CN115241261A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN115241261A CN115241261A CN202210938744.2A CN202210938744A CN115241261A CN 115241261 A CN115241261 A CN 115241261A CN 202210938744 A CN202210938744 A CN 202210938744A CN 115241261 A CN115241261 A CN 115241261A
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- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000010410 layer Substances 0.000 claims description 90
- 238000005538 encapsulation Methods 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000012044 organic layer Substances 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 abstract description 6
- 235000009537 plain noodles Nutrition 0.000 abstract 2
- 238000000034 method Methods 0.000 description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
An embodiment of the present invention provides a display panel and a display device, where the display panel includes: a substrate; the panel body is arranged on the substrate and comprises a display section and a binding section, and the binding section comprises a plurality of binding terminals; wherein, the substrate set up in the display segment deviates from one side on play plain noodles, bind the section and extend to outside the substrate, display panel still includes printed circuit board, printed circuit board and a plurality of bind the terminal and bind the connection, through with the substrate only set up in the display segment deviates from one side on play plain noodles, even get the thickness attenuate of binding the section and have the flexibility, thereby make the panel main part can directly with printed circuit board binds to simplify display panel's preparation flow and reduce display panel's preparation cost, in addition, still make the panel main part with printed circuit board's distance is zero, has reduced the shared space of this display panel.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
The existing bonding technology for interconnecting a display Panel and a Printed Circuit Board (PCB) is based on bonding a Flexible Printed Circuit (FPC) to the display Panel (FPC on Panel FOP) and bonding the FPC to the PCB (FPC on PCB, FOB), thereby achieving signal interconnection between the display Panel and the PCB.
The binding design has certain disadvantages, on one hand, in order to ensure the binding reliability and adapt to the size of the binding machine, the distance between the display panel and the PCB cannot be 0 mm necessarily, and the space of the whole machine system is inevitably occupied; on the other hand, the FPC needs to be bound to the PCB and the display panel respectively through two binding processes, so that the binding process is complex and the binding cost is high.
Disclosure of Invention
The invention provides a display panel and a display device, which can solve the problems of complex binding process and large occupied space of a binding structure.
To solve the above problem, in a first aspect, the present invention provides a display panel comprising:
a substrate;
the panel body is arranged on the substrate and comprises a display section and a binding section, and the binding section comprises a plurality of binding terminals;
the substrate is arranged on one side, away from the light emitting surface, of the display section, the binding section extends out of the substrate, and the display panel further comprises a printed circuit board which is bound and connected with the binding terminals.
In the display panel provided by the embodiment of the invention, the binding terminals are arranged on the side surface of the binding section departing from the light emitting surface, and the printed circuit board is bound and connected with the surfaces of the binding terminals departing from the light emitting surface.
In the display panel provided in the embodiment of the present invention, the panel main body includes an array driving layer disposed on the substrate, the array driving layer includes an insulating layer and a metal layer disposed on a side of the insulating layer away from the substrate, the insulating layer includes a plurality of through holes located in the binding section, the metal layer includes a plurality of binding terminals, one binding terminal is disposed in one through hole, and a surface of the binding terminal facing away from the light exit surface is exposed through the through hole.
In the display panel provided in the embodiment of the present invention, the bonding terminals and the substrate are disposed at intervals near the sides of the bonding terminals.
In the display panel provided by the embodiment of the invention, the distance between the binding terminal and the side edge of the substrate close to the binding terminal is greater than 0.5 micrometer.
In an embodiment of the present invention, the array driving layer includes an organic layer disposed on the metal layer, and the organic layer includes a first organic portion located in the display section and a second organic portion located in the bonding section.
In the display panel according to the embodiment of the present invention, a thickness of the second organic portion is smaller than a thickness of the first organic portion.
In the display panel provided in the embodiment of the present invention, the panel main body further includes a light emitting layer disposed on a side of the array driving layer away from the substrate and an encapsulation layer disposed on a side of the light emitting layer away from the array driving layer, and the encapsulation layer includes a first encapsulation portion located in the display section and a second encapsulation portion located in the binding section.
In the display panel provided by the embodiment of the invention, the binding section is bent towards the side surface of the substrate far away from the panel main body, and the printed circuit board is arranged on one side of the substrate far away from the panel main body.
In a second aspect, the present invention provides a display device, which includes the display panel described above.
