult to self-heal, or have difficulty in processing the materials into large surfacesThe film is accumulated, so that the problem of high temperature resistance is difficult to implement by replacing a biaxially oriented polypropylene film (BOPP) with a brand new material in a short time. In the prior art, inorganic small molecular particles and polypropylene are selected to be blended into a composite material to improve the temperature resistance of the composite material, but the inorganic fillers have poor compatibility with the polypropylene, so that the improvement on the heat resistance of the composite material is limited on one hand, and the subsequent stretch film forming is not facilitated on the other hand.
Based on the temperature resistance improvement principle of high molecular materials, the invention provides that high-temperature resistant polymer resin is added into polypropylene resin by a physical blending method to prepare a polymer blending resin raw material, so as to improve the temperature resistance of a blend film after biaxial stretching. However, to achieve this goal, several key technical issues need to be solved: firstly, the added high-temperature resistant polymer resin not only needs to have higher melting point or glass transition temperature, but also needs to have better compatibility with the polypropylene resin, and the cracking or other physical defects of the product film caused by the incompatibility among different materials in the film processing stages of melting, stretching and the like can not be generated; secondly, the added polymer resin can not obviously reduce the crystallinity and the mechanical strength of the polypropylene resin so as to avoid causing biaxial tension failure or obviously reducing the mechanical property and the electrical property of the film dielectric medium; thirdly, the processing conditions of the blended resin after adding the high-temperature resistant polymer resin, such as melting temperature, stretching temperature and the like, are similar to those of polypropylene, and the condition that the blended resin cannot be processed into a film under the existing production conditions due to too large difference is avoided
Disclosure of Invention
Based on the problems in the background art, the invention aims to overcome the defect that the existing capacitor based on the polypropylene biaxially oriented film (BOPP) is limited in application because polypropylene resin has insufficient heat resistance (< 85 ℃) and cannot be stably used in a high-temperature environment (> 125 ℃), and the heat resistance of the polypropylene resin and the stretched film thereof needs to be improved in order to improve the temperature resistance of the capacitor. The invention provides a polypropylene-high temperature resistant polymer blend film, a preparation method thereof and a capacitor core.
In the present invention, the high-temperature-resistant polymer resin means a polymer resin having a heat distortion temperature of 125 ℃ or higher.
The invention provides a polypropylene-high temperature resistant polymer blend film, which is prepared from the following raw materials in parts by weight: polypropylene resin: high temperature resistant polymer resin = 1:1-12, preferably polypropylene resin: high temperature resistant polymer resin =7:3 to 9:1.
the further scheme is that the melting point of the high-temperature resistant polymer resin is higher than the melting point of the polypropylene resin, or the heat distortion temperature of the high-temperature resistant polymer resin is higher than the heat distortion temperature of the polypropylene resin, or the Vicat softening point of the high-temperature resistant polymer resin is higher than the Vicat softening point of the polypropylene resin.
In a further scheme, the high-temperature resistant polymer resin is selected from any one of poly 4-methylpentene and cyclic olefin copolymer.
In a second aspect of the present invention, a method for preparing the polypropylene-high temperature resistant polymer blend film is provided, which comprises the following steps:
a. preparation of polymer blend resin raw materials:
the polypropylene resin and the high-temperature resistant polymer resin are physically and uniformly mixed according to the weight ratio of 1:1-12;
b. and (3) biaxial stretching film preparation:
processing the blended resin raw materials, and shaping the blended resin raw materials into a polypropylene-high temperature resistant polymer blended film through biaxial stretching treatment, wherein the thickness of the film is 2-20 mu m, and the sum of the longitudinal thermal shrinkage rate and the transverse thermal shrinkage rate of the polypropylene-high temperature resistant polymer blended film is less than or equal to 5% under the conditions that the thermal shrinkage test temperature is 125 ℃ and the time is 15 minutes.
In a further scheme, in the step b, the processing comprises heating and melting, impurity filtering, extruding a die head, casting into a sheet, biaxial stretching and heat setting.
In the step b, the thickness of the casting slice obtained by casting the sheet is 0.2-2 mm.
