CN115241619B - Non-contact low passive intermodulation waveguide filter - Google Patents
Non-contact low passive intermodulation waveguide filter Download PDFInfo
- Publication number
- CN115241619B CN115241619B CN202210878888.3A CN202210878888A CN115241619B CN 115241619 B CN115241619 B CN 115241619B CN 202210878888 A CN202210878888 A CN 202210878888A CN 115241619 B CN115241619 B CN 115241619B
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- waveguide
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- insulating
- resonant cavity
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- 238000005192 partition Methods 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 29
- 239000000741 silica gel Substances 0.000 claims description 29
- 229910002027 silica gel Inorganic materials 0.000 claims description 29
- 239000000523 sample Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000003491 array Methods 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001914 filtration Methods 0.000 abstract description 5
- 239000002184 metal Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Abstract
The invention discloses a non-contact low-passive intermodulation waveguide filter, which comprises an insulating base, a first waveguide lower plate, a second waveguide lower plate, an insulating partition plate, a waveguide upper plate and an insulating top cover, wherein the first waveguide lower plate and the second waveguide lower plate are respectively embedded at two sides of the top of the insulating base; the invention adopts a non-contact indirect waveguide mode, has good electric contact, low passive intermodulation interference degree and good filtering effect, adopts an elastic clamping connection mode, reduces the leakage risk of the waveguide filter, ensures the safety of equipment and personnel, optimizes the structural design, has good heat dissipation performance and high efficiency, can efficiently conduct internal heat to the outside, is not easy to overheat or explode, and has more reliable work.
Description
Technical Field
The invention relates to the technical field of waveguide filters, in particular to a non-contact low-passive intermodulation waveguide filter.
Background
The waveguide filter is a transmission line filter, generally consists of a discontinuity and a transmission line segment, and can be equivalently used as a corresponding lumped parameter element and a corresponding circuit, the waveguide discontinuity structure provides equivalent reactance, the transmission line segment is equivalent to a resonant cavity and the like, and the waveguide filter has the characteristics of high Q value, high power, low loss and the like, and is widely applied to the fields of radar, satellite communication, millimeter wave communication and the like.
However, the common waveguide filter mostly adopts a contact type direct waveguide mode, and contact metal often generates dirt and burrs on the surface in the manufacturing and assembling processes, so that the problem of poor electrical contact is easy to occur, the passive intermodulation interference degree is high, the filtering effect is poor, certain leakage risk exists due to connection through a metal fastener, the safety of equipment and personnel is endangered, in addition, the structure is simple, the heat dissipation performance is poor, internal heat is difficult to conduct to the outside, the internal heat is easy to overheat and explode, and the working reliability is poor.
Disclosure of Invention
The present invention aims to provide a contactless low passive intermodulation waveguide filter, which solves the problems set forth in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the non-contact low-passive intermodulation waveguide filter comprises an insulating base, a first waveguide lower plate, a second waveguide lower plate, an insulating partition plate, a waveguide upper plate and an insulating top cover, wherein the first waveguide lower plate and the second waveguide lower plate are respectively embedded at two sides of the top of the insulating base, a first lower resonant cavity and a second lower resonant cavity are respectively formed in one side of the top of the first waveguide lower plate and one side of the top of the second waveguide lower plate, and a first waveguide sheet array and a second waveguide sheet array are respectively arranged in the first lower resonant cavity and the second lower resonant cavity.
Preferably, the top of the first waveguide lower plate and the top of the second waveguide lower plate are respectively contacted with the outer edge of the bottom of the insulating partition plate, the outer edge of the top of the insulating partition plate is contacted with the outer edge of the bottom of the waveguide upper plate, an upper resonant cavity is arranged in the center of the bottom of the waveguide upper plate, and upper waveguide sheet arrays are symmetrically arranged on two sides of the interior of the upper resonant cavity.
