CN115250602A - Multi-loop circulating heat radiation module - Google Patents

Abstract

The invention provides a multi-loop circulating heat dissipation module which comprises a first groove body, a first pipeline, a second groove body and a second pipeline. The first pipeline is connected with the first tank body to form a first loop, the first working fluid is filled in the first loop and carries out heat transfer through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline. The second pipeline is connected with the second tank body to form a second loop, the second working fluid is filled in the second loop and carries out heat transfer through phase change, and a second high-temperature section and a second low-temperature section are formed in the second pipeline. The first high temperature section is in thermal contact with the second low temperature section, and the first low temperature section is in thermal contact with the second high temperature section.

Description

Multi-loop circulating heat radiation module

Technical Field

The present disclosure relates to heat dissipation modules, and particularly to a multi-loop heat dissipation module.

Background

With the progress of technology, portable electronic devices are becoming thinner and lighter. Such as a thin and light notebook computer, a Tablet PC (Tablet PC), or a Smart Phone (Smart Phone), the thin and light shape of the portable Phone is suitable for users to carry and operate. Moreover, in order to improve the processing efficiency of the tablet computer, the performance of the cpu of the motherboard is also improved, but a large amount of heat is easily generated, which often causes the shutdown of the circuit or the electronic component of the electronic device due to overheating, which is inconvenient.

Generally, the heat dissipation module disposed in the electronic device includes an air-cooled heat dissipation module and a water-cooled heat dissipation module, such as a light and thin notebook computer, a Tablet PC (Tablet PC) or a smart phone, wherein the efficiency of the water-cooled heat dissipation module is better. However, in the trend of the portable electronic device toward light, thin, short, small design and development, how to configure the corresponding heat dissipation module in the machine body with limited space and maintain the heat dissipation efficiency thereof is a subject to be considered and solved by related people.

Disclosure of Invention

The invention aims at a multi-loop circulation heat dissipation module which can improve the overall heat dissipation capacity of the module.

According to an embodiment of the invention, the multi-loop circulation heat dissipation module comprises a first tank body, a first pipeline, a second tank body and a second pipeline. The first pipeline is connected with the first groove body to form a first loop, the first working fluid is filled in the first loop and carries out heat transfer through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline. The second pipeline is connected with the second groove body to form a second loop, the second working fluid is filled in the second loop and carries out heat transfer through phase change, and a second high-temperature section and a second low-temperature section are formed in the second pipeline. The first high temperature section is in thermal contact with the second low temperature section, and the first low temperature section is in thermal contact with the second high temperature section.

Based on the above, the heat dissipation module is formed by a multi-loop circulation arrangement, and the loops are independent single loops (single loops) by filling the corresponding working fluid, and more importantly, in the loops, the heat dissipation module of the present invention further combines the high temperature section and the low temperature section of each pipeline by means of thermal contact. Therefore, the high-temperature section of one loop can further transfer heat to the low-temperature section of the other loop, and the heat dissipation module can be provided with a temperature equalization effect on the whole, so that the whole heat dissipation capacity of the heat dissipation module is effectively improved. In other words, by slowing down the temperature drop of the single loop and providing an additional heat dissipation path, the overall heat dissipation efficiency of the heat dissipation module can be improved accordingly, so that the heat generated by the heat source of the electronic device can be more rapidly transmitted to the external environment to avoid the heat from being accumulated in the local part of the electronic device.

Drawings

Fig. 1 is a schematic diagram of a multi-loop circulation heat dissipation module according to an embodiment of the invention;

fig. 2 is an internal structure view of a tank body of the heat dissipation module of fig. 1;

FIG. 3 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the present invention;

fig. 4 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the invention.

Detailed Description

Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

Fig. 1 is a schematic diagram of a multi-loop circulation heat dissipation module according to an embodiment of the invention. Referring to fig. 1, an arrow beside a loop is shown as a simple schematic of the working fluid filled therein, and in the present embodiment, the multi-loop circulation heat dissipation module 100 includes a first tank 110, a first pipeline 120, a second tank 130 and a second pipeline 140. The first pipeline 120 is connected to the first tank 110 to form a first circuit P1, the first working fluid F1 is filled in the first circuit P1 and performs heat transfer through phase change, and a first high temperature section H1 and a first low temperature section L1 are formed in the first pipeline 120. The second pipeline 140 is connected to the second tank 130 to form a second loop P2, the second working fluid F2 is filled in the second loop P2 and performs heat transfer through phase change, and a second high temperature section H2 and a second low temperature section L2 are formed in the second pipeline 140, wherein the first high temperature section H1 is in thermal contact with the second low temperature section L2, and the first low temperature section L1 is in thermal contact with the second high temperature section H2.