In a third aspect of the present invention, there is provided a capacitor core comprising the above polypropylene-high temperature resistant polymer blend film.
The further proposal is that the capacity reduction of the capacitor core is not more than 5 percent in durability test at 125 ℃ for 2000 hours
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a polypropylene-high temperature resistant polymer blend film, a preparation method thereof and a capacitor core, wherein low-polarity poly 4-methylpentene or cycloolefin copolymer is selected as high temperature resistant polymer resin to be blended with polypropylene resin, so that the high temperature resistant polymer resin and the low-polarity polypropylene resin have good compatibility, and the film forming property and other manufacturability of polypropylene in the processing process are not influenced. The poly-4-methylpentene or cycloolefin copolymer is selected as the high-temperature-resistant polymer resin with high heat resistance, so that the heat resistance of the blended resin is higher than that of the polypropylene resin, and the polypropylene-high-temperature-resistant polymer blended film with the heat resistance of not less than 125 ℃ can be obtained, and can be used in the fields of smart grids, new energy vehicles and capacitors for pulse power equipment.
Detailed Description
In order to make the objects, technical solutions, design methods and advantages of the present invention more apparent, the present invention is further described in detail by the following specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Hereinafter, specific embodiments of the present application will be described in detail, and those skilled in the art can clearly understand the present application and can implement the present application according to the detailed description. Features from different embodiments may be combined to yield new embodiments, or certain features may be substituted for certain embodiments to yield yet further preferred embodiments, without departing from the principles of the present application.
The following examples of the invention were tested for heat distortion temperature of PP, COC, TPX: the PP is 85 ℃; COC is 150 ℃; TPX is 160 ℃.
The invention provides a polypropylene-high temperature resistant polymer blend film, which is prepared from the following raw materials in parts by weight: polypropylene resin: high temperature resistant polymer resin = 1:1-12.
In the polypropylene-high temperature resistant polymer blend film provided by the invention, the heat resistance of the high temperature resistant polymer resin is higher and simultaneously far higher than that of the polypropylene resin, so that the heat resistance of the blend resin of the high temperature resistant polymer resin and the polypropylene resin is possibly higher than that of the polypropylene resin; in addition, the high temperature resistant polymer resin and the low polarity polypropylene resin need to have good compatibility, so that the film forming property and other manufacturability of the polypropylene in the processing process are not influenced. In the embodiment of the present invention, poly-4-methylpentene (TPX) and Cyclic Olefin Copolymer (COC) are preferably used as the high temperature resistant polymer resin. In some embodiments, the mass ratio of the polypropylene resin to the high temperature resistant polymer resin is preferably 3:1 to 4:1; in some embodiments, the mass ratio of the polypropylene resin to the high temperature resistant polymer resin is preferably 7:3 to 9:1.
in a second aspect of the present invention, a method for preparing the polypropylene-high temperature resistant polymer blend film is provided, the method comprising the following steps:
a. preparation of polymer blend resin: the polypropylene resin and the high-temperature resistant polymer resin are physically and uniformly mixed according to the proportion to prepare a blending resin raw material;
b. and (3) biaxial stretching film preparation: the blending resin raw material is subjected to heating and melting, impurity filtering, extrusion die head, tape casting sheeting, biaxial stretching and heat setting on the existing production line to prepare the polymer film for the capacitor.
In some embodiments, step b biaxially stretching film formation is carried out in a commercial film biaxially stretching apparatus comprising modules for heat melting of resin feedstock, impurity filtration, extrusion die, cast sheeting, biaxial stretching, said cast sheeting having a cast sheet thickness of 0.5 to 2mm and a film thickness of 2 to 20 μm.
The third aspect of the invention provides a capacitor core, which is formed by cutting the biaxially oriented and shaped film, performing electrode evaporation according to capacitor design parameters and processes, and finally winding and packaging.
The following examples are provided to further illustrate various features of the present invention. These examples also illustrate useful methods for practicing the invention. These examples are not intended to limit the claimed invention.