Preferably, the two sides of the top of the insulating partition board are provided with middle resonant cavities, resonant sheets are arranged in the middle resonant cavities, the middle resonant cavities are communicated with the first lower resonant cavities, the second lower resonant cavities and the upper resonant cavities, and the resonant sheets are respectively positioned between the first waveguide sheet array and the upper waveguide sheet array and between the second waveguide sheet array and the upper waveguide sheet array.
Preferably, the waveguide upper plate is embedded in the center of the bottom of the insulating top cover, and the four corners of the waveguide upper plate, the first waveguide lower plate and the second waveguide lower plate are provided with column holes, square columns are embedded in the column holes, and the square columns are respectively arranged at the four corners of the bottom of the insulating top cover, the four corners of the inner edge and the four corners of the outer edge of the top of the insulating base.
Preferably, the positioning groove has all been seted up in the four corners of insulating top cap bottom, and the inside of positioning groove is inlayed and is equipped with the reference column, and the reference column sets up the outer fringe four corners at insulating base top respectively, and four sides at insulating base top all are provided with elastic buckle, and elastic buckle inlays the dress in the inside of catching groove, and the catching groove is seted up the four sides at insulating top cap bottom respectively.
Preferably, the center of insulating base bottom and the center at insulating top cap top inlay respectively and are equipped with heating panel and lower heating panel, and the radiating groove has all been seted up to the center at heating panel top and the center at heating panel bottom down, and the both sides at heating panel bottom and the both sides at heating panel top down all contact the one end of a plurality of silica gel heat conduction post.
Preferably, the silica gel heat conduction columns are respectively arranged at the center of the bottom of the lower silica gel heat conduction plate and the two sides of the top of the upper silica gel heat conduction plate, the lower silica gel heat conduction plate and the upper silica gel heat conduction plate are respectively embedded at the two sides of the top of the insulating base and the center of the bottom of the insulating top cover, the top of the lower silica gel heat conduction plate is respectively contacted with the bottom centers of the first waveguide lower plate and the second waveguide lower plate, and the bottom of the upper silica gel heat conduction plate is contacted with the center of the top of the waveguide upper plate.
Preferably, the sleeve grooves are formed in two corners of the top of the insulating base and two corners of the bottom of the insulating top cover, limiting sleeves are embedded in the sleeve grooves, limiting strips are symmetrically arranged on two sides of the limiting sleeves and embedded in the limiting grooves, the limiting grooves are respectively formed in two sides of the sleeve grooves, the limiting sleeves are sleeved on the middle section of the waveguide probe, the other ends of the waveguide probe are embedded in the probe grooves, and the probe grooves are respectively formed in two corners of the bottom of the insulating partition plate, and one corner of the top of the first waveguide lower plate and one corner of the top of the second waveguide lower plate.
Compared with the prior art, the invention has the beneficial effects that: the non-contact low-passive intermodulation waveguide filter adopts a non-contact indirect waveguide mode, the contact is not influenced by dirt and burrs on the metal surface, the electric contact is good, the passive intermodulation interference degree is low, and the filtering effect is good; the elastic clamping connection mode is adopted, so that the leakage risk of the waveguide filter is reduced, and the safety of equipment and personnel is ensured; optimize structural design, heat dispersion is good, efficient, can be efficient with inside heat conduction to the external world, be difficult for overheated fire, explosion, the work is more reliable.
