CN115243457B

CN115243457B - Manufacturing method of PTFE high-frequency mixed pressure product

Info

Publication number: CN115243457B
Application number: CN202210996740.XA
Authority: CN
Inventors: 宋小凡
Original assignee: JIANGSU DIFEIDA ELECTRONICS CO LTD
Current assignee: JIANGSU DIFEIDA ELECTRONICS CO LTD
Priority date: 2022-08-19
Filing date: 2022-08-19
Publication date: 2023-08-04
Anticipated expiration: 2042-08-19
Also published as: CN115243457A

Abstract

The application relates to a manufacturing method of a PTFE high-frequency mixed pressure product, which belongs to the technical field of circuit board processing and comprises the following steps of: cutting a plurality of base materials to form base materials; copper sinking press rivet: mounting rivets on a substrate, placing the substrate into a copper deposition cylinder to perform oxidation reaction, and performing hole metallization on holes to deposit copper on the surface of the substrate so as to communicate two sides of the substrate; laying a circuit: wiring is arranged on the top surface and the bottom surface of the base material, so that a GTL layer and a GBL layer are formed on the base material; pressing: placing a protective film on the GTL layer, and laminating the base material; depth-control gong: the substrate is flattened by means of a pressing device, and then a number of grooves are milled in the substrate. The method and the device are beneficial to reducing the defective rate of PCB production.

Description

Manufacturing method of PTFE high-frequency mixed pressure product

Technical Field

The application relates to the technical field of circuit board processing, in particular to a manufacturing method of a PTFE high-frequency mixed pressure product.

Background

PTFE is a high molecular polymer using polytetrafluoroethylene as a monomer polymerization finger, and is generally used as a material of a base material of a PCB (circuit board).

In the process of manufacturing the PCB, a GTL layer and a GBL layer can be formed on the base material, and in order to protect the GTL layer, the GTL layer is covered with a film layer, and the GTL layer and the film layer are bonded together through lamination. But PTFE material is softer, and after the pressfitting, the panel is crooked comparatively seriously for in follow-up shooting, shaping, accuse dark gong etc. technology, produce positional deviation easily, produce the defective products.

Disclosure of Invention

In order to help to reduce the defective rate of PCB production, the application provides a manufacturing method of a PTFE high-frequency mixed pressure product.

The manufacturing method of the PTFE high-frequency mixed pressure product adopts the following technical scheme:

a manufacturing method of a PTFE high-frequency mixed pressure product comprises the following steps:

cutting: cutting a plurality of base materials to form base materials;

copper sinking press rivet: installing rivets on the base material, and carrying out comprehensive copper deposition on the base material;

laying a circuit: uniformly distributing lines on the top surface and the bottom surface of the base material, and forming a GTL layer and a GBL layer on the base material;

pressing: pressing the protective film on the GTL layer;

depth-control gong: the substrate is flattened by means of a pressing device, and then a number of grooves are milled in the substrate.

By adopting the technical scheme, the base material is subjected to cutting treatment, and the size of the base material is cut, so that the cut base material can be processed on a production line; rivet installation is carried out on the base material, copper deposition is carried out on the surface of the base material, and two sides of the base material can be communicated; then, laying lines on the top surface and the bottom surface of the base material to form a GTL layer and a GBL layer, and laminating a protective film on the GBL layer to protect the GBL layer; after the lamination is completed, the base material is placed on the positioning device, the bent base material after lamination is flattened through the positioning device, then the base material is subjected to depth control gong, deviation of the position of the depth control gong is avoided as much as possible, and the defective rate of PCB production is reduced conveniently.

In a specific embodiment, in the step of copper-clad press-riveting, it includes:

drilling: drilling holes in the substrate for installing rivets;

primary copper deposition: depositing copper on the drilled substrate;

plug rivet: riveting the rivet into the hole on the base material subjected to primary copper deposition;

secondary copper deposition: the substrate with the rivet installed is again copper deposited.