Further, the multi-loop circulation heat dissipation module 100 is adapted to an electronic device (e.g., a notebook computer or a tablet computer) to dissipate heat from a heat source 400 (e.g., a central processing unit or a display chip), wherein the first tank 110 and the second tank 130 of the embodiment are in thermal contact with the heat source 400 to absorb heat generated by the heat source 400, and the first working fluid F1 and the second working fluid F2 respectively located in the first tank 110 and the second tank 130 are caused to change phase (from liquid phase to vapor phase), so that the first working fluid F1 and the second working fluid F2 in vapor phase respectively flow out of the first tank 110 and the second tank 130, and then gradually dissipate heat in the process of the first pipeline 120 and the second pipeline 140 to change into liquid phase, and accordingly respectively flow back to the first tank 110 and the second tank 130 to form a phase change circulation, thereby providing a heat dissipation effect to the heat source 400 no matter the first loop P1 or the second loop P2. For the first circuit P1, the first working fluid F1 in the first high temperature section H1 is in a vapor phase, and the first working fluid F1 in the first low temperature section L1 is in a liquid phase, and the liquid and the vapor are coexistent therebetween. For the second circuit P2, the second working fluid F2 in the second high temperature section H2 is in a vapor phase, and the second working fluid F2 in the second low temperature section L2 is in a liquid phase, and the liquid and the vapor coexist therebetween.

It should be noted that, if the first loop P1 and the second loop P2 are only individually considered, the temperature of the first low temperature section L1 and the temperature of the second low temperature section L2 are substantially close to the ambient temperature, and the overall heat dissipation effect is significantly reduced in the case of a small temperature difference. In other words, if only the first loop P1 or only the second loop P2 is present, the overall heat dissipation performance can achieve heat dissipation only by the phase change of the first working fluid F1 in the first pipeline 120 or the phase change of the second working fluid F2 in the second pipeline 140, thereby creating a performance bottleneck of the current loop-type circulation heat dissipation module.

In view of the above, the present embodiment further combines the first loop P1 and the second loop P2 which are different from each other to form a thermal contact area between the first high temperature section H1 and the second low temperature section L2, and another thermal contact area between the second high temperature section H2 and the first low temperature section L1, so that the first high temperature section H1 and the second low temperature section L2 can further perform heat exchange, and the second high temperature section H2 and the first low temperature section L1 can further perform heat exchange. By combining the above-mentioned means with multiple independent loops, the multi-loop circulation heat dissipation module 100 can provide a uniform temperature effect on the whole, and thus slow down the temperature drop of the individual loops, and also provide an additional heat dissipation path for the first high temperature section H1 and the second high temperature section H2, which further causes the temperature difference between the multi-loop circulation heat dissipation module 100 and the external environment (also equivalent to increase the temperature difference area between the multi-loop circulation heat dissipation module 100 and the external environment), so that the multi-loop circulation heat dissipation module 100 can more easily dissipate the heat generated by the heat source 400 to the external environment.

In the present embodiment, the flow direction of the first working fluid F1 in the first circuit P1 is opposite to the flow direction of the second working fluid F2 in the second circuit P2, and the first circuit P1 and the second circuit P2 are independent and have an inner and outer closed contour, so that the high and low temperature sections of different circuits can correspond to each other. Furthermore, the multi-loop circulation heat dissipation module 100 further includes a first conduction element 150 and a second conduction element 160, wherein the first conduction element 150 is connected between the first high temperature section H1 and the second low temperature section L2 to transfer the heat of the first high temperature section H1 to the second low temperature section L2. The second conduction element 160 is connected between the second high temperature section H2 and the first low temperature section L1 to transfer the heat of the second high temperature section H2 to the first low temperature section L1.

Here, the first and second conduction elements 150 and 160 are, for example, heat pipes or members with heat conduction capability. For example, when the multi-loop circulation heat dissipation module 100 is adapted to a notebook computer, the first conducting element 150 and the second conducting element 160 may be a metal structure of the body, or a metal back plate or a metal bracket disposed on the body. To facilitate the formation of the thermal contact zones of the high and low temperature sections. Of course, in other embodiments not shown, the direct heat transfer can also be achieved by directly abutting the first high temperature section H1 to the second low temperature section L2, and directly abutting the second high temperature section H2 to the first low temperature section L1. Here, the form of bringing the high and low temperature sections into thermal contact with each other is not limited.

In addition, the first slot 110 and the second slot 130 of the present embodiment are of an integrated structure, that is, they belong to different chambers in the same structural member, and the different chambers are independent and not communicated with each other.