Has the advantages that: an embodiment of the present invention provides a display panel and a display device, where the display panel includes: a substrate; the panel body is arranged on the substrate and comprises a display section and a binding section, and the binding section comprises a plurality of binding terminals; the substrate is arranged on one side, away from the light emitting surface, of the display section, the binding section extends out of the substrate, the display panel further comprises a printed circuit board, and the printed circuit board is bound and connected with the binding terminals, wherein the substrate is only arranged on one side, away from the light emitting surface, of the display section, and the substrate is not arranged on one side, away from the light emitting surface, of the binding section, so that the thickness of the binding section of the panel main body is reduced, and the panel main body can be directly bound with the printed circuit board; on the other hand, the distance between the panel main body and the printed circuit board is made to be 0, so that the space occupied by the display panel is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a planar structure of a panel body in a display panel according to an embodiment of the present invention;
fig. 3 is a schematic plan view of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional structure diagram of a printed circuit board in a display panel according to an embodiment of the present invention;
fig. 5 is a schematic plan view illustrating a printed circuit board of a display panel according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
An embodiment of the present invention provides a display panel, which is described in detail below with reference to fig. 1 to 3:
referring to fig. 1, the display panel includes a substrate 100 and a panel main body 200 disposed on the substrate 100;
further, please refer to fig. 2 in combination, the panel main body 200 includes a display segment 200a and a binding segment 200c, wherein the panel main body 200 further includes a frame segment 200b disposed on the peripheral side of the display segment 200a, the binding segment 200c is adjacent to one side of the frame segment 200b away from the display segment 200a, the display segment 200a is a portion of the display panel actually used for light emitting display, the binding segment 200c is a portion for binding with an external circuit of the display panel, the frame segment 200b is a portion for connecting the external circuit and peripheral wires of the display device, it is added that, according to the specific design of the display panel, the number of the binding segments 200c is one or more, and the embodiment of the present invention is exemplarily described by having one binding segment 200 c;
the display segment 200a includes a structure of a display device, etc., and the binding segment 200c includes a plurality of binding terminals P;
the substrate 100 is only disposed on one side of the display segment 200a facing away from the light emitting surface, the binding segment 200c extends to the outside of the substrate 100, that is, the binding segment 200c is disposed in a suspended manner, the substrate 100 is not disposed on the lower side thereof, the display panel further includes a printed circuit board 300, the printed circuit board 300 is bound and connected with the binding terminals P in the panel main body 200, and a planar structure of the display panel formed after the panel main body is bound with the printed circuit board 300 please refer to fig. 3;
the substrate 100 is only arranged on one side of the display section 200a, which is far away from the light-emitting surface, and the substrate 100 is not arranged on the lower side of the binding section 200c, so that the thickness of the binding section 200c is reduced, and the binding section 200c of the panel main body 200 can be directly bound with the printed circuit board 300, compared with a binding mode that the panel main body and the printed circuit board are respectively bound through a flexible circuit board to realize the electrical connection between the panel main body and the printed circuit board in the conventional display panel, on one hand, the binding can be completed only by one binding procedure, and the material of the flexible circuit board can be omitted, so that the preparation process of the display panel is simplified, and the preparation cost of the display panel is reduced; on the other hand, the distance between the panel body 200 and the printed circuit board 300 is made 0, so that the space occupied by the display panel is reduced;
it should be added that the key point that the panel main body 200 in the display panel provided in the embodiment of the present invention can be directly bonded to the printed circuit board 300 is to remove a substrate conventionally disposed on the lower side of the bonding section 200c, so that the thickness of the bonding section 200c is greatly reduced, and further, the deformation amount of the bonding section 200c is greatly reduced when the bonding section 200c is press-bonded to the printed circuit board 300, so as to improve the bonding accuracy, i.e., to have a higher bonding yield;
in the display panel provided by the present invention, according to actual process requirements, the substrate 100 may be a rigid substrate or a flexible substrate, the rigid substrate may generally be a glass substrate, and the flexible substrate may generally be a polyimide film, and no matter the substrate 100 is a rigid substrate or a flexible substrate, since the substrate 100 is not disposed on the side of the binding segment 200c away from the light exit surface, the binding between the panel main body 200 and the printed circuit board 300 is not affected;
in the actual manufacturing process of the display panel, before the bonding process, the portion of the substrate 100 corresponding to the bonding segment 200c is removed by a laser lift-off process;
the printed circuit board is a circuit board equipped with important electronic components, so that input signals of the display panel are processed and then input to the driving chip through the flexible circuit board, and thus processing and power supply of signals in the display panel are achieved, referring to fig. 4, the cross-sectional structure of the printed circuit board 300 is generally a multilayer copper-clad layer 320 and a multilayer glass fiber layer 330 which are arranged in a stacked manner, and the top layer and the bottom layer are both the copper-clad layer 320;
referring to fig. 5, a printed circuit board 300 has a top surface for being bonded to the panel body, and a gold finger 310 corresponding to a plurality of bonding terminals is disposed on the top surface, and when bonding is performed, one gold finger 310 is bonded to one bonding terminal on the panel body, specifically, according to a circuit design, the plurality of gold fingers 310 may be divided into a plurality of groups, such as four groups shown in the drawing, and correspondingly, the plurality of bonding terminals in the panel body are also divided into a plurality of groups, and the plurality of gold fingers in any group are bonded to the corresponding group of bonding terminals.