Example 1
The polypropylene-high temperature resistant polymer blend film in the embodiment is prepared from the following raw materials in parts by weight: 80 parts of PP and 20 parts of COC, namely the mass ratio of PP to COC is 4:1. the preparation process comprises the following steps: PP and COC are physically blended, melted at 240 ℃, extruded into a sheet, and subjected to biaxial tension film making. Wherein the stretching temperature of longitudinal stretching is 130 ℃, and the stretching ratio is 4.0 times; the stretching temperature of transverse stretching is 150 ℃, and the stretching ratio is 7.0 times; the sum of the longitudinal and transverse heat shrinkages after stretching is not more than 5% (when standing for 15 minutes at 125 ℃). And cutting the biaxially oriented film, performing electrode evaporation according to capacitor design parameters and processes, and finally winding and packaging to obtain the capacitor core.
Example 2
The polypropylene-high temperature resistant polymer blend film is prepared from the following raw materials in parts by weight: 75 parts of PP and 25 parts of COC, wherein the mass ratio of PP to COC is 3:1. the preparation process comprises the following steps: PP and COC were expressed as PP: COC =3:1, melting at 250 ℃, extruding into a sheet, and performing biaxial stretching film preparation, wherein the stretching temperature of longitudinal stretching is 140 ℃, and the stretching ratio is 5.0 times; the stretching temperature of transverse stretching is 160 ℃, and the stretching ratio is 8.0 times; the sum of the longitudinal and transverse heat shrinkages after stretching is not more than 5% (when standing for 15 minutes at 125 ℃). And cutting the biaxially oriented film, performing electrode evaporation according to capacitor design parameters and processes, and finally winding and packaging to obtain the capacitor core.
Example 3
The polypropylene-high temperature resistant polymer blend film is prepared from the following raw materials in parts by weight: 90 parts of PP and 10 parts of TPX, namely the mass ratio of PP to COC is 9:1. the preparation process comprises the following steps: PP and COC were expressed as PP: TPX =9:1, melting at 260 ℃, extruding into a sheet, and performing biaxial stretching film preparation, wherein the stretching temperature of longitudinal stretching is 150 ℃, and the stretching ratio is 5.0 times; the stretching temperature of transverse stretching is 160 ℃, and the stretching ratio is 8.0 times; the sum of the longitudinal and transverse heat shrinkages after stretching is not more than 5% (when standing for 15 minutes at 125 ℃). And cutting the biaxially oriented film, performing electrode evaporation according to capacitor design parameters and processes, and finally winding and packaging to obtain the capacitor core.
Example 4
The polypropylene-high temperature resistant polymer blend film of the embodiment is composed of the following raw materials in parts by weight: 70 parts by weight of PP, 30 parts by weight of TPX, calculated as PP: TPX =7:3, melting at 255 ℃, extruding into a sheet, and performing biaxial stretching film preparation, wherein the stretching temperature of longitudinal stretching is 145 ℃, and the stretching ratio is 4.5 times; the stretching temperature of transverse stretching is 165 ℃, and the stretching ratio is 7.5 times; the sum of the longitudinal and transverse heat shrinkages after stretching is not more than 5% (when standing for 15 minutes at 125 ℃). And cutting the biaxially oriented film, performing electrode evaporation according to capacitor design parameters and processes, and finally winding and packaging to obtain a capacitor core.
The capacitor cores obtained in the 4 embodiments were subjected to a temperature resistance evaluation test at 125 ℃ for 2000 hours, and the results are shown in table 1.
TABLE 1 evaluation test results of temperature resistance of capacitor core
Blending ratio (weight ratio) of raw materials Temperature resistant test conditions1 Durability is goodTest results2
Example 1 PP:COC=4:1 125℃ By passing
Example 2 PP:COC=3:1 125℃ By passing
Example 3 PP:TPX=9:1 125℃ By passing
Example 4 PP:TPX=7:3 125℃ By passing
1Test voltage: direct current is applied according to design voltage;
2the standard is as follows: the capacitor core capacity drop is not more than 5% in durability test at 125 deg.C for 2000 hr.
Although the present application has been described above with reference to specific embodiments, those skilled in the art will recognize that many changes may be made in the configuration and details of the present application within the principles and scope of the present application. The scope of protection of the present application is determined by the appended claims, and all changes that come within the meaning and range of equivalency of the technical features of the claims are intended to be embraced therein.