Fig. 2 is a schematic view of an internal structure of a tank body of the heat dissipation module of fig. 1. Here, taking the first slot 110 as an example, the second slot 130 has the same internal structure and is omitted. In this embodiment, the first tank 110 has a chamber 111 and a plurality of flow guiding members 112 disposed in the chamber 111, the chamber 111 has an inlet E1 and an outlet E2, the flow guiding members 112 have a tapered profile from the inlet E1 to the outlet E2, or the flow guiding members 112 form a plurality of flow channels 113 tapered from the inlet E1 to the outlet E2 in the chamber 111, so as to correspondingly control the flow of the first working fluid F1 and the second working fluid F2 from the inlet E1 to the outlet E2. In other words, the arrangement of the flow guiding element 112 in the cavity 111 will affect the flow direction of the working fluid (taking the first working fluid F1 as an example) in the circuit, so the first circuit P1 and the second circuit P2 are configured as shown in fig. 1 by adjusting the first tank 110 and the second tank 130, so as to achieve the corresponding effect required by the high-temperature section and the low-temperature section.

Fig. 3 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the invention. Referring to fig. 3, in the present embodiment, the multi-loop circulation heat dissipation module 200 includes a first tank 210, a first pipeline 220, a second tank 230, a second pipeline 240, a third tank 250, and a third pipeline 260, wherein the first tank 210 is connected to the first pipeline 220 to form a first loop P11, the second tank 230 is connected to the second pipeline 240 to form a second loop P21, and the third tank 250 is connected to the third pipeline 260 to form a third loop P31. The first circuit P11 is filled with the first working fluid F11, the second circuit P21 is filled with the second working fluid F21, and the third circuit P31 is filled with the third working fluid F31.

The same logic as the previous embodiment, but different individual circuits are combined in this embodiment, and there is a thermal contact state between the high and low temperature sections to facilitate heat transfer. Accordingly, the first high temperature section H11 of the first pipeline 220 is in thermal contact with the third low temperature section L31 of the third pipeline 260, the first low temperature section L11 of the first pipeline 220 is in thermal contact with the second high temperature section H21 of the second pipeline 240, and the third high temperature section H31 of the third pipeline 260 is in thermal contact with the second low temperature section L21 of the second pipeline 240. In other words, as shown in fig. 3, the first loop P11, the second loop P21 and the third loop P31 form three thermal contact areas 271-273, and these thermal contact areas 271-273 can be directly contacted or connected by a heat conduction element as in the above embodiments, so as to achieve the effect of transferring the heat of the high temperature section to the low temperature section.

Here, the first tank 210, the second tank 230, and the third tank 250 are integrated, the flow direction of the first working fluid F11 in the first circuit P11 and the flow direction of the second working fluid F21 in the second circuit P21 are opposite to each other, and the flow direction of the first working fluid F11 in the first circuit P11 and the flow direction of the third working fluid F31 in the third circuit P31 are opposite to each other, so that the second circuit P21 and the third circuit P31 are separated independently from each other and surrounded by the first circuit P11.

Fig. 4 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the invention. Unlike the previous embodiments, in the multi-loop circulation heat dissipation module 300 of the present embodiment. The first tank 310 and the second tank 330 are separate structures, the first pipeline 320 and the second pipeline 340 are also separate structures and are parallel structures, and the flow directions of the working fluid in the different circuits are the same. In other words, the first tank 310, the first pipeline 320 and the working fluid filled therein of the present embodiment radiate heat from the heat source 410, and the second tank 330, the second pipeline 340 and the working fluid filled therein radiate heat from the heat source 420. Meanwhile, the first tank 310 and the second tank 330 are connected by the conductive element three 350 to achieve a heat transfer effect therebetween, and more importantly, the first pipe 320 and the second pipe 340 also have thermal contact areas 360 and 370 for the high and low temperature sections. In short, the independent loops of the multi-loop circulation heat dissipation module 300 of the present embodiment can simultaneously achieve heat exchange with the thermal contact areas 360 and 370 through the third conductive element 350, so as to achieve the above-mentioned temperature equalization effect and overall heat dissipation capability.

It should also be noted that in the embodiments shown in fig. 1, 3 or 4, the flow guide 112 shown in fig. 2 can be used in the groove body to make the flow direction of the working fluid in the circuit meet the requirement.