In addition, the driving chips may be bound to the frame section 200b of the panel main body, and a binding alignment mark is provided on the frame section 200b of the panel main body 200, so as to assist in alignment when binding the panel main body 200 to the printed circuit board 300, thereby improving binding accuracy.
In the conventional binding process of the current display panel, a hot-pressing binding process is usually used for realizing shape binding operation, specifically, anisotropic conductive adhesive is used as a medium for realizing binding connection, that is, under the action of high-temperature pressing, conductive particles in the anisotropic conductive adhesive are broken under the action of pressure, so that a printed circuit board is conducted with a binding terminal in a panel main body to realize connection;
in the hot-pressing binding process, in order to obtain a high binding yield rate by performing the press-fitting, a relatively soft structure is usually bound to a relatively hard structure, and then, in the display panel provided in this embodiment, please refer to fig. 1, the binding section 200c having flexibility in the panel main body 200 is bound to the rigid printed circuit board 300, so that, in order to facilitate the binding operation, the lower side surface of the binding section 200c in the panel main body 200 is bound to the upper side surface of the printed circuit board 300, and therefore, the binding terminal P is disposed on the side surface of the panel main body 200 away from the light emitting surface, and the printed circuit board 300 can be bound and connected with the surface of the binding terminal P away from the light emitting surface.
Further, the panel main body 200 includes an array driving layer 210 disposed on the substrate, the array driving layer 210 includes an insulating layer 211 and a metal layer 212 disposed on a side of the insulating layer 211 away from the substrate, at a portion corresponding to the binding section 200c, the insulating layer 211 includes a plurality of through holes 211a, the metal layer 212 includes a plurality of binding terminals P, one binding terminal P is disposed in one through hole 211a, a surface of the binding terminal P facing away from the light exit surface can be exposed through the corresponding through hole 211a, so as to achieve binding connection with the printed circuit board 300, in this structural design, for a surface where the panel main body 200 and the printed circuit board 300 are bound, only the surface of the binding terminal P is exposed, and structures such as a side surface of the binding terminal P and other signal traces are shielded by the insulating layer 211, which is beneficial to improving binding yield and binding reliability;
specifically, the array driving layer generally includes necessary structures such as a gate metal layer, a gate insulating layer, an active layer, a source and drain metal layer, a passivation layer, a planarization layer, and a pixel definition layer, which are stacked on the substrate 100, in the array driving layer with such a structure, the insulating layer 211 may be the gate insulating layer, and the metal layer may be the source and drain metal layer.
Further, in some embodiments, referring to fig. 1, the panel main body 200 further includes a light emitting layer 220, an encapsulation layer 230, a protection layer 240, and the like, which are stacked on the array driving layer 210;
the light-emitting layer 220 may be an organic light-emitting layer, that is, composed of a plurality of organic light-emitting diodes, and then the display panel is an OLED display panel, or the light-emitting layer 220 may also be a light-emitting diode layer, that is, composed of a plurality of light-emitting diode chips, and then the display panel is a Micro LED display panel;
the encapsulation layer 230 is a thin film encapsulation layer, and is used for blocking water and oxygen in the environment from invading into the light-emitting layer 220 to cause the failure of the light-emitting device.
In some embodiments, referring to fig. 1, the binding terminals P and the side of the substrate 100 close to the binding terminals P are arranged at intervals, that is, a certain gap exists between the binding terminals P and the substrate 100, so as to provide a space for binding the panel body 200 and the printed circuit board 300, specifically, a distance d between the binding terminals P and the side of the substrate 100 close to the binding terminals P is greater than 0.5 micrometers, and a specific size of the distance d is determined according to actual process requirements.