By adopting the technical scheme, copper deposition is carried out on the surfaces of the holes and the base material before the rivet is installed, and secondary copper deposition is carried out after the rivet is installed, so that copper is deposited between the rivet and the inner surface of the hole, and good contact between the rivet and the copper on the inner surface of the hole is guaranteed.

In a specific embodiment, the drilling step further comprises depth-controlling drilling the hole by means of flat-headed drilling such that the hole at the depth-controlling location forms a right angle.

By adopting the technical scheme, the flat-headed drill is used for deep drilling of the hole, so that the hole pattern forms a right angle, and the rivet and the surface of the substrate are kept flat when the rivet is placed in the hole.

In a specific embodiment, in the step of pressing, the pressing temperature is greater than 250 ℃ and the pressure is greater than 600ps.

By adopting the technical scheme, the temperature of the lamination is adjusted to be more than 250 ℃, the intensity of the lamination is adjusted to be more than 600ps, and the binding force of the protective film with the base material and the copper surface is avoided as much as possible.

In a specific embodiment, in the depth-controlling routing step, the pressing device includes a carrier plate and a pressing plate, the substrate is disposed between the pressing plate and the carrier plate, and the pressing plate presses on the substrate.

Through adopting above-mentioned technical scheme, before carrying out accuse dark gong to the substrate, put the substrate on the loading board earlier to press the clamp plate on the substrate, and then press the substrate to be level, avoid the substrate to take place crookedly as far as possible in subsequent processing.

In a specific implementation mode, two sides of the pressing plate are provided with pressing rods, the pressing rods are pressed on the edges of the base material, the pressing rods are provided with connecting rods, the bearing rods are provided with sliding grooves perpendicular to the pressing rods, and one ends of the connecting rods, far away from the pressing rods, extend into the sliding grooves; the sliding groove is internally provided with a sliding piece corresponding to the connecting rod, the bearing plate is provided with a driving assembly, and the driving assembly is used for driving the sliding piece to slide along the sliding groove along the length direction.

By adopting the technical scheme, the pressing rod is pressed on the edge of the base material, so that the edge of the base material can be flattened conveniently; the sliding piece is driven by the driving component to move along the length direction of the sliding groove, and the sliding piece moves together with the pressing rod, so that the part of the base material covered by the pressing rod is exposed, and the edge of the base material is deeply processed.

In a specific implementation manner, connecting rods are arranged on each pressure rod and located on two sides of the base material along the length direction of the pressure rods, the sliding parts are sliding boxes, one ends of the connecting rods, far away from the pressure rods, extend into the corresponding sliding boxes, limiting plates are arranged in the sliding boxes, springs are arranged between the limiting plates and the sliding boxes, and the pressure rods are pressed on the base material under the action of the springs.

Through adopting above-mentioned technical scheme, drive assembly drive slide box slides in the spout, drives the connecting rod along spout length direction motion, and then is convenient for adjust the position of depression bar on the substrate. When the substrate is placed between the bearing plate and the compression bar, the connecting rod has a trend of moving towards the direction of inserting the sliding box under the action of the spring, so that the compression bar is pressed on the substrate, and the edge of the substrate is convenient to compress tightly.

In a specific implementation manner, the sliding box is provided with a ball, a yielding groove corresponding to the ball is formed in the bottom surface of the sliding box, one part of the ball stretches into the yielding groove, and the other part of the ball stretches out of the yielding groove and abuts against the inner wall of the sliding groove.

Through adopting above-mentioned technical scheme, when the slip box slides in the spout, the ball can take place to rotate, and then helps reducing the frictional force that the slip box received when sliding.

In a specific implementation manner, the driving assembly comprises a motor and a screw rod, the motor is arranged on one side of the bearing plate, the screw rod is arranged in the sliding groove along the length direction of the sliding groove, and an output shaft of the motor penetrates through the side wall of the bearing plate and extends into the sliding groove to be coaxially connected with the screw rod; the screw rod penetrates through the sliding box, and the screw rod is in threaded connection with the sliding box.