Drawings
FIG. 1 is a perspective view of the overall structure of the present invention;
FIG. 2 is a front cross-sectional view of the overall structure of the present invention;
FIGS. 3 and 4 are exploded views of the overall structure of the present invention;
FIG. 5 is a perspective view of an insulating base of the present invention;
in the figure: 1. an insulating base; 2. a first waveguide lower plate; 3. a second waveguide lower plate; 4. a first lower resonant cavity; 5. a second lower resonant cavity; 6. a first waveguide chip array; 7. a second waveguide chip array; 8. an insulating separator; 9. a waveguide upper plate; 10. an upper resonant cavity; 11. an upper waveguide chip array; 12. a middle resonant cavity; 13. a resonance piece; 14. an insulating top cover; 15. a post hole; 16. square columns; 17. a positioning groove; 18. positioning columns; 19. an elastic buckle; 20. a buckling groove; 21. an upper heat dissipation plate; 22. a lower heat dissipation plate; 23. a heat sink; 24. a silica gel heat conduction column; 25. a lower silica gel heat conducting plate; 26. a silica gel heat conducting plate is arranged; 27. a sleeve groove; 28. a limit sleeve; 29. a limit bar; 30. a limit groove; 31. a waveguide probe; 32. a probe groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, an embodiment of the present invention is provided: the non-contact low passive intermodulation waveguide filter comprises an insulating base 1, a first waveguide lower plate 2, a second waveguide lower plate 3, an insulating partition plate 8, a waveguide upper plate 9 and an insulating top cover 14, wherein the first waveguide lower plate 2 and the second waveguide lower plate 3 are respectively embedded at two sides of the top of the insulating base 1, a first lower resonant cavity 4 and a second lower resonant cavity 5 are respectively arranged at one side of the top of the first waveguide lower plate 2 and the second waveguide lower plate 3, a first waveguide sheet array 6 and a second waveguide sheet array 7 are respectively arranged in the first lower resonant cavity 4 and the second lower resonant cavity 5, the tops of the first waveguide lower plate 2 and the second waveguide lower plate 3 are respectively contacted with the outer edge of the bottom of the insulating partition plate 8, the outer edge of the top of the insulating partition plate 8 is contacted with the outer edge of the bottom of the waveguide upper plate 9, an upper resonant cavity 10 is arranged in the center of the bottom of the waveguide upper plate 9, upper waveguide sheet arrays 11 are symmetrically arranged on two sides of the inner part of the upper resonant cavity 10, middle resonant cavities 12 are respectively arranged on two sides of the top of the insulating partition plate 8, resonant sheets 13 are arranged in the middle resonant cavities 12, the middle resonant cavities 12 are communicated with the first lower resonant cavities 4, the second lower resonant cavities 5 and the upper resonant cavities 10, the resonant sheets 13 are respectively positioned between the first waveguide sheet array 6 and the upper waveguide sheet array 11 and between the second waveguide sheet array 7 and the upper waveguide sheet array 11, a non-contact indirect waveguide mode is adopted, the contact is not influenced by dirt and burrs on the metal surface, the electric contact is good, the passive intermodulation interference degree is low, and the filtering effect is good; the waveguide upper plate 9 is embedded in the center of the bottom of the insulating top cover 14, column holes 15 are formed in four corners of the waveguide upper plate 9, the first waveguide lower plate 2 and the second waveguide lower plate 3, square columns 16 are embedded in the column holes 15, the square columns 16 are respectively arranged at four corners of the bottom of the insulating top cover 14, four corners of the inner edge and four corners of the top of the insulating base 1, positioning grooves 17 are formed in four corners of the bottom of the insulating top cover 14, positioning columns 18 are embedded in the positioning grooves 17, the positioning columns 18 are respectively arranged at four corners of the outer edge of the top of the insulating base 1, elastic buckles 19 are respectively arranged on four sides of the top of the insulating base 1, the buckling grooves 20 are respectively formed on four sides of the bottom of the insulating top cover 14, and the electric leakage risk of the waveguide filter is reduced by adopting an elastic clamping connection mode, so that the