In some embodiments, referring to fig. 6, the array driving layer 210 includes an organic layer 213 disposed on the metal layer 212, the organic layer 213 includes a first organic portion 2131 disposed on the display segment 200a and a second organic portion 2132 disposed on the binding segment 200c, wherein the organic layer 213 is an organic layer conventionally disposed in the array driving layer 210, such as a planarization layer or a pixel defining layer, the first organic portion 2131 disposed on the display segment 200a is used as an organic film layer for performing a conventional function, such as a planarization function or a function for defining a pixel region, and the organic layer 213 is extended and disposed on the binding segment 200c to form the second organic portion 2132, and the second organic portion 2132 is disposed on the insulating layer 211 and the binding terminals P, so as to enhance the strength of the binding segment 200c of the panel body 200 to some extent, and avoid the problem that the binding segment 200c of the panel body 200 is broken and fails;
further, in order to avoid that the excessive thickness of the binding segment 200c of the panel main body 200 affects the binding process, the thickness of the second organic portion 2132 is not too thick, so the thickness of the second organic portion 2132 may be set to be smaller than the thickness of the first organic portion 2131, and the specific thickness of the second organic portion 2132 is set according to the actual process requirements, which is not particularly limited in the embodiment of the present invention;
in an actual manufacturing process, the organic layer 213 may be formed by exposure using a half-tone mask, and a via hole or a groove required in the first organic portion 2131 may be formed by a single photo-masking process, such that the thickness of the second organic portion 2132 is smaller than the thickness of the first organic portion 2131.
In some embodiments, referring to fig. 7, the panel main body 200 further includes a light emitting layer 220 disposed on a side of the array driving layer 210 away from the substrate 100 and an encapsulation layer 230 disposed on a side of the light emitting layer 220 away from the array driving layer 210, where the encapsulation layer 230 includes a first encapsulation portion 231 located on the display segment 200a and a second encapsulation portion 232 located on the binding segment 200c, where the first encapsulation portion 231 located on the display segment 200a completely covers the light emitting layer 220 to achieve the function of blocking water and oxygen intrusion, and the encapsulation layer 230 is extended and disposed on the binding segment 200c to form the second encapsulation portion 232, and the second encapsulation portion 232 is disposed on the insulating layer 211 and the binding terminal P to enhance the strength of the binding segment 200c of the panel main body 200 to a certain extent, so as to avoid the problem that a part of the binding segment 200c of the panel main body 200 is broken and binding failure occurs;
further, in order to avoid that the excessive thickness of the binding segment 200c of the panel main body 200 affects the performance of the binding process, the thickness of the second encapsulating portion 232 is not too thick, so the thickness of the second encapsulating portion 232 can be set to be smaller than the thickness of the first encapsulating portion 231, and the specific thickness of the second encapsulating portion 232 is set according to the actual process requirement, which is not specially limited in the embodiment of the present invention;
in an actual manufacturing process, the encapsulation layer 230 includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are stacked, the second encapsulation portion 232 located in the binding segment 200c may be one or more of the first inorganic encapsulation layer, the second encapsulation portion 232 includes only the first inorganic encapsulation layer and the second inorganic encapsulation layer, for example.
In the display panel provided in the above embodiment, the second sealing portion 232 and the second organic portion 2132 may be disposed alternatively or both, that is, the second sealing portion 232 is disposed on the second organic portion 2132, and is specifically set according to actual process requirements.
In some embodiments, the binding section is not provided with the substrate, so that the part of the binding section of the panel main body has better flexibility, and the part of the binding section of the panel main body can be bent towards the side surface of the substrate, which is far away from the panel main body, so that the printed circuit board is arranged on one side of the substrate, which is far away from the panel main body.
It should be noted that, in the above-mentioned display panel embodiment, only the above-mentioned structure is described, and it is understood that, in addition to the above-mentioned structure, any other necessary structure may be included in the display panel provided in the embodiment of the present invention as needed, and the specific structure is not limited herein.
By adopting the display panel described in the above embodiment, the substrate is only arranged on the side of the display section away from the light-emitting surface, and the substrate is not arranged on the side of the binding section away from the light-emitting surface, that is, the thickness of the part of the binding section 200c of the panel main body is reduced, so that the panel main body can be directly bound with the printed circuit board, compared with the binding mode that the panel main body and the printed circuit board are respectively bound through a flexible circuit board to realize the electrical connection between the panel main body and the printed circuit board in the conventional display panel, on one hand, the binding can be completed only by one binding process, and the material of the flexible circuit board can be omitted, so that the preparation process of the display panel is simplified and the preparation cost of the display panel is reduced; on the other hand, the distance between the panel main body and the printed circuit board is made to be 0, so that the space occupied by the display panel is reduced.