It should be noted that, although the steps are described in a specific order, the steps are not necessarily performed in the specific order, and in fact, some of the steps may be performed concurrently or even in a changed order as long as the required functions are achieved.
Having described embodiments of the present invention, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or technical improvements to the market, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims (10)

1. A polypropylene-high temperature resistant polymer blend film is characterized in that the film is prepared from the following raw materials in percentage by weight: polypropylene resin: high temperature resistant polymer resin = 1:1-12.
2. The polypropylene-high temperature resistant polymer blend film according to claim 1, wherein the melting point of the high temperature resistant polymer resin is higher than the melting point of the polypropylene resin, or the heat distortion temperature of the high temperature resistant polymer resin is higher than the heat distortion temperature of the polypropylene resin, or the vicat softening point of the high temperature resistant polymer resin is higher than the vicat softening point of the polypropylene resin.
3. The polypropylene-high temperature-resistant polymer blend film according to claim 1, wherein the high temperature-resistant polymer resin is selected from any one of poly 4-methylpentene and cyclic olefin copolymer.
4. The method for preparing the polypropylene-high temperature resistant polymer blend film according to any one of claims 1 to 3, characterized by comprising the following steps:
step a, preparing polymer blend resin raw materials:
the polypropylene resin and the high-temperature resistant polymer resin are physically and uniformly mixed according to the weight ratio of 1:1-12;
step b, biaxially stretching film preparation:
and processing the blended resin raw material, and shaping into the polypropylene-high temperature resistant polymer blended film through biaxial stretching treatment.
5. The method for preparing the polypropylene-high temperature resistant polymer blend film according to claim 4, wherein the thickness of the polypropylene-high temperature resistant polymer blend film is 2 to 20 μm.
6. The method for preparing the polypropylene-high temperature resistant polymer blend film according to claim 4, wherein the sum of the longitudinal heat shrinkage rate and the transverse heat shrinkage rate of the polypropylene-high temperature resistant polymer blend film is less than or equal to 5% under the conditions that the heat shrinkage test temperature is 125 ℃ and the time is 15 minutes.
7. The method for preparing the polypropylene-high temperature resistant polymer blend film according to the claim 4, wherein in the step b, the processing steps comprise heating and melting, impurity filtering, extruding die head, casting into sheet, biaxial stretching and heat setting.
8. The method of claim 7, wherein in step b, the thickness of the cast sheet obtained from the cast sheet is 0.2-2 mm.
9. A capacitor element comprising a polypropylene-high temperature resistant polymer blend film of any one of claims 1 to 3.
10. The capacitor element as claimed in claim 9, wherein the capacitor element has a capacity drop of not more than 5% in a durability test at 125 ℃ for 2000 hours.
CN202110485237.3A 2021-04-30 2021-04-30 Polypropylene-high temperature resistant polymer blend film, preparation method thereof and capacitor core Pending CN115260647A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096521A (en) * 1993-02-12 1994-12-21 赫彻斯特股份公司 Flexible cycloolefin copolymer film
JPH09270361A (en) * 1996-03-29 1997-10-14 Toray Ind Inc Polyolefin film for capacitor and capacitor made or the same
JP2014114419A (en) * 2012-12-12 2014-06-26 Oji Holdings Corp Biaxially stretched polyolefin film, method for manufacturing the film, metal-deposited polyolefin film, and film capacitor
CN110914939A (en) * 2017-05-15 2020-03-24 Tdk电子股份有限公司 Thin film capacitor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1096521A (en) * 1993-02-12 1994-12-21 赫彻斯特股份公司 Flexible cycloolefin copolymer film
JPH09270361A (en) * 1996-03-29 1997-10-14 Toray Ind Inc Polyolefin film for capacitor and capacitor made or the same
JP2014114419A (en) * 2012-12-12 2014-06-26 Oji Holdings Corp Biaxially stretched polyolefin film, method for manufacturing the film, metal-deposited polyolefin film, and film capacitor
CN110914939A (en) * 2017-05-15 2020-03-24 Tdk电子股份有限公司 Thin film capacitor

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