safety of equipment and personnel is ensured; the center of the bottom of the insulating base 1 and the center of the top of the insulating top cover 14 are respectively embedded with the upper radiating plate 21 and the lower radiating plate 22, the center of the top of the upper radiating plate 21 and the center of the bottom of the lower radiating plate 22 are respectively provided with the radiating grooves 23, both sides of the bottom of the upper radiating plate 21 and both sides of the top of the lower radiating plate 22 are respectively contacted with one end of a plurality of silica gel heat conducting columns 24, the silica gel heat conducting columns 24 are respectively arranged at the center of the bottom of the lower silica gel heat conducting plate 25 and both sides of the top of the upper silica gel heat conducting plate 26, the lower silica gel heat conducting plate 25 and the upper silica gel heat conducting plate 26 are respectively embedded at both sides of the top of the insulating base 1 and the center of the bottom of the insulating top cover 14, the top of the lower silica gel heat conducting plate 25 is respectively contacted with the centers of the bottoms of the first waveguide lower plate 2 and the second waveguide lower plate 3, the structure design is optimized, the radiating performance is good, the efficiency is high, internal heat can be efficiently conducted to the outside, the internal heat is not easy to overheat and explode, and the work is more reliable; the sleeve grooves 27 are formed in two corners at the top of the insulating base 1 and two corners at the bottom of the insulating top cover 14, the limiting sleeves 28 are embedded in the sleeve grooves 27, limiting strips 29 are symmetrically arranged on two sides of the limiting sleeves 28, the limiting strips 29 are embedded in the limiting grooves 30, the limiting grooves 30 are respectively formed in two sides of the sleeve grooves 27, the limiting sleeves 28 are sleeved on the middle sections of the waveguide probes 31, the other ends of the waveguide probes 31 are embedded in the probe grooves 32, and the probe grooves 32 are respectively formed in two corners at the bottom of the insulating partition plate 8, and one corner at the top of the first waveguide lower plate 2 and one corner at the bottom of the second waveguide lower plate 3.
Working principle: when the filter is used, the filter is firstly arranged on a circuit through the waveguide probe 31, so that an input electric signal is conducted to the first waveguide lower plate 2, then conducted to the upper waveguide sheet array 11 of the waveguide upper plate 9 from the first waveguide sheet array 6 through the first lower resonant cavity 4, the middle resonant cavity 12 and the upper resonant cavity 10, then conducted to the second waveguide sheet array 7 from the upper waveguide sheet array 11 through the second lower resonant cavity 5, and then the filtered electric signal is output through the waveguide probe 31 on the second waveguide lower plate 3, and the contact is not influenced by dirt and burrs on the metal surface by adopting a non-contact indirect waveguide mode, so that the electric contact is good, the passive intermodulation interference degree is low, and the filtering effect is good; meanwhile, the redundant heat generated on the first waveguide lower plate 2, the second waveguide lower plate 3 and the waveguide upper plate 9 is respectively transmitted to the lower silica gel heat-conducting plate 25 and the upper silica gel heat-conducting plate 26, and further is respectively transmitted to the upper heat-radiating plate 21 and the lower heat-radiating plate 22 through the silica gel heat-conducting columns 24, and is transmitted to the outside through the heat-radiating grooves 23, so that the structural design is optimized, the heat-radiating performance is good, the efficiency is high, the internal heat can be efficiently transmitted to the outside, the overheating and the explosion are not easy to occur, and the work is more reliable; finally, the elastic buckle 19 is separated from the buckling groove 20, the insulating top cover 14 is taken down from the insulating base 1, and the electric leakage risk of the waveguide filter is reduced by adopting an elastic clamping connection mode, so that the safety of equipment and personnel is ensured.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a low passive intermodulation waveguide filter of non-contact, includes insulating base (1), first waveguide hypoplastron (2), second waveguide hypoplastron (3), insulating baffle (8), waveguide upper plate (9) and insulating top cap (14), its characterized in that: a first waveguide lower plate (2) and a second waveguide lower plate (3) are respectively embedded at two sides of the top of the insulating base (1), a first lower resonant cavity (4) and a second lower resonant cavity (5) are respectively arranged at one side of the tops of the first waveguide lower plate (2) and the second waveguide lower plate (3), and a first waveguide sheet array (6) and a second waveguide sheet array (7) are respectively arranged in the first lower resonant cavity (4) and the second lower resonant cavity (5);