Through adopting above-mentioned technical scheme, the motor provides driving force for the rotation of lead screw, and when the lead screw rotated, the lead screw drove the smooth box motion, and then drives smooth box and slide in the spout.

In a specific implementation manner, the bearing plate is provided with a limit groove, the bottom surface of the base material is positioned in the limit groove, and the base material is attached to the side wall of the limit groove.

Through adopting above-mentioned technical scheme, the spacing groove is spacing to the position of substrate, and the excessive frictional force drives the substrate removal when avoiding the depression bar to move on the substrate as far as possible.

In summary, the present application includes at least one of the following beneficial technical effects:

1. by adopting the technical scheme, the base material is subjected to cutting treatment, and the size of the base material is cut, so that the cut base material can be processed on a production line; rivet installation is carried out on the base material, copper deposition is carried out on the surface of the base material, and two sides of the base material can be communicated; then, laying lines on the top surface and the bottom surface of the base material to form a GTL layer and a GBL layer, and laminating a protective film on the GBL layer to protect the GBL layer; after the lamination is completed, the base material is placed on a positioning device, the laminated base material with the bending is flattened through the positioning device, then the base material is subjected to depth control gong, deviation of the depth control gong position is avoided as much as possible, and the defective rate of PCB production is reduced conveniently;

2. in the process of copper deposition and riveting of the substrate, a right-angle hole is drilled in the substrate, so that the surface of the substrate is kept flat after the rivet is installed; copper deposition is carried out for one time before and after the rivet is pressed, so that the connection between the rivet and the inner surface of the rivet is convenient to strengthen;

3. when the edge of the base material is subjected to depth control gong, the base material is placed in a limit groove of the bearing plate, the pressing plate is pressed on the base material, the motor drives the screw rod to rotate, the sliding box is driven to move, the pressing rod is pressed on the base material, and the pressing rod is pressed on the base material under the action of the spring so as to flatten the bearing plate.

Drawings

Fig. 1 is a schematic structural view of a pressing device according to an embodiment of the present application.

Fig. 2 is a cross-sectional view of a carrier plate according to an embodiment of the present application.

Fig. 3 is a partial enlarged view of a portion a in fig. 2.

Reference numerals illustrate: 1. a carrying plate; 11. a limit groove; 12. a chute; 2. a pressing plate; 21. a through groove; 3. a substrate; 4. a compression bar; 41. a connecting rod; 42. a limiting plate; 43. a connecting plate; 5. a slide box; 51. a spring; 52. a ball; 53. a relief groove; 6. a drive assembly; 61. a motor; 62. a screw rod; 7. a pressing device.

Detailed Description

The present application is described in further detail below with reference to the accompanying drawings.

The embodiment of the application discloses press device, refer to fig. 1 and 2, press device 7 includes loading board 1 and clamp plate 2, and spacing groove 11 has been seted up to the top surface of loading board 1, and spacing groove 11 is used for placing substrate 3, and substrate 3's bottom surface is located spacing groove 11, and clamp plate 2 presses the top surface at substrate 3.

Referring to fig. 1 and 2, a pressing bar 4 is provided at both sides of the pressing plate 2, and the pressing bar 4 presses the edge of the top surface of the base material 3 to flatten the edge of the base material 3. The bearing plate 1 is provided with a sliding groove 12 on two sides of the base material 3 along the length direction of the compression bars 4, two ends of each compression bar 4 are provided with a connecting rod 41, one end of each connecting rod 41 away from each compression bar 4 stretches into the corresponding sliding groove 12 and is connected with a sliding piece, and the sliding piece can slide in the corresponding sliding groove 12; the bearing plate 1 is provided with a driving assembly 6 corresponding to the sliding groove 12, and the driving assembly 6 is used for driving a sliding piece in the corresponding sliding groove 12 to slide in the sliding groove 12. When the part covered by the compression bar 4 on the base material 3 needs to be controlled in depth, the driving component 6 drives the sliding piece to slide, and the connecting rod 41 and the compression bar 4 are driven to move, so that the base material 3 is controlled in depth.