In summary, the heat dissipation module of the present invention is formed by a multi-loop circulation arrangement, and fills the corresponding working fluid to make the loops be independent single loops. More importantly, for the circuits independent from each other, the heat dissipation module of the present invention further combines the high temperature section and the low temperature section of the respective pipelines by means of thermal contact. Therefore, the high-temperature section of one loop can further transfer heat to the low-temperature section of the other loop, and the high-temperature section can be used as an additional heat dissipation path and can also provide a temperature equalization effect for the whole heat dissipation module so as to effectively improve the whole heat dissipation capacity of the heat dissipation module. In other words, by slowing down the temperature drop of the single loop and providing an additional heat dissipation path, the overall heat dissipation performance of the heat dissipation module can be improved, so that the heat generated by the heat source of the electronic device can be more rapidly transmitted to the external environment, and the heat can be prevented from being accumulated in the local part of the electronic device.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.

Claims (15)

1. A multi-loop circulation heat dissipation module, comprising:

a first tank body;

a first pipeline connected with the first tank to form a first circuit, wherein a first working fluid is filled in the first circuit and is subjected to heat transfer through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline;

a second tank body; and

and a second pipeline connected to the second tank to form a second loop, wherein a second working fluid is filled in the second loop and performs heat transfer through phase change, and a second high temperature section and a second low temperature section are formed in the second pipeline, wherein the first high temperature section is in thermal contact with the second low temperature section, and the first low temperature section is in thermal contact with the second high temperature section.

2. The multi-loop circulation heat dissipation module of claim 1, further comprising a first conductive element connected between the first high temperature section and the second low temperature section to transfer heat from the first high temperature section to the second low temperature section.

3. The multi-loop circulation heat dissipation module of claim 1, further comprising a second conductive element connected between the second high temperature section and the first low temperature section to transfer heat of the second high temperature section to the first low temperature section.

4. The multi-loop circulation heat dissipation module of claim 1, wherein the first high temperature stage structure abuts against the second low temperature stage, and the second high temperature stage structure abuts against the first low temperature stage.

5. The multi-circuit loop dissipation module of claim 1, wherein the first working fluid flows in the first circuit in a direction opposite to the second working fluid flows in the second circuit.

6. The multi-loop circulation heat dissipating module of claim 1, wherein the first loop and the second loop are independent of each other and have an inner and outer closed profile.

7. The multi-loop circulation heat dissipation module of claim 1, wherein the first tank and the second tank are of an integrated structure.

8. The multi-loop circulation heat dissipation module of claim 1, further comprising a third conductor connected between the first tank and the second tank.

9. The multi-loop circulation heat dissipation module of claim 1, further comprising a third tank and a third pipe, wherein the third pipe is connected to the third tank to form a third loop, a third working fluid is filled in the third loop and performs heat transfer through phase change, and a third high temperature section and a third low temperature section are formed on the third pipe, wherein the first high temperature section is in thermal contact with the third low temperature section, the first low temperature section is in thermal contact with the second high temperature section, and the third high temperature section is in thermal contact with the second low temperature section.

10. The multi-loop circulation heat dissipation module of claim 9, wherein the first tank, the second tank, and the third tank are of an integrated structure.

11. The multi-circuit loop-around thermal module of claim 9, wherein the first working fluid flows in the first circuit and the second working fluid flows in the second circuit in opposite directions to each other, and the first working fluid flows in the first circuit and the third working fluid flows in the third circuit in opposite directions to each other.

12. The multi-loop circulation heat sink module of claim 9, wherein the second loop and the third loop are separate and independent from each other and are surrounded by the first loop.

13. The multi-loop circulation heat dissipation module of claim 9, wherein the first tank, the second tank, and the third tank each have a chamber and a plurality of flow guides disposed in the chamber, the chamber has an inlet and an outlet, the plurality of flow guides have a tapered profile from the inlet toward the outlet, or the plurality of flow guides form a plurality of flow channels tapered from the inlet toward the outlet in the chamber, so as to correspondingly control the first working fluid, the second working fluid, and the third working fluid to flow from the inlet to the outlet.

14. The multi-loop circulation heat dissipation module of claim 1, wherein the first tank body and the second tank body each have a chamber and a plurality of flow guiding members disposed in the chamber, the chamber has an inlet and an outlet, the plurality of flow guiding members are tapered from the inlet toward the outlet, or the plurality of flow guiding members form a plurality of flow channels tapered from the inlet toward the outlet in the chamber, so as to correspondingly control the first working fluid and the second working fluid to flow from the inlet to the outlet.

15. A multi-loop circulation heat dissipation module comprises a plurality of independent fluid loops, each fluid loop is filled with working fluid to transfer heat through phase change of the working fluid, a pipeline of each fluid loop is provided with a high temperature section and a low temperature section, wherein the high temperature section of one fluid loop is in thermal contact with the low temperature section of the other fluid loop so as to transfer heat of the high temperature sections to the low temperature sections.

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