the top of the first waveguide lower plate (2) and the top of the second waveguide lower plate (3) are respectively contacted with the outer edge of the bottom of the insulating partition plate (8), the outer edge of the top of the insulating partition plate (8) is contacted with the outer edge of the bottom of the waveguide upper plate (9), an upper resonant cavity (10) is arranged in the center of the bottom of the waveguide upper plate (9), and upper waveguide sheet arrays (11) are symmetrically arranged on two sides of the interior of the upper resonant cavity (10);
the two sides of the top of the insulating partition plate (8) are provided with a middle resonant cavity (12), the inside of the middle resonant cavity (12) is provided with a resonant sheet (13), the middle resonant cavity (12) is communicated with the first lower resonant cavity (4), the second lower resonant cavity (5) and the upper resonant cavity (10), and the resonant sheets (13) are respectively positioned between the first waveguide sheet array (6) and the upper waveguide sheet array (11) and between the second waveguide sheet array (7) and the upper waveguide sheet array (11);
the waveguide upper plate (9) is embedded in the center of the bottom of the insulating top cover (14).
2. The contactless low-passive intermodulation waveguide filter of claim 1, wherein: the four corners of the waveguide upper plate (9), the first waveguide lower plate (2) and the second waveguide lower plate (3) are provided with column holes (15), square columns (16) are embedded in the column holes (15), and the square columns (16) are respectively arranged at the four corners of the bottom of the insulating top cover (14) and the four corners of the inner edge and the four corners of the outer edge of the top of the insulating base (1).
3. The contactless low-passive intermodulation waveguide filter of claim 2, wherein: positioning grooves (17) are formed in four corners of the bottom of the insulating top cover (14), positioning columns (18) are embedded in the positioning grooves (17), the positioning columns (18) are respectively arranged at four corners of the outer edge of the top of the insulating base (1), elastic buckles (19) are respectively arranged on four sides of the top of the insulating base (1), the elastic buckles (19) are embedded in buckling grooves (20), and the buckling grooves (20) are respectively formed in four sides of the bottom of the insulating top cover (14).
4. The contactless low-passive intermodulation waveguide filter of claim 3, wherein: the center of insulating base (1) bottom and the center at insulating top cap (14) top inlay respectively are equipped with last heating panel (21) and lower heating panel (22), and heat dissipation groove (23) have all been seted up to the center at last heating panel (21) top and the center at lower heating panel (22) bottom, and the both sides at last heating panel (21) bottom and the both sides at lower heating panel (22) top all contact the one end of a plurality of silica gel heat conduction post (24).
5. The contactless low-passive intermodulation waveguide filter of claim 4, wherein: the silica gel heat conduction post (24) is arranged at the center of the bottom of the lower silica gel heat conduction plate (25) and at the two sides of the top of the upper silica gel heat conduction plate (26), the lower silica gel heat conduction plate (25) and the upper silica gel heat conduction plate (26) are embedded at the two sides of the top of the insulating base (1) and the center of the bottom of the insulating top cover (14) respectively, the top of the lower silica gel heat conduction plate (25) is contacted with the centers of the bottoms of the first waveguide lower plate (2) and the second waveguide lower plate (3) respectively, and the bottom of the upper silica gel heat conduction plate (26) is contacted with the center of the top of the waveguide upper plate (9).