Referring to fig. 2 and 3, in the present embodiment, the sliding member is a sliding box 5, and the sliding box 5 is slidably engaged with the sliding groove 12. One end of the connecting rod 41 positioned in the sliding groove 12 stretches into the sliding box 5 and is connected with the limiting plate 42, a spring 51 is sleeved on the outer side of the part of the connecting rod 41 positioned in the sliding box 5, the spring 51 is propped between the limiting plate 42 and the inner surface of the sliding box 5, and the pressing rod 4 is pressed on the top surface of the base material 3 under the action of the spring 51 and is convenient for adapting to the base materials 3 with different thicknesses.

Referring to fig. 2, through grooves 21 are formed in the side wall of the pressing plate 2, and the through grooves 21 are formed along the distribution direction of the two pressing rods 4. The two opposite sides of the compression bars 4 are connected with connecting plates 43, and one end of each connecting plate 43 far away from the compression bar 4 is inserted into the through groove 21. Since the pressing rod 4 is pressed on the top surface of the base material 3 under the action of the spring 51, the pressing plate 2 is connected with the pressing rod 4 through the connecting plate 43 so as to press the base material 3.

Referring to fig. 3, a plurality of balls 52 are disposed between the bottom surface of the slide box 5 and the bottom wall of the slide groove 12, a relief groove 53 corresponding to the balls 52 is formed in the bottom wall of the slide box 5, the top of the balls 52 is clamped in the relief groove 53 and is attached to the inner surface of the relief groove 53, and the bottom of the balls 52 extends out of the relief groove 53 and abuts against the bottom wall of the slide groove 12. As the slide box 5 slides in the slide groove 12, the balls 52 rotate, helping to reduce the friction force experienced by the slide box 5.

Referring to fig. 1 and 2, the driving assembly 6 includes a motor 61 and a screw 62, wherein the motor 61 is located at one side of the slide box 5, the screw 62 is disposed in the slide groove 12 along the length direction of the slide groove 12, and an output shaft of the motor 61 penetrates through a sidewall of the carrier plate 1 to extend into the slide groove 12 and is disposed coaxially with the screw 62. Referring to fig. 3, a screw 62 penetrates the slide box 5 and is screw-coupled with the slide box 5. When the motor 61 drives the screw rod 62 to rotate, the sliding box 5 is driven to slide in the sliding groove 12, and the compression bar 4 is driven to displace.

The working principle of the embodiment of the application is as follows: the substrate 3 is placed in the limit groove 11, the pressing plate 2 is pressed on the substrate 3, the sliding box 5 is driven to move by the motor 61, the pressing rod 4 is pressed on the edge of the substrate 3, the connecting plate 43 on the pressing rod 4 is inserted into the through groove 21, and then the substrate 3 is flattened. The motor 61 adjusts the position of the pressing rod 4 on the base material 3 so as to perform depth control gong on the edge of the base material 3.

The embodiment of the application also discloses a manufacturing method of the PTFE high-frequency mixed pressure product, which comprises the following steps:

s100, cutting: the plurality of base materials 3 are cut by a cutting device, so that a plurality of base materials 3 meeting the size requirement are formed.

S200, copper sinking press rivet: rivets are attached to the base material 3, and copper is deposited on the entire surface of the base material 3.

In the implementation, the copper deposition and riveting step specifically further comprises the following sub-steps:

s201, drilling: holes for setting rivets are drilled in the base material 3.

In practice, holes are drilled in the base material 3 by a conventional drill, then the holes are deeply drilled by flat-head drilling, and the depth is controlled to be between 0.3mm and 0.5mm, so that the hole-type section of the depth control position is square, and the position of the rivet cap and the surface of the base material 3 are kept flat after the rivet is placed in the holes and copper is deposited.