Another embodiment of the present invention further provides a display device, where the display device includes the display panel provided in the above embodiment, and the display device includes, but is not limited to, a mobile phone, a smart watch, a tablet computer, a notebook computer, a television, and the like.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again.
The display panel and the display device provided by the embodiment of the present invention are described in detail above, and the principle and the embodiment of the present invention are explained herein by applying specific examples, and the description of the above embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed, and in summary, the content of the present specification should not be construed as limiting the present invention.
Claims (10)
1. A display panel, comprising:
a substrate;
the panel body is arranged on the substrate and comprises a display section and a binding section, and the binding section comprises a plurality of binding terminals;
the substrate is arranged on one side, away from the light emitting surface, of the display section, the binding section extends out of the substrate, the display panel further comprises a printed circuit board, and the printed circuit board is bound and connected with the binding terminals.
2. The display panel according to claim 1, wherein the binding terminals are disposed on a side of the binding section facing away from the light emitting surface, and the printed circuit board is bound and connected to surfaces of the binding terminals facing away from the light emitting surface.
3. The display panel according to claim 2, wherein the panel body includes an array driving layer disposed on the substrate, the array driving layer includes an insulating layer and a metal layer disposed on a side of the insulating layer away from the substrate, the insulating layer includes a plurality of through holes located in the binding section, the metal layer includes a plurality of binding terminals, one binding terminal is disposed in one of the through holes, and a surface of the binding terminal facing away from the light exit surface is exposed through the through hole.
4. The display panel of claim 2, wherein the binding terminals are spaced apart from the side of the substrate proximate the binding terminals.
5. The display panel according to claim 4, wherein the bonding terminal is spaced from a side of the substrate close to the bonding terminal by more than 0.5 μm.
6. The display panel according to claim 3, wherein the array driving layer comprises an organic layer disposed on the metal layer, the organic layer comprising a first organic portion located in the display section and a second organic portion located in the binding section.
7. The display panel according to claim 6, wherein a thickness of the second organic portion is smaller than a thickness of the first organic portion.
8. The display panel according to claim 3, wherein the panel body further comprises a light emitting layer disposed on a side of the array driving layer away from the substrate and an encapsulation layer disposed on a side of the light emitting layer away from the array driving layer, the encapsulation layer comprising a first encapsulation portion located in the display segment and a second encapsulation portion located in the binding segment.
9. The display panel according to claim 1, wherein the binding section is bent toward a side of the substrate away from the panel main body, and the printed circuit board is disposed on a side of the substrate away from the panel main body.
10. A display device characterized in that it comprises a display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210938744.2A CN115241261A (en) | 2022-08-05 | 2022-08-05 | Display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210938744.2A CN115241261A (en) | 2022-08-05 | 2022-08-05 | Display panel and display device |
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| CN115241261A true CN115241261A (en) | 2022-10-25 |
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| CN202210938744.2A Pending CN115241261A (en) | 2022-08-05 | 2022-08-05 | Display panel and display device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108663863A (en) * | 2018-06-25 | 2018-10-16 | 深圳市华星光电技术有限公司 | Array substrate |
| CN108762562A (en) * | 2018-05-25 | 2018-11-06 | 京东方科技集团股份有限公司 | A kind of display base plate, display panel, touch control display apparatus and preparation method thereof |
| CN108803103A (en) * | 2018-05-30 | 2018-11-13 | 上海中航光电子有限公司 | A kind of liquid crystal display device and preparation method thereof |
| CN109599421A (en) * | 2018-11-21 | 2019-04-09 | 武汉华星光电半导体显示技术有限公司 | OLED display and preparation method thereof |
| CN114843321A (en) * | 2022-04-18 | 2022-08-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and mobile terminal |
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2022
- 2022-08-05 CN CN202210938744.2A patent/CN115241261A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108762562A (en) * | 2018-05-25 | 2018-11-06 | 京东方科技集团股份有限公司 | A kind of display base plate, display panel, touch control display apparatus and preparation method thereof |
| CN108803103A (en) * | 2018-05-30 | 2018-11-13 | 上海中航光电子有限公司 | A kind of liquid crystal display device and preparation method thereof |
| CN108663863A (en) * | 2018-06-25 | 2018-10-16 | 深圳市华星光电技术有限公司 | Array substrate |
| CN109599421A (en) * | 2018-11-21 | 2019-04-09 | 武汉华星光电半导体显示技术有限公司 | OLED display and preparation method thereof |
| CN114843321A (en) * | 2022-04-18 | 2022-08-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and mobile terminal |
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