6. The contactless low-passive intermodulation waveguide filter of claim 5, wherein: the utility model discloses a waveguide probe, including insulating base (1), insulating top cap (14), sleeve groove (27) have all been seted up at both corners at insulating base (1) top and both corners at insulating top cap (14) bottom, the inside of sleeve groove (27) is inlayed and is equipped with stop collar (28), the bilateral symmetry of stop collar (28) is provided with stop collar (29), the inside of stop collar (30) is inlayed in stop collar (29), both sides at sleeve groove (27) are seted up respectively in stop collar (30), the middle section at waveguide probe (31) is cup jointed in stop collar (28), the other end of waveguide probe (31) is inlayed in the inside of probe groove (32), both corners at insulating baffle (8) bottom, the top one corner of first waveguide hypoplastron (2) and second waveguide hypoplastron (3) are seted up respectively in probe groove (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210878888.3A CN115241619B (en) | 2022-07-25 | 2022-07-25 | Non-contact low passive intermodulation waveguide filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210878888.3A CN115241619B (en) | 2022-07-25 | 2022-07-25 | Non-contact low passive intermodulation waveguide filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115241619A CN115241619A (en) | 2022-10-25 |
| CN115241619B true CN115241619B (en) | 2023-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210878888.3A Active CN115241619B (en) | 2022-07-25 | 2022-07-25 | Non-contact low passive intermodulation waveguide filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115241619B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4701728A (en) * | 1985-09-06 | 1987-10-20 | Alps Electric Co., Ltd. | Waveguide filter |
| US4990870A (en) * | 1989-11-06 | 1991-02-05 | The United States Of America As Represented By The Secretary Of The Navy | Waveguide bandpass filter having a non-contacting printed circuit filter assembly |
| CN201466184U (en) * | 2009-08-06 | 2010-05-12 | 中国电子科技集团公司第五十四研究所 | Ku band electric adjustable filter |
| CN103035988A (en) * | 2011-09-29 | 2013-04-10 | 百一电子股份有限公司 | Adjustable filter device |
| CN109792102A (en) * | 2016-10-05 | 2019-05-21 | 深谷波股份公司 | Encapsulating structure including forming at least one transition of contactless interface |
| KR20220012080A (en) * | 2020-07-22 | 2022-02-03 | 주식회사 알에프텍 | Cavity filter and method of manufacturing the same |
| CN114069172A (en) * | 2021-10-09 | 2022-02-18 | 西安电子科技大学 | Miniaturized non-contact low-passive intermodulation waveguide filter, design method and application |
| CN114069181A (en) * | 2021-10-09 | 2022-02-18 | 西安电子科技大学 | Miniaturized non-contact waveguide transmission line and application |
-
2022
- 2022-07-25 CN CN202210878888.3A patent/CN115241619B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4701728A (en) * | 1985-09-06 | 1987-10-20 | Alps Electric Co., Ltd. | Waveguide filter |
| US4990870A (en) * | 1989-11-06 | 1991-02-05 | The United States Of America As Represented By The Secretary Of The Navy | Waveguide bandpass filter having a non-contacting printed circuit filter assembly |
| CN201466184U (en) * | 2009-08-06 | 2010-05-12 | 中国电子科技集团公司第五十四研究所 | Ku band electric adjustable filter |
| CN103035988A (en) * | 2011-09-29 | 2013-04-10 | 百一电子股份有限公司 | Adjustable filter device |
| CN109792102A (en) * | 2016-10-05 | 2019-05-21 | 深谷波股份公司 | Encapsulating structure including forming at least one transition of contactless interface |
| KR20220012080A (en) * | 2020-07-22 | 2022-02-03 | 주식회사 알에프텍 | Cavity filter and method of manufacturing the same |
| CN114069172A (en) * | 2021-10-09 | 2022-02-18 | 西安电子科技大学 | Miniaturized non-contact low-passive intermodulation waveguide filter, design method and application |
| CN114069181A (en) * | 2021-10-09 | 2022-02-18 | 西安电子科技大学 | Miniaturized non-contact waveguide transmission line and application |
Non-Patent Citations (1)
| Title |
|---|
| 一种两毫米波矩形波导带通滤波器的研究与设计;詹景坤;吕天慧;陈灿辉;郑宏涛;王国庆;宁学;;电子测试(第06期);全文 * |
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|---|---|
| CN115241619A (en) | 2022-10-25 |
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