S201, primary copper deposition: and (3) placing the drilled base material 3 into a copper deposition cylinder to perform oxidation-reduction reaction, and performing hole metallization on the holes to deposit copper on the surface of the base material 3.

S202, primary electroplating: and thickening copper in the surface and the hole of the substrate subjected to primary copper deposition, so that the condition that the use is influenced due to oxidation of copper in the surface and the hole of the substrate is avoided as much as possible.

S203, plugging rivet: riveting the rivet into the hole on the base material 3 subjected to primary copper deposition;

s204, secondary copper deposition: placing the base material 3 with the rivet in the copper deposition cylinder again for oxidation-reduction reaction, depositing copper between the rivet and the inner surface of the hole, and ensuring good contact between the rivet and the copper on the inner surface of the hole, so that two sides of the base material 3 are communicated.

S205, primary electroplating: and thickening copper on the surface and in the holes of the substrate subjected to secondary copper deposition, so that the condition that the use is influenced due to oxidation of copper between the holes and the rivets is avoided as much as possible.

S300, laying a circuit: lines are laid on both the top and bottom surfaces of the substrate 3 so that a GTL layer and a GBL layer are formed on the substrate 3.

In the implementation, firstly, carrying out primary circuit layout on the top surface of the substrate 3 to form a GTL layer, and carrying out AOI (automatic optical inspection) on the GTL layer to detect whether the circuit on the GTL layer has defects; after the detection is completed, the substrate 3 without defects is subjected to electro-gold and film stripping, so that a metal coating layer is formed on the circuit surface of the GTL layer, and the circuit is further protected. And then, carrying out secondary circuit layout on the bottom surface of the substrate 3 to form a GTL layer, and carrying out AOI inspection on the GTL layer to detect whether the circuit on the GTL layer is defective or not so as to facilitate people to timely repair the defective base layer.

Specifically, the AOI inspection includes automatically scanning a circuit on a substrate with an AOI machine via a camera, capturing an image, processing the image, inspecting the circuit for defects, and marking the defects via a display for repair by a repair person.

S400, laminating: the protective film is placed on the GTL layer, and the protective film and the base material 3 are laminated, so that a film-coated surface is formed on the GBL layer, and the GBL layer is protected. Specifically, during lamination, the temperature is controlled to be more than 250 ℃, the pressure is controlled to be more than 600ps, and the binding force of the protective film with the substrate 3 and the copper surface is avoided as much as possible.

S500, targeting: leveling the pressed substrate by a leveling machine, marking a target site at a proper position, sending a signal to a computer system by a CCD, and controlling a drilling device to drill holes at the target site by the computer system so as to form a plurality of upper positioning holes on the upper substrate.

S600, molding: after targeting, the substrate 3 is cut into a suitable external dimension by a cutting device.

S700, V-CUT: according to the drawing requirements, a plurality of separation lines are cut on the formed base material 3 by a rotary table cutter so as to cut the base material 3 into single plates later.

S800, depth control gong: the substrate 3 is flattened by means of the pressing device 7, and then grooves are milled into the substrate 3.

Specifically, referring to fig. 2, the substrate 3 is placed in the limit groove 11 on the carrier plate 1 of the pressing device 7, and the pressing plate 2 is pressed on the substrate 3, and the motor 61 drives the pressing rod 4 to move, so that the pressing rod 4 presses on the edge of the substrate 3, and the substrate 3 is flattened. The position of the pressing rod 4 on the base material 3 is then adjusted by the motor 61 so as to perform the depth-controlling operation on the edge of the base material 3.

S900, final inspection packaging: and performing FQC test on the processed product. Specifically, appearance inspection, size/aperture measurement, performance testing are included to ensure that the product meets the requirements of shipment specifications. And packaging the product after finishing the final inspection.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims

1. A manufacturing method of a PTFE high-frequency mixed pressure product is characterized by comprising the following steps: the method comprises the following steps:

cutting: cutting a plurality of base materials (3) to form the base materials (3);

copper sinking press rivet: rivet is installed on the base material (3), and copper is fully deposited on the base material (3);

laying a circuit: wiring is distributed on the top surface and the bottom surface of the base material (3), and a GTL layer and a GBL layer are formed on the base material (3);

pressing: pressing the protective film on the GTL layer;

depth-control gong: flattening the base material (3) by using a pressing device (7), and milling a plurality of grooves on the base material (3); the pressing device (7) comprises a bearing plate (1) and a pressing plate (2), the base material (3) is arranged between the pressing plate (2) and the bearing plate (1), and the pressing plate (2) presses on the base material (3); the two sides of the pressing plate (2) are respectively provided with a pressing rod (4), the pressing rods (4) are pressed on the edge of the base material (3), the pressing rods (4) are provided with connecting rods (41), the bearing plate (1) is provided with sliding grooves (12) perpendicular to the pressing rods (4), and one ends of the connecting rods (41) away from the pressing rods (4) extend into the sliding grooves (12); the sliding chute (12) is internally provided with a sliding piece corresponding to the connecting rod (41), the bearing plate (1) is provided with a driving assembly (6), and the driving assembly (6) is used for driving the sliding piece to slide along the sliding chute (12) along the length direction.

2. The method for manufacturing a PTFE high-frequency hybrid product according to claim 1, wherein in the step of copper-clad press-riveting, comprising:

drilling: drilling holes for rivet installation in the substrate (3);

primary copper deposition: depositing copper on the drilled substrate (3);

plug rivet: riveting the rivet into a hole on the base material (3) subjected to primary copper deposition;

secondary copper deposition: copper is deposited again on the substrate (3) on which the rivet is mounted.

3. The method for manufacturing the PTFE high-frequency mixed pressure product according to claim 2, which is characterized in that: the drilling step further comprises the step of drilling the hole in a depth-controlled manner through flat-head drilling, so that the hole in the depth-controlled position forms a right angle.

4. The method for manufacturing the PTFE high-frequency mixed pressure product according to claim 1, which is characterized in that: in the step of pressing, the pressing temperature is higher than 250 ℃ and the pressure is higher than 600ps.

5. The method for manufacturing the PTFE high-frequency mixed pressure product according to claim 1, which is characterized in that: every on depression bar (4) and be located substrate (3) are followed both sides on depression bar (4) length direction all are provided with connecting rod (41), the slider is smooth box (5), the one end that depression bar (4) was kept away from to connecting rod (41) stretches into corresponding in smooth box (5), be provided with limiting plate (42) in smooth box (5), limiting plate (42) with be provided with spring (51) between smooth box (5), depression bar (4) are in under the effect of spring (51) press on substrate (3).

6. The method for manufacturing the PTFE high-frequency mixed pressure product according to claim 5, which is characterized in that: be provided with ball (52) on slide box (5), offer on slide box (5) bottom surface with groove (53) of stepping down that ball (52) correspond, in part of ball (52) stretches into in groove (53) of stepping down, another part of ball (52) follow in groove (53) of stepping down stretches out and support on the inner wall of spout (12).

7. The method for manufacturing the PTFE high-frequency mixed pressure product according to claim 5, which is characterized in that: the driving assembly (6) comprises a motor (61) and a screw rod (62), the motor (61) is arranged on one side of the bearing plate (1), the screw rod (62) is arranged in the sliding groove (12) along the length direction of the sliding groove (12), and an output shaft of the motor (61) penetrates through the side wall of the bearing plate (1) and stretches into the sliding groove (12) to be coaxially connected with the screw rod (62); the screw rod (62) penetrates through the sliding box (5), and the screw rod (62) is in threaded connection with the sliding box (5).

8. The method for manufacturing the PTFE high-frequency mixed pressure product according to claim 7, wherein the method comprises the following steps: the bearing plate (1) is provided with a limiting groove (11), the bottom surface of the base material (3) is positioned in the limiting groove (11), and the base material (3) is attached to the side wall of the limiting